Patent | Date |
---|
High performance transient uniform cooling solution for thermal compression bonding process Grant 9,943,931 - Li , et al. April 17, 2 | 2018-04-17 |
Direct air impingement cooling of package structures Grant 9,612,060 - Sauciuc April 4, 2 | 2017-04-04 |
Hybrid heat exchanger Grant 9,588,554 - Hood, III , et al. March 7, 2 | 2017-03-07 |
High Performance Transient Uniform Cooling Solution For Thermal Compression Bonding Process App 20170014957 - Li; Zhihua ;   et al. | 2017-01-19 |
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same Grant 9,448,278 - Schroeder , et al. September 20, 2 | 2016-09-20 |
High performance transient uniform cooling solution for thermal compression bonding process Grant 9,434,029 - Li , et al. September 6, 2 | 2016-09-06 |
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same Grant 9,347,987 - Schroeder , et al. May 24, 2 | 2016-05-24 |
Low profile heat spreader and methods Grant 9,293,428 - Sauciuc March 22, 2 | 2016-03-22 |
Direct Liquid-contact Micro-channel Heat Transfer Devices, Methods Of Temperature Control For Semiconductive Devices, And Processes Of Forming Same App 20150285857 - SCHROEDER; Christopher R. ;   et al. | 2015-10-08 |
Transient thermal management systems for semiconductor devices Grant 9,142,482 - Ahuja , et al. September 22, 2 | 2015-09-22 |
Battery Power Management For Electronic Device App 20140281590 - SAUCIUC; IOAN ;   et al. | 2014-09-18 |
Low Profile Heat Spreader And Methods App 20140160673 - Sauciuc; Ioan | 2014-06-12 |
Transient Thermal Management Systems For Semiconductor Devices App 20130329358 - Ahuja; Sandeep ;   et al. | 2013-12-12 |
High Performance Transient Uniform Cooling Solution For Thermal Compression Bonding Process App 20130299133 - Li; Zhihua ;   et al. | 2013-11-14 |
Direct Air Impingment Cooling Of Package Structures App 20130248153 - Sauciuc; Ioan | 2013-09-26 |
Hybrid Heat Exchanger App 20130232995 - Hood, III; Charles D. ;   et al. | 2013-09-12 |
Hybrid heat exchanger Grant 8,453,467 - Hood, III , et al. June 4, 2 | 2013-06-04 |
Method and apparatus for two-phase start-up operation Grant 8,333,569 - Sauciuc , et al. December 18, 2 | 2012-12-18 |
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same App 20110109335 - Schroeder; Christopher R. ;   et al. | 2011-05-12 |
Electrically conductive fluid interconnects for integrated circuit devices Grant 7,939,945 - Sauciuc , et al. May 10, 2 | 2011-05-10 |
Microelectronic cooling apparatus and associated method Grant 7,795,711 - Sauciuc , et al. September 14, 2 | 2010-09-14 |
Compact rake piezoelectric assembly and method of manufacturing same Grant 7,786,654 - Sauciuc August 31, 2 | 2010-08-31 |
Localized microelectronic cooling apparatuses and associated methods and systems Grant 7,779,638 - Sauciuc , et al. August 24, 2 | 2010-08-24 |
Electromagnetically-actuated micropump for liquid metal alloy Grant 7,764,499 - Sauciuc , et al. July 27, 2 | 2010-07-27 |
Cooling solutions for die-down integrated circuit packages Grant 7,755,186 - Chiu , et al. July 13, 2 | 2010-07-13 |
Cooling arrangement to cool components on circuit board Grant 7,751,189 - Ahuja , et al. July 6, 2 | 2010-07-06 |
Piezo fans for cooling an electronic device Grant 7,742,299 - Sauciuc , et al. June 22, 2 | 2010-06-22 |
Heatsink, method of manufacturing same, and microelectronic package containing same Grant 7,692,922 - Leija , et al. April 6, 2 | 2010-04-06 |
Piezoelectric fan, method of cooling a microelectronic device using same, and system containing same App 20100047092 - Erturk; Hakan ;   et al. | 2010-02-25 |
Dual direction rake piezo actuator Grant 7,642,698 - Leija , et al. January 5, 2 | 2010-01-05 |
Piezo actuator for cooling Grant 7,638,928 - Palanduz , et al. December 29, 2 | 2009-12-29 |
Piezoelectric air jet augmented cooling for electronic devices Grant 7,633,753 - Sauciuc , et al. December 15, 2 | 2009-12-15 |
Piezo Fans For Cooling An Electronic Device App 20090279255 - Sauciuc; Ioan ;   et al. | 2009-11-12 |
Electrically Conductive Fluid Interconnects For Integrated Circuit Devices App 20090273083 - Sauciuc; Ioan ;   et al. | 2009-11-05 |
Compact Rake Piezoelectric Assembly And Method Of Manufacturing Same App 20090230819 - Sauciuc; Ioan | 2009-09-17 |
Piezoelectric Air Jet Augmented Cooling For Electronic Devices App 20090174999 - Sauciuc; Ioan ;   et al. | 2009-07-09 |
Cooling solutions for die-down integrated circuit packages App 20090166855 - Chiu; Chia-Pin ;   et al. | 2009-07-02 |
Heat sink with thermoelectric module Grant 7,554,808 - Scott , et al. June 30, 2 | 2009-06-30 |
Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same Grant 7,550,901 - Chrysler , et al. June 23, 2 | 2009-06-23 |
Integrated Circuit Assembly Including Thermal Interface Material Comprised Of Oil Or Wax App 20090152713 - Sauciuc; Ioan ;   et al. | 2009-06-18 |
Multi-layer piezoelectric actuators with conductive polymer electrodes Grant 7,538,476 - Chrysler , et al. May 26, 2 | 2009-05-26 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls Grant 7,539,016 - Sauciuc , et al. May 26, 2 | 2009-05-26 |
Flow solutions for microelectronic cooling Grant 7,532,476 - Sauciuc May 12, 2 | 2009-05-12 |
Microelectronic Assembly And Method Of Preparing Same App 20090096087 - Sauciuc; Ioan ;   et al. | 2009-04-16 |
Piezoelectric Fan, Cooling Device Containing Same, And Method Of Cooling A Microelectronic Device Using Same App 20090085438 - Chrysler; Gregory M. ;   et al. | 2009-04-02 |
Loading Mechanism For Bare Die Packages And Lga Socket App 20090085187 - Scott; Ward ;   et al. | 2009-04-02 |
Enabling Bare Die Liquid Cooling For The Bare Die And Hot Spots App 20090084931 - Sauciuc; Ioan ;   et al. | 2009-04-02 |
Loading mechanisms for integrated circuit (IC) packages Grant 7,510,418 - Scott , et al. March 31, 2 | 2009-03-31 |
Cooling Arrangement to Cool Components on Circuit Board App 20090080156 - Ahuja; Sandeep ;   et al. | 2009-03-26 |
Computer system having controlled cooling Grant 7,508,671 - Sauciuc , et al. March 24, 2 | 2009-03-24 |
Method and apparatus for dissipating heat from an electronic device Grant 7,499,278 - Sauciuc , et al. March 3, 2 | 2009-03-03 |
Heatsink, Method Of Manufacturing Same, And Microelectronic Package Containing Same App 20090034197 - Leija; Javier ;   et al. | 2009-02-05 |
Piezoelectric Fan, Method Of Cooling A Microelectronic Device Using Same, And System Containing Same App 20090026881 - Erturk; Hakan ;   et al. | 2009-01-29 |
Interconnect Using Liquid Metal App 20090001576 - Tuli; Surinder ;   et al. | 2009-01-01 |
Method and system to cool memory Grant 7,457,116 - Erturk , et al. November 25, 2 | 2008-11-25 |
Dual direction rake piezo actuator App 20080238256 - Leija; Javier ;   et al. | 2008-10-02 |
Multi-layer Piezoelectric Actuators With Conductive Polymer Electrodes App 20080238248 - Chrysler; Gregory M. ;   et al. | 2008-10-02 |
Cooling device, system containing same, and cooling method App 20080218972 - Sauciuc; Ioan ;   et al. | 2008-09-11 |
Method and system to cool memory App 20080158812 - Erturk; Hakan ;   et al. | 2008-07-03 |
Active condensation enhancement for alternate working fluids App 20080142195 - Erturk; Hakan ;   et al. | 2008-06-19 |
Application and removal of thermal interface material Grant 7,367,195 - Sauciuc , et al. May 6, 2 | 2008-05-06 |
Hybrid heat exchanger App 20080087024 - Hood; Charles D. ;   et al. | 2008-04-17 |
Heat dissipating device with enhanced boiling/condensation structure Grant 7,353,860 - Erturk , et al. April 8, 2 | 2008-04-08 |
Liquid metal thermal interface for an integrated circuit device Grant 7,348,665 - Sauciuc , et al. March 25, 2 | 2008-03-25 |
Method and apparatus for removing heat Grant 7,340,904 - Sauciuc , et al. March 11, 2 | 2008-03-11 |
Heat dissipating device with enhanced boiling/condensation structure Grant 7,327,572 - Erturk , et al. February 5, 2 | 2008-02-05 |
Rake shaped fan Grant 7,321,184 - Lee , et al. January 22, 2 | 2008-01-22 |
Preventing burst-related hazards in microelectronic cooling systems App 20080006389 - Sauciuc; Ioan ;   et al. | 2008-01-10 |
Flow solutions for microelectronic cooling App 20080002359 - Sauciuc; Ioan | 2008-01-03 |
Heat sink with themoelectric module App 20070297139 - Scott; Brian A. ;   et al. | 2007-12-27 |
Integrated Circuit Coolant Microchannel With Compliant Cover App 20070230116 - Myers; Alan M. ;   et al. | 2007-10-04 |
Integrated Circuit Coolant Microchannel Assembly With Targeted Channel Configuration App 20070217147 - Chang; Je-Young ;   et al. | 2007-09-20 |
Cooling integrated circuits using a cold plate with two phase thin film evaporation Grant 7,265,979 - Erturk , et al. September 4, 2 | 2007-09-04 |
Integrated circuit coolant microchannel assembly with targeted channel configuration Grant 7,259,965 - Chang , et al. August 21, 2 | 2007-08-21 |
Wireless device enclosure using piezoelectric cooling structures Grant 7,248,475 - Paydar , et al. July 24, 2 | 2007-07-24 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls App 20070164427 - Sauciuc; Ioan ;   et al. | 2007-07-19 |
Integrated circuit coolant microchannel with compliant cover Grant 7,243,705 - Myers , et al. July 17, 2 | 2007-07-17 |
Localized microelectronic cooling apparatuses and associated methods and systems App 20070144182 - Sauciuc; Ioan ;   et al. | 2007-06-28 |
Microelectronic cooling apparatus and associated method App 20070090518 - Sauciuc; Ioan ;   et al. | 2007-04-26 |
Application and removal of thermal interface material App 20070068173 - Sauciuc; Ioan ;   et al. | 2007-03-29 |
Rake shaped fan App 20070037506 - Lee; Seri ;   et al. | 2007-02-15 |
Heat dissipating device with enhanced boiling/condensation structure App 20070035927 - Erturk; Hakan ;   et al. | 2007-02-15 |
High pressure pump for cooling electronics App 20070020107 - Sauciuc; Ioan ;   et al. | 2007-01-25 |
Piezo actuator for cooling App 20070001550 - Palanduz; Cengiz A. ;   et al. | 2007-01-04 |
Wireless device enclosure using piezoelectric cooling structures App 20060268534 - Paydar; Reza ;   et al. | 2006-11-30 |
Thermal solution with isolation layer App 20060256531 - Sauciuc; Ioan ;   et al. | 2006-11-16 |
Integrated circuit coolant microchannel assembly with targeted channel configuration App 20060226539 - Chang; Je-Young ;   et al. | 2006-10-12 |
Integrated circuit coolant microchannel with compliant cover App 20060196646 - Myers; Alan M. ;   et al. | 2006-09-07 |
Heatsink device and method Grant 7,082,031 - Leija , et al. July 25, 2 | 2006-07-25 |
Apparatus and associated method for microelectronic cooling App 20060131003 - Chang; Je-Young ;   et al. | 2006-06-22 |
Method and apparatus for removing heat App 20060090474 - Sauciuc; Ioan ;   et al. | 2006-05-04 |
Thin film evaporation heat dissipation device that prevents bubble formation App 20060090882 - Sauciuc; Ioan | 2006-05-04 |
Electronic thermal management Grant 7,031,155 - Sauciuc , et al. April 18, 2 | 2006-04-18 |
Liquid metal thermal interface for an integrated circuit device App 20060033205 - Sauciuc; Ioan ;   et al. | 2006-02-16 |
Condensation accumulation removal apparatus and method App 20060028800 - Chrysler; Gregory M. ;   et al. | 2006-02-09 |
Method and apparatus for dissipating heat from an electronic device App 20060005948 - Sauciuc; Ioan ;   et al. | 2006-01-12 |
Thermoelectric module App 20060000500 - Sauciuc; Ioan ;   et al. | 2006-01-05 |
Cooling integrated circuits using a cold plate with two phase thin film evaporation App 20050286227 - Erturk, Hakan ;   et al. | 2005-12-29 |
Heat dissipating device with enhanced boiling/condensation structure App 20050280996 - Erturk, Hakan ;   et al. | 2005-12-22 |
Method and apparatus for dissipating heat from an electronic device Grant 6,971,442 - Sauciuc , et al. December 6, 2 | 2005-12-06 |
Clearing of vapor lock in a microchannel cooling subsystem Grant 6,967,840 - Chrysler , et al. November 22, 2 | 2005-11-22 |
Clearing Of Vapor Lock In A Microchannel Cooling Subsystem App 20050219816 - Chrysler, Gregory M. ;   et al. | 2005-10-06 |
Apparatus and method for cooling integrated circuit devices Grant 6,917,522 - Erturk , et al. July 12, 2 | 2005-07-12 |
Method and apparatus for two-phase start-up operation App 20050147500 - Sauciuc, Ioan ;   et al. | 2005-07-07 |
Apparatus And Method For Cooling Integrated Circuit Devices App 20050141197 - Erturk, Hakan ;   et al. | 2005-06-30 |
Computer system having controlled cooling App 20050078451 - Sauciuc, Ioan ;   et al. | 2005-04-14 |
Heatsink device and method App 20050068737 - Leija, Javier ;   et al. | 2005-03-31 |
Heat pipe having an inner retaining wall for wicking components Grant 6,868,898 - Chau , et al. March 22, 2 | 2005-03-22 |
Phase-change refrigeration apparatus with thermoelectric cooling element and methods Grant 6,845,622 - Sauciuc , et al. January 25, 2 | 2005-01-25 |
Application and removal of thermal interface material App 20040261988 - Sauciuc, Ioan ;   et al. | 2004-12-30 |
Electronic thermal management App 20040253130 - Sauciuc, Ioan ;   et al. | 2004-12-16 |
Heat pipe having an inner retaining wall for wicking components App 20040188067 - Chau, David S. ;   et al. | 2004-09-30 |
Phase-change refrigeration apparatus with thermoelectric cooling element and methods App 20040187501 - Sauciuc, Ioan ;   et al. | 2004-09-30 |
Method and apparatus for dissipating heat from an electronic device App 20030205364 - Sauciuc, Ioan ;   et al. | 2003-11-06 |
Tunnel-phase change heat exchanger Grant 6,609,561 - Sauciuc , et al. August 26, 2 | 2003-08-26 |
Tunnel-phase Change Heat Exchanger App 20030116302 - Sauciuc, Ioan ;   et al. | 2003-06-26 |
Heat Sink And Electronic Circuit Module Including The Same App 20030062151 - Sauciuc, Ioan ;   et al. | 2003-04-03 |