U.S. patent application number 10/747978 was filed with the patent office on 2005-06-30 for apparatus and method for cooling integrated circuit devices.
Invention is credited to Erturk, Hakan, Sauciuc, Ioan, Unrein, Edgar J..
Application Number | 20050141197 10/747978 |
Document ID | / |
Family ID | 34700820 |
Filed Date | 2005-06-30 |
United States Patent
Application |
20050141197 |
Kind Code |
A1 |
Erturk, Hakan ; et
al. |
June 30, 2005 |
APPARATUS AND METHOD FOR COOLING INTEGRATED CIRCUIT DEVICES
Abstract
Some embodiments of a method and apparatus for cooling
integrated circuit devices are described. In one embodiment, the
apparatus includes a thermosiphon having an evaporator portion
coupled to a first surface of a heat source and a condenser portion
coupled to the evaporator portion distal from the first surface of
the heat source. A remote heat exchanger is coupled to the
condenser of the thermosiphon. In addition, one or more
thermoelectric elements are coupled between the heat exchanger and
the condenser of the thermosiphon. In one embodiment, the remote
heat exchanger, the thermoelectric elements and the condenser
portion of the thermosiphon are located outside a chassis of a one
rack unit (1U) server computer.
Inventors: |
Erturk, Hakan; (Tempe,
AZ) ; Sauciuc, Ioan; (Phoenix, AZ) ; Unrein,
Edgar J.; (Steilacoom, WA) |
Correspondence
Address: |
BLAKELY SOKOLOFF TAYLOR & ZAFMAN
12400 WILSHIRE BOULEVARD
SEVENTH FLOOR
LOS ANGELES
CA
90025-1030
US
|
Family ID: |
34700820 |
Appl. No.: |
10/747978 |
Filed: |
December 29, 2003 |
Current U.S.
Class: |
361/700 ;
257/E23.088 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/427 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
361/700 |
International
Class: |
H05K 007/20 |
Claims
What is claimed is:
1. An apparatus, comprising: a thermosiphon having an evaporator
portion coupled to a first surface of a heat source and a condenser
portion coupled to the evaporator portion distal from the first
surface of the heat source; at least one thermoelectric element
coupled to the condenser portion of the thermosiphon; and a remote
heat exchanger coupled to the at least one thermoelectric
element.
2. The apparatus of claim 1, wherein the evaporator portion
comprises: an enhanced boiling structure at a base of the
evaporator portion opposite the first surface of the heat source;
and an attachment base to couple the thermosiphon to the heat
source.
3. The apparatus of claim 1, wherein the condenser portion
comprises: a concave base coupled to the evaporator portion; a
first condenser arm coupled to a proximal portion of the concave
base; and a second condenser arm coupled to a distal portion of the
concave base opposite the first condenser arm.
4. The apparatus of claim 1, wherein the at least one
thermoelectric element further comprises: a first pair of
thermoelectric elements coupled to opposed surfaces of a first
condenser arm of the condenser portion of the thermosiphon; and a
second pair of thermoelectric elements coupled to opposed surfaces
of a second condenser arm of the thermosiphon.
5. The apparatus of claim 1, wherein the remote heat exchanger
comprises: a plurality of fins coupled to an exposed surface of the
at least one thermoelectric element.
6. The apparatus of claim 1, further comprising: a device to
subject the remote heat exchanger and an exposed surface of the at
least one thermoelectric element to blown, ambient temperature
air.
7. The apparatus of claim 1, wherein the evaporator portion of the
thermosiphon is located within a one rack unit (1U) server chassis
and wherein the condenser portion of the thermosiphon, the at least
one thermoelectric element and the remote heat exchanger are
located outside the 1U server chassis.
8. The apparatus of claim 2, wherein the enhanced boiling structure
comprises: a uniform thin film of porous coating formed on the base
of the evaporator portion.
9. The apparatus of claim 1, wherein the at least one
thermoelectric element is to transfer heat from an unexposed
surface of the thermoelectric element, heated by a surface of the
condenser portion, toward an exposed surface of the thermoelectric
element, facing the heat exchanger, to reduce the temperature of
the condenser portion of the thermosiphon.
10. The apparatus of claim 1, wherein the heat source comprises an
integrated circuit.
11. A system comprising: a processor; a thermosiphon having an
evaporator portion coupled to a first surface of a processor and a
condenser portion coupled to the evaporator portion distal from a
first surface of the processor; at least one thermoelectric element
coupled to the condenser portion of the thermosiphon; and a remote
heat exchanger coupled to the at least one thermoelectric
element.
12. The system of claim 11, wherein the evaporator portion
comprises: an enhanced boiling structure at a base of the
evaporator opposite the first surface of the heat source.
13. The system of claim 11, wherein the condenser portion
comprises: a concave base coupled to the evaporator portion; a
first condenser arm coupled to a proximal portion of the concave
base; and a second condenser arm coupled to a distal portion of the
concave base opposite the first condenser arm.
14. The system of claim 11, wherein the at least one thermoelectric
element comprises: a first pair of thermoelectric elements coupled
to opposed surfaces of a first condenser arm of the condenser
portion of the thermosiphon; and a second pair of thermoelectric
elements coupled to opposed surfaces of a second condenser arm of
the thermosiphon.
15. The system of claim 11, wherein the remote heat exchanger
comprises: a plurality of fins coupled to an exposed surface of the
at least one thermoelectric element.
16. The system of claim 11, further comprising: a device to subject
the remote heat exchanger and an exposed surface of the at least
one thermoelectric element to blown, ambient temperature air.
17. The system of claim 11, wherein the evaporator portion of the
thermosiphon is located within a server chassis and wherein the
condenser portion of the thermosiphon, the one or more
thermoelectric elements and the remote heat exchanger are located
outside the server chassis; and wherein the server chassis is a one
rack unit (1U) server chassis.
18. The system of claim 11, wherein the evaporator portion of the
thermosiphon is located within a server chassis and wherein the
condenser portion of the thermosiphon, the one or more
thermoelectric elements and the remote heat exchanger are located
outside the server chassis; and wherein the server chassis is a
blade server chassis.
19. The system of claim 11, wherein the at least one thermoelectric
element is to transfer heat from an unexposed surface of the
thermoelectric element, a heated by a surface of the condenser
portion, toward an exposed surface of the thermoelectric element,
facing the heat exchanger, to reduce the temperature of the
condenser portion of the thermosiphon.
20. The system of claim 11, further comprising: a double data rate
(DDR), synchronous dynamic random access memory (SDRAM) (DDR
SDRAM); a memory controller coupled between the processor and the
DDR SDRAM; and an input/output controller coupled to the memory
controller.
21. The system of claim 11, wherein the processor is a graphics
processor.
22. The system of claim 11, wherein the processor is a one rack
unit (1U) processor.
23. The system of claim 11, wherein the processor is a blade server
processor.
24. The apparatus of claim 12, wherein the enhanced boiling
structure comprises: a uniform thin film of porous coating formed
on the base of the evaporator portion.
25. A method comprising: boiling a liquid within an evaporator
portion of a thermosiphon to form a vapor using heat from a heat
source; transferring heat from a surface of a condenser portion of
the thermosiphon to exposed surfaces of one or more thermoelectric
elements to reduce a temperature of the condenser portion of the
thermosiphon; and subjecting the exposed surfaces of the one or
more thermoelectric elements to ambient temperature, blown air to
dissipate heat from the heat source.
26. The method of claim 25, wherein boiling comprises: heating an
enhanced boiling structure at the base of the evaporator portion of
the thermosiphon; evaporating liquid within the evaporator portion
of the thermosiphon to cause the vapor to occupy the condenser
portion of the thermosiphon; and heating, by the vapor, the surface
of the condenser portion to cause unexposed surfaces of the one or
more thermoelectric elements to absorb the heat from the surface of
the condenser portion of the thermosiphon.
27. The method of claim 25, wherein transferring the heat
comprises: powering the one or more thermoelectric elements;
transmitting, by each respective thermoelectric element, heat from
an unexposed surface of each respective thermoelectric element to
an exposed surface of the respective thermoelectric element; and
reducing a temperature of the condenser portion of the
thermosiphon; and decreasing an operating temperature of the fluid
within the evaporation portion of the thermosiphon.
28. The method of claim 25, wherein subjecting the exposed surfaces
comprises: operating a fan to blow room temperature air through a
heat exchanger coupled to the exposed surfaces of the one or more
thermoelectric elements.
29. The method of claim 25, wherein transferring heat comprises:
reducing a temperature within the condenser portion of the
thermosiphon; converting vapor within the condenser portion of the
thermosiphon into a liquid; and causing the liquid to occupy the
evaporator portion of the thermosiphon to prohibit complete
evaporation of liquid within the evaporator portion of the
thermosiphon.
Description
FIELD OF THE INVENTION
[0001] One or more embodiments of the invention relate generally to
the field of integrated circuit and computer system design. More
particularly, one or more of the embodiments of the invention
relates to a method and apparatus for cooling integrated circuit
devices.
BACKGROUND OF THE INVENTION
[0002] The advent of the Internet provides Internet users with a
worldwide web of information at the click of a button. As the
Internet continues to grow and occupy a ubiquitous position within
society, Internet service providers are continuously in competition
for providing users with Internet access. Generally, Internet
service providers (ISPs) use one or more server computers, which
are designed to provide customers of the ISP with Internet access.
Unfortunately, as the ISP's customer base grows, the ISP's data
center is required to house additional servers in order to provide
Internet access to new customers.
[0003] Accordingly, central processing unit (CPU) space is at a
substantially high premium within an ISP's data center. To combat
the war on processor real estate, various companies are shipping
slim line, full-featured servers and storage units for the
space-constrained ISP. These companies have established a new
industry standard for today's Internet servers. According to the
new industry standard, the dimension of a server may be limited to
19 inches wide by 1.75 inches high or one rack unit (1U). Hence,
compliant servers are commonly referred to as 1U servers.
[0004] However, although 1U servers may be compact in size, such
servers are required to provide continuously increasing data
throughput levels. Hence, technologies, such as data pipelining,
out-of-order execution and the like, are required to enable such 1U
server architectures to operate at significantly higher clock rates
to achieve the data throughput levels. However, the increased clock
rates and processing speeds of corresponding 1U processors result
in substantial heating when incorporated within a 1U server.
Consequently, conventional techniques, such as using a solid metal
heat sink on top of the processor, while passing air through
extended surfaces of the heat sink, are insufficient for
dissipating heat produced by modern days 1U processors.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The invention is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings in
which like references indicate similar elements. It should be noted
that references to "an" or "one" embodiment in this disclosure are
not necessarily to the same embodiment, and such references mean at
least one.
[0006] FIG. 1 is a block diagram illustrating a computer system for
use within a one rack unit (1U) server computer in accordance with
one embodiment.
[0007] FIG. 2 is a block diagram illustrating a cooling system
including a remote heat exchanger in accordance with one
embodiment.
[0008] FIG. 3 is a block diagram further illustrating the cooling
system of FIG. 1, in accordance with one embodiment.
[0009] FIG. 4 is a block diagram further illustrating an evaporator
portion of the thermosiphon of FIGS. 2 and 3, in accordance with
one embodiment.
[0010] FIGS. 5A and 5B illustrate 1U server computer systems,
incorporating the cooling system of FIG. 2 and computer system of
FIG. 1, in accordance with one embodiment.
[0011] FIG. 6 is a flowchart illustrating a method for cooling a
heat source using a cooling system, in accordance with one
embodiment.
[0012] FIG. 7 is a flowchart illustrating a method for boiling
liquid to form vapor using heat from a heat source, in accordance
with one embodiment.
[0013] FIG. 8 is a flowchart illustrating a method for transferring
heat from a surface of a condenser portion of the thermosiphon
cooling system, in accordance with one embodiment.
[0014] FIG. 9 is a flowchart illustrating a method for transferring
heat from a surface of a condenser portion of the thermosiphon, in
accordance with one embodiment.
DETAILED DESCRIPTION
[0015] A method and apparatus for cooling integrated circuit
devices are described. In one embodiment, the apparatus includes a
thermosiphon having an evaporator portion coupled to a first
surface of a heat source. A condenser portion of the thermosiphon
is coupled to the evaporator portion distal from the first surface
of the heat source. At least one thermoelectric element is coupled
to the condenser portion of the thermosiphon. A remote heat
exchanger is coupled to the at least one thermoelectric
element.
[0016] In one embodiment, the remote heat exchanger, the
thermoelectric elements and the condenser portion of the
thermosiphon are located outside a chassis of a one rack unit (1U)
server computer. Accordingly, by placing the remote heat exchanger,
the thermoelectric element and the condenser portion of the
thermosiphon outside the 1U server chassis, heat absorbed by the
device is cooled by ambient air. In one embodiment, the condenser
portion of the thermosiphon is cooled by powering of the
thermoelectric element to dissipate heat from the condenser portion
and transfer the heat to an exposed surface of the thermoelectric
element. Subsequently, a fan or blower is used to blow room
temperature air through the heat remote exchanger and the exposed
portion of the thermoelectric element.
[0017] System
[0018] FIG. 1 is a block diagram illustrating a computer system 100
including a processor 110, in accordance with one embodiment.
Computer system 100 comprises a processor system bus (front side
bus (FSB)) 102 for communicating information between the processor
(CPU) 110 and a chipset 180 coupled together via FSB 102. As
described herein, the term "chipset" is used to describe
collectively the various devices coupled to CPU 110 to perform
desired system functionality.
[0019] In one embodiment, chipset 180 includes a memory controller
or memory controller hub (MCH) 120, as well as an input/output
(I/O) controller or I/O controller hub (ICH) 130. In one
embodiment, I/O bus 125 couples MCH 120 to ICH 130. MCH 120 of
chipset 180 is coupled to main memory 140 and one or more graphics
devices or graphics controller 160. In one embodiment, main memory
110 is volatile memory, including but not limited to, random access
memory (RAM), synchronous RAM (SRAM), synchronous dynamic RAM
(SDRAM), double data rate (DDR) SDRAM, Rambus dynamic RAM (RDRAM),
or the like. In addition, hard disk drive devices (HDD) 150, as
well as one or more I/O devices 170 (170-1, . . . , 170-N) are
coupled to ICH 130.
[0020] In one embodiment, computer system 100 may be implemented
within a one rack unit (1U) server, a blade server or other like
space constrained server. Hence, although computer system 100 may
require reconfiguration for placement into a 1U server, in spite of
the compact size, computer system 100 is required to provide
continuously increasing data throughput levels. Hence, technology,
such as data pipeline, out-of-order execution and the like are
required to enable computer system 100 to function within a 1U
server architecture, while operating at a sufficient clock rate to
achieve the data throughput levels.
[0021] Unfortunately, increasing the clock rates and processing
speeds of processors within 1U servers (1U processors) results in
increased, substantial heating when incorporated within a 1U
server. Consequently, conventional techniques, such as utilizing a
solid metal heat sink on top of the 1U processor and passing air
through extended surfaces of the heat sink is insufficient for
dissipating heat produced by 1U processors. Accordingly, in one
embodiment, thermosiphon cooling system 200, as illustrated in FIG.
2, is used to cool 1U processor 110 of FIG. 1.
[0022] As illustrated in FIG. 2, cooling system 200 is configured
for attachment to a heat source, such as, for example, CPU 110 of
computer system 100 of FIG. 1. Representatively, cooling system 200
comprises thermosiphon 210 and remote heat exchanger 250. In one
embodiment, remote heat exchanger 250 is placed outside a 1U server
chassis and cooled with blown, room temperature air to assist
thermosiphon 210 to dissipate heat from a 1U processor. The various
components of thermosiphon cooling system 200 are illustrated with
reference to FIG. 3.
[0023] As illustrated in FIG. 3, cooling system 200 is comprised of
an attachment base 202 for coupling to a heat source (not shown).
In one embodiment, thermosiphon 210 is a phase-change heatsink
comprised of a sealed evaporator portion 220 containing a volatile
liquid. Evaporator portion 220 is coupled to a condenser portion
240 of thermosiphon 210. Representatively, condenser portion 240 is
illustrated according to an arcuate or U-shaped embodiment.
However, as will be recognized by those skilled in the art, various
configurations of condenser portion 240 are possible while
remaining within the scope of the described embodiments.
[0024] In one embodiment, condenser portion 240 includes opposed
first condenser arm 244 and second condenser arm 246.
Representatively, first condenser arm 244 and second condenser arm
246 are coupled to concave base 242. In one embodiment, first
condenser arm 244 and second condenser arm 246, as well as concave
base 242 of thermosiphon 210 are hollow to allow vapor or gas to
rise from evaporator portion 220. As illustrated in further detail
below, thermoelectric elements are coupled to opposed surfaces of
first condenser arm 244 and second condenser arm 246 to dissipate
heat therefrom.
[0025] Referring to FIG. 4, FIG. 4 further illustrates evaporator
portion 220 of FIG. 3, in accordance with one embodiment.
Representatively, evaporator portion 220 includes a base 222. In
one embodiment, base 222 of evaporator portion 220 may include an
enhanced boiling structure 230. In one embodiment, the enhanced
boiling structure is, for example, a uniform thin film of porous
coating, a mesh structure, an extended surface structure or a like
material to enhance the ability of evaporator portion 220 to boil a
liquid 234 contained within evaporator portion 220.
[0026] Representatively, when evaporator portion 220 is placed over
heat source 204, liquid 234 within evaporator portion 220 is
converted into vapor 232. Vapor 232 then rises from evaporator
portion 220 into condenser portion 240 of thermosiphon 210. Hence,
in one embodiment, thermosiphon 210 operates as a wickless heatpipe
that relies on gravity, rather than the capillary forces of a wick,
to return condensate (liquid) 234 to evaporator portion 220.
Unfortunately, in normal operation, heat source 204 may eventually
deplete liquid within evaporator portion 220 unless the temperature
of condenser portion 240 is properly regulated.
[0027] In one embodiment, as illustrated in FIG. 3, thermoelectric
elements, referred to herein as thermoelectric coolers (TEC) 270
(270-1, 270-2, 270-3, 270-4), are attached to opposed surfaces of
first condenser arm 244 and second condenser arm 246. For example,
TEC 270-4 includes unexposed surface 274-4 coupled to a surface of
first condenser arm 244. As also illustrated, TEC 270-2 is coupled
to an opposed surface of first condenser arm 244. TEC 270-1 and TEC
270-3 are coupled to opposed surfaces of second condenser arm 246.
Hence, vapor generated from boiling liquid 234 within evaporator
portion 220 causes first condenser arm 244 and second condenser
arms 246 to heat, which causes the unexposed surfaces (e.g. 272-2,
272-1, 274-4 and 274-3) of the TEC 270 to heat.
[0028] In one embodiment, TEC 270 are solid state refrigeration
units. In one embodiment, TEC 270 may be powered by an electrical
current, which causes the transfer of heat from a first surface
(e.g., 272) of TEC 270 to an opposed surface (e.g., 274) of TEC
270. Accordingly, heat from a surface of first condenser arm 244
and second condenser arm 246 is absorbed by unexposed surfaces of
TEC 270 and transferred to the exposed surfaces of TEC 270. As a
result, the unexposed surfaces of TEC 270 cool condenser portion
240 of thermosiphon 210.
[0029] Accordingly, in one embodiment, by providing electrical
current to TEC 270, TEC 270 dissipates heat from a surface of the
respective condenser arm (244 and 246) and transfers or transmits
that heat to an unexposed surface (e.g., 272-4) of TEC 270. As a
result, heat within first condenser arm 244 and second condenser
arm 246, as well as base 242 of condenser portion 240 is
dissipated. In other words, a temperature within condenser portion
240 of thermosiphon 210 is reduced. As a result, vapor 232 within
first condenser arm 244 and second condenser arm 246 is caused to
return to its liquid form 234 and once again occupy base 222 of
evaporator portion 220, as illustrated in FIG. 4.
[0030] In a further embodiment, fins 260 (260-1, 260-2, 260-3) are
coupled to exposed surfaces of TEC 270. As illustrated in FIG. 3,
fins 260-2 are coupled to exposed surface 274-1 of TEC 270-1.
Likewise, fins 260-2 are also coupled to exposed surface 274-2 of
TEC 270-2. As illustrated in FIG. 2, fins 260-2 are coupled to TEC
270-2 and 270-1 between first condenser arm 244 and second
condenser arm 246. As further illustrated in FIG. 3, fins 260-3 are
coupled to exposed surface 272-4 of TEC 270-4. Likewise, fins 260-1
are coupled to exposed surface 272-3 of TEC 270-3.
[0031] Representatively, fins 260 dissipate heat from exposed
surfaces of TEC 270. In one embodiment, air may be blown through
fins 260 in order to cool exposed surfaces of TEC 220. As such, the
room temperature air assists in dissipating heat from remote heat
exchanger 250, resulting in an overall decrease in the temperature
of thermosiphon 210. As a result, an operating temperature of fluid
234 within thermosiphon 210 is reduced. However, in contrast to
conventional systems, in one embodiment, as illustrated in FIGS. 5A
and 5B, remote heat exchanger portion 250 of cooling system 200 is
placed outside a computer server chassis.
[0032] Accordingly, as illustrated with reference to FIG. 5A, 1U
server computer system 300 incorporates cooling system 200, wherein
remote heat exchanger portion 250 is placed outside 1U server
chassis 310. In the embodiment described, the term "remote heat
exchanger" may also collectively refer to first condenser arm 244
and second condenser arm 246, TEC 270 and fins 260.
Representatively, remote heat exchanger 250 may be blown with air
that is provided via duct 330 from fan/blower 320.
[0033] Accordingly, in the embodiment illustrated in FIGS. 5A and
5B, cooling system 200 uses room temperature air to cool exposed
surfaces of TEC 270. Representatively, such room or ambient
temperature air is not preheated by either server computer
components and hence, provides an enhanced ability to dissipate
heat transferred from first condenser arm 244 and second condenser
arm 246 to exposed surfaces of TECs 270. Conversely, evaporator
portion 220 is placed within 1U server 310 and coupled to 1U
processor 110 via attachment base 202. Procedural methods for
implementing embodiments of the invention are described below.
[0034] Operation
[0035] FIG. 6 is a flowchart illustrating a method 400 for cooling
a heat source using a cooling system, in accordance with one
embodiment. Accordingly, in one embodiment, as illustrated with
reference to FIGS. 2-5B, the heat source described is a one rack
unit (1U) processor. However, as will be recognized by those
skilled in the art, the cooling system described herein may be
applied to reduce heat within virtually any component of a computer
system, including any integrated or on-die circuits.
[0036] Representatively, at process block 402, a liquid within an
evaporator portion of a thermosiphon is boiled to form a vapor
using heat from a heat source. At process block 420, heat from a
surface of a condenser portion of the thermosiphon is transferred
to exposed surfaces of one or more thermoelectric elements to
reduce a temperature of the condenser portion of the thermosiphon.
At process block 470, the exposed surfaces of the one or more
thermoelectric elements are subject to room temperature, blown air
to dissipate heat from the heat source.
[0037] FIG. 7 is a flowchart illustrating a method 410 for boiling
the liquid within an evaporator portion of the thermosiphon of
process block 402 of FIG. 6, in accordance with one embodiment. At
process block 412, an enhanced boiling structure at a base of the
evaporator portion of a thermosiphon is heated using, for example,
heat from a 1U processor. At process block 414, liquid within the
evaporator portion of the thermosiphon is evaporated to cause vapor
to occupy a condenser portion of the thermosiphon. At process block
416, the surface of the condenser portion is heated by the vapor to
cause unexposed surfaces of the one or more thermoelectric elements
to absorb the heat from the surface of the condenser portion of the
thermosiphon.
[0038] FIG. 8 is a flowchart illustrating a method 430 for
transferring heat from an unexposed surface to an exposed surface
of a thermoelectric element or cooler (TEC). At process block 432,
the one or more TECs are powered. At process block 434, each
respective TEC transmits heat from an unexposed surface of each
respective TEC to an exposed surface of the respective TEC. At
process block 436, a temperature of the condenser portion of the
thermosiphon is reduced by cooling the condenser portion within an
unexposed surface of the TECs. At process block 438, an operating
temperature of fluid within the evaporator portion of a
thermosiphon is also decreased.
[0039] FIG. 9 is a flowchart illustrating a method 450 for
transferring heat from the unexposed to the exposed portions of
TECs, in accordance with one embodiment. At process block 452, a
temperature within the condenser portion of the thermosiphon is
reduced. At process block 454, vapor within the condenser portion
the thermosiphon is converted into a liquid. At process block 456,
liquid occupying the evaporator portion of the thermosiphon is
prohibited from completely evaporating. Hence, by using TEC 270, a
thermosiphon cooling system, in accordance with embodiments
described, continues to perform efficient dissipation of heat from
heat source 204, for example, as illustrated with reference to FIG.
4.
[0040] Accordingly, by using a cooling system including a
thermosiphon with an enhanced boiling structure, the heat from a 1U
processor is used to evaporate fluid within the evaporator portion
of the thermosiphon. The vapor expands and moves into the condenser
part of the thermosiphon where the TECs are attached. By using
optimum input power into the TECs, the condenser temperature is
lowered by a greater amount than would be achieved without the TECs
to cause the vapor to return to liquid form and repeat the cycle.
As a result, the operating temperature of the fluid in the
thermosiphon is decreased. In turn, the sink temperature of the
evaporator portion is decreased, thus prohibiting any ambient
resistance.
Alternate Embodiments
[0041] It will be appreciated that, for other embodiments, a
different system configuration may be used. For example, while the
system 300 includes a single 1U CPU 110, for other embodiments, a
multiprocessor system (where one or more processors may be similar
in configuration and operation to the CPU 110 described above) may
benefit from the cooling system of various embodiments. Further
different type of system or different type of computer system such
as, for example, a server, a workstation, a desktop computer
system, a gaming system, an embedded computer system, a blade
server, etc., may be cooled using one of the above-described
embodiments.
[0042] Having disclosed exemplary embodiments and the best mode,
modifications and variations may be made to the disclosed
embodiments while remaining within the scope of the embodiments of
the invention as defined by the following claims.
* * * * *