U.S. patent application number 10/453230 was filed with the patent office on 2003-11-06 for dual metal gate cmos devices.
This patent application is currently assigned to Sharp Laboratories of America, Inc.. Invention is credited to Evans, David R., Hsu, Sheng Teng, Ma, Yanjun, Ono, Yoshi.
Application Number | 20030205767 10/453230 |
Document ID | / |
Family ID | 25223983 |
Filed Date | 2003-11-06 |
United States Patent
Application |
20030205767 |
Kind Code |
A1 |
Ma, Yanjun ; et al. |
November 6, 2003 |
Dual metal gate CMOS devices
Abstract
A method of fabricating a dual metal gate CMOS includes forming
a gate oxide in a gate region and depositing a place-holder gate in
each of a n-well and p-well; removing the place-holder gate and
gate oxide; depositing a high-k dielectric in the gate region;
depositing a first metal in the gate region of the p-well;
depositing a second metal in the gate region of each of the n-well
and p-well; and insulating and metallizing the structure. A dual
metal gate CMOS of the invention includes PMOS transistor and a
NMOS transistor. In the NMOS, a gate includes a high-k cup, a first
metal cup formed in the high-k cup, and a second metal gate formed
in the first metal cup. In the PMOS, a gate includes a high-k cup
and a second metal gate formed in the high-k cup.
Inventors: |
Ma, Yanjun; (Vancouver,
WA) ; Ono, Yoshi; (Camas, WA) ; Evans, David
R.; (Beaverton, OR) ; Hsu, Sheng Teng; (Camas,
WA) |
Correspondence
Address: |
David C. Ripma, Patent Counsel
Sharp Laboratories of America, Inc.
5750 N.W. Pacific Rim Boulevard
Camas
WA
98607
US
|
Assignee: |
Sharp Laboratories of America,
Inc.
|
Family ID: |
25223983 |
Appl. No.: |
10/453230 |
Filed: |
June 2, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10453230 |
Jun 2, 2003 |
|
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09817834 |
Mar 27, 2001 |
|
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6573134 |
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Current U.S.
Class: |
257/371 ;
257/E21.637; 257/E27.062 |
Current CPC
Class: |
H01L 21/823842 20130101;
H01L 27/092 20130101 |
Class at
Publication: |
257/371 |
International
Class: |
H01L 029/76 |
Claims
We claim:
1. A method of fabricating a dual metal gate CMOS, comprising:
preparing a silicon substrate to form device areas, wherein each
device area includes an n-well and a p-well; forming a gate oxide
in a gate region and depositing a place-holder gate in each of the
n-well and p-well; implanting ions to form a source region and a
drain region in each of the n-well and p-well; removing the
place-holder gate and gate oxide; depositing a high-k dielectric in
the gate region; depositing a first metal in the gate region of the
p-well; depositing a second metal in the gate region of each of the
n-well and p-well; and insulating and metallizing the
structure.
2. The method of claim 1 wherein said depositing a place-holder
gate includes depositing a place-holder material to a thickness of
between about 150 nm to 500 nm.
3. The method of claim 2 wherein said depositing a place-holder
material includes depositing Si.sub.3N.sub.4.
4. The method of claim 2 which further includes depositing an oxide
layer before said removing, wherein said oxide layer is between
about 1.5.times. to 2.0.times. the thickness of the placeholder
gate.
5. The method of claim 1 wherein said depositing a high-k material
includes depositing a high-k material taken from the group of
materials consisting of HfO.sub.2 and ZrO.sub.2.
6. The method of claim 1 wherein said depositing a high-k material
includes depositing high-k material to a thickness of between about
3 nm to 8 nm.
7. The method of claim 1 wherein said depositing a first metal
includes patterning the gate area of the p-well and depositing a
first metal, patterning the first metal and selectively etching the
first metal.
8. The method of claim 1 wherein said depositing a first metal
includes depositing a layer of the first metal over the entire
device area, and patterning the device area to leave a first metal
cup in the gate region of the p-well.
9. The method of claim 1 wherein said depositing a first metal
includes depositing a metal taken from the group of metals
consisting of platinum and iridium.
10. The method of claim 1 wherein said depositing a second metal
includes depositing a metal taken from the group of metals
consisting of aluminum, zirconium, molybdenum, niobium, thallium,
thallium nitride and vanadium.
11. A method of fabricating a dual metal gate CMOS, comprising:
preparing a silicon substrate to form device areas, wherein each
device area includes an n-well and a p-well; forming a gate oxide
in a gate region and depositing a place-holder gate in each of the
n-well and p-well, including depositing a Si.sub.3N, place-holder
material to a thickness of between about 150 nm to 500 nm;
implanting ions to form a source region and a drain region in each
of the n-well and p-well; depositing an oxide layer to a thickness
of between about 225 nm to 1000 nm; removing the place-holder gate
and gate oxide; depositing a high-k dielectric in the gate region;
depositing a first metal taken from the group of metals consisting
of platinum and iridium in the gate region of the p-well;
depositing a second metal taken from the group of metals consisting
of aluminum, zirconium, molybdenum, niobium, thallium, thallium
nitride and vanadium in the gate region of each of the n-well and
p-well; and insulating and metallizing the structure.
12. The method of claim 11 wherein said depositing a high-k
material includes depositing a high-k material taken from the group
of materials consisting of HfO.sub.2 and ZrO.sub.2.
13. The method of claim 11 wherein said depositing a high-k
material includes depositing high-k material to a thickness of
between about 3 nm to 8 nm.
14. The method of claim 11 wherein said depositing a first metal
includes patterning the gate area of the p-well and depositing a
first metal, patterning the first metal and selectively etching the
first metal.
15. The method of claim 11 wherein said depositing a first metal
includes depositing a layer of the first metal over the entire
device area, and patterning the device area to leave a first metal
cup in the gate region of the p-well.
16. A dual metal gate CMOS comprising: a substrate having an n-well
to form a PMOS transistor and a p-well to form a NMOS transistor,
each having a gate region, a source region and a drain region; in
the NMOS, a gate including a high-k cup, a first metal cup formed
in the said high-k cup, and a second metal gate formed in said
first metal cup; in the PMOS, a gate including a high-k cup and a
second metal gate formed in said high-k cup; wherein said first
metal is taken from the group of metals consisting of platinum and
iridium; and wherein said second metal is taken from the group of
metals consisting of aluminum, zirconium, molybdenum, niobium,
thallium, thallium nitride and vanadium.
17. The CMOS of claim 16 wherein said high-k material is a high-k
material taken from the group of materials consisting of HfO.sub.2
and ZrO.sub.2.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of application Ser. No.
09/817,834, filed Mar. 27, 2001, entitled "Dual Metal Gate CMOS
Devices and Method for Making the Same," invented by Ma et al., now
U.S. Pat. No. 6,573,134.
FIELD OF THE INVENTION
[0002] This invention relates to MOS transistors and IC fabrication
method, and specifically to a dual metal gate CMOS device and the
fabrication thereof.
BACKGROUND OF THE INVENTION
[0003] Dual metal gate CMOS devices are suggested in the 1999
edition of International Technology Roadmap for Semiconductors,
however, that publication neither teaches nor suggests any process
for making such devices, nor does it specify materials or
parameters for making dual metal gate CMOS devices.
[0004] Current CMOS devices use polysilicon as the gate electrode
for both the NMOS and the PMOS transistor, wherein N+ polysilicon
is used for the NMOS transistor, while P+ polysilicon is used for
the PMOS. Because of gate depletion problems associated with
polysilicon, replacing the polysilicon with metal is expected to
provide a more reliable and efficient CMOS device.
[0005] There are currently two techniques for placement of metal
electrodes in IC devices: one is to use a metal electrode with the
Fermi level at the middle of the Si band gap. The second technique
is to use dual metal: one metal functions similarly to that of N+
polysilicon in the NMOS transistor, and a second, different metal
functions similarly to P+ polysilicon in the PMOS transistor.
SUMMARY OF THE INVENTION
[0006] A method of fabricating a dual metal gate CMOS, includes
preparing a silicon substrate to form device areas, wherein each
device area includes an n-well and a p-well; forming a gate oxide
in a gate region and depositing a place-holder gate in each of the
n-well and p-well; implanting ions to form a source region and a
drain region in each of the n-well and p-well; removing the
place-holder gate and gate oxide; depositing a high-k dielectric in
the gate region; depositing a first metal in the gate region of the
p-well; depositing a second metal in the gate region of each of the
n-well and p-well; and insulating and metallizing the
structure.
[0007] A dual metal gate CMOS of the invention includes a substrate
having an n-well to form a PMOS transistor and a p-well to form a
NMOS transistor, each having a gate region, a source region and a
drain region; in the NMOS, a gate including a high-k cup, a first
metal cup formed in the high-k cup, and a second metal gate formed
in the first metal cup; in the PMOS, a gate including a high-k cup
and a second metal gate formed in the high-k cup; wherein the first
metal is taken from the group of metals consisting of platinum and
iridium; and wherein the second metal is taken from the group of
metals consisting of aluminum, zirconium, molybdenum, niobium,
thallium, thallium nitride and vanadium.
[0008] It is an object of the invention to provide an efficient,
reliable dual metal gate CMOS device.
[0009] Another object of the invention is to provide a CMOS device
wherein polysilicon is not used in the Date region.
[0010] This summary and objectives of the invention are provided to
enable quick comprehension of the nature of the invention. A more
thorough understanding of the invention may be obtained by
reference to the following detailed description of the preferred
embodiment of the invention in connection with the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIGS. 1-7 depict steps in the formation of a dual metal gate
CMOS device according to the method of the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] This invention provides a process for integration of dual
metal-gate CMOS devices, and a CMOS device constructed according to
the method of the invention. Turning now to FIG. 1, the CMOS device
of the invention is formed on a wafer 10 of p-type silicon. Wafer
10 is segmented to provide device isolation by oxide regions 11 and
form device areas, one of which is shown generally at 12.
State-of-the-art process are followed to form an n-well 14 for the
PMOS transistor, and a p-well 16 for the NMOS transistor. These
areas may be formed by, for the PMOS, by implantation of phosphorus
ions, at a dose of about 5-10.sup.3 cm.sup.-2 to 5-10.sup.14
cm.sup.-2, and at an energy level of 50 keV to 200 keV, and for the
NMOS, by implantation of boron ions, at a dose of about 5-10.sup.13
cm.sup.-2 to 5-10.sup.14 cm.sup.-2,and at an energy level of 20 keV
to 100 keV. The threshold voltage is adjusted. A gate oxide layer
18, 20, for the PMOS transistor and the NMOS transistor,
respectively, is formed by thermal oxidation. Silicon nitride
(Si.sub.3N.sub.4), or polysilicon, in a thickness of between about
150 nm to 500 nm is deposited by plasma-enhanced chemical vapor
deposition (PECVD), to form what is referred to as a "dummy" gate,
or a place-holder gate. Place-holder gates 22, 24 are formed in the
PMOS and NMOS, respectively. These are formed by photolithography
and anisotropic plasma etching of the nitride, or polysilicon, with
the etching stopping at the level of the gate oxide. The gate oxide
may be partially etched or may be completely removed during this
etch process. The nitride layer forms a replacement cast for the
gate electrode.
[0013] Source and drain junctions are formed in both the PMOS and
NMOS. One technique for accomplishing this is to by implantation of
BF.sub.2 ions, at a dose of about 1-10.sup.15 cm.sup.-2 to
5-10.sup.15 cm.sup.-2, and at an energy level of 30 keV to 50 keV,
in n-well 14, to provide a source 26 and a drain 28 for the PMOS,
and to implant arsenic ions, at a dose of about 1-10.sup.15
cm.sup.-2 to 5-10.sup.15 cm.sup.-2, and at an energy level of 30
keV to 60 keV, in p-well 16, to provide a source. 30 and a drain 32
for the NMOS. An oxide spacer is formed by depositing oxide and
anisotropic etching, followed by silicide deposition.
[0014] Referring now to FIG. 2, an oxide layer 36 is deposited by
CVD. The desired thickness is about 1.5.times. to 2.times. the
thickness of the silicon nitride layer deposited in FIG. 1. The
structure is planarize by a CMP process, stopping at the top of the
silicon nitride. A high selectivity slurry is desirable for the CMP
process.
[0015] Turning now to FIGS. 3 and 4, removal of the nitride
place-holder gates 22, 24 and gate oxides 18, 20. A high-k gate
dielectric 38, such as HfO.sub.2 or ZrO.sub.2, is deposited to a
thickness of between about 3 nm to 8 nm, and treated by
conventional post deposition treatment, including annealing, at a
temperature in a range of about 500.degree. C. to 800.degree. C.
for between about 10 minutes to 60 minutes, forming a dielectric
cup in the gate region of each of n-well 14 and p-well 16. The next
step of the method of the invention may be performed in either of
two way.
[0016] The first option, and now referring to FIG. 3, is to apply
photoresist 40 to pattern the gate area of the NMOS, and to
deposit, by sputtering, the first metal 42 for the metal gate
electrode. The first metal is generally either platinum or iridium.
The metal is patterned, and the metal etched, except for the metal
in the gate are of the NMOS The photoresist is then removed,
resulting at the structure shown in FIG. 5, which includes a first
metal cup formed inside the high-k cup in the NMOS.
[0017] The second option, and now referring to FIG. 4, is to
deposit a first metal 42 over the entire wafer, and then to pattern
the wafer and the PMOS area with photoresist 40. The exposed metal
is then selectively wet etched with an etchant that will not etch
the high-k gate dielectric. One such etchant is H.sub.2O.sub.2. The
resulting structure, as from the first option, is shown in FIG.
5.
[0018] The next step in the method of the invention is to deposit
the second metal 44, which may be any metal taken from the group
aluminum, zirconium, molybdenum, niobium, thallium, thallium
nitride and vanadium. This metal is then smoothed and reduced by
CMP, resulting in the structure shown in FIG. 6, wherein a metal
gate electrode is formed in the high-k cup of the PMOS and in the
first metal cup of the NMOS.
[0019] The remainder of the process to complete the dual metal gate
CMOS, and now referring to FIG. 7, proceeds according to
state-of-the-art processes to remove the remaining high-k material,
deposit insulating oxide 46, and medialis the structure, 48, 50, 52
and 54. Medullization for the gate electrodes is also performed,
although the structure does not show in the view in FIG. 7.
[0020] Thus, a method and system for dual metal gate CMOS devices
and method for making the same has been disclosed. It will be
appreciated that further variations and modifications thereof may
be made within the scope of the invention as defined in the
appended claims.
* * * * *