| Patent | Date |
|---|
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
Grant 7,557,452 - Williams , et al. July 7, 2 | 2009-07-07 |
Standoffs for centralizing internals in packaging process
Grant 7,501,309 - James , et al. March 10, 2 | 2009-03-10 |
Standoffs for centralizing internals in packaging process
Grant 7,462,510 - James , et al. December 9, 2 | 2008-12-09 |
Standoffs for centralizing internals in packaging process
Grant 7,459,797 - James , et al. December 2, 2 | 2008-12-02 |
Standoffs for centralizing internals in packaging process
Grant 7,323,767 - James , et al. January 29, 2 | 2008-01-29 |
Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
Grant 7,273,802 - Williams September 25, 2 | 2007-09-25 |
Leadframe and method for reducing mold compound adhesion problems
Grant 7,264,456 - Williams , et al. September 4, 2 | 2007-09-04 |
Heat sinks including nonlinear passageways
Grant 7,239,015 - Williams , et al. July 3, 2 | 2007-07-03 |
Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components
App 20070148817 - Williams; Vernon M. ; et al. | 2007-06-28 |
Electrical connection methods employing corresponding, insulator-coated members of interconnection elements
App 20070148818 - Williams; Vernon M. ; et al. | 2007-06-28 |
Programmed material consolidation methods for fabricating heat sinks
Grant 7,205,654 - Williams , et al. April 17, 2 | 2007-04-17 |
Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
App 20070062033 - Williams; Vernon M. | 2007-03-22 |
Standoffs for centralizing internals in packaging process
App 20060292750 - James; Stephen L. ; et al. | 2006-12-28 |
Programmed material consolidation methods for fabricating printed circuit board
Grant 7,137,193 - Williams November 21, 2 | 2006-11-21 |
Standoffs for centralizing internals in packaging process
App 20060237832 - James; Stephen L. ; et al. | 2006-10-26 |
Leadframe and method for reducing mold compound adhesion problems
App 20060082021 - Williams; Vernon M. ; et al. | 2006-04-20 |
Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
Grant 7,026,191 - Williams , et al. April 11, 2 | 2006-04-11 |
Selective consolidation processes for electrically connecting contacts of semiconductor device components
Grant 6,977,211 - Williams December 20, 2 | 2005-12-20 |
Flip-chip type semiconductor devices and conductive elements thereof
App 20050230843 - Williams, Vernon M. | 2005-10-20 |
Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
App 20050230806 - Williams, Vernon M. | 2005-10-20 |
Carrier substrates and conductive elements thereof
App 20050221531 - Williams, Vernon M. | 2005-10-06 |
Programmed material consolidation methods for fabricating heat sinks
App 20050148115 - Williams, Vernon M. ; et al. | 2005-07-07 |
Transfer molding and underfilling apparatus
Grant 6,863,516 - Williams March 8, 2 | 2005-03-08 |
Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
App 20050026414 - Williams, Vernon M. | 2005-02-03 |
Standoffs for centralizing internals in packaging process
App 20050023562 - James, Stephen L. ; et al. | 2005-02-03 |
Selective consolidation processes for electrically connecting contacts of semiconductor device components
App 20050006736 - Williams, Vernon M. | 2005-01-13 |
Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically
Grant 6,838,319 - Williams January 4, 2 | 2005-01-04 |
Programmed material consolidation methods for fabricating semiconductor device components and conductive features thereof
App 20040255458 - Williams, Vernon M. | 2004-12-23 |
Transfer molding and underfilling method and apparatus
Grant 6,830,954 - Williams December 14, 2 | 2004-12-14 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
Grant 6,815,253 - Williams November 9, 2 | 2004-11-09 |
Standoffs for centralizing internals in packaging process
App 20040169292 - James, Stephen L. ; et al. | 2004-09-02 |
Stereolithographic methods for securing conductive elements to contacts of semiconductor device components
Grant 6,780,744 - Williams August 24, 2 | 2004-08-24 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
Grant 6,767,815 - Williams July 27, 2 | 2004-07-27 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
Grant 6,764,933 - Williams July 20, 2 | 2004-07-20 |
Stereolithographic methods for fabricating conductive elements
Grant 6,764,935 - Williams July 20, 2 | 2004-07-20 |
Methods for finishing microelectronic device packages
App 20040104200 - Nally, Steven P. ; et al. | 2004-06-03 |
Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
Grant 6,730,998 - Williams , et al. May 4, 2 | 2004-05-04 |
Heat sinks including nonlinear passageways
App 20040036161 - Williams, Vernon M. ; et al. | 2004-02-26 |
Stereolithographic methods for securing conductive elements to contacts of semiconductor device components
App 20040018709 - Williams, Vernon M. | 2004-01-29 |
Method and apparatus for packaging microelectronic substrates
App 20030235663 - Williams, Vernon M. ; et al. | 2003-12-25 |
Method for removing cleaning compound flash from mold vents
Grant 6,666,997 - Williams , et al. December 23, 2 | 2003-12-23 |
Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
App 20030211657 - Williams, Vernon M. ; et al. | 2003-11-13 |
Method and apparatus for packaging microelectronic substrates
App 20030209831 - Williams, Vernon M. ; et al. | 2003-11-13 |
Standoffs for centralizing internals in packaging process
App 20030201525 - James, Stephen L. ; et al. | 2003-10-30 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
Grant 6,632,732 - Williams October 14, 2 | 2003-10-14 |
Methods for finishing microelectronic device packages
Grant 6,602,430 - Nally , et al. August 5, 2 | 2003-08-05 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20030098470 - Williams, Vernon M. | 2003-05-29 |
Leadframe and method for reducing mold compound adhesion problems
App 20030067061 - Williams, Vernon M. ; et al. | 2003-04-10 |
Leadframe and method for removing cleaning compound flash from mold vents
App 20030062603 - Williams, Vernon M. ; et al. | 2003-04-03 |
Leadframe and method for removing cleaning compound flash from mold vents
App 20030062642 - Williams, Vernon M. ; et al. | 2003-04-03 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20030045047 - Williams, Vernon M. | 2003-03-06 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
Grant 6,500,746 - Williams December 31, 2 | 2002-12-31 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20020123213 - Williams, Vernon M. | 2002-09-05 |
Transfer molding and underfilling method and apparatus
App 20020115237 - Williams, Vernon M. | 2002-08-22 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20020111003 - Williams, Vernon M. | 2002-08-15 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20020102829 - Williams, Vernon M. | 2002-08-01 |
Transfer molding and underfilling method and apparatus
App 20020025353 - Williams, Vernon M. | 2002-02-28 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20010051391 - Williams, Vernon M. | 2001-12-13 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
App 20010036718 - Williams, Vernon M. | 2001-11-01 |
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