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Patent applications and USPTO patent grants for Koschmieder; Thomas H..The latest application filed is for "semiconductor device attached to an exposed pad".
Patent | Date |
---|---|
Semiconductor device attached to an exposed pad Grant 10,217,713 - Chopin , et al. Feb | 2019-02-26 |
Semiconductor Device Attached To An Exposed Pad App 20170098618 - CHOPIN; Sheila F. ;   et al. | 2017-04-06 |
Integrated circuit carrier coating Grant 9,431,313 - Mathew , et al. August 30, 2 | 2016-08-30 |
Integrated Circuit Carrier Coating App 20160247738 - MATHEW; VARUGHESE ;   et al. | 2016-08-25 |
Semiconductor Device Attached To An Exposed Pad App 20160071787 - CHOPIN; SHEILA F. ;   et al. | 2016-03-10 |
Package Substrate With Improved Reliability App 20160064316 - Carpenter; Burton J. ;   et al. | 2016-03-03 |
Mold Locks For Laminate Substrates App 20150091196 - Koschmieder; Thomas H. | 2015-04-02 |
Semiconductor Device Packages Providing Enhanced Exposed Toe Fillets App 20140151865 - Koschmieder; Thomas H. | 2014-06-05 |
Multiple layer strain gauge Grant 7,938,016 - Koschmieder May 10, 2 | 2011-05-10 |
Multiple Layer Strain Gauge App 20100236334 - Koschmieder; Thomas H. | 2010-09-23 |
Lead solder indicator and method Grant 7,074,627 - Burnette , et al. July 11, 2 | 2006-07-11 |
Semiconductor package having angulated interconnect surfaces Grant 7,067,907 - Koschmieder , et al. June 27, 2 | 2006-06-27 |
Lead solder indicator and method App 20050285274 - Burnette, Terry E. ;   et al. | 2005-12-29 |
Semiconductor package having angulated interconnect surfaces App 20040188812 - Koschmieder, Thomas H. ;   et al. | 2004-09-30 |
Semiconductor device having a ball grid array and method therefor App 20030102535 - Burnette, Terry E. ;   et al. | 2003-06-05 |
Semiconductor device having a ball grid array and method therefor Grant 6,552,436 - Burnette , et al. April 22, 2 | 2003-04-22 |
Semiconductor device having a ball grid array and method therefor App 20020070451 - Burnette, Terry E. ;   et al. | 2002-06-13 |
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