U.S. patent application number 10/677317 was filed with the patent office on 2005-04-07 for heat sink structure.
Invention is credited to Wang, Chin Wen, Wang, Ching Chung, Wang, Pei Choa.
Application Number | 20050072563 10/677317 |
Document ID | / |
Family ID | 34393696 |
Filed Date | 2005-04-07 |
United States Patent
Application |
20050072563 |
Kind Code |
A1 |
Wang, Chin Wen ; et
al. |
April 7, 2005 |
Heat sink structure
Abstract
An improved heat sink structure, having a heat dissipating
member and a board member on which the heat dissipating member is
mounted. The board member has an upper board and a lower board. A
plurality of recessed connecting structures is formed on the top
surface of the upper board. The heat dissipating member has a
plurality of fins and air circulating channels between the fins. A
plurality of protruding embedding structures is formed on the
bottom of the fins, such that the heat dissipating member can be
secured to the top surface by the connecting parts and the
inserting parts. Thereby, the heat dissipating member can be
secured to the board member as an integral unit. The structure
strength, attachment and conducting performance can thus be
enhanced.
Inventors: |
Wang, Chin Wen; (Pingjhen
City, TW) ; Wang, Pei Choa; (Pingjhen City, TW)
; Wang, Ching Chung; (Pingjhen City, TW) |
Correspondence
Address: |
Yi-Wen Tseng
509 ROOSEVELT BLVD. #D306
FALLS CHURCH
VA
22044
US
|
Family ID: |
34393696 |
Appl. No.: |
10/677317 |
Filed: |
October 3, 2003 |
Current U.S.
Class: |
165/185 ;
257/E23.088; 257/E23.099 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/427
20130101; H01L 23/467 20130101; F28F 3/02 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 007/00 |
Claims
What is claimed is:
1. An improved heat dissipating structure, comprising a heat
dissipating member and a board member, wherein the board member
includes an upper board and a lower board, and the upper board
includes a plurality of recessed connecting structures formed on a
top surface thereof, the heat dissipating member includes a
plurality of fins parallel to and spaced with each other to form a
plurality of air circulating channels, each of the fins includes an
embedding part along a bottom edge thereof engageable with the
connecting structure to securely mount the heat dissipating
structure on the board member.
2. The heat dissipating structure according to claim 1, wherein the
upper board includes a hollow cuboid with an open bottom.
3. The heat dissipating structure according to claim 1, wherein the
lower board includes a hollow cuboid with an open top.
4. The heat dissipating structure according to claim 1, wherein the
upper board is made of aluminum or copper.
5. The heat dissipating structure according to claim 1, wherein the
lower board is made of aluminum or copper.
6. The heat dissipating structure according to claim 1, wherein the
recessed connecting structures include dovetail slots.
7. The heat dissipating structure according to claim 1, wherein the
recessed connecting structures include rectangular slots.
8. The heat dissipating structure according to claim 1, wherein the
heat dissipating member includes an aluminum-extruded heat
sink.
9. The heat dissipating structure according to claim 1, wherein the
heat dissipating member includes a stack-type heat sink.
10. The heat dissipating structure according to claim 1, further
comprising a fan mounted on the heat dissipating member.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to an improved heat sink
structure, and more particularly, to an improved heat sink
structure with enhanced attachment and thermal conducting
performance applied to a computer central processing unit (CPU) or
other electronic heat generating device.
[0002] The fast development of computer related products such as
hard disk, interface card, and central processing unit has greatly
increased the amount of data being processed in logic operation and
the operation speed. Consequently, the operating temperature of the
internal devices of personal computer and integrated circuit device
is increased. Without appropriately heat dissipation, operation of
these devices are will be seriously affected to cause degradation
in operation speed or lifetime. However, currently, most of the
manufacturers have been focusing on how to enlarge the fan and
increase the heat dissipating area to enhance heat dissipation
efficiency. The important task of how to securely attach the board
member with the heat sink has not been intensively reported and
developed yet.
[0003] The conventional heat sink structure uses thermal conductive
paste or soldering to attach two contact surfaces. The thermal
conductive paste includes silver paste with thermal conductivity at
about 10 W/Mk, which is far inferior to that thermal conductivity
of aluminum at about 237 W/Mk. Therefore, thermal conduction cannot
be efficiently enhanced. On the contrary, the thermal conductive
paste becomes a barrier for heat conduction. Further, bubbles are
easily formed while applying the thermal conductive paste. Such
bubbles become the heat accumulating area to block the circulating
of heat towards the heat sink. As a result, the devices may be
damaged for being overheated. Some of the thermal conductive paste
is melted when the temperature of the electronic device rises up to
a certain degree. The liquid thermal conductive paste is likely to
damage the electronic device.
[0004] With regard to soldering connection, aluminum and copper are
typically used for fabricating heat dissipating member and board
member respectively, under the consideration of cost and weight.
However, as the thermal expansion coefficients for aluminum and
copper are different. The contact surfaces are easily deformed or
detached from each other to degrade the heat dissipation
effect.
BRIEF SUMMARY OF THE INVENTION
[0005] The present invention provides an improved heat sink
structure. By forming embedding structures on the heat dissipating
member and recessed connection structures on the board member, the
heat dissipating member can be securely attached to the board
member, such that the overall structure strength is enhanced, and
the thermal conduction is improved.
[0006] The improved heat sink structure provided by the present
invention comprises a heat dissipating member and a board member.
The heat dissipating member is mounted on board member. The board
member includes an upper board and a lower member. A plurality of
recessed connection structures is formed in the top surface of the
upper board. The heat dissipating member includes a plurality of
fins and a plurality of heat circulating channels between the fins.
The heat dissipating member further comprises a plurality of
protruding embedding structures formed on the bottom of the fins.
The embedding structures are engageable with the connection
structures to securely mount the heat dissipating member on the
board member.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] These, as well as other features of the present invention,
will become apparent upon reference to the drawings wherein:
[0008] FIG. 1 shows an exploded view of an improved heat sink
structure provided by the present invention;
[0009] FIG. 2 shows the assembly of the improved heat sink
structure;
[0010] FIG. 3 shows a cross sectional view of the improved heat
sink structure;
[0011] FIG. 4 shows the improved heat sink structure and a fan;
and
[0012] FIG. 5 shows the operation status of the improved heat
sink.
DETAILED DESCRIPTION OF THE INVENTION
[0013] FIGS. 1-3 show the exploded view, the assembly and the
cross-sectional view of an improved heat sink structure provided by
the present invention. As shown, the improved heat sink structure
includes a board member 10 and a heat dissipating member 20.
[0014] The board member 10 is preferably fabricated from materials
with good thermal conductivity such as aluminum or copper. The
board member 10 includes an upper board 11 and a lower board 12
stacked with each other.
[0015] The board member 10 is preferably made of materials with
good thermal conductivity such as aluminum or copper. The board
member 10 comprises an upper board 11 and a lower board 12. The
upper and lower boards 11 and 12 include hollow cuboids with an
open bottom and an open top thereof. As shown, the upper board 11
is stacked over the lower board 12 to form a cavity therebetween.
Wick structure and working fluid are preferably formed and
introduced in the cavity to achieve high thermal conducting
efficiency. Thereby, the heat source can be instantly dissipated
away from the heat generating area.
[0016] In the present invention, the top surface of the upper board
11 has a plurality of connecting parts 111. Each of the connecting
parts 111 includes a recessed dovetail slot, rectangular slot or
other geometric slots. In this embodiment, three dovetail slots are
formed in two opposing ends and the middle of the top surface, and
a plurality of rectangular slots are formed between the middle and
the opposing ends.
[0017] The heat dissipating member 20 is an aluminum extruded heat
sink or a stack-type heat sink. The heat dissipating member 20
includes a pair of elongate frame members 22 parallel to each other
to construct two opposing sides of the heat dissipating member 20.
The heat dissipating member 20 further comprises a plurality of
fins 24 extending transversely from the bottom surface of one frame
member 22 to that of the other frame member 22. Preferably, the top
ends of each pin 24 are permanently attached to the bottom surfaces
frames 22. As shown, as the fins 24 extend between the bottom
surfaces of the frame member 22, the top edges of the fins 24 are
thus recessed from the frame members 22 to form a recessed slot 21.
A plurality of threaded holes 23 are formed on top surfaces of the
frame members 22. The fins 24 are parallel to and spaced with each
other by an air circulating channel 25. Therefore, from a top
viewing angle, the recessed slot 21 comprises a plurality of ridges
(the top edges of the fins 24) spaced with each other by a
plurality of channels (the air circulating channels 25). The
formation of the air circulating channels 25 provide paths for heat
to circulate upwardly and cold air to flow downwardly. The bottom
edges of the fins 24 are processed with embedding parts 26
engageable with the connecting parts 111 of the upper board 11. By
engaging the embedding parts 26 with the connecting parts 111, the
heat dissipating member 20 is thus securely mounted to the board
member 10 as shown in FIG. 3.
[0018] The attachment between the board member 10 and the heat
dissipating member 20 can be a cold processing. Wick structure and
working fluid can be introduced into a cavity formed between the
upper board 11 and the lower board. The board member 10 is then
held by holding clamp while the heat dissipating member 20 is
attached thereto by embedding the embedding parts 26 into the
connecting parts 111 of the upper board 11. Minor adjustment is
then made to secure the connection.
[0019] As shown in FIG. 4, a fan 30 can be mounted on the heat
dissipating member 20. As shown, a hole 31 is formed through each
corner thereof. The hole 31 is aligned with the threaded holes 23
formed in the frame members 22. Fasteners such as screws can then
be used to fasten the fan 30 on top of the heat dissipating member
20.
[0020] FIG. 5 illustrates an operation status of the heat
dissipating structure as described above. The heat dissipating
structure is applied to a central processing unit of a motherboard.
As shown, the bottom surface of the board member 20 is attached to
the central processing unit. When heat is generated by the central
processing unit, the wick structure and working fluid instantly
conduct the heat from the central processing unit to the fins 24 of
the heat dissipating member 20. Meanwhile, the fan is operating to
blow cold air into the air circulating channels 25 to dissipate
heat accumulated in the fins 24.
[0021] Therefore, the present invention has at least the following
advantages.
[0022] 1. The connecting parts formed on the board member and the
embedding parts formed on the bottom edge of the fins provide a
secure attachment between the heat dissipating member and the board
member and increase contact area between the fins and the board
member. Therefore, the contact strength is increased, while the
heat conductivity is improved.
[0023] 2. The cold process applied to the board member and the heat
dissipating member avoids oxidation and deformation of the
soldering surfaces caused by post processes such as acid cleaning
and reformation. The cost is thus reduced.
[0024] 3. The wick structure and working fluid introduced within
the board member has low thermal resistance and high thermal
conductivity. Therefore, heat can instantly dissipated from the
source allowing the heat generating device to operate under a
uniform temperature.
[0025] This disclosure provides exemplary embodiments of the
present invention. The scope of this disclosure is not limited by
these exemplary embodiments. Numerous variations, whether
explicitly provided for by the specification or implied by the
specification, such as variations in shape, structure, dimension,
type of material or manufacturing process may be implemented by one
of skill in the art in view of this disclosure.
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