U.S. patent application number 10/686589 was filed with the patent office on 2004-04-29 for multi-tool control system, method and medium.
This patent application is currently assigned to Applied Materials, Inc.. Invention is credited to Grunes, Howard E., Somekh, Sasson.
Application Number | 20040083021 10/686589 |
Document ID | / |
Family ID | 23862973 |
Filed Date | 2004-04-29 |
United States Patent
Application |
20040083021 |
Kind Code |
A1 |
Somekh, Sasson ; et
al. |
April 29, 2004 |
Multi-tool control system, method and medium
Abstract
A system, method and medium for facilitating communication
between tools in a semiconductor (e.g., wafer) processing facility.
In particular, the present invention provides greater control of
the overall semiconductor product output of groups of tools in
terms of the quantity and/or quality of a final semiconductor
product.
Inventors: |
Somekh, Sasson; (Los Altos
Hills, CA) ; Grunes, Howard E.; (Santa Cruz,
CA) |
Correspondence
Address: |
Applied Materials, Inc.
Patent Counsel, MS/2061
Legal Affars Dept.
P.O. Box 450A
Santa Clara
CA
95052
US
|
Assignee: |
Applied Materials, Inc.
|
Family ID: |
23862973 |
Appl. No.: |
10/686589 |
Filed: |
October 17, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10686589 |
Oct 17, 2003 |
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09469227 |
Dec 22, 1999 |
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6640151 |
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Current U.S.
Class: |
700/121 |
Current CPC
Class: |
H01L 21/67253
20130101 |
Class at
Publication: |
700/121 |
International
Class: |
G06F 019/00 |
Claims
What is claimed is:
1. A system for interactively monitoring and adjusting product
output from the individual tool of a module, wherein the output is
a result of the coordinated effort of two or more semiconductor
preparation tools making up the module, the system comprising; a
first tool of said two or more semiconductor tools, said first tool
capable of implementing a first process on a semiconductor product
and producing a first output; a second tool of said two or more
semiconductor tools, said second tool receiving as input said first
output from said first tool, and said second tool capable of
implementing a second process on the semiconductor product and
producing a second output, wherein said first tool measures and
obtains measurement data relating to the thickness and uniformity
of a film, and wherein said measurement data is conveyed to said
second tool for use in modifying a behavior of said second tool;
and a module control mechanism, said module control mechanism
capable of facilitating the exchange of information between said
first tool and said second tool so that the module yields a desired
semiconductor product output, said semiconductor product output
being, or resulting from, said second output.
2. The system of claim 1 wherein the said first tool includes a
metrology station and said second tool includes a chemical
mechanical polishing apparatus.
3. The system of claim 2, wherein modifying the behavior of said
second tool includes determining a plurality of pressures to apply
to different regions of the semiconductor product as it is pressed
against a polishing surface.
4. The system of claim 1, wherein said module control mechanism is
a part of said first tool, or is distributed between said first and
second tools.
5. A system for controlling the quality and/or quantity of a final
semiconductor product output from a multi-function tool, wherein
the final semiconductor output is a result of the coordinated
effort of two or more functional units making up the multi function
tool, the system comprising; a first functional unit of said two or
more functional units, said first functional unit capable of
implementing a first process on a semiconductor product and
producing a first output, wherein said first functional unit
measures and obtains measurement data relating to the thickness
and/ or uniformity of a film; a second functional unit of said two
or more semiconductor functional units, said second tool receiving
as input said first output from said first functional unit, and
said second functional unit capable of implementing a second
process on the semiconductor product and producing a second output,
wherein said measurement data from the first functional unit is
conveyed to said second functional unit for use in modifying a
behavior of said second functional unit; and a module control
mechanism, said module control mechanism capable of facilitating
the exchange of information between said first functional unit and
said second functional unit so that the multi-function tool yields
a pre-set or user-specified final semiconductor product output,
said semiconductor product output being, or resulting from, said
second output.
6. The system of claim 5 wherein the said first functional unit
includes a metrology station and said second functional unit
includes a chemical mechanical polishing apparatus.
7. The system of claim 6, wherein modifying the behavior of said
second functional unit includes determining a plurality of
pressures to apply to different regions of the semiconductor
product.
8. A method for associating information with a wafer in a
semiconductor processing facility, comprising the steps of: (1)
processing a wafer at a first wafer processing tool, and storing
first information pertaining to said wafer on a traveling
information file, wherein said traveling information file comprises
information pertaining to the status of said wafer; (2)
transferring said wafer to a second wafer processing tool; (3)
transferring said traveling information file with said wafer to
said second wafer processing tool; (4) receipt of said traveling
information file by said second wafer processing tool; and (5)
processing said wafer at said second processing tool using said
first information in said wafer status file, and storing second
information pertaining to said wafer on said traveling information
file.
9. A system for controlling the quality and/or quantity of a final
semiconductor product output from a module, wherein the final
semiconductor output is a result of the coordinated effort of two
or more semiconductor preparation tools making up the module, the
system comprising; a first tool of said two or more semiconductor
tools, said first tool capable of implementing a first process on a
semiconductor product and producing a first output; a second tool
of said two or more semiconductor tools, said second tool receiving
as input said first output from said first tool, and said second
tool capable of implementing a second process on the semiconductor
product and producing a second output, wherein said first tool
measures and obtains measurement data relating to the thickness and
uniformity of a film, and wherein said measurement data is conveyed
to said second tool for use in modifying a behavior of said second
tool; and a module control mechanism, said module control mechanism
capable of facilitating the exchange of information between said
first tool and said second tool so that the module yields a pre-set
or user-specified final semiconductor product output, said final
semiconductor product output being, or resulting from, said second
output.
10. The system of claim 9 wherein the said first tool includes a
metrology station and said second tool includes a chemical
mechanical polishing apparatus.
11. The system of claim 10, wherein modifying the behavior of said
second tool includes determining a plurality of pressures to apply
to different regions of the semiconductor product as it is pressed
against a polishing surface.
12. The system of claim 9, wherein said module control mechanism is
a part of said first tool, or is distributed between said first and
second tools.
13. A system for interactively monitoring and adjusting product
output from a module, wherein the output is a result of the
coordinated effort of two or more semiconductor tools making up the
module, the system comprising: a first tool of said two or more
semiconductor tools, said first tool capable of implementing a
first process on a semiconductor product and producing a first
output; a second tool of said two or more semiconductor tools, said
second tool receiving as input said first output from said first
tool, and said second tool capable of implementing a second process
on the semiconductor product and producing a second output, wherein
one of said first or second tools measures and obtains measurement
data relating to said semiconductor product, and wherein said
measurement data is conveyed to the other of said first or second
tools for use in modifying a behavior of said other of said first
or second tool; and a module communication mechanism, said module
communication mechanism capable of facilitating the communication
of information between said first tool and said second tool so that
the module yields a desired semiconductor product output, said
semiconductor product output being, or resulting from, said second
output.
14. The system of claim 13, wherein said first tool includes a
deposition function, and said second tool includes a CMP
function.
15. The system of claim 13, wherein said first tool includes a
deposition function, and said second tool includes an etch
function.
16. The system of claim 13, wherein said first tool includes a CMP
function, and said second tool includes an etch function.
17. The system of claim 13, wherein said first tool includes an
electroplating function, and said second tool includes a CMP
function.
18. The system of claim 13, wherein said first tool includes a
sputtering function, and said second tool includes an
electroplating function.
19. The system of claim 13, wherein said first tool includes an
etch function, and said second tool includes an inspection function
for inspecting the results of said etch function.
20. The system of claim 13, wherein said measurement data relates
to the thickness and/or uniformity of a film.
21. The system of claim 13, further comprising a module controller,
wherein at least some information communicated by said module
communication mechanism are controlled by said module
controller.
22. The system of claim 21, wherein said module communication
mechanism resides, at least in part, in either said first or second
tool, or is distributed between said first and second tools.
23. The system of claim 13, wherein said module communication
mechanism resides, at least in part, in either said first or second
tool, or is distributed between said first and second tools.
24. A system for interactively monitoring and adjusting product
output from a multi-function tool, wherein the output is a result
of the coordinated effort of two or more functional units making up
the multi-function tool, the system comprising: a first functional
unit of said two or more semiconductor functional units, said first
functional unit capable of implementing a first process on a
semiconductor product and producing a first output; a second
functional unit of said two or more semiconductor functional units,
said second functional unit receiving as input said first output
from said first functional unit, and said second functional unit
capable of implementing a second process distinct from said first
process on the semiconductor product and producing a second output,
wherein one of said first or second functional units measures and
obtains measurement data relating to said semiconductor product,
and wherein said measurement data is conveyed to the other of said
first or second functional units for use in modifying a behavior of
said other of said first or second functional unit; and a module
communication mechanism, said module communication mechanism
capable of facilitating the exchange of information between said
first functional unit and said second functional unit so that the
multi-function tool yields a desired semiconductor product output,
said semiconductor product output being, or resulting from, said
second output.
25. The system of claim 24, wherein said measurement data relates
to the thickness and/or uniformity of a film.
26. The system of claim 24, further comprising a third functional
unit, wherein the routing of a semiconductor product through said
first, second and third functional units occurs in a predetermined,
fixed sequence.
27. The system of claim 24, wherein said first functional unit
includes a deposition function, and said second functional unit
includes a CMP function.
28. The system of claim 24, wherein said first functional unit
includes a deposition function, and said second functional unit
includes an etch function.
29. The system of claim 24, wherein said first functional unit or
said second functional unit includes a CMP function.
30. The system of claim 24, wherein said first functional unit
includes an electroplating function, and said second functional
unit includes a CMP function.
31. The system of claim 24, wherein said first functional unit or
said second functional unit includes a deposition function.
32. The system of claim 24, wherein said first functional unit
includes an etch function, and said second functional unit includes
an inspection function for inspecting the results of said etch
function.
33. The system of claim 24, further comprising a module controller,
wherein at least some information communicated by said module
communication mechanism are controlled by said module
controller.
34. The system of claim 33, wherein said module communication
mechanism resides, at least in part, in either said first or second
functional unit, or is distributed between said first and second
functional units.
35. The system of claim 24, wherein said module communication
mechanism resides, at least in part, in either said first or second
functional unit, or is distributed between said first and second
functional units.
36. A method for associating information with a wafer in a
semiconductor processing facility, comprising the steps of: (1)
processing a wafer at a first wafer processing tool, and storing
first information pertaining to said wafer on a wafer information
entity, wherein said wafer information entity comprises information
pertaining to the status of said wafer; (2) transferring said wafer
to a second wafer processing tool; (3) transferring said wafer
information entity with said wafer to said second wafer processing
tool; (4) receiving said wafer information entity by said second
wafer processing tool; (5) processing said wafer at said second
processing tool using said first information in said wafer
information entity, and storing second information pertaining to
said wafer on said wafer information entity.
37. A method for associating information with a wafer in a
semiconductor processing facility, comprising the steps of: (1)
processing a first wafer at a first wafer processing tool, and
storing first information pertaining to said first wafer on a wafer
information entity, wherein said wafer information entity comprises
information pertaining to the status of said first wafer; (2)
transferring said first wafer to a second wafer processing tool;
(3) transferring said wafer information entity with said first
wafer to said second wafer processing tool; (4) receiving said
wafer information entity by said second wafer processing tool; (5)
processing said first wafer at said second processing tool, and
storing second information pertaining to said first wafer on said
wafer information entity; (6) transferring at least some of said
second information to said first wafer processing tool; and (7)
processing a second wafer at said first wafer processing tool using
said at least some of said second information of said step (6).
38. The method of claim 37, wherein wafer information entity
contains a recipe or a modification of said recipe, and wherein
said first wafer processing tool comprises the step of using said
recipe or said modification of said recipe in said wafer
information entity to process said wafer.
39. A system for interactively monitoring and adjusting product
output from a module, wherein the output is a result of the
coordinated effort of two or more semiconductor tools making up the
module, the system comprising; an electroplating tool, said
electroplating tool capable of implementing a copper depositing
process on a semiconductor product and producing a first output; a
CMP tool, said CMP tool receiving as input said first output from
said electroplating tool, and said CMP tool capable of implementing
an excess material removal process on the semiconductor product and
producing a second output, a module communication mechanism, said
module communication mechanism capable of facilitating the exchange
of information between said electroplating tool and said CMP tool
so that the module yields a desired semiconductor product output,
said semiconductor product output being, or resulting from, said
second output.
40. The system of claim 39, further comprising a module controller,
wherein at least some information communicated by said module
communication mechanism are controlled by said module
controller.
41. The system of claim 40, wherein said module communication
mechanism resides, at least in part, in either said first or second
tool, or is distributed between said first and second tools.
42. The system of claim 39, wherein said module communication
mechanism resides, at least in part, in either of said first or
second tool, or is distributed between said first and second
tools.
43. A method for interactively monitoring and adjusting product
output from a module, wherein the output is a result of the
coordinated effort of two or more semiconductor tools making up the
module, the method comprising the steps of: (1) implementing a
first process on a semiconductor product, using a first tool of
said two or more semiconductor tools, to produce a first output;
(2) implementing a second process on the semiconductor product,
using a second tool of said two or more semiconductor tools, to
produce a second output, said second tool receiving as input said
first output from said first tool, (3) measuring and obtaining
measurement data relating to said semiconductor product, by one of
said first or second tools, and conveying said measurement data to
the other of said first or second tools for use in modifying a
behavior of said other of said first or second tool; and (4)
facilitating the communication of information between said first
tool and said second tool so that the module yields a desired
semiconductor product output, said semiconductor product output
being, or resulting from, said second output.
44. The method of claim 43, wherein said first tool includes a
deposition function, and said second tool includes a CMP
function.
45. The method of claim 43, wherein said first tool includes a
deposition function, and said second tool includes an etch
function.
46. The method of claim 43, wherein said first tool includes a CMP
function, and said second tool includes an etch function.
47. The method of claim 43, wherein said first tool includes an
electroplating function, and said second tool includes a CMP
function.
48. The method of claim 43, wherein said first tool includes a
sputtering function, and said second tool includes an
electroplating function.
49. The method of claim 43, wherein said first tool includes an
etch function, and said second tool includes an inspection function
for inspecting the results of said etch function.
50. The method of claim 43, wherein said measurement data relates
to the thickness and/or uniformity of a film.
51. The method of claim 43, wherein at least some aspects of said
step (4) are controlled by a module controller.
52. The method of claim 51, wherein at least some aspects of said
step (4) are controlled by either said first or second tools, or by
a combination of said first and second tools.
53. The method of claim 43, wherein at least some aspects of said
step (4) are controlled by either said first or second tools, or by
a combination of said first and second tools.
54. A method for interactively monitoring and adjusting product
output from a multi-function tool, wherein the output is a result
of the coordinated effort of two or more functional units making up
the multi-function tool, the method comprising the steps of: (1)
implementing a first process on a semiconductor product, using a
first functional unit of said two or more functional units, to
produce a first output; (2) implementing a second process on the
semiconductor product, using a second functional unit of said two
or more functional units, to produce a second output, said second
functional unit receiving as input said first output from said
first functional unit, (3) measuring and obtaining measurement data
relating to said semiconductor product, by one of said first or
second functional units, and conveying said measurement data to the
other of said first or second functional units for use in modifying
a behavior of said other of said first or second functional unit;
and (4) facilitating the communication of information between said
first functional unit and said second functional unit so that the
multi-function tool yields a desired semiconductor product output,
said semiconductor product output being, or resulting from, said
second output.
55. The method of claim 54, further comprising the step of
implementing a third process on the semiconductor product using a
third functional unit, wherein the routing of the semiconductor
product through said first, second and third functional units
occurs in a predetermined, fixed sequence.
56. The system of claim 24, wherein said first functional unit or
said second functional unit includes a sputtering function.
57. The system of claim 33, wherein said control is facilitated by
the use of algorithmic instructions.
58. The system of claim 40, wherein said control is facilitated by
the use of algorithmic instructions.
59. A system for controlling the quality and/or quantity of a final
semiconductor product output from a multi-function tool, wherein
the final semiconductor output is a result of the coordinated
effort of two or more functional units making up the multi function
tool, the system comprising; a first functional unit of said two or
more functional units, said first functional unit capable of
implementing a first process on a semiconductor product and
producing a first output, wherein said first functional unit
measures and obtains measurement data relating to the thickness
and/ or uniformity of a film; a second functional unit of said two
or more semiconductor functional units, said second tool receiving
as input said first output from said first functional unit, and
said second functional unit capable of implementing a second
process on the semiconductor product and producing a second output,
wherein said measurement data from the first functional unit is
conveyed to said second functional unit for use in modifying a
behavior of said second functional unit; and a module control
mechanism, said module control mechanism capable of facilitating
the exchange of information between said first functional unit and
said second functional unit so that the multi-function tool yields
a pre-set or user-specified final semiconductor product output,
said semiconductor product output being, or resulting from, said
second output, wherein said two or more semiconductor functional
units use a unifying protocol, to thereby alleviate a need to use
station controllers for said two or more functional units.
Description
RELATED APPLICATION
[0001] This application is a continuation of U.S. patent
application Ser. No. 09/469,227, filed Dec. 22, 1999, which is
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to the control of tools and
the communication among tools in a multi-tool semiconductor
processing environment. More specifically, embodiments of the
present invention relate to a system, method and medium for control
of and communication among wafer processing tools in a wafer
processing environment.
[0004] 2. Related Art
[0005] In today's semiconductor manufacturing environment, a
facility for the production of semiconductor products (such as,
e.g., wafers) will typically contain multiple tools, each for
performing one or more of a variety of functions. Thus, where a
wafer is being processed into items such as logic (e.g., central
processing units) or memory (e.g., DRAMs) units, each tool performs
some specified function on the wafer, and then the wafer is passed
on to the next tool. (The final product output, i.e., final state
of the wafer, in this example, eventually gets cut up into
individual chips, e.g., Central Processing Units, DRAM's, etc.)
[0006] An example of a conventional semiconductor manufacturing
facility is now described with regard to FIG. 1. Referring now to
FIG. 1, a host computer 104 is shown as being in communication and
control of the various aspects of the semiconductor manufacturing
facility. More specifically, host computer 104 is in communication
with Tools 1-3 (112-116, respectively) used to process (or inspect)
semiconductor products. Thus, for example, Tool 1 (112) might be a
deposition tool, while Tool 2 (114) might be a chemical mechanical
polishing (CMP) tool.
[0007] For each tool shown in FIG. 1, there exists an associated
station controller (106-110). These station controllers are used to
facilitate the communication between the tools (112-116) and the
host computer 104. Since the tools often have disparate protocols,
it becomes necessary to implement the station controllers (112-116)
to allow the tools to communicate using protocol common to the
semiconductor processing facility, and thus communicate with the
host computer 104. Such common protocols that may be used to
ultimately communicate with the host computer 104 include SECS/GEM
and HSMS.
[0008] In addition, host computer 104 is also in communication with
a material transport control 102, which controls an external
material transport system 118. The external material transport
system 118 is what physically transports the semiconductor products
(at their various stages of production) from one tool to another.
(Typically, the semiconductor products are contained in cassettes,
boxes or pods of 25 units.) Consequently, a semiconductor "tool"
can be defined as a device that performs a given function or
functions on a given semiconductor product (e.g., a wafer), whereby
some external material transport system is required to transport
the semiconductor product to and from the tool (and, thus, from and
to other tools).
[0009] Various deficiencies have been found to exist using the
conventional semiconductor factory scheme as described above. These
deficiencies typically relate to the problems associated with
communication and control of the tools, and can have effects on
both the quantity and quality of the final (and intermediate)
semiconductor products. Some of these deficiencies are described
below.
[0010] Conventional semiconductor processing facilities contain
tools whose individual output (in terms of quantity and/or quality)
is controllable, and can be set to some amount/specification for a
given tool. However, each tool is just one part of the overall
wafer production process. Furthermore, the output of a given tool
typically results in at least some variation from wafer to wafer.
Consequently, in order to accurately control the quality and
quantity of the final output resulting from the work of multiple
tools, it would be desirable to effectively coordinate the efforts
of the multiple tools by, e.g., facilitating enhanced communication
to and between tools. This would more readily facilitate, for
example, 1) allowing a tool to send information forward to a second
tool to compensate for the variations in the output (in terms of
quantity and/or quality) of the previous tool, and/or 2) allowing a
tool to notify a previous tool of a variation so that the previous
tool can compensate by modifying its procedures for the benefit of
subsequently-processed products. However, protocols (which are
currently very host-centric) do not currently exist to readily
facilitate communication among tools. Consequently, what is needed
is a scheme to facilitate communication between two or more tools
so that the final product output from a combination of tools can be
more accurately controlled, adjusted and predicted.
[0011] Another problem with conventional semiconductor processing
facilities relates to the modification of recipes for particular
semiconductor products being processed in the semiconductor
processing facility. (A "recipe" is a sequence of steps that one or
more semiconductor products are directed to go through within a
given tool and/or series of tools.). Conventionally, if a recipe
needs to be modified for a particular purpose (e.g., one or more
individual semiconductor products needs to be specially treated),
the entire recipe would become corrupt (e.g., the recipe would be
changed and also there is no tracking or recording of the
modifications made to the recipe for the individual semiconductor
products. Consequently, what is needed is a scheme to
systematically implement, track and record modifications made to an
initial recipe for particular individual semiconductor products
(e.g., such as semiconductor wafers) without corrupting the entire
recipe.
[0012] Another deficiency with conventional schemes relates to
determining whether a tool or set of tools, each capable of
producing a number of different products (e.g., such as particular
types of central processing units) and/or capable of implementing a
number of different steps is prepared to produce a particular
semiconductor product that has been requested by the semiconductor
processing facility (e.g., requested by the host computer 104)
and/or is prepared to implement required/requested step(s).
Knowledge of such information is clearly important so that proper
planning can be undertaken before materials are sent to the various
appropriate tools in the semiconductor processing facility.
Consequently, what is needed is a scheme for determining whether a
tool or series of tools are ready for the production of a
particular semiconductor product and/or for the implementation of
required/requested steps. Knowledge of related information, such as
when a tool or tools will be undergoing some type of maintenance
(such as, e.g., preventive maintenance), is also desirable to
obtain in conjunction with whether one or more tools are ready for
producing a given semiconductor product.
[0013] Yet another problem with conventional schemes relates to
conveying historical (and related) information specifically
regarding one or more semiconductor products to specific tools
within the semiconductor processing facility as the semiconductor
product(s) travel to those tools for processing or inspection.
While conventional schemes can convey process or inspection
information about semiconductor product(s) to the host computer 104
(for use in any number of disparate ways), these schemes do not
actually and automatically associate information about the
semiconductor product with the semiconductor product as it travels
through the semiconductor processing facility or make this
information available to process and inspection tools.
Consequently, what is needed is a scheme for associating historical
(and related) information with a semiconductor product as it
travels (and is processed) through a semiconductor processing
facility.
[0014] Because of the deficiencies mentioned above, tools need to
be shut down for maintenance more frequently than might otherwise
be the case. Specifically, when a semiconductor product is
processed by a tool, the resultant semiconductor product typically
contains at least some variance (e.g., in terms of crystalline
structure and/or physical specification) from what is optimally
desired. This variance can occur due to any number of factors,
including 1) that parts of the tool are wearing down and/or, 2)
that the tool is in a foundry environment, where it is requested to
participate in the production of many different products over a
relatively short amount of time (and the switching from one product
to another does not, e.g., fully recalibrate certain aspects of the
tool). At some point, if the variance becomes too great (despite
efforts to, e.g., adjust the controls on the tool), the resultant
semiconductor product will be unacceptable, and the tool causing
the variance will need to be shut down for maintenance. However, if
there were some way to convey variance information (e.g.,
historical and related information) to a subsequent tool, and the
unacceptable variance can be compensated for by that subsequent
tool, then the tool causing the variance could continue to operate
without the need for a maintenance shut down. Allowing a tool
causing the variance to operate for a longer period of time without
requiring maintenance would clearly be beneficial from a cost and
yield perspective.
SUMMARY OF THE INVENTION
[0015] The present invention alleviates the deficiencies of the
prior schemes mentioned above by providing a system, method and
medium for facilitating communication among tools in a
semiconductor (e.g., wafer) processing facility. In particular, the
present invention provides greater control of the overall
semiconductor product output of groups of tools in terms of the
quantity and/or quality of a final semiconductor product.
Embodiments of the present invention contemplate that this is
implemented by providing enhanced communication among a group of
tools which form a "module" (where the module is contemplated to
provide some designated function or functions). This communication
can be facilitated via a module control mechanism, which could be a
separate "module controller," and/or computer/communications
facilities residing in the individual tools themselves. This
enhanced communication allows for more effective feedback and feed
forward capabilities so that variations found in a particular
semiconductor product can effectively and automatically trigger
appropriate compensation mechanisms.
[0016] More specifically, the present invention contemplates
implementing the above-mentioned concepts by providing that
modifications to a recipe can be made to one or more semiconductor
products without it affecting (e.g., corrupting) the entire recipe.
Also, such special modifications are recorded, so that they can be
noted by subsequent (or previous) tools. As part of (or possibly
separately from) this, the present invention also contemplates that
a "traveling information" file can be associated with one or more
wafers, and travel with the one or more wafers throughout the
semiconductor processing facility.
[0017] In addition, the present invention also provides facilities
to query one or more tools to determine whether or not the tools
are ready for the production of a specified semiconductor product
(and when in the tool's maintenance cycle some type of maintenance
is scheduled to occur) and/or for the implementation of
required/requested steps so that appropriate actions can be
taken.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Various objects, features, and attendant advantages of the
present invention can be more fully appreciated as the same become
better understood with reference to the following detailed
description of the present invention when considered in connection
with the accompanying drawings, in which:
[0019] FIG. 1 is a block diagram showing a conventional
semiconductor processing facility.
[0020] FIG. 2 is a block diagram depicting an exemplary module
configuration of tools, as contemplated by embodiments of the
present invention.
[0021] FIG. 3 shows a flow diagram depicting a method of operation
for implementing various tool-related communication schemes as
contemplated by embodiments of the present invention.
[0022] FIG. 4a illustrates three possible states of a tool in
response to a tool status request.
[0023] FIG. 4b depicts exemplary steps for querying (and receiving
information from) a tool, as contemplated by embodiments of the
present invention.
[0024] FIG. 5 is a block diagram depicting a traveling information
file associated with one or more wafers, as contemplated by
embodiments of the present invention.
[0025] FIG. 6 depicts an exemplary format of the traveling
information file.
[0026] FIG. 7 depicts an exemplary hierarchy of IDs.
[0027] FIGS. 8a and 8b depict exemplary scenarios for
communications involving the transport of materials through the
semiconductor processing facility.
[0028] FIG. 9 depicts an exemplary form of information relating to
wafers in a "cassette."
[0029] FIG. 10 depicts an exemplary computing device which can
exist as (or be a part of) various entities described herein,
including the host computer, tools and module controller.
DETAILED DESCRIPTION
[0030] The present invention relates to the control of tools and
the communication among tools in a multi-tool semiconductor
processing environment. More specifically, embodiments of the
present invention relate to a system, method and medium for control
of and communication among wafer processing tools in a wafer
processing environment.
[0031] While it should be understood that aspects of the present
invention can relate to any number of types of semiconductor
products (hereafter "products"), for the purposes of example and
discussion herein, the particular type of semiconductor product
referred to shall typically be envisioned to be a "wafer."
[0032] Aspects of the present invention (and embodiments thereof)
relate to facilitating communication between two or more tools in a
wafer processing facility for the purpose of synergistically
achieving a greater degree of control of the quality and/or
quantity of the combined, final output of the tools (e.g., in a
pre-set or user-specified manner). In various embodiments, these
tools (for which such communication is facilitated) are grouped
together into "modules" for performing certain specified functions.
To facilitate the tool-to-tool communication to implement the
specified functions, embodiments of the present invention
contemplate the use of a "module controller," which is envisioned
to be separate from (but is contemplated to be in communication
with) a host computer. Embodiments of the present invention
envision that the module controller may be a separate entity and/or
some or all of its functionality can reside in the tools,
themselves.
[0033] The module concept is now described in greater detail with
regard to FIG. 2. Referring to FIG. 2, tool 1 (204) and tool 2
(206) are depicted to be part of a module 218 (where the collection
of tools within module 218 is envisioned to perform one or more
specified overall functions). At least some embodiments of the
present invention contemplate that each of tools 1 and 2 (204 and
206, respectively) contains a communication control (210 and 214,
respectively) which enables each of the tools (204 and 206) to
communicate with each other directly (e.g., via a communication
link 220) without the use of a separate module controller 216. In
that situation, it is contemplated that the tools contain
sufficient "intelligence" (e.g., the tools have a built-in computer
mechanism within communication control 210 and/or 214 to process
and communicate information relating to the wafers processed by the
tools). This intelligence allows the tools to communicate directly
with each other, utilizing at least some of the various protocols
and techniques as described herein. In addition, embodiments of the
present invention contemplated that this intelligence can reside in
any one tool or it can be distributed in some manner among the
various communication controls (e.g., 210 and 214) of the tools.
Also, in this scenario, tools 1 and 2 will depend on various
information (e.g., initial recipes) being received directly from
the host computer (e.g., via host communication 208 and 212, and/or
through a traveling information file as described below), since a
separate module controller 216 would not be used.
[0034] Other embodiments of the present invention envision that
some or all of the communication aspects between tools are routed
through a module controller 216 that exists as a separate entity
from the tools (204 and 206). In this scenario, it is contemplated
that the host computer 202 is in communication with the module
controller 216, and the module controller is in communication with
the tools (204 and 206).
[0035] In either of the scenarios mentioned above with regard to,
e.g., use, partial use or non-use of a separate module controller
216, the host computer 202 is generally contemplated as being used
to control the overall function of the wafer processing facility
(of which the module 218 is at least a part) and is in
communication with that part of the module 218 that, e.g., receives
instructions regarding product recipes or conveys tool status.
Thus, host 202 exists and functions separately from the module
controller 216 and from the tool-to-tool communication
functionality thereof that might otherwise exist in the tools.
Also, in either scenario, it is contemplated that a unifying
protocol between the various components of the wafer processing
facility alleviates the need to use station controllers, as
described previously.
[0036] Embodiments of the present invention contemplate that at
least a part of the purpose of the host computer 202 is to convey
or select initial recipes for the tools, and also query the tools
and initiate the production of a requested product using the tools.
In addition, it is also contemplated that host computer 202 has at
least some control with regard to any external material transport
system that may be in use.
[0037] The dotted lines in FIG. 2 indicate connections and devices
that may or may not exist depending particularly upon whether or
not there is a separate module controller 216 being used (i.e.,
depending upon the particular embodiment contemplated).
[0038] It should be understood that embodiments of the present
invention contemplate that a "module" can be a set, physical entity
(e.g., three tools and a module controller) that is put together in
a kind of discrete package to perform a pre-set function and/or a
module can be defined within a multi-tool semiconductor processing
environment (e.g., three existing tools in a factory can be chosen
to perform a given function and caused to communicate to facilitate
performance of that function) or, three tools can be dispersed
within the factory and a wafer routed therethrough to facilitate a
series of prequalified steps leading to a known overall result. It
should also be understood that either of the above possibilities
contemplate embodiments that use, and that do not use, a separate
module controller 216.
[0039] Embodiments of the present invention envision that any
number of different types of tools could be used with any of the
various "module" schemes described above (or in other non-module
setting contemplated herein). A specific example of a module
contemplated by embodiments of the present invention is one that
envisions the usage of copper in the production of a wafer, for
example to fill features such as vias, trenches and/or contacts
which extend through an insulative layer previously deposited and
etched while on the wafer. The exemplary tools that could be used
in this module include 1) a "sputtering" tool to deposit a liner
layer and a seed layer onto a wafer and the features in a film
layer thereon for facilitating the further deposition of copper, 2)
an "electroplating" tool to deposit copper onto the wafer to fill
the features, and 3) a chemical/mechanical/polishing (CMP) tool to
remove excess material after the electroplating process has been
completed to facilitate further processing of the wafer. Thus, in
this module, it is contemplated that a wafer will be passed through
each of these above-mentioned tools in turn. Some embodiments of
the present invention contemplate the use of a separate "metrology"
tool to measure the thickness of the copper to determine how much
polishing needs to be done by the CMP tool. (Alternatively, the
"metrology" function can also be incorporated into one of the
aforementioned tools, such as the CMP or electroplating tool,
itself, in the form of, e.g., a metrology station.) Thus, the
measuring of thickness and/or uniformity of a film (in this
exemplary case, a copper film), and then using that measurement
information to determine the polishing that is needed (e.g., how
much, if any, to deviate from the amount of polishing otherwise
specified by an initial recipe), are characteristic aspects
contemplated by embodiments of the present invention.
[0040] In addition, the measurement of thickness and/or uniformity
of a film within a multi-function (e.g., cluster) tool by a first
functional unit and use of that measurement information to adjust a
second functional unit (e.g., a polishing unit) within that same
tool is also an aspect contemplated by various embodiments of the
present invention. In such an instance, it is envisioned that many
of the characteristics and features described herein (e.g., use of
a module controller to effect communication among functional units)
are applicable to this multi-function tool embodiment.
[0041] Another example of a "module" is one that uses a set of
tools to perform a "deposition/etch" function. For this module,
exemplary tools include 1) a deposition tool for dielectric film
deposition, 2) a photolithography tool, 3) an etching tool, and 4)
an inspection tool to inspect the results of the etching. As
contemplated in this example, if inspection of a wafer by the
inspection tool indicates that any of the previously-mentioned
tools did not function as expected, then feedback can be given to
those tools so that they can recalibrate themselves to produce a
more desirable result for subsequent wafers that will go through
the process. In this way, enhanced communication (whether
facilitated by a module controller 216 or "intelligence" in the
tools) thus facilitates enhanced quality of the wafers.
[0042] In the examples mentioned above, the tools can be made by
any number of companies, such as Applied Materials of Santa Clara,
Calif. or Nikon Corporation of Tokyo, Japan. Thus, the various
embodiments mentioned above (e.g., use of the module controller 216
or enhanced intelligence implemented within communication control
210, 214) can be implemented using various ones of such tools. Some
specific examples of tools manufactured by Applied Materials that
can be used in the "deposition/etch" example mentioned above are as
follows: the "dielectric deposition" tool can be the "Applied
Producer" tool, the etch tool can be the "Centura Etch," and the
inspection tool can be the "Applied CD SEM" tool.
[0043] Of course, it should be understood that the present
invention contemplates that any number of other different tools (in
addition to what is mentioned above) can also be used, so long as
they can be interfaced (with each other and with a host computer)
using any existing or future-recognizable protocols such as TCP/IP,
DCOM, SECS/GEM, CORBA and/or HSMS, and operating systems such as NT
(from Microsoft Corporation of Redmond, Wash.). Also, it should be
evident that any number of different types of tools are
contemplated, such as processing tools and inspection tools.
[0044] Embodiments of the present invention envision that module
controller 216 and/or communication control (210 and 214) in tools
1 and 2 and/or host computer 202 can contain standard computer
components (such as those found in PC compatible processors) such
as Pentium processors from Intel Corporation of Santa Clara,
Calif.). (This is also discussed further below with regard to FIG.
10.)
[0045] The present invention contemplates the use of various
embodiments to assist in facilitating the communication schemes
(and other envisioned aspects) described above with regard to FIG.
2. It should be understood, however, that these various embodiments
are, themselves, also contemplated for use separately from any use
that may be associated with the "modules" as indicated above (and
in some instances may not even be applicable to the module scheme).
These various embodiments are now described below.
[0046] A method of operation for implementing some of the various
embodiments that assist in facilitating communication schemes as
alluded to above are now discussed with regard to FIG. 3. Referring
to FIG. 3, the first step is that wafers are dispositioned (i.e.,
committed to production), as indicated by a block 302. Thus, in
this step it is contemplated that the semiconductor processing
facility (or some portion thereof) dispositions wafers (in some
initial or intermediate state) to be processed into some finished
(or at least intermediate) product.
[0047] The next step is that a request is forwarded to the tool(s)
in the wafer processing facility to produce a specified product, as
indicated by a block 304. (The tools receiving this request can,
e.g., be part of a "module.") In embodiments contemplated by the
present invention, such a request could be forwarded, for example,
by a host computer.
[0048] The next step is to determine whether the tool(s) are ready
to produce the specified product, such as a specific film layer
having specified characteristics or features, re, crystalline
structure, refluctivity, flatness, etc., as indicated by a decision
block 306. (Embodiments of the present invention also contemplate
that a determination can be made regarding whether one or more
tools are ready to implement some specifically requested or
required step or steps.) As will be discussed further below, a tool
may not be ready to produce a product for any number of reasons,
including that the tool is currently only ready to produce an
entirely different product (where the tool is capable of producing
multiple products) or that the tool is off-line because it is
undergoing maintenance. Thus, where a tool is not ready to produce
a requested product, any number of actions can be taken, including
waiting until the tool (or tools) is ready to produce a specified
product and/or notify the user of the status of the tool and/or run
some specified program which will take some designated action. This
is indicated by a block 308.
[0049] If the necessary tool(s) are ready to produce the specified
product, then one or more initial recipes can be accessed (e.g.,
requested) by the appropriate tools or forwarded to the tools by a
host computer, so that the tools will process the wafers as
instructed. This is indicated by a block 310. Then, the next step
is to begin processing wafers according to one or more recipes, as
indicated by block 312.
[0050] During the course of processing the wafers in accordance
with the recipes, it may be the case that one or more wafers need
to be processed somewhat differently than would otherwise be
indicated by an initial recipe. For example, if a wafer is etched
at one stage of the processing, it may be desirable at a subsequent
stage to treat that wafer somewhat differently to compensate for
variations in the etch process not consistent with a desired goal.
Consequently, it is envisioned that a determination is made as to
whether any wafer or wafers require treatment differing from the
initial recipe(s), as indicated by a block 314. If the answer is
"yes," then the appropriate steps of the recipe are modified only
for the specified wafer(s) needing special treatment, as indicated
by a block 318. The remaining wafers are still processed in
accordance with the initial recipes steps. Any special
modifications that were made to any of the wafers are recorded for
subsequent potential retrieval so that the history of any of the
specially modified wafers can be ascertained (e.g., by a subsequent
tool or the host). In this way, modifications are implemented and
kept track of, while the initial recipe is kept intact for the
remaining wafers that were not in need of any special
modification.
[0051] For wafers not requiring any treatment differing from the
initial recipe(s), then those wafers are processed in accordance
with the initial recipe(s) as indicated by a block 316.
[0052] It should be understood that the steps (and sequence
thereof) as depicted and discussed with regard to FIG. 3 are merely
by way of example, and that the present invention contemplates the
use of additional steps, as well as various modifications of those
steps mentioned.
[0053] As indicated above, embodiments of the present invention
contemplate the use of tools capable of potentially participating
in the manufacture of any number of different products. To
coordinate the effort to produce a given product, embodiments of
the present invention contemplate that those tools involved in the
production process are capable of receiving certain types of
commands from, and conveying status (e.g., availability)
information to, some central command/initiation computer such as a
host computer. As an example of this, embodiments of the present
invention contemplate that a status inquiry may be undertaken with
regard to whether one, several, or an entire factory of tools are
currently "ready" for the production of a specified product.
[0054] Various embodiments of the present invention contemplate
that any given product that can be manufactured by the wafer
processing facility (and thus, which a tool can participate in the
manufacture of) has a specified Product ID associated with it.
Thus, where it is desired to produce a given product, a status
request is sent (e.g., by a host computer) to determine whether a
tool (and/or all tools that would be involved in the process) are
ready to participate in the manufacture of the desired product. In
response to this status request, a "tool status" is then returned
for each tool, indicating the status of the particular tool for the
request as given.
[0055] An exemplary form of the "tool status" that is returned by a
tool as contemplated by embodiments of the present invention is
shown at FIG. 4a. Referring to FIG. 4a, this example depicts three
different possible states that a given tool (having a specified
"Tool ID") can have (in actual use, it is envisioned that only one
of these states is actually returned by the tool). In state one,
the tool has indicated that it is ready to participate in the
production of the product that has been requested. When this state
is returned, it is returned with certain other items of
information, including the time until the tool becomes inactive
due, e.g., to the fact that it undergoes some type of maintenance
(e.g., preventive maintenance [pm]), and the number of wafers that
the tool may process before the maintenance occurs. In embodiments
of the present invention, this information can be important since,
even if the tool indicated that it is "ready for production" of a
particular product, it may be scheduled to undergo maintenance in a
short period of time. In that case, the controlling entity (e.g.,
host computer) may decide to postpone production of the desired
product until after the maintenance, and may even command the tool
to immediately initiate the maintenance procedure (so that
production of the desired product can begin that much earlier).
[0056] A second possible state that can be returned (as shown in
this example of FIG. 4a) is one where the tool is currently down
for maintenance. In that case, as contemplated by embodiments of
the present invention, an item of information returned with that
state includes the time remaining until the tool is back up for
production.
[0057] A third possible state that can be returned as contemplated
by embodiments of the present invention is that the tool is
"currently running" some other job (e.g., involved in the
production of some other product). In that state, it is
contemplated that the number of wafers before completion of the
currently-running job is returned, as well as a time and number of
wafers until maintenance. In addition, embodiments of the present
invention also contemplate that, where a particular product
requested is not the same as the one currently running and some
time is required to re-set the tool in order for it to participate
in making the requested product, then that amount of time will also
be returned.
[0058] It should be understood that the present invention
contemplates the usage of any number of different states and/or the
ability to return and process any number of different items of
information. In addition, embodiments of the present invention
contemplate that the information returned in a "tool status" can
indicate which of possibly multiple steps that the tool performs in
its participation of making a given product are "ready." Thus, for
example, a particular tool may implement three different steps
while participating in the production of a particular product, but
at a given point in time the tool may be ready to implement only
two of them. In addition, it is also contemplated that some central
command (e.g., host) computer could also directly poll a tool as to
whether it is ready to implement some specified step that the tool
may generally be capable of implementing.
[0059] A sequence of exemplary steps for requesting the manufacture
of a particular product in accordance with the principles mentioned
above is now discussed with regard to FIG. 4b. Referring to FIG.
4b, the control entity (e.g., host computer) sends out a tool
status request, as indicated by a step 1. This can be in the form
of a list of one or more product ID's sent to a single tool, across
two or more tools, or even to all tools in a wafer processing
facility.
[0060] Step 2 indicates that the "tool status" has been sent by the
tool to the control entity (e.g., host ) (e.g., as was discussed
with regard to FIG. 4a above).
[0061] Once an indication has been sent that the necessary tools
are ready to make the requested product, then in step 3, a "tool
service request" is initiated (containing the relevant product ID
and/or tool ID's) to initiate the manufacture of the product or to
perform some tool service (e.g., maintenance). Since various events
could occur between the time that the "tool status" of step 2 is
received and the time that the tool service request is initiated
(e.g., a tool could have broken down), embodiments of the present
invention contemplate that the host computer then waits to receive
an indication whether the tool service request has been granted or
rejected, as indicated by step 4. If service is "granted," the tool
service will start, as indicated by step 5. (Otherwise, if service
is rejected, or if no response to the tool service request is
received (and a "time-out" occurs), then the tool service will not
be initiated.)
[0062] If tool service has been initiated, then when completed, the
tool will send, e.g., the host computer a "tool service completed"
message, as indicated by step 6.
[0063] It should be understood that the various states and
parameters of FIG. 4a and steps of FIG. 4b are examples
contemplated by the present invention, and that the present
invention envisions that any number of different types of
parameters, steps, etc. can also be used to implement the features
contemplated herein.
[0064] Embodiments of the present invention contemplate that
historical information pertaining to groups (e.g., "cassettes") of
wafers or even to a single wafer be recorded, and that this
information "follow" the wafers (or wafer) through the journey
through the wafer processing facility. In this way, if a wafer was
processed by a given tool such that an undesirable variation
occurred, then this recorded information will be following the
wafer to a subsequent tool, where appropriate compensation for the
variation can take place. Thus, for example, if the information
associated with a given wafer indicates that it was heated to a
less than adequate temperature within a certain tool, a subsequent
tool receiving the wafer may be able to utilize this recorded
information to compensate for the effects of reduced
temperature.
[0065] A scheme for implementing the wafer information recordation
as described above is depicted by FIG. 5. Referring now to FIG. 5,
a Wafer X is shown as being conveyed from a tool 1 (502) to a tool
2 (504) via an external material transport system 510, which may be
either manual or automated. In addition to wafer X itself, a
traveling information file (referred to in this example here as
"Wafer X file") 506 is also conveyed via a communication link 508
from tool 1 (502) to tool 2 (504). (Embodiments of the present
invention contemplate that tool 2 could automatically be passed the
Wafer X file, or that it would request the Wafer X file upon
receipt of Wafer X. In the latter case, such request could be made
directly of tool 1 and/or of some module control mechanism. In
either case, control of the Wafer X file gets transferred to tool
2.)
[0066] The Wafer X file 506 mentioned above can contain any number
of different items of information which may be relevant in the
processing of a wafer (to make a desired product) as it is
processed by the appropriate tools in the wafer processing
facility. As indicated by Wafer X file 506, such information can be
"feed forward information," meaning that it can contain information
which indicates how the Wafer X should be treated differently than
would otherwise be indicated by the initial recipes. Depending upon
the variation as recorded in the wafer history (i.e., in the Wafer
X file), deviations from the initial recipe(s) can be a difference
in one step on a single tool, or multiple steps over several tools.
Generally, it is envisioned that whatever corrective measures need
to be taken to compensate for the variation would be
implemented.
[0067] As an example of a specific application of the use of a
traveling information file such as Wafer X file 506 of FIG. 5 and
environments used therewith, tool 2 (504) can be a CMP apparatus,
and tool 1 (502) can be a metrology device that can generate
information about a wafer and store it in the traveling information
file. Assuming that a thickness or uniformity profile (e.g., an
indication of the thickness or uniformity of a wafer layer as a
function of the position on the wafer) can be derived from the
"feed forward" information in the traveling information file, the
CMP apparatus can then use that information to improve the
polishing uniformity and compensate for variations that occurred at
previous tools. Thus, if one radial region of the layer on the
wafer is thicker than another region, the CMP apparatus can use the
feed forward information to determine a plurality of pressures that
will be applied to the different radial regions of the wafer. By
applying a higher pressure to the thick region, material may be
preferentially removed from the thick region, thereby improving the
planarity of the resulting wafer and compensating for variations in
a prior tool. An example of a chemical mechanical polishing system
that can apply preferential pressures to a wafer is described in
provisional U.S. Application Serial No. 60/143,219, filed Jul. 9,
1999, the entire disclosure of which is incorporated by
reference.
[0068] While the description of FIG. 5 above has been in terms of a
single wafer, it should be understood that the present invention
also contemplates that the history of a group of wafers (e.g., a
cassette or lot of wafers), to the extent that they have been
treated substantially the same in at least certain instances, can
also be recorded in a traveling information file and follow the
group as it travels through the wafer processing facility.
[0069] In addition to, or in conjunction with, the use of the
traveling information file, embodiments of the present invention
also contemplate that feedback information can be utilized. Thus,
for example, should one or more traveling information files which
are received by tool 2 from tool 1 indicate that there is a
variation with tool 1 which needs to be compensated for, feedback
information 512 can be sent from tool 2 to tool 1 indicating to
tool 1 that certain aspects of tool 1 need to be adjusted.
(Embodiments of the present invention contemplate that this
feedback can, in effect, be in the form of a copy of the traveling
information file 506.) In this way, once tool 1 makes these
adjustments, subsequent wafers can be processed in a desirable
fashion.
[0070] It should be understood that the concepts described herein,
particularly with regard to FIG. 5, result in certain distinct
advantages relating to the present invention. For example,
implementation of the "feed forward" concept as described above may
allow a given tool to produce wafers with a greater variance (in
terms of, e.g., crystalline structure and/or physical dimension)
than would otherwise be acceptable in the course of producing a
given semiconductor product, since a subsequent tool can then
compensate for this variance. A result of this is that the
necessity to shut an individual tool down (or slow its production)
for maintenance purposes (so that the product the tool provides
would be within a range where subsequent (or precedent) process
compensation would not be necessary), decreases. Since the tools
are down for maintenance less of the time, yield increases, and the
cost of maintaining the tools decreases. Similar advantages can
also occur by the implementation of the aforementioned feedback
concept. Situations where the feed forward and feedback concepts
are contemplated to be applicable include where parts of a tool
incrementally change product results over time and must otherwise
be replaced before their "end of life" to ensure that the resulting
product is within narrow specified limits, and/or in a foundry
environment, where a tool is directed to participate in the
production of a different semiconductor product from the one that
it was previously participating in, and the process provided by the
tool must be changed for its manufacture of the second
semiconductor product.
[0071] Embodiments of the present invention also contemplate that
various concepts discussed herein, and particularly those relating
to FIG. 5 above, are also applicable with regard to the measurement
of thickness and/or uniformity of a film within a multi-function
(e.g., cluster) tool. Thus, it is envisioned that, e.g., a first
functional unit within a cluster tool can obtain measurement
information relating to the thickness and/or uniformity of a wafer,
and convey that information to a second functional unit within the
cluster tool (e.g., one that performs a polishing function). The
second functional unit can then (if needed or desired) adjust its
operation (e.g., the amount of polishing) in accordance with the
received measurement information.
[0072] An exemplary format for a traveling information file
containing information for a single wafer (particularly where
inherent computer intelligence is contemplated to exist in the
tools, as described above) is now shown and described with regard
to FIG. 6. Referring to FIG. 6, a Tool ID indicates the given tool
for which a set of actions (e.g., recipe steps) are to be taken. As
can be appreciated, such a set of actions is contemplated to exist
in the traveling information file for each tool that will be used
to process each wafer (having a specified Wafer ID) to create the
desired product. As can be seen in FIG. 6, there are n Steps
associated with the process, each of which is associated with a
recipe. Thus, in this example, n "initial" recipes (which, as
indicated above, are contemplated by embodiments of the present
invention to have come from the host computer) are to be
implemented by the tool having "Tool ID" as shown.
[0073] In conjunction with the recipes, parameters associated with
the wafer are also recorded. The "parameters" represent those
specific aspects to be implemented by the tool that are variations
from the initial recipe. For example, if a particular Tool ID
represented a polishing tool, and the wafer at issue needed an
additional 10 seconds of polishing beyond what was otherwise
prescribed by the relevant recipe, the need for the extra 10
seconds would be recorded into the "parameters" associated with the
recipe. Thus, the "parameters" are calculated (e.g., by one of the
tools), and recorded in the course of the wafer traveling through
the wafer processing facility.
[0074] The "data list" is envisioned to contain any number of items
of data that may pertain to the wafer, such as temperature of the
wafer at certain times in the wafer's history, wafer thickness,
uniformity, etc. It is envisioned that it is the information in
this data list that is used, for example, to determine whether the
wafer needs to undergo treatment different from that prescribed by
the initial recipe (thus causing additional information to be
entered into the "parameters").
[0075] It should be understood that the format depicted by FIG. 6
as described above is by way of example, and that any number of
different formats are also contemplated.
[0076] Typically, a tool in a wafer processing facility will
receive wafers in various sized groups. Often, wafers will be sent
to a tool in groups of one or more "cassettes," (comprising
typically 25 wafers). Each cassette can have its own "Material ID
(cassette ID)" associated with it. A "lot" (consisting of a number
of wafers) will typically comprise multiple cassettes (or portions
of a cassette), and can have their own associated "Lot ID."
Finally, a "wafer" can, itself, have its own individual Wafer ID.
One exemplary hierarchal structure for this is depicted by FIG.
7.
[0077] In addition to determining whether or not a tool or groups
of tools are ready for the production of a given product, and in
addition to conveying information about the status of a particular
wafer's progress during processing, embodiments of the present
invention also contemplate usage of, and operating within
environments of, a material transport system, such as the type
indicated in FIGS. 1 and 2. Further to the implementation of such a
system, FIG. 8a depicts an exemplary scenario for the steps
involved in the delivery of material (e.g., cassettes of wafers)
from a material transport system (where the communicated
information and/or materials emanate from a host computer/delivery
system and/or another tool) to a tool, while FIG. 8b depicts an
exemplary scenario for the steps involved in the retrieval of
materials from a tool. As can be seen from FIGS. 8a and 8b, wafers
at the cassette level (i.e., whole cassettes of wafers, each having
a cassette ID) are what are being transported and queried. It
should be understood, however, that any number of other types of
scenarios, steps, and groupings of wafers are also contemplated for
use with, and in environments of, the present invention.
[0078] FIG. 9 depicts information regarding a cassette of wafers
(having a particular cassette ID). This information can be conveyed
to a tool so that the tool can associate a particular wafer with
its wafer ID, as well as identify which physical "slot" in a
cassette the particular wafer having a given wafer ID is located
at. In this way, when a tool needs to, for example, implement (or
modify) one or more steps in a different way from that which is
otherwise dictated by a given recipe, the tool will know which
"slot" the relevant wafer is in when the cassette is delivered from
or removed from the tool.
[0079] Embodiments of the present invention contemplate potentially
operating with tools that may place a given wafer in a different
cassette than the one it entered the tool in. However, where this
is the case, the present invention contemplates that this
occurrence would be anticipated and kept track of, so that any
appropriate information corresponding to a given wafer continues to
be associated with that wafer.
[0080] Embodiments of the present invention contemplate the use of
various computers and computer components either as, or as a part
of, various entities such as the host computer, tools and/or module
controllers, and/or for use in environments therewith. An exemplary
depiction of such a computing device that could be used with
embodiments of the present invention is shown at FIG. 10. Referring
now to FIG. 10, CPU(s) 1004 are shown to be in communication with a
memory/storage device 1006 via bus 1002. CPU(s) 1004 can be any
number of different types of processors, including those
manufactured by Intel Corporation or Motorola of Schaumberg, Ill.
The memory/storage device 1006 can be any number of different types
of memory devices such as DRAM and SRAM as well as various types of
storage devices, including magnetic and optical media, and that the
memory/storage device 1006 can also take the form of a
communications transmission.
[0081] A display device 1008 is also shown, which could be any
number of devices conveying visual and/or audio information to a
user. Also in communication with bus 1002 is an I/O interface 1010
for allowing the computing device 1000 to interface with other
devices, such as host computers, tools or module controllers,
depending upon which device the computing device 1000 (or portion
thereof) represents.
[0082] The computing device 1000 can be an off-the-shelf device
such as a personal computer (e.g., an Intel-based device), or can
be merely components on a "rack." Any number of operating systems,
such as NT from Microsoft Corporation can be used. Also, it is
further contemplated that computing device 1000 (and/or various
components thereof) are connected via 1/0 1010 using, e.g., the
communications mechanisms as generally described above, which may
comprise networking mechanisms and protocols such as DCOM, the HSMS
protocol standard used by SECS/GEM, and/or network operating
systems such as NT or Novell from Novell, Inc. of Provo, Utah.
[0083] Of course, it should be, understood that the components
described above are by way of example, and that the present
invention contemplates that any number of different types of
components and configurations can be used.
[0084] In general, it should be emphasized that the various
components of embodiments of the present invention can be
implemented in hardware, software or a combination thereof. In such
embodiments, the various components and steps would be implemented
in hardware and/or software to perform the functions of the present
invention. Any presently available or future developed computer
software language and/or hardware components can be employed in
such embodiments of the present invention. For example, at least
some of the functionality mentioned above could be implemented
using the C, C++, or any assembly language appropriate in view of
the processor(s) being used. It could also be written in an
interpretive environment such as Java and transported to multiple
destinations to various users.
[0085] It is also to be appreciated and understood that the
specific embodiments of the invention described hereinbefore are
merely illustrative of the general principles of the invention.
Various modifications may be made by those skilled in the art
consistent with the principles set forth hereinbefore.
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