U.S. patent application number 11/223233 was filed with the patent office on 2006-01-19 for device for mounting a semiconductor package on a support plate via a base.
Invention is credited to Remi Brechignac, Kevin Channon, Juan Exposito.
Application Number | 20060012002 11/223233 |
Document ID | / |
Family ID | 27619949 |
Filed Date | 2006-01-19 |
United States Patent
Application |
20060012002 |
Kind Code |
A1 |
Brechignac; Remi ; et
al. |
January 19, 2006 |
Device for mounting a semiconductor package on a support plate via
a base
Abstract
A semiconductor package is mounted to a support plate through a
base. The base is inserted between a rear face of the semiconductor
package and a front face of the support plate. An electrical
connection mechanism is provided to connect the semiconductor
package to the support plate pass. This mechanism passes through
the base. The mounting of the semiconductor package is accomplished
by a variety of structures to fasten the package onto the said
support plate. These structures cooperate with and are placed below
the rear face of the semiconductor package.
Inventors: |
Brechignac; Remi; (Grenoble,
FR) ; Channon; Kevin; (Edinburgh, GB) ;
Exposito; Juan; (St Nazaire Les Eymes, FR) |
Correspondence
Address: |
JENKENS & GILCHRIST, PC
1445 ROSS AVENUE
SUITE 3200
DALLAS
TX
75202
US
|
Family ID: |
27619949 |
Appl. No.: |
11/223233 |
Filed: |
September 9, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10358994 |
Feb 5, 2003 |
|
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11223233 |
Sep 9, 2005 |
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Current U.S.
Class: |
257/432 ;
257/680; 257/704; 257/731; 257/732; 257/E31.117 |
Current CPC
Class: |
H01L 2224/48227
20130101; H05K 3/325 20130101; H01L 2224/48091 20130101; H01L
2924/00014 20130101; H01L 31/0203 20130101 |
Class at
Publication: |
257/432 ;
257/731; 257/732; 257/704; 257/680 |
International
Class: |
H01L 23/12 20060101
H01L023/12; H01L 31/0232 20060101 H01L031/0232 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 6, 2002 |
FR |
0201427 |
Claims
1. A device for mounting a semiconductor package on a support
plate, comprising: a base inserted between a rear face of the
semiconductor package and a front face of the said support plate;
means, passing through the base, for electrically connecting the
semiconductor package to the support plate; and means for fastening
the semiconductor package onto the support plate, wherein the means
for fastening cooperates with and is placed below the rear face of
the semiconductor package.
2. The device according to claim 1, wherein the rear face of the
semiconductor package has at least one part projecting towards the
support plate and in that the means for fastening cooperates with
this projecting part and wherein the projecting part from the
semiconductor package extends through the base and is adhesively
bonded to the support plate.
3. The device according to claim 1, further comprising: a fastening
lug which passes through the support plate and the base, this lug
having a shoulder away from the base and bearing on a rear face of
the support plate and being fastened to the rear face of the
semiconductor package.
4. The device according to claim 4, wherein the lug is fastened to
the semiconductor package by adhesive bonding.
5. The device according to claim 1, wherein the semiconductor
package and the base include complementary centering parts engaging
with each other.
6. The device according to claim 1, wherein the semiconductor
package and the base have peripheries which substantially
correspond.
7. A semiconductor product, comprising: a semiconductor package
securing an integrated circuit, the semiconductor package having a
rear face surface; a peripheral rib member projecting rearwardly
from the rear face surface; a mounting base; and a peripheral latch
mechanism associated with the mounting base, the peripheral latch
mechanism engaging the peripheral rib member to retain the
semiconductor package to the mounting base.
8. The product as in claim 7 further including a printed circuit
support plate to which the mounting base is attached.
9. The product as in claim 8 further including electrical
interconnection structure in the mounting base for electrically
connecting the semiconductor package to the printed circuit support
plate.
10. The product as in claim 7 wherein the integrated circuit
comprises an optical semiconductor component.
11. The product as in claim 10 further including a transparent
plate overlying a front face surface of the semiconductor package
to optically expose the optical semiconductor component.
12. The product as in claim 11 further including: a front plate
bonded to the transparent plate, the front plate including a
central passage therein; and an optical lens mounted within the
central passage.
13. The product as in claim 7 wherein the peripheral latch
mechanism comprises a plurality of deformable holding catches which
engage the peripheral rib member.
14. A semiconductor product, comprising: a semiconductor package
securing an integrated circuit, the semiconductor package having a
rear face surface and a boss member projecting rearwardly
therefrom; a mounting base including an aperture sized and shaped
to receive the rearwardly projecting boss member; and an adhesive
layer engaging the boss member to retain the semiconductor package
in the mounting base when the rearwardly projecting boss member is
inserted into the aperture.
15. The product as in claim 14 further including a printed circuit
support plate to which the mounting base is attached.
16. The product as in claim 15 further including electrical
interconnection structure in the mounting base for electrically
connecting the semiconductor package to the printed circuit support
plate.
17. The product as in claim 15 wherein the adhesive layer engaging
the boss member further engages the printed circuit support
plate.
18. The product as in claim 14 wherein the integrated circuit
comprises an optical semiconductor component.
19. The product as in claim 18 further including a transparent
plate overlying a front face surface of the semiconductor package
to optically expose the optical semiconductor component.
20. The product as in claim 19 further including: a front plate
bonded to the transparent plate, the front plate including a
central passage therein; and an optical lens mounted within the
central passage.
21. A semiconductor product, comprising: a semiconductor package
securing an integrated circuit, the semiconductor package having a
rear face surface; a mounting base having a front and back surface
and including an aperture, the semiconductor package positioned
with its rear face surface adjacent the front surface of the
mounting base; a holding lug inserted from the back surface of the
mounting base, and through the aperture therein, into a position
adjacent the rear face surface of the semiconductor package; and an
adhesive layer between the holding lug and rear face surface of the
semiconductor package to retain the semiconductor package adjacent
the mounting base.
22. The product as in claim 21 further including a printed circuit
support plate to which the mounting base is attached.
23. The product as in claim 22 further including electrical
interconnection structure in the mounting base for electrically
connecting the semiconductor package to the printed circuit support
plate.
24. The product as in claim 22 wherein the printed circuit support
plate further includes a passage through which the holding lug is
inserted.
25. The product as in claim 21 wherein the integrated circuit
comprises an optical semiconductor component.
26. The product as in claim 25 further including a transparent
plate overlying a front face surface of the semiconductor package
to optically expose the optical semiconductor component.
27. The product as in claim 26 further including: a front plate
bonded to the transparent plate, the front plate including a
central passage therein; and an optical lens mounted within the
central passage.
28. A device for mounting a semiconductor package to a supporting
base, the supporting base being mounted to a printed circuit board,
comprising: means for fastening the semiconductor package onto the
supporting base, wherein the means for fastening cooperates with
and is placed below a rear face of the semiconductor package; and
means for making an electrical connection from the printed circuit
board to the semiconductor package wherein the electrical
connection extends through the supporting base.
29. The device according to claim 28, wherein the projecting member
extends through an aperture in the supporting base and is
adhesively bonded to the printed circuit board.
30. The device according to claim 28, wherein the projecting member
is adhesively bonded to the supporting base fastened to the support
plate.
31. The device according to claim 28, further comprising: a
fastening lug which passes through an aperture in the printed
circuit board and the supporting base, this lug having a shoulder
away from the supporting base and bearing on a rear face of the
printed circuit board and being fastened to the rear face of the
semiconductor package.
32. The device according to claim 31, wherein the lug is fastened
to the semiconductor package by adhesive bonding.
33. The device according to claim 28, wherein the semiconductor
package and the supporting base include complementary centering
parts engaging with each other.
34. The device according to claim 28, wherein the semiconductor
package and the supporting base have peripheries which
substantially correspond.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a divisional of pending U.S.
application for patent Ser. No. 10/358,994, which was filed on Feb.
5, 2003, and which claims foreign priority from French Application
for Patent No. 0201427 filed Feb. 6, 2002, the disclosures of each
of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field of the Invention
[0003] The present invention relates to a device for mounting a
semiconductor package on a support plate.
[0004] 2. Description of Related Art
[0005] Semiconductor packages are known which contain optical
semiconductor components having optical sensors on a front face and
which have optical lenses in their front part.
[0006] To mount such packages on support plates, it is known to
adhesively bond bases fitted on the sides with projecting tabs, the
ends of which form catches, and to engage the semiconductor
packages between these tabs, above the bases, such that the tabs
extend laterally to the package and that their catches engage above
the front face of the packages.
[0007] The aim of the present invention is in particular to reduce
the footprint of devices for mounting semiconductor packages, in
particular optical semiconductor packages, on support plates, in
particular printed circuit boards.
SUMMARY OF THE INVENTION
[0008] According to the invention, the device for mounting a
semiconductor package on a support plate, in which a base is
inserted between a rear face of the package and a front face of the
said support plate and in which means for electrically connecting
the said package to the said support plate pass through the said
base, comprises means for fastening the said package onto the said
support plate which cooperate with and are placed below the rear
face of this package.
[0009] According to an alternative embodiment of the invention, the
said rear face of the package has at least one part projecting
towards the said plate and the said fastening means cooperate with
this projecting part.
[0010] According to the invention, the said fastening means
preferably comprise additional coupling means provided on the said
part projecting from the package and on the said base.
[0011] According to the invention, the said additional coupling
means preferably comprise catches suitable for engaging with
shoulders.
[0012] According to the invention, the said part projecting from
the package preferably extends through the said base and is
adhesively bonded to the support plate.
[0013] According to another alternative embodiment of the
invention, the said part projecting from the package is adhesively
bonded to the said base fastened to the support plate.
[0014] According to an alternative embodiment of the invention, the
device comprises a fastening lug which passes through the said
support plate and the said base, this lug having a shoulder away
from the base and bearing on the rear face of the support plate and
being fastened to the rear face of the said package.
[0015] According to the invention, the said lug is preferably
fastened to the package by adhesive bonding.
[0016] According to the invention, the said package and the said
base preferably comprise complementary centering parts engaging
with each other.
[0017] According to an alternative embodiment of the invention, the
said package and the said base have peripheries which substantially
correspond.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] A more complete understanding of the method and apparatus of
the present invention may be acquired by reference to the following
Detailed Description when taken in conjunction with the
accompanying Drawings wherein:
[0019] FIG. 1 shows a cross section of a first mounting device
according to the present invention;
[0020] FIG. 2 shows a section through II-II of the mounting device
of FIG. 1;
[0021] FIG. 3 shows a cross section of a second mounting device
according to the present invention;
[0022] FIG. 4 shows a section through II-II of the mounting device
of FIG. 1;
[0023] FIG. 5 shows a cross section of a third mounting device
according to the present invention;
[0024] FIG. 6 shows a cross section of a fourth mounting device
according to the present invention.
DETAILED DESCRIPTION OF THE DRAWINGS
[0025] FIGS. 1 and 2 show a device 1 for mounting a semiconductor
package 2 on a printed circuit support plate 3.
[0026] In the particular example shown, the semiconductor package 2
comprises a rear plate 4 which has, in its front face, a recess 5
and a transparent plate 6 adhesively bonded to the front face of
the rear plate 4, so as to define a cavity 7. An optical
semiconductor component 8 is fitted in this cavity 7, its rear face
being adhesively bonded to the bottom of the recess 5 and its front
face having an optical sensor 9 provided substantially in its
central part.
[0027] The semiconductor package 2 further comprises a front plate
10 which is adhesively bonded to the transparent plate 6 and which
has a central passage 11 in which an optical lens 12 is mounted so
as to face the optical sensor 9.
[0028] The rear plate 4 of the semiconductor component 2 has, on
its rear face, rear electrical connection pads 13 which are
connected to inner electrical connection pads 14 provided in the
recess 5 via an integrated circuit 15, the inner electrical
connection pads 14 being connected to front electrical connection
pads 16 of the optical semiconductor component 8 via electrical
wires 17.
[0029] The periphery of the rear plate 4, the periphery of the
transparent plate 6 and the periphery of the front plate 10 of the
semiconductor component 2 substantially coincide and are
substantially square.
[0030] Between the rear face 13 of the semiconductor package 2 and
the support plate 3, the mounting device 1 comprises a base 18
comprising a plate, the rear face 19 of which is for example
adhesively bonded or soldered to the support plate 3 and which has,
in its front face 20, a central recess 21.
[0031] From its rear face 13 and in its central part with no
electrical connection pad 13a, the rear plate 4 of the
semiconductor package 2 has a part or boss 22 projecting rearwards,
which is engaged in the central recess 21 of the base 18.
[0032] The end part of the projecting boss 22 has a peripheral
lateral holding shoulder 23, away from the rear face 13, and the
base 18 has, in its recess 21, holding catches 24 projecting
towards the front and engaging with the annular shoulder 23.
[0033] Furthermore, the base 18 has, between its central recess 21
and its periphery, electrical connection through-passages 25, in
which spiral electrical connection springs 26 are placed, making it
possible to connect the rear electrical connection pads 13a of the
semiconductor package 2 to electrical connection pads 27 provided
on the support plate 3.
[0034] The periphery of the base 18 is substantially square and
substantially coincides with the square periphery of the
semiconductor package 2. The projecting boss 22 is substantially
square, in parallel with the periphery of the semiconductor package
2 and, in the example, four catches 24 cooperate respectively with
the four sides of the peripheral holding shoulder 23.
[0035] In order to fit the mounting device 1, it is possible to
proceed as follows.
[0036] The base 18 is adhesively bonded or soldered onto the
support plate 3 in a position such that its through-passages 25
correspond to the electrical connection pads 27 of this support
plate 3.
[0037] The electrical connection springs 26 are placed in the
passages 25.
[0038] The boss 22 of the semiconductor package 2 is engaged in the
central recess 21 of the base 18 in the space between the catches
24 and in a position such that its rear electrical connection pads
13a correspond to the passages 25, until its rear face 13 comes
into contact with the front face 20 of the base 18. This being
done, the catches 24 are deformed laterally in the recess 21, in
order to engage towards the inside with the annular shoulder 23 of
the central boss 22 of the semiconductor package 2 and the springs
26 are compressed.
[0039] Thus, the catches 24 and the annular shoulder 23 of the
central boss 22 constitute not only additional means for coupling
the semiconductor package 2 to the base 18 but also additional
parts for centering the semiconductor package 2 with respect to the
base 18, one being engaged in the other.
[0040] With reference now to FIGS. 3 and 4, it can be seen that a
mounting device 28 is shown which is differentiated from the
mounting device 1 described with reference to FIGS. 1 and 2 by the
following points.
[0041] The optical semiconductor component 29 is differentiated
from the semiconductor component 2 in that it does not have the
rear projecting boss 22 but that it has a peripheral rib 31
projecting rearwards from the periphery of its rear face 30 and
which has, at its end, an inner holding rim or shoulder 32
projecting away from the rear face 30.
[0042] Its base 33 is differentiated from the base 18 of the
previous example in that it has no central recess 21, but that it
has, between its periphery and its through-passages 34
corresponding to the previous passages 25, an annular channel 35
made in its front face 36 and that, in its part separating its
periphery and the groove 35, holding catches 37 are formed
projecting forwards and suitable for external engagement with the
shoulder 32.
[0043] To fit the mounting device 28, it is possible to proceed as
in the previous example.
[0044] The base 33 is adhesively bonded or soldered onto the
support plate 3 in a position such that its through-passages 34
correspond to the electrical connection pads 27.
[0045] Electrical connection springs 38 are placed in its passages
34.
[0046] The rib 31 projecting to the rear of the semiconductor
package 29 is engaged around the catches 37 of the base 28 and in a
position such that its rear electrical connection pads 39
correspond to the passage 34, until its rear face 30 comes into
contact with the front face 36 of the base 33, the catches 37 being
deformed laterally in order to engage externally with the annular
shoulder 32 of the peripheral rib 31 and the springs 38 being
compressed.
[0047] With reference to FIG. 5, a mounting device 40 is shown
which is differentiated from the previously described examples in
that it no longer has catches.
[0048] So, in this mounting device 40, the rear face 41 of the
optical semiconductor component 42 has a central part or boss 43
projecting rearwards, with a square cross section, which is engaged
in a central passage 44 of square cross section of a base 45, until
its end is in contact or at a short distance from the support plate
3.
[0049] A layer of adhesive 45 is inserted between the end face of
the boss 43 and the front face of the support plate 3.
[0050] To fit the mounting device 40, it is possible to proceed as
follows.
[0051] The base 45 is adhesively bonded or soldered onto the
support plate 3 in a position such that its through-passages 46
correspond to the electrical connection pads 27 of this support
plate 3.
[0052] The electrical connection springs 47 are placed in the
passages 46.
[0053] A drop or a layer of adhesive is deposited on the support
plate 3 through the central passage 44 of the base 45 and/or on the
front face of the rear boss 43 of the semiconductor package 42.
[0054] The rear boss 43 of the semiconductor package 42 is engaged
in the central passage 44 of the base 45, in a position such that
its rear electrical connection pads 48 correspond to the
through-passages 46 and until the layer of adhesive 45 is inserted
between the front face of the boss 43 and the support plate 3, the
rear face 41 of the semiconductor package 42 then being in contact
with, or a short distance from, the front face 49 of the base
45.
[0055] When the layer of adhesive 45 is set, the semiconductor
package 42 is fastened to the support plate 3, the rear boss 43
providing the coupling and the centering of one with respect to the
other.
[0056] With reference to FIG. 6, a mounting device 50 is shown in
which the base 51 corresponds to the base 45 of the previous
example, and in which the rear face 52 of the semiconductor package
53 is flat.
[0057] In this example, the support plate 3 has a through-passage
3a located so as to face the central passage 54 of the base 51.
[0058] A holding lug 55 is engaged through the passage 3a of the
support plate 3 and of the central passage 54 of the base 51, this
lug 55 having a peripheral shoulder 56 bearing against the rear
face of the support plate 3 and a layer of adhesive 57 being
inserted between the front face of the lug 55 and the rear face 52
of the optical semiconductor package 53.
[0059] To fit the mounting device 50, it is possible to proceed as
follows.
[0060] The base 51 is adhesively bonded or soldered onto the
support plate 3 in a position such that the electrical connection
through-passages 58 correspond to the electrical connection pads 27
of the support plate 3 and that its central passage 54 corresponds
to the through-passage 3a of the support plate 3.
[0061] The electrical connection springs 9 are placed in the
through-passages 58 of the base 51.
[0062] A drop or a layer of adhesive is deposited on the end face
of the holding lug 55 and/or on the central part of the rear face
52 of the optical semiconductor device 53.
[0063] The optical semiconductor package 53 is put on the front
face 60 of the base 51 by compressing the springs 59, in a position
such that its rear electrical connection pads 61 correspond to the
through-passages 58.
[0064] The lug 55 is engaged through the through-passage 3a of the
support plate 3 and through the central passage 54 of the base 51
until the front end of the holding lug 55 comes into contact with
the rear face 52 of the optical semiconductor package 53 via the
layer of adhesive 57 thus formed.
[0065] After this adhesive is set, the optical semiconductor
package 53 is fastened to the support plate 3.
[0066] Furthermore, the optical semiconductor package 53 and the
base 51 could have complementary centering parts making it easier
to position one with respect to the other during their coupling.
For this, the optical semiconductor package 53 could have, for
example, pins projecting rearwards and the base 51 could have front
holes for receiving these pins.
[0067] Although preferred embodiments of the method and apparatus
of the present invention have been illustrated in the accompanying
Drawings and described in the foregoing Detailed Description, it
will be understood that the invention is not limited to the
embodiments disclosed, but is capable of numerous rearrangements,
modifications and substitutions without departing from the spirit
of the invention as set forth and defined by the following
claims.
* * * * *