U.S. patent application number 10/875232 was filed with the patent office on 2005-10-06 for semiconductor manufacturing apparatus and method for assisting monitoring and analysis of the same.
This patent application is currently assigned to Hitachi High-Technologies Corporation. Invention is credited to Ikuhara, Shoji, Kagoshima, Akira, Shiraishi, Daisuke.
Application Number | 20050217794 10/875232 |
Document ID | / |
Family ID | 35052980 |
Filed Date | 2005-10-06 |
United States Patent
Application |
20050217794 |
Kind Code |
A1 |
Kagoshima, Akira ; et
al. |
October 6, 2005 |
Semiconductor manufacturing apparatus and method for assisting
monitoring and analysis of the same
Abstract
To provide a semiconductor manufacturing apparatus that can
easily and quickly monitor and analyze the state of a semiconductor
processing apparatus and a method for assisting the monitoring and
analysis thereof. A semiconductor manufacturing apparatus includes:
detecting means 7, 8 that detects, as a plurality of state signals,
at least either of a plurality of spectra obtained by separating
plasma light emission generated in a processing chamber 2 of a
semiconductor processing apparatus 1 or a plurality of apparatus
state signals that indicate states of the apparatus; apparatus
event information output means 9 that outputs the state of the
semiconductor processing apparatus in a current process step;
conversion means 14, 17, 18 that converts a combination of the
plurality of state signals detected by the detecting means 7, 8
into respective particular figures; and display position
controlling means 20 that displays the figures generated by the
conversion means 14, 17, 18 at predetermined display positions
associated with the process step.
Inventors: |
Kagoshima, Akira;
(Kudamatsu-shi, JP) ; Ikuhara, Shoji; (Hikari-shi,
JP) ; Shiraishi, Daisuke; (Hikari-shi, JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON
VA
22209-3873
US
|
Assignee: |
Hitachi High-Technologies
Corporation
Tokyoi
JP
|
Family ID: |
35052980 |
Appl. No.: |
10/875232 |
Filed: |
June 25, 2004 |
Current U.S.
Class: |
156/345.24 |
Current CPC
Class: |
H01J 37/32972 20130101;
H01J 37/32935 20130101 |
Class at
Publication: |
156/345.24 |
International
Class: |
C23F 001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 30, 2004 |
JP |
2004-100136 |
Claims
What is claimed is:
1. A semiconductor manufacturing apparatus, comprising: detecting
means that detects, as a plurality of state signals, at least
either of a plurality of spectra obtained by separating plasma
light emission generated in a processing chamber of a semiconductor
processing apparatus or a plurality of apparatus state signals that
indicate states of the apparatus; apparatus event information
output means that outputs the state of the semiconductor processing
apparatus in a current process step; conversion means that converts
a combination of the plurality of state signals detected by said
detecting means into respective particular figures; and display
position controlling means that displays the figures generated by
the conversion means at predetermined display positions associated
with the process step.
2. A semiconductor manufacturing apparatus, comprising: an emission
spectrometer that separates plasma light emission generated in a
processing chamber of a semiconductor processing apparatus;
apparatus event information output means that outputs the state of
the semiconductor processing apparatus in a current process step;
color signal generating means that converts the output of said
emission spectrometer into a plurality of spectra and converts the
resulting combination of a plurality of spectra into color signals;
and display position controlling means that displays the color
signals generated by the color signal generating means at display
positions on a display device which are specified by the apparatus
event information output means.
3. A semiconductor manufacturing apparatus, comprising: apparatus
state sensor that detects a plurality of apparatus state signals
that represents states of a semiconductor processing apparatus;
apparatus event information output means that outputs the state of
the semiconductor processing apparatus in a current process step;
color signal generating means that converts a combination of the
plurality of apparatus state signals detected by said apparatus
state sensor into color signals; and display position controlling
means that displays the color signals generated by the color signal
generating means at display positions on a display device which are
determined by the apparatus event information output means.
4. The semiconductor manufacturing apparatus according to claim 2
or 3, wherein said color signals are displayed on the display
device with the time axes thereof being superimposed in accordance
with a signal indicating a processing point in time for each sample
which is output by the apparatus event information output
means.
5. The semiconductor manufacturing apparatus according to claim 2
or 3, wherein said color signals are displayed on the display
device in a time-series manner in accordance with information
output by the apparatus event information output means.
6. A semiconductor manufacturing apparatus, comprising: an emission
spectrometer that separates plasma light emission generated in a
processing chamber of a semiconductor processing apparatus;
apparatus state sensor that detects a plurality of apparatus state
signals that represents states of a semiconductor processing
apparatus; apparatus event information output means that outputs
the state of the semiconductor processing apparatus in a current
process step; color signal generating means that converts the
output of said emission spectrometer into a plurality of spectra
and converts the resulting combination of a plurality of spectra
into color signals; and display position controlling means that
displays the color signals generated by the color generating means
and the apparatus state signals detected by the apparatus state
sensor at display positions determined by the apparatus event
information output means.
7. The semiconductor manufacturing apparatus according to claim 6,
wherein said color signals and apparatus state signals are
displayed on the display device with the time axes thereof being
superimposed in accordance with a signal indicating a processing
point in time for each sample which is output by the apparatus
event information output means.
8. The semiconductor manufacturing apparatus according to claim 6,
wherein said color signals and apparatus state signals are
displayed on the display device in a time-series manner in
accordance with information output by the apparatus event
information output means.
9. A method for assisting monitoring and analysis of a
semiconductor manufacturing apparatus, comprising: a step of
detecting, as a plurality of state signals, at least either of a
plurality of spectral output signal obtained by separating plasma
light emission generated in a processing chamber or a plurality of
apparatus state signals that indicate states of the apparatus and
converting a combination of the plurality of detected state signals
into respective particular figures; and a step of displaying said
figures at predetermined display positions associated with a
process step.
10. A method for assisting monitoring and analysis of a
semiconductor manufacturing apparatus, comprising: a step of
separating plasma light emission generated in a processing chamber
into a plurality of spectra and converting a combination of the
plurality of spectra into color signals; and a step of displaying
said color signals at display positions specified by apparatus
event information output means, the apparatus event information
output means indicating the state of the apparatus in a current
process step.
11. A method for assisting monitoring and analysis of a
semiconductor manufacturing apparatus, comprising: a step of
converting a combination of a plurality of apparatus state signals
detected by an apparatus state sensor into color signals; and a
step of displaying said color signals at display positions
specified by apparatus event information output means, the
apparatus event information output means indicating the state of
the apparatus in a current process step.
12. A semiconductor manufacturing apparatus, comprising: detecting
means that detects, as a plurality of state signals, at least
either of a plurality of spectra obtained by separating plasma
light emission generated in a processing chamber of a semiconductor
processing apparatus or a plurality of apparatus state signals that
indicate states of the apparatus; apparatus event information
output means that outputs the state of the semiconductor processing
apparatus in a current process step; conversion means that converts
a combination of the plurality of state signals detected by said
detecting means into respective particular sound information; and
reproduction means that reproduces the sound information generated
by the conversion means at predetermined display timings associated
with the process step.
Description
[0001] The present application claims priority from Japanese patent
application No. 2004-100136 filed on Mar. 30, 2004, the content of
which is hereby incorporated by reference into this
application.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a semiconductor
manufacturing apparatus and a method for assisting monitoring and
analysis of the same. In particular, it relates to a semiconductor
manufacturing apparatus whose state can be easily monitored and
analyzed and a method for assisting monitoring and analysis of the
apparatus.
[0004] 2. Description of the Related Art
[0005] In semiconductor manufacturing, improvement of the overall
equipment effectiveness (OEE) of semiconductor manufacturing
apparatus is one important factor in terms of manufacturing
efficiency.
[0006] A primary reason for the deterioration of the overall
equipment effectiveness is the quality control (QC) period or
running-in period for assuring a high process stability of a
semiconductor processing apparatus. Besides, considerable process
failures occur because of deterioration of the manufacturing
apparatus with time or the like, or considerable shutdown periods
occurring due to unexpected abnormalities or the like.
[0007] To improve the overall equipment effectiveness, it is
essential not only to prevent occurrence of such troubles but also
to make the apparatus recover to its normal state as quick as
possible after such troubles or abnormalities occur. To achieve
this, it is required to quickly and accurately diagnose the state
of the apparatus.
[0008] As a system for readily monitoring the state of a
semiconductor manufacturing apparatus, for example, there is known
a system that mounts a signal lamp on the top of the apparatus in
the semiconductor manufacturing line and indicates the operational
state of the apparatus or any abnormality in the apparatus to the
operator.
[0009] In typical semiconductor manufacturing factories, monitoring
and analysis systems that assist detailed diagnosis of the state of
semiconductor processing apparatus are widely used. Such monitoring
and analysis systems assist the user to monitor and analyze a
semiconductor processing apparatus by displaying, on a computer
screen, a time-series graph of measurements obtained by a plurality
of monitors attached to the apparatus, for example.
[0010] FIG. 8 shows an example of graphs displayed by such
conventional monitoring and analysis systems. In this example, as
process variables indicating the state of the apparatus, a
reflected power (a reflected wave power of a high-frequency power
for generating plasma), a bias voltage and a plasma emission
intensity (average value for the whole wavelength) are displayed in
the form of a graph. In this drawing, the broken lines 82a, 82b,
82c, 82d and 82e indicate separations of the processings of each of
the wafers. Therefore, FIG. 8 shows apparatus state data for five
wafers.
[0011] Further, the broken lines 84a, 84b, 84c and 84d indicate
separations of process steps in the processing of a single wafer.
That is, the section between the Y axis and the broken line 84a
corresponds to a process step No. 1, the section between the broken
lines 84a and 84b corresponds to a waiting state between process
steps, the section between the broken lines 84b and 84c corresponds
to a process step No. 2, the section between the broken lines 84c
and 84d corresponds to a process step No. 3, and the section
between the broken lines 84d and 82a corresponds to a process step
No. 4.
[0012] As described above, in semiconductor manufacturing
processes, a single wafer may be processed in a single process
which comprises a plurality of process steps. In such a case, the
system for monitoring and analyzing the apparatus state has to
conduct monitoring and analysis for each process step. Thus,
display for each process step described above is required.
BRIEF SUMMARY OF THE INVENTION
[0013] However, the system that uses a signal lamp to indicate the
apparatus state to the operator is capable of representing only a
few apparatus states using the signal lamp. Thus, it is difficult
to address a time variation of the apparatus or process, a sudden
abnormality or the like.
[0014] Besides, the above-described monitoring and analysis systems
used commonly in semiconductor manufacturing factories must handle
enormous volumes of data of various types. Therefore, the
monitoring and analysis operations require considerable time and
effort, and thus, the operation efficiency is reduced.
[0015] Signals to be monitored or analyzed include various kinds of
process variables, such as gas flow rate, pressure, and electrical
signals. However, it is impossible to display all the process
variables on the display device of the computer. Therefore,
generally, the user of the system selects several process variables
based on the experience or past analysis result and only the
selected variables are displayed.
[0016] In the case where several process variables are selected and
displayed individually in the form of graphs, for example, it is
hard to understand the variation or trend of each process variable.
Therefore, considerable time and effort is required for diagnosing
the apparatus state and process state. In such a case, generally, a
large amount of data is handled collectively using a statistical
analysis technique, in particular, a multivariate analysis
technique in recent years. However, in this approach, it is
difficult to select an effective technique or find the meanings of
values obtained as a result of analysis. Thus, in order to use the
approach effectively, it is required to conduct a long-term and
detailed process analysis and fully understand the technique.
[0017] The present invention has been devised in view of such
problems, and an object of the present invention is to provide a
semiconductor manufacturing apparatus that can easily and quickly
monitor and analyze the state of a semiconductor manufacturing
apparatus and a method for assisting the monitoring and
analysis.
[0018] In order to attain the object, the present invention adopts
the following means:
[0019] detecting means that detects, as a plurality of state
signals, at least either of a plurality of spectra obtained by
separating plasma light emission generated in a processing chamber
of a semiconductor processing apparatus or a plurality of apparatus
state signals that indicate states of the apparatus; apparatus
event information output means that outputs the state of the
semiconductor processing apparatus in a current process step;
conversion means that converts a combination of the plurality of
state signals detected by the detecting means into respective
particular figures; and display position controlling means that
displays the figures generated by the conversion means at
predetermined display positions associated with the process
step.
[0020] Owing to the components described above, the present
invention can provide a semiconductor manufacturing apparatus whose
state can be easily and quickly monitored and analyzed and a method
for assisting monitoring and analysis thereof.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is a diagram illustrating an overall arrangement of a
semiconductor manufacturing apparatus according to an embodiment of
the present invention;
[0022] FIG. 2 shows an example of a display screen displayed on a
display device by state monitoring/analysis assisting means;
[0023] FIG. 3 shows another example of the display screen displayed
on the display device by the state monitoring/analysis assisting
means;
[0024] FIG. 4 shows a graph of process step No. 2 extracted from
graphs shown in FIG. 2;
[0025] FIG. 5 shows a graph showing a bias voltage extracted from
the graphs in FIG. 2;
[0026] FIG. 6 shows the graph of process step No. 2 extracted from
the graph shown in FIG. 5;
[0027] FIG. 7 shows a graph of a bias voltage extracted from the
graphs in FIG. 2; and
[0028] FIG. 8 shows an example of graphs displayed by a
conventional monitoring and analysis system.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0029] In the following, the most preferred embodiment of the
present invention will be described with reference to the
accompanying drawings. FIG. 1 is a diagram illustrating an overall
arrangement of a semiconductor manufacturing apparatus according to
the embodiment of the present invention. In FIG. 1, a semiconductor
manufacturing apparatus 100 comprises a semiconductor processing
apparatus 1 and state monitoring/analysis assisting means 13. The
semiconductor processing apparatus 1 produces plasma 5 in a chamber
2 and processes a sample placed on a stage 4 in the chamber 2, such
as a wafer 3, using the plasma.
[0030] The light of the plasma 5 emitted from the chamber 2 is
transmitted to an emission spectrometer 7 through an optical fiber
6 attached to an observation window of the chamber 2. The emission
spectrometer 7 separates the plasma emission into spectral
components and transfers the intensities of the spectral components
(spectra) to the apparatus state monitoring/analysis assisting
means 13 via an interface 10 at a sampling cycle of the emission
spectrometer, for example. Some semiconductor processing
apparatuses may use no plasma in processing. In the case where such
a semiconductor processing apparatus is used, only an apparatus
state sensor output may be used as described later.
[0031] An apparatus state sensor 8 transfers electric signals of
the semiconductor processing apparatus 1 and various signals
indicating the detection values of the gas flow rate, gas pressure
or the like of the apparatus, that is, process variables, to the
state monitoring/analysis assisting means 13 via an interface 11 at
a preset sampling cycle.
[0032] When an apparatus event, such as a start or end of
processing, occurs, apparatus event information output means 9
transfers manufacture management information about the
semiconductor processing apparatus 1, such as the lot name, wafer
number, process step number and processing time for the processing
at that time, to the apparatus state monitoring/analysis means 13
via an interface 12.
[0033] A state vector generating means 14 generates a state vector
14A based on the emission spectrometer output and the apparatus
state sensor output (state signals) received via the interfaces 10
and 11, respectively. In addition, time-stamping means 15 imparts a
time stamp to the output (manufacture management information) of
the apparatus event information output means received via the
interface 12 based on a timing signal from a clock 16. At the same
time, it imparts the same time stamp to the state vector 14A. That
is, the manufacture management information and the state vector are
managed synchronously.
[0034] The timing at which the state vector generating means 14
converts the output of the emission spectrometer 7 or apparatus
state sensor into the state vector 14A can be chosen arbitrarily.
However, preferred timings are as follows.
[0035] (1) The monitoring values for each wafer processed in the
semiconductor processing apparatus 1 are time-averaged for the
processing duration of the wafer, and the average value is output
as the state vector 14A (when the processing of the wafer is
completed, for example).
[0036] (2) The monitoring values for each wafer are time-averaged
for each process step, and the average value is output as the state
vector 14A (when each process step of the wafer is completed, for
example).
[0037] (3) Conversion and output are successively conducted. That
is, the data received via the interface 10 or 11 is converted into
the state vector 14A and output at the sampling cycle of the
data.
[0038] Color conversion means 17 converts the state vector 14A into
a color signal. Here, the state vector generating means 14 may
convert only one of the outputs of the emission spectrometer 7 and
apparatus state sensor 8 into the state vector 14A and transmit the
state vector 14A to the color conversion means 17.
[0039] If the outputs of the emission spectrometer 7 and apparatus
state sensor 8 are converted into the state vector 14A, all the
outputs of the emission spectrometer 7 and apparatus state sensor 8
are converted into color signals by the color conversion means 17.
Alternatively, if only the output of the apparatus state sensor 8
is converted into the state vector 14A, the output of the apparatus
state sensor 8 is converted into a color signal by the color
conversion means 17.
[0040] That is, the state vector generating means 14, the color
conversion means 17 and color generating means 18 cooperate to
convert a plurality of spectra output from the emission
spectrometer 7 into a combination of a plurality of components
constituting a state vector 14A and convert the resulting
combination of components into color signals. In addition, they
convert a combination of a plurality of apparatus state signals
detected by the apparatus state sensor 8 into a combination of a
plurality of components of a state vector 14A and convert the
resulting combination into color signals.
[0041] The color conversion means 17 preferably produces R, G and B
signals, which are commonly used in display operations of
computers, as a result of conversion. The following are specific
examples of the color conversion means 17.
[0042] (1) For example, of the variables of the state vector 14A,
three variables that are optimum to represent the state of the
processing apparatus are extracted, and the variables are assigned
to the signal intensities of the R, G and B signals respectively.
The three variables are preferably normalized or otherwise
processed because the values have different means regardless of
whether they are different physical quantities (units) or the same
physical quantity.
[0043] (2) The variables of the state vector 14A are separated into
three groups, average values are calculated for the respective
groups, and the average values are assigned to the R, G and B
signals respectively. Again, the variables are preferably
normalized or otherwise processed.
[0044] (3) A color system, which is used for representing colors,
is used to virtually generate colors. For example, the XYZ color
system prescribed in JIS-Z-8701 which represents colors by numeric
values may be used to reproduce colors on the assumption that the
state vector 14A is a spectral distribution, thereby determining
the R, G and B signals. The XYZ color system can be represented
as:
[0045] [Formula 1] 1 X = K 380 780 S ( ) x _ ( ) Y = K 380 780 S (
) y _ ( ) Z = K 380 780 S ( ) z _ ( ) ( 1 )
[0046] where
[0047] S(.lambda.): relative spectral distribution of radiation
from light source
[0048] {overscore (x)}(.lambda.), {overscore (y)}(.lambda.),
{overscore (z)}(.lambda.): color matching functions in XYZ color
system
[0049] K: factor of proportionality
[0050] In these equations, if the relative spectral distribution
S(.lambda.) is replaced with a state vector Ei (i=1, 2, 3, . . . ,
N, where N is the number of components of the state vector), the
apparatus state can be converted into color information. That is,
the above equations are changed into the following equations (2).
Here, the state vector Ei corresponds to the state vector 14A
described above.
[0051] [Formula 2] 2 X = K E i = 1 N E i x _ ( i ) Y = K E i = 1 N
E i y _ ( i ) Z = K E i = 1 N E i z _ ( i ) ( 2 )
[0052] where
[0053] N: number of components of apparatus state vector (number of
monitoring values)
[0054] i: i=1, 2, .LAMBDA., N
[0055] E.sub.i: apparatus state vector
[0056] .DELTA..lambda.: wavelength range ((780-380)/N)
[0057] .lambda..sub.i:
.lambda..sub.i=.lambda..sub.0+{(i-1)*.DELTA..lambda- .}
(.lambda..sub.0=380)
[0058] {overscore (x)}(.lambda..sub.i),{overscore
(y)}(.lambda..sub.i),{ov- erscore (z)}(.lambda..sub.i): color
matching functions in XYZ color system
[0059] K.sub.E: factor of proportionality
[0060] In addition, conversion from the XYZ color system to the R,
G and B signals is represented by the following equations.
R=1.9104.times.X-0.5338.times.Y-0.2891.times.Z
G=-0.9844.times.X+1.9985.times.Y-0.0279.times.Z (3)
B=0.0585.times.X-0.1187.times.Y+0.9017.times.Z
[0061] The color generating means 18 generates a color signal 19
from the R, G and B signals obtained by the color conversion means
17.
[0062] Display position controlling means 20 displays the color
signal generated by the color generating means 18 at a display
position on a display device 22 which is specified by the apparatus
event information output means 9, as describer later. In addition,
the display position controlling means 20 may receive the apparatus
state sensor output, which is a component of the state vector, from
the state vector generating means 14 and display the received
sensor output values (for example, gas flow rate values) at a
display position on the display device 22 which is specified by the
apparatus event information output means 9 in the form of a
graph.
[0063] The semiconductor manufacturing apparatus shown in FIG. 1
can serve as a monitoring system that monitors the state of the
apparatus in real time using the state monitoring/analysis
assisting means 13. In addition, it can serve as an analysis system
that sequentially accumulates the information about the state of
the apparatus and analyzes the history of the apparatus state or
process state.
[0064] Now, a processing of the state monitoring/analysis assisting
means will be described with reference to FIGS. 2 to 7.
[0065] FIG. 2 shows an example of a display screen displayed on the
display device 22 by the state monitoring/analysis assisting means.
In FIG. 2, graphs 40 in the upper area are time-series graphs each
showing a reflected power, a bias voltage and an emission
intensity, which are components of the state vector 14A obtained
when the semiconductor processing apparatus 1 successively
processes five wafers.
[0066] The processing time for each wafer is separated from the
others by the broken lines 42a, 42b, 42c, 42d and 42e. Broken lines
inside the sections separated by the above-mentioned broken lines
indicate separations of a plurality of process steps of the
processing of each wafer. For example, the broken lines 44a, 44b,
44c and 44d between the Y axis and the broken line 42a indicate
separations of five process steps of the processing of one wafer.
That is, the section between the Y axis and the line 44a
corresponds to a process step No. 1, the section between the lines
44a and 44b corresponds to a waiting state between process steps,
the section between the lines 44b and 44c corresponds to a process
step No. 2, the section between the lines 44c and 44d corresponds
to a process step No. 3, and the section between the lines 44d and
42e corresponds to a process step No. 4. The positions of the
broken lines for indicating the processing times for the respective
wafers and the positions of the lines for indicating the
separations of the process steps can be specified by the apparatus
event information output means 9 shown in FIG. 1.
[0067] In this example, the reflected power, the bias voltage and
the emission intensity (average value for the overall wavelength)
are shown in the form of graphs as described above. However, since
they are different physical quantities (that is, expressed in
different units), in order to show them on the same Y axis, the
data are normalized so that the maximum values are 1, for example.
Such display facilitates understanding of the trends of the process
variables.
[0068] A graph 50 in the lower area of FIG. 2 shows color signals
displayed on the display device 22 at display positions specified
by the apparatus event information output means 9, the color
signals being converted from the state vector 14A shown in FIG. 1
by the color conversion means 17 and the color generating means
18.
[0069] In this drawing, reference numeral 52a denotes a state of
the apparatus in the process step No. 1. Similarly, reference
numeral 52b denotes a state thereof in the process step No. 2,
reference numeral 52c denotes a state thereof in the process step
No. 3, and reference numeral 52d denotes a state thereof in the
process step No. 4. Since the state of the apparatus is indicated
by colors in this way, in monitoring or analysis of the state of
the apparatus, the state of the apparatus or the state of the
operation thereof can be quickly recognized without detailed
observation of the individual process variables or trends
thereof.
[0070] FIG. 3 shows an example of a display screen displayed on the
display device 22 by the state monitoring/analysis assisting
means.
[0071] In the example shown in FIG. 2, graphs for the processings
of the respective wafers are arranged side by side along the time
axis. To the contrary, in the example shown in FIG. 3, the graphs
for the processings of the respective wafers are displayed with the
time axes being superimposed. As described above, in a
semiconductor manufacturing process, one process may comprise a
plurality of process steps. In such a case, the plurality of
process steps of one process are conducted under different
processing conditions. Thus, to compare the processing of each
wafer with the processings of the others, the comparison has to be
made between the equivalent process steps.
[0072] In a comparison between equivalent process steps, the way of
display shown in FIG. 2 is not effective for visual comparison.
However, the way of display shown in FIG. 3 facilitates comparison
between process steps and understanding of the variations of the
processing and apparatus state among the wafers. For example, a
state color 62a for the process step No. 2 for a first wafer, a
state color 62b for the process step No. 2 for a second wafer, a
state color 62c for the process step No. 2 for a third wafer, a
state color 62d for the process step No. 2 for a fourth wafer and a
state color 62e for the process step No. 2 for a fifth wafer are
displayed with the time axes of the processings of the wafers being
superimposed. That is, the graphs are displayed on the display
device with the processing start points coinciding with each
other.
[0073] If the graphs for the processing of the respective wafers
are displayed with the time axes being superimposed in this way,
visual comparison is facilitated because the historical information
about the processings of the wafers are arranged in the vertical
direction. In the example shown in FIG. 3, it is shown that the
state color 62d for the fourth wafer differs from the state colors
62a, 62b, 62c and 62e for the other wafers. That is, it is shown
that the fourth wafer has been processed under a processing
condition different from those of the other wafers. In the upper
area of the display screen, graphs of the data including the
reflected power, bias voltage and emission intensity obtained
during the processings of the wafers can be displayed.
[0074] Alternatively, in the upper area of the display screen, the
data for the fourth wafer including the reflected power, bias
voltage and emission intensity may be displayed in the form of a
graph in contrast with the data for the other wafers, and the user
may stop the processing by the apparatus based on the graph. In
this way, defective wafers can be prevented from being produced in
large numbers. In addition, maintenance can be conducted at an
adequate cycle, and, as a result, the apparatus operability can be
improved.
[0075] FIG. 4 shows the graph for the process step No. 2
(indicating the bias voltage) of the graphs shown in FIG. 2 and the
color signals indicating the state of the apparatus. State colors
72a, 72b, 72c, 72d and 72e are arranged side by side. Thus, such a
way of display also facilitates comparison of the state of the
apparatus between equivalent process steps.
[0076] FIG. 5 shows a time series graph showing the bias voltage
extracted from the graphs in FIG. 2. From the time-series graph of
only the bias voltage, information other than the bias voltage
cannot be provided. However, in the example shown in this drawing,
the inside areas of the graph are filled with colors representing
states of the apparatus. Thus, additional information that cannot
be provided by simple graph display can be provided.
[0077] Specifically, in FIG. 5, a state color 74a indicates the
state of the apparatus in the process step No. 1, a state color 74b
indicates the state of the apparatus in the process step No. 2, a
state color 74c indicates the state of the apparatus in the process
step No. 3, and a state color 74d indicates the state of the
apparatus in the process step No. 4.
[0078] FIG. 6 shows the graph for only the process step No. 2
extracted from the graph shown in FIG. 5. In the graph shown in
FIG. 6, state colors 76a, 76b, 76c, 76d and 76e for the process
step No. 2 for the five wafers are shown side by side. In this
example, comparison of the apparatus state between equivalent
process steps can be made quickly. Also in the example in this
drawing, the inside areas of the graph may be filled with colors
representing states of the apparatus.
[0079] FIG. 7 shows a time series graph showing the bias voltage
extracted from the graphs in FIG. 2. From this graph, information
other than the bias voltage cannot be provided. However, in the
example shown in this drawing, for each process step, the
background area of the graph is filled with a state color
representing the state of the apparatus. Thus, an apparatus state
other than the bias voltage can be shown. Specifically, in FIG. 7,
a state color 78a indicates the state of the apparatus in the
process step No. 1, a state color 78b indicates the state of the
apparatus in the process step No. 2, a state color 78c indicates
the state of the apparatus in the process step No. 3, and a state
color 78d indicates the state of the apparatus in the process step
No. 4.
[0080] The above description has been made concerning the example
in which the states of the apparatus are represented by colors.
However, according to the present invention, the states of the
apparatus can be represented by information other than colors. For
example, the R, G and B signals from the color conversion means 17
may be associated with figures (or sounds), such as characters or
symbols, which represent states of the apparatus. In other words,
the state vector 14A may be associated with a particular figure (or
sound). And then, the figure(s) may be displayed on the display
device at a display position specified by the apparatus event
information output means, or the sound(s) may be produced at the
timing specified by the apparatus event information output
means.
[0081] As described above, according to this embodiment, the state
of the manufacturing apparatus in operation can be displayed by
color information or the like and can be monitored and analyzed
using the color information or the like. Thus, the state of the
apparatus can be quickly and easily monitored and analyzed during
operation without observing individual monitoring values.
[0082] While the semiconductor manufacturing apparatus and the
method for assisting monitoring and analysis of the same have been
described as an embodiment of the present invention, the present
invention is not limited thereto. The present invention can be
applied to a manufacturing apparatus for a liquid crystal display
device and a method for manufacturing the same, for example.
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