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Semiconductor device having lithography marks and resin portions in a cutting region Grant 10,707,174 - Tsukiyama , et al. | 2020-07-07 |
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Light Emitting Device And Manufacturing Method Thereof App 20160079500 - AOKI; Hideo ;   et al. | 2016-03-17 |
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Semiconductor Module App 20140252588 - AOKI; Hideo ;   et al. | 2014-09-11 |
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Image forming apparatus Grant 8,770,716 - Aoki July 8, 2 | 2014-07-08 |
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Powdery processing aid for polyolefin resins, method for producing the same, resin composition and shaped article Grant 8,236,896 - Hatae , et al. August 7, 2 | 2012-08-07 |
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Method of manufacturing a semiconductor integrated circuit device Grant 7,977,238 - Funakoshi , et al. July 12, 2 | 2011-07-12 |
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Method For Manufacturing Semiconductor Device App 20110076801 - Aoki; Hideo ;   et al. | 2011-03-31 |
Method of manufacturing an electronic circuit formed on a substrate Grant 7,877,871 - Aoki , et al. February 1, 2 | 2011-02-01 |
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Method For Manufacturing Semiconductor Device App 20100320258 - Sawada; Kanako ;   et al. | 2010-12-23 |
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Image Forming Apparatus App 20090256884 - AOKI; Hideo | 2009-10-15 |
Thermoplastic resin composition and molded article comprising the same Grant 7,589,151 - Aoki , et al. September 15, 2 | 2009-09-15 |
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Image forming apparatus and method of manufacturing electronic circuit using the same App 20090007426 - Aoki; Hideo ;   et al. | 2009-01-08 |
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Semiconductor Integrated Circuit Device App 20080303158 - Funakoshi; Takako ;   et al. | 2008-12-11 |
Image forming apparatus and method of manufacturing electronic circuit using the same Grant 7,433,637 - Aoki , et al. October 7, 2 | 2008-10-07 |
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Congestion control and avoidance method in a data processing system App 20080209069 - Aoki; Hideo ;   et al. | 2008-08-28 |
Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts Grant 7,414,417 - Yamaguchi , et al. August 19, 2 | 2008-08-19 |
Electrode Tip Holder, Welding Method, and Electrode Tip Adjusting Device App 20080190899 - Sugahara; Toshio ;   et al. | 2008-08-14 |
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Thermoplastic Resin Composition And Molded Article Comprising The Same App 20070276090 - Aoki; Hideo ;   et al. | 2007-11-29 |
Method of manufacturing a semiconductor device Grant 7,282,434 - Tamaru , et al. October 16, 2 | 2007-10-16 |
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Data communication system using priority queues with wait count information for determining whether to provide services to client requests Grant 7,130,912 - Nishikado , et al. October 31, 2 | 2006-10-31 |
Belt conveyance apparatus and image forming apparatus using such a belt conveyance apparatus App 20060233578 - Maki; Tsuneo ;   et al. | 2006-10-19 |
Semiconductor integrated circuit device having a conductive film which contains metal atoms bondable to a halogen element Grant 7,119,443 - Nakamura , et al. October 10, 2 | 2006-10-10 |
Manufacturing method of semiconductor device Grant 7,109,127 - Noguchi , et al. September 19, 2 | 2006-09-19 |
Wiring substrate and manufacturing method thereof App 20060194031 - Yamaguchi; Naoko ;   et al. | 2006-08-31 |
Semiconductor integrated circuit device Grant 7,078,815 - Tamaru , et al. July 18, 2 | 2006-07-18 |
Method of producing electronic circuit and electronic circuit Grant 7,067,398 - Aoki , et al. June 27, 2 | 2006-06-27 |
Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device App 20060102290 - Harada; Susumu ;   et al. | 2006-05-18 |
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Method of manufacturing semiconductor integrated circuit devices having a memory device with a reduced bit line stray capacity and such semiconductor integrated circuit devices Grant 6,969,649 - Sekiguchi , et al. November 29, 2 | 2005-11-29 |
Toner for producing wiring board and method of producing wiring board using thereof App 20050227158 - Yamauchi, Toshiaki ;   et al. | 2005-10-13 |
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Method of forming semiconductor device including silicon oxide with fluorine, embedded wiring layer, via holes, and wiring grooves Grant 6,812,127 - Oshima , et al. November 2, 2 | 2004-11-02 |
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Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus App 20030019917 - Furuno, Masahiko ;   et al. | 2003-01-30 |
Method of manufacturing semiconductor integrated circuit devices having a memory device with a reduced bit line stray capacity and such semiconductor integrated circuit devices App 20020192905 - Sekiguchi, Toshihiro ;   et al. | 2002-12-19 |
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