U.S. patent application number 10/677556 was filed with the patent office on 2004-07-15 for monolithic structures including alignment and/or retention fixtures for accepting components.
This patent application is currently assigned to Microfabrica Inc.. Invention is credited to Bang, Christopher A., Cohen, Adam L., Feinberg, Daniel I..
Application Number | 20040134772 10/677556 |
Document ID | / |
Family ID | 32069846 |
Filed Date | 2004-07-15 |
United States Patent
Application |
20040134772 |
Kind Code |
A1 |
Cohen, Adam L. ; et
al. |
July 15, 2004 |
Monolithic structures including alignment and/or retention fixtures
for accepting components
Abstract
Permanent or temporary alignment and/or retention structures for
receiving multiple components are provided. The structures are
preferably formed monolithically via a plurality of deposition
operations (e.g. electrodeposition operations). The structures
typically include two or more positioning fixtures that control or
aid in the positioning of components relative to one another, such
features may include (1) positioning guides or stops that fix or at
least partially limit the positioning of components in one or more
orientations or directions, (2) retention elements that hold
positioned components in desired orientations or locations, and/or
(3) positioning and/or retention elements that receive and hold
adjustment modules into which components can be fixed and which in
turn can be used for fine adjustments of position and/or
orientation of the components.
Inventors: |
Cohen, Adam L.; (Los
Angeles, CA) ; Feinberg, Daniel I.; (Sylmar, CA)
; Bang, Christopher A.; (San Diego, CA) |
Correspondence
Address: |
Microfabrica Inc.
1103 W. Isabel St.
Burbank
CA
91506
US
|
Assignee: |
Microfabrica Inc.
|
Family ID: |
32069846 |
Appl. No.: |
10/677556 |
Filed: |
October 1, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60415374 |
Oct 1, 2002 |
|
|
|
Current U.S.
Class: |
204/198 ;
204/222 |
Current CPC
Class: |
H01P 11/005 20130101;
H01P 3/06 20130101; B81C 3/002 20130101; G01P 1/023 20130101; H01P
11/00 20130101; H01P 5/183 20130101; H05K 3/4647 20130101; G01P
15/0802 20130101; B81C 2203/051 20130101; B81C 3/008 20130101; G01P
15/125 20130101; H01P 11/007 20130101; B81B 2201/042 20130101; H01P
1/202 20130101 |
Class at
Publication: |
204/198 ;
204/222 |
International
Class: |
C25D 017/00 |
Claims
We claim:
1. An alignment and/or retention structure for receiving a
plurality of components, comprising: a base; a plurality of
alignment and/or retention fixtures attached to the base and having
desired positions relative to one another, wherein one or more of
the following conditions is met: (1) the base and the alignment
and/or retention fixtures are substantially monolithic, (2) the
alignment and/or retention fixtures comprise at least one material
deposited as a plurality of layers, or (3) the alignment and/or
retention fixtures are formed in a single process in their
respective relative positions.
2. The structure of claim 1 wherein the base and at least a portion
of the alignment and/or retention fixtures are connected by a
deformable material that allows fine adjustments of the fixtures
relative to the base to be made to optimize alignment and/or
retention of components.
3. The structure of claim 1 wherein the deformable material
comprises a low melting point metal that can be heated to allow
deformation.
4. The structure of claim 2 wherein the deformable material is a
material that comprises a structural configuration that allows
relatively easy deformation along at least one axis.
5. The structure of claim 1 wherein at least one alignment and/or
retention fixture comprises at least one stop in a direction of
motion parallel to a plane of a surface of the base.
6. The structure of claim 1 wherein at least one alignment and/or
retention fixture comprises at least one stop in a direction of
motion perpendicular to a plane of a surface of the base.
7. The structure of claim 1 wherein at least one retention fixture
comprises at least structure for retaining a component in a desired
position.
8. The structure of claim 1 wherein at least one alignment and/or
retention fixture comprises a structure for guiding a component to
a desired position.
9. The structure of claim 1 wherein at least a first alignment
and/or retention fixture is located at a first surface of the base
and at least a second alignment and/or retention fixture is located
at a second surface of the base.
10. The structure of claim 1 wherein the base comprises an opening
that extends from one surface to another surface and through which
material or information may pass to or from a component aligned or
retained relative thereto.
11. The structure of claim 1 wherein at least one alignment and/or
retention fixture is capable of receiving a secondary alignment
and/or retention fixture to which a component may be aligned and/or
retained.
12. The structure of claim 1 wherein the alignment and/or retention
fixtures comprise a material deposited on substantially a
layer-by-layer basis or the alignment and/or retention fixtures are
formed in a single process in their respective relative positions,
and wherein the structure comprises two or more conductive paths
separated from one another by a dielectric, wherein at least one of
the paths meets at least one of the following criteria: (1) the at
least one path forms a connection between at least two electrical
contact points on a single component; (2) the at least one path
forms a connection between electrical contact points on at least
two different components; (3) the at least one path allows an
electrical connection to be made from the structure to a separate
structure; (4) the structure is adapted to be located in a
substantially hermetic package and the at least one path allows an
electrical connection to be made from the structure to a separate
structure that is external to the package; (5) the at least one
path makes an electrical connection to an electrically functional
device that was formed along with the structure; or (6) the at
least one path comprises a component that guides and/or modifies an
RF or microwave signal.
13. The structure of claim 1 wherein at least a portion of at least
one alignment and/or retention fixture contacts the at least one
dielectric region and at least a portion of at least one alignment
and/or retention fixture contacts the at least one conductive
region.
14. The structure of claim 1 wherein the structure is capable of
receiving photonic components for forming a photonics device.
15. The structure of claim 14 wherein the photonics components
include at least one optical generation, detection, or manipulation
device.
16. The structure of claim 1 wherein the fixtures are adapted to
align and/or retain at least one of (1) an electronic component;
(2) an electrical component; (3) a component capable of controlling
or directing the flow of a liquid or a gas; or (4) a component for
modifying, controlling, or detecting temperature.
17. The structure of claim 1 wherein the structure is adapted to
engage with a housing structure.
18. The structure of claim 1 wherein the structure comprises
elements that provide an electrical functional, a thermodynamic
function, an optical or photonic function, and/or a mechanical
function.
19. The structure of claim 1 wherein the structure comprises at
least one fixture having a retention functionality comprising at
least one of: (1) a pivotable structure that includes a retention
arm and an actuation arm that move substantially in conjunction
with one another, (2) a retention arm that slides over the
component and holds one side while the opposite side is held, at
least in part, by the elastomeric deformation of a compression
element, or (3) a retention arm that engages a side of a component
and inhibits the component from backing out in a direction opposite
to a loading direction and a stop component that inhibits further
inward loading of the component.
20. The structure of claim 1 whose production comprises one or more
of the following operations: (1) selectively electrodepositing a
first conductive material and electrodepositing a second conductive
material, wherein one of the first or second conductive materials
is a sacrificial material and the other is a structural material;
(2) electrodepositing a first conductive material, selectively
etching the first structural material to create at least one void,
and electrodepositing a second conductive material to fill the at
least one void; (3) electrodepositing at least one conductive
material, depositing at least one flowable dielectric material, and
depositing a seed layer of conductive material in preparation for
formation of a next layer of electrodeposited material, and/or (4)
selectively electrodepositing a first conductive material, then
electrodepositing a second conductive material, then selectively
etching one of the first or second conductive materials, and then
electrodepositing a third conductive material, wherein at least one
of the first, second, or third conductive materials is a
sacrificial material and at least one of the remaining two
conductive materials is a structural material.
21. A device, comprising: (a) an alignment and/or retention
structure, comprising: (1) a base; (2) a plurality of alignment
and/or retention fixtures adhered to the base and having desired
positions relative to one another; (b) a plurality of components
mounted on the alignment structure in positions dictated by the
alignment and/or retention fixtures, wherein one or more of the
following conditions are met: wherein one or more of the following
conditions are met: (1) the base and the alignment and/or retention
fixtures are monolithic, (2) the alignment and/or retention
fixtures comprise a material deposited on substantially a
layer-by-layer basis, or (3) the alignment and/or retention
fixtures are formed in a single process in their respective
relative positions.
22. The device of claim 21 wherein the base and at least a portion
of the alignment and/or retention fixtures are connected by a
deformable material that allows fine adjustments of the fixtures
relative to the base to be made to optimize alignment and/or
retention of components.
23. The device of claim 21 wherein the deformable material
comprises a low melting point metal that can be heated to allow
deformation.
24. The device of claim 23 wherein the deformable material is a
material that comprises a structural configuration that allows
relatively easy deformation along at least one axis.
25. The device of claim 21 wherein at least one alignment and/or
retention fixture comprises at least one stop in a direction of
motion parallel to a plane of a surface of the base.
26. The device of claim 21 wherein at least one alignment and/or
retention fixture comprises at least one stop in a direction of
motion perpendicular to a plane of a surface of the base.
27. The device of claim 21 wherein at least one retention fixture
comprises at least structure for retaining a component in a desired
position.
28. The device of claims 21 wherein at least one alignment and/or
retention fixture comprises a structure for guiding a component to
a desired position.
29. The device of claim 21 wherein at least a first alignment
and/or retention fixture is located at a first surface of the base
and at least a second alignment and/or retention fixture is located
at a second surface of the base.
30. The device of claim 21 wherein the base comprises an opening
that extends from one surface to another surface and through which
material or information may pass to or from a component aligned or
retained relative thereto.
31. The device of claim 21 wherein at least one alignment and/or
retention fixture is capable of receiving a secondary alignment
and/or retention fixture to which a component may be aligned and/or
retained.
32. The device of claim 21 wherein the alignment and/or retention
fixtures comprise a material deposited on substantially a
layer-by-layer basis or the alignment and/or retention fixtures are
formed in a single process in their respective relative positions,
and wherein the structure comprises two or more conductive paths
separated from one another by a dielectric, wherein at least one of
the paths meets at least one of the following criteria: (1) the at
least one path forms a connection between at least two electrical
contact points on a single component; (2) the at least one path
forms a connection between electrical contact points on at least
two different components; (3) the at least one path allows an
electrical connection to be made from the structure to a separate
structure; (4) the structure is located in a substantially hermetic
package and the at least one path allows an electrical connection
to be made from the structure to a separate structure that is
external to the package; (5) the at least one path makes an
electrical connection to an electrically functional device that was
formed along with the structure; (6) the at least one path
comprises a component that guides and/or modifies an RF or
microwave signal.
33. The device of claim 21 wherein at least a portion of at least
one alignment and/or retention fixture contacts the at least one
dielectric region and at least a portion of at least one alignment
and/or retention fixture contacts the at least one conductive
region.
34. The device of claim 21 wherein the structure has received
photonic components for forming a photonics device.
35. ' The device of claim 34 wherein the photonics components
include at least one optical generation, detection, or manipulation
device.
36. The device of claim 21 wherein the fixtures align and/or retain
at least one of (1) an electronic component; (2) an electrical
component; (3) a component capable of controlling or directing the
flow of a liquid or a gas; or (4) a component for modifying,
controlling, or detecting temperature.
37. The device of claims 21 wherein the structure is engaged with a
housing structure for forming a substantially hermetic cavity
around at least a portion of one surface of the base.
38. The device of claim 21 wherein the structure comprises elements
that provide an electrical functional, a thermodynamic function, an
optical or photonic function, and/or a mechanical function.
39. The device of claim 21 wherein the structure comprises at least
one fixture having a retention functionality comprising one of: (1)
a pivotable structure that includes a retention arm and an
actuation arm that move substantially in conjunction with one
another, (2) a retention arm that slides over the component and
holds one side while the opposite side is held, at least in part,
by the elastomeric deformation of a compression element, or (3) a
retention arm that engages a side of a component and inhibits the
component from backing out in a direction opposite to a loading
direction and a stop component that inhibits further inward loading
of the component.
40. The device of claim 21, wherein production of at least a
portion of the device comprises one or more of the following
operations: (1) selectively electrodepositing a first conductive
material and electrodepositing a second conductive material,
wherein one of the first or second conductive materials is a
sacrificial material and the other is a structural material; (2)
electrodepositing a first conductive material, selectively etching
the first structural material to create at least one void, and
electrodepositing a second conductive material to fill the at least
one void; (3) electrodepositing at least one conductive material,
depositing at least one flowable dielectric material, and
depositing a seed layer of conductive material in preparation for
formation of a next layer of electrodeposited material, and/or (4)
selectively electrodepositing a first conductive material, then
electrodepositing a second conductive material, then selectively
etching one of the first or second conductive materials, and then
electrodepositing a third conductive material, wherein at least one
of the first, second, or third conductive materials is a
sacrificial material and at least one of the remaining two
conductive materials is a structural material.
Description
RELATED APPLICATIONS
[0001] This application claims benefit of U.S. Provisional Patent
Application No. 60/415,374, filed Oct. 1, 2002. This prior
application is incorporated herein by reference as if set forth in
full.
FIELD OF THE INVENTION
[0002] Embodiments of this invention relate to precision alignment
and/or retention structures that may be used to align and/or retain
multiple components in desired locations relative to one another or
relative to other components that are fixed in position relative to
the alignment structure. More particularly some embodiments relates
to alignment and/or retention structures that can be prototyped or
manufactured using, at least in part, a multi-layer
electrodeposition technique known as Electrochemical
Fabrication.
BACKGROUND
[0003] A technique for forming three-dimensional structures (e.g.
parts, components, devices, and the like) from a plurality of
adhered layers was invented by Adam L. Cohen and is known as
Electrochemical Fabrication. It is being commercially pursued by
Microfabrica Inc. (formerly MEMGen.RTM. Corporation) of Burbank,
Calif. under the name EFAB.TM.. This technique was described in
U.S. Pat. No. 6,027,630, issued on Feb. 22, 2000. This
electrochemical deposition technique allows the selective
deposition of a material using a unique masking technique that
involves the use of a mask that includes patterned conformable
material on a support structure that is independent of the
substrate onto which plating will occur. When desiring to perform
an electrodeposition using the mask, the conformable portion of the
mask is brought into contact with a substrate while in the presence
of a plating solution such that the contact of the conformable
portion of the mask to the substrate inhibits deposition at
selected locations. For convenience, these masks might be
generically called conformable contact masks; the masking technique
may be generically called a conformable contact mask plating
process. More specifically, in the terminology of Microfabrica Inc.
of Burbank, Calif. such masks have come to be known as INSTANT
MASKS.TM. and the process known as INSTANT MASKING.TM. or INSTANT
MASK.TM. plating. Selective depositions using conformable contact
mask plating may be used to form single layers of material or may
be used to form multi-layer structures. The teachings of the '630
patent are hereby incorporated herein by reference as if set forth
in full herein. Since the filing of the patent application that led
to the above noted patent, various papers about conformable contact
mask plating (i.e. INSTANT MASKING) and electrochemical fabrication
have been published:
[0004] (1) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and
P. Will, "EFAB: Batch production of functional, fully-dense metal
parts with micro-scale features", Proc. 9th Solid Freeform
Fabrication, The University of Texas at Austin, p161, Aug.1998.
[0005] (2) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and
P. Will, "EFAB: Rapid, Low-Cost Desktop Micromachining of High
Aspect Ratio True 3-D MEMS", Proc. 12th IEEE Micro Electro
Mechanical Systems Workshop, IEEE, p244, Jan 1999.
[0006] (3) A. Cohen, "3-D Micromachining by Electrochemical
Fabrication", Micromachine Devices, March 1999.
[0007] (4) G. Zhang, A. Cohen, U. Frodis, F. Tseng, F. Mansfeld,
and P. Will, "EFAB: Rapid Desktop Manufacturing of True 3-D
Microstructures", Proc. 2nd International Conference on Integrated
MicroNanotechnology for Space Applications, The Aerospace Co.,
Apr.1999.
[0008] (5) F. Tseng, U. Frodis, G. Zhang, A. Cohen, F. Mansfeld,
and P. Will, "EFAB: High Aspect Ratio, Arbitrary 3-D Metal
Microstructures using a Low-Cost Automated Batch Process", 3rd
International Workshop on High Aspect Ratio Microstructure
Technology (HARMST'99), June 1999.
[0009] (6) A. Cohen, U. Frodis, F. Tseng, G. Zhang, F. Mansfeld,
and P. Will, "EFAB: Low-Cost, Automated Electrochemical Batch
Fabrication of Arbitrary 3-D Microstructures", Micromachining and
Microfabrication Process Technology, SPIE 1999 Symposium on
Micromachining and Microfabrication, September 1999.
[0010] (7) F. Tseng, G. Zhang, U. Frodis, A. Cohen, F. Mansfeld,
and P. Will, "EFAB: High Aspect Ratio, Arbitrary 3-D Metal
Microstructures using a Low-Cost Automated Batch Process", MEMS
Symposium, ASME 1999 International Mechanical Engineering Congress
and Exposition, November, 1999.
[0011] (8) A. Cohen, "Electrochemical Fabrication (EFABTM)",
Chapter 19 of The MEMS Handbook, edited by Mohamed Gad-EI-Hak, CRC
Press, 2002.
[0012] (9) "Microfabrication--Rapid Prototyping's Killer
Application", pages 1-5 of the Rapid Prototyping Report, CAD/CAM
Publishing, Inc., June 1999.
[0013] The electrochemical deposition process may be carried out in
a number of different ways as set forth in the above patent and
publications. In one form, this process involves the execution of
three separate operations during the formation of each layer of the
structure that is to be formed:
[0014] 1. Selectively depositing at least one material by
electrodeposition upon one or more desired regions of a
substrate.
[0015] 2. Then, blanket depositing at least one additional material
by electrodeposition so that the additional deposit covers both the
regions that were previously selectively deposited onto, and the
regions of the substrate that did not receive any previously
applied selective depositions.
[0016] 3. Finally, planarizing the materials deposited during the
first and second operations to produce a smoothed surface of a
first layer of desired thickness having at least one region
containing the at least one material and at least one region
containing at least the one additional material.
[0017] After formation of the first layer, one or more additional
layers may be formed adjacent to the immediately preceding layer
and adhered to the smoothed surface of that preceding layer. These
additional layers are formed by repeating the first through third
operations one or more times wherein the formation of each
subsequent layer treats the previously formed layers and the
initial substrate as a new and thickening substrate.
[0018] Once the formation of all layers has been completed, at
least a portion of at least one of the materials deposited is
generally removed by an etching process to expose or release the
three-dimensional structure that was intended to be formed.
[0019] The preferred method of performing the selective
electrodeposition involved in the first operation is by conformable
contact mask plating. In this type of plating, one or more
conformable contact (CC) masks are first formed. The CC masks
include a support structure onto which a patterned conformable
dielectric material is adhered or formed. The conformable material
for each mask is shaped in accordance with a particular
cross-section of material to be plated. At least one CC mask is
needed for each unique cross-sectional pattern that is to be
plated.
[0020] The support for a CC mask is typically a plate-like
structure formed of a metal that is to be selectively electroplated
and from which material to be plated will be dissolved. In this
typical approach, the support will act as an anode in an
electroplating process. In an alternative approach, the support may
instead be a porous or otherwise perforated material through which
deposition material will pass during an electroplating operation on
its way from a distal anode to a deposition surface. In either
approach, it is possible for CC masks to share a common support,
i.e. the patterns of conformable dielectric material for plating
multiple layers of material may be located in different areas of a
single support structure. When a single support structure contains
multiple plating patterns, the entire structure is referred to as
the CC mask while the individual plating masks may be referred to
as "submasks". In the present application such a distinction will
be made only when relevant to a specific point being made.
[0021] In preparation for performing the selective deposition of
the first operation, the conformable portion of the CC mask is
placed in registration with and pressed against a selected portion
of the substrate (or onto a previously formed layer or onto a
previously deposited portion of a layer) on which deposition is to
occur. The pressing together of the CC mask and substrate occur in
such a way that all openings, in the conformable portions of the CC
mask contain plating solution. The conformable material of the CC
mask that contacts the substrate acts as a barrier to
electrodeposition while the openings in the CC mask that are filled
with electroplating solution act as pathways for transferring
material from an anode (e.g. the CC mask support) to the
non-contacted portions of the substrate (which act as a cathode
during the plating operation) when an appropriate potential and/or
current are supplied.
[0022] An example of a CC mask and CC mask plating are shown in
FIGS. 1(a)-1(c). FIG. 1(a) shows a side view of a CC mask 8
consisting of a conformable or deformable (e.g. elastomeric)
insulator 10 patterned on an anode 12. The anode has two functions.
FIG. 1(a) also depicts a substrate 6 separated from mask 8. One is
as a supporting material for the patterned insulator 10 to maintain
its integrity and alignment since the pattern may be topologically
complex (e.g., involving isolated "islands" of insulator material).
The other function is as an anode for the electroplating operation.
CC mask plating selectively deposits material 22 onto a substrate 6
by simply pressing the insulator against the substrate then
electrodepositing material through apertures 26a and 26b in the
insulator as shown in FIG. 1(b). After deposition, the CC mask is
separated, preferably non-destructively, from the substrate 6 as
shown in FIG. 1(c). The CC mask plating process is distinct from a
"through-mask" plating process in that in a through-mask plating
process the separation of the masking material from the substrate
would occur destructively. As with through-mask plating, CC mask
plating deposits material selectively and simultaneously over the
entire layer. The plated region may consist of one or more isolated
plating regions where these isolated plating regions may belong to
a single structure that is being formed or may belong to multiple
structures that are being formed simultaneously. In CC mask plating
as individual masks are not intentionally destroyed in the removal
process, they may be usable in multiple plating operations.
[0023] Another example of a CC mask and CC mask plating is shown in
FIGS. 1(d)-1(f). FIG. 1(d) shows an anode 12' separated from a mask
8' that comprises a patterned conformable material 10' and a
support structure 20. FIG. 1(d) also depicts substrate 6 separated
from the mask 8'. FIG. 1(e) illustrates the mask 8' being brought
into contact with the substrate 6. FIG. 1(f) illustrates the
deposit 22' that results from conducting a current from the anode
12' to the substrate 6. FIG. 1(g) illustrates the deposit 22' on
substrate 6 after separation from mask 8'. In this example, an
appropriate electrolyte is located between the substrate 6 and the
anode 12' and a current of ions coming from one or both of the
solution and the anode are conducted through the opening in the
mask to the substrate where material is deposited. This type of
mask may be referred to as an anodeless INSTANT MASK.TM. (AIM) or
as an anodeless conformable contact (ACC) mask.
[0024] Unlike through-mask plating, CC mask plating allows CC masks
to be formed completely separate from the fabrication of the
substrate on which plating is to occur (e.g. separate from a
three-dimensional (3D) structure that is being formed). CC masks
may be formed in a variety of ways, for example, a
photolithographic process may be used. All masks can be generated
simultaneously, prior to structure fabrication rather than during
it. This separation makes possible a simple, low-cost, automated,
self-contained, and internally-clean "desktop factory" that can be
installed almost anywhere to fabricate 3D structures, leaving any
required clean room processes, such as photolithography to be
performed by service bureaus or the like.
[0025] An example of the electrochemical fabrication process
discussed above is illustrated in FIGS. 2(a)-2(f). These figures
show that the process involves deposition of a first material 2
which is a sacrificial material and a second material 4 which is a
structural material. The CC mask 8, in this example, includes a
patterned conformable material (e.g. an elastomeric dielectric
material) 10 and a support 12 which is made from deposition
material 2. The conformal portion of the CC mask is pressed against
substrate 6 with a plating solution 14 located within the openings
16 in the conformable material 10. An electric current, from power
supply 18, is then passed through the plating solution 14 via (a)
support 12 which doubles as an anode and (b) substrate 6 which
doubles as a cathode. FIG. 2(a), illustrates that the passing of
current causes material 2 within the plating solution and material
2 from the anode 12 to be selectively transferred to and plated on
the cathode 6. After electroplating the first deposition material 2
onto the substrate 6 using CC mask 8, the CC mask 8 is removed as
shown in FIG. 2(b). FIG. 2(c) depicts the second deposition
material 4 as having been blanket-deposited (i.e. non-selectively
deposited) over the previously deposited first deposition material
2 as well as over the other portions of the substrate 6. The
blanket deposition occurs by electroplating from an anode (not
shown), composed of the second material, through an appropriate
plating solution (not shown), and to the cathode/substrate 6. The
entire two-material layer is then planarized to achieve precise
thickness and flatness as shown in FIG. 2(d). After repetition of
this process for all layers, the multi-layer structure 20 formed of
the second material 4 (i.e. structural material) is embedded in
first material 2 (i.e. sacrificial material) as shown in FIG. 2(e).
The embedded structure is etched to yield the desired device, i.e.
structure 20, as shown in FIG. 2(f).
[0026] Various components of an exemplary manual electrochemical
fabrication system 32 are shown in FIGS. 3(a)-3(c). The system 32
consists of several subsystems 34, 36, 38, and 40. The substrate
holding subsystem 34 is depicted in the upper portions of each of
FIGS. 3(a) to 3(c) and includes several components: (1) a carrier
48, (2) a metal substrate 6 onto which the layers are deposited,
and (3) a linear slide 42 capable of moving the substrate 6 up and
down relative to the carrier 48 in response to drive force from
actuator 44. Subsystem 34 also includes an indicator 46 for
measuring differences in vertical position of the substrate which
may be used in setting or determining layer thicknesses and/or
deposition thicknesses. The subsystem 34 further includes feet 68
for carrier 48 which can be precisely mounted on subsystem 36.
[0027] The CC mask subsystem 36 shown in the lower portion of FIG.
3(a) includes several components: (1) a CC mask 8 that is actually
made up of a number of CC masks (i.e. submasks) that share a common
support/anode 12, (2) precision X-stage 54, (3) precision Y-stage
56, (4) frame 72 on which the feet 68 of subsystem 34 can mount,
and (5) a tank 58 for containing the electrolyte 16. Subsystems 34
and 36 also include appropriate electrical connections (not shown)
for connecting to an appropriate power source for driving the CC
masking process.
[0028] The blanket deposition subsystem 38 is shown in the lower
portion of FIG. 3(b) and includes several components: (1) an anode
62, (2) an electrolyte tank 64 for holding plating solution 66, and
(3) frame 74 on which the feet 68 of subsystem 34 may sit.
Subsystem 38 also includes appropriate electrical connections (not
shown) for connecting the anode to an appropriate power supply for
driving the blanket deposition process.
[0029] The planarization subsystem 40 is shown in the lower portion
of FIG. 3(c) and includes a lapping plate 52 and associated motion
and control systems (not shown) for planarizing the
depositions.
[0030] Another method for forming microstructures from
electroplated metals (i.e. using electrochemical fabrication
techniques) is taught in U.S. Pat. No. 5,190,637 to Henry Guckel,
entitled "Formation of Microstructures by Multiple Level Deep X-ray
Lithography with Sacrificial Metal layers. This patent teaches the
formation of metal structure utilizing mask exposures. A first
layer of a primary metal is electroplated onto an exposed plating
base to fill a void in a photoresist, the photoresist is then
removed and a secondary metal is electroplated over the first layer
and over the plating base. The exposed surface of the secondary
metal is then machined down to a height which exposes the first
metal to produce a flat uniform surface extending across the both
the primary and secondary metals. Formation of a second layer may
then begin by applying a photoresist layer over the first layer and
then repeating the process used to produce the first layer. The
process is then repeated until the entire structure is formed and
the secondary metal is removed by etching. The photoresist is
formed over the plating base or previous layer by casting and the
voids in the photoresist are formed by exposure of the photoresist
through a patterned mask via X-rays or UV radiation.
[0031] Electrochemical Fabrication provides the ability to form
prototypes and commercial quantities of miniature objects, parts,
structures, devices, and the like at reasonable costs and in
reasonable times. In fact, Electrochemical Fabrication is an
enabler for the formation of many structures that were hitherto
impossible to produce. Electrochemical Fabrication opens the design
and product spectrum in many industrial fields. Even though
Electrochemical Fabrication offers this new capability and it is
understood that Electrochemical Fabrication techniques can be
combined with designs and structures known within various fields to
produce new structures, certain uses for Electrochemical
Fabrication provide designs, structures, capabilities and/or
features not known or obvious in view of the state of the art
within the field or fields of a specific application.
[0032] A need exists in the field of aligning and/or retaining
components, and particularly in the field of precision alignment
structures and/or retention structures, for enhanced alignment
and/or retention methods and structures that can be used to reduce
manufacturing costs, enhance reliability of assemblies, reduce the
amount of labor, or skilled labor required to align and/or retain
critical components.
SUMMARY OF THE INVENTION
[0033] An object of various aspects of the invention is to provide
improved alignment and/or retention structures for receiving
components.
[0034] An object of various aspects of the invention is to provide
a reduction in manufacturing costs for devices requiring the
alignment and/or retention of various components.
[0035] An object of various aspects of the invention is to provide
a reduction in skilled labor required to assemble devices having
components that need precise relative alignment and/or
retention.
[0036] Other objects and advantages of various aspects of the
invention will be apparent to those of skill in the art upon review
of the teachings herein. The various aspects of the invention, set
forth explicitly herein or otherwise ascertained from the teaching
herein, may address any one of the above objects alone or in
combination, or alternatively may address some other object of the
invention ascertained from the teachings herein. It is not intended
that all of these objects be addressed by any single aspect of the
invention even though that may be the case with regard to some
aspects.
[0037] It is an aspect of the invention to provide an alignment
and/or retention structure for receiving a plurality of components,
that includes a base; a plurality of alignment and/or retention
fixtures attached to the base and having desired positions relative
to one another, wherein one or more of the following conditions are
met: (1) the base and the alignment and/or retention fixtures are
substantially monolithic, (2) the alignment and/or retention
fixtures comprise at least one material deposited on substantially
a layer-by-layer basis, or (3) the alignment and/or retention
fixtures are formed in a single process in their respective
relative positions.
[0038] It is an aspect of the invention to provide a device, that
includes (a) an alignment and/or retention structure, that includes
(1) a base; (2) a plurality of alignment and/or retention fixtures
adhered to the base and having desired positions relative to one
another; (b) a plurality of components mounted on the alignment
structure in positions dictated by the alignment and/or retention
fixtures, wherein one or more of the following conditions are met:
wherein one or more of the following conditions are met: (1) the
base and the alignment and/or retention fixtures are monolithic,
(2) the alignment and/or retention fixtures comprise a material
deposited on substantially a layer-by-layer basis, or (3) the
alignment and/or retention fixtures are formed in a single process
in their respective relative positions.
[0039] Further aspects of the invention will be understood by those
of skill in the art upon reviewing the teachings herein. Other
aspects of the invention may involve combinations of the above
noted aspects of the invention. Other aspects of the invention may
involve methods and/or apparatus that can be used in implementing
one or more of the above aspects of the invention. These other
aspects of the invention may provide various combinations of the
aspects presented above as well as provide other configurations,
structures, functional relationships, and processes that have not
been specifically set forth above.
[0040] Preferred embodiments are directed to permanent or temporary
alignment structures for receiving multiple components. The
structures are preferably formed monolithically via a plurality of
deposition operations (e.g. electrodeposition operations). The
structures typically include two or more positioning features that
control or aid in the positioning of components relative to one
another, such features may include (1) positioning guides or stops
that fix or at least partially limit the positioning of components
in one or more orientations or directions, (2) retention elements
that hold positioned components in desired orientations or
locations, and (3) positioning and/or retention elements that
receive and hold adjustment modules into which components can be
fixed and which in turn can be used for fine adjustments of
position and/or orientation of the components. The structures may
also include elements that bring functionality beyond that of
mechanical alignment and retention. Such functionality may involve
electrical function, a thermodynamic function, optical or photonic
function, and/or a mechanical function. Conductive paths may be
provided on a structure to allow off- structure communication as
well as on-structure communication. On structure communication may
occur within single components, between single components and
functional elements, or between multiple components with or without
intermediate functional element enhancements.
BRIEF DESCRIPTION OF THE DRAWINGS
[0041] FIGS. 1(a)-1(c) schematically depict side views of various
stages of a CC mask plating process, while FIGS. 1(d)-(g)
schematically depict a side views of various stages of a CC mask
plating process using a different type of CC mask.
[0042] FIGS. 2(a)-2(f) schematically depict side views of various
stages of an electrochemical fabrication process as applied to the
formation of a particular structure where a sacrificial material is
selectively deposited while a structural material is blanket
deposited.
[0043] FIGS. 3(a)-3(c) schematically depict side views of various
example subassemblies that may be used in manually implementing the
electrochemical fabrication method depicted in FIGS. 2(a)-2(f).
[0044] FIGS. 4(a)-4(i) schematically depict the formation of a
first layer of a structure using adhered mask plating where the
blanket deposition of a second material overlays both the openings
between deposition locations of a first material and the first
material itself.
[0045] FIG. 5(a) depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
alignment and/or retention fixtures protrude from a base.
[0046] FIG. 5(b) depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
alignment and/or retention fixtures are recessed into a base.
[0047] FIG. 6 depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
some alignment and/or retention fixtures protrude from a base and
other alignment fixtures are recessed into the base.
[0048] FIG. 7 depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
some alignment and/or retention fixtures are located on an upper
surface of a base and where other alignment and/or retention
fixtures are located on a lower surface of the base.
[0049] FIG. 8 depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
the alignment and/or retention fixtures are located on an upper
surface of a base and other alignment and/or retention fixtures are
located on the sides of the base.
[0050] FIG. 9 depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
alignment and/or retention fixtures are stacked upon one
another.
[0051] FIG. 10 depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
some alignment and/or retention structures are formed on an upper
surface of the base and openings extend through the base between
its upper and lower surfaces.
[0052] FIGS. 11(a) and 11(b) depict schematic representations of
alignment and/or retention structures for receiving multiple
components where the structures include conductive paths and/or
other built-in functional structures or features.
[0053] FIG. 12 depicts a schematic representation of an alignment
and/or retention structure for receiving multiple components where
the structure includes a preliminary alignment and/or retention
fixture that can receive a secondary alignment and/or retention
fixture which in turn can receive a component.
[0054] FIG. 13 depicts a perspective view of a first preferred
protruding-type fixture along with a schematic representation of a
component that can be located thereby.
[0055] FIG. 14 depicts a perspective view of a second preferred
protruding-type fixture along with a schematic representation of a
component that can be located thereby.
[0056] FIG. 15 depicts a perspective view of a third preferred
protruding-type fixture along with a schematic representation of a
component located thereby.
[0057] FIG. 16(a) depicts a perspective view of a fourth preferred
protruding-type fixture along with a schematic representation of a
component located thereby while FIG. 16(b) depicts a side view of
the component loaded into and retained by the fixture of FIG.
16(a).
[0058] FIGS. 17(a) and 17(b) depict side views of a fifth preferred
protruding-type fixture along with a schematic representation of a
component located and retained thereby.
[0059] FIG. 17(c) depicts a side view of several alternative
compressive structures that can be used in an alignment and
retention fixture such as that depicted in FIGS. 17(a) and
17(b).
[0060] FIGS. 18(a) and 18(b) depict perspective views of a seventh
protruding-type fixture along with a schematic representation of a
component located thereby.
[0061] FIGS. 19(a) and 19(b) depict perspective views of an eighth
preferred protruding-type fixture along with a schematic
representation of a component located thereby.
[0062] FIGS. 20(a) and 20(b) depict perspective views of a ninth
preferred protruding-type fixture along with a schematic
representation of a component located and retained thereby.
[0063] FIG. 21 depicts a perspective view of a first and second
preferred recessed-type fixture along with a schematic
representation of a component that can be located thereby.
[0064] FIG. 22 depicts a perspective view of a third preferred
recessed-type fixture along with a schematic representation of a
component that can be located and retained thereby.
[0065] FIGS. 23(a) and 23(b) depict side views of an fourth
preferred recessed-type fixture along with a schematic
representation of a component located and retained thereby.
[0066] FIG. 24 depicts a perspective view of a portion of an
alignment and retention structure that includes four variations of
fixtures and associated components where the components may be
mounted and then moved relative to the rest of the structure so
that precision positional adjustments may be made beyond those
associated with the initial mounting.
[0067] FIG. 25 depicts a perspective view of a portion of an
alignment and retention structure including a fixture that may be
deformed at an intermediate position between a component mounting
location and the rest of the structure so that the component
location may be adjusted relative to the rest of the structure
beyond that associated with the initial mounting of the
component.
[0068] FIG. 26(a) and 26(b) depict side views of an alignment and
retention structure that includes a fixture having retention
elements, guide elements, and electrical contact elements that are
independent of but positioned relative to the other components of
the fixture.
[0069] FIG. 27(a) and 27(b) depict side views of a portion of an
alternative alignment and retention structure that includes a
fixture having retention clips that are closed onto the component
as the component is loaded into the fixture.
[0070] FIG. 28(a) depicts a variation of the alignment and
retention structure of FIGS. 27(a) and 27(b) where the moving
portion of the fixture engages another portion of the structure to
help lock the fixture/component in a retention position.
[0071] FIG. 28(b) depicts a variation of the alignment and
retention structure of FIGS. 27(a) and 27(b) where the fixture
includes outward facing levers that may be used to move the
structure from a retention position to an open position.
[0072] FIGS. 29(a)-29(c) depict perspective views of a device that
contains an alignment and/or retention structure, components, and a
packaging structure having passages for various
internal-to-external connections.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0073] FIGS. 1(a)-1(g), 2(a)-2(f), and 3(a)-3(c) illustrate various
features of one form of electrochemical fabrication that are known.
Other electrochemical fabrication techniques are set forth in the
'630 patent referenced above, in the various previously
incorporated publications, in various other patents and patent
applications incorporated herein by reference, still others may be
derived from combinations of various approaches described in these
publications, patents, and applications, or are otherwise known or
ascertainable by those of skill in the art from the teachings set
forth herein. All of these techniques may be combined with those of
the various embodiments of various aspects of the invention to
yield enhanced embodiments. Still other embodiments may be derived
from combinations of the various embodiments explicitly set forth
herein.
[0074] FIGS. 4(a)-4(i) illustrate various stages in the formation
of a single layer of a multi-layer fabrication process where a
second metal is deposited on a first metal as well as in openings
in the first metal where its deposition forms part of the layer. In
FIG. 4(a), a side view of a substrate 82 is shown, onto which
patternable photoresist 84 is cast as shown in FIG. 4(b). In FIG.
4(c), a pattern of resist is shown that results from the curing,
exposing, and developing of the resist. The patterning of the
photoresist 84 results in openings or apertures 92(a)-92(c)
extending from a surface 86 of the photoresist through the
thickness of the photoresist to surface 88 of the substrate 82. In
FIG. 4(d), a metal 94 (e.g. nickel) is shown as having been
electroplated into the openings 92(a)-92(c). In FIG. 4(e), the
photoresist has been removed (i.e. chemically stripped) from the
substrate to expose regions of the substrate 82 which are not
covered with the first metal 94. In FIG. 4(f), a second metal 96
(e.g., silver) is shown as having been blanket electroplated over
the entire exposed portions of the substrate 82 (which is
conductive) and over the first metal 94 (which is also conductive).
FIG. 4(g) depicts the completed first layer of the structure which
has resulted from the planarization of the first and second metals
down to a height that exposes the first metal and sets a thickness
for the first layer. In FIG. 4(h) the result of repeating the
process steps shown in FIGS. 4(b)-4(g) several times to form a
multi-layer structure are shown where each layer consists of two
materials. For most applications, one of these materials is removed
as shown in FIG. 4(i) to yield a desired 3-D structure 98 (e.g.
component or device).
[0075] FIG. 5(a) depicts a schematic representation of an alignment
and/or retention structure 100 for receiving multiple components
where alignment and/or retention fixtures 104-109 protrude from a
base 102. In the example of FIG. 5(a), boxes 104-109 represent the
six alignment and/or retention structures that extend from a base
plate 102. The fixtures may be configured, positioned, and oriented
for acceptance of specifically sized and configured components for
loading in specific orders and from specific orientations. As such,
the fixtures may have different sizes, orientations, and
configurations as exemplified in FIG. 5(a). It should be understood
(even though not depicted), the fixtures need not have a
rectangular structure but may take on any structural configuration
that is appropriate to the component or components to be aligned or
retained. In the illustration of FIG. 5(a), all structural features
within the boxes may be considered part of the alignment structures
themselves while those outside the boxes maybe considered part of
the base.
[0076] FIG. 5(b) depicts a schematic representation of an alignment
and/or retention structure 110 for receiving multiple components
where alignment fixtures 114-118 are recessed into a base 112. In
the illustration of FIG. 5(b) , all structural features within the
box-like depressions may be considered part of the alignment
structures themselves while those outside the boxes maybe
considered part of the base. As with protruding alignment fixtures
recessed alignment fixtures may take on any appropriate
configuration or orientation.
[0077] In some preferred embodiments the base need not have the
substantially rectangular configurations as shown in the
illustrations of the present applications, the configuration of the
base may take on any form appropriate to a given situation. In the
present application, the term "base" shall refer to any structure
that connects two or more alignment fixtures together (unless more
narrowly limited by the context) and not just the structural
configuration depicted. For example, a base may be a single
bar-like structure that connects two fixtures; it may be a rigid
gird-like structure that connects two or more fixtures; it may not
be planar but may have features that extend in three dimensions; it
may not be a single structure that connects all fixtures but may be
in the form of segmented elements that connect a only a portion of
the fixtures; or the surfaces of what might be considered part of
the fixtures themselves may function as a base if those surfaces
join other fixtures.
[0078] FIG. 6 depicts a schematic representation of an alignment
and/or retention structure 120 for receiving multiple components
where some alignment and/or retention fixtures 124 and 126 protrude
from a base 122 and other alignment and/or retention fixtures 125
and 127 are recessed into the base 122. In other embodiments,
alignment and or retention fixtures may be of a mixed nature in
that a portion of fixtures may be recessed while another portion
may protrude from a base.
[0079] FIG. 7 depicts a schematic representation of an alignment
and/or retention structure 130 for receiving multiple components
where some alignment and/or retention fixtures 133-138 are located
on an upper surface of a base 132 and where other alignment and/or
retention fixtures 143, 144, and 148 are located on a lower surface
of the base.
[0080] FIG. 8 depicts a schematic representation of an alignment
and/or retention structure 150 for receiving multiple components
where the alignment and/or retention fixtures 153 and 154 are
located on an upper surface of a base 152 and other alignment
and/or retention fixtures 163-169 and 173 are located on the sides
of the base. As depicted fixtures 165-168 are recessed into the
base, while 163, 164, 169, and 173 protrude from a nominal side
surface of the base. One or more of the fixtures and most
particularly one or more of the side fixtures 163-169, and 173 may
be used in aligning the structure with second alignment and/or
retention structure or with a package that is to receive the
alignment and/or retention structure. The side fixtures may be used
solely as alignment guides or may be used for retention purposes as
well. Of course, in some preferred embodiments, side fixtures may
take on different configurations and/or side fixtures may be used
in conjunction with the various other alternative fixtures set
forth herein. In some embodiments, fixtures on upper or lower
surfaces of a base may be used in aligning a first alignment and/or
retention structures with a second such structure.
[0081] FIG. 9 depicts a schematic representation of another
preferred alignment and/or retention structure 180 for receiving
multiple components where alignment and/or retention fixtures 184
and 186 are stacked above alignment and/or retention fixtures 183
and 185 respectively. Upper fixtures may be supported from lower
fixtures (i.e. a portion of the lower fixture functions as a base
for the upper fixture) as illustrated in conjunction with fixtures
184 and 183 or upper fixtures may be supported directly from
extensions of the alignment fixture or extensions that protrude
from the base as illustrated by extensions 187a-187c that support
or at least help support fixture 186 directly from base 182. Of
course, in alternative embodiments fixtures may be stacked within
recesses that extend into the base and may also include further
stacking above the base. In still other embodiments fixturing
elements may be included as part of the packaging of previously
loaded components. In some embodiments heat conductive pastes and
the like may be used to achieve desired component to base
properties.
[0082] FIG. 10 depicts a schematic representation of an alignment
and/or retention structure 190 for receiving multiple components
where some alignment and/or retention fixtures 193 and 194 are
formed on an upper surface of a base 192 and openings 195 and 196
extend through the base from an upper to a lower surface. The
openings that extend through the base may serve several functions:
(1) they may include component alignment or retention fixtures for
receiving components, such as when component placement and loading
order requires loading of components from both sides, (2) they may
form passageways through the base that allow communication of
signals or material flow between upper and lower regions, e.g.
optical signals, gas or liquid flow, and the like, or (3) they may
perform some other design function, such as reducing material
consumption, improving manufacturability, providing clearance for
other structures, and the like. Fixtures and components may be
located above or below openings. Such locations may aid in
production or reception of signals or production of, receipt of,
directing of, or controlling of material flow that moves through
the opening. The openings through the base need not be orientated
perpendicular to a plane of the base but may be orientated in any
convenient or required manner. The openings may actually take the
form of simple or complex two or three dimensional paths (e.g.
manifolds and the like) that may direct signals or material flow in
a desired pattern. In the case of EM signal flow, the openings may
not be physical openings but may be physically obstructed with a
medium that allows transmission of the desired signal, e.g. for
optical signals a glass barrier may be located in the opening, and
for RF or microwave signals an appropriate dielectrical may be
located in a wave-guide or coaxial-type transmission line. Such
obstructing materials may or may not be considered components
mounted in a fixture. In Particular they may not be considered
components when they are formed or built up along with the
formation of the structure itself.
[0083] FIGS. 11(a) and 11(b) depict schematic representations of
alignment and/or retention structures 200 and 210 for receiving
multiple components where the structures include conductive paths
and/or other functional structures, elements, or devices built into
bases 202 and 212. FIG. 11(a) depicts alignment and/or retention
fixtures 207-209 located on the upper surface of base 202. The
upper surface of the base is depicted as having off-structure
communicating conductive paths 203a and 203b, on-structure
component-to-component communicating paths 204a-204c, and
on-structure paths for communicating between different portions of
a single components 205a-205c. FIG. 11(b) depicts alignment and/or
retention fixtures 217 and 218 located on the upper surface of base
212. The upper surface of the base 212 is depicted as having
off-structure communicating conductive paths 213a and 213b,
on-structure component-to-component communicating paths 214a-214d,
on structure paths for communicating between different portions of
a single component 215a-215e, and built-in functional elements
219a-219g.
[0084] Paths 203a, 203b, 213a, and 213b allow communication from
the components that will be associated with their respective
structures to devices or components that are not associated with
these respective structures. The signals along these paths may take
the form of a simple power input or output, or signal input or
output, or some combination of both. As path 203b connects fixtures
207 and 209 and as path 213b connects fixtures 217 and 218, on
structure communication between components may also occur.
[0085] As indicated, paths 205a-205c and 215a-215e make external
connections between different portions of a single component. This
type of connection may occur within the boundary of an alignment
and/or retention fixture or it may extend beyond such a boundary.
Such connections can be useful for a variety of reasons. As
indicated by path 215a and 215b and also by 215c and 215d, such
paths may allow the connection to be made via functional elements
such as 219b and 219f. These functional elements may be formed
along with the formation of the base and fixtures. These
elements/structures may introduce many different functionalities,
for example resistance, capacitance, inductance, wave shaping (e.g.
coaxial transmission or filtering), testing functionality, or
monitoring functionality, and the like. Additional embedded
functional elements (such as 219a) may not be connected to other
structures or components by electrically conductive paths but
instead provide some other functionality such as, for example,
production of magnetic fields, enhanced heat flow (e.g. via heat
pipes), or enhanced reflectivity.
[0086] In alternative embodiments, the functional elements may be
connected conductively, capacitively, or inductively to
off-structure devices. In still other embodiments the functional
elements may be formed on the fixtures instead on the bases.
Furthermore, conductive paths may run partly or completely on or
into the alignment and/or retention fixtures. In some embodiments,
portions of the base, or substantially the entire base, and/or
portions of the alignment and/or retention fixtures, or
substantially the entire fixtures, may be formed from a dielectric
material with the exception of the conductive paths or functional
elements that require conductive materials. In other embodiments,
the bases and the fixtures may be primarily formed from a
conductive material with only a relatively thin region of
dielectric separating the conductive paths from the rest of the
conductive material. In still further alternative embodiments, the
conductive paths and/or functional components may be completely
embedded within dielectric portions of the base or within
dielectric portions of the fixtures with the exception of those
locations where contact must be made. In other alternative
embodiment on surface conducting paths may be coated or otherwise
shielded by a dielectric.
[0087] FIG. 12 depicts a schematic representation of an alignment
and/or retention structure 230 for receiving multiple components
where the structure includes a preliminary alignment and/or
retention fixture 233, in base 232, that can receive a secondary
alignment and/or retention fixture 234 which in turn can receive a
component 236. The depicted structure also contains an additional
alignment and/or retention fixture 235. In alternative embodiments
multiple primary and secondary fixture pairs may exist. In still
further embodiments even tertiary or higher order groups of
fixtures may exist. Such fixture groups may be useful to allow
height or orientation changes in component fixturing to occur. Such
versatility might be helpful in allowing a single alignment and/or
retention structure to be used in multiple applications where
differing components or numbers of components might be involved. In
some alternative embodiments secondary fixtures may allow multiple
components to be attached. In some other alternative embodiments
the secondary fixtures may make conductive paths that connect to
conductive paths on the primary fixtures.
[0088] FIG. 13 depicts a perspective view of a first preferred
protruding-type alignment (or positioning) fixture 240 along with a
schematic representation of a component 249 that can be located
thereby. The fixture of FIG. 13 includes four alignment elements
243a-243d that hold the corners of component 249. As illustrated,
the alignment elements 243a-243d do not necessarily aid in guiding
the component into the fixture though they do ensure that once the
component is lowered completely into the fixture it is properly
located in all three-dimensions (assuming the fixture is mounted
from below by the base whose surface functions as part of the
fixture). In alternative embodiments, fewer or more fixturing
elements may be used and different configurations (e.g. having
different heights and widths) may be used. In particular, if a
component has particular features, the fixturing elements may be
sized and positioned appropriately to either catch or avoid the
features. In still further alternatives, tapering of the inside
upper edges of the alignment elements can help guide the component
into the fixture and likewise tapering of the lower edges of the
component can also help in the guiding process. In some alternative
embodiments the fixtures may include vertical stops as well. In the
depicted embodiment frictional forces may be used to help retain
the component in the fixture. If it is desired that the component
be firmly affixed in the fixture, alternative embodiments may use
various techniques for securing the component and the fixture, for
example: (1) a desired type of adhesive may be located between the
component and a base (not shown) on which the fixture sits, (2) an
adhesive may be located between the fixture elements and the
components, (3) cooling of the component and/or heating of fixture
may be used to temporarily increase or create a desired size
differential between the component and the fixture to allow tightly
fitting pieces to be positioned where after temperature
equalization will cause a more intimate mating and retention of the
pieces; (4) solder or the like may be selectively applied to
desired locations (e.g. electrical contact regions) or blanket
deposited if shorting is not an issue so that after positioning,
melting and resolidification of the solder may cause bonding as
well as ensuring reliable electrical contact, (5) other conductive
and/or non-conductive meltable or temporarily flowable or
deformable materials may be used in a manner analogous to that
noted above for solder, (6) packaging of the
component(s)/structure(s) may involve a partial or complete
embedding of the components in a selected material within a package
that includes the structures, or (7) packaging of the
component(s)/structure(s) may involve the used of an enclosure that
holds the component(s)/structure(s) together.
[0089] FIG. 14 depicts a perspective view of a second preferred
protruding-type fixture 250 along with a schematic representation
of a component 259 that can be located thereby. The fixture of FIG.
14 includes four alignment elements 253a-253d that hold the sides
of component 249. As with FIG. 13, as depicted, the alignment
elements 253a-253d do not necessarily aid greatly in guiding the
component into the fixture. The alternatives noted above with
regard to FIG. 13 are also applicable to the embodiment illustrated
in FIG. 14 and are largely applicable to the other embodiments
explicitly set forth below as well as other embodiments that will
be apparent to those of skill in the art that have studied the
teachings herein.
[0090] FIGS. 15 depicts a perspective view of a third preferred
protruding-type fixture 260 along with a schematic representation
of a component 269 that may be located thereby. Fixture elements
263a-263d not only properly locate the component but due to their
tapered configuration they also can help guide the component into
the fixture. In alternative embodiments, the tapering need not be
uniform but may be greater at the top of the fixture elements. In
alternative embodiments the tapering may reduce to nothing as the
width of the opening offered by the alignment structure approaches
the width of the component. In some alternatives, upper surfaces of
the bases may function as a vertical stop or additional elements or
stop features may be considered part of the fixture itself.
[0091] FIGS. 16(a) depicts a perspective view of a fourth preferred
protruding-type fixture 270 along with a schematic representation
of a component 279 located thereby while FIG. 16(b) depicts aside
view of the component 279 loaded into and retained by the fixture
270. FIG. 16(a) illustrates a component 279 located above an
alignment and retention fixture. The down-facing arrows 275a-275d
indicate the movement of component that may be used to load the
component into the fixture. The fixture 270 includes a perimeter
wall 274 and four inward-facing, downward-sloping side retention
tabs 273a-273d. A portion of the base 272 of the alignment
structure can also be seen. As the component is loaded into the
fixture the tabs 273a-273d bend down sufficiently to allow the
component to enter the fixture but due to their at least partial
elastic deformation they exert an inward pointing forces onto the
component which tends to center the component in the fixture and
hold the component in place friction between the tabs and
components inhibit an upward backing out of the component from the
fixture.
[0092] In some alternative embodiments, the components may have
sets of side slots that engage the tabs 273a-273d, or the like,
which may be useful in helping the desired positions of the
component and fixture. In other alternatives, additional tabs may
be used and/or the tab structure may be varied (e.g. tab width and
thickness may vary (e.g. decrease) with length from the perimeter
wall 274. In other embodiments, the perimeter wall may be replaced
by individual tab supports. In still other embodiments, the
retention tabs may enter indentations in the component side walls
to further aid in securing the component into a desired position
relative to the alignment/retention structure.
[0093] FIGS. 17(a) and 17(b) depict side views of a fifth preferred
protruding-type fixture 280 along with a schematic representation
of a component 289 located and retained thereby. The fixture
includes retention arms 283a and 283b along with compression
elements 284a and 284b. As the component 289 is push down into the
fixture, retention arms 283a and 283b are forced open. As the
component is pushed deeper into the fixture, the bottom of the
component encounters the compression elements and pushes them
downward. As downward motion continues, the upper portion of the
component clears the retention arms 283a and 283b and they slide
inward such that fingers 285a and 285b become located above the
upper surface of the component. When the downward loading force is
removed, the compression elements push the component upward causing
fingers 285a and 285b to grasp the upper surface of the component
such that the component is firmly held between the retention arms
and compression elements. As illustrated both the retention arms
and the compression elements are mounted on or formed integral with
a base 282 of the alignment and retention structure.
[0094] In some embodiments one or more of the compression elements
may be electrical conductors and contactors and/or one or more of
the retention arms may be electrical conductors and contactors. The
elements that are electrical contactors may be formed of any
desired conductive material (e.g. copper or a gold plated material)
and they may be connected to conductive paths on or within the
base. In some embodiments, additional structures may be added to
aid in guiding the component into the fixture (see for example
elements 386a and 386b of FIG. 27(a)). In some embodiments more
than two compression springs and retention arms may be used, the
springs and arms may be paired or otherwise grouped or there may be
different numbers of each. In some embodiments, the compression
springs may be configured differently, such as for example, like
those indicated in FIG. 17(c).
[0095] FIG. 17(c) depicts four examples of different alternative
configurations 286a-286d with each mounted on a base 282'. Each of
the alternative configurations depicted in FIG. 17(c) may have a
contact region made from a different material as indicated by
elements 287a-287d (particularly if used as an electrical
contactor). In some embodiments, instead of retention arms that
hold a component from a surface perpendicular to the loading
direction (e.g. top surface) retention tabs (similar to those shown
in FIGS. 16a and 16b) may be used that hold the components on a
surface that is more parallel to the direction of loading (e.g. the
side surfaces). In still further alternatives a single compression
element or retention arm may have more than one element or finger
that contacts the component. In still other embodiments, components
may have slots or indentations on their upper and/or lower surfaces
for engaging the fingers and/or compression elements. In still
other embodiments fixtures configurations may be used that allow
for spring based loading and spring based release. In even further
embodiments base 282 may have a hole through it to allow signal or
material access to the lower surface of the component.
[0096] FIGS. 18(a) and 18(b) depict perspective views of a seventh
protruding-type fixture 290 along with a schematic representation
of a component 299 located thereby. In FIG. 18(a) a component 299
is depicted separate from a two stop 293a and 293b alignment
fixture 290 that is mounted on a base 292. The component is loaded
into the fixture so that two of the sides are caught and held by
the two stops 293a and 293b. The two stops constrain the component
in a first direction along both of the two horizontal axes and in
the vertical direction. A rounding of the bottom of the fingers
294a and 294b of stops 293a and 293b and/or of the upper portion's
of the component that engage the stops may lead to easy loading of
the component into the fixture. FIG. 18(b) depicts the loaded
fixture/component combination and as described herein elsewhere,
various methods may be used to retain the component in the fixture
as desired.
[0097] FIG. 19(a) and 19(b) depict perspective views of an eighth
preferred protruding-type fixture 300 along with a schematic
representation of a component 309 located thereby. The alignment
fixture 300 sits on base 302 and includes two guides 303a and 30b
along with a stop 304 whose upper surface is a hook to constrain
vertical movement of one end of a component 309 that is loaded into
the fixture. From the teachings herein various alternative
configurations of this embodiment will be apparent to those of
skill in the art. For example, a guide opposite to the stop may be
added. FIG. 19(b) depicts the loaded fixture/component
combination.
[0098] FIGS. 20(a) and 20(b) depict perspective views of a ninth
preferred protruding-type fixture 310 along with a schematic
representation of a component 319 located and retained thereby. The
alignment fixture 310 is attached to a base 312. Though the
alignment fixture protrudes from base 312, it may be considered a
recessed fixture in that it includes an opening 314 through a
rectangular block 315 (particularly if the block is considered to
be part of the base). The alignment fixture 310 also includes
retention tabs 313a-313d. The retention tabs are used to hold a
component in much the same way the retention tabs of FIGS. 16(a)
and 16(b) did. FIG. 20(b) depicts the loaded fixture/component
combination. Various alternatives as discussed herein before and
herein after may be used in conjunction with this embodiment.
[0099] FIG. 21 depicts a perspective view of within a base 322
first and second preferred recessed-type fixtures 320a and 320b
respectively along with a schematic representation of components
329a and 329b that can be located thereby. Fixture 320b is a simple
straight walled fixture which in many respects is similar to the
fixtures of FIGS. 13 and 14. Fixture 320a is a sloped wall fixture
which in many respects is similar to the fixture of FIG. 15. The
embodiment of fixture 320a may be enhanced by modifying the slope
of the walls so that, near the upper surface, the slope is angled
or rounded so as to help guide the component into the fixture. As
the component moves deeper into the fixture it may encounter more
vertical and even completely vertical walls where the dimension of
the opening within the walls is such as to allow accurate
positioning and orientation of the component and potentially to
retention of the component as well.
[0100] FIG. 22 depicts a perspective view of a third preferred
recessed-type fixture 330 within a base 332 along with a schematic
representation of a component 339 that can be located and retained
thereby. The fixture of FIG. 22 is similar to those of FIGS. 16 and
20a with the exception that the walls surrounding the opening of
the fixture are sloped to help center and ensure proper orientation
of the component once it is loaded into the fixture. The fixture
also includes retention tabs 333a-333d. In some alternative
embodiments the fixtures of FIGS. 21 and 22 may be supplemented by
protruding elements that help guide and orient the component and/or
that help retain components in the fixtures.
[0101] FIG. 23(a) and 23(b) depict side views of an fourth
preferred recessed-type fixture 340 along with a schematic
representation of a component 349 located and retained thereby.
Functionally the fixture of FIGS. 23(a) and 23(b) is similar to
that of FIG. 17(a) but several distinctions exist. The fixture of
FIGS. 23(a) and 23(b) include guide structures 346a and 346b that
help ensure the component is properly oriented and located as it
seats against spring elements 344a and 344b and as it is retained
by elements 343a and 343b. In FIGS. 23(a) and 23(b) spring elements
344a and 344b may be electrical contactors that are isolated from a
conductive base 342 by insulators 345a and 345b. Some of the
elastic nature of spring elements 344a and 344b may result from an
elastomeric nature of the insulating material of 345a and 345b. In
some alternative embodiments, the base 342 may be formed from a
dielectric material in which case a dielectrical material 345a and
345b may not be necessary. In embodiments where the component 349
is an RF or microwave component, conductors 344a and 344b
surrounded by material 345a and 345b and a grounded conductor 342
may function as a coaxial transmission lines for any RF or
microwave signals generated. In some embodiments, the coaxial
attributes of the contactors may be extended by extending the
dielectric and a surrounding conductive shield closer to the ends
of conductors 344a and 344b. In particular, it is preferred that
the dielectric and conductive shield not detrimentally reduce the
elastomeric nature of conductors 344a and 344b.
[0102] FIG. 24 depicts a perspective view of a portion of an
alignment and retention structure that includes four variations of
deformable fixtures 350a-350d, mounted on a base 352, along with
associated components 359a-359d. The components are mounted on
elements 353a, 353b'-353b'", 353c, and 353d and then moved relative
to the rest of the structure so that precision positional
adjustments may be made beyond those associated with the initial
mounting. Elements 353a-353d may be a solder-like material or other
low melting temperature material and particular a material of
sufficiently low softening temperature that the material may be
deformed without damaging the components 359a-359d. Component 359a
may be mounted and initially bonded to material 353a by heating the
material. In some embodiments the meltable material may be formed
with or otherwise attached to the base prior to mounting the
components. In other embodiments the meltable material may be
attached to the component and thereafter the combination attached
to the base. The position of component 359a may be finely adjusted
in all three dimensions and in all orientations by grasping the
component and softening material 353a and then adjusting the
component's position while monitoring a desired alignment
parameter. After the desired alignment is obtained the material
353a is cooled and allowed to fix the component in its desired
precision position. If material 353a shrinkage causes misalignment
upon solidification the extent of misalignment can be monitored and
appropriate offset positioning used so that final positioning is
correct.
[0103] Component 359b may be similarly adjusted in all three
dimensions and in any orientation. Component 539c is bounded from
below by protrusions 354c' and 354c". These protrusions may be used
to set the lowest vertical height of the component and the
orientation of the component relative to a vertical axis. Upon
softening the material 353c, the component may be pushed down
against the block (or even potentially raised slightly if desired)
and then the horizontal position and orientation may be set.
Component 353d may be moved up and down vertically by softening
material 353d and potentially its orientation with respect to a
vertical axis changed slightly (depending on the restriction
dictated by the fixture elements 354d'-354d'") but its horizontal
position and orientation is largely fixed by fixture elements
354d'-354d'".
[0104] In some embodiments a single component will be adjustable
via a softenable or meltable material while in other embodiments a
given alignment structure may have multiple components that will be
adjustable in such a manner. When multiple components are
adjustable in such a manner, and not all such components will be
positioned and oriented simultaneously, then it may be appropriate
to tailor the adjustment process to ensure that initial bonding or
adjustments of a second or subsequent component do not disturb the
bonding or adjustment or previously mounted or finely aligned
components. This may be done by using materials with different
softening temperatures and mounting the components and adjusting
the components associated with the highest softening temperature
first. Alternatively, if the heating of the material is isolated
sufficiently to the alignment element associated with a single
component, a single material may be used and adjustment may occur
in any desired order or even in an incremental order. As with the
other embodiments various alternatives will be understood by those
of skill in the art upon review of the teachings herein.
[0105] FIG. 25 depicts a perspective view of a portion of an
alignment and retention structure including a fixture 360 that is
deformable at a position intermediate to a component mounting
location and a base 362 so that the component location is
adjustable relative to the base and, as such, relative to the rest
of the structure. The fixture of FIG. 25 includes four legs
363a-363d which are located in a rectangular pattern. On top of the
legs is a mounting plate 364 and on top of the mounting plate an
optional softenable material is located. The component is mounted
on the softenable material. A vertical adjustment of the component
may be made via the softenable material as noted above with regard
to FIG. 24. A horizontal adjustment in a first direction may be
made by bending legs 363a-363d at their meeting points with base
362 and plate 364 in the direction of arrows 366a and 366b and in
the other direction by bending the legs in the direction of 367a
and 367b. In some embodiments, the bending of the legs may be
facilitated by a narrowing of the width of the legs at the junction
points in the direction of desired adjustment. Any variation in
vertical position that results from the bending of the legs may be
accommodated by adjustments associated with softening the material
365. In some embodiments, the fixture of FIG. 25 may be made
monolithically. In other embodiments, purely mechanical
deformations may be used to obtain movement in all three directions
and even in orientation as well. Various alternatives to the
adjustable fixture of FIG. 25 are possible. U.S. Pat. No.
6,416,937, to Flanders et al., entitled "Optical Component
Installation Process", sets forth an installation process using
adjustable mounting fixtures. This patent is hereby incorporated
herein by reference as if set forth herein in full.
[0106] FIGS. 26(a) and 26(b) depict side views of an alignment and
retention structure that includes a fixture 370 having retention
elements 374a and 374b, guide elements 377a and 377b, and
electrical contact elements 375a and 375b. The electrical contact
elements are mounted directly onto a base 372 and are independent
of alignment fixture frame 373 with the exception of their contact
at contractors 376a and 376b with the component 379 when it is
loaded into the fixture. FIG. 26(a) shows the component prior to
loading it in the fixture while FIG. 26(b) depicts the component
after loading. The alignment and retention features of this
embodiment are similar to that of FIGS. 17(a) and 17(b) and FIGS.
23(a) and 23(b) with the exception that both the left and right
sides (the top and bottom relative to FIGS. 17(a) and 17(b) and
FIGS. 23(a) and 23(b) ) are not blocked or shadowed by a portion of
a base or a frame. If component 379 is an optical generation or
detection device and if contactors 376a and 376b provide electrical
input or output to the same side of the component as its optically
active surface, the configuration of the FIGS. 26(a) and 26(b)
allows mounting and use of such a component. Element 378 depicts an
optical path coming from or going to component 379.
[0107] In some embodiments the conductive elements 375a and 375b
may originate on frame 373 or may be supported by elements
extending from the frame 373. In other embodiments, various other
configurations of the alignment and retention fixture are possible
and will be apparent to those of skill in the art upon reviewing
the teachings herein.
[0108] FIGS. 27(a) and 27(b) depict side views of a portion of an
alternative alignment and retention structure that includes a
fixture 380 having retention clips 384a and 384b that are closed
onto component 389 as the component is loaded into the fixture. The
fixture is attached to a base 382 and includes legs 383a and 383b,
pivot regions 385a and 385b. As indicated by the dashed outlines of
structures 386a and 386b, guide structures may be included in the
alignment fixture to ensure that the component is loaded in the
fixture with the right orientation and alignment. In alternative
embodiments, no guides may be used or additional guides may be used
and the guides may have various configurations. As component 389 is
loaded into the fixture the upper portion of the fixture begins to
bend inward as the bottom of the component contacts the lower
portions (i.e. actuation levers) 384a' and 384b' of clips 384a and
384b. The bending forward continues until the tips 384a" and 384b"
of clips 384a and 384b contact the electrical pads 384a'" and
384b'". As indicated in FIGS. 27(a) and 27(b) , the upper surfaces
of the lower portions 384a' and 384b' may be roughened, knurled,
stair stepped or otherwise patterned to increase the stability of
the matting of the clips and the component. In some embodiments
pivot regions may, for example, be bendable joins or rotatable
structures.
[0109] Various alternatives to the embodiment of FIGS. 27(a) and
27(b) are possible and will be apparent to those of skill in the
art. Two examples are illustrated in FIGS. 28(a) and 28(b). In FIG.
28(a) the moving portion 384a' and 384b' of the fixture 380 engages
another portion 387a' and 387b' of the structure via extensions
387a" and 387b" to help lock the fixture/component in a retention
position. In some embodiments, structures 387a' and 387b' and
extensions 387a" and 387b" may be of a ratcheted configuration
while in other embodiments they may simply be stair-stepped as
depicted. In some embodiments structures 387a' and 387b' may be on
elastomeric (e.g. compressible) mounts, or may be formed from an
elastomeric material, to give sufficient retention force while
still allowing component release and the seating of new components.
In still other alternatives extensions 387a" and 387b" may be
located on a elastomeric structures. In still further alternatives,
a release mechanism may be provided to aid in separating the
engaged portions. In FIG. 28(b), the fixture is shown as including
outward facing levers 388a and 388b that may be used to move
portions 384a" and 384b" from a retention position to an open
position. Many other alternatives will be apparent to those of
skill in the art upon reviewing the disclosure herein.
[0110] FIGS. 29(a)-29(c) depict perspective views of a device that
contains an alignment and/or retention structure (including
fixtures 390a-390c and a base 392 having alignment structures),
components 399a', 399a", 399b, and 399c, and a packaging structure
402 and 405 and having passages 409a" and 409c. FIG. 29(a) shows
components 399a' and 399a", 399b, and 399c separated from their
respective alignment fixtures 390a, 390b, and 390c. FIG. 29(b)
depicts the components mounted on their respective alignment
structures. In FIG. 29(c) the component/alignment fixture
combination is located between a package lid 405 and a package
bottom 402 and is ready for mounting into bottom 402 via mating
alignment marks 393a-393d and 403a-403d. Component 399c extends out
of the assembled device package via slot 409c and component 399a"
will extend out of the assembled package via slot 409a". The top
portions of slots 409c and 409a" will be filled by structures such
as 405', that extend from lid 405, once the lid is mounted on the
bottom 402. In the example of FIGS. 29(a)-29(c) component 399c may
be one or more fiber optic elements, component 399b may be a lens,
component 399a' may be a radiation generating component, and
component 399a" may be one or more electrical signal and/or power
feed lines.
[0111] In some embodiments any gaps in the walls of the package
(e.g. where the lid is mounted or where the components pass
through) may be sealed in various manners. For example, sealing may
occur via gaskets, sealing compounds, meltable conductive or
non-conductive materials. In still further embodiments, the package
may contain pre-sealed vias (for passing signals between the
interior and exterior of a package) with contact structures that
mate with electrical leads or other components that are loaded into
the package in much the same way contact between alignment fixtures
and components is achieved according to the teachings herein. In
some embodiments multiple alignment and/or retention structures and
associated components may be loaded into a single package. In some
embodiments, internal volume of the package may be evacuated, back
filled with a desired gas, or even filled with a flowable but
settable material. In addition to the packaging embodiments and
alternative set forth above, many other alternatives will be
apparent upon review of the teachings herein.
[0112] The components that may be located and or retained by the
structures of various embodiments of the present invention vary
considerably, for example, the components may include: (1)
electrical and electronic components including both active and
passive devices, (2) optical and photonic components, (3)
temperature control components, and (5) other mechanical and
electromechanical devices. The electrical and electronic components
may include, for example, capacitors; inductors; resistors; RF and
microwave transmission lines, delay lines, filters, couplers,
splitters, and the like; transducers, diodes; transistors;
integrated circuits, batteries and other power generation devices,
permanent and electromagnets, and the like. Optical and photonic
components may include, for example, mirrors, lenses, light sources
(e.g. LEDs and lasers), photocells, detectors, fiber optics,
filters, windows, and the like. Temperature control components may
include, for example, thermistors, thermal couples, heaters,
thermal electric coolers, heat pipes, thermal electric materials,
heat sinks, and the like. Other mechanical and electromechanical
devices include, for example, fluid flow channels, manifolds,
valves, pumps, piezoelectric devices, pneumatic devices, actuators,
springs, alignment fixtures, and the like.
[0113] In some preferred implementations an Electrochemical
Fabrication process (EFAB) is used for forming bases, alignment
and/or retention fixtures, and any included functional elements.
For example, such a process is described above in association with
FIGS. 2(a)-2(f). In other processes, additional conductive
materials may be used and/or dielectric materials may be used to
isolate selective conductive regions from one another. In still
other processes, an initial building substrate may be a dielectric
or after formation of all layers of deposited material, the
structure may be swapped from an original substrate to a second
substrate which may be a dielectric. In still other processes,
chemical or electrochemical etching may be used to form structures
directly or to create cavities into which other material may be
deposited. In alternative implementations, an electrochemical
extrusion (ELEX) process may be used to form a structure or a
portion of the structure.
[0114] After formation of each layer of a structure, various post
processing operations may be used to complete formation of the
alignment and/or retention structures. For example, a single
etching operation may be used to remove any sacrificial material, a
multi-step etching operation may be used to allow more control of
the etching process or to allow various intermediate steps or
operations to occur, the partially formed structure may bonded or
otherwise combined with other structures.
[0115] Various alternative production processes that may be used in
forming alignment and/or retention structures some of which are
described in the various publications, patents, and patent
application incorporated herein by reference.
[0116] Various combinations of the teachings in the above
embodiments and their alternatives are possible and will be
understood by those of skill in the art upon review of the
teachings herein. As such, alternatives mentioned explicitly in one
embodiment may also have application to other embodiments
[0117] The patent applications in TABLE 1 are hereby incorporated
by reference herein as if set forth in full. The gist of each
patent application is included in the table to aid the reader in
finding specific types of teachings. It is not intended that the
incorporation of subject matter be limited to those topics
specifically indicated, but instead the incorporation is to include
all subject matter found in these applications. The teachings in
these incorporated applications can be combined with the teachings
of the instant application in many ways. For example, the various
apparatus configurations disclosed in these referenced applications
may be used in conjunction with the novel features of the instant
invention to provide various alternative apparatus that include the
functionality disclosed herein:
1TABLE 1 US Application No. Title Filing Date Brief Description US
App. No. 10/434,295 Method of and Apparatus for Forming
Three-Dimensional Structures Integral May 7, 2003 With
Semiconductor Based Circuitry Enhanced Electrochemical fabrication
processes are provided that can form three- dimensional multi-layer
structures using semiconductor based circuitry as a substrate.
Electrically functional portions of the structure are formed from
structural material (e.g. nickel) that adheres to contact pads of
the circuit. Aluminum contact pads and silicon structures are
protected from copper diffusion damage by application of
appropriate barrier layers. In some embodiments, nickel is applied
to the aluminum contact pads via solder bump formation techniques
using electroless nickel plating. In other embodiments, selective
electroless copper plating or direct metallization is used to plate
sacrificial material directly onto dielectric passivation layers.
In still other embodiments, structural material deposition
locations are shielded, then sacrificial material is deposited, the
shielding is removed, and then structural material is deposited. In
still other embodiments structural material is made to attached to
non- contact pad regions.. US App. No. 10/434,493 Electrochemically
Fabricated Structures Having Dielectric Bases or Active May 7, 2003
Bases and Methods of and Apparatus for Producing Such Structures
Multilayer structures are electrochemically fabricated (e.g. by
EFAB .TM.) on a temporary conductive substrate and are there after
are bonded to a permanent dielectric substrate and removed from the
temporary substrate. The structures are formed from top layer to
bottom layer, such that the bottom layer of the structure becomes
adhered to the permanent substrate. The permanent substrate may be
a solid sheet that is bonded (e.g. by an adhesive) to the layered
structure or the permanent substrate may be a flowable material
that is solidified adjacent to or partially surrounding a portion
of the structure with bonding occurs during solidification. The
multilayer structure may be released from a sacrificial material
prior to attaching the permanent substrate or more preferably it
may be released after attachment. US App. No. 10/434,103
Electrochemically Fabricated Hermetically Sealed Microstructures
and May 7, 2003 Methods of and Apparatus for Producing Such
Structures Multilayer structures are electrochemically fabricated
(e.g. by EFAB .TM.) from at least one structural material (e.g.
nickel), at least one sacrificial material (e.g. copper), and at
least one sealing material (e.g. solder). The layered structure is
made to have a desired configuration which is at least partially
and immediately surrounded by sacrificial material which is in turn
surrounded almost entirely by structural material. The surrounding
structural material includes openings in the surface through which
etchant can attack and remove trapped sacrificial material found
within. Sealing material is located near the openings. After
removal of the sacrificial material, the box is evacuated or filled
with a desired gas or liquid. Thereafter, the sealing material is
made to flow, seal the openings, and resolidify. US App. No.
10/434,497 Multistep Release Method for Electrochemically
Fabricated Structures May 7, 2003 Multilayer structures are
electrochemically fabricated (e.g. by EFAB .TM.) from at least one
structural material (e.g. nickel), that is configured to define a
desired structure and which may be attached to a support structure,
and at least a first sacrificial material (e.g. copper) that
surrounds the desired structure, and at least one more material
which surrounds the first sacrificial material and which will
function as a second sacrificial material. The second sacrificial
material is removed by an etchant and/or process that does not
attack the first sacrificial material. Intermediate post processing
activities may occur, and then the first sacrificial material is
removed by an etchant or process that does not attack the at least
one structural material to complete the release of the desired
structure.
[0118] Various other embodiments of the present invention exist.
Some of these embodiments may be based on a combination of the
teachings herein with various teachings incorporated herein by
reference. Some embodiments may not use any blanket deposition
process and/or they may not use a planarization process. Some
embodiments may involve the selective deposition of a plurality of
different materials on a single layer or on different layers. Some
embodiments may use blanket depositions processes that are not
electrodeposition processes. Some embodiments may use selective
deposition processes on some layers that are not conformable
contact masking processes and are not even electrodeposition
processes. Some embodiments may use nickel as a structural material
while other embodiments may use different materials such as copper,
gold, silver, or any other electrodepositable materials that can be
separated from the a sacrificial material. Some embodiments may use
copper as the structural material with or without a sacrificial
material. Some embodiments may remove a sacrificial material while
other embodiments may not. In some embodiments the sacrificial
material may be removed by a chemical etching operation, an
electrochemical operation, or a melting operation. In some
embodiments the anode may be different from the conformable contact
mask support and the support may be a porous structure or other
perforated structure. Some embodiments may use multiple conformable
contact masks with different patterns so as to deposit different
selective patterns of material on different layers and/or on
different portions of a single layer. In some embodiments, the
depth of deposition will be enhanced by pulling the conformable
contact mask away from the substrate as deposition is occurring in
a manner that allows the seal between the conformable portion of
the CC mask and the substrate to shift from the face of the
conformal material to the inside edges of the conformable
material.
[0119] In view of the teachings herein, many further embodiments,
alternatives in design and uses of the instant invention will be
apparent to those of skill in the art. As such, it is not intended
that the invention be limited to the particular illustrative
embodiments, alternatives, and uses described above but instead
that it be solely limited by the claims presented hereafter.
* * * * *