Exposito; Juan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Exposito; Juan.The latest application filed is for "device for mounting a semiconductor package on a support plate via a base".

Company Profile

0.8.4

Exposito; Juan - St. Nazaire les Eymes FR
Exposito; Juan - Saint Nazaire les Eymes FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical semiconductor package with incorporated lens and shielding Grant 7,327,005 - Brechignac , et al. February 5, 2	2008-02-05
Device for mounting a semiconductor package on a support plate via a base Grant 7,012,331 - Brechignac , et al. March 14, 2	2006-03-14
Device for mounting a semiconductor package on a support plate via a base App 20060012002 - Brechignac; Remi ; et al.	2006-01-19
Optical semiconductor housing and method for making same Grant 6,969,898 - Exposito , et al. November 29, 2	2005-11-29
Optical semiconductor package and process for fabricating the same Grant 6,893,169 - Exposito , et al. May 17, 2	2005-05-17
Shielded housing for optical semiconductor component Grant 6,870,238 - Exposito , et al. March 22, 2	2005-03-22
Optical semiconductor package with incorporated lens and shielding App 20040217454 - Brechignac, Remi ; et al.	2004-11-04
Shielded housing for optical semiconductor component App 20040212055 - Exposito, Juan ; et al.	2004-10-28
Device for mounting a semiconductor package on a support plate via a base App 20030214028 - Brechignac, Remi ; et al.	2003-11-20
Process for packaging a chip with sensors and semiconductor package containing such a chip Grant 6,597,020 - Brechignac , et al. July 22, 2	2003-07-22
Process for manufacturing semiconductor packages comprising an integrated circuit Grant 6,087,202 - Exposito , et al. July 11, 2	2000-07-11
Injection molded ball grid array casing Grant 5,841,192 - Exposito November 24, 1	1998-11-24

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