U.S. patent application number 11/140823 was filed with the patent office on 2005-10-20 for conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements.
Invention is credited to Williams, Vernon M..
Application Number | 20050230806 11/140823 |
Document ID | / |
Family ID | 24037218 |
Filed Date | 2005-10-20 |
United States Patent
Application |
20050230806 |
Kind Code |
A1 |
Williams, Vernon M. |
October 20, 2005 |
Conductive elements with adjacent, mutually adhered regions and
semiconductor device assemblies including such conductive
elements
Abstract
Conductive elements that include a plurality of adjacent,
mutually adhered regions are disclosed. All of the regions may
include the same type of material. At least a portion of such a
conductive element may be configured to extend laterally. In a
semiconductor device assembly, such a conductive element is in
electrical communication with a contact of at least one
semiconductor device component, and may extend between
corresponding contacts of two or more semiconductor device
components.
Inventors: |
Williams, Vernon M.;
(Meridian, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
24037218 |
Appl. No.: |
11/140823 |
Filed: |
May 31, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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11140823 |
May 31, 2005 |
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09511986 |
Feb 24, 2000 |
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Current U.S.
Class: |
257/691 ;
257/692; 257/E21.508; 257/E23.033; 257/E25.012 |
Current CPC
Class: |
H01L 2924/351 20130101;
H01L 24/11 20130101; H01L 24/12 20130101; H01L 2224/76155 20130101;
H01L 2924/00014 20130101; Y10T 29/49126 20150115; H01L 2924/00014
20130101; H01L 2224/05599 20130101; H01L 2924/00 20130101; H01L
2924/00 20130101; Y10T 29/49117 20150115; H01L 2924/00014 20130101;
H05K 3/321 20130101; Y10T 29/49128 20150115; H01L 2224/45099
20130101; H01L 2224/82102 20130101; H05K 3/4664 20130101; H01L
2224/24101 20130101; H01L 23/4952 20130101; B33Y 70/00 20141201;
H01L 2924/014 20130101; H01L 2924/351 20130101; Y10T 29/4913
20150115; B33Y 10/00 20141201; H01L 2924/00014 20130101; H01L 24/76
20130101; B33Y 30/00 20141201; H01L 25/0655 20130101; H01L
2924/01029 20130101; H01L 2924/01047 20130101; H01L 2224/85399
20130101; H01L 2924/01078 20130101; H01L 2924/12042 20130101; H05K
2203/1469 20130101; B33Y 80/00 20141201; H01L 2224/24137 20130101;
H01L 2924/01006 20130101; H01L 2924/12042 20130101; H01L 2224/85399
20130101; H01L 2924/01033 20130101; H01L 24/05 20130101; H01L 24/25
20130101; H01L 2924/01024 20130101; H01L 2924/01082 20130101; H01L
2224/24226 20130101; Y02P 80/30 20151101; H05K 3/02 20130101; H05K
2203/0514 20130101; H01L 21/4857 20130101; H01L 2224/24227
20130101; H01L 2924/15173 20130101; H05K 3/0023 20130101; H05K 3/32
20130101; H05K 2203/107 20130101; H01L 2224/05599 20130101; H01L
24/82 20130101; H01L 2224/0401 20130101; H01L 2224/13099 20130101;
H01L 2224/24051 20130101; Y10T 29/49155 20150115; H01L 24/24
20130101; H01L 2924/01005 20130101; H01L 2924/01039 20130101 |
Class at
Publication: |
257/691 ;
257/692 |
International
Class: |
H01L 029/76 |
Claims
What is claimed is:
1. A semiconductor device assembly, comprising: a semiconductor
device component including at least one contact; and at least one
conductive element in electrical communication with the at least
one contact, the at least one conductive element including a
plurality of adjacent, mutually adhered regions.
2. The semiconductor device assembly of claim 1, wherein the at
least one conductive element includes at least a portion that
extends laterally relative to a plane within which at least one of
the semiconductor device and the at least one other semiconductor
device is disposed.
3. The semiconductor device assembly of claim 1, wherein at least
one region of the plurality of adjacent, mutually adhered regions
comprises a polymer.
4. The semiconductor device assembly of claim 1, wherein at least
one region of the plurality of adjacent, mutually adhered regions
comprises metal.
5. The semiconductor device assembly of claim 1, further
comprising: another semiconductor device component including a
corresponding bond pad in electrical communication with the at
least one conductive element.
6. The semiconductor device assembly of claim 5, further
comprising: a carrier to which at least one of the semiconductor
device component and the another semiconductor device component is
secured.
7. The semiconductor device assembly of claim 6, further
comprising: at least one other conductive element connecting at
least one contact of at least one of the semiconductor devices to a
contact of the carrier and comprising a plurality of adjacent,
mutually adhered regions.
8. The semiconductor device assembly of claim 1, wherein the
plurality of adjacent, mutually adhered regions comprises a
plurality of superimposed, contiguous, mutually adhered layers.
9. The semiconductor device assembly of claim 1, wherein the
plurality of adjacent, mutually adhered regions comprise the same
type of conductive material.
10. The semiconductor device assembly of claim 9, wherein the at
least one conductive element comprises a semiconductor device.
11. A semiconductor device assembly, comprising: a first
semiconductor device component including at least one first
contact; a second semiconductor device component including a second
contact corresponding to the at least one first contact; and at
least one conductive element extending between and facilitating
electrical communication between the at least one first contact and
the corresponding second contact, the at least one conductive
element comprising a plurality of adjacent, mutually adhered
regions.
12. The semiconductor device assembly of claim 11, wherein the at
least one conductive element includes at least a portion that
extends laterally relative to a plane within which at least one of
the first semiconductor device and the second semiconductor device
is disposed.
13. The semiconductor device assembly of claim 11, wherein each
region of the plurality of adjacent, mutually adhered regions
comprises a same type of material as all of the other regions of
the plurality of adjacent, mutually adhered regions.
14. The semiconductor device assembly of claim 11, wherein at least
one region of the plurality of adjacent, mutually adhered regions
comprises a polymer.
15. The semiconductor device assembly of claim 11, wherein at least
one region of the plurality of adjacent, mutually adhered regions
comprises a metal.
16. The semiconductor device assembly of claim 11, wherein the
plurality of adjacent, mutually adhered regions comprises a
plurality of superimposed, contiguous, mutually adhered layers.
17. The semiconductor device assembly of claim 11, wherein the
first semiconductor device component comprises a semiconductor
device.
18. The semiconductor device assembly of claim 17, wherein the
second semiconductor device component comprises a semiconductor
device.
19. A conductive element for electrically connecting two contacts
of an electronic component to one another, comprising a plurality
of adjacent, mutually adhered regions.
20. The conductive element of claim 19, at least a portion of which
extends laterally.
21. The conductive element of claim 19, wherein each region of the
plurality of adjacent, mutually adhered regions comprises a same
type of material as all of the other regions of the plurality of
adjacent, mutually adhered regions.
22. The conductive element of claim 19, wherein at least one region
of the plurality of adjacent, mutually adhered regions comprises a
polymer.
23. The conductive element of claim 19, wherein at least one region
of the plurality of adjacent, mutually adhered regions comprises a
metal.
24. The conductive element of claim 19, wherein the plurality of
adjacent, mutually adhered regions comprises a plurality of
superimposed, contiguous, mutually adhered layers.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of application Ser. No.
09/511,986, filed Feb. 24, 2000, pending.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to conductive elements for
electrically connecting different semiconductor device components
to one another. Particularly, the present invention relates to
conductive elements that are carried by semiconductor devices. More
particularly, the present invention relates to
stereolithographically fabricated conductive elements. The present
invention also relates to the conductive lines of carrier
substrates, such as circuit boards, and to methods of fabricating
such carrier substrates.
[0004] 2. State of the Art
[0005] Intermediate Conductive Elements. An electronic device
typically includes one or more semiconductor devices. The
semiconductor devices of an electronic device are electrically
connected to a carrier substrate, which, in turn, electrically
connects each semiconductor device to other components of the
electronic device. In order to fulfill the demands for electronic
devices of ever-decreasing size and ever-increasing capability,
much of the large, space-consuming circuitry components of
conventional electronic devices have been incorporated into
semiconductor devices. As a result, many state of the art
electronic devices include semiconductor devices that are directly
connected to one another.
[0006] Conventionally, electrical connections between a
semiconductor device and a carrier substrate or another
semiconductor device are made by way of wire bonds between bond
pads of the semiconductor device and contact pads of the carrier
substrate. Wire bonding is somewhat undesirable, however, in that
the wire bonds are separately and sequentially formed. As state of
the art semiconductor devices typically include large numbers of
bond pads positioned closely to one another, wire bonding these
semiconductor devices to carrier substrates or other semiconductor
devices can be a very time-consuming process.
[0007] The semiconductor devices of many state of the art
electronic devices are connected to carrier substrates or other
semiconductor devices with alternative types of intermediate
conductive elements. For example, semiconductor devices can be
flip-chip bonded, or bonded by way of a controlled collapse chip
connection (C-4) to a substrate or another semiconductor device
with conductive structures, such as solder balls. When flip-chip
type bonds are used, a minimal amount of the real estate on a
carrier substrate or other semiconductor device component is
consumed.
[0008] Tape automated bonding (TAB) processes, which employ a tape
including a dielectric film with conductive traces extending
thereacross, have also been used to electrically connect
semiconductor devices to other semiconductor device components.
Tape automated bonding is useful for forming very thin assemblies
of semiconductor devices and substrates.
[0009] While all of the bond pads of a semiconductor device may be
simultaneously connected with a carrier substrate or another
semiconductor device when both flip-chip type bonding and TAB are
used, neither of these techniques addresses the need for assemblies
of both minimal lateral dimensions and minimal thickness.
[0010] Circuit Boards: Circuit boards are often assembled with
semiconductor devices to electrically connect different
semiconductor devices to one another or to other components of an
electronic device. Typically, circuit boards have one or more
layers of metal circuitry carried by the insulating, or dielectric,
substrates thereof. When circuit boards have conductive circuits
extending across more than one plane thereof, the circuits may be
electrically connected by way of through holes that are metal
plated or filled.
[0011] Typically, reinforced polymeric materials are employed as
the dielectric substrates of rigid circuit boards. The most
commonly used dielectric substrate material is glass-reinforced
epoxy. Some circuit boards are made from polyimide resins so as to
withstand higher temperatures. Other dielectric materials have also
been developed and used to fabricate the dielectric substrates of
circuit boards.
[0012] Some applications require that the dielectric substrate of
the circuit board bend or flex during assembly of the circuit board
with semiconductor or other electronic devices or while a device
including the circuit board is being used. While some flexible
circuit boards have substrates fabricated from flexible dielectric
materials that are reinforced with woven or random fibers,
unsupported polymeric films may also be used to form the substrates
of flexible circuit boards.
[0013] Conventional printed circuit boards having a single-layered
substrate are machined to define the edges thereof, to bevel the
edges thereof, and to form through holes at desired locations.
Metal conductive circuits are then formed on one or both surfaces
of the printed circuit boards, in communication with metal plating
or vias located in the through holes. Originally, conductive
materials, such as silver, were printed onto the substrate to form
the metal conductive circuits and to plate the through holes or to
form vias therein.
[0014] Copper-clad laminates, which include a layer of copper
secured to a dielectric substrate, can also be used to fabricate
circuit boards. Copper is removed from regions of the surface of
the substrate where conductive circuits are not desired.
Accordingly, the process is referred to as a "subtractive"
technique.
[0015] Other conventional techniques for forming metal conductive
circuits and plating or filling the through holes include
electroless plating, electrolytic plating, and plasma-assisted
chemical vapor deposition ("CVD") processes. Etching processes may
also be used to pattern the conductive circuits of printed circuit
boards. As the metal circuits, plating, or vias are formed on the
substrate, these processes are referred to as "additive"
techniques.
[0016] The substrates of state of the art circuit boards have
multiple, laminated layers. The conductive circuits of these
circuit boards laterally traverse the surfaces of the boards, as
well as several different planes through the interior of the
substrate to accommodate the increasingly complex semiconductor
devices connected to the substrate while maintaining or decreasing
the size of the circuit board. In manufacturing such boards,
circuit traces are fabricated, as noted above, on one layer of the
substrate prior to laminating the next layer of the substrate
thereto. Thus, laminated circuit boards are built up, layer by
layer. The use of conventional processes to fabricate multilayer
circuit boards is, however, somewhat undesirable since each new
layer must be aligned with every previously formed layer of the
circuit board to provide the desired functionality.
[0017] Completed circuit boards may then be tested. Optical or
electrical testing may be conducted to determine whether the
circuit boards will function properly.
[0018] Circuit boards are typically fabricated on a very large
scale, with sheets of several circuit boards typically being
supplied to semiconductor device manufacturers or electronic device
manufacturers for assembly with semiconductor devices and other
electronic components. Conventional, large scale circuit board
fabrication processes are typically not useful for fabricating
prototype circuit boards.
[0019] When a new circuit board design is needed, a prototype
circuit board is usually fabricated. Due to the complexity of state
of the art semiconductor devices and electronic devices, the
fabrication of prototype circuit boards is a very time-consuming
process. Moreover, production scale circuit boards based on a
certain prototype circuit board design may not provide the same
electrical performance as intended.
[0020] Accordingly, there is a need for a method that can be
employed to quickly fabricate simple and multilayered circuit
boards in either very small numbers or very large numbers. There is
also a need for a process for fabricating multilayered circuit
boards that does not require repeated alignment of each of the new
layers of the circuit board with the previously fabricated layers
thereof.
[0021] Stereolithography. In the past decade, a manufacturing
technique termed "stereolithography," also known as "layered
manufacturing," has evolved to a degree where it is employed in
many industries.
[0022] Essentially, stereolithography as conventionally practiced
involves utilizing a computer to generate a three-dimensional (3-D)
mathematical simulation or model of an object to be fabricated,
such generation usually effected with 3-D computer-aided design
(CAD) software. The model or simulation is mathematically separated
or "sliced" into a large number of relatively thin, parallel,
usually vertically superimposed layers, each layer having defined
boundaries and other features associated with the model (and thus
the actual object to be fabricated) at the level of that layer
within the exterior boundaries of the object. A complete assembly
or stack of all of the layers defines the entire object, and
surface resolution of the object is, in part, dependent upon the
thickness of the layers.
[0023] The mathematical simulation or model is then employed to
generate an actual object by building the object, layer by
superimposed layer. A wide variety of approaches to
stereolithography by different companies has resulted in techniques
for fabrication of objects from both metallic and nonmetallic
materials. Regardless of the material employed to fabricate an
object, stereolithographic techniques usually involve disposition
of a layer of unconsolidated or unfixed material corresponding to
each layer within the object boundaries, followed by selective
consolidation or fixation of the material to at least a partially
consolidated, or semi-solid, state in those areas of a given layer
corresponding to portions of the object, the consolidated or fixed
material also at that time being substantially concurrently bonded
to a lower layer of the object being fabricated. The unconsolidated
material employed to build an object may be supplied in particulate
or liquid form, and the material itself may be consolidated or
fixed, or a separate binder material may be employed to bond
material particles to one another and to those of a previously
formed layer. In some instances, thin sheets of material may be
superimposed to build an object, each sheet being fixed to a next
lower sheet and unwanted portions of each sheet removed, a stack of
such sheets defining the completed object. When particulate
materials are employed, resolution of object surfaces is highly
dependent upon particle size, whereas when a liquid is employed,
surface resolution is highly dependent upon the minimum surface
area of the liquid which can be fixed and the minimum thickness of
a layer that can be generated. Of course, in either case,
resolution and accuracy of object reproduction from the CAD file is
also dependent upon the ability of the apparatus used to fix the
material to precisely track the mathematical instructions
indicating solid areas and boundaries for each layer of material.
Toward that end, and depending upon the layer being fixed, various
fixation approaches have been employed, including particle
bombardment (electron beams), disposing a binder or other fixative
(such as by ink-jet printing techniques), or irradiation using heat
or specific wavelength ranges.
[0024] An early application of stereolithography was to enable
rapid fabrication of molds and prototypes of objects from CAD
files. Thus, either male or female forms on which mold material
might be disposed may be rapidly generated. Prototypes of objects
might be built to verify the accuracy of the CAD file defining the
object and to detect any design deficiencies and possible
fabrication problems before a design is committed to large-scale
production.
[0025] In more recent years, stereolithography has been employed to
develop and refine object designs in relatively inexpensive
materials, and has also been used to fabricate small quantities of
objects where the cost of conventional fabrication techniques is
prohibitive for same, such as in the case of plastic objects
conventionally formed by injection molding. It is also known to
employ stereolithography in the custom fabrication of products
generally built in small quantities or where a product design is
rendered only once. Finally, it has been appreciated in some
industries that stereolithography provides a capability to
fabricate products, such as those including closed interior
chambers or convoluted passageways, which cannot be fabricated
satisfactorily using conventional manufacturing techniques. It has
also been recognized in some industries that a stereolithographic
object or component may be formed or built around another,
preexisting object or component to create a larger product.
[0026] However, to the inventor's knowledge, stereolithography has
yet to be applied to mass production of articles in volumes of
thousands or millions, or employed to produce, augment or enhance
products including other, preexisting components in large
quantities, where minute component sizes are involved, and where
extremely high resolution and a high degree of reproducibility of
results are required. In particular, the inventor is not aware of
the use of stereolithography to fabricate intermediate conductive
elements between semiconductor device components or on circuit
boards. Furthermore, conventional stereolithography apparatus and
methods fail to address the difficulties of precisely locating and
orienting a number of preexisting components for stereolithographic
application of material thereto without the use of mechanical
alignment techniques or to otherwise assuring precise, repeatable
placement of components.
SUMMARY OF THE INVENTION
[0027] The present invention includes stereolithographically
fabricated intermediate conductive elements. Accordingly, the
intermediate conductive elements of the present invention may have
one or more layers of conductive material. In multilayer
embodiments, the intermediate conductive elements have a plurality
of superimposed, contiguous, mutually adhered layers of conductive
material. Any known conductive material may be used to form the
intermediate conductive elements of the present invention.
Exemplary conductive materials include, without limitation,
electrically conductive thermoplastic elastomers and metals.
[0028] The invention also includes semiconductor device assemblies
with one or more semiconductor devices that are electrically
connected to one or more other semiconductor device components,
such as carrier substrates, leads, or other semiconductor devices,
by way of the intermediate conductive elements of the present
invention. These intermediate conductive elements are substantially
carried upon the semiconductor device and the component to which
the semiconductor device is connected. For example, when used to
connect one semiconductor die to another semiconductor die, an
intermediate conductive element of the present invention contacts a
bond pad of the first semiconductor die, extends across a portion
of the active surface of the first semiconductor die towards the
second semiconductor die, extends over the active surface of the
second semiconductor die, and contacts a corresponding bond pad of
the second semiconductor die. As another example, when the
intermediate conductive elements of the present invention are used
to connect a semiconductor die to a carrier substrate, one end of
an intermediate conductive element may contact a contact (e.g., a
bond pad) of the semiconductor die, extend over an active surface
of the semiconductor die, down a peripheral edge thereof, and over
a surface of the carrier substrate, and contact a contact pad of
the carrier substrate at a second end of the intermediate
conductive element.
[0029] In another aspect, the present invention includes a printed
circuit board with a substrate that carries one or more
stereolithographically fabricated conductive traces. Each
conductive trace may have one or more layers of conductive
material. The conductive material may be, for example, a
thermoplastic conductive elastomer or a metal.
[0030] According to another aspect of the present invention, the
substrate of the printed circuit board has two or more
superimposed, contiguous, mutually adhered layers of dielectric
material. One or more of these layers of the substrate may be
fabricated using stereolithography techniques. For example, each
stereolithographically formed layer of the substrate may be defined
by, first, forming a layer of unconsolidated (i.e., uncured or
particulate) dielectric material, then consolidating (i.e., curing
or bonding particles) of the dielectric material in selected
regions of the layer. Alternatively, each of the layers of the
substrate may be fabricated by spraying dielectric material so as
to define the desired configuration of the layer, permitting the
dielectric material to at least partially harden or solidify, then
using the same technique to form and stack one or more additional
layers of dielectric material to complete the substrate.
[0031] When both the intermediate conductive elements and the
substrate are fabricated by stereolithographic techniques, layers
of the intermediate conductive elements and of the substrate
residing in the same planes can be fabricated substantially
simultaneously or sequentially.
[0032] The materials of both the intermediate conductive elements
and the substrate may be either rigid or flexible. Accordingly, the
methods of the present invention can be used to fabricate both
rigid and flexible circuit boards.
[0033] The stereolithography, or "layered manufacturing," processes
that are used to fabricate the intermediate conductive elements or
circuit board substrates of the present invention are initiated and
controlled by a 3-D CAD-programmed computer.
[0034] When stereolithography is used to fabricate intermediate
conductive elements between assembled semiconductor device
components, the stereolithographic method of fabricating the
intermediate conductive elements of the present invention
preferably includes the use of a machine vision system to locate
the assembled semiconductor device components on which intermediate
conductive elements are to be fabricated, as well as the various
features of the semiconductor device components. The use of a
machine vision system directs the alignment of a stereolithography
system with each substrate or layer for material disposition
purposes. Accordingly, the assembled semiconductor device
components need not be precisely mechanically aligned with any
component of the stereolithography system to practice the
stereolithographic embodiment of the method of the present
invention.
[0035] As noted previously herein, in a preferred embodiment, the
intermediate conductive elements of the present invention are
preferably fabricated using three-dimensional printing techniques,
wherein a conductive material having the desired properties and
that is solid at ambient temperatures is heated to liquefy same.
Exemplary materials that are useful for forming intermediate
conductive elements according to the present invention include
thermoplastic conductive elastomers and metals. The liquified
conductive material is then disposed, in a precisely focused spray
(e.g., through an ink jet type nozzle) under control of a computer
and, preferably, responsive to input from a machine vision system,
such as a pattern recognition system, to form a layer of each of
the intermediate conductive elements. The conductive material is
then permitted to at least partially harden.
[0036] A circuit board substrate may be similarly manufactured,
except with a dielectric material rather than a conductive
material. Alternatively, other stereolithographic processes may be
employed to fabricate the substrate. For example, the substrate may
be fabricated using precisely focused electromagnetic radiation in
the form of an ultraviolet (UV) wavelength laser to fix or cure
selected regions of a layer of a liquid photopolymer material
disposed on the semiconductor device or other substrate.
[0037] Other features and advantages of the present invention will
become apparent to those of skill in the art through consideration
of the ensuing description, the accompanying drawings, and the
appended claims.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0038] FIG. 1 is a top schematic representation of a first
embodiment of an assembly according to the present invention, which
includes a semiconductor die with bond pads electrically connected
to the contact pads of a carrier substrate by way of the
intermediate conductive elements of the present invention;
[0039] FIG. 2 is a cross-section taken along line 2-2 of FIG.
1;
[0040] FIG. 3 is a top schematic representation of a second
embodiment of an assembly according to the present invention, which
includes two semiconductor dice with bond pads that are connected
by way of the intermediate conductive elements of the present
invention;
[0041] FIG. 4 is a cross-section taken along line 4-4 of FIG.
3;
[0042] FIG. 5 is a top schematic representation of a circuit board
with a single substrate layer, at least the intermediate conductive
elements of the circuit board having been fabricated in accordance
with the method of the present invention;
[0043] FIG. 6 is a cross-section taken along line 6-6 of FIG.
5;
[0044] FIG. 6A is a cross-sectional representation of a variation
of the circuit board shown in FIGS. 5 and 6, in which the
conductive elements are at least partially recessed within the
surrounding material;
[0045] FIG. 7 is a schematic cross-sectional representation of a
multilayered circuit board with stereolithographically fabricated
intermediate conductive elements;
[0046] FIG. 8 is a schematic representation of an assembly
including a packaged semiconductor device with leads that are
electrically connected to corresponding contact pads of a carrier
substrate by way of the intermediate conductive elements of the
present invention;
[0047] FIG. 9 is a schematic representation of an assembly
including a semiconductor die and leads connected to the bond pads
thereof by way of the intermediate conductive elements of the
present invention;
[0048] FIG. 10 is a schematic cross-sectional representation of a
semiconductor device including a semiconductor die, intermediate
conductive elements of the present invention in communication with
the bond pads of the semiconductor die to reroute same, and a
dielectric layer disposed between the intermediate conductive
elements and the active surface of the semiconductor die;
[0049] FIG. 11 is a schematic representation of a first apparatus
for stereolithographically fabricating structures in accordance
with a first embodiment of the method of the present invention;
[0050] FIG. 12 is a schematic representation of a second apparatus
for stereolithographically fabricating structures in accordance
with a second embodiment of the method of the present invention;
and
[0051] FIG. 13 is partial cross-sectional schematic representation
of a semiconductor device disposed on a platform of a
stereolithographic apparatus for the formation of intermediate
conductive elements between contacts of the assembled semiconductor
device components.
DETAILED DESCRIPTION OF THE INVENTION
Stereolithography Apparatus and Methods
[0052] FIG. 11 schematically depicts various components, and
operation, of exemplary stereolithography apparatus 80 to
facilitate the reader's understanding of the technology employed in
implementation of the methods of the present invention, although
those of ordinary skill in the art will understand and appreciate
that apparatus of other designs and manufacture may be employed in
practicing the method of the present invention. Apparatus 80 and
the operation thereof are described in great detail in United
States Patents assigned to 3D Systems, Inc. of Valencia, Calif.,
such patents including, without limitation, U.S. Pat. Nos.
4,575,330; 4,929,402; 4,996,010; 4,999,143; 5,015,424; 5,058,988;
5,059,021; 5,059,359; 5,071,337; 5,076,974; 5,096,530; 5,104,592;
5,123,734; 5,130,064; 5,133,987; 5,143,663; 5,164,128; 5,174,931;
5,174,943; 5,182,055; 5,182,056; 5,182,715; 5,184,307; 5,192,469;
5,192,559; 5,209,878; 5,234,636; 5,236,637; 5,238,639; 5,248,456;
5,256,340; 5,258,146; 5,267,013; 5,273,691; 5,321,622; 5,345,391;
5,358,673; 5,447,822; 5,481,470; 5,495,328; 5,554,336; 5,556,590;
5,569,431; 5,571,471; 5,573,722; 5,609,812; 5,609,813; 5,610,824;
5,630,981; 5,637,169; 5,651,934; 5,667,820; 5,676,904; 5,688,464;
5,693,144; 5,711,911; 5,779,967; 5,814,265; 5,850,239; 5,854,748;
5,855,718; 5,885,511; 5,897,825; 5,902,537; 5,902,538; 5,904,889;
5,943,235; and 5,945,058. The disclosure of each of the foregoing
patents is hereby incorporated herein by this reference.
[0053] With continued reference to FIG. 11 and as noted above, a
3-D CAD drawing of an object to be fabricated in the form of a data
file is placed in the memory of a computer 82 controlling the
operation of apparatus 80 if computer 82 is not a CAD computer in
which the original object design is effected. In other words, an
object design may be effected in a first computer in an engineering
or research facility and the data files transferred via wide or
local area network, tape, disc, CD-ROM, or as otherwise known in
the art to computer 82 of apparatus 80 for object fabrication.
[0054] The data is preferably formatted in an STL (for
STereoLithography) file, STL being a standardized format employed
by a majority of manufacturers of stereolithography equipment.
Fortunately, the format has been adopted for use in many
solid-modeling CAD programs, so translation from another internal
geometric database format is often unnecessary. In an STL file, the
boundary surfaces of an object are defined as a mesh of
interconnected triangles.
[0055] Apparatus 80 also includes a reservoir 84 (which may
comprise a removable reservoir interchangeable with others
containing different materials) of an unconsolidated material 86 to
be employed in fabricating the intended object. Unconsolidated
material 86 useful in apparatus 80 is a liquid, photo-curable
polymer, or "photopolymer" that cures in response to light in the
UV wavelength range. The surface level 88 of material 86 is
automatically maintained at an extremely precise, constant
magnitude by devices known in the art responsive to output of
sensors within apparatus 80 and preferably under control of
computer 82. A support platform or elevator 90, precisely
vertically movable in fine, repeatable increments responsive to
control of computer 82, is located for movement downward into and
upward out of material 86 in reservoir 84.
[0056] An object may be fabricated directly on platform 90, or on a
substrate disposed on platform 90. When the object is to be
fabricated on a substrate disposed on platform 90, the substrate
may be positioned on platform 90 and secured thereto by way of one
or more base supports 122 (FIG. 13). Such base supports 122 may be
fabricated before or simultaneously with the stereolithographic
fabrication of one or more objects on platform 90 or a substrate
disposed thereon. These base supports 122 may support, or prevent
lateral movement of, the substrate relative to a surface 100 of
platform 90. Base supports 122 may also provide a perfectly
horizontal reference plane for fabrication of one or more objects
thereon, as well as facilitate the removal of a substrate from
platform 90 following the stereolithographic fabrication of one or
more objects on the substrate. Moreover, where a so-called
"recoater" blade 102 is employed to form a layer of material on
platform 90 or a substrate disposed thereon, base supports 122 can
preclude inadvertent contact of recoater blade 102, to be described
in greater detail below, with surface 100 of platform 90.
[0057] Apparatus 80 has a UV wavelength range laser plus associated
optics and galvanometers (collectively identified as laser 92) for
controlling the scan of laser beam 96 in the X-Y plane across
platform 90. Laser 92 has associated therewith a mirror 94 to
reflect laser beam 96 downwardly as laser beam 98 toward surface
100 of platform 90. Laser beam 98 is traversed in a selected
pattern in the X-Y plane, that is to say in a plane parallel to
surface 100, by initiation of the galvanometers under control of
computer 82 to at least partially cure, by impingement thereon,
selected portions of material 86 disposed over surface 100 to at
least a partially consolidated (e.g., semisolid) state. The use of
mirror 94 lengthens the path of the laser beam, effectively
doubling same, and provides a more vertical laser beam 98 than
would be possible if the laser 92 itself were mounted directly
above platform surface 100, thus enhancing resolution.
[0058] Referring now to FIGS. 11 and 13, data from the STL files
resident in computer 82 is manipulated to build an object, such as
an intermediate conductive element 20, 20', 20", or 20'",
illustrated in FIGS. 1-10, or base supports 122, one layer at a
time. Accordingly, the data mathematically representing one or more
of the objects to be fabricated are divided into subsets, each
subset representing a slice or layer of the object. The division of
data is effected by mathematically sectioning the 3-D CAD model
into at least one layer, a single layer or a "stack" of such layers
representing the object. Each slice may be from about 0.0001 to
about 0.0300 inch thick. As mentioned previously, a thinner slice
promotes higher resolution by enabling better reproduction of fine
vertical surface features of the object or objects to be
fabricated.
[0059] When one or more base supports 122 are to be
stereolithographically fabricated, base supports 122 may be
programmed as a separate STL file from the other objects to be
fabricated. The primary STL file for the object or objects to be
fabricated and the STL file for base support(s) 122 are merged.
[0060] Before fabrication of a first layer for a support 122 or an
object to be fabricated is commenced, the operational parameters
for apparatus 80 are set to adjust the size (diameter if circular)
of the laser light beam used to cure material 86. In addition,
computer 82 automatically checks and, if necessary, adjusts by
means known in the art the surface level 88 of material 86 in
reservoir 84 to maintain same at an appropriate focal length for
laser beam 98. U.S. Pat. No. 5,174,931, referenced above and
previously incorporated herein by reference, discloses one suitable
level control system. Alternatively, the height of mirror 94 may be
adjusted responsive to a detected surface level 88 to cause the
focal point of laser beam 98 to be located precisely at the surface
level 88 of material 86 if the surface level 88 is permitted to
vary, although this approach is more complex. Platform 90 may then
be submerged in material 86 in reservoir 84 to a depth equal to the
thickness of one layer or slice of the object to be formed, and the
liquid surface level 88 is readjusted as required to accommodate
material 86 displaced by submergence of platform 90. Laser 92 is
then activated so laser beam 98 will scan unconsolidated (e.g.,
liquid or powdered) material 86 disposed over surface 100 of
platform 90 to at least partially consolidate (e.g., polymerize to
at least a semisolid state) material 86 at selected locations,
defining the boundaries of a first layer 122A of base support 122
and filling in solid portions thereof. Platform 90 is then lowered
by a distance equal to the thickness of second layer 122B, and
laser beam 98 scanned over selected regions of the surface of
material 86 to define and fill in the second layer while
simultaneously bonding the second layer to the first. The process
may be repeated as often as necessary, layer by layer, until base
support 122 is completed. Platform 90 is then moved relative to
mirror 94 to form any additional base supports 122 on platform 90
or a substrate disposed thereon or to fabricate objects upon
platform 90, base support 122, or a substrate, as provided in the
control software. The number of layers required to erect support
122 or one or more other objects to be formed depends upon the
height of the object or objects to be formed and the desired layer
thicknesses of layers 20A, 20B, etc. The layers of a
stereolithographically fabricated structure may have different
thicknesses.
[0061] If a recoater blade 102 is employed, the process sequence is
somewhat different. In this instance, surface 100 of platform 90 is
lowered into unconsolidated (e.g., liquid) material 86 below
surface level 88 a distance greater than a thickness of a single
layer of material 86 to be cured, then raised above surface level
88 until platform 90, a substrate disposed thereon, or a structure
being formed on platform 90 or a substrate thereon is precisely one
layer's thickness below blade 102. Blade 102 then sweeps
horizontally over platform 90 or (to save time) at least over a
portion thereof on which one or more objects are to be fabricated
to remove excess material 86 and leave a film of precisely the
desired thickness. Platform 90 is then lowered so that the surface
of the film and surface level 88 are coplanar and the surface of
the unconsolidated material 86 is still. Laser 92 is then initiated
to scan with laser beam 98 and define the first layer 20A. The
process is repeated, layer by layer, to define each succeeding
layer and simultaneously bond same to the next lower layer until
all of the layers of the object or objects to be fabricated are
completed. A more detailed discussion of this sequence and
apparatus for performing same is disclosed in U.S. Pat. No.
5,174,931, previously incorporated herein by reference.
[0062] As an alternative to the above approach to preparing a layer
of material 86 for scanning with laser beam 98, a layer of
unconsolidated (e.g., liquid) material 86 may be formed on surface
100 of support platform 90, on a substrate disposed on platform 90,
or on one or more objects being fabricated by lowering platform 90
to flood material 86 over surface 100, over a substrate disposed
thereon, or over the highest completed layer of the object or
objects being formed, then raising platform 90 and horizontally
traversing a so-called "meniscus" blade horizontally over platform
90 to form a layer of unconsolidated material having the desired
thickness over platform 90, the substrate, or each of the objects
being formed. Laser 92 is then initiated and a laser beam 98
scanned over the layer of unconsolidated material to define at
least the boundaries of the solid regions of the next higher layer
of the object or objects being fabricated.
[0063] Yet another alternative to layer preparation of
unconsolidated (e.g., liquid) material 86 is to merely lower
platform 90 to a depth equal to that of a layer of material 86 to
be scanned, and to then traverse a combination flood bar and
meniscus bar assembly horizontally over platform 90, a substrate
disposed on platform 90, or one or more objects being formed to
substantially concurrently flood material 86 thereover and to
define a precise layer thickness of material 86 for scanning.
[0064] All of the foregoing approaches to liquid material flooding
and layer definition and apparatus for initiation thereof are known
in the art and are not material to practice of the present
invention, so no further details relating thereto will be provided
herein.
[0065] In practicing the present invention, a commercially
available stereolithography apparatus operating generally in the
manner as that described above with respect to apparatus 80 of FIG.
11 may be employed, but with further additions and modifications as
hereinafter described for practicing the method of the present
invention. For example and not by way of limitation, the
SLA-250/50HR, SLA-5000 and SLA-7000 stereolithography systems, each
offered by 3D Systems, Inc., of Valencia, Calif., are suitable for
modification. Photopolymers believed to be suitable for use in
practicing the present invention include Cibatool SL 5170 and SL
5210 resins for the SLA-250/50HR system, Cibatool SL 5530 resin for
the SLA-5000 and 7000 systems, and Cibatool SL 7510 resin for the
SLA-7000 system. All of these photopolymers are available from Ciba
Specialty Chemicals Inc.
[0066] By way of example and not limitation, the layer thickness of
material 86 to be formed, for purposes of the invention, may be on
the order of about 0.0001 to 0.0300 inch, with a high degree of
uniformity. It should be noted that different material layers may
have different heights, so as to form a structure of a precise,
intended total height or to provide different material thicknesses
for different portions of the structure. The size of the laser beam
"spot" impinging on the surface of material 86 to cure same may be
on the order of 0.001 inch to 0.008 inch. Resolution is preferably
.+-.0.0003 inch in the X-Y plane (parallel to surface 100) over at
least a 0.5 inch.times.0.25 inch field from a center point,
permitting a high resolution scan effectively across a 1.0
inch.times.0.5 inch area. Of course, it is desirable to have
substantially this high a resolution across the entirety of surface
100 of platform 90 to be scanned by laser beam 98, such area being
termed the "field of exposure," such area being substantially
coextensive with the vision field of a machine vision system
employed in the apparatus of the invention as explained in more
detail below. The longer and more effectively vertical the path of
laser beam 96/98, the greater the achievable resolution.
[0067] Another apparatus 180 useful in implementing the methods of
the present invention, referred to as a thermal stereolithography
apparatus, is schematically illustrated in FIG. 12. Apparatus 180
and the operation of apparatus 180 are described in great detail in
United States Patents assigned to 3D Systems, Inc. of Valencia,
Calif., such patents including, without limitation, U.S. Pat. Nos.
5,141,680; 5,344,298; 5,501,824; 5,569,349; 5,672,312; 5,695,707;
5,776,409; 5,855,836. The disclosure of each of the foregoing
patents is hereby incorporated herein by this reference.
[0068] As noted above, a 3-D CAD drawing of an object to be
fabricated in the form of a data file may be placed in the memory
of a computer 182 controlling the operation of apparatus 180 if
computer 182 is not a CAD computer in which the original object
design is effected. Preferably, the data is formatted in an STL
file.
[0069] Apparatus 180 includes a support platform or elevator 190,
precisely vertically movable in fine, repeatable increments
responsive to control of computer 182. An object may be fabricated
directly on platform 190, or on a substrate disposed on platform
190. When the object is to be fabricated on a substrate disposed on
platform 190, the substrate may be positioned on platform 190 and
secured thereto by way of one or more base supports (see FIG. 13).
Such base supports 122 may be fabricated before or simultaneously
with the stereolithographic fabrication of one or more objects on
platform 190 or a substrate disposed thereon. These base supports
122 may support, or prevent lateral movement of, the substrate
relative to a surface 200 of platform 190. Base supports 122 may
also provide a perfectly horizontal reference plane for fabrication
of one or more objects thereon, as well as facilitate the removal
of a substrate from platform 190 following the stereolithographic
fabrication of one or more objects on the substrate.
[0070] Apparatus 180 also includes a reservoir 184 (which may
comprise a removable reservoir interchangeable with others
containing different materials) of an unconsolidated material 186
to be employed in fabricating the intended object. Unconsolidated
material 186 useful with apparatus 180 is a heated, flowable
material that is typically solid at the operating temperatures of a
semiconductor device.
[0071] One or more spray heads 192 of apparatus 180 communicate
with and receive unconsolidated material 186 from reservoir 184.
Each spray head 192, under control of computer 182, effects the
deposition of unconsolidated material 186 in the X-Y plane of
platform 190, on a substrate disposed on platform 190, or on an
object being formed.
[0072] Data from the STL files resident in computer 182 is
manipulated to build an object, such as intermediate conductive
element 20, illustrated in FIGS. 1-10, or base supports 122,
illustrated in FIG. 13, one layer at a time. Accordingly, the data
mathematically representing one or more of the objects to be
fabricated are divided into subsets, each subset representing a
slice or layer of the object. The division of data is effected by
mathematically sectioning the 3-D CAD model into at least one
layer, a single layer or a "stack" of such layers representing the
object. Each slice may be from about 0.003 to about 0.030 inch
thick. As mentioned previously, a thinner slice promotes higher
resolution by enabling better reproduction of fine vertical surface
features of the object or objects to be fabricated.
[0073] When one or more base supports 122 are to be
stereolithographically fabricated, base supports 122 may be
programmed as an STL file separate from the STL files for other
objects to be fabricated. The primary STL file for the object or
objects to be fabricated and the STL file for base support(s) 122
are merged.
[0074] Before fabrication of a first layer for a support 122 or an
object to be fabricated is commenced, the operational parameters
for apparatus 180 are set to adjust the size (diameter if circular)
of the stream of unconsolidated material 186 to be ejected from
each spray head 192. In addition, computer 182 automatically checks
and, if necessary, adjusts by means known in the art the surface
level 188 of platform 190 to maintain same at an appropriate length
from spray heads 192 to obtain an object having the desired
resolution. U.S. Pat. No. 5,174,931, referenced above and
previously incorporated herein by reference, discloses one suitable
level control system.
[0075] Each spray head 192 is then activated so as to deposit
unconsolidated material 186 over surface 200 of platform 190 to
form at least the boundaries of a first layer 122A of base support
122 (FIG. 13) and to fill in solid portions thereof. The deposited
material 186 is then permitted to at least partially harden, or
consolidate, prior to forming another layer thereon. Each layer of
the object being fabricated may be laterally supported by a
material that remains substantially unconsolidated at ambient
temperatures and that, preferably, will not adhere to the
just-formed layer of material 186.
[0076] After a layer is formed, platform 190 may be lowered a
distance substantially equal to the thickness of the just-formed
layer so as to maintain a substantially constant distance between
spray heads 192 and the surface on which the next layer of
unconsolidated material 186 is to be disposed. Spray heads 192 may
then be scanned over selected regions of surface 200 or the surface
of the previously formed layer to define and fill in the second
layer while simultaneously bonding the second layer to the first.
The process may be then repeated, as often as necessary, layer by
layer, until base support 122 is completed. The number of layers
required to erect support 122 or one or more other objects to be
formed depends upon the height of the object or objects to be
formed and the desired thicknesses of layers 20A, 20B, etc. The
layers of a stereolithographically fabricated structure may have
different thicknesses.
[0077] Exemplary commercially available thermal stereolithography
apparatus operating generally in the manner as that described above
with respect to apparatus 180 of FIG. 12 include, but are not
limited to, the THERMOJET.TM. printer offered by 3D Systems, Inc.,
of Valencia, Calif. Of course, as with apparatus 80 depicted in
FIG. 11, apparatus 180 may be employed with further additions and
modifications as hereinafter described. Thermoplastic materials, or
"thermopolymers," believed to be suitable for use in practicing the
method of the present invention in combination with apparatus 180
include ThermoJet 88 Thermopolymer, available from 3D Systems,
Inc., as well as other nonconductive and electrically conductive
thermopolymers known in the art.
[0078] By way of example and not limitation, the layer thickness of
material 186 to be formed, for purposes of the invention, may be on
the order of about 0.003 to 0.030 inch, with a high degree of
uniformity. It should be noted that different material layers may
have different heights, so as to form a structure of a precise,
intended total height or to provide different material thicknesses
for different portions of the structure. Resolution is preferably
about 300 dpi (dots per inch) or about 0.003 inch in the X-Y plane
(parallel to surface 200). Of course, it is desirable to have
substantially this high a resolution across the entire surface 200
of platform 190 to be scanned by spray heads 192, such area being
termed the "field of exposure," such area being substantially
coextensive with the vision field of a machine vision system
employed in the apparatus of the invention as explained in more
detail below. Of course, since apparatus 180 deposits material by
way of one or more spray heads 192, the resolution with which an
object can be formed by apparatus 180 is dependent, at least in
part, upon spray heads 192 and the type of material 186 deposited
thereby.
[0079] Referring now to both FIGS. 11 and 12, it should be noted
that apparatus 80, 180 useful in the methods of the present
invention include cameras 140 which are in communication with
computers 82, 182, respectively, and are preferably located, as
shown, in close proximity to optics and mirror 94 located above
surface 100, 200 of support platform 90, 190. Each camera 140 may
be any one of a number of commercially available cameras, such as
capacitive-coupled discharge (CCD) cameras available from a number
of vendors. Suitable circuitry as required for adapting the output
of camera 140 for use by computer 82, 182 may be incorporated in a
board 142 installed in computer 82, 182 which is programmed as
known in the art to respond to images generated by camera 140 and
processed by board 142. Camera 140 and board 142 may together
comprise a so-called "machine vision system" and, specifically, a
"pattern recognition system" (PRS), the operation of which will be
described briefly below for a better understanding of the present
invention. Alternatively, a self-contained machine vision system
available from a commercial vendor of such equipment may be
employed. For example, and without limitation, such systems are
available from Cognex Corporation of Natick, Mass. For example, the
apparatus of the Cognex BGA Inspection Package.TM. or the SMD
Placement Guidance Package.TM. may be adapted to the present
invention, although it is believed that the MVS-8000.TM. product
family and the Checkpoint.RTM. product line, the latter employed in
combination with Cognex PatMax.TM. software, may be especially
suitable for use in the present invention.
[0080] It is noted that a variety of machine vision systems are in
existence, examples of which and their various structures and uses
are described, without limitation, in U.S. Pat. Nos. 4,526,646;
4,543,659; 4,736,437; 4,899,921; 5,059,559; 5,113,565; 5,145,099;
5,238,174; 5,463,227; 5,288,698; 5,471,310; 5,506,684; 5,516,023;
5,516,026; and 5,644,245. The disclosure of each of the immediately
foregoing patents is hereby incorporated by this reference.
Stereolithographic Fabrication of the Conductive Elements
[0081] In order to facilitate fabrication of one or more
intermediate conductive elements 20 in accordance with the method
of the present invention with apparatus 80, 180, a data file
representative of the size, configuration, thickness and surface
topography of, for example, a particular type and design of
semiconductor device 10 or other substrate upon which one or more
intermediate conductive elements 20 are to be fabricated is placed
in the memory of computer 82, 182.
[0082] One or more semiconductor devices 10, carrier substrates 30,
or other semiconductor device components may be placed on surface
100, 200 of platform 90, 190 for fabrication of intermediate
conductive elements 20 in communication with contact pads thereof
(e.g., bond pads 12 of semiconductor device 10, shown in FIGS.
1-4). One or more semiconductor devices 10, carrier substrates 30,
or other semiconductor device components may be held on or
supported above platform 90, 190 by stereolithographically formed
base supports 122. When apparatus 80 is used, these base supports
122 are formed by sequentially disposing one or more layers of
material 86 on surface 100 and selectively altering material 86 by
use of laser 92. Apparatus 180 forms base supports 122 by
selectively depositing one or more layers of material 186 from
spray heads 192.
[0083] Camera 140 is then activated to locate the position and
orientation of each semiconductor device 10, carrier substrate 30,
or other type of semiconductor device component upon which
intermediate conductive elements 20 are to be fabricated. The
features of each semiconductor device 10, carrier substrate 30, or
other type of semiconductor device component are compared with
those in the data file residing in memory, the locational and
orientational data for each semiconductor device 10, carrier
substrate 30, or other type of semiconductor device component then
also being stored in memory. It should be noted that the data file
representing the design size, shape and topography for each
semiconductor device 10, carrier substrate 30, or other type of
semiconductor device component may be used at this juncture to
detect physically defective or damaged semiconductor devices 10,
carrier substrates 30, or other types of semiconductor device
components prior to fabricating intermediate conductive elements 20
thereon or before conducting further packaging of semiconductor
devices 10, carrier substrates 30, or other types of semiconductor
device components. Accordingly, such damaged or defective
semiconductor devices 10, carrier substrates 30, or other types of
semiconductor device components can be deleted from the process of
fabricating intermediate conductive elements 20 and from further
packaging. It should also be noted that data files for more than
one type (size, thickness, configuration, surface topography) of
each semiconductor device 10, carrier substrate 30, or other type
of semiconductor device component may be placed in computer memory
and computer 82, 182 programmed to recognize not only the locations
and orientations of each semiconductor device 10, carrier substrate
30, or other type of semiconductor device component, but also the
type of semiconductor component at each location upon platform 90,
190 so that material 86 may be at least partially consolidated by
laser beam 98 or material 186 selectively deposited by spray heads
192 in the correct pattern and to the height required to define
intermediate conductive elements 20 in the appropriate, desired
locations on each semiconductor device 10, carrier substrate 30, or
other semiconductor device component.
Fabrication of the Conductive Elements by
Photo-Stereolithography
[0084] When apparatus 80 is used, as depicted in FIGS. 11 and 13,
the one or more semiconductor devices 10, carrier substrates 30, or
other semiconductor device components on platform 90 may then be
submerged partially below the surface level 88 of unconsolidated
(e.g., liquid) material 86 to a depth greater than the thickness of
a first layer of material 86 to be at least partially consolidated
(e.g., cured to at least a semisolid state) to form the lowest
layer of each intermediate conductive element 20 at the appropriate
location or locations on each semiconductor device 10, carrier
substrate 30, or other type of semiconductor device component, then
raised to a depth equal to the layer thickness, the surface level
88 of material 86 being allowed to become calm. Photopolymers that
are useful as material 86 exhibit a desirable dielectric constant
and low shrinkage upon cure, are of sufficient (i.e., semiconductor
grade) purity, exhibit good adherence to other semiconductor device
materials, and have a coefficient of thermal expansion (CTE)
similar to that of the materials adjacent thereto. Preferably, the
CTE of material 86 is sufficiently similar to that of the adjacent
materials to prevent undue stressing thereof during thermal cycling
of semiconductor device 10, carrier substrate 30, or other
semiconductor device component in testing, subsequent processing,
and subsequent normal operation. Exemplary photopolymers exhibiting
these properties are believed to include, but are not limited to,
the above-referenced resins from Ciba Specialty Chemicals Inc. One
area of particular concern in determining resin suitability is the
substantial absence of mobile ions and, specifically,
fluorides.
[0085] Laser 92 is then activated and scanned to direct laser beam
98, under control of computer 82, toward specific locations of
surface level 88 relative to each semiconductor device 10, carrier
substrate 30, or other type of semiconductor device component to
effect the aforementioned partial cure of material 86 to form a
first layer 20A of each intermediate conductive element 20.
Platform 90 is then lowered into reservoir 84 and raised a distance
equal to the desired thickness of another layer 20B of each
intermediate conductive element 20, and laser 92 is activated to
add another layer 20B to each intermediate conductive element 20
under construction. This sequence continues, layer by layer, until
each of the layers of intermediate conductive elements 20 has been
completed.
[0086] In FIG. 13, the first layer of intermediate conductive
element 20 is identified by numeral 20A, and the second layer is
identified by numeral 20B. Likewise, the first layer of base
support 122 is identified by numeral 122A and the second layer
thereof is identified by numeral 122B. As illustrated, base support
122 and intermediate conductive element 20 have only two layers.
Intermediate conductive elements 20 with any number of layers are,
however, within the scope of the present invention.
[0087] In addition to being useful for fabricating intermediate
conductive elements 20, apparatus 80 may also be used to fabricate
nonconductive structures, such as dielectric layers and substrate
layers, such as the nonconductive support layers of a circuit board
or other carrier substrate.
[0088] When apparatus 80 is employed to fabricate one or more
intermediate conductive elements 20 or other structures (e.g., one
or more layers of a carrier substrate 30), each layer 20A, 20B of
each intermediate conductive element 20 is preferably built by
first defining any internal and external object boundaries of that
layer with laser beam 98, then hatching solid areas of intermediate
conductive elements 20 located within the object boundaries with
laser beam 98. An internal boundary of a layer may comprise an
aperture, a through hole, a void, or a recess in carrier substrate
30, for example. If a particular layer includes a boundary of a
void in the object above or below that layer, then laser beam 98 is
scanned in a series of closely spaced, parallel vectors so as to
develop a continuous surface, or skin, with improved strength and
resolution. The time it takes to form each layer depends upon the
geometry thereof, the surface tension and viscosity of material 86,
and the thickness of that layer.
[0089] Alternatively, intermediate conductive elements 20 or other
stereolithographically fabricated structures may each be formed as
a partially cured outer skin extending above active surface 14 of
semiconductor device 10 or above surface 34 of carrier substrate 30
and forming a dam within which unconsolidated material 86 can be
contained. This may be particularly useful where intermediate
conductive elements 20 or other structures protrude a relatively
high distance above active surface 14. In this instance, support
platform 90 may be submerged so that material 86 enters the area
within the dam and raised above surface level 88, and then laser
beam 98 activated and scanned to at least partially cure material
86 residing within the dam or, alternatively, to merely cure a
"skin," a final cure of the material of intermediate conductive
elements 20 or other structures under construction being effected
subsequently by broad-source UV radiation in a chamber, or by
thermal cure in an oven. In this manner, intermediate conductive
elements 20 and other structures of extremely precise dimensions
may be formed of material 86 by apparatus 80 in minimal time.
[0090] Once intermediate conductive elements 20 or other
structures, or at least the outer skins thereof, have been
fabricated, platform 90 is elevated above surface level 88 of
material 86 and platform 90 is removed from apparatus 80, along
with semiconductor device 10, carrier substrate 30, or another
semiconductor device component upon which intermediate conductive
elements 20 or other structures have been stereolithographically
fabricated. Excess, unconsolidated material 86 (e.g., excess
uncured liquid) may be manually removed from platform 90, from any
substrate disposed thereon, and from intermediate conductive
elements 20 or other stereolithographically fabricated structures.
Each semiconductor device 10, carrier substrate 30, or other
semiconductor device component is removed from platform 90, such as
by cutting the semiconductor device component free of base supports
122. Alternatively, base supports 122 may be configured to readily
release semiconductor devices 10, carrier substrates 30, or other
semiconductor device components. As another alternative, a solvent
may be employed to release base supports 122 from platform 90. Such
release and solvent materials are known in the art. See, for
example, U.S. Pat. No. 5,447,822 referenced above and previously
incorporated herein by reference.
[0091] The stereolithographically fabricated intermediate
conductive elements 20 or other structures, as well as
semiconductor device 10, carrier substrate 30, or another
semiconductor device component upon which these structures have
been fabricated, may also be cleaned by use of known solvents that
will not substantially degrade, deform, or damage the
stereolithographically fabricated structures, such as intermediate
conductive elements 20, or the semiconductor device components.
[0092] As noted previously, intermediate conductive elements 20 or
other stereolithographically fabricated structures may then require
postcuring. Intermediate conductive elements 20 or other structures
may have regions of unconsolidated material contained within a
boundary or skin thereof, or material 86 may be only partially
consolidated (e.g., polymerized or cured) and exhibit only a
portion (typically 40% to 60%) of its fully consolidated strength.
Postcuring to completely harden intermediate conductive elements 20
or other stereolithographically fabricated structures may be
effected in another apparatus projecting UV radiation in a
continuous manner over the stereolithographically fabricated
structures or by thermal completion of the initial, UV-initiated
partial cure.
Fabrication of the Conductive Elements by Thermal
Stereolithography
[0093] Referring again to FIGS. 12 and 13, when apparatus 180 is
used to fabricate intermediate conductive elements 20, spray heads
192 direct liquified material 186 onto the appropriate location or
locations of the one or more semiconductor devices 10, carrier
substrates 30, or other semiconductor device components on platform
190, 90. The material is permitted to solidify to form the lowest
layer 20A of each intermediate conductive element 20. Thermoplastic
polymers that are useful as material 186 exhibit desirable
electrical conductivity, exhibit low shrinkage upon solidification,
substantially maintain their structural integrity under normal
operating conditions (e.g., operating temperatures of the
semiconductor device), are of sufficient (i.e., semiconductor
grade) purity, exhibit good adherence to other semiconductor device
materials, and have a coefficient of thermal expansion (CTE)
similar to that of the materials adjacent thereto. Preferably, the
CTE of material 186 is sufficiently similar to that of the adjacent
materials to prevent undue stressing thereof during thermal cycling
of semiconductor device 10, carrier substrate 30, or another
semiconductor device component in testing, subsequent processing,
and subsequent normal operation.
[0094] Platform 190 is then lowered a distance substantially equal
to the next layer 20B of each intermediate conductive element 20
under construction. Heated conductive material 186 is then disposed
by spray heads 192 onto appropriate locations of the previously
fabricated layer 20A of each intermediate conductive element 20 to
form layer 20B. This sequence continues, layer by layer, until each
of the layers of intermediate conductive elements 20 have been
completed.
[0095] In addition to being useful for fabricating intermediate
conductive elements 20, apparatus 180 may also be used to fabricate
nonconductive structures, such as dielectric layers and substrate
layers, such as the nonconductive support layers of a circuit board
or other carrier substrate.
[0096] Once intermediate conductive elements 20 or other structures
have been fabricated, platform 190 is removed from apparatus 180,
along with semiconductor device 10, carrier substrate 30, or
another semiconductor device component upon which intermediate
conductive elements 20 or other structures have been
stereolithographically fabricated. Each semiconductor device 10,
carrier substrate 30, or other semiconductor device component is
removed from platform 190, such as by cutting the semiconductor
device component free of base supports 122. Alternatively, base
supports 122 may be configured to readily release semiconductor
devices 10, carrier substrates 30, or other semiconductor device
components. As another alternative, a solvent may be employed to
release base supports 122 from platform 190. Such release and
solvent materials are known in the art. See, for example, U.S. Pat.
No. 5,447,822 referenced above and previously incorporated herein
by reference.
[0097] The stereolithographically fabricated intermediate
conductive elements 20 or other structures, as well as
semiconductor device 10, carrier substrate 30, or another
semiconductor device component upon which these structures have
been fabricated, may also be cleaned by use of known solvents that
will not substantially degrade, deform, or damage the
stereolithographically fabricated structures, such as intermediate
conductive elements 20, or the semiconductor device components.
[0098] The use of a stereolithographic process as exemplified above
to fabricate intermediate conductive elements 20 is particularly
advantageous since a large number of intermediate conductive
elements 20 may be substantially simultaneously fabricated in a
short time, the positioning thereof is computer controlled and
extremely precise, wastage of material is minimal, and the
stereolithography method requires minimal handling of semiconductor
devices 10, carrier substrates 30, or other semiconductor device
components.
[0099] Stereolithography is also an advantageous method of
fabricating intermediate conductive elements 20 according to the
present invention since stereolithography can be conducted at
temperatures that will not damage or induce significant thermal
stress on the semiconductor device components during fabrication of
intermediate conductive elements 20 thereon. The stereolithography
fabrication process may also be used to simultaneously form
intermediate conductive elements 20 on several semiconductor device
components or assemblies, saving fabrication time and expense. As
the stereolithography method of the present invention recognizes
specific semiconductor devices 10, carrier substrates 30, and other
semiconductor device components, variations between different
semiconductor device components are accommodated. Accordingly, when
the stereolithography method of the present invention is employed,
intermediate conductive elements 20 can be simultaneously
fabricated on different types of semiconductor device components or
assemblies of semiconductor device components.
Semiconductor Device Components and Assemblies Including the
Conductive Elements
[0100] Referring now to FIGS. 1 and 2, an assembly 1 of a
semiconductor device 10 and a carrier substrate 30 is illustrated.
Semiconductor device 10 is a semiconductor die that includes bond
pads 12, which are also referred to herein as contact pads or
contacts for simplicity, on an active surface 14 thereof. A back
side 16 of semiconductor device 10 is disposed against a surface 34
of carrier substrate 30. Bond pads 12 of semiconductor device 10
are electrically connected to corresponding contact pads 32 of
carrier substrate 30 by way of intermediate conductive elements 20.
For simplicity, contact pads 32 are also referred to herein as
contacts.
[0101] Intermediate conductive elements 20, which are fabricated by
stereolithographic techniques, are formed from a conductive
material, such as a conductive elastomer or a metal. Intermediate
conductive elements 20 may each include a single layer or a
plurality of superimposed, contiguous, mutually adhered layers of
conductive material.
[0102] Each intermediate conductive element 20 is substantially
entirely carried along the length thereof upon either semiconductor
device 10 or carrier substrate 30. As illustrated in FIG. 2, each
intermediate conductive element 20 extends across a portion of
active surface 14 of semiconductor device 10, down a lateral edge
18 of semiconductor device 10, and across a portion of surface 34
of carrier substrate 30. A first end 22 of each intermediate
conductive element 20 is in contact with a bond pad 12 and a second
end 24 of intermediate conductive element 20 is connected to a
contact pad 32 of carrier substrate 30.
[0103] FIGS. 3 and 4 illustrate another exemplary assembly 2 with
intermediate conductive elements 20 of the present invention.
Assembly 2 includes two semiconductor devices 10, 10' disposed on a
carrier substrate 30. As illustrated, each semiconductor device 10,
10' is a semiconductor die that includes bond pads 12, 12', or
contact pads or contacts, on an active surface 14, 14' thereof.
Back sides 16, 16' of semiconductor devices 10, 10' are disposed
over a surface 34 of carrier substrate 30, with a lateral edge 18
of one semiconductor device 10 abutting a lateral edge 18' of the
other semiconductor device 10'. Corresponding bond pads 12, 12' of
the two semiconductor devices 10, 10' are electrically connected to
each other by way of intermediate conductive elements 20.
[0104] As in assembly 1 depicted in FIGS. 1 and 2, intermediate
conductive elements 20 of assembly 2 are stereolithographically
fabricated from an electrically conductive material, such as an
electrically conductive thermoplastic polymer or a metal. Since
intermediate conductive elements 20 are stereolithographically
fabricated, each intermediate conductive element 20 may include one
layer or a plurality of superimposed, contiguous, mutually adhered
layers of conductive material.
[0105] With continued reference to FIGS. 3 and 4, substantially the
entire lengths of intermediate conductive elements 20 are carried
by semiconductor devices 10, 10'. As illustrated in FIG. 4, each
intermediate conductive element 20 extends across a portion of
active surface 14 of a first semiconductor device 10, over an
interface 17 between abutting lateral edges 18, 18' of the two
semiconductor devices 10, 10', and across a portion of active
surface 14' of the second semiconductor device 10'. A first end 22
of each intermediate conductive element 20 is in contact with a
bond pad 12 of one semiconductor device 10 and a second end 24 of
intermediate conductive element 20 is connected to a bond pad 12'
of the other semiconductor device 10' (FIG. 3).
[0106] Turning now to FIGS. 5 and 6, an embodiment of a carrier
substrate 30, in this case a circuit board, is schematically
depicted that includes stereolithographically fabricated
intermediate conductive elements 20' according to the present
invention. Carrier substrate 30 includes a single substrate layer
31, intermediate conductive elements 20' carried by carrier
substrate 30, and a contact pad 32, or contact, at an end of each
intermediate conductive element 20'. Intermediate conductive
elements 20' that traverse more than one plane of carrier substrate
30 include vertically extending vias 36 along the lengths thereof.
Vias 36 are located in through holes 38 formed through substrate
layer 31.
[0107] As discussed previously herein, intermediate conductive
elements 20' may be fabricated by stereolithographic techniques.
Contact pads 32 may also be stereolithographically fabricated.
Accordingly, each intermediate conductive element 20' and contact
pad 32 may include one layer or a plurality of superimposed,
contiguous, mutually adhered layers of conductive material.
Exemplary conductive materials that may be used to form
intermediate conductive elements 20' and contact pads 32 include
known thermoplastic conductive polymers and metals. In order to
fabricate intermediate conductive elements 20' on both sides of
substrate layer 31, a first set of intermediate conductive elements
20' is fabricated on a first side of substrate layer 31. Substrate
layer 31 is then inverted and a second set of intermediate
conductive elements 20' is fabricated on a second side of substrate
layer 31.
[0108] Substrate layer 31 may similarly be fabricated from
dielectric materials by stereolithographic processes such as those
disclosed herein. As shown in FIG. 6A, when substrate layer 31 is
stereolithographically fabricated, channels 33 may be recessed in
one or both surfaces thereof to receive intermediate conductive
elements 20'. Thus, the exposed surfaces of intermediate conductive
elements 20' may be recessed relative to the surfaces of substrate
layer 31 or substantially flush therewith. When stereolithography
is used to fabricate substrate layer 31, the layer or layers of
material are preferably deposited onto a flexible or fibrous matrix
and become integral therewith, thereby imparting strength and some
flexibility to the fabricated substrate layer 31.
[0109] When both intermediate conductive elements 20' and substrate
layer 31 are stereolithographically fabricated, carrier substrates
30 that carry intermediate conductive elements 20' on both surfaces
thereof may be fabricated by forming a first, bottom set of
intermediate conductive elements 20' on a platform of a suitable
stereolithography apparatus, forming substrate layer 31 over the
first set of intermediate conductive elements 20', then forming a
second, upper set of intermediate conductive elements 20' on
substrate layer 31. Any vias 36 that extend vertically through
substrate layer 31 may be fabricated before, during, or after the
fabrication of substrate layer 31. When both intermediate
conductive elements 20' and substrate layer 31 are fabricated by
use of stereolithography, the same stereolithographic technique and
apparatus are preferably employed to fabricate intermediate
conductive elements 20' and substrate layer 31. Accordingly,
carrier substrate 30 need not be moved between different
stereolithographic apparatus during fabrication thereof. However,
the use of different stereolithographic techniques and apparatus to
fabricate intermediate conductive elements 20' and substrate layer
31 are also within the scope of the present invention.
[0110] FIG. 7 schematically illustrates a multilayer carrier
substrate 30' according to the present invention, which includes a
plurality of superimposed, contiguous, mutually adhered layers 31'
of dielectric material and intermediate conductive elements 20'
that are each carried by one or more of layers 31'. Intermediate
conductive elements 20' that are carried by more than one layer 31'
and, thus, that extend along more than one plane through carrier
substrate 30' include vias 36 along the lengths thereof. Vias 36
extend substantially vertically through through holes 38' formed in
one or more layers 31'.
[0111] Intermediate conductive elements 20', which are preferably
fabricated by stereolithographic techniques such as those disclosed
herein, each include one layer or a plurality of superimposed,
contiguous, mutually adhered layers of conductive material, such as
a conductive elastomer (e.g., a thermoplastic conductive elastomer
or a conductive photopolymer) or a metal.
[0112] One or more layers 31' of carrier substrate 30' may also be
fabricated by stereolithographic techniques using a dielectric
material. When stereolithography is used to fabricate layers 31' of
carrier substrate 30', each layer 31' may be made by disposing
dielectric material onto a layer of a flexible or fibrous matrix to
impart strength and some flexibility to each fabricated substrate
layer 31'.
[0113] When both intermediate conductive elements 20' and substrate
layer 31' are stereolithographically fabricated, a first, bottom
set of intermediate conductive elements 20' may be formed on a
platform of a suitable stereolithography apparatus, forming a first
substrate layer 31' over or laterally adjacent to the first set of
intermediate conductive elements 20'. The appropriate sequence of
forming intermediate conductive elements 20' and substrate layers
31' then continues until a multilayer carrier substrate 30' of
desired configuration has been fabricated. Any vias 36 that extend
vertically through one or more substrate layers 31' may be
fabricated before, during, or after the fabrication of the
substrate layers 31'. When both intermediate conductive elements
20' and substrate layers 31' are fabricated by use of
stereolithography, the same stereolithographic technique and
apparatus are preferably employed to fabricate intermediate
conductive elements 20' and substrate layers 31'. Accordingly,
carrier substrate 30' need not be moved between different
stereolithographic apparatus during fabrication thereof. However,
the use of different stereolithographic techniques and apparatus to
fabricate intermediate conductive elements 20' and substrate layers
31' are also within the scope of the present invention.
[0114] Turning now to FIGS. 8 and 9, packaged semiconductor devices
that include stereolithographically fabricated conductive elements
are also within the scope of the present invention.
[0115] FIG. 8 illustrates an exemplary semiconductor device package
3 incorporating teachings of the present invention. Semiconductor
device package 3 includes a semiconductor device 10, illustrated as
a leads-over-chip (LOC) type semiconductor die, leads 40 positioned
over an active surface 14 of semiconductor device 10 proximate
corresponding bond pads 12 on active surface 14, and intermediate
conductive elements 20" disposed between leads 40 and bond pads 12
so as to establish electrical communication therebetween. Leads 40
and active surface 14 are electrically isolated from one another by
way of one or more dielectric layers 42 disposed therebetween.
Semiconductor device package 3 may also include a package 50. While
package 50 is illustrated as covering substantially the entire
semiconductor device 10 and the portions of leads 40 adjacent
semiconductor device 10, package 50 may only enclose bond pads 12
and intermediate conductive elements 20".
[0116] Intermediate conductive elements 20" are
stereolithographically fabricated structures that may include one
layer or a plurality of superimposed, contiguous, mutually adhered
layers of a conductive material, such as a conductive elastomer or
a metal. Dielectric layers 42 and package 50 may also be fabricated
by stereolithographic techniques.
[0117] With reference to FIG. 9, another embodiment of a
semiconductor device package 4 that incorporates teachings of the
present invention is illustrated. Semiconductor device package 4
includes a semiconductor device 10, illustrated as a LOC type
semiconductor die, with bond pads 12 on an active surface 14
thereof. Intermediate conductive elements 20'" communicate with
selected bond pads 12 and extend laterally so as to reroute
selected bond pads 12 to different lateral locations relative to
active surface 14. The laterally extending portions of intermediate
conductive elements 20'" are electrically isolated from active
surface 14 by way of a dielectric layer 42 positioned therebetween.
Each intermediate conductive element 20'" includes a contact 26'"
at an end or along the length thereof. Contacts 26'" are at least
electrically exposed through a protective layer 44 and may include
integral conductive structures 28'" or attached conductive
structures 28'", such as solder bumps, protruding therefrom.
[0118] Intermediate conductive elements 20'" are
stereolithographically fabricated and may each include a single
layer or a plurality of superimposed, contiguous, mutually adhered
layers of a conductive material, such as a conductive elastomer or
a metal. Conductive structures 28'" protruding from intermediate
conductive elements 20'" may also be stereolithographically
fabricated from conductive material. In addition, dielectric layer
42 and protective layer 44 may be fabricated from dielectric
materials by use of stereolithographic techniques.
[0119] FIG. 10 illustrates yet another use of conductive elements
according to the present invention, wherein a packaged
semiconductor device 60 with leads 62 extending therefrom is
connected to a carrier substrate 30. Leads 62 are electrically
connected to corresponding contact pads 32 of carrier substrate 30
by way of intermediate conductive elements 20", such as those
described above with reference to FIG. 8.
[0120] Of course, other semiconductor devices and semiconductor
device assemblies that include stereolithographically fabricated
conductive elements are also within the scope of the present
invention.
[0121] While the present invention has been disclosed in terms of
certain preferred embodiments, those of ordinary skill in the art
will recognize and appreciate that the invention is not so limited.
Additions, deletions and modifications to the disclosed embodiments
may be effected without departing from the scope of the invention
as claimed herein. Similarly, features from one embodiment may be
combined with those of another while remaining within the scope-of
the invention.
* * * * *