U.S. patent application number 10/810384 was filed with the patent office on 2005-09-29 for rinse nozzle and method.
Invention is credited to Huang, Chi-Che, Huang, Po-Chang, Hung, Ming-Yeon, Kao, Yao-Hwan.
Application Number | 20050211267 10/810384 |
Document ID | / |
Family ID | 34988342 |
Filed Date | 2005-09-29 |
United States Patent
Application |
20050211267 |
Kind Code |
A1 |
Kao, Yao-Hwan ; et
al. |
September 29, 2005 |
Rinse nozzle and method
Abstract
A method and apparatus for rinsing and drying a substrate (100)
of a semiconductor wafer (102), has a first nozzle (110) dispensing
rinsing fluid against the substrate (100); and a second nozzle
(114) dispensing dry gas under pressure against the substrate (100)
during a drying cycle to dry the substrate (100) completely. The
second nozzle (114) can point to the substrate (100) while the
substrate (100) spins. The nozzles (110) and (114) can be
positioned by a robot arm (112).
Inventors: |
Kao, Yao-Hwan; (Baoshan
Township, TW) ; Huang, Po-Chang; (Taipei City,
TW) ; Hung, Ming-Yeon; (Hsin Chu, TW) ; Huang,
Chi-Che; (Hsinchu City, TW) |
Correspondence
Address: |
DUANE MORRIS LLP
IP DEPARTMENT (TSMC)
4200 ONE LIBERTY PLACE
PHILADELPHIA
PA
19103-7396
US
|
Family ID: |
34988342 |
Appl. No.: |
10/810384 |
Filed: |
March 26, 2004 |
Current U.S.
Class: |
134/2 ; 134/137;
134/26; 134/33; 134/94.1; 134/95.1; 257/E21.228 |
Current CPC
Class: |
H01L 21/67051 20130101;
H01L 21/67028 20130101; H01L 21/02052 20130101; B08B 3/02
20130101 |
Class at
Publication: |
134/002 ;
134/026; 134/033; 134/094.1; 134/095.1; 134/137 |
International
Class: |
C23G 001/00 |
Claims
What is claimed is:
1. A process for rinsing and drying a substrate on a semiconductor
wafer, comprising the steps of: dispensing rinsing fluid on the
substrate during a rinsing cycle; and spinning the wafer about an
axis of rotation during a drying cycle to dry the wafer, while
dispensing dry gas under pressure against the substrate to dry the
wafer completely.
2. The process of claim 1, further comprising the steps of:
dispensing the rinsing fluid on a surface of the substrate near the
axis of rotation during the rinsing cycle; and dispensing the gas
on the surface of the substrate near the axis of rotation during
the drying cycle.
3. The process of claim 1, further comprising the steps of:
dispensing the rinsing fluid through a first nozzle mounted on a
robot arm; and dispensing the gas through a second nozzle mounted
on the robot arm.
4. The process of claim 1, further comprising the steps of:
pointing a first nozzle to the substrate near the axis of rotation
while dispensing the rinsing fluid through the first nozzle; and
pointing a second nozzle to the substrate near the axis of rotation
while dispensing the gas though the nozzle.
5. The process of claim 1, further comprising the steps of: moving
a robot arm on which a first nozzle is mounted to point the first
nozzle at the substrate while dispensing the rinsing fluid during
the rinsing cycle; and moving the robot arm on which a second
nozzle is mounted to point the second nozzle at the substrate while
dispensing the gas during the drying cycle.
6. The process of claim 1, further comprising the steps of: opening
and closing a motor controlled first valve during the rinsing cycle
to dispense the rinsing fluid; and opening and closing a motor
controlled second valve during the drying cycle to dispense the
gas.
7. The process of claim 1, further comprising the steps of: moving
a robot arm on which a first nozzle is mounted to point the first
nozzle at the substrate while dispensing the rinsing fluid during
the rinsing cycle; opening and closing a motor controlled first
valve during the rinsing cycle to dispense the rinsing fluid;
moving the robot arm on which a second nozzle is mounted to point
the second nozzle at the substrate while dispensing the gas during
the drying cycle; and opening and closing a motor controlled second
valve during the drying cycle to dispense the gas during the drying
cycle.
8. The process of claim 1, further comprising the steps of:
supplying the rinsing fluid through a motor controlled valve to a
first nozzle; dispensing the rinsing fluid through the first
nozzle; supplying the gas through a motor controlled valve to a
second nozzle; and dispensing the gas through the second
nozzle.
9. The process of claim 1, further comprising the step of:
dispensing the gas on the surface of the substrate near the axis of
rotation during the drying cycle.
10. The process of claim 1, further comprising the steps of:
dispensing the gas on the surface of the substrate near the axis of
rotation during the drying cycle; and dispensing the gas through a
nozzle mounted on a robot arm.
11. Apparatus for rinsing and drying a substrate of a semiconductor
wafer, comprising: a first nozzle dispensing rinsing fluid against
the substrate during a rinsing cycle; and a second nozzle
dispensing dry gas under pressure against the substrate during a
drying cycle to dry the substrate completely.
12. The apparatus of claim 11, further comprising: the first nozzle
being mounted on a robot arm that positions the first nozzle during
the rinsing cycle; and the second nozzle being mounted on the robot
arm that positions the second nozzle during a drying cycle to dry
the substrate completely.
13. The apparatus of claim 12, further comprising: a microprocessor
controlling the robot arm.
14. The apparatus of claim 11, further comprising: a motor
controlled first valve supplying rinsing fluid to the first nozzle;
and a motor controlled second valve supplying rinsing fluid to the
second nozzle.
15. The apparatus of claim 14, further comprising: a microprocessor
controlling the first valve and the second valve.
Description
FIELD OF THE INVENTION
[0001] The invention relates to the field of semiconductor device
manufacturing, and, more particularly, to rinsing and drying of a
substrate on a semiconductor wafer, including, but not limited to,
a silicon wafer and an insulating circuit board, on which
semiconductor devices are fabricated by semiconductor device
manufacturing processes.
BACKGROUND
[0002] Semiconductor device manufacturing pertains to process steps
of fabricating integrated circuits in successive layers of a
substrate that is built on a semiconductor wafer. Some of the
process steps leave residues to be removed by rinsing and drying of
the semiconductor wafer.
[0003] Prior to the invention, the substrate was dried solely by
spinning the semiconductor wafer while it was being held by a wafer
holder on a robot arm. Incomplete drying would leave residues of DI
water on the substrate, which would encourage chemical ionization
and other chemical reactions that decrease the yield of integrated
circuits that are fabricated on the substrate. However, an attempt
to achieve complete drying of the substrate, by prolonging the
drying cycle period, would cause unacceptable declines in
productivity and throughput of wafer batches. An attempt to achieve
complete drying of the substrate, by a high spin-dry speed, by
spinning the wafers faster, would increase the momentum of the
rinsing fluid mass, to splash and rewet the substrate. Thus, a need
exists for a process and apparatus for completely drying the
substrates within a reasonable drying cycle period.
SUMMARY OF THE INVENTION
[0004] According to the invention, a substrate is completely dried
within a reasonable drying cycle period. An embodiment of the
invention is a process for rinsing and drying a substrate on a
semiconductor wafer, by dispensing rinsing fluid on the substrate
during a rinsing cycle; and spinning the wafer about an axis of
rotation during a drying cycle to dry the wafer, while dispensing
dry gas under pressure against the substrate to dry the wafer
completely.
[0005] Another embodiment of the invention is apparatus having, a
first nozzle dispensing rinsing fluid against the substrate during
a rinsing cycle, and a second nozzle dispensing dry gas under
pressure against the substrate during a drying cycle to dry the
substrate completely.
[0006] Although the invention will be described by referring to
photolithography, the invention applies to any of the different
integrated circuit manufacturing processes that leaves residues to
be removed by rinsing and drying of a semiconductor wafer.
[0007] An embodiment of the invention will now be described by way
of example with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1A is a diagrammatic view of an apparatus for rinsing
and drying a substrate on a semiconductor wafer.
[0009] FIG. 1B is a view similar to FIG. 1, and discloses a drying
process step.
[0010] FIG. 2 is a circuit diagram of a circuit that controls an
apparatus for rinsing and drying a substrate on a semiconductor
wafer.
DETAILED DESCRIPTION
[0011] This description of the exemplary embodiments is intended to
be read in connection with the accompanying drawings, which are to
be considered part of the entire written description. In the
description, relative terms such as "lower," "upper," "horizontal,"
"vertical," "above," "below," "up," "down," "top" and "bottom" as
well as derivative thereof (e.g., "horizontally," "downwardly,"
"upwardly," etc.) should be construed to refer to the orientation
as then described or as shown in the drawing under discussion.
These relative terms are for convenience of description and do not
require that the apparatus be constructed or operated in a
particular orientation. Terms concerning attachments, coupling and
the like, such as "connected" and "interconnected," refer to a
relationship wherein structures are secured or attached to one
another either directly or indirectly through intervening
structures, as well as both movable or rigid attachments or
relationships, unless expressly described otherwise.
[0012] FIG. 1 discloses a substrate (100), including, but not
limited to one or more layers of material. The substrate (100) is
on a semiconductor wafers (102), including, but not limited to, a
silicon wafer and an insulating circuit board, on which
semiconductor devices are fabricated by semiconductor device
manufacturing processes. The invention relates to rinsing and
drying of the substrate (100) on a semiconductor wafers (102).
Although the invention will be described by referring to
photolithography, the invention applies to any of the different
integrated circuit manufacturing processes that leaves residues to
be removed by rinsing and drying of a semiconductor wafers
(102).
[0013] Photolithography involves manufacture of an integrated
circuit pattern by, first, patterning a beam of light with a
patterned mask, and focusing the patterned beam onto a light
sensitive layer that serves as a photo resist, PR (104). The PR
(104) covers an underlying layer of a substrate (100) on a
semiconductor wafers (102). Exposure of the PR (104) to the
patterned beam will photograph the pattern onto the PR (104). Then,
the photographed, PR (104) is developed by treatment with a
chemical developer to provide an open pattern through the PR
(104).
[0014] Following photolithography, the patterned photo resist (104)
is in place during etching, to etch an integrated circuit pattern
in the underlying layer of the substrate (100).
[0015] The substrate (100) must be rinsed and dried, following
development of the photo resist (104). Thus, the chemical developer
is removed by rinsing the substrate (100) with a rinsing fluid, for
example, de-ionized water, DI water. Then, the substrate (100) is
dried to remove the rinsing fluid.
[0016] FIG. 1 further discloses a portion of a motor driven wafer
holder (106). A commercially available, industry known wafer
processing apparatus has such a wafer holder (106) on a motor
driven robot arm (108). The wafer holder (106) and robot arm (108)
are programmed by computer to automatically pick up individual
wafers (102) from a batch of wafers (102) and guide the wafers
(102) through a manufacturing equipment that performs a
manufacturing operation on the wafers (102). When the manufacturing
process cycle is complete, the robot arm (108) returns the
individual wafers (102) to the batch.
[0017] For example, the wafer holder (106) and robot arm (108)
guides the wafers (102) through rinsing equipment while a rinsing
process step is performed on the wafers (102). For example, a first
nozzle (110) on a motor driven, auxiliary robot arm (112) dispenses
the rinsing fluid, DI water supplied through a motor controlled
valve (110a) to the first nozzle (110). Following a rinsing cycle,
the wafer holder (106) on the first robot arm (108) is equipped to
spin the wafers (102) edgewise as they are being held edgewise by
the wafer holder (106). Prior to the invention, the substrate (100)
was dried solely by spinning the semiconductor wafer (102) while it
was being held by a wafer holder (106) on the first robot arm
(108).
[0018] Almost all of the wafers (102) would have traces of rinsing
fluid following a spin-dry cycle. The rinsing fluid, i.e., DI
water, near the center of rotation of the wafer (102) could not be
ejected easily, due to lack of sufficient linear velocity, and due
DI water in vapor form lacking sufficient mass for ejection. The
rinsing fluid on the substrate (100) would cause the photo resist
(104) to peel from the substrate (100) at localized areas where the
traces of rinsing fluid remained after a spin-drying cycle.
[0019] When DI vapor at HB will produce the stress between DI and
PR it will induce peeling of the photo resist (104) from the
substrate (100). Please explain HB. Please explain what is meant by
this sentence at page 2 of the Power Point information.
[0020] Traces of the rinsing fluid that would remain on the photo
resist (104) would weaken the bond between the photo resist (104)
and the substrate (100). The photo resist (104) would peel, due to
the weakened bond. Peeling of the photo resist (104) would lower
the manufacturing yield of integrated circuits being fabricated on
the substrate (100).
[0021] The invention obtains complete drying of the substrate (100)
without prolonging the spin-dry cycle and without increasing the
spin speed generated by the wafer holder (106). With reference to
FIG. 1, a second nozzle (114) is beside the first nozzle (110).
During a rinse cycle, the first nozzle (110) is moved by the
auxiliary robot arm (112) to point a discharge end of the first
nozzle (110) at the substrate (100) near the axis of rotation. The
location coordinates of the axis of rotation are known by moving
the first nozzle (110) by the auxiliary robot arm (112). The rinse
cycle is performed by dispensing rinsing fluid from the first
nozzle (110) onto the substrate (100), while the wafer holder (106)
spins the semiconductor wafer (102) about the axis of rotation.
Following the rinse cycle, the flow of rinsing fluid is shut off
from the first nozzle (110).
[0022] FIG. 1A discloses that the auxiliary robot arm (112) moves
the first nozzle (110) away from the axis of rotation, and moves
the second nozzle (114) to replace the first nozzle, which points a
discharge end of the second nozzle (114) at the substrate (100)
near the axis of rotation. The drying cycle is performed by the
wafer holder (106) spinning the wafer (102) while dry gas is
dispensed under pressure to eject rinsing fluid near the axis of
rotation. The gas is supplied through a motor controlled valve
(114a) to the second nozzle (114) that dispenses the gas. The dry
gas desiccates a vaporous film of rinsing fluid near the axis of
rotation. Thus, the substrate (100) is dried by a combination of
expelling and desiccation. For example, the dry gas is gaseous
Nitrogen, N.sub.2, under pressure.
[0023] Thus, a process for rinsing and drying a substrate (100) on
a semiconductor wafer (102) involves, dispensing rinsing fluid on
the substrate (100) during a rinsing cycle; and spinning the wafer
(102) about an axis of rotation during a drying cycle to dry the
wafer (102), while dispensing dry gas under pressure against the
substrate (100) to dry the wafer (102) completely.
[0024] When the drying cycle is finished, the auxiliary robot arm
(112) is moved away, and the robot arm (108) returns the wafer
(102) to the wafer batch where it is released by the wafer holder
(106).
[0025] FIG. 2 discloses a control circuit (200) having a
microprocessor (202) with an input clock signal CK 1 and an
interconnection V1 with a computer or with a server for connection
to a network. The microprocessor (202) is programmed by a computer
to send the following control signals. First control signals are
sent to a control circuit (204) of a motor drive of the first robot
arm (108). Second control signals are sent to a control circuit
(206) of a motor drive of the wafer holder (106). Third control
signals are sent to a control circuit (108) of a motor drive of the
auxiliary robot arm (112). Fourth control signals are sent to a
control circuit (210) of the motor controlled first valve (110a)
supplying rinsing fluid to the first nozzle (110). Fifth control
signals are sent to a control circuit (212) of the motor controlled
second valve (114a) supplying rinsing fluid to the second nozzle
(114).
[0026] The microprocessor (202) signals the control circuit (210)
to open and close the valve (110a) during a rinsing cycle. The
microprocessor (202) signals the control circuit (206) to spin the
wafer (102) during a drying cycle to dry the wafer (102), while
signals to the control circuit (212) opens and closes the valve
(114a) to dispense dry gas under pressure against the substrate
(100) to dry the wafer (102) completely.
[0027] The microprocessor (202) signals the control circuit (208)
for moving a first nozzle (110) to point to the substrate (100)
near the axis of rotation (116), while the microprocessor (202)
signals the control circuit (210) to open and close the valve
(110a) for dispensing the rinsing fluid through the valve (110)
during a rinsing cycle. The microprocessor (202) signals the
control circuit (208) to move the second nozzle (114) to point to
the substrate (100) near the axis of rotation (116), while the
microprocessor (202) signals the control circuit (212) to open and
close the valve (114a) for dispensing the gas though the nozzle
(114) during a drying cycle.
[0028] Although the invention has been described in terms of
exemplary embodiments, it is not limited thereto. Rather, the
appended claims should be construed broadly, to include other
variants and embodiments of the invention, which may be made by
those skilled in the art without departing from the scope and range
of equivalents of the invention.
* * * * *