Tsui; Hui-Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsui; Hui-Min.The latest application filed is for "isothermal plate assembly with predetermined shape and method for manufacturing the same".

Company Profile

0.5.6

Tsui; Hui-Min - Wugu Township Taipei County TW
Tsui; Hui-Min - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Isothermal plate assembly with predetermined shape and method for manufacturing the same Grant 7,322,102 - Lin , et al. January 29, 2	2008-01-29
Method for manufacturing heat-dissipating device with isothermal plate assembly of predetermined shape Grant 7,237,338 - Lin , et al. July 3, 2	2007-07-03
Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same App 20060144561 - Lin; Kuo-Len ; et al.	2006-07-06
Isothermal plate assembly with predetermined shape and method for manufacturing the same App 20060144571 - Lin; Kuo-Len ; et al.	2006-07-06
Protection structure for thermal conducting medium of heat dissipation device Grant 7,068,514 - Chang , et al. June 27, 2	2006-06-27
Heat dissipating device with uniform heat points Grant 7,021,368 - Lin , et al. April 4, 2	2006-04-04
Method for integrating heat conductor with heat dissipating fin App 20050193561 - Lin, Kuo-Len ; et al.	2005-09-08
Protection structure for thermal conducting medium of heat dissipation device App 20050180115 - Chang, Chi-Lin ; et al.	2005-08-18
Dual-layer heat dissipating structure Grant 6,918,429 - Lin , et al. July 19, 2	2005-07-19
Heat dissipating device with uniform heat points App 20050098304 - Lin, Kuo-Len ; et al.	2005-05-12
Dual-layer Heat Dissipating Structure App 20050092465 - Lin, Kuo-Len ; et al.	2005-05-05

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