U.S. patent application number 10/888898 was filed with the patent office on 2004-12-02 for method and system for sensing ic package orientation in sockets.
Invention is credited to Adkisson, Richard W., Benavides, John A..
Application Number | 20040242053 10/888898 |
Document ID | / |
Family ID | 32298289 |
Filed Date | 2004-12-02 |
United States Patent
Application |
20040242053 |
Kind Code |
A1 |
Benavides, John A. ; et
al. |
December 2, 2004 |
Method and system for sensing IC package orientation in sockets
Abstract
An embodiment of this invention provides a system and method for
indicating the orientation of a packaged IC in a socket. An LED is
physically mounted to a socket. One lead of the LED is electrically
connected to a positive voltage through a socket hole on the
socket. When the orientation of the IC package in the socket is
correct, the other lead of the LED is connected to a ground path on
the packaged IC. As a result, the LED is activated indicating the
orientation of the packaged IC is correct.
Inventors: |
Benavides, John A.;
(Garland, TX) ; Adkisson, Richard W.; (Dallas,
TX) |
Correspondence
Address: |
HEWLETT-PACKARD COMPANY
Intellectual Property Administration
P. O. Box 272400
Fort Collins
CO
80527-2400
US
|
Family ID: |
32298289 |
Appl. No.: |
10/888898 |
Filed: |
July 8, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10888898 |
Jul 8, 2004 |
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10420577 |
Apr 21, 2003 |
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6786760 |
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Current U.S.
Class: |
439/489 |
Current CPC
Class: |
H05K 7/1092
20130101 |
Class at
Publication: |
439/489 |
International
Class: |
H01R 003/00 |
Claims
What is claimed is:
1) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) a resistor, the resistor physically and
electrically connected to the socket; c) wherein the resistor
conducts current when the packaged IC is correctly inserted in the
socket.
2) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) a resistor, the resistor physically and
electrically connected to the socket; c) wherein the resistor
conducts current when the packaged IC is incorrectly inserted in
the socket.
3) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) a resistor, the resistor physically mounted to the
socket and electrically connected between a first socket hole and a
second socket hole on the socket; c) wherein the resistor conducts
current when the packaged IC is correctly inserted in the
socket.
4) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) a resistor, the resistor physically mounted to the
socket and electrically connected between a first socket hole and a
second socket hole on the socket; c) wherein the resistor conducts
current when the packaged IC is incorrectly inserted in the
socket.
5) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) a resistor, the resistor physically mounted to the
socket and electrically connected between a first socket hole and
second socket hole on the socket; c) wherein the first socket hole
is connected to a positive voltage; d) wherein the second socket
hole is connected to a ground path on the packaged IC when the
packaged IC is oriented correctly; e) wherein the resistor conducts
current when the packaged IC is oriented correctly.
6) The system in claim 5 wherein the socket is a ZIF socket.
7) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) a resistor, the resistor physically mounted to the
socket and electrically connected between a first socket hole and
second socket hole on the socket; c) wherein the first socket hole
is connected to a positive voltage; d) wherein the second socket
hole is connected to a ground path on the packaged IC when the
packaged IC is oriented incorrectly; e) wherein the resistor
conducts current when the packaged IC is oriented incorrectly.
8) The system in claim 7 wherein the socket is a ZIF socket.
9) A method for indicating orientation of a packaged IC comprising:
a) physically mounting a resistor to a socket; b) electrically
connecting the resistor between a first socket hole and a second
socket hole on the socket; c) inserting the packaged IC in the
socket; d) providing a positive voltage to the first socket hole;
e) wherein the second socket hole is connected to a ground path on
the packaged IC when the packaged IC is oriented correctly; f)
wherein the resistor conducts current when the packaged IC is
oriented correctly.
10) The method in claim 9 wherein the socket is a ZIF socket.
11) A method for indicating orientation of a packaged IC
comprising: a) physically mounting a resistor to a socket; b)
electrically connecting the resistor between a first socket hole
and a second socket hole on the socket; c) inserting the packaged
IC in the socket; d) providing a positive voltage to the first
socket hole; e) wherein the second socket hole is connected to a
ground path on the packaged IC when the packaged IC is oriented
incorrectly; f) wherein the resistor conducts current when the
packaged IC is oriented incorrectly.
12) The method in claim 11 wherein the socket is a ZIF socket.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No.
10/420,577 also entitled, "A Method and System for Sensing IC
Package Orientation in Sockets," filed on Apr. 21, 2003 hereby
incorporated herein by reference.
FIELD OF THE INVENTION
[0002] This invention relates generally to packaged integrated
electronic circuits. More particularly, this invention relates to
sensing the orientation of a packaged IC in a socket.
BACKGROUND OF THE INVENTION
[0003] Very Large Scale Integrated (VLSI) chips may contain
millions of transistors and electrical connections. Because VLSI
chips may be so complex, a great deal of testing may be required to
verify that a particular chip is fully functional. The time
required to test an integrated circuit (IC) may increase the cost
of an IC. As a result, it is desirable to reduce the time required
to test an IC.
[0004] ICs are typically manufactured on a silicon wafer. Each
silicon wafer may contain dozens of individual ICs. These ICs may
be microprocessors, DRAMs (Dynamic Random Access Memory), SRAMs
(Static Random Access Memory), or other types of ICs. The
individual ICs on a silicon wafer are usually tested before the
wafer is cut into separate, individual ICs. After all the ICs on
the wafer are tested, the wafer is cut into separate, individual
ICs and the ICs that passed the tests during wafer test are
packaged.
[0005] Next, packaged ICs are tested. Packaged ICs are usually
placed in a socket that is connected to external test equipment.
The external test equipment applies power and signals to operate
and test packaged ICs. The tests applied by test equipment can be
very complex and as a result may require a relatively great deal of
time to complete testing. Before applying the complete suite of
tests found on external test equipment, it would be helpful to know
if the packaged IC is correctly oriented in a test socket.
[0006] The orientation of a packaged IC may be difficult to detect,
for example, because the module may be symmetrical about both the X
and Y axis. As a result the packaged IC may be incorrectly placed
in a socket. If a packaged IC is incorrectly placed in a socket
during testing of the packaged IC, the tests may fail and a great
deal of time and effort may be used before it is discovered the
packaged IC is incorrectly oriented in the socket.
[0007] In addition, when a packaged IC is incorrectly oriented in a
socket that is part of a system, for example, a computer, the
system may not operate properly. Again, a great deal of time and
effort may be used in this situation before the incorrect
orientation is detected.
[0008] There is a need in the art to communicate the orientation of
a packaged IC in a socket. One embodiment of this invention
communicates the orientation of a packaged IC in a socket by
activating an LED mounted to the socket when the orientation of the
packaged IC is incorrect. A detailed description of this embodiment
of this invention is described later.
SUMMARY OF THE INVENTION
[0009] An embodiment of this invention provides a system and method
for indicating the orientation of a packaged IC in a socket. An LED
is physically mounted to a socket. One lead of the LED is
electrically connected to a positive voltage through a socket hole
on the socket. When the orientation of the IC package in the socket
is correct, the other lead of the LED is connected to a ground path
on the packaged IC. As a result, the LED is activated indicating
the orientation of the packaged IC is correct.
[0010] Other aspects and advantages of the present invention will
become apparent from the following detailed description, taken in
conjunction with the accompanying drawing, illustrating by way of
example the principles of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a mechanical drawing of a socket and light source
viewed from the top.
[0012] FIG. 2 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the side.
[0013] FIG. 3 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
[0014] FIG. 4 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
[0015] FIG. 5 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
[0016] FIG. 6 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
[0017] FIG. 7 is a mechanical drawing of a socket, an audio source,
and a packaged IC viewed from the side.
[0018] FIG. 8 is a mechanical drawing of a socket, a resistor, and
a packaged IC viewed from the side.
[0019] FIG. 9 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
[0020] FIG. 10 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
[0021] FIG. 11 is a mechanical drawing of a socket, a light source
and a packaged IC viewed from the top.
[0022] FIG. 12 is a mechanical drawing of a socket, a light source,
and a packaged IC viewed from the top.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0023] FIG. 1 is a mechanical drawing of a socket, 100 and light
source, 114, viewed from the top. Socket holes, which provide
connections for IC contacts (e.g. pins, BGA balls, or other
electrical or optical contacts), 102, are represented by small
circles in FIG. 1. In this embodiment, the light source, 114 is
physically mounted to the top of the socket, 100. The light source
is electrically connected to a positive voltage and to socket hole
112. Socket hole 110 is connected to a ground. When a packaged IC
is correctly oriented in the socket, 100, the packaged IC provides
a ground path from socket hole 112 to socket hole 110. Providing a
ground path from socket hole 112 to socket hole 110 allows current
to be conducted through light source, 114, activating the light
source. An activated light source, in this example, indicates the
packaged IC is oriented correctly. Socket holes, 106 and 108, are
not connected to a ground or any reference voltage.
[0024] FIG. 2 is a mechanical drawing of a socket, 208, a light
source, 214, and a packaged IC, 200, viewed from the side. In this
embodiment, the light source, 214, is physically mounted to the top
of the socket, 208. The light source, 214, is electrically
connected, 216, to a positive voltage, 220 and to socket hole 212.
Socket hole, 210, provides a path to a ground, 218.
[0025] In this example, packaged IC, 200, is correctly oriented in
socket 208 when pin 202 is inserted in socket hole 210, and pin 206
is inserted in socket hole 212. When pin 202 is inserted in socket
hole 210, and pin 206 is inserted in socket hole 212, a ground
path, 204, is provided by the packaged IC, 200, from socket hole
212 to ground, 218. Providing a ground path, 204, from socket hole
212 to ground, 218, allows current to be conducted through light
source, 214, activating the light source, 214. An activated light
source, 214, in this example, indicates the packaged IC, 200, is
oriented correctly.
[0026] FIG. 3 is a mechanical drawing of a socket, 308, a light
source, 314, and a packaged IC, 300, viewed from the top. In this
embodiment, the light source, 314, is physically mounted to the top
of the socket, 308. Socket hole 312 is electrically connected to
one lead of light source 314 and a positive voltage is electrically
connected to the other lead of light source 314. Socket hole, 310,
is this example, is connected to an external ground. Socket holes
320 and 322 are not connected to a ground or a reference
voltage.
[0027] Pin 302 is electrically connected through ground path, 304,
to pin 306. Pins 316 and 318 on packaged IC 300 are not connected
to a ground or a voltage reference. To correctly insert packaged
IC, 300, into, socket 308, pin 302 is inserted in to socket hole
310, pin 306 is inserted into socket hole 312, pin 316 is inserted
into socket hole 320, and pin 318 is inserted into socket hole 322.
When packaged IC 300 is correctly inserted into socket 308, a
ground path, 304, is provided from socket hole 312 to socket hole
310. In this example, socket hole 310 is connected to an external
ground. Providing a ground path, 304, from socket hole 312 to
grounded socket hole, 310, allows current to be conducted through
light source, 314, activating the light source, 314. An activated
light source, 314, in this example, indicates the packaged IC, 300,
is oriented correctly.
[0028] FIG. 4 is a mechanical drawing of a socket, 408, a light
source, 414, and a packaged IC, 400, viewed from the top. In this
embodiment, the light source, 414, is physically mounted to the top
of the socket, 408. Socket hole 412 is electrically connected to
one lead of light source 414 and a positive voltage is electrically
connected to the other lead of light source 414. Socket hole, 410,
is this example, is connected to an external ground. Socket holes
420 and 422 are not connected to a ground or a reference
voltage.
[0029] Pin 402 is electrically connected through ground path 404 to
pin 406. Pins 416 and 418 on packaged IC 400 are not connected to a
ground or a voltage reference. In this example, packaged IC, 400 is
incorrectly inserted into socket 408, when pin 402 is inserted in
to socket hole 420, pin 406 is inserted into socket hole 410, pin
416 is inserted into socket hole 422, and pin 418 is inserted into
socket hole 412. In this example, when packaged IC 400 is
incorrectly inserted into socket 408, no ground path is provided
from socket hole 412 to socket hole 410. An inactivated light
source, 414, in this example, indicates the packaged IC, 400, is
oriented incorrectly.
[0030] FIG. 5 is a mechanical drawing of a socket, 508, a light
source, 514, and a packaged IC, 500, viewed from the top. In this
embodiment, the light source, 514, is physically mounted to the top
of the socket, 508. Socket hole 512 is electrically connected to
one lead of light source 514 and a positive voltage is electrically
connected to the other lead of light source 514. Socket hole, 510,
is this example, is connected to an external ground. Socket holes
520 and 522 are not connected to a ground or a reference
voltage.
[0031] Pin 502 is electrically connected through ground path 504 to
pin 506. Pins 516 and 518 on packaged IC 500 are not connected to a
ground or a voltage reference. In this example, packaged IC, 500 is
incorrectly inserted into socket 508, when pin 502 is inserted in
to socket hole 522, pin 506 is inserted into socket hole 520, pin
516 is inserted into socket hole 512, and pin 518 is inserted into
socket hole 510. In this example, when packaged IC 500 is
incorrectly inserted into socket 508, no ground path is provided
from socket hole 512 to socket hole 510. An inactivated light
source, 514, in this example, indicates the packaged IC, 500, is
oriented incorrectly.
[0032] FIG. 6 is a mechanical drawing of a socket, 608, a light
source, 614, and a packaged IC, 600, viewed from the top. In this
embodiment, the light source, 614, is physically mounted to the top
of the socket, 608. Socket hole 612 is electrically connected to
one lead of light source 614 and a positive voltage is electrically
connected to the other lead of light source 614. Socket hole, 610,
is this example, is connected to an external ground. Socket holes
620 and 622 are not connected to a ground or a reference
voltage.
[0033] Pin 602 is electrically connected through ground path 604 to
pin 606. Pins 616 and 618 on packaged IC 600 are not connected to a
ground or a voltage reference. In this example, packaged IC, 600 is
incorrectly inserted into socket 608, when pin 602 is inserted in
to socket hole 612, pin 606 is inserted into socket hole 622, pin
616 is inserted into socket hole 610, and pin 618 is inserted into
socket hole 620. In this example, when packaged IC 600 is
incorrectly inserted into socket 608, no ground path is provided
from socket hole 612 to socket hole 610. An inactivated light
source, 614, in this example, indicates the packaged IC, 600, is
oriented incorrectly.
[0034] FIG. 7 is a mechanical drawing of a socket, 708, an audio
source, 714, and a packaged IC, 700, viewed from the side. In this
embodiment, the audio source, 714, is physically mounted to the top
of the socket, 708. The audio source, 714, is electrically
connected, 716, to a positive voltage, 720 and to socket hole 712.
Socket hole, 710, provides a path to a ground, 718.
[0035] In this example, packaged IC, 700, is correctly oriented in
socket 708 when pin 702 is inserted in socket hole 710, and pin 706
is inserted in socket hole 712. When pin 702 is inserted in socket
hole 710, and pin 706 is inserted in socket hole 712, a ground
path, 704, is provided by the packaged IC, 700, from socket hole
712 to ground, 718. Providing a ground path, 704, from socket hole
712 to ground, 718, allows current to be conducted through the
audio source, 714, activating the audio source, 714. An activated
audio source, 714, in this example, indicates the packaged IC, 700,
is oriented correctly.
[0036] FIG. 8 is a mechanical drawing of a socket, 808, a resistor,
814, and a packaged IC, 800, viewed from the side. In this
embodiment, the resistor, 814, is physically mounted to the top of
the socket, 808. The resistor, 814, is electrically connected, 816,
to a positive voltage, 820, sense contact, 822, and to socket hole
812. Socket hole, 810, provides a path to a ground, 818.
[0037] In this example, packaged IC, 800, is correctly oriented in
socket 808 when pin 802 is inserted in socket hole 810, and pin 806
is inserted in socket hole 812. When pin 802 is inserted in socket
hole 810, and pin 806 is inserted in socket hole 812, a ground
path, 804, is provided by the packaged IC, 800, from socket hole
812 to ground, 818. Providing a ground path, 804, from socket hole
812 to ground, 818, allows current to be conducted through the
resistor, 814, which establishes a voltage on sense contact 822.
The voltage on the sense contact, 822, may be used to drive
external equipment. A voltage near ground on sense contact, 822,
indicates the packaged is oriented correctly.
[0038] FIG. 9 is a mechanical drawing of a socket, 908, a light
source, 914, and a packaged IC, 900, viewed from the top. In this
embodiment, the light source, 914, is physically mounted to the top
of the socket, 908. Socket hole 912 is electrically connected to
one lead of light source 914 and a positive voltage is electrically
connected to the other lead of light source 914. Socket holes, 910,
920, and 922 in this example, are connected to an external
ground.
[0039] Pin 902 is electrically connected through ground path 904,
to pin 916 and pin 916 is electrically connected through ground
path 924 to pin 918. Pin 906 on packaged IC 900 is not connected to
a ground or a voltage reference. To correctly insert packaged IC,
900, into, socket 908, pin 902 is inserted in to socket hole 910,
pin 906 is inserted into socket hole 912, pin 916 is inserted into
socket hole 920, and pin 918 is inserted into socket hole 922. When
packaged IC 900 is correctly inserted into socket 908, no ground
path is provided from socket hole 912. An inactivated light source,
914, in this example, indicates the packaged IC, 900, is oriented
correctly.
[0040] FIG. 10 is a mechanical drawing of a socket, 1008, a light
source, 1014, and a packaged IC, 1000, viewed from the top. In this
embodiment, the light source, 1014, is physically mounted to the
top of the socket, 1008. Socket hole 1012 is electrically connected
to one lead of light source 1014 and a positive voltage is
electrically connected to the other lead of light source 1014.
Socket holes, 1010, 1020, and 1022 in this example, are connected
to an external ground.
[0041] Pin 1002 is electrically connected through ground path 1004
to pin 1016 and pin 1016 is electrically connected through ground
path 1024 to pin 1018. Pin 1006 on packaged IC 1000 is not
connected to a ground or a voltage reference. When packaged IC 1000
is incorrectly inserted into socket 1008, in this example, pin 1006
is inserted in to socket hole 1010, pin 1018 is inserted into
socket hole 1012, pin 1002 is inserted into socket hole 1020, and
pin 1016 is inserted into socket hole 1022. When packaged IC 1000
is incorrectly inserted into socket 1008, in this example, a ground
path is provided from socket hole 1012 to a ground. An activated
light source, 1014, in this example, indicates the packaged IC,
1000, is oriented incorrectly.
[0042] FIG. 11 is a mechanical drawing of a socket, 1108, a light
source, 1114, and a packaged IC, 1100, viewed from the top. In this
embodiment, the light source, 1114, is physically mounted to the
top of the socket, 1108. Socket hole 1112 is electrically connected
to one lead of light source 1114 and a positive voltage is
electrically connected to the other lead of light source 1114.
Socket holes, 1110, 1120, and 1122, in this example, are connected
to an external ground.
[0043] Pin 1102 is electrically connected through ground path 1104
to pin 1116 and pin 1116 is electrically connected through ground
path 1124 to pin 1118. Pin 1106 on packaged IC 1100 is not
connected to a ground or a voltage reference. When packaged IC 1100
is incorrectly inserted into socket 1108, in this example, pin 1118
is inserted in to socket hole 1110, pin 1116 is inserted into
socket hole 1112, pin 1106 is inserted into socket hole 1120, and
pin 1102 is inserted into socket hole 1122. When packaged IC 1100
is incorrectly inserted into socket 1108, in this example, a ground
path is provided from socket hole 1112 to a ground. An activated
light source, 1114, in this example, indicates the packaged IC,
1100, is oriented incorrectly.
[0044] FIG. 12 is a mechanical drawing of a socket, 1208, a light
source, 1214, and a packaged IC, 1200, viewed from the top. In this
embodiment, the light source, 1214, is physically mounted to the
top of the socket, 1208. Socket hole 1212 is electrically connected
to one lead of light source 1214 and a positive voltage is
electrically connected to the other lead of light source 1214.
Socket holes, 1210, 1220, and 1222, in this example, are connected
to an external ground.
[0045] Pin 1202 is electrically connected through ground path 1204
to pin 1216 and pin 1216 is electrically connected through ground
path 1224 to pin 1218. Pin 1206 on packaged IC 1200 is not
connected to a ground or a voltage reference. When packaged IC 1200
is incorrectly inserted into socket 1208, in this example, pin 1216
is inserted in to socket hole 1210, pin 1202 is inserted into
socket hole 1212, pin 1218 is inserted into socket hole 1220, and
pin 1206 is inserted into socket hole 1222. When packaged IC 1200
is incorrectly inserted into socket 1208, in this example, a ground
path is provided from socket hole 1212 to a ground. An activated
light source, 1214, in this example, indicates the packaged IC,
1200, is oriented incorrectly.
[0046] The foregoing description of the present invention has been
presented for purposes of illustration and description. It is not
intended to be exhaustive or to limit the invention to the precise
form disclosed, and other modifications and variations may be
possible in light of the above teachings. The embodiment was chosen
and described in order to best explain the principles of the
invention and its practical application to thereby enable others
skilled in the art to best utilize the invention in various
embodiments and various modifications as are suited to the
particular use contemplated. It is intended that the appended
claims be construed to include other alternative embodiments of the
invention except insofar as limited by the prior art.
* * * * *