loadpatents
Patent applications and USPTO patent grants for Wang; Pei-Choa.The latest application filed is for "light source module and led street lamp using the same".
Patent | Date |
---|---|
Waterproof assembly of LED lamp cup Grant 8,033,687 - Wang October 11, 2 | 2011-10-11 |
Light Source Module And Led Street Lamp Using The Same App 20110007505 - WANG; Pei-Choa | 2011-01-13 |
Led Illumination Device App 20100327723 - WANG; Pei-Choa | 2010-12-30 |
Waterproof Assembly Of Led Lamp Cup App 20100328960 - WANG; Pei-Choa | 2010-12-30 |
Combination Structure Of Led Lighting Device App 20100232155 - WANG; Pei-Choa | 2010-09-16 |
LED lamp with heat dissipation mechanism and multiple light emitting faces Grant 7,789,534 - Wang September 7, 2 | 2010-09-07 |
Structure of LED of high heat-conducting efficiency Grant 7,772,610 - Wang August 10, 2 | 2010-08-10 |
Structure of tag integrated circuit flexible board Grant 7,705,461 - Wang April 27, 2 | 2010-04-27 |
Packaging method of LED of high heat-conducting efficiency and structure thereof Grant 7,700,386 - Wang April 20, 2 | 2010-04-20 |
Light Emitting Diode Lighting Set App 20100027263 - WANG; Pei-Choa | 2010-02-04 |
Lamp Base Improvement Of A Street Lamp App 20090323343 - WANG; Pei-Choa | 2009-12-31 |
Switching Led Driver Circuit App 20090302778 - Wang; Pei-Choa | 2009-12-10 |
Structure Of LED Of High Heat-Conducting Efficiency App 20090272987 - WANG; Pei-Choa | 2009-11-05 |
Heat-dissipating model Grant 7,610,947 - Wang , et al. November 3, 2 | 2009-11-03 |
LED lamp conducting structure with plate-type heat pipe Grant 7,549,772 - Wang June 23, 2 | 2009-06-23 |
Light source structure of backlight module Grant 7,517,126 - Wang April 14, 2 | 2009-04-14 |
LED illumination apparatus Grant 7,513,639 - Wang April 7, 2 | 2009-04-07 |
Method for manufacturing a tag integrated circuit flexible board Grant 7,504,320 - Wang March 17, 2 | 2009-03-17 |
Structure Of Tag Integrated Circuit Flexible Board App 20080310129 - WANG; Pei-Choa | 2008-12-18 |
Led Illumination Device App 20080298062 - WANG; Pei-Choa | 2008-12-04 |
Method For Manufacturing Tag Integrated Circuit Flexible Board And Structure Of The Same App 20080299360 - WANG; Pei-Choa | 2008-12-04 |
Method Of Bonding A Solder Type Light Emitting Diode Chip App 20080299688 - WANG; Pei-Choa | 2008-12-04 |
Packaging Method Of LED Of High Heat-Conducting Efficiency And Structure Thereof App 20080258157 - WANG; Pei-Choa | 2008-10-23 |
LED lamp device Grant 7,434,959 - Wang October 14, 2 | 2008-10-14 |
Led Lamp With Heat Dissipation Mechanism And Multiple Light Emitting Faces App 20080212325 - WANG; Pei-Choa | 2008-09-04 |
Focused Type Solar Plate Assembly Having Heat-dissipating Module App 20080185031 - Wang; Pei-Choa | 2008-08-07 |
Heat dissipating LED signal lamp source structure Grant 7,396,146 - Wang July 8, 2 | 2008-07-08 |
Light Source Structure Of Backlight Module App 20080158882 - Wang; Pei-Choa | 2008-07-03 |
LED Illumination Apparatus App 20080080189 - Wang; Pei-Choa | 2008-04-03 |
Quick Assembling Structure For Led Lamp And Heat Dissipating Module App 20080043478 - Wang; Pei-Choa | 2008-02-21 |
Assembling Structure For Led Road Lamp And Heat Dissipating Module App 20080043479 - Wang; Pei-Choa | 2008-02-21 |
Heat Dissipating LED Signal Lamp Source Structure App 20080037255 - Wang; Pei-Choa | 2008-02-14 |
Assembling structure for LED road lamp and heat dissipating module Grant 7,329,030 - Wang February 12, 2 | 2008-02-12 |
Quick assembling structure for LED lamp and heat dissipating module Grant 7,325,949 - Wang February 5, 2 | 2008-02-05 |
Arrangement of Light-Emitting Diodes Of LED Lamp App 20080019130 - Wang; Pei-Choa | 2008-01-24 |
LED lamp conducting structure with plate-type heat pipe App 20070236935 - Wang; Pei-Choa | 2007-10-11 |
Lamp with multiple light emitting faces App 20070230172 - Wang; Pei-Choa | 2007-10-04 |
LED lamp Grant D542,943 - Wang May 15, 2 | 2007-05-15 |
LED lamp Grant D542,425 - Wang May 8, 2 | 2007-05-08 |
LED lamp Grant D541,957 - Wang May 1, 2 | 2007-05-01 |
Heat-Dissipating Model App 20070079954 - Wang; Chin-Wen ;   et al. | 2007-04-12 |
Cooling energy saving structure App 20070022773 - Wang; Chin-Wen ;   et al. | 2007-02-01 |
Device for cooling light emitting diode projector App 20060290891 - Wang; Chin-Wen ;   et al. | 2006-12-28 |
Structure of heat conductive plate Grant 7,032,652 - Wang , et al. April 25, 2 | 2006-04-25 |
Supporting structure for planar heat pipe Grant 7,025,124 - Wang , et al. April 11, 2 | 2006-04-11 |
Structure of heat conductive plate App 20060005950 - Wang; Chin Wen ;   et al. | 2006-01-12 |
Cylindrical heat pipe structure App 20050274495 - Wang, Chin Wen ;   et al. | 2005-12-15 |
Large-area planar heat dissipation structure App 20050270741 - Wang, Chin Wen ;   et al. | 2005-12-08 |
Cooling module for electronic devices App 20050270743 - Wang, Chin Wen ;   et al. | 2005-12-08 |
Circulation structure of heat dissipation device App 20050189088 - Wang, Chin Wen ;   et al. | 2005-09-01 |
Planar heat pipe structure Grant 6,913,070 - Wang , et al. July 5, 2 | 2005-07-05 |
Supporting structure for planar heat pipe App 20050087327 - Wang, Chin Wen ;   et al. | 2005-04-28 |
Heat sink structure App 20050072563 - Wang, Chin Wen ;   et al. | 2005-04-07 |
Planar heat pipe structure App 20050045308 - Wang, Chin Wen ;   et al. | 2005-03-03 |
Uniform coating process of metal powder micro thin film App 20040253372 - Wang, Pei Choa | 2004-12-16 |
Flat type heat pipe with opening Grant 6,802,363 - Wang October 12, 2 | 2004-10-12 |
Tabular heat pipe structure having support bodies Grant 6,782,942 - Wang , et al. August 31, 2 | 2004-08-31 |
Hydronic pump type heat radiator Grant 6,702,002 - Wang March 9, 2 | 2004-03-09 |
Magnetic-levitated cooling circulatory mechanism Grant 6,638,033 - Wang October 28, 2 | 2003-10-28 |
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