U.S. patent application number 10/950532 was filed with the patent office on 2005-03-03 for semiconductor device and method for fabricating the same.
This patent application is currently assigned to Matsushita Electronics Corporation. Invention is credited to Ito, Toyoji, Izutsu, Yasufumi, Kutsunai, Toshie, Matsuda, Akihiro, Mikawa, Takumi, Nagano, Yoshihisa, Nakao, Keisaku, Nasu, Toru, Tanaka, Keisuke.
Application Number | 20050045990 10/950532 |
Document ID | / |
Family ID | 26510773 |
Filed Date | 2005-03-03 |
United States Patent
Application |
20050045990 |
Kind Code |
A1 |
Nakao, Keisaku ; et
al. |
March 3, 2005 |
Semiconductor device and method for fabricating the same
Abstract
The semiconductor device of the invention includes a capacitor
device, which is formed on a substrate and which includes a
capacitive lower electrode, a capacitive insulating film made of an
insulating metal oxide film and a capacitive upper electrode. An
interlevel insulating film having an opening reaching the
capacitive upper electrode is formed over the capacitor device. A
metal interconnection including a titanium film is formed over the
interlevel insulating film so as to be electrically connected to
the capacitive upper electrode through the opening. An
anti-diffusion film having conductivity is formed between the
capacitive upper electrode and the metal interconnection for
preventing titanium atoms composing the titanium film of the metal
interconnection from passing through the capacitive upper electrode
and diffusing into the capacitive insulating film.
Inventors: |
Nakao, Keisaku; (Kyoto,
JP) ; Matsuda, Akihiro; (Osaka, JP) ; Izutsu,
Yasufumi; (Kyoto, JP) ; Ito, Toyoji; (Shiga,
JP) ; Mikawa, Takumi; (Kyoto, JP) ; Nasu,
Toru; (Kyoto, JP) ; Nagano, Yoshihisa; (Osaka,
JP) ; Tanaka, Keisuke; (Shiga, JP) ; Kutsunai,
Toshie; (Osaka, JP) |
Correspondence
Address: |
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON
DC
20005-3096
US
|
Assignee: |
Matsushita Electronics
Corporation
Osaka
JP
|
Family ID: |
26510773 |
Appl. No.: |
10/950532 |
Filed: |
September 28, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10950532 |
Sep 28, 2004 |
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09797987 |
Mar 5, 2001 |
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6809000 |
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09797987 |
Mar 5, 2001 |
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09120893 |
Jul 23, 1998 |
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6239462 |
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Current U.S.
Class: |
257/532 ;
257/E21.009; 438/253 |
Current CPC
Class: |
H01L 28/55 20130101 |
Class at
Publication: |
257/532 ;
438/253 |
International
Class: |
H01L 021/8242; H01L
021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 24, 1997 |
JP |
9-198118 |
Jul 24, 1997 |
JP |
9-198119 |
Claims
1-15. (Cancelled)
16. A method for fabricating a semiconductor device, comprising the
steps of: sequentially stacking a first metal film, an insulating
metal oxide film, a second metal film and a conductive film, which
prevents the passage of titanium atoms therethrough, on a
substrate; patterning the second metal film and the conductive film
by using the same etching mask, thereby forming a capacitive upper
electrode out of the second metal film and an anti-diffusion film
out of the conductive film; patterning the insulating metal oxide
film to form a capacitive insulating film and patterning the first
metal film to form a capacitive lower electrode; forming an
interlevel insulating film, having a contact hole reaching the
capacitive upper electrode, over a capacitor device constituted by
the capacitive lower electrode, the capacitive insulating film and
the capacitive upper electrode; and forming, on the interlevel
insulating film, a metal interconnection including a titanium film
such that the metal interconnection is electrically connected to
the capacitive upper electrode via the anti-diffusion film.
17. The method for fabricating a semiconductor device of claim 16,
wherein the conductive film is a metal nitride film or metal oxide
film having conductivity.
18. The method for fabricating a semiconductor device of claim 16,
wherein the capacitive insulating film is a ferroelectric film or a
high dielectric film.
19. The method for fabricating a semiconductor device of claim 16,
wherein the titanium film is an adhesive layer, formed as a
lowermost layer of the metal interconnection, for improving
adhesion between the metal interconnection and the capacitive upper
electrode, and wherein the anti-diffusion film is a titanium
nitride film.
20. The method for fabricating a semiconductor device of claim 16,
wherein the capacitive upper electrode has a crystal structure
including a grain boundary.
21-25. (Cancelled)
Description
BACKGROUND OF THE INVENTION
[0001] The present invention generally relates to a semiconductor
device and a method for fabricating the same. More particularly,
the present invention relates to a semiconductor device including a
capacitor device having a capacitive insulating film of insulating
metal oxide film such as a ferroelectric film or a high dielectric
film (i.e., a film made of a material having a high dielectric
constant) and to a method for fabricating the same.
[0002] In recent years, as various electronic units such as
microcomputers operating at an even higher speed and with even
lower power consumption have been developed, the performance of
consumer-use electronic units have also been further enhanced.
Correspondingly, the sizes of semiconductor devices used for these
units have also been rapidly reduced drastically.
[0003] As semiconductor devices have been miniaturized, unwanted
radiation, i.e., electromagnetic wave noise generated from
electronic units, has become a serious problem. Technology for
incorporating a large-capacity capacitor device, including a
ferroelectric film or a high dielectric film as a capacitive
insulating film, into a semiconductor integrated circuit is now the
object of much attention as a means for reducing the unwanted
radiation.
[0004] On the other hand, since a very highly integrated dynamic
RAM is now provided, researches have been widely carried out on
technology for using a high dielectric film as a capacitive
insulating film, instead of a silicon oxide film or a silicon
nitride film, which has been conventionally used.
[0005] Furthermore, in order to put into practical use a
nonvolatile RAM operating with a low voltage and enabling
high-speed write and read operations, researches and developments
have also been vigorously carried out on a ferroelectric film
having spontaneous polarization properties. A ferroelectric memory
using a ferroelectric film as a capacitive insulating film takes
advantage of a phenomenon that the amount of charge flowing
into/out of a data line of a ferroelectric memory differs depending
upon whether or not the spontaneous polarization of the
ferroelectric film is inverted.
[0006] In all of these types of semiconductor devices mentioned
above, it is an urgent task to develop technology for realizing
very high integration for a capacitor device without deteriorating
the characteristics thereof.
[0007] Hereinafter, a conventional semiconductor device will be
described with reference to FIG. 13.
[0008] FIG. 13 illustrates a cross-sectional structure of a
conventional semiconductor device. As shown in FIG. 13, a lower
electrode 2 made of a first platinum film, a capacitive insulating
film 3 made of a ferroelectric film and an upper electrode 4 made
of a second platinum film are formed in this order on a
semiconductor substrate 1 made of silicon. The lower electrode 2,
the capacitive insulating film 3 and the upper electrode 4
constitute a capacitor device. An interlevel insulating film 5 made
of a silicon oxide film, a silicon nitride film or the like is
deposited to cover the entire surface of the semiconductor
substrate 1 as well as the capacitor device. A lower-electrode
contact hole 6 and an upper-electrode contact hole 7 are formed
through the interlevel insulating film 5. Metal interconnections 8,
each consisting of a titanium film 8a, a first titanium nitride
film 8b, an aluminum film 8c and a second titanium nitride film 8d,
are formed to cover the interlevel insulating film 5 as well as the
inner surfaces of the lower-electrode contact hole 6 and the
upper-electrode contact hole 7.
[0009] Hereinafter, a method for fabricating the conventional
semiconductor device will be described with reference to FIGS.
14(a) through 14(e).
[0010] First, as shown in FIG. 14(a), the first platinum film 2A,
the ferroelectric film 3A and the second platinum film 4A are
sequentially stacked over the entire surface of the semiconductor
substrate 1. Thereafter, as shown in FIG. 14(b), the second
platinum film 4A is selectively etched, thereby forming the upper
electrode 4. Then, in order to recover and stabilize the crystal
structure of the ferroelectric film 3A, the ferroelectric film 3A
is subjected to a heat treatment within oxygen ambient.
[0011] Next, as shown in FIG. 14(c), the ferroelectric film 3A and
the first platinum film 2A are selectively etched, thereby forming
the capacitive insulating film 3 out of the ferroelectric film 3A
and the lower electrode 2 out of the first platinum film 2A. Then,
in order to recover and stabilize the crystal structure of the
ferroelectric film constituting the capacitive insulating film 3,
the capacitive insulating film 3 is subjected to a heat treatment
within oxygen ambient.
[0012] Subsequently, as shown in FIG. 14(d), the interlevel
insulating film 5 made of a silicon oxide film or a silicon nitride
film is deposited over the entire surface of the semiconductor
substrate 1. And the lower-electrode contact hole 6 and the
upper-electrode contact hole 7 are formed through the interlevel
insulating film 5. Then, in order to recover and stabilize the
crystal structure of the ferroelectric film constituting the
capacitive insulating film 3, the capacitive insulating film 3 is
subjected to a heat treatment within oxygen ambient.
[0013] In order to prevent the lower electrode 2 or the upper
electrode 4 from being oxidized as a result of the reaction between
the lower electrode 2 or the upper electrode 4 with the capacitive
insulating film 3 during the heat treatment conducted to recover
and stabilize the crystal structure of the ferroelectric film, the
lower and the upper electrodes 2, 4 are made of platinum, which is
hard to react with the ferroelectric film 3A constituting the
capacitive insulating film 3 during the heat treatment and exhibits
anti-oxidation properties even at a high temperature.
[0014] Then, as shown in FIG. 14(e), the titanium film 8a, the
first titanium nitride film 8b, the aluminum film 8c and the second
titanium nitride film 8d are sequentially deposited to cover the
entire surface of the semiconductor substrate 1 as well as the
inner surfaces of the lower-electrode contact hole 6 and the
upper-electrode contact hole 7, thereby forming the metal
interconnections 8, each consisting of the titanium film 8a, the
first titanium nitride film 8b, the aluminum film 8c and the second
titanium nitride film 8d. The titanium film 8a functions as an
adhesive film for improving the adhesion between the aluminum film
8c and the platinum film constituting the upper electrode 4. The
first titanium nitride film 8b functions as a barrier film for
preventing aluminum in the aluminum film 8c from diffusing into the
capacitive insulating film 3. The second titanium nitride film 8d
functions as an anti-reflection film while an upper interlevel
insulating film deposited over the metal interconnections 8 is
etched.
[0015] Next, in order to further improve the adhesion between the
titanium film 8a constituting the metal interconnections 8 and the
interlevel insulating film 5, the metal interconnections 8 are
subjected to a heat treatment.
[0016] However, during the heat treatment conducted to stabilize
the crystal structure of the ferroelectric film, the platinum film
constituting the upper electrode comes to have column like crystal
structure. Thus, during the heat treatment conducted to improve the
adhesion between the metal interconnections and the interlevel
insulating film, the titanium atoms in the titanium film
constituting the metal interconnections adversely pass through the
grain boundary of the column like crystals of the platinum film
constituting the upper electrode so as to diffuse into the
capacitive insulating film. As a result, since the composition of
the ferroelectric film or the high dielectric film constituting the
capacitive insulating film is varied, the electrical
characteristics of the capacitor device are disadvantageously
deteriorated.
[0017] It is not only when the upper electrode is made of platinum
but also when the upper electrode is made of iridium, ruthenium,
rhodium, palladium or the like that the upper electrode ordinarily
has a column like crystal structure. Thus, in the latter case, the
titanium atoms in the titanium film constituting the metal
interconnections also adversely pass through the grain boundary of
the column like crystals constituting the upper electrode so as to
diffuse into the capacitive insulating film.
SUMMARY OF THE INVENTION
[0018] In view of the foregoing, the object of the present
invention is to prevent titanium atoms in a titanium film from
passing through the grain boundary of metal crystals composing the
upper electrode of a capacitor device and diffusing into a
capacitive insulating film during a heat treatment conducted on
metal interconnections, which are formed on the capacitor device
and include the titanium film.
[0019] In order to accomplish the object, the semiconductor device
according to the present invention includes: a substrate; a
capacitor device, which is formed on the substrate and includes a
capacitive lower electrode, a capacitive insulating film made of an
insulating metal oxide film and a capacitive upper electrode; an
interlevel insulating film, which is formed on the capacitor device
and has an opening reaching the capacitive upper electrode; a metal
interconnection, which is formed on the interlevel insulating film
so as to be electrically connected to the capacitive upper
electrode through the opening and includes a titanium film; and an
anti-diffusion film, which is formed between the capacitive upper
electrode and the metal interconnection, has conductivity and
prevents titanium atoms composing the titanium film of the metal
interconnection from passing through the capacitive upper electrode
and diffusing into the capacitive insulating film.
[0020] In the semiconductor device of the present invention, an
anti-diffusion film for preventing titanium atoms composing the
titanium film of the metal interconnection from passing through the
capacitive upper electrode and diffusing into the capacitive
insulating film is formed between the capacitive upper electrode
and the metal interconnection. Thus, during the heat treatment on
the metal interconnection, the titanium atoms in the titanium film
do not pass through the grain boundary of metal crystals composing
the capacitive upper electrode and do not diffuse into the
capacitive insulating film. Accordingly, a semiconductor device
including a highly reliable capacitor device can be formed.
[0021] In the semiconductor device of the present invention, the
anti-diffusion film is preferably a metal nitride film or metal
oxide film having conductivity.
[0022] In such an embodiment, since the conductive metal nitride
film or metal oxide film has no grain boundary and has a dense
structure, the film can prevent the passage of titanium atoms with
certainty. In particular, if the anti-diffusion film is a
conductive metal oxide film, the conductivity of the film is not
damaged even when a heat treatment is conducted within oxygen
ambient in order to recover the crystal structure of the
ferroelectric film constituting the capacitive insulating film.
This is because the metal oxide film has conductivity in the state
of an oxide.
[0023] In the semiconductor device of the present invention, if the
capacitive insulating film is a ferroelectric film, a highly
reliable nonvolatile memory can be obtained. On the other hand, if
the capacitive insulating film is a high dielectric film, a highly
reliable dynamic memory can be obtained.
[0024] In the semiconductor device of the present invention, the
titanium film is preferably an adhesive layer, formed as a
lowermost layer of the metal interconnection, for improving
adhesion between the metal interconnection and the upper electrode,
and the anti-diffusion film is preferably a titanium nitride
film.
[0025] In such an embodiment, since the titanium film is an
adhesive layer, the adhesion between the metal interconnection and
the upper electrode can be improved. In addition, if the
anti-diffusion film is a titanium nitride film, then no byproduct
is formed during the deposition of the anti-diffusion film.
Moreover, even if titanium in the titanium film diffuses toward the
anti-diffusion film over a certain distance, the nature of the
anti-diffusion film is not changed and the characteristics of the
capacitor device are stabilized.
[0026] In the semiconductor device of the present invention, the
capacitive upper electrode preferably has a crystal structure
including a grain boundary.
[0027] In such an embodiment, although the titanium atoms are more
likely to pass through the capacitive upper electrode, the titanium
atoms do not diffuse into the capacitive insulating film because
the atoms are prevented by the anti-diffusion film from reaching
the capacitive upper electrode.
[0028] A first method for fabricating a semiconductor device
according to the present invention includes the steps of: forming a
capacitor device, including a capacitive lower electrode, a
capacitive insulating film made of an insulating metal oxide film
and a capacitive upper electrode, on a substrate; forming an
interlevel insulating film, having a contact hole reaching the
capacitive upper electrode, on the capacitor device; depositing a
conductive film, preventing the passage of titanium atoms
therethrough, so as to cover the entire surface of the interlevel
insulating film as well as the contact hole; patterning the
conductive film such that at least a part of the conductive film
located inside the contact hole is left, thereby forming an
anti-diffusion film out of the conductive film; and forming, on the
interlevel insulating film, a metal interconnection including a
titanium film such that the metal interconnection is electrically
connected to the capacitive upper electrode via the anti-diffusion
film.
[0029] In the first method for fabricating a semiconductor device,
a conductive film, preventing the passage of titanium atoms, is
deposited over an interlevel insulating film formed on the
capacitor device and including a contact hole. Then, the conductive
film is patterned, thereby leaving the part of the conductive film
located inside the contact hole. Thus, the anti-diffusion film for
preventing the titanium atoms from passing through the capacitive
upper electrode and diffusing into the capacitive insulating film
can be formed between the upper electrode of the capacitor device
and the metal interconnection with certainty.
[0030] A second method for fabricating a semiconductor device
according to the present invention, includes the steps of: forming
a capacitor device, including a capacitive lower electrode, a
capacitive insulating film made of an insulating metal oxide film
and a capacitive upper electrode, on a substrate; forming an
interlevel insulating film, having a contact hole reaching the
capacitive upper electrode, on the capacitor device; forming, on
the interlevel insulating film, a resist pattern having an opening
at a site corresponding to the contact hole; depositing a
conductive film, preventing the passage of titanium atoms
therethrough, so as to cover the entire surface of the resist
pattern; lifting off the conductive film together with the resist
pattern such that a part of the conductive film located inside the
contact hole is left, thereby forming an anti-diffusion film out of
the conductive film; and forming, on the interlevel insulating
film, a metal interconnection including a titanium film such that
the metal interconnection is electrically connected to the
capacitive upper electrode via the anti-diffusion film.
[0031] In the second method for fabricating a semiconductor device,
a resist pattern having an opening at a site corresponding to a
contact hole is formed on the interlevel insulating film formed on
the capacitor device and including the contact hole, and a
conductive film, preventing the passage of titanium atoms
therethrough, is deposited thereon. Thus, the anti-diffusion film
for preventing the titanium atoms from passing through the
capacitive upper electrode and diffusing into the capacitive
insulating film can be formed between the upper electrode of the
capacitor device and the metal interconnection with certainty.
[0032] A third method for fabricating a semiconductor device
according to the present invention includes the steps of:
sequentially stacking a first metal film, an insulating metal oxide
film, a second metal film and a conductive film, preventing the
passage of titanium atoms therethrough, on a substrate; patterning
the second metal film and the conductive film by using the same
etching mask, thereby forming a capacitive upper electrode out of
the second metal film and an anti-diffusion film out of the
conductive film; patterning the insulating metal oxide film to form
a capacitive insulating film and patterning the first metal film to
form a capacitive lower electrode; forming an interlevel insulating
film, having a contact hole reaching the capacitive upper
electrode, over a capacitor device constituted by the capacitive
lower electrode, the capacitive insulating film and the capacitive
upper electrode; and forming, on the interlevel insulating film, a
metal interconnection including a titanium film such that the metal
interconnection is electrically connected to the capacitive upper
electrode via the anti-diffusion film.
[0033] In the third method for fabricating a semiconductor device,
among the sequentially stacked first metal film, insulating metal
oxide film, second metal film and conductive film preventing the
passage of titanium atoms therethrough, the second metal film and
the conductive film are patterned first, thereby forming a
capacitive upper electrode and an anti-diffusion film. Then, a
metal interconnection including a titanium film is formed over the
interlevel insulating film having a contact hole. Thus, the
anti-diffusion film for preventing the titanium atoms from passing
through the capacitive upper electrode and diffusing into the
capacitive insulating film can be formed between the upper
electrode of the capacitor device and the metal interconnection
with certainty.
[0034] A fourth method for fabricating a semiconductor device
according to the present invention includes the steps of: forming a
capacitive lower electrode and a capacitive insulating film made of
an insulating metal oxide film on a substrate; depositing an
interlevel insulating film so as to cover the substrate as well as
the capacitive insulating film; forming a resist pattern over the
interlevel insulating film, the resist pattern having an opening
over a region where a capacitive upper electrode is to be formed;
etching the interlevel insulating film by using the resist pattern
as a mask, thereby forming an upper electrode forming opening
through the interlevel insulating film; sequentially depositing a
metal film and a conductive film preventing the passage of titanium
atoms therethrough so as to cover the entire surface of the resist
pattern as well as the upper electrode forming opening; lifting off
the metal film and the conductive film together with the resist
pattern such that part of the metal film and part of the conductive
film, which are located in the upper electrode forming opening, are
left, thereby forming the capacitive upper electrode out of the
metal film and an anti-diffusion film out of the conductive film;
and forming, on the interlevel insulating film, a metal
interconnection including a titanium film such that the metal
interconnection is electrically connected to the capacitive upper
electrode via the anti-diffusion film.
[0035] In the fourth method for fabricating a semiconductor device,
the interlevel insulating film is etched by using, as a mask, a
resist pattern including an opening over the region where the
capacitive upper electrode is to be formed, thereby forming an
upper electrode forming opening through the interlevel insulating
film. Then, a metal film and a conductive film preventing the
passage of titanium atoms therethrough are deposited, and a metal
interconnection including a titanium film is formed thereon. Thus,
the anti-diffusion film for preventing the titanium atoms from
passing through the capacitive upper electrode and diffusing into
the capacitive insulating film can be formed between the upper
electrode of the capacitor device and the metal interconnection
with certainty.
[0036] Therefore, in accordance with the first to fourth methods
for fabricating a semiconductor device, the semiconductor device of
the present invention can be fabricated with certainty.
[0037] In the first to fourth methods for fabricating a
semiconductor device, the conductive film is preferably a metal
nitride film or metal oxide film having conductivity.
[0038] In the first to fourth methods for fabricating a
semiconductor device, the capacitive insulating film is preferably
a ferroelectric film or a high dielectric film.
[0039] In the first to fourth methods for fabricating a
semiconductor device, the titanium film is preferably an adhesive
layer, formed as a lowermost layer of the metal interconnection,
for improving adhesion between the metal interconnection and the
capacitive upper electrode, and the anti-diffusion film is
preferably a titanium nitride film.
[0040] In the first to fourth methods for fabricating a
semiconductor device, the capacitive upper electrode preferably has
a crystal structure including a grain boundary.
BRIEF DESCRIPTION OF THE DRAWINGS
[0041] FIG. 1 is a cross-sectional view of a semiconductor device
in the first embodiment of the present invention.
[0042] FIG. 2 is a cross-sectional view of a semiconductor device
in the second embodiment of the present invention.
[0043] FIG. 3 is a cross-sectional view of a semiconductor device
in a variation of the second embodiment of the present
invention.
[0044] FIG. 4 is a cross-sectional view of a semiconductor device
in the third embodiment of the present invention.
[0045] FIG. 5 is a cross-sectional view of a semiconductor device
in the fourth embodiment of the present invention.
[0046] FIGS. 6(a) through 6(c) are cross-sectional views
illustrating respective process steps in a method for fabricating
the semiconductor device of the first embodiment of the present
invention.
[0047] FIGS. 7(a) through 7(c) are cross-sectional views
illustrating respective process steps in the method for fabricating
the semiconductor device of the first embodiment of the present
invention.
[0048] FIGS. 8(a) through 8(c) are cross-sectional views
illustrating respective process steps in a method for fabricating
the semiconductor device of the second embodiment of the present
invention.
[0049] FIGS. 9(a) through 9(c) are cross-sectional views
illustrating respective process steps in the method for fabricating
the semiconductor device of the second embodiment of the present
invention.
[0050] FIGS. 10(a) through 10(e) are cross-sectional views
illustrating respective process steps in a method for fabricating
the semiconductor device of the third embodiment of the present
invention.
[0051] FIGS. 11(a) through 11(c) are cross-sectional views
illustrating respective process steps in a method for fabricating
the semiconductor device of the fourth embodiment of the present
invention.
[0052] FIGS. 12(a) through 12(c) are cross-sectional views
illustrating respective process steps in the method for fabricating
the semiconductor device of the fourth embodiment of the present
invention.
[0053] FIG. 13 is a cross-sectional view of a conventional
semiconductor device.
[0054] FIGS. 14(a) through 14(e) are cross-sectional views
illustrating respective process steps in a conventional method for
fabricating a semiconductor device.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0055] Embodiment 1
[0056] Hereinafter, a semiconductor device according to the first
embodiment of the present invention will be described with
reference to FIG. 1.
[0057] FIG. 1 illustrates a cross-sectional structure of the
semiconductor device in the first embodiment. As shown in FIG. 1, a
lower electrode 11 made of a first platinum film, a capacitive
insulating film 12 made of an insulating metal oxide film such as a
ferroelectric film or a high dielectric film, and an upper
electrode 13 made of a second platinum film are sequentially formed
on a semiconductor substrate 10 made of silicon. The lower
electrode 11, the capacitive insulating film 12 and the upper
electrode 13 constitute a capacitor device. In this embodiment, the
size of the lower electrode 11 is larger than that of the upper
electrode 13 such that a metal interconnection can be extended
upward to pass by the sides of the upper electrode 13 and be
electrically connected to the lower electrode 11.
[0058] An interlevel insulating film 14 made of a silicon oxide
film, for example, is deposited to cover the entire surface of the
semiconductor substrate 10 as well as the capacitor device. A
lower-electrode contact hole 15 and an upper-electrode contact hole
16 are formed through the interlevel insulating film 14.
[0059] The first embodiment is characterized by including an
anti-diffusion conductive film 17 made of a conductive metal
nitride film (e.g., a titanium nitride film) on the inner bottom
surface and inner wall surfaces of the upper-electrode contact hole
16 and on a part of the interlevel insulating film 14 surrounding
the upper-electrode contact hole 16.
[0060] Metal interconnections 18, each consisting of a titanium
film 18a, a first titanium nitride film 18b, an aluminum film 18c
and a second titanium nitride film 18d, are formed over the
interlevel insulating film 14 as well as the inner surfaces of the
lower-electrode contact hole 15 and the upper-electrode contact
hole 16. In this embodiment, one of the metal interconnections 18
is electrically connected to the lower electrode 11 directly inside
the lower-electrode contact hole 15. The other metal
interconnection 18 is electrically connected to the upper electrode
13 via the anti-diffusion conductive film 17 inside the
upper-electrode contact hole 16.
[0061] It is noted that the titanium film 18a functions as an
adhesive layer for improving the adhesion between the aluminum film
18c and the lower electrode 11 and between the aluminum film 18c
and the upper electrode 13. The first titanium nitride film 18b
functions as a barrier layer for preventing aluminum in the
aluminum film 18c from diffusing into the capacitive insulating
film 12. The second titanium nitride film 18d functions as an
anti-reflection film while an upper interlevel insulating film to
be deposited on the metal interconnections 18 is etched.
[0062] Hereinafter, a method for fabricating the semiconductor
device in the first embodiment of the present invention will be
described with reference to FIGS. 6(a) through 6(c) and FIGS. 7(a)
through 7(c).
[0063] First, as shown in FIG. 6(a), the first platinum film 11A,
the ferroelectric film 12A and the second platinum film 13A are
sequentially stacked over the entire surface of the semiconductor
substrate 10.
[0064] Thereafter, as shown in FIG. 6(b), the second platinum film
13A is selectively etched, thereby forming the upper electrode 13.
Then, the ferroelectric film 12A and the first platinum film 11A
are selectively etched, thereby forming the capacitive insulating
film 12 out of the ferroelectric film 12A and the lower electrode
11 out of the first platinum film 11A. In this embodiment, the
ferroelectric film 12A and the first platinum film 11A are
preferably etched by using the same mask, because mask misalignment
can be prevented by doing so. Alternatively, the ferroelectric film
12A and the first platinum film 11A may be etched separately by
using respectively different masks. Then, the capacitive insulating
film 12 is selectively etched in order to form a region from which
a metal interconnection to be electrically connected to the lower
electrode 11 is extended upward. Subsequently, in order to recover
and stabilize the crystal structure of the ferroelectric film
constituting the capacitive insulating film 12, the capacitive
insulating film 12 is subjected to a heat treatment within oxygen
ambient.
[0065] Next, as shown in FIG. 6(c), the interlevel insulating film
14 made of a silicon oxide film is deposited over the entire
surface of the semiconductor substrate 10. And the interlevel
insulating film 14 is selectively etched, thereby forming the
lower-electrode contact hole 15 and the upper-electrode contact
hole 16. Then, in order to recover and stabilize the crystal
structure of the ferroelectric film constituting the capacitive
insulating film 12, the capacitive insulating film 12 is subjected
to a heat treatment within oxygen ambient.
[0066] Next, as shown in FIG. 7(a), the titanium nitride film 17A
is deposited so as to cover the entire surface of the semiconductor
substrate 10 as well as the inner surfaces of the lower-electrode
contact hole 15 and the upper-electrode contact hole 16. Then, a
resist pattern 19 having an opening over the upper-electrode
contact hole 16 and the surrounding region thereof is formed over
the titanium nitride film 17A.
[0067] Subsequently, as shown in FIG. 7(b), the titanium nitride
film 17A is etched by using the resist pattern 19 as a mask,
thereby forming the anti-diffusion conductive film 17 out of the
titanium nitride film 17A so as to cover the inner bottom surface
and inner wall surfaces of the upper-electrode contact hole 16 and
part of the upper surface of the interlevel insulating film 14
surrounding the upper-electrode contact hole 16.
[0068] Then, as shown in FIG. 7(c), the metal interconnections 18,
each consisting of the titanium film 18a, the first titanium
nitride film 18b, the aluminum film 18c and the second titanium
nitride film 18d, are formed over the anti-diffusion conductive
film 17 and the interlevel insulating film 14. The titanium film
18a functions as an adhesive layer for improving the adhesion
between the aluminum film 18c and the lower electrode 11 and
between the aluminum film 18c and the upper electrode 13. The first
titanium nitride film 18b functions as a barrier layer for
preventing aluminum in the aluminum film 18c from diffusing into
the capacitive insulating film 12. The second titanium nitride film
18d functions as an anti-reflection film while an upper interlevel
insulating film to be deposited over the metal interconnections 18
is etched.
[0069] Next, in order to further improve the adhesion between the
titanium film 18a constituting the metal interconnections 18 and
the interlevel insulating film 14, the metal interconnections 18
are subjected to a heat treatment.
[0070] In the first embodiment, the inner bottom surface and inner
wall surfaces of the upper-electrode contact hole 16 and the part
of the upper surface of the interlevel insulating film 14
surrounding the upper-electrode contact hole 16 are covered with
the anti-diffusion conductive film 17 made of the titanium nitride
film 17A including no grain boundaries and having a dense
structure. Thus, the titanium atoms in the titanium film 18a
constituting the metal interconnections 18 do not pass through the
anti-diffusion conductive film 17. Accordingly, during the heat
treatment conducted on the metal interconnections 18, it is
possible to prevent the titanium atoms in the titanium film 18a
from passing through the grain boundaries of metal crystals
composing the upper electrode 13 and diffusing into the capacitive
insulating film 12. As a result, in the first embodiment, a
semiconductor device including a highly reliable capacitor device
can be formed.
[0071] In addition, in the first embodiment, not only the inner
surfaces of the upper-electrode contact hole 16 but also the part
of the upper surface of the interlevel insulating film 14
surrounding the upper-electrode contact hole 16 are covered with
the anti-diffusion conductive film 17. Thus, even when a mask used
for patterning the titanium nitride film 17A is out of alignment to
a certain degree, the inner bottom surface of the upper-electrode
contact hole 16 can be covered with the anti-diffusion conductive
film 17 with certainty.
[0072] Hereinafter, the evaluation of the semiconductor device of
the first embodiment will be described.
[0073] Table 1 shows in comparison the characteristics of the
capacitor device in the semiconductor device of the first
embodiment and the characteristics of a capacitor device in a
conventional semiconductor device.
1TABLE 1 Data retention time Breakdown voltage (V) (years) First
Embodiment 40 10 Conventional Capacitor 20 1
[0074] As can be understood from Table 1, in the first embodiment,
the breakdown voltage of the capacitor device is 40 V, which is
twice as high as that of the conventional capacitor device. The
data retention time of the capacitor device of the first embodiment
is 10 years, which is ten times as long as that of the conventional
capacitor device.
[0075] Embodiment 2
[0076] Hereinafter, a semiconductor device according to the second
embodiment of the present invention will be described with
reference to FIG. 2.
[0077] FIG. 2 illustrates a cross-sectional structure of the
semiconductor device in the second embodiment. As shown in FIG. 2,
a lower electrode 21 made of a first platinum film, a capacitive
insulating film 22 made of an insulating metal oxide film such as a
ferroelectric film or a high dielectric film, and an upper
electrode 23 made of a second platinum film are sequentially formed
on a semiconductor substrate 20 made of silicon. The lower
electrode 21, the capacitive insulating film 22 and the upper
electrode 23 constitute a capacitor device.
[0078] An interlevel insulating film 24 made of a silicon oxide
film, for example, is deposited to cover the entire surface of the
semiconductor substrate 20 as well as the capacitor device. A
lower-electrode contact hole 25 and an upper-electrode contact hole
26 are formed through the interlevel insulating film 24.
[0079] The second embodiment is characterized in that an
anti-diffusion conductive film 27 made of a titanium nitride film
is filled in the upper-electrode contact hole 26.
[0080] Metal interconnections 28, each consisting of a titanium
film 28a, a first titanium nitride film 28b, an aluminum film 28c
and a second titanium nitride film 28d, are formed so as to cover
the interlevel insulating film 24 as well as the inner surfaces of
the lower-electrode contact hole 25. In this embodiment, one of the
metal interconnections 28 is electrically connected to the lower
electrode 21 directly inside the lower-electrode contact hole 25.
The other metal interconnection 28 is electrically connected to the
upper electrode 23 via the anti-diffusion conductive film 27 above
the upper-electrode contact hole 26. In other words, the latter
metal interconnection 28 is electrically connected to the upper
electrode 23 without being bent in the vertical direction. Thus,
the latter metal interconnection 28 can be electrically connected
to the upper electrode 23 with more certainty.
[0081] Hereinafter, a semiconductor device according to a variation
of the second embodiment of the present invention will be described
with reference to FIG. 3.
[0082] FIG. 3 illustrates a cross-sectional structure of the
semiconductor device in the variation of the second embodiment.
Only the difference between the second embodiment and this
variation will be described below.
[0083] The variation of the second embodiment is characterized in
that the anti-diffusion conductive film 27 made of a titanium
nitride film, for example, is deposited only in the lower part
inside the upper-electrode contact hole 26. Thus, part of the metal
interconnection 28 consisting of the titanium film 28a, the first
titanium nitride film 28b, the aluminum film 28c and the second
titanium nitride film 28d is located inside the upper-electrode
contact hole 26. Accordingly, one of the metal interconnections 28
is electrically connected to the lower electrode 21 directly inside
the lower-electrode contact hole 25. The other metal
interconnection 28 is electrically connected to the upper electrode
23 via the anti-diffusion conductive film 27 inside the
upper-electrode contact hole 26.
[0084] Hereinafter, a method for fabricating the semiconductor
device in the second embodiment of the present invention will be
described with reference to FIGS. 8(a) through 8(c) and FIGS. 9(a)
through 9(c).
[0085] First, as shown in FIG. 8(a), the first platinum film 21A,
the ferroelectric film 22A and the second platinum film 23A are
sequentially stacked over the entire surface of the semiconductor
substrate 20.
[0086] Thereafter, as shown in FIG. 8(b), the second platinum film
23A is selectively etched, thereby forming the upper electrode 23.
Then, the ferroelectric film 22A and the first platinum film 21A
are selectively etched, thereby forming the capacitive insulating
film 22 out of the ferroelectric film 22A and the lower electrode
21 out of the first platinum film 21A. Then, the capacitive
insulating film 22 is selectively etched in order to form a region
from which a metal interconnection to be electrically connected to
the lower electrode 21 is extended upward. Subsequently, in order
to recover and stabilize the crystal structure of the ferroelectric
film constituting the capacitive insulating film 22, the capacitive
insulating film 22 is subjected to a heat treatment within oxygen
ambient.
[0087] Next, as shown in FIG. 8(c), the interlevel insulating film
24 made of a silicon oxide film is deposited over the entire
surface of the semiconductor substrate 20. And the interlevel
insulating film 24 is selectively etched, thereby forming the
lower-electrode contact hole 25 and the upper-electrode contact
hole 26. Then, in order to recover and stabilize the crystal
structure of the ferroelectric film constituting the capacitive
insulating film 22, the capacitive insulating film 22 is subjected
to a heat treatment within oxygen ambient.
[0088] Thereafter, as shown in FIG. 9(a), a resist pattern 29
having an opening in a region corresponding to the upper-electrode
contact hole 26 is formed over the interlevel insulating film 24
and the titanium nitride film 27A is deposited over the entire
surface of the semiconductor substrate 20.
[0089] Subsequently, as shown in FIG. 9(b), the resist pattern 29
is removed and the titanium nitride film 27A deposited on the
resist pattern 29 is lifted off, thereby forming the anti-diffusion
conductive film 27 out of the titanium nitride film 27A so as to
fill in only the inside of the upper-electrode contact hole 26.
[0090] Then, as shown in FIG. 9(c), the metal interconnections 28,
each consisting of the titanium film 28a, the first titanium
nitride film 28b, the aluminum film 28c and the second titanium
nitride film 28d, are formed over the anti-diffusion conductive
film 27 and the interlevel insulating film 24. Next, in order to
further improve the adhesion between the titanium film 28a
constituting the metal interconnections 28 and the interlevel
insulating film 24, the metal interconnections 28 are subjected to
a heat treatment.
[0091] In the second embodiment and the variation thereof, the
anti-diffusion conductive film 27 made of the titanium nitride film
27A including no grain boundaries and having a dense structure is
formed inside the upper-electrode contact hole 26. Thus, the
titanium atoms in the titanium film 28a constituting the metal
interconnections 28 do not pass through the anti-diffusion
conductive film 27. Accordingly, during the heat treatment
conducted on the metal interconnections 28, it is possible to
prevent the titanium atoms in the titanium film 28a from passing
through the grain boundaries of metal crystals composing the upper
electrode 23 and diffusing into the capacitive insulating film 22.
As a result, in the second embodiment and the variation thereof, a
semiconductor device including a highly reliable capacitor device
can be formed.
[0092] In addition, in the second embodiment, since the
anti-diffusion conductive film 27 is filled in the upper-electrode
contact hole 26, the metal interconnection 28 is not bent over the
upper-electrode contact hole 26. Thus, the contact between the
metal interconnection 28 and the upper electrode 23 is
satisfactory.
[0093] Hereinafter, the evaluation of the semiconductor device of
the second embodiment will be described.
[0094] Table 2 shows in comparison the characteristics of the
capacitor device in the semiconductor device of the second
embodiment and the characteristics of a capacitor device in a
conventional semiconductor device.
2TABLE 2 Data retention time Breakdown voltage (V) (years) Second
Embodiment 40 10 Conventional Capacitor 20 1
[0095] As can be understood from Table 2, in the second embodiment,
the breakdown voltage of the capacitor device is 40 V, which is
twice as high as that of the conventional capacitor device. The
data retention time of the capacitor device of the second
embodiment is 10 years, which is ten times as long as that of the
conventional capacitor device.
[0096] Embodiment 3
[0097] Hereinafter, a semiconductor device according to the third
embodiment of the present invention will be described with
reference to FIG. 4.
[0098] FIG. 4 illustrates a cross-sectional structure of the
semiconductor device in the third embodiment. As shown in FIG. 4, a
lower electrode 31 made of a first platinum film, a capacitive
insulating film 32 made of an insulating metal oxide film such as a
ferroelectric film or a high dielectric film, and an upper
electrode 33 made of a second platinum film are sequentially formed
on a semiconductor substrate 30 made of silicon. The lower
electrode 31, the capacitive insulating film 32 and the upper
electrode 33 constitute a capacitor device.
[0099] An interlevel insulating film 34 made of a silicon oxide
film, a silicon nitride film or the like, is deposited to cover the
entire surface of the semiconductor substrate 30 as well as the
capacitor device. A lower-electrode contact hole 35 and an
upper-electrode contact hole 36 are formed through the interlevel
insulating film 34.
[0100] The third embodiment is characterized in that an
anti-diffusion conductive film 37 made of a titanium nitride film
having the same planar shape as that of the upper electrode 33 is
formed on the upper electrode 33.
[0101] Metal interconnections 38, each consisting of a titanium
film 38a, a first titanium nitride film 38b, an aluminum film 38c
and a second titanium nitride film 38d, are formed to cover the
interlevel insulating film 34 as well as the inner surfaces of the
lower-electrode contact hole 35 and the upper-electrode contact
hole 36. In this embodiment, one of the metal interconnections 38
is electrically connected to the lower electrode 31 directly inside
the lower-electrode contact hole 35. The other metal
interconnection 38 is electrically connected to the upper electrode
33 at the bottom of the upper-electrode contact hole 36 via the
anti-diffusion conductive film 37.
[0102] Hereinafter, a method for fabricating the semiconductor
device in the third embodiment of the present invention will be
described with reference to FIGS. 10(a) through 10(e).
[0103] First, as shown in FIG. 10(a), the first platinum film 31A,
the ferroelectric film 32A, the second platinum film 33A and the
titanium nitride film 37A are sequentially stacked over the entire
surface of the semiconductor substrate 30.
[0104] Thereafter, as shown in FIG. 10(b), the titanium nitride
film 37A and the second platinum film 33A are patterned by using
the same etching mask, thereby forming the anti-diffusion
conductive film 37 out of the titanium nitride film 37A and the
upper electrode 33 out of the second platinum film 33A.
Subsequently, in order to recover and stabilize the crystal
structure of the ferroelectric film 32A, the ferroelectric film 32A
is subjected to a heat treatment within oxygen ambient.
[0105] Then, as shown in FIG. 10(c), the ferroelectric film 32A and
the first platinum film 31A are patterned, thereby forming the
capacitive insulating film 32 out of the ferroelectric film 32A and
the lower electrode 31 out of the first platinum film 31A.
Thereafter, the capacitive insulating film 32 is selectively etched
in order to form a region from which a metal interconnection to be
electrically connected to the lower electrode 31 is extended
upward. Subsequently, in order to recover and stabilize the crystal
structure of the ferroelectric film constituting the capacitive
insulating film 32, the capacitive insulating film 32 is subjected
to a heat treatment within oxygen ambient.
[0106] Next, as shown in FIG. 10(d), the interlevel insulating film
34 made of a silicon oxide film is deposited over the entire
surface of the semiconductor substrate 30. And the interlevel
insulating film 34 is selectively etched, thereby forming the
lower-electrode contact hole 35 and the upper-electrode contact
hole 36. Then, in order to recover and stabilize the crystal
structure of the ferroelectric film constituting the capacitive
insulating film 32, the capacitive insulating film 32 is subjected
to a heat treatment within oxygen ambient.
[0107] Next, as shown in FIG. 10(e), the metal interconnections 38,
each consisting of the titanium film 38a, the first titanium
nitride film 38b, the aluminum film 38c and the second titanium
nitride film 38d, are formed over the anti-diffusion conductive
film 37 and the interlevel insulating film 34. Then, in order to
further improve the adhesion between the titanium film 38a
constituting the metal interconnections 38 and the interlevel
insulating film 34, the metal interconnections 38 are subjected to
a heat treatment.
[0108] In the third embodiment, the anti-diffusion conductive film
37 made of the titanium nitride film 37A including no grain
boundaries and having a dense structure is formed under the bottom
of the upper-electrode contact hole 36. Thus, the titanium atoms in
the titanium film 38a constituting the metal interconnection 38 do
not pass through the anti-diffusion conductive film 37.
Accordingly, during the heat treatment conducted on the metal
interconnections 38, it is possible to prevent the titanium atoms
in the titanium film 38a from passing through the grain boundaries
of metal crystals composing the upper electrode 33 and diffusing
into the capacitive insulating film 32. As a result, in the third
embodiment, a semiconductor device including a highly reliable
capacitor device can be formed.
[0109] Hereinafter, the evaluation of the semiconductor device of
the third embodiment will be described.
[0110] Table 3 shows in comparison the characteristics of the
capacitor device in the semiconductor device of the third
embodiment and the characteristics of a capacitor device in a
conventional semiconductor device.
3TABLE 3 Data retention time Breakdown voltage (V) (years) Third
Embodiment 40 10 Conventional Capacitor 20 1
[0111] As can be understood from Table 3, in the third embodiment,
the breakdown voltage of the capacitor device is 40 V, which is
twice as high as that of the conventional capacitor device. The
data retention time of the capacitor device of the third embodiment
is 10 years, which is ten times as long as that of the conventional
capacitor device.
[0112] Embodiment 4
[0113] Hereinafter, a semiconductor device according to the fourth
embodiment of the present invention will be described with
reference to FIG. 5.
[0114] FIG. 5 illustrates a cross-sectional structure of the
semiconductor device in the fourth embodiment. As shown in FIG. 5,
a lower electrode 41 made of a first platinum film, a capacitive
insulating film 42 made of an insulating metal oxide film such as a
ferroelectric film or a high dielectric film, and an upper
electrode 43 made of a second platinum film are sequentially formed
on a semiconductor substrate 40 made of silicon. The lower
electrode 41, the capacitive insulating film 42 and the upper
electrode 43 constitute a capacitor device.
[0115] An interlevel insulating film 44, made of a silicon oxide
film, a silicon nitride film or the like, is deposited to cover the
entire surface of the semiconductor substrate 40 as well as the
capacitor device. A lower-electrode contact hole 45 and an
upper-electrode contact hole 46 are formed through the interlevel
insulating film 44.
[0116] The fourth embodiment is characterized in that an
anti-diffusion conductive film 47 made of a titanium nitride film,
for example, is deposited so as to fill in only the lower part
inside the lower-electrode contact hole 45 and the lower part
inside the upper-electrode contact hole 46.
[0117] Metal interconnections 48, each consisting of a titanium
film 48a, a first titanium nitride film 48b, an aluminum film 48c
and a second titanium nitride film 48d, are formed to cover the
interlevel insulating film 44 as well as the inner surfaces of the
lower-electrode contact hole 45 and the upper-electrode contact
hole 46. In this embodiment, one of the metal interconnections 48
is electrically connected to the lower electrode 41 via the
anti-diffusion conductive film 47 inside the lower-electrode
contact hole 45. The other metal interconnection 48 is electrically
connected to the upper electrode 43 via the anti-diffusion
conductive film 47 inside the upper-electrode contact hole 46.
[0118] Hereinafter, a method for fabricating the semiconductor
device in the fourth embodiment of the present invention will be
described with reference to FIGS. 11(a) through 11(c) and FIGS.
12(a) through 12(c).
[0119] First, as shown in FIG. 11(a), the first platinum film 41A
and the ferroelectric film 42A are sequentially stacked over the
entire surface of the semiconductor substrate 40.
[0120] Thereafter, as shown in FIG. 11(b), the ferroelectric film
42A and the first platinum film 41A are selectively etched, thereby
forming the capacitive insulating film 42 out of the ferroelectric
film 42A and the lower electrode 41 out of the first platinum film
41A. Then, the capacitive insulating film 42 is selectively etched
in order to form a region from which a metal interconnection to be
electrically connected to the lower electrode 41 is extended
upward. Subsequently, in order to recover and stabilize the crystal
structure of the ferroelectric film constituting the capacitive
insulating film 42, the capacitive insulating film 42 is subjected
to a heat treatment within oxygen ambient.
[0121] Next, as shown in FIG. 11(c), the interlevel insulating film
44 is deposited over the entire surface of the semiconductor
substrate 40. And a resist pattern 49, having openings over the
respective regions where the lower-electrode contact hole and the
upper-electrode contact hole are to be formed, is formed over the
interlevel insulating film 44.
[0122] Then, as shown in FIG. 12(a), the interlevel insulating film
44 is patterned by using the resist pattern 49 as an etching mask,
thereby forming the lower-electrode contact hole 45 and the
upper-electrode contact hole 46 through the interlevel insulating
film 44. Thereafter, the second platinum film 43A and the titanium
nitride film 47A are sequentially deposited to cover the entire
surface including the inner surfaces of the lower-electrode contact
hole 45 and the upper-electrode contact hole 46.
[0123] Next, as shown in FIG. 12(b), the resist pattern 49 is
removed and the second platinum film 43A and the titanium nitride
film 47A deposited on the resist pattern 49 are lifted off, thereby
leaving the second platinum film 43A inside the lower-electrode
contact hole 45 and forming the anti-diffusion conductive film 47
out of the titanium nitride film 47A thereon. Also, inside the
upper-electrode contact hole 46, the upper electrode 43 is formed
out of the second platinum film 43A and the anti-diffusion
conductive film 47 is formed out of the titanium nitride film
47A.
[0124] Then, as shown in FIG. 12(c), the metal interconnections 48,
each consisting of the titanium film 48a, the first titanium
nitride film 48b, the aluminum film 48c and the second titanium
nitride film 48d, are formed over the anti-diffusion conductive
film 47 and the interlevel insulating film 44. Next, in order to
further improve the adhesion between the titanium film 48a
constituting the metal interconnections 48 and the interlevel
insulating film 44, the metal interconnections 48 are subjected to
a heat treatment.
[0125] In the fourth embodiment, the anti-diffusion conductive film
47 made of the titanium nitride film 47A including no grain
boundaries and having a dense structure is formed inside the
upper-electrode contact hole 46. Thus, the titanium atoms in the
titanium film 48a constituting the metal interconnections 48 do not
pass through the anti-diffusion conductive film 47. Accordingly,
during the heat treatment conducted on the metal interconnections
48, it is possible to prevent the titanium atoms in the titanium
film 48a from passing through the grain boundaries of metal
crystals composing the upper electrode 43 and diffusing into the
capacitive insulating film 42. As a result, in the fourth
embodiment, a semiconductor device including a highly reliable
capacitor device can be formed.
[0126] Hereinafter, the evaluation of the semiconductor device of
the fourth embodiment will be described.
[0127] Table 4 shows in comparison the characteristics of the
capacitor device in the semiconductor device of the fourth
embodiment and the characteristics of a capacitor device in a
conventional semiconductor device.
4TABLE 4 Data retention time Breakdown voltage (V) (years) Fourth
Embodiment 40 10 Conventional Capacitor 20 1
[0128] As can be understood from Table 4, in the fourth embodiment,
the breakdown voltage of the capacitor device is 40 V, which is
twice as high as that of the conventional capacitor device. The
data retention time of the capacitor device of the fourth
embodiment is 10 years, which is ten times as long as that of the
conventional capacitor device.
[0129] In the foregoing first to fourth embodiments, a titanium
nitride film is used as the anti-diffusion conductive film 17, 27,
37, 47. Alternatively, a metal film made of at least one element
selected from the group consisting of tungsten, iridium, tantalum,
rhodium, palladium, zirconium, niobium and vanadium; a metal
nitride film made of at least one element selected from the group
consisting of tungsten, tantalum, zirconium, niobium and vanadium;
or a metal oxide film made of at least one element selected from
the group consisting of iridium, rhodium, palladium, osmium and
ruthenium may be used instead. Since these metal films, metal
nitride films and metal oxide films include no grain boundaries and
have a dense structure, these films also prevent the passage of
titanium atoms in the titanium film composing the metal
interconnections 18, 28, 38, 48, in the same way as the titanium
nitride film.
[0130] If one of the above-enumerated metal oxide film is used as
the anti-diffusion conductive film 17, 27, 37, 47, then the
conductivity of the metal oxide film is not damaged even when a
heat treatment is conducted within oxygen ambient in order to
recover and stabilize the crystal structure of the ferroelectric
film constituting the capacitive insulating film 12, 22, 32, 42.
This is because the metal oxide film has conductivity in the state
of an oxide.
[0131] Also, a multi-layer structure including at least two types
of films selected from the metal films, the metal nitride films and
the metal oxide films may be used as the anti-diffusion conductive
film 17, 27, 37, 47.
[0132] In the first to fourth embodiments, a multi-layer film
including a platinum film and an iridium oxide film, instead of the
platinum film, may be used as the lower electrode 11, 21, 31, 41
and/or the upper electrode 13, 23, 33, 43.
[0133] In the third and fourth embodiments, a plurality of upper
electrodes 33, 43 and a plurality of anti-diffusion conductive
films 37, 47, each having a small thickness, may be alternately
stacked. In such an embodiment, a stable upper electrode, which is
very less likely to be deformed because of thermal expansion, can
be formed.
[0134] In the first to fourth embodiments, a perovskite
ferroelectric film made of barium titanate, lead titanate zirconate
or the like, or a bismuth layer shaped perovskite ferroelectric
film made of SrBi.sub.2Ta.sub.2O.sub.9 or the like may be used as
the ferroelectric film constituting the capacitive insulating film
12, 22, 32, 42.
[0135] Also, if an insulating metal oxide film, such as a high
dielectric film, other than the ferroelectric film is used as the
capacitive insulating film 12, 22, 32, 42, then the capacitor
device may be applied to a dynamic RAM.
[0136] In the first to fourth embodiments, a silicon nitride film
or a silicon oxynitride film, instead of the silicon oxide film,
may be used as the interlevel insulating film 14, 24, 34, 44. The
semiconductor substrate 10, 20, 30, 40 may be an insulating
substrate (such as a glass substrate), a conductive substrate or a
semiconductor substrate on which transistors or the like are
formed.
* * * * *