U.S. patent application number 10/927703 was filed with the patent office on 2005-09-08 for method and apparatus for semiconductor processing.
This patent application is currently assigned to Crossing Automation, Inc.. Invention is credited to Cheng, David, Dulmage, Laurence, Keller, Jed, Price, J.B..
Application Number | 20050194096 10/927703 |
Document ID | / |
Family ID | 34272490 |
Filed Date | 2005-09-08 |
United States Patent
Application |
20050194096 |
Kind Code |
A1 |
Price, J.B. ; et
al. |
September 8, 2005 |
Method and apparatus for semiconductor processing
Abstract
A method and apparatus for semiconductor processing is
disclosed. In one embodiment, a method of transporting a wafer
within a cluster tool, comprises placing the wafer into a first
segment of a vacuum enclosure, the vacuum enclosure being attached
to a processing chamber and a factory interface. The wafer is
transported to a second segment of the vacuum enclosure using a
vertical transport mechanism, wherein the second segment is above
or below the first segment.
Inventors: |
Price, J.B.; (Los Gatos,
CA) ; Keller, Jed; (Los Gatos, CA) ; Dulmage,
Laurence; (Nevada City, CA) ; Cheng, David;
(Sunnyvale, CA) |
Correspondence
Address: |
ORRICK, HERRINGTON & SUTCLIFFE, LLP
IP PROSECUTION DEPARTMENT
4 PARK PLAZA
SUITE 1600
IRVINE
CA
92614-2558
US
|
Assignee: |
Crossing Automation, Inc.
|
Family ID: |
34272490 |
Appl. No.: |
10/927703 |
Filed: |
August 27, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60496479 |
Aug 29, 2003 |
|
|
|
Current U.S.
Class: |
156/345.31 ;
118/719; 156/345.32 |
Current CPC
Class: |
H01L 21/67178 20130101;
H01L 21/67766 20130101; Y10S 414/139 20130101; H01L 21/67742
20130101; H01L 21/67167 20130101; H01L 21/67161 20130101 |
Class at
Publication: |
156/345.31 ;
118/719; 156/345.32 |
International
Class: |
C23F 001/00 |
Claims
We claim:
1. A method of transporting a wafer within a cluster tool,
comprising: placing the wafer into a first segment of a vacuum
enclosure, the vacuum enclosure being attached to a processing
chamber and a factory interface; transporting the wafer to a second
segment of the vacuum enclosure using a vertical transport
mechanism, wherein the second segment is above or below the first
segment.
2. The method of claim 1, further comprising: moving the wafer into
and out of the vacuum enclosure using a linear wafer drive, wherein
the linear wafer drive is external to the vacuum enclosure.
3. The method of claim 2, further comprising: controlling the
linear wafer drive and the vertical transport mechanism with a
computer executing processing control software.
4. The method of claim 3, wherein moving the wafer includes moving
the wafer through a gate valve.
5. The method of claim 3, wherein moving the wafer includes moving
the wafer between the vacuum enclosure and the processing
chamber.
6. The method of claim 3, wherein moving the wafer includes moving
the wafer between the vacuum enclosure and a second vacuum
enclosure.
7. A method of transporting a wafer within a cluster tool,
comprising: moving the wafer between a vacuum enclosure and a
processing chamber using a linear wafer drive, wherein the linear
wafer drive is external to the vacuum enclosure and the processing
chamber.
8. The method of claim 7, further comprising: controlling the
linear wafer drive with a computer executing processing control
software.
9. The method of claim 7, wherein moving the wafer includes moving
the wafer through a gate valve.
10. The method of claim 7, wherein moving the wafer includes moving
the wafer between the vacuum enclosure and the processing
chamber.
11. The method of claim 7, wherein moving the wafer includes moving
the wafer between the vacuum enclosure and a second vacuum
enclosure.
12. The method claim 7, wherein the linear drive is disposed
between the vacuum enclosure and the processing chamber.
13. The method of claim 12, further comprising simultaneously
transporting a fresh wafer from the vacuum enclosure and a
processed wafer from the processing chamber into the linear wafer
drive.
14. The method of claim 13, further comprising rotating the fresh
wafer and the processed wafer within the linear wafer drive.
15. The method of claim 14, further comprising simultaneously
transporting the fresh wafer into the processing chamber and the
processed wafer into the vacuum enclosure.
16. The method of claim 12, further comprising transporting the
wafer from the vacuum enclosure into the linear wafer drive.
17. The method of claim 16, further comprising rotating the wafer
within the linear wafer drive.
18. The method of claim 17, further comprising transporting the
wafer from the linear wafer drive into the processing chamber.
19. A cluster tool, comprising: a vacuum enclosure; a linear drive
attached to the vacuum enclosure; and a processing chamber, wherein
the vacuum enclosure includes a vertical transport mechanism that
carries a wafer from a lower segment of the vacuum enclosure to an
upper segment of a vacuum enclosure.
20. A vacuum processing system comprising: at least one wafer
transport operating vertically through an assembly of end-to-end
flanged chamber sections; a load-lock system between two of the
end-to-end flanged chamber sections acting to bring wafers from
outside the system into the vacuum processing system; and a
processing module between two of the end-to-end flanged chamber
sections including at least one horizontal linear transport
mechanisms for trading wafers horizontally between the vertical
wafer transport and a processing chamber, through isolation valves.
Description
RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional
Application Ser. No. 60/496,479, filed on Aug. 29, 2003. The
contents of U.S. Provisional Application Ser. No. 60/496,479 are
incorporated herein by reference in their entirety.
FIELD OF THE INVENTION
[0002] The field of the invention relates generally to
semiconductor manufacturing equipment and pertains particularly to
vacuum equipment for enabling sequential processing under vacuum,
using different process environments, such as cluster tools.
BACKGROUND
[0003] Semiconductor substrate processing is typically performed by
subjecting a substrate to a plurality of sequential processes to
create devices, conductors and insulators on the substrate. FIG. 1
illustrates a prior art semiconductor processing system 100 for
performing sequential processes. These processes are generally
performed in a processing chamber configured to perform a single
step of the production process. In order to efficiently complete
the entire sequence of processing steps, a number of processing
chambers 108 are typically coupled to a central transfer chamber
104 that houses one or more robots 112 to facilitate transfer of
the substrate 124 between the processing chambers 108. A
semiconductor processing platform having this configuration is
generally known as a cluster tool, examples of which are the family
of CENTURA.RTM. and ENDURA.RTM. processing platforms available from
Applied Materials, Inc. of Santa Clara, Calif.
[0004] Generally, a cluster tool 100 consists of a central transfer
chamber 104 having one or more robots 112 disposed therein. The
transfer chamber 104 is typically surrounded by one or more
processing chambers 108, at least one load lock chamber 106. The
processing chambers 108 are generally utilized to process the
substrate 124, for example, performing various processing steps
such as etching, physical vapor deposition, chemical vapor
deposition, and the like. Processed and unprocessed substrates 124
are housed in a substrate storage cassette 130 disposed in a
factory interface 102 coupled to the load lock chamber 106.
[0005] The load lock chamber 106 is isolated from the factory
interface 102 and the transfer chamber 104 by slit valves 116.
Substrates 124 enter the transfer chamber 104 from the substrate
storage cassettes 130 one at a time through the load lock 106. The
substrate 124 is first positioned in the load lock 106 after the
substrate 124 is removed from the cassette 130. The load lock 106
is then sealed and pumped down to match the operating pressure of
the substrate transfer chamber 104. The slit valve 116 between the
load lock 106 and transfer chamber 104 is then opened, allowing the
substrate transfer robots 112 to access the substrates 124 disposed
in the factory interface 102. In this fashion, substrates 124 may
be transferred into and out of the transfer chamber 104 without
having to repeatedly re-establish transfer chamber vacuum levels
after each substrate 124 passes through the load lock 106 or
processing chambers 108. Although cluster tool 100 includes six
processing chambers 108, any number may be used.
SUMMARY
[0006] A method and apparatus for semiconductor processing is
disclosed. In one embodiment, a method of transporting a wafer
within a cluster tool, comprises placing the wafer into a first
segment of a vacuum enclosure, the vacuum enclosure being attached
to a processing chamber and a factory interface. The wafer is
transported to a second segment of the vacuum enclosure using a
vertical transport mechanism, wherein the second segment is above
or below the first segment.
[0007] The above and other preferred features of the invention,
including various novel details of implementation and combination
of elements, will now be more particularly described with reference
to the accompanying drawings and pointed out in the claims. It will
be understood that the particular methods and mechanisms embodying
the invention are shown by way of illustration only and not as
limitations of the invention. As will be understood by those
skilled in the art, the principles and features of this invention
may be employed in various and numerous embodiments without
departing from the scope of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The accompanying drawings, which are included as part of the
present specification, illustrate the presently preferred
embodiment of the present invention and together with the general
description given above and the detailed description of the
preferred embodiment given below serve to explain and teach the
principles of the present invention.
[0009] FIG. 1 illustrates a prior art semiconductor processing
system 100 for performing sequential processes;
[0010] FIG. 2 illustrates an exemplary vertical transport cluster
tool, according to one embodiment of the present invention;
[0011] FIG. 3 illustrates an exemplary horizontal transport cluster
tool, according to one embodiment of the present invention;
[0012] FIG. 4 illustrates an exemplary dual vacuum enclosure
cluster tool, according to one embodiment of the present
invention;
[0013] FIG. 5 illustrates an exemplary horizontal cluster tool,
according to another embodiment of the invention;
[0014] FIG. 6 illustrates an exemplary dual linear drive, according
to one embodiment of the present invention;
[0015] FIG. 7 illustrates an exemplary dual linear drive in an
extended position, according to one embodiment of the present
invention;
[0016] FIG. 8 illustrates an exemplary dual linear drive mechanism,
according to one embodiment of the present invention;
[0017] FIG. 9 illustrates an exemplary dual linear drive mechanism,
according to another embodiment of the present invention; and
[0018] FIG. 10 illustrates an exemplary linear drive with a
rotation mechanism, according to one embodiment of the present
invention;
[0019] FIG. 11 illustrates an exemplary linear drive with a
rotation mechanism, according to another embodiment of the present
invention;
[0020] FIG. 12 illustrates an exemplary method of transporting a
wafer, according to one embodiment of the present invention;
and
[0021] FIG. 13 illustrates a computer system representing an
integrated multi-processor, in which elements of the present
invention may be implemented.
DETAILED DESCRIPTION
[0022] A method and apparatus for semiconductor processing is
disclosed. In one embodiment, a method of transporting a wafer
within a cluster tool, comprises placing the wafer into a first
segment of a vacuum enclosure, the vacuum enclosure being attached
to a processing chamber and a factory interface. The wafer is
transported to a second segment of the vacuum enclosure using a
vertical transport mechanism, wherein the second segment is above
or below the first segment. According to another embodiment of the
invention, unlike the robotic mechanisms described above that are
used in the center of a platform, the present apparatus allows for
a distributed linear wafer drive architecture. The linear
architecture provided and described below does away with the need
for radial dominated architectures.
[0023] In the following description, for purposes of explanation,
specific nomenclature is set forth to provide a thorough
understanding of the present invention. However, it will be
apparent to one skilled in the art that these specific details are
not required in order to practice the present invention.
[0024] Some portions of the detailed descriptions that follow are
presented in terms of algorithms and symbolic representations of
operations on data bits within a computer memory. These algorithmic
descriptions and representations are the means used by those
skilled in the data processing arts to most effectively convey the
substance of their work to others skilled in the art. An algorithm
is here, and generally, conceived to be a self-consistent sequence
of steps leading to a desired result. The steps are those requiring
physical manipulations of physical quantities. Usually, though not
necessarily these quantities take the form of electrical or
magnetic signals capable of being stored, transferred, combined,
compared, and otherwise manipulated. It has proven convenient at
times, principally for reasons of common usage, to refer to these
signals as bits, values, elements, symbols, characters, terms,
numbers, or the like.
[0025] It should be borne in mind, however, that all of these and
similar terms are to be associated with the appropriate physical
quantities and are merely convenient labels applied to these
quantities. Unless specifically stated otherwise as apparent from
the following discussion, it is appreciated that throughout the
description, discussions utilizing terms such as "processing" or
"computing" or "calculating" or "determining" or "displaying" or
the like, refer to the action and processes of a computer system,
or similar electronic computing device, that manipulates and
transforms data represented as physical (electronic) quantities
within the computer system's registers and memories into other data
similarly represented as physical quantities within the computer
system memories or registers or other such information storage,
transmission or display devices.
[0026] The present invention also relates to apparatus for
performing the operations herein. This apparatus may be specially
constructed for the required purposes, or it may comprise a general
purpose computer selectively activated or reconfigured by a
computer program stored in the computer. Such a computer program
may be stored in a computer readable storage medium, such as, but
is not limited to, any type of disk including floppy disks, optical
disks, CD-ROMs, and magnetic-optical disks, read-only memories
(ROMs), random access memories (RAMs), EPROMs, EEPROMs, magnetic or
optical cards, or any type of media suitable for storing electronic
instructions, and each coupled to a computer system bus.
[0027] The algorithms and displays presented herein are not
inherently related to any particular computer or other apparatus.
Various general purpose systems may be used with programs in
accordance with the teachings herein, or it may prove convenient to
construct more specialized apparatus to perform the required method
steps. The required structure for a variety of these systems will
appear from the description below. In addition, the present
invention is not described with reference to any particular
programming language. It will be appreciated that a variety of
programming languages may be used to implement the teachings of the
invention as described herein.
[0028] FIG. 2 illustrates an exemplary vertical transport cluster
tool, according to one embodiment of the present invention. Cluster
tool 200 has a central vertical transport drive 2 within a
vertically-oriented vacuum enclosure 3. Vacuum enclosure 3 may be
made from polished stainless steel (or other similar type of metal
or alloy) pipe sections with pipe flanges 210 according to one
embodiment of the present invention. The pipe sections 10 may be
finished and polished in a variety of ways, but--being enclosures
for high vacuum movement of wafers, the pipe sections 10 follow
specifications used in the semiconductor manufacturing industry.
Flanges 210 at each end of each pipe section have diameter and hole
patterns appropriate to the application. Flanges 210 are finished
and grooved for o-ring seals and other similar high-vacuum
seals.
[0029] Cluster tool 200 has three sections 10 separated by
horizontal transport assemblies 11 and 12. At a lower end a pumping
module 4 is sealed through a gate valve 9 to the vertical assembly
of sections 10, 11 and 12. Pumping module 4 provides rough and high
vacuum pumping to maintain vacuum within vacuum enclosure 3.
Additionally, pumping module 4 can provide vacuum conditions for
processing chamber 6. A vertical support drive 2 for a vertical
transport mechanism (not shown within sections 10, 11 and 12) is
positioned at the top end of the vertical assembly of pipe sections
10 and horizontal transport modules 11 and 12. The vertical
transport mechanism and its drive 2 can be any of several sorts of
elevator, such as an elevator actuator assembly manufactured by the
Semiconductor Engineering Group, Inc.
[0030] Also included in cluster tool 200 is a horizontal transport
assembly 12 that serves as a load and unload station for wafers in
process. Horizontal transport assembly 12 also serves as a load
lock-chamber with elevator mechanisms (not shown). Horizontal
transport assembly 12 is mounted to a gate valve 5 via an extension
13. Extension 13 serves as an outer chamber of the transfer
assembly, which is essentially a flanged section of stainless steel
pipe. A linear wafer drive transport mechanism 1 mounts to a second
extension 13 via another valve 5. Transport mechanism reaches
through assembly 12 to bring wafers into the vertical transport
mechanism and to place processed wafers from the vertical transport
to a substrate storage cassette 8. Cassette 8 may be part of a
factory interface, such as factory interface 102.
[0031] Horizontal transport assembly 11 is attached to linear wafer
drive transport mechanism 1 via a valve 5 and extension 13. A
processing chamber 6 is isolated from the horizontal transport
assembly 11 by valve 5 and extension 13. The processing chamber 6
may be a processing chamber such as chamber 108 of cluster tool
100, according to one embodiment. Additionally, processing chamber
6 may have a wafer carousel or other transporting mechanism such
that a number of wafers may processed simultaneously.
[0032] Although only one drive mechanism 1 and chamber 6 (or
cassette 8) are illustrated per assembly 11 and 12, additional
drive mechanisms 1 may be used. The combination of linear drive 1
and horizontal assembly 11 eliminates the need for robots to
transfer substrates into process chamber 6. Additionally, cluster
tool 200 removes wafer transport mechanisms from within a center
transfer chamber such as vacuum enclosure 3. Thus, linear drive 1
is external to vacuum enclosure 3 and operates to move substrates
between processing chamber 6 and vacuum enclosure 3.
[0033] FIG. 3 illustrates an exemplary horizontal transport cluster
tool 300, according to one embodiment of the present invention.
Horizontal cluster tool 300 has three distinct processing chambers
306 and three cooperating linear transport drives 301 operating
through gate valves 305. Processing chambers 306 are coupled to a
vacuum chamber 303, where vacuum chamber 303 can be assembly 11 of
vertical transport cluster tool 200. It is important to note that
although one layer of chambers is illustrated in horizontal cluster
tool 300, numerous layers can exist through vertical stacking along
the vacuum chamber of a vertical cluster tool, such as vacuum
chamber 3 of vertical cluster tool 200. For example, the horizontal
transport cluster tool 300 can be attached as assembly 11, with an
additional layer of components of horizontal transport cluster tool
300 mounted above or below assembly 11.
[0034] Additionally, any one of processing chambers 306 can be
replaced with a factory interface such as factory interface 102.
Horizontal cluster tool 300 includes linear transport drives 301
that transport substrate wafers between processing chambers 306 and
vacuum enclosure 303. Linear transport drive 301 includes a blade
(not shown) that extends through a gate valve 305, through
extensions 313, through vacuum enclosure 303, through a second
extensions 313, through a second gate valve 305 to a processing
chamber 306, where linear transport drive 301 places or removes a
substrate wafer. The blade 380 will be described in greater detail
below.
[0035] Horizontal cluster tool 300 also includes an elevator
mechanism 390 that transports a substrate to another level
(assembly) of vertical transport cluster tool 200, according to one
embodiment of the present invention. For example, a fresh wafer may
be removed from cassette 8, vertically transport from assembly 12
to assembly 11. In one embodiment section 11 of FIG. 2 corresponds
to vacuum enclosure 303 of FIG. 3 from which the fresh wafer may be
distributed to any processing chamber 306.
[0036] The combination of linear drives 301 with vacuum enclosure
303 eliminates the need for robots to transfer substrates into
process chambers 306. Additionally, cluster tool 300 removes wafer
transport mechanisms from a center transfer chamber such as vacuum
enclosure 303. Thus, linear drives 301 are external to vacuum
enclosure 303 and operate to move substrates between processing
chambers 306 and vacuum enclosure 303. In additional embodiments,
any number of processing chamber 306 may be implemented around
vacuum enclosure 303 according to the needs of the process.
[0037] FIG. 4 illustrates an exemplary dual vacuum enclosure
cluster tool 400, according to one embodiment of the present
invention. Dual-vacuum enclosure cluster tool 400 has two vertical
transport mechanisms (not shown) within each vacuum enclosure 403.
Each vertical transport mechanism is driven by a vertical transport
drive, such as vertical transport drive 402 and vertical transport
drive 420. Vacuum enclosures 403 may be connected in a twin-tower
arrangement such that a single cassette 8 within a company
interface 102 may serve two separate vertical transports 403, which
may support one or more horizontal cluster tools 300 inserted as
horizontal assemblies 411. Note, that dual vacuum enclosure cluster
tool 400 does not illustrate any processing chambers attached to
horizontal assemblies 411.
[0038] Linear drive 401 transports one or more wafers between the
two vacuum enclosures 403. For example, a wafer within section 422
is removed by linear drive 401, and carried to section 412 through
extension 413 and gate valve 405, where vertical transport drive
402 elevates the wafer to horizontal assembly 411 for processing.
In alternate embodiments, additional vacuum enclosures 403 may be
interconnected to cluster tool 400 using additional linear drives
401, gate valves 405 and extensions 413.
[0039] FIG. 5 illustrates an exemplary horizontal cluster tool 500,
according to another embodiment of the invention. Horizontal
cluster tool 500 includes three processing chambers 506, although
additional (or fewer) processing chambers can be used. A vacuum
enclosure 503 is attached to a company interface 502. Attached
between each processing chamber 506 and the vacuum enclosure 503 is
a dual linear drive 501. Each dual linear drive 501 connects to
processing chamber 506 and vacuum enclosure 503 through extensions
and gate valves (not shown), according to one embodiment.
[0040] As illustrated in FIG. 5, dual linear drives 501 are
disposed between vacuum enclosure 503 and processing chambers 506.
This disposition is in direct contrast to horizontal cluster tool
300 in which its processing chamber separate the linear drives from
the vacuum enclosure.
[0041] The combination of dual linear drives 501 with vacuum
enclosure 503 eliminates the need for robots to transfer substrates
into process chambers 506. Additionally, cluster tool 500 removes
wafer transport mechanisms inside a center transfer chamber such as
vacuum enclosure 303. Thus, dual linear drives 501 are external to
vacuum enclosure 503 and operate to move substrates between
processing chambers 506 and vacuum enclosure 503. A more detailed
description of the operation of dual linear drives 501 is provided
below.
[0042] FIG. 6 illustrates an exemplary dual linear drive 601,
according to one embodiment of the present invention. Dual linear
drive 601 operates to transport two wafers 660 between a vacuum
chamber and a processing chamber (both not shown). The wafers 660
enter and exit through gate valves 605. Additionally, the wafers
660 sit upon blades 661. Besides extending from within enclosure
670 to processing chambers and vacuum chambers, blades 661 and
wafers 660 can be rotated within enclosure 670 by one hundred and
eighty (180) degrees. The rotation of blades 661 and wafers 660
will be described below.
[0043] The ability to rotate blades 661 and wafers 660 allows a
fresh wafer to be placed within a processing chamber at the same
time a processed wafer (removed from the same processing chamber)
is returned to a vacuum enclosure. Dual linear drive 601 doubles
the throughput of the a single wafer transport mechanism. Dual
linear drive 601 is illustrated in a home position where both
wafers 660 and both blades 661 are fully contained within enclosure
670.
[0044] FIG. 7 illustrates an exemplary dual linear drive 701 in an
extended position, according to one embodiment of the present
invention. Dual linear drive 701 includes an enclosure 770 having
two gate valves 705. Dual linear drive 701 has both blades 761
extended such that wafers 760 are outside enclosure 770, having
passed through gate valves 705. Wafers 760 can then be placed
within a processing chamber or vacuum enclosure (or taken from a
processing chamber or vacuum enclosure). In alternate embodiments,
one blade and wafer may be kept within enclosure 770, while the
second blade and wafer is extended.
[0045] FIG. 8 illustrates an exemplary dual linear drive mechanism
800, according to one embodiment of the present invention. Drive
mechanism 800 transports two wafers 860 into and out of an
enclosure (not shown) using blades 861 that support wafers 860.
Blades 861 glide along rails 880 via rollers 862. According to one
embodiment, three rollers 862 are used per blade, although any
number may be used. Rails 880 are shaped to mate with grooves
within rollers 862 that resemble pulley wheels, according to one
embodiment. In an alternate embodiment, ball bearings are used to
allow blades 861 to glide within rails 880.
[0046] Blades 861 are moved using motor 870 in combination with
pulleys 871, belt 872 and attachment tabs 863. Pulleys 871 are
placed along the center rail, such that belt 872 can be stretched
between them for the entire length of the rails 880. Motor 870
rotates one pulley 871 causing belt 872 to move along the center
rail. Each blade 861 is attached to the belt 872 via attachment
tabs 863 (one not shown). Thus, as the belt 872 moves, blades 861
carry wafers 860 into or out of the enclosure. The direction the
motor 870 spins pulley 871 is reversed to reverse the motion of
blades 861.
[0047] The rails are made from stainless steel according to one
embodiment. The pulleys are made from stainless steel, according to
one embodiment, although other materials including ceramics, carbon
fiber, aluminum, and similar materials can be used as well.
[0048] According to another embodiment, dual linear drive mechanism
800 is modified to be a single linear drive mechanism, such as
linear drives 201, 301, and 401. Only one blade 861 is used with
two rails 880, and no rotational mechanism is provided. Similarly,
in another embodiment, if a single blade linear drive is desired as
a substitute for the dual linear drives 501, a single blade can be
used as described with the ability to rotate one hundred and eighty
(180) degrees. In this example, a wafer can be removed from a
process chamber, rotated within the enclosure of the linear drive
and then placed in a vacuum enclosure. Then a fresh wafer can be
placed into the process chamber from the vacuum enclosure using the
same process in reverse.
[0049] FIG. 9 illustrates an exemplary dual linear drive mechanism
900, according to another embodiment of the present invention.
Drive mechanism 900 transports two wafers 960 into and out of an
enclosure (not shown) using blades 961 that support wafers 960.
Blades 961 glide along rails 980 via rolling guide 990. According
to one embodiment, one rolling guide 990 is used per blade,
although any number may be used. Rails 980 are shaped to mate with
grooves within rolling guide 990.
[0050] Blades 961 are moved using a small piezoelectric motor (not
shown) in combination with rolling guide 990, and ceramic strip
981. The motor is fixed to the side of rolling guide 990 closest to
the ceramic strip 981. When energized the motor moves rolling guide
990 along the ceramic strip 981 and glide on top of rail 980. The
direction of the motor can be reversed to reverse the motion of
blades 861.
[0051] The rails 980 are made from stainless steel according to one
embodiment, but can also be manufactured from aluminum or other
similar substances. The rails 980 can be a rail such as those
manufactured by IKO International, Inc. of Japan. The rolling guide
990 can be a Solid lubrication linear motion rolling guide, such as
those manufactured by IKO International, Inc. of Japan. According
to one embodiment, the motor is a piezoelectric motor such as the
HR Series solid state motors manufactured by Nanomotion, Ltd. of
Israel.
[0052] FIG. 10 illustrates an exemplary linear drive 1000 with a
rotation mechanism, according to one embodiment of the present
invention. Linear drive 1000 includes a top enclosure 1010 and a
bottom enclosure 1050 sealed by an O-ring 1030. Both the top
enclosure 1010 and bottom enclosure 1050 can be constructed from
aluminum, stainless steel, carbon fiber, or similar material. The
O-ring 1030 allows for the sealing of linear drive 1000 to create
vacuum conditions within. Mechanism 1020 is any one of the linear
drive mechanisms described above, including rails, blades and other
supporting architecture.
[0053] The mechanism 1020 is mounted to backing plate 1043,
according to one embodiment. In alternate embodiments, a backing
plate 1043 is not used. Backing plate 1043 along with mechanism
1020 rotate in a circular fashion over the bottom enclosure 1050 on
bearings 1090. The bearings 1090 can sit within a circular track
grooved into the bottom enclosure 1050, according to one
embodiment. Attached to the bottom side of the backing plate is a
spindle 1040 surrounded by one or more permanent magnets 1041. The
elements described thus far, exist within a vacuum sealed
environment.
[0054] The spindle 1040, backing plate 1043, and mechanism 1020 are
caused to rotate by one or more ring magnets 1060 outside the
bottom enclosure 1050. The ring magnets 1060 are connected to a
motor 1070 via a belt 1080. By causing the motor 1070 to rotate the
belt 1080 moves ring magnet 1060, ultimately turning the mechanism
120 within linear drive 1000.
[0055] FIG. 11 illustrates an exemplary linear drive 1100 with a
rotation mechanism, according to another embodiment of the present
invention. Linear drive 1100 includes a top enclosure 1110 and a
bottom enclosure 1151 sealed by an O-ring 1130. Both the top
enclosure 1110 and bottom enclosure 1151 can be constructed from
aluminum, stainless steel, carbon fiber, or similar material. The
O-ring 1130 allows for the sealing of linear drive 1100 to create
vacuum conditions within. Mechanism 1120 is any one of the linear
drive mechanisms described above, including rails, blades and other
supporting architecture.
[0056] The mechanism 1120 is mounted to backing plate 1143,
according to one embodiment. In alternate embodiments, a backing
plate 1143 is not used. Backing plate 1143 along with mechanism
1120 rotate in a circular fashion over the bottom enclosure 1151 on
bearings 1190. The bearings 1190 can sit within a circular track
grooved into the bottom enclosure 1151, according to one
embodiment. Attached to the bottom side of the backing plate 1143
is a circular guide ring 1172 constructed from ceramic, according
to one embodiment. Attached to the bottom enclosure 1151 is a motor
1171. Motor 1171 can be a piezoelectric motor such as the HR Series
solid state motors manufactured by Nanomotion, Ltd. of Israel. Both
the motor 1171 and guide ring 1172 can be glued into their
respective positions. The elements described thus far, exist within
a vacuum sealed environment. The backing plate 1143, and mechanism
1120 are caused to rotate when the motor 1171 is energized causing
the portion of the motor 1171 to contact and move the guide ring
1172.
[0057] FIG. 12 illustrates an exemplary method of transporting a
wafer, according to one embodiment of the present invention. A
wafer, such as wafer 660 is placed into a first segment of a vacuum
enclosure, such as assembly 12 of vacuum enclosure 3. (block 1210)
Linear wafer drive 1 physically moves the wafer into and out of
vacuum enclosure 3. Vertical transport mechanism and drive 2
transports the wafer to a second segment of the vacuum enclosure,
such as assembly 11. (block 1220) The wafer can then be removed
from vacuum enclosure 3 by another linear wafer drive 1, and into a
processing chamber 6. (block 1230)
[0058] Cluster tools, such as those described above are controlled
by a PC-type computer motion control system with software included.
The software running on the computer directs the movement of wafers
between chambers and enclosures. FIG. 13 illustrates a computer
system 1000 representing an integrated multi-processor, in which
elements of the present invention may be implemented. The system
1300 may represent a computer used to control the cluster tools
described above such as computer 7 of FIG. 2.
[0059] One embodiment of computer system 1300 comprises a system
bus 1320 for communicating information, and a processor 1310
coupled to bus 1320 for processing information. Computer system
1300 further comprises a random access memory (RAM) or other
dynamic storage device 1325 (referred to herein as main memory),
coupled to bus 1320 for storing information and instructions to be
executed by processor 1310. Main memory 1325 also may be used for
storing temporary variables or other intermediate information
during execution of instructions by processor 1310. Computer system
1300 also may include a read only memory (ROM) and/or other static
storage device 1326 coupled to bus 1320 for storing static
information and instructions used by processor 1310.
[0060] A data storage device 1327 such as a magnetic disk or
optical disc and its corresponding drive may also be coupled to
computer system 1300 for storing information and instructions.
Computer system 1300 can also be coupled to a second I/O bus 1350
via an I/O interface 1330. A plurality of I/O devices may be
coupled to I/O bus 1350, including a display device 1343, an input
device (e.g., an alphanumeric input device 1342 and/or a cursor
control device 1341). For example, web pages and business related
information may be presented to the user on the display device
1343.
[0061] The communication device 1340 is for accessing other
computers (servers or clients) via a network. The communication
device 1340 may comprise a modem, a network interface card, or
other well known interface device, such as those used for coupling
to Ethernet, token ring, or other types of networks.
[0062] The devices described herein may use simple, mostly
off-the-shelf linear wafer movement mechanisms, and motion control
software. The present cluster tools have many applications, such as
all thin film deposition, anneal, and etch processes in use in
memory chip and microprocessor manufacturing.
[0063] A method and apparatus for semiconductor processing is
disclosed. Although the present invention has been described with
respect to specific examples and subsystems, it will be apparent to
those of ordinary skill in the art that the invention is not
limited to these specific examples or subsystems but extends to
other embodiments as well. The present invention includes all of
these other embodiments as specified in the claims that follow.
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