U.S. patent application number 10/793789 was filed with the patent office on 2005-09-08 for method for integrating heat conductor with heat dissipating fin.
Invention is credited to Lin, Kuo-Len, Tsui, Hui-Min.
Application Number | 20050193561 10/793789 |
Document ID | / |
Family ID | 34912123 |
Filed Date | 2005-09-08 |
United States Patent
Application |
20050193561 |
Kind Code |
A1 |
Lin, Kuo-Len ; et
al. |
September 8, 2005 |
Method for integrating heat conductor with heat dissipating fin
Abstract
A method for integrating a heat conductor with a heat
dissipating fin is provided. The steps includes: a) employing a
low-temperature treatment to an area of the heat conductor so as to
generate a shape contraction thereof, wherein the area is a
connecting area between the heat conductor and the heat dissipating
fin; b) employing a heating treatment to the heat dissipating fin
to generate a shape expansion thereof and opening an aperture on
the heat dissipating fin corresponding to a position of the heat
conductor; and c) integrating the heat conductor with the heat
dissipating fin by passing the heat conductor through the aperture
on the heat dissipating fin and combining the heat conductor and
the heat dissipating fin under a room temperature. Accordingly, the
contact density between heat conductor and heat dissipating fin is
increased, while the thermal resistance is reduced.
Inventors: |
Lin, Kuo-Len; (WuguTownship,
TW) ; Tsui, Hui-Min; (Wugu Township, TW) |
Correspondence
Address: |
Yi-Wen Tseng
4331 Stevens Battle Lane
Fairfax
VA
22033
US
|
Family ID: |
34912123 |
Appl. No.: |
10/793789 |
Filed: |
March 8, 2004 |
Current U.S.
Class: |
29/890.046 |
Current CPC
Class: |
Y10T 29/49378 20150115;
F28F 1/30 20130101; F28F 2275/12 20130101 |
Class at
Publication: |
029/890.046 |
International
Class: |
F28F 007/00 |
Claims
What is claimed is:
1. A method for integrating a heat conductor with a heat
dissipating fin, comprising steps of: employing a low-temperature
treatment to an area of said heat conductor so as to generate a
shape contraction thereof, wherein said area is a connecting area
between said heat conductor and said heat dissipating fin;
employing a heating treatment to said heat dissipating fin to
generate a shape expansion thereof and opening an aperture on said
heat dissipating fin corresponding to a position of said heat
conductor; and integrating said heat conductor with said heat
dissipating fin by passing said heat conductor through said
aperture on said heat dissipating fin and combining said heat
conductor and said heat dissipating fin under a room
temperature.
2. The method according to claim 1, wherein said low-temperature
treatment step and said heat treatment step are proceeded
simultaneously.
3. The method according to claim 1, wherein said low-temperature
treatment step is proceeded after said heat treatment step.
4. The method according to claim 1, wherein said low-temperature
treatment step and said heat treatment step are proceeded before
step c).
5. The method according to claim 1, wherein said heat conductor is
a heat tube.
6. The method according to claim 1, wherein said heat conductor is
a copper pillar.
7. The method according to claim 1, wherein said aperture on said
heat dissipating fin has an inside diameter which is larger than or
equal to an outer diameter of said heat conductor so that said heat
conductor can easily passes through said aperture of said heat
dissipating fin to be combined therewith.
8. A method for integrating a heat conductor with a heat
dissipating fin, comprising steps of: a) employing a
low-temperature treatment to an area of said heat conductor so as
to generate a shape contraction thereof, wherein said area is a
connecting area between said heat conductor and said heat
dissipating fin, and said heat dissipating fin has an aperture
mounted thereon and is maintained at a room temperature; and b)
integrating said heat conductor with said heat dissipating fin by
passing said heat conductor through said aperture on said heat
dissipating fin and combining said heat conductor and said heat
dissipating fin under said room temperature.
9. The method according to claim 8, wherein said heat conductor is
a heat tube.
10. The method according to claim 8, wherein said heat conductor is
a copper pillar.
11. A method for integrating a heat conductor with a heat
dissipating fin, comprising steps of: a) maintaining said heat
conductor under a room temperature and employing a heating
treatment to said heat dissipating fin to generate a shape
expansion thereof, and opening an aperture on said heat dissipating
fin corresponding to a position of said heat conductor; and b)
integrating said heat conductor with said heat dissipating fin by
passing said heat conductor through said aperture on said heat
dissipating fin and combining said heat conductor and said heat
dissipating fin under said room temperature.
12. The method according to claim 11, wherein said heat conductor
is a heat tube.
13. The method according to claim 11, wherein said heat conductor
is a copper pillar.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention is related to a method for integrating
a heat conductor with a heat dissipating fin, and more
particularly, to an integrating method employing a temperature
change to the metal material to cause a physical change thereof for
easily combining a heat conductor with a heat dissipating fin
tightly. It has been a general trend to use a heat conductor as a
heat dissipating element in the fields relevant to computers. By
owning the properties including high heat-conducting ability, short
heat-conducting time, high heat-conducting speed, light weight,
simple structure, and multi-purpose, the heat conductors are very
suitable for the heat dissipating needs of electronic products
since they can conduct large amount of heat without consuming any
electrical power, especially the heat conductors like heat tubes
and copper pillars.
[0002] In the past, when connecting or combining the heat tube of
heat conductor with the heat dissipating fin, the apertures
corresponding to the position of the heat tube must be opened or
mounted on each heat dissipating fin before the heat tube
respectively passes through each aperture of the heat dissipating
fins. In addition, in order to enhance the contact density between
the heat tube and each heat dissipating fin so as to reduce the
thermal resistance of heat conduction, the heat-conducting medium
like solder paste is coated on the surface of the heat tube before
the heat tube is connected or combined with each heat dissipating
fin.
[0003] However, since the foresaid heat-conducting medium is
usually viscose-like, the heat tube can not pass the aperture on
each heat dissipating fin very smoothly when the heat-conducting
medium is spread on the heat tube. Besides, the extra viscose-like
heat-conducting medium would spill from each aperture, which not
only affects the outside appearance, but also increases the thermal
resistance when the impurities are attached thereon. On the other
hand, if the coated heat-conducting medium is not enough, the heat
tube would not be able to be contacted with the aperture on each
heat dissipating fin tightly. Therefore, it is very hard to
accurately control the amount of the coated heat-conducting medium
or to evenly spread the heat-conducting medium on the heat tube
during the integrating process of the heat tube and the heat
dissipating fin, and that seriously affects the product quality and
results in plenty of manufacturing troubles.
[0004] In addition, there is another disadvantage, in which the
aperture of the heat dissipating fin is designed to have a slightly
smaller diameter than the outer diameter of the heat tube so that
the heat dissipating fin can be directly pushed and put around the
heat tube. Accordingly, the contact density and the heat conducting
ability of the combined heat tube and the heat dissipating fin are
both enhanced. However, since the thickness of the tube wall is
very thin (thinner than 0.5 mm), it is very common to cause a
distortion by improperly extruding the heat tube or to impair the
heat tube by accidentally scratching the surface of the heat
tube.
[0005] Hence, how to improve the process for integrating the heat
tube and the heat dissipating fin has become a major problem waited
to be solved in the industry. In order to overcome the drawbacks in
the prior art, a method for integrating a heat conductor with a
heat dissipating fin, which effectively improves the integrating
process, is provided.
SUMMARY OF THE INVENTION
[0006] The present invention is to provide a method for integrating
a heat conductor with a heat dissipating fin. Based on the
principle that a temperature change would cause the physical change
of metal material, the heat conductor and the heat dissipating fin
can be combined tightly. Therefore, the drawbacks in the
conventional art that the viscose-like heat-conducting medium is
not spread evenly, the shape of the heat conductor is altered due
to improper extruding, and the surface of the heat tube is impaired
because of unavoidable scratching, are accordingly solved so that
the product quality could be effectively controlled for further
manufacturing and processing.
[0007] According to one aspect of the present invention, a method
for integrating a heat conductor with a heat dissipating fin is
provided. The steps includes:
[0008] a) employing a low-temperature treatment to an area of the
heat conductor so as to generate a shape contraction thereof,
wherein the area is a connecting area between the heat conductor
and the heat dissipating fin;
[0009] b) employing a heating treatment to the heat dissipating fin
to generate a shape expansion thereof and opening an aperture on
the heat dissipating fin corresponding to a position of the heat
conductor; and
[0010] c) integrating the heat conductor with the heat dissipating
fin by passing the heat conductor through the aperture on the heat
dissipating fin and combining the heat conductor and the heat
dissipating fin under a room temperature.
[0011] In accordance with the present invention, the step a) and
the step b) are proceeded simultaneously.
[0012] In accordance with the present invention, the step a) is
proceeded after the step b).
[0013] In accordance with the present invention, the step a) and
the step b) are proceeded before step c).
[0014] In accordance with the present invention, the heat conductor
is a heat tube.
[0015] In accordance with the present invention, the heat conductor
is a copper pillar.
[0016] In accordance with the present invention, the aperture on
the heat dissipating fin has an inside diameter larger than or
equal to an outer diameter of the heat conductor so that the heat
conductor can easily pass through the aperture of the heat
dissipating fin to be combined therewith.
[0017] According to another aspect of the present invention, a
method for integrating a heat conductor with a heat dissipating fin
is provided. The steps includes:
[0018] a) employing a low-temperature treatment to an area of the
heat conductor so as to generate a shape contraction thereof,
wherein the area is a connecting area between the heat conductor
and the heat dissipating fin, and the heat dissipating fin has an
aperture mounted thereon and is maintained at a room temperature;
and
[0019] b) integrating the heat conductor with the heat dissipating
fin by passing the heat conductor through the aperture on the heat
dissipating fin and combining the heat conductor and the heat
dissipating fin under the room temperature.
[0020] According to another aspect of the present invention, a
method for integrating a heat conductor with a heat dissipating fin
is provided. The steps includes:
[0021] a) maintaining the heat conductor under a room temperature
and employing a heating treatment to the heat dissipating fin to
generate a shape expansion thereof, and opening an aperture on the
heat dissipating fin corresponding to a position of the heat
conductor; and
[0022] b) integrating the heat conductor with the heat dissipating
fin by passing the heat conductor through the aperture on the heat
dissipating fin and combining the heat conductor and the heat
dissipating fin under the room temperature.
[0023] The foregoing and other features and advantages of the
present invention will be more clearly understood through the
following descriptions with reference to the drawings, wherein:
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIG. 1A is a flow chart illustrating the steps for
integrating a heat conductor with a heat dissipating fin according
to the first preferred embodiment of the present invention;
[0025] FIG. 1B is a flow chart illustrating the steps for
integrating a heat conductor with a heat dissipating fin according
to the second preferred embodiment of the present invention;
[0026] FIG. 1C is a flow chart illustrating the steps for
integrating a heat conductor with a heat dissipating fin according
to the third preferred embodiment of the present invention;
[0027] FIG. 2 is a diagram showing the heat conductor and the heat
dissipating fin before combined according to a preferred embodiment
of the present invention;
[0028] FIG. 3 is a diagram showing the heat tube and the heat
dissipating fin after combined according to a preferred embodiment
of the present invention; and
[0029] FIG. 4 is a sectional diagram showing the heat dissipating
device combined by the heat tube and a plurality of heat
dissipating fin according to a preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0030] The present invention will now be described more
specifically with reference to the following embodiments. It is to
be noted that the following descriptions of preferred embodiments
of this invention are presented herein for purpose of illustration
and description only; it is not intended to be exhaustive or to be
limited to the precise form disclosed.
[0031] Please refer to FIGS. 1A and 2-4. FIG. 1A is a flow chart
illustrating the steps for integrating a heat conductor with a heat
dissipating fin according to the first preferred embodiment of the
present invention. FIG. 2 is a diagram showing the heat conductor
and the heat dissipating fin before combined. FIG. 3 is a diagram
showing the heat tube and the heat dissipating fin after combined.
FIG. 4 is a sectional diagram showing the heat dissipating device
combined by the heat tube and a plurality of heat dissipating fin.
A method for integrating a heat conductor with a heat dissipating
fin is provided in the present invention. Based on the principle
that a temperature change would cause the physical change of metal
material, the heat conductor would have a shape contraction when
treated by a low temperature. The heat dissipating fin is heated to
make the diameter of the aperture on the heat dissipating fin
larger. Then, the heat conductor is penetrated through the heat
dissipating fin via the aperture and combined with the heat
dissipating fin under a room temperature. According to the first
preferred embodiment of the present invention, the steps are as
follows.
[0032] a) A low-temperature treatment is employed to an area of the
heat conductor 1, where is the connecting region of the heat
conductor is combined with the heat dissipating fin 2. The heat
conductor 1 would generate a shape contraction around the
connecting region, as shown in FIG. 2. In this step, the material
for the heat conductor 1 is preferably the metal material of heat
tube or copper pillar. The heat conductor 1 is put into a freezing
device or a low-temperature liquid such as liquid nitrogen so that
the shape or the size thereof would shrink slightly. By controlling
the factors such as the cooling time or the cooling temperature of
the cooling liquid, the contraction degree of the heat conductor 1
can be accurately monitored and controlled. Thus an even shape
contraction can be obtained.
[0033] b) A heating treatment is employed to the heat dissipating
fin 2 so as to generate a shape expansion thereof, as shown in FIG.
2. An aperture 20 is opened on the heat dissipating fin 2
corresponding to a position of the heat conductor 1. In this step,
the aperture 20 on the heat dissipating fin 2 has an inside
diameter larger than or equal to the outer diameter of the heat
conductor 1 so that the heat conductor 1 can easily pass through
the aperture 20 of the heat dissipating fin 2. As such, neither the
shape alteration of the heat conductor 1 nor the scratching damage
on the surface of the heat conductor 1 would occur. According to
another preferred embodiment of the present invention, this step
can be proceeded with the step a) simultaneously, or proceeded
before the step a).
[0034] c) The heat conductor 1 is penetrated through the aperture
20 on the heat dissipating fin 2 and then combined with the heat
dissipating fin 2 under a room temperature. In this step, the
temperature of the heat conductor 1 is increased owing to the
ambient environment so that the shape and the size thereof are
expanded. Meanwhile, since the aperture 20 of the heat dissipating
fin 2 is cooled down, the diameter of the aperture 20 is shrunk.
Consequently, the heat conductor 1 and the heat dissipating fin 2
can be tightly integrated under a room temperature through the
manners that the size of the heat conductor 1 is increased and the
diameter of the heat dissipating fin 2 is decreased. Preferably,
this step is proceeded after the step a) and the step b).
[0035] Please refer to FIG. 1B. FIG. 1B is a flow chart
illustrating the steps for integrating a heat conductor with a heat
dissipating fin according to the second preferred embodiment of the
present invention. According to the second preferred embodiment of
the present invention, the steps are as follows.
[0036] a) A low-temperature treatment is employed to an area of the
heat conductor 1, where is the connecting region the heat conductor
is combined with the heat dissipating fin 2. The heat conductor 1
would generate a shape contraction around the connecting region.
The heat dissipating fin 2 has an aperture 20 and is maintained at
a room temperature. In this step, the heat conductor 1 is employed
with the low-temperature treatment longer than that in the first
embodiment, or under a lower temperature than that in the first
embodiment so that more shape contraction is obtained.
[0037] b) The heat conductor 1 is penetrated through the aperture
20 on the heat dissipating fin 2 and then combined with the heat
dissipating fin 2 under a room temperature.
[0038] Please refer to FIG. 1C. FIG. 1C is a flow chart
illustrating the steps for integrating a heat conductor with a heat
dissipating fin according to the third preferred embodiment of the
present invention. According to the third preferred embodiment of
the present invention, the steps are as follows.
[0039] a) A heating treatment is employed to the heat dissipating
fin 2 to generate a shape expansion. The aperture 20 is opened on
the heat dissipating fin 2 corresponding to the position of the
heat conductor 1. In this step, the heat dissipating fin 2 is
employed under the heating treatment with a high temperature than
that in the first embodiment so that more shape expansion of the
aperture 20 is obtained. Meanwhile, the heat conductor 1 is
maintained under a room temperature.
[0040] b) The heat conductor 1 is penetrated through the aperture
20 on the heat dissipating fin 2 and then combined with the heat
dissipating fin 2 under a room temperature.
[0041] Accordingly, the method for integrating a heat conductor
with a heat dissipating fin could be accomplished by the foresaid
steps in the respective embodiment.
[0042] According to the above, the drawbacks in the conventional
integrating method for heat conductor and heat dissipating fin are
not existed in the integrating method provided in the present
invention. By employing the method for integrating heat conductor
with heat dissipating fin of the present invention, the drawbacks
in the conventional art that the viscose-like heat-conducting
medium is not spread evenly, the shape of the heat conductor is
altered due to improper extruding, and the surface of the heat tube
is impaired because of unavoidable scratching, are accordingly
solved. The products made by the present integrating method not
only have a pleasant outside appearance, but also are preferable
for further manufacturing and processing. The contact density
between heat conductor and heat dissipating fin is increased, while
the thermal resistance is reduced. Accordingly, the property that
the heat conductor conducts large amount of heat is effectively
achieved. Hence, the present invention not only has a novelty and a
progressive nature, but also has an industry utility.
[0043] While the invention has been described in terms of what is
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiments. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures.
* * * * *