U.S. patent application number 10/342818 was filed with the patent office on 2003-06-05 for semiconductor device having a ball grid array and method therefor.
Invention is credited to Burnette, Terry E., Koschmieder, Thomas H., Mawer, Andrew J..
Application Number | 20030102535 10/342818 |
Document ID | / |
Family ID | 24946518 |
Filed Date | 2003-06-05 |
United States Patent
Application |
20030102535 |
Kind Code |
A1 |
Burnette, Terry E. ; et
al. |
June 5, 2003 |
Semiconductor device having a ball grid array and method
therefor
Abstract
A semiconductor device (50) includes a semiconductor die (52)
having electronic circuitry that is connected to a substrate (54).
The substrate (54) is used to interface the semiconductor die (52)
to a printed circuit board (64). The substrate (54) includes a
plurality of bonding pads (56, 58). A first portion of the
plurality of bonding pads are soldermask defined (SMD) bonding pads
(56) and a second portion of the plurality of bonding pads are
non-soldermask defined (NSMD) bonding pads (58). Using a
combination of SMD and NSMD bonding pads provides the advantages of
good thermal cycling reliability and good bending reliability over
devices that have only SMD bonding pads or NSMD bonding pads.
Inventors: |
Burnette, Terry E.; (New
Braunfels, TX) ; Koschmieder, Thomas H.; (Austin,
TX) ; Mawer, Andrew J.; (Austin, TX) |
Correspondence
Address: |
MOTOROLA INC
AUSTIN INTELLECTUAL PROPERTY
LAW SECTION
7700 WEST PARMER LANE MD: TX32/PL02
AUSTIN
TX
78729
|
Family ID: |
24946518 |
Appl. No.: |
10/342818 |
Filed: |
January 15, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10342818 |
Jan 15, 2003 |
|
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09733170 |
Dec 8, 2000 |
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Current U.S.
Class: |
257/659 ;
257/E23.07 |
Current CPC
Class: |
H01L 23/49838 20130101;
H05K 2201/0989 20130101; H05K 2201/094 20130101; H05K 2201/099
20130101; H01L 2224/16 20130101; H05K 3/3452 20130101; H05K
2201/10734 20130101; H01L 23/585 20130101; H05K 3/3436 20130101;
H01L 2924/12044 20130101 |
Class at
Publication: |
257/659 |
International
Class: |
H01L 023/552 |
Claims
What is claimed is:
1. A semiconductor device, comprising: a semiconductor die having
electronic circuitry; and a substrate for interfacing the
semiconductor die to a printed circuit board, the substrate having
a plurality of bonding pads for connecting to the printed circuit
board, a first portion of the plurality of bonding pads being
characterized as soldermask defined bonding pads and a second
portion of the plurality of bonding pads being characterized as
non-soldermask defined bonding pads.
2. The semiconductor device of claim 1, wherein a soldermask
defined bonding pad on a surface of the substrate comprises a metal
bonding pad and having an insulative coating on the substrate
overlapping a portion of the metal bonding pad, the overlapping
portion for defining a connection area for a solder
interconnect.
3. The semiconductor device of claim 1, wherein a non-soldermask
defined bonding pad on a surface of the substrate comprises a metal
bonding pad and having an exposed edge, the exposed edge defining a
connection area for a solder interconnect.
4. The semiconductor device of claim 1, wherein the first portion
of the plurality of bonding pads are the outermost bonding pads in
an array of bonding pads.
5. The semiconductor device of claim 4, wherein the outermost
bonding pads are the three outer rows of bonding pads on the
substrate.
6. The semiconductor device of claim 4, wherein the second portion
of the plurality of bonding pads are the innermost bonding pads in
the array of bonding pads.
7. The semiconductor device of claim 1, further comprising a
printed circuit board for receiving the semiconductor die, the
printed circuit board having a plurality of bonding pads for
connecting to the substrate, a first portion of the plurality of
bonding pads being characterized as the soldermask defined bonding
pads and a second portion of the plurality of bonding pads being
characterized as the non-soldermask defined bonding pads.
8. The semiconductor device of claim 1, further comprising a
printed circuit board for receiving the semiconductor die, the
printed circuit board having a plurality of bonding pads for
connecting to the substrate, the plurality of bonding pads being
characterized as soldermask defined bonding pads.
9. The semiconductor device of claim 1, further comprising a
printed circuit board for receiving the semiconductor die, the
printed circuit board having a plurality of bonding pads for
connecting to the substrate, the plurality of bonding pads being
characterized as non-soldermask defined bonding pads.
10. A printed circuit board, comprising a plurality of bonding pads
for connecting to a semiconductor device, a first portion of the
plurality of bonding pads being characterized as soldermask defined
bonding pads and a second portion of the plurality of bonding pads
being characterized as non-soldermask defined bonding pads.
11. The printed circuit board of claim 10, wherein the printed
circuit board is a substrate for interfacing a semiconductor die to
the printed circuit board.
12. The printed circuit board of claim 10, wherein the first
portion of the plurality of bonding pads are the outermost bonding
pads in an array of bonding pads.
13. The printed circuit board of claim 10, wherein the outermost
bonding pads are the three outer rows of bonding pads of the
printed circuit board.
14. The printed circuit board of claim 10, further comprising a
substrate, the substrate for interfacing the printed circuit board
to a semiconductor die, a first portion of a plurality of bonding
pads on the substrate being characterized as the soldermask defined
bonding pads and a second portion of the plurality of bonding pads
being characterized as the non-soldermask defined bonding pads.
15. The printed circuit board of claim 10, further comprising a
substrate, the substrate for interfacing the printed circuit board
to a semiconductor die, the substrate having a plurality of bonding
pads for connecting to the printed circuit board, the plurality of
bonding pads being characterized as soldermask defined bonding
pads.
16. The printed circuit board of claim 10, further comprising a
substrate, the substrate for interfacing the printed circuit board
to a semiconductor die, the substrate having a plurality of bonding
pads for connecting to the printed circuit board, the plurality of
bonding pads being characterized as non-soldermask defined bonding
pads.
17. A method for attaching a semiconductor device to a printed
circuit board, the semiconductor device comprising a semiconductor
die connected to a substrate, the method comprising the steps of:
providing a plurality of bonding pads on a surface of the substrate
for electrically connecting the substrate to the printed circuit
board; and depositing a soldermask over the surface of the
substrate to define a first portion of the plurality of bonding
pads as soldermask defined bonding pads and to define a second
portion of the plurality of bonding pads as non-soldermask defined
bonding pads.
18. The method of claim 17, further comprising a step of forming
solder balls on the plurality of bonding pads.
19. The method of claim 18, further comprising the steps of:
providing a plurality of bonding pads on the surface of the printed
circuit board for electrically connecting to the plurality of
bonding pads on the substrate; and depositing a soldermask over the
surface of the printed circuit board to define a first portion of
the plurality of bonding pads on the printed circuit board as
soldermask defined bonding pads and to define a second portion of
the plurality of bonding pads on the printed circuit board as
non-soldermask defined bonding pads.
20. A method for attaching a semiconductor device to a printed
circuit board, the semiconductor device comprising a semiconductor
die connected to a substrate, the method comprising the steps of:
providing a plurality of bonding pads on a surface of the printed
circuit board for electrically connecting the printed circuit board
to the substrate; and depositing a soldermask over the surface of
the printed circuit board to define a first portion of the
plurality of bonding pads as soldermask defined bonding pads and to
define a second portion of the plurality of bonding pads as
non-soldermask defined bonding pads.
Description
FIELD OF THE INVENTION
[0001] This invention relates generally to semiconductor devices,
and more particularly, to a semiconductor device having a ball grid
array and method therefor.
BACKGROUND OF THE INVENTION
[0002] In some semiconductor manufacturing processes, such as for
example, "flip chip", bumps are fabricated on pad areas of a
semiconductor die in order to interconnect the die to a package or
to a substrate. The substrate is used to interface the electrical
circuits of the semiconductor die to a printed circuit board. In
some instances, the semiconductor die may be attached directly to
the printed circuit board.
[0003] An integrated circuit manufactured using "flip chip"
technology may have hundreds of these solder bumps. In solder ball,
or solder bump, technology, various techniques may be used to
define the area on the pads for receiving the solder balls. One
technique provides a solder ball connection area called a
soldermask defined (SMD) bonding pad. Another technique provides a
solder ball connection area known as a non-soldermask defined
(NSMD) bonding pad.
[0004] FIG. 1 illustrates a soldermask defined bonding pad in
accordance with the prior art. A SMD bonding pad is provided on
both a substrate 12 and on a printed circuit board 22. The SMD
bonding pad on substrate 12 includes a metal bonding pad 14 formed
on substrate 12. Substrate 12 is generally used to interconnect, or
interface a semiconductor die (not shown) with printed circuit
board 22. A soldermask coating 16 is formed over substrate 12 and
covers a portion of bonding pad 14. A portion of the metal bonding
pad 14 is left exposed. A solder ball 24 is then attached to
bonding pad 14. When connecting substrate 12 to printed circuit
board 22, a bonding pad 20 is formed on the surface of printed
circuit board 22. A solder mask 18 is formed over the surface of
printed circuit board 22 and overlaps a portion of bonding pad 20
to form another SMD bonding pad. The openings in the soldermask
coatings 16 and 18 define the area of the bonding pads to which the
solder attaches for making electrical contact between the substrate
12 and printed circuit board 22. Also, the soldermask prevents
liquid solder from flowing over areas where it is not wanted, such
as for example, along a metal trace. In addition, the soldermask
functions to shape the solder ball 24 after it is reflowed.
[0005] FIG. 2 illustrates a non-soldermask defined bonding pad in
accordance with the prior art. An NSMD bonding pad is illustrated
on both a substrate 32 and a printed circuit board 42. The NSMD
bonding pad on substrate 32 includes a metal bonding pad 34. As
described above in connection with FIG. 1, substrate 32 is used to
interconnect, or interface a semiconductor die (not shown) with
printed circuit board 42. A soldermask coating 36 is formed over
substrate 32 and has an opening that does not typically contact or
overlap bonding pad 34. A solder ball 44 is attached to bonding pad
34. Likewise, a bonding pad 40 is formed on the surface of printed
circuit board 42 where it is intended to connect to bonding pad 34.
A solder mask 38 is formed over the surface of printed circuit
board 42 and has openings that do not typically cover or overlap
any of bonding pad 40. The shape and size of the bonding pads
function to determine the shape of the solder ball after solder
reflow.
[0006] SMD bonding pads are known to provide greater reliability in
applications where the printed circuit board is subjected to high
bending loads, such as for example, a cellular telephone that
includes push buttons on the same printed circuit board as the
integrated circuits. However, SMD bonding pads are not known for
providing high reliability in those applications that subject the
printed circuit board to thermal cycling, such as for example, in
an automotive application. In contrast, NSMD bonding pads are known
to provide high reliability in extreme temperature applications,
but not high reliability when subjected to bending loads.
[0007] Therefore, a need exists for a technique to attach a
semiconductor device to a printed circuit board that provides
improved bending reliability as well as improved reliability when
exposed to temperature cycling.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The present invention is illustrated by way of example and
not limited in the accompanying figures, in which like references
indicate similar elements, and in which:
[0009] FIG. 1 illustrates a soldermask defined bonding pad in
accordance with the prior art.
[0010] FIG. 2 illustrates a non-soldermask defined bonding pad in
accordance with the prior art.
[0011] FIG. 3 illustrates a cross-sectional view of a semiconductor
device and printed circuit board in accordance with an embodiment
of the present invention.
[0012] FIG. 4 illustrates a bottom-up view of a portion of the
semiconductor device of FIG. 3.
DESCRIPTION OF A PREFERRED EMBODIMENT
[0013] Generally, the present invention provides a semiconductor
device and a method for attaching the semiconductor device to a
printed circuit board. The semiconductor device includes a
semiconductor die having electronic circuitry that is connected to
a substrate. The substrate is used to interface the semiconductor
die to a printed circuit board. The substrate includes a plurality
of bonding pads arranged as a grid array, for example, Land, Ball,
and Column. A first portion of the plurality of bonding pads are
characterized as soldermask defined (SMD) bonding pads and a second
portion of the plurality of bonding pads are characterized as
non-soldermask defined (NSMD) bonding pads. It has been determined
that the advantages of good thermal cycling reliability and good
bending reliability can be achieved for the same printed circuit
board by including both SMD and NSMD bonding pads on the same
semiconductor device.
[0014] FIG. 3 illustrates a cross-sectional view of a semiconductor
device 50 and printed circuit board 64 in accordance with an
embodiment of the present invention. Semiconductor device 50
includes a semiconductor die 52 that is attached to a substrate 54.
In the illustrated embodiment, semiconductor die 52 is an
integrated circuit fabricated from a silicon wafer. Substrate 54 is
a commonly used substrate for interfacing the semiconductor die 52
with a printed circuit board and is typically formed from an
organic material. Semiconductor die 52 is attached to substrate 54
using one of the commonly known techniques, such as for example,
the C4 (Controlled Collapse Chip Connection) bump process, the E3
(Extended Eutectic Evaporative) bump process, the conductive
adhesive process, or the wire bond process. The method used to
connect semiconductor die 52 to substrate 54 is not important for
purposes of describing the present invention and will not be
described further. After semiconductor die 52 is attached to the
substrate 54, the surface of the substrate and the die are
encapsulated using a common mold compound encapsulation
material.
[0015] SMD bonding pads 56 and NSMD bonding pads 58 are formed on
the other side of substrate 54. The bonding pads are typically laid
out as an array, or matrix, for electrically connecting the
substrate to the printed circuit board. An SMD bonding pad 56
includes a metal bonding pad, typically made from copper. An
insulative coating 62, also known as a soldermask, is deposited on
substrate 54 so that an opening is formed over bonding pad 56. The
opening is smaller than the bonding pad and overlaps a portion of
bonding pad 56. The overlapping portion of soldermask 62 is for
defining a connection area for a solder interconnect and shapes the
solder connection between the substrate and the printed circuit
board.
[0016] NSMD bonding pads 58 include metal bonding pads 58. The
bonding pads are not covered with soldermask 62 and have an exposed
edge. In the NSMD bonding pad technique, the exposed edge of the
bonding pad defines a connection area for a solder
interconnect.
[0017] In the illustrated embodiment, printed circuit board 64 has
a combination of SMD and NSMD bonding pads in locations that
correspond to the bonding pads of semiconductor device 50. As
described above, SMD bonding pads 66 are formed by overlapping a
portion of the metal bonding pads with soldermask 70 so that the
edge of the soldermask openings define the solder ball shape. Also,
NSMD bonding pads 68 are formed by making the soldermask openings
large enough that the metal bonding pads are not covered.
[0018] Solder balls (not shown in FIG. 3) are formed on bonding
pads 56 and 58. To connect semiconductor device 50 to printed
circuit board 64, the solder balls are remelted, or reflow
attached, after placing the solder balls of semiconductor device 50
in contact with the bonding pads of printed circuit board 64.
[0019] Through experimentation, it has been determined that the
best bending reliability and the best thermal cycling reliability
is achieved by using a combination of both SMD and NSMD bonding pad
types to connect a substrate to a printed circuit board as
illustrated in FIG. 3. In the illustrated embodiment, SMD bonding
pads are used around the outer edge of the substrate because these
are the pad locations that have been found to be more likely to
break when subjected to bending stress. Likewise, NSMD bonding pads
are used for the interior locations of the substrate, as
illustrated in FIG. 3, because these are the pad locations more
likely to fail under thermal cycling. Note that in the illustrated
embodiment, the outer three rows of bonding pads are SMD, but in
other embodiments, a different number of outer rows may be SMD.
Also, the actual locations for the SMD and NSMD bonding pads may be
different depending on a number of variables such as die size,
number of bonding pads, solder ball volume, substrate thickness,
encapsulation thickness, etc. Also, in other embodiments, a
different combination of SMD and NSMD bonding pads may be used to
provide improved thermal cycling and bending reliability. As an
example, a combination of SMD and NSMD bonding pads may be used on
the substrate, while the printed circuit board has one only one of
either SMD or NSMD bonding pads. In addition, in another
embodiment, the SMD and NSMD combination may be used on the printed
circuit board but not on the substrate and still be within the
scope of the invention.
[0020] FIG. 4 illustrates a bottom-up view of a portion 80 of
semiconductor device 50 of FIG. 3. The cross-hatching over portion
80 is soldermask 62. The left side of portion 80 is an edge of
substrate 54. As can be seen in FIG. 4, SMD bonding pads 56 are
formed by making openings in soldermask 62 that are smaller than
the metal bonding pads. As discussed above, the shape of the solder
ball after melting and connecting to the printed circuit board is
largely determined by soldermask 62. The NSMD bonding pads 58 are
formed by making openings in soldermask 62 that are larger than the
bonding pad. The shape of the solder connection is determined by
the edge of the metal pad and not by the soldermask. Note that in
the illustrated embodiment, the metal pads of NSMD bonding pads 58
are slightly larger than the metal pads of SMD bonding pads 56.
Also, note that for illustration purposes, traces are provided
between adjacent bonding pads. In other embodiments, the routing of
traces and the presence of vias (not shown) is determined by the
particular application.
[0021] While the invention has been described in the context of a
preferred embodiment, it will be apparent to those skilled in the
art that the present invention may be modified in numerous ways and
may assume many embodiments other than that specifically set out
and described above. For example, in the illustrated embodiment,
the bonding pads have a circular shape. In other embodiments, the
bonding pads may have a square, rectangular, or other shape.
Accordingly, it is intended by the appended claims to cover all
modifications of the invention which fall within the true scope of
the invention.
* * * * *