U.S. patent application number 10/126586 was filed with the patent office on 2003-02-20 for carrier for a module integrated circuit handler.
This patent application is currently assigned to MIRAE CORPORATION. Invention is credited to Kim, Hee Soo, Kim, Jong Won, Lee, Dong Chun, Lee, Sang Soo, Lee, Wan Gu, Oh, Young Hak.
Application Number | 20030033711 10/126586 |
Document ID | / |
Family ID | 27555127 |
Filed Date | 2003-02-20 |
United States Patent
Application |
20030033711 |
Kind Code |
A1 |
Lee, Sang Soo ; et
al. |
February 20, 2003 |
Carrier for a module integrated circuit handler
Abstract
A chamber for a module IC handler is disclosed which consists of
a pre-heater for suitably heating a carrier containing a plurality
of module IC at a preset temperature (which may be generated at the
driving of the module IC) before the tests for the module IC are
performed, and a test site for performing the tests with a external
tester while pushing the carrier by using the pusher. The chamber
consists of: a seating piece on which plural seating grooves are
formed that place the carrier containing the module ICs thereon; a
driving piece which is retractable and movable upward/downward, and
on which a seating groove having the same spacing as that of the
seating groove formed in the seating piece is formed; driving piece
ascending/descending means for elevating/lowering the driving piece
above a top surface of the seating piece relative to a top surface
of the driving piece; driving piece advancing/retracting means for
advancing/retracing the driving piece by one pitch corresponding to
a spacing between the seating grooves formed in the seating piece;
and transferring means for holding and transferring the carrier,
which has the module IC heated in accordance with the tests
conditions, positioned on a transfer path of the test site toward
the test site.
Inventors: |
Lee, Sang Soo;
(Choongchungnam-do, KR) ; Lee, Wan Gu;
(Choongchungnam-do, KR) ; Kim, Jong Won;
(Kyungki-do, KR) ; Kim, Hee Soo; (Kyungki-do,
KR) ; Oh, Young Hak; (Kyungki-do, KR) ; Lee,
Dong Chun; (Seoul, KR) |
Correspondence
Address: |
FLESHNER & KIM, LLP
P.O. Box 221200
Chantilly
VA
20153-1200
US
|
Assignee: |
MIRAE CORPORATION
|
Family ID: |
27555127 |
Appl. No.: |
10/126586 |
Filed: |
April 22, 2002 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
10126586 |
Apr 22, 2002 |
|
|
|
09428477 |
Oct 28, 1999 |
|
|
|
6425178 |
|
|
|
|
Current U.S.
Class: |
29/760 ;
29/740 |
Current CPC
Class: |
G01R 31/2893 20130101;
Y10T 29/53174 20150115; G01R 31/2851 20130101; G01R 1/04 20130101;
Y10T 29/5313 20150115; Y10T 29/53178 20150115; G01R 31/2867
20130101; Y10T 29/53261 20150115; Y10T 29/53265 20150115 |
Class at
Publication: |
29/760 ;
29/740 |
International
Class: |
B23P 019/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 31, 1998 |
KR |
1998-46603 |
Oct 31, 1998 |
KR |
1998-46604 |
Nov 2, 1998 |
KR |
1998-46778 |
Nov 4, 1998 |
KR |
1998-47191 |
Nov 9, 1998 |
KR |
1998-47859 |
Nov 9, 1998 |
KR |
1998-47860 |
Claims
What is claimed is:
1. A carrier for a module IC (Integrated Circuit) handler, the
carrier comprising: a housing; a pair of installation elements
installed parallel to each other in a receiving space of the
housing, and having a guide groove; a plurality of rotators
elastically installed in the installation elements, and for
supporting the module IC by retractable actions thereof; and an
elastic member giving a restoring force to the rotator.
2. The carrier as defined in claim 1, wherein the housing comprises
a plurality of fastening holes for adjusting an installation
spacings between the installation elements at place selected.
3. The carrier as defined in claim 1, wherein the rotator is
coupled to a bracket having a protrusion rod into which a elastic
member is inserted and which is coupled to an insertion hole, the
rod also having an end portion to which an E-ring is coupled to
support the rod.
4. The carrier as defined in any one of claims 1 and 2, wherein the
rotator is provided with a V-groove formed along a circumferential
surface thereof.
5. A carrier for a module IC handler, the carrier comprising: a
housing; a pair of guiders disposed at both sides of the housing; a
plurality of supporting members installed between the guiders, and
to which the module IC is seated by inserting both ends of the
module IC thereto; a pressing member installed at a predetermined
place of the supporting member, for pressing a top of the module IC
loaded into the supporting member; and opening/closing means for
opening/closing an seating groove formed in the supporting member,
when the module IC is loaded or unloaded.
6. The carrier as defined in claim 5, wherein the housing comprises
at predetermined paces thereof a plurality of holes for fixing the
guiders, the holes being configured to fasten a fixing screw
thereto.
7. The carrier as defined in claim 5, wherein the opening/closing
means comprises: a pair of guiders provided, respectively, in both
right and left sides of the housing, and having a cam surface and a
hitching jaw; guide bar having one side thereof positioned at the
cam surface of the guider and the other side thereof positioned at
the hitching jaw; a pair of connection bars crossing both the guide
bars, for rotating the pressing member; an opener fixed at both
ends of the connection bars, and which is moved upward/downward by
a pusher; a guide rod for guiding the ascending or descending
motion of the opener; and an elastic member for restoring the
opener when external force is not applied thereto.
8. The carrier as defined in claim 5, further comprising spacing
adjustment means consisting of: a locking member elastically,
movably upward/downward installed in the guiders, and having a
plurality of locking pins formed at a bottom surface thereof; a
plurality of supporting members inserted into the locking pins
formed at a bottom surface of the locking member, for maintaining a
constant interval; and a pair of horizontal guide rod, ends of
which is fixed at the guiders through a vertical long hole of the
locking member, for guiding a horizontal movement of the supporting
member.
9. The carrier as defined in claim 8, wherein the supporting member
comprises a seating groove fitted into a floating preventing groove
of the pressing member, and an insertion hole into which the module
IC is fitted.
10. A carrier for a module IC handler, the carrier comprising: a
housing; a pair of installation elements installed parallel to each
other for forming opposing insertion grooves at an equidistance
therebetween in the housing, and adapted to adjust an installation
spacing thereof; and a supporting member, both ends of which are
supported so that a supporting portion is exposed to the
installation element, wherein a predetermined spacing of the
supporting member is made narrower than the thickness of the module
IC so that said narrow portion can be widened by an elastic force
itself to hold both sides of the module IC at the time of loading
of the module IC.
11. The carrier as defined in claim 10, wherein the installation
element is at a predetermined place thereof provided with an
insertion groove having a receiving spaces at both sides thereof
and a drop preventing groove at a lower part thereof by which a
neck portion of the supporting member is hitched.
12. The carrier as defined in claim 10, wherein the supporting
member consists of: a supporting portion for holding both sides of
the module IC 1; a wound portion having insertion holes formed at
both ends thereof; and a connecting portion for connecting the
wound portion and the supporting portion.
13. The carrier as defined in claim 10, wherein a sectional
configuration of the supporting member is selected from any one of
springs whose sections are circular and a plate.
14. A carrier for a module IC handler, the carrier comprising: a
housing; a pair of supporting blocks installed oppositely to each
other at both sides of a housing; an installation element fixed
between the supporting blocks, and having positioning grooves at
opposing side thereof disposed at an equidistance; an
ascending/descending member installed movably upward/downward at
the supporting block, and having a slant long hole therein; a
connection member both ends of which are inserted into the slant
hole of the ascending/descending member, and which is retractable
in response to the ascending/descending motion of the member; a
plurality of supporting member inserted into the connection member,
having one side positioned in the positioning groove of the
installation element and the other side having a seating groove and
a seating surface for receiving the module IC; and an elastic
member installed between the installation element and the
connection member, for returning the connection member to an
initial state when external force is not applied to the
ascending/descending member.
15. The handler as defined in claim 14, wherein the installation
element has predetermined places into which a plurality of pins are
inserted, one end of the pin being supported by E-ring by exposing
said one end of the pin to an outside of each connection member,
and wherein the elastic member is inserted in an outer peripheral
surface of the pin disposed between the installation element and
the connection member.
16. The handler as defined in claim 15, wherein the coupling of the
pin into the installation element is made by the screwing which
allows the clamping force of the pin to be adjusted to vary an
elastic force of the elastic member.
17. The handler as defined in claim 14, wherein the installation
element is provided with a horizontal long hole in the housing so
that an installation spacing of the installation element can be
adjusted, and is fixed by a fixed screw for fastening the
installation element through said long hole.
18. A carrier for a module IC handler, the carrier comprising: a
housing configured as a rectangular frame fashion; a pair of
supporting blocks installed at both sides of the housing; at least
one or more guide bars fixed between the supporting blocks 113; a
plurality of opposing holding member inserted oppositely into said
guide bar, for holding both ends of the module IC; and spacing
adjustment means for adjusting the spacing of the holding member
based on associated loading or unloading position of the module
IC.
19. The carrier as defined in claim 18, wherein the holding member
consists of: a body having a seating surface and a seating surface
into which end portion of the module IC is inserted; an
ascending/descending member installed in the body to be moved
upward/downward; a pressing piece installed on an upper portion of
the body to be rotated, and having a cam surface formed in at least
one side thereof for pressing a top of the module IC; an elastic
member installed on an outer peripheral surface of the
ascending/descending member, and for restoring the
ascending/descending member to which the pressing piece is
installed, when an external force is not applied to the
ascending/descending member; and a stopper installed on the upper
portion of the body, for rotating the pressing piece by suppressing
the raising of the pressing piece.
20. The carrier as defined in claim 19, wherein the pressing piece
has protrusion pieces formed at both sided thereof, and a
supporting groove encompassing a supporting groove formed in a
bottom surface of the pressing piece.
21. The carrier as defined in claim 19, wherein the spacing
adjustment means comprises: a plurality of holding members having a
pair of upper and lower protrusions formed on a rear surface
thereof; a plurality of links, ends of which have long holes, for
causing simultaneous moving of the holding members, wherein the
link connects in a diagonal direction any one holding member and
another holding member adjacent to said one holding member by
inserting the protrusion of each of holding members into the long
holes of said link into; and elastic member connected between a
hinge axis of the link and the protrusion of the holding member,
and for maximizing the spacing between the holding means and the
means adjacent thereto by pushing outward each holding means, when
an external force is not applied.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a carrier for a module IC
handler, and more particularly to a carrier for a module IC handler
used to transfer the carrier holding a plurality of module ICs
between the processes.
[0003] 2. Description of the Conventional Art
[0004] Typically, a module IC 1 refers to, as shown in FIG. 1, a
standalone structure provided with a substrate 2 whose one side or
both sides thereof is used for fixedly mounting a plurality of ICs
1 and electric components 2, for example, by soldering, and has a
function for extending a capacity when it is coupled to a mother
substrate. In FIG. 1, reference numeral la denotes a pattern.
[0005] For the prior process for manufacturing a module IC, since
there has been no an apparatus for automatically loading the module
IC into a test socket, testing the same, automatically classifying
into respective categories depending upon the test results and then
unloading the classified modules into the customer trays (not
shown), the operator manually has to pick up one piece of the
module IC from the test tray in which the module ICs are contained
therein, load it into a test socket, conducts the tests for a time
period preset, and finally classify the module IC depending upon
the test results in order to put it into the customer tray. This
results in lower productivity due to manual work.
[0006] In the meantime, referring to FIGS. 1 and 2 illustrating a
handler developed by the inventors, the constitution thereof will
be described below.
[0007] As shown in FIG. 2, fingers 4 remain fully opened which will
hold both ends of the module IC, when well-known picking-up means 3
is transferred toward a tray so as to hold one module IC contained
in the tray.
[0008] When the transferring of picking-up means 3 to a tray side
is completed under the state that the fingers 3 are opened, the
fingers 4 are moved to a position over the module IC and then moved
downward. At this time, a finger cylinder 5 is driven to inwardly
move the fingers, which in turn hold the module IC 1 in the
tray.
[0009] After holding the module IC 1 contained in the tray, the
picking-up means 3 is moved to a test site in which a test socket 6
is located, places the held module IC 1 on a position over the test
socket 6 and then is again moved to the tray side in order to hold
another new module IC.
[0010] With repetitions of the above-mentioned operations, if all
the module ICs to be tested are loaded into a plurality of test
sockets 6 disposed at the test site, a main cylinder 7 and a poking
cylinder 8 are in turn sequentially driven to lower a pusher 9,
during which the pusher 9 presses a top surface of the module IC 1
placed on the test tray 6. Thus, patterns la of the module IC 1 can
be electrically coupled to terminals of the test socket 6.
Therefore, it becomes possible to conduct the performance tests for
the module IC.
[0011] In the meantime, when the tests for the module ICs are
finished, a discharging cylinder 10 is driven to rotate a
discharging lever 11 to pull out the module IC 1 inserted into the
test socket 6, and then another picking-up means disposed at an
unloading side holds the test-finished module IC 1 to unload it
into a customer tray depending upon the test results.
[0012] However, because the module IC 1 is transferred to the test
socket 6 by the conventional picking-up means, the following
problems occur.
[0013] Firstly, since the picking-up means designed to hold the
module IC and load/unload it into/from the test socket cannot be
used to handle the module IC in a sealed chamber, there is a
problem that the module IC is tested at a normal temperature.
However, because the module IC is actually driven at a higher
temperature, there occurs a difference between conditions at the
test and at an actual use of the IC, thus resulting in lower
reliability of the product discharged.
[0014] Secondly, since the module ICs in the tray and in the test
socket are held and transferred by the picking-up means, the
transfer of the module IC cannot be made during the tests. An
elongated cycle time is introduced, by which lots of module ICs
cannot be tested during a time interval given.
SUMMARY OF THE INVENTION
[0015] Therefore, it is an object of the present invention to
provide a carrier for a module IC handler being capable improving
reliability of the discharged product by conducting performance
tests at a constant temperature for the module IC manufactured.
[0016] It is another object of the present invention to a carrier
for a module IC handler being capable maximizing availability of a
high-cost apparatus by using picking-up means which performs only
the loading/unloading of module ICs contained in a tray into/from a
carrier, and by transferring the carrier holding a plurality of
module ICs therein between the processes.
[0017] To accomplish the above objects, a carrier for a module IC
handler according to the present invention is provided, the carrier
comprising: a housing; a pair of installation elements installed
parallel to each other in a receiving space of the housing, and
having a guide groove; a plurality of rotators elastically
installed in the installation elements, and for supporting the
module IC by retractable actions thereof; and an elastic member
giving a restoring force to the rotator.
[0018] To accomplish another object of the present invention, a
carrier for a module IC handler according to the present invention
is provided, the carrier comprising: a housing; a pair of guides
disposed at both sides of the housing; a plurality of supporting
members installed between the guides, and to which the module IC is
seated by inserting both ends of the module IC thereto; a pressing
member installed at a predetermined place of the supporting member,
for pressing a top of the module IC loaded into the supporting
member; and opening/closing means for opening/closing a seating
groove formed in the supporting member, when the module IC is
loaded or unloaded.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] FIG. 1 is a perspective view of a conventional module
IC.
[0020] FIG. 2 illustrates the state that, for the conventional
module IC handler, a module IC picking-up means holds the module IC
to load it in a test socket of a test site.
[0021] FIG. 3 illustrates the state that, the conventional module
IC handler, the insertion of the module IC into the test socket is
completed.
[0022] FIG. 4 illustrates a carrier for a module IC handler
according to a first embodiment of the present invention.
[0023] FIG. 5 is a sectional view taken along line A-A in FIG.
4.
[0024] FIG. 6 is an exploded perspective view of the portion "B" in
FIG. 5.
[0025] FIG. 7 is a vertical sectional view showing the combining
state of FIG. 6.
[0026] FIG. 8 illustrates a carrier for a module IC handler
according to a second embodiment of the present invention.
[0027] FIG. 9 is a bottom perspective view of the state that the
module IC is inserted into a supporting member.
[0028] FIG. 10 is a perspective view of a guider.
[0029] FIG. 11 is a perspective view of a supporting member
[0030] FIG. 12 is a view showing the state that a pressing member
closely comes into contact with a locking member to thereby close a
seating groove of the supporting member.
[0031] FIG. 13a is a view showing the state that a locking pin of
the locking member is inserted into an insertion hole of the
supporting member.
[0032] FIG. 13b is a view showing the state that the locking member
is elevated to adjust a spacing between the supporting members.
[0033] FIG. 14 illustrates a carrier for a module IC handler
according to a third embodiment of the present invention.
[0034] FIG. 15 is an enlarged bottom perspective view showing the
portion "A" in FIG. 14.
[0035] FIG. 16a is a view showing the state before the module IC
held by the picking-up means is inserted.
[0036] FIG. 16b is a view showing the state that by inserting the
module IC, the supporting member is opened wide to hold both side
surfaces of the module IC therebetween.
[0037] FIG. 17 is a perspective view showing another embodiment of
the supporting member to which the present invention is
applied.
[0038] FIG. 18 is a perspective view showing main parts when the
FIG. 17 supporting member is applied.
[0039] FIGS. 19a and 19b show the supporting member structured by a
plate-spring.
[0040] FIG. 20 is a perspective view showing another embodiment of
the supporting member as a main part of the present invention.
[0041] FIG. 21 is a perspective view showing main portions when the
FIG. 20 supporting member is applied.
[0042] FIG. 22 illustrates a carrier for a module IC handler
according to a fourth embodiment of the present invention.
[0043] FIG. 23 is an exploded perspective view of the portion "A"
in FIG. 22 as a main part of the present invention.
[0044] FIG. 24a is a view showing the state that the supporting
member is opened wide according to the elevation of the
ascending/descending member by a pusher.
[0045] FIG. 24b is a view showing the state that both sides of the
module IC are held by the supporting member by the restoring of the
supporting member.
[0046] FIG. 25 is a vertical sectional view showing another
embodiment in which the supporting member is installed in an
installation element.
[0047] FIG. 26 illustrates a carrier for a module IC handler
according to a fifth embodiment of the present invention.
[0048] FIG. 27 is an exploded perspective view of a holding member
as a main part of the present invention.
[0049] FIG. 28 is an exploded, vertical sectional view of the
holding member shown in FIG. 27.
[0050] FIG. 29 is a view of spacing adjustment means as a main part
of the present invention.
[0051] FIG. 30a is a view showing the state that a pressing piece
is rotated by the elevation of the pusher.
[0052] FIG. 30b is a view showing the state that by the descending
operation of the pusher, the pressing piece holds the module IC
inserted into an insertion groove of a housing.
DETAILED DESCRIPTION OF THE INVENTION
[0053] Referring to the accompanying drawings, a carrier for a
module IC handler according to various embodiments of the present
invention will be described in detail.
[0054] At first, a carrier for a module IC handler according to a
first embodiment of the present invention will be explained below,
with reference to FIG. 7.
[0055] The carrier for the module IC handler, as shown in FIGS. 4
to 6, is provided with a pair of installation elements 14 each
element being spaced apart at an equidistance therebetween, wherein
the parallel elements 14 are disposed in a receiving space 13 of a
housing 12 configured like a rectangular frame. Further, the
housing 12 has a plurality of fastening holes 12a formed at both
right and left sides thereof, and to which fixing screws 15 are
selectively screwed through the through-holes 14a formed in the
installation elements 14, so that a spacing between the
installation elements 14 may be adjusted depending on a
longitudinal width L of the module IC 1. Thus, a single one carrier
can cover the handling of various kinds of module ICs each having
different size.
[0056] A plurality of rotators 16 elastically provided,
respectively, in the installation elements 14 are used to support
both ends of the module ICs 1, which each rotator is retractable by
the aid of an elastic member 17.
[0057] To endow the rotator 16 with a retractable function in the
installation element 14, as shown in FIGS. 6 and 7, the rotator 16
is axially coupled to a bracket 18 having a protrusion rod 18a into
which the elastic member 17 is inserted and which is coupled to an
insertion hole 14b of the installation element 14. The rod 18a also
has an end portion to which an E-ring 20 is coupled to support the
rod.
[0058] Each rotator 16 is provided with a V-groove 16a formed along
a circumferential surface thereof, like a configuration of V-belt
pulley. The installation element 14 also has a guide groove 21
immediately below which the rotator is disposed.
[0059] The V-shaped circumferential surface of the rotator 16 is
provided for safely maintaining the module ICs inserted between the
rotators, without the module IC being floated left and right,
during the transferring of the carrier. Moreover, The provision of
the guide groove 21 in the installation element 14 accurately
places the module IC 1 into the V-groove 16a of the rotator.
[0060] The operation of a first embodiment of the present invention
will be described.
[0061] Referring to FIG. 5, the bracket 18 is fully, forwardly
projected from the installation element 14 by the elastic member
17, when the module IC is not yet loaded between the rotators 16
provided in the respective installation elements 14. Therefore,
under such a condition, a distance S between the rotators is
narrower than the longitudinal width L of the module IC. After the
conventional picking-up means hold the plural module ICs 1 from the
tray and then transfer them to position over the carrier, the
module ICs 1 are moved downward from the position determined by the
guide groove 21 formed at the installation element 14.
[0062] With the positioning of the module IC held by the picking-up
means determined, when the module IC is moved downward toward the
rotator 16, the bottom surface of the module IC 1 meets an inner
surface of the V groove 16a, due to wider width L of the module IC
1 than the distance S between the opposing rotators 16. As the
descending operation of the module IC 1 held by the picking-up
means continues, the rotators 16, which is coupled to the bracket
18 to be rotated, then respectively rotate and are retracted
backward to thereby compress the elastic member 17.
[0063] As described above, the rotators 16 retracted backward by
both ends of the module IC 1 firmly support both ends of the module
ICs by a restoring force of the elastic member 17 which tends to
return to its initial state.
[0064] When the picking-up means holding the module IC 1 reaches
its associated bottom dead point, the holding state for the module
IC 1 is released, and then the picking-up means is again elevated.
At this time, the module ICs 1 both ends of which are supported by
the respective rotators 16 maintains their loaded state between the
rotators 16 by the aid of the restoring force of the elastic member
17.
[0065] After the module IC meets the V grooves of the rotators and
is loaded therein by the picking-up means, separate transferring
means moves the carrier to the inside of the sealed chamber (not
shown) in which the module ICs are heated at a temperature suitably
selected for the tests and the tests for the module ICs are
conduced.
[0066] In the meantime, after the tests are finished and then the
carrier arrives at an unloading side for the module ICs, another
picking-up means disposed at the unloading side lowers to hold the
module IC 1 supported between the rotators 16.
[0067] When said another picking-up means holding the module IC
lifts, the rotator 16 rotates by a frictional force between the
rotator and the module IC, thereby minimizing the frictional
resistance at their contact surface. With the continued ascending
operation of the picking-up means, the module IC 1 exits from the
rotators, at this time, the bracket coupled to the rotators in turn
returns to its initial state by the restoring force of the elastic
member 17, as shown in FIG. 5. Therefore, at the loading side, it
is possible to load a new module IC into the carrier.
[0068] Although the module ICs to be tested have different
longitudinal widths L, respectively, the carrier for the module IC
handler according to the present invention makes it possible the
adjustment of the corresponding width suitable for loading the
module IC in the housing. Accordingly, the handling of various
kinds of the module ICs is made possible only by one carrier. In
other words, depending upon the longitudinal widths L of the module
IC to be tested, the distance between the pair of installation
elements 14 is defined by appropriately selecting suitable pair
among the fastening holes pairs 12a, aligning the selected pair
with the through-holes 14a, and fastening the fixing screw 15
thereto.
[0069] Next, a second embodiment according to the present invention
will be explained below.
[0070] According to the second embodiment of the present invention,
a carrier for a module IC handler, as shown in FIGS. 8 to 11,
comprises a housing 32 configured like a rectangular frame, having
two sides to which a pair of opposing guiders 33, 34 are disposed.
Between the guiders 33(34), there is provided a pressing member 36
for opening/closing a module seating groove 35a which is formed on
a plurality of supporting members 35 and which both ends of the
module IC are inserted into and seated therein, the pressing member
36 opening or closing the module seating groove 35a by changing the
position thereof by opening/closing means.
[0071] The opening/closing means for changing the position of the
pressing member 36 when the module is loaded or unloaded may
consist of:
[0072] the pair of guiders 33, 34 provided, respectively, in both
right and left sides of the housing 32, each guider being disposed
oppositely to each other and having an inner surface looking at
each other on which a cam surface 33a(34a) is formed, and an outer
surface on which a hitching jaw 33b(34b) is formed;
[0073] guide bar 37(38) outwardly projected from both ends of the
pressing member 36 and having one side thereof positioned at the
cam surface 33a(33b) of the guider and the other side thereof
positioned at the hitching jaw 33b(34b);
[0074] a pair of connection bars 39 crossing both the guide bars
37, 38, consisting of the guide bar 37 fixed at an inner side and
positioned therebetween and another guide bar 38 fixed at an outer
side and positioned below the bars, the connection bars 39
functioning to rotate the pressing member 36 during elevation
thereof;
[0075] an opener 41 fixed at both ends of the connection bar 39,
and which ascends or descends by a pusher 40;
[0076] a guide rod 42 for guiding the ascending or descending
motion of the opener 41; and
[0077] an elastic member 43 for restoring the opener 41 when
external force is not applied thereto.
[0078] When the pressing members 36 rotate in opposing directions
to each other by the pressing operation of the opener 41, the
module seating groove 35a of the supporting member 35 is opened and
the known picking-up means can thus load the module IC to be tested
into the module seating groove 35a of the supporting member 35, or
unload the test-finished module IC 1.
[0079] FIG. 10 illustrates the details of the guiders 33, 34 of the
opening/closing means. The above structure of the opening/closing
means is not limited thereto, but modifications thereof will be
possible which fall within a scope of the present invention.
Namely, alternatively, the module seating groove 15a of the
supporting member 15 can be also opened, by installing the pressing
member 36 in the guiders 33, 34 such that the member 36 is
horizontally moved so that the pressing member 36 can be slid right
or left by the pusher (not shown) having a slant surface, at the
loading or unloading of the module ICs. However, in this case,
inconvenience may occur that the pressing member 36 should be
exchanged whenever the module IC having different size in height is
to be tested.
[0080] The housing 32 has further a plurality of guider fixing
holes 32a used for fixing the guiders which have fastening holes
33c, 34c. The guiders 83, 34 are fixed by the fixing screw 34
through the guider fixing holes 32a, after the arrangement position
of the guiders 33, 34 is determined depending on the longitudinal
width L of the module IC to be tested. In other words, in the case
where the short width L of the module IC to be tested is given, the
narrowed spacing between two guides 33, 34 is used, whereas in case
of longer width L of the IC, the wider spacing is used. Therefore,
any lengths of the module IC can be adopted in the use of a single
one carrier, thus it is possible to handle various lengths of the
module ICs.
[0081] Although the supporting members 35 for holding the module
ICs may be installed such that the spacing between the guiders 33
and 34 is not adjusted, it is desirable to employ spacing
adjustment means for the supporting member 35 so that the spacing
of the supporting member 35 can be adjusted in accordance with the
spacing of the test socket. To this end, according to the second
embodiment of the present invention, there is provided the
receiving spaces 33d, 34d formed by a bottom surface in which a
plurality of locking pins 45a are formed at an equidistance
therebetween, and by a side surface in which a locking member 45
having a vertical long hole 45b formed therein is installed to be
elevated or lowered by the elastic member 46. To a pair of
horizontal guide rod 47, ends of which is fixed at the guides 33,
34 through the vertical long hold 45b of the locking member 45, is
coupled a plurality of supporting members 35 for maintaining a
constant interval, by inserting the locking pins 45a formed at a
bottom surface of the locking member 45 into an insertion hole
35c.
[0082] At the state in which external force is not applied to the
opener 41, since the top surface of the locking member 45 is
configured such that the pressing member 36 is connected thereto by
the restoring force supplied from the elastic member 43, one side
of the pressing member closes the module seating groove 35a.
[0083] As shown in FIGS. 7 and 13b, the supporting member 35 has a
positioning hole 35a formed at the bottom surface thereof and the
insertion hole formed at the top surface thereof. Further, an
extension portion 36a of the pressing member 36, which is an upper
part of the module seating groove 35a formed in the supporting
member 35, has a floating preventing groove 36b for preventing the
held module IC 1 from being floated during the transferring thereof
between the processes. Immediately before the module IC held in the
carrier is inserted into the test socket, to the positioning hole
36b is inserted extra positioning pin 48 to re-position the test
socket with respect to the position of the supporting member 35,
which thereby allows the module IC held in the supporting member 35
to be accurately inserted into the test socket.
[0084] The operation of the carrier for the module IC handler
according to the second embodiment of the present invention will be
explained below.
[0085] Under the state that the housing 32 is horizontally
maintained, the extension portion 36 closes the module seating
groove 35a of the supporting member 35, when the carrier is
transferred by separate transferring means (not shown) to the
loading side for loading the module IC 1 to be tested, the pusher
40 elevates upward from the bottom surface of the housing 32 and
pushes the opener 41. Then, the opener 41 inserted into the guide
rod 42 starts to compress the elastic member 43 during the
elevation.
[0086] The elevation of the opener 41 introduces an elevation of
the pressing member 36 due to the construction that the opener 41
is connected to the connection bar 39 into which in turn the guide
bars 37, 38 fixed to the pressing member 36 is inserted.
[0087] However, since among the guide bars 37, 38 fixed to the
pressing member 36, the guide bar 37 fixed in an inner side is
inserted between the connection bars 39, and the guide bar 37 fixed
an outer side abuts against the bottom surface of the connection
bar 39 positioned at a lower side, the guide bars 37, 38 at the
condition that the guide bars 37, 38 are connected to both sides of
the guides 33, 34 ascend, as the opener 41 elevates.
[0088] During the elevation of the guide bars 37, 38, when the
connection bar 39 continues to ascend under the condition that one
guide bar 38 stops to elevate by the hitching jaw 33b, 34b formed
at the guiders 33, 34, the guide bar 37 fixed at the extension
portion 36a moves along the cam surface of the guiders 33, 35.
Therefore, the pressing members 36 rotate in opposing directions to
each other, which opens the module seating groove 35a of the
supporting member 35.
[0089] By the operation described above, if the module seating
groove 35a is opened, the prior pricking-up means holds the
plurality of the module ICs contained in the tray to load them into
the module seating groove 35a of the supporting member 35.
[0090] After the module ICs held by the picking-up means are loaded
into the module seating groove 35a of the supporting member 35, the
pressing member 36 returns to its initial state, as shown in FIG.
12, which operation is needed for the module IC seated in the
module seating groove 35a not to be dropped from the supporting
member 35 during the transferring of the carrier between the
processes.
[0091] The pusher 40 having been used to elevate the opener 41
lowers by a restoring force of the elastic member 43, and the
connection bar 39 fixed to the opener 41 also descends,
accordingly.
[0092] With the descending operation of the connection bar 39, the
pressing member 36, which was elevated and rotated by the
connection bar 39, is also lowered and returns to a horizontal
state thereof, which the returning to an initial state of the
pressing member 36 is possible by the connection bar 39 pressing
the guide bar 37.
[0093] If the pressing member 36 returns to its initial state, the
top surface of the module IC inserted into the supporting member 35
is pressed by the extension portion 36a formed in the pressing
member 36 and having the floating preventing groove 36b into which
each the module IC seated in the module seating groove 15a is in
turn inserted and thereby the module ICs are not floated during the
transferring between the processes.
[0094] FIGS. 13a and 13b are sectional views taken along line A-A
in FIG. 8. Referring to these drawings, the operation for adjusting
the spacing of the supporting member 35 supported to the locking
member 45, the adjustment being based on the spacing of the test
socket installed at the test site, will be explained below.
[0095] At the state that external force is not applied to the
locking member 45 as shown in FIG. 13a, a force applied from the
elastic member 46 to the locking member will move downward the
locking member, and therefore the condition is maintained that the
locking pin 45a formed in the locking member is inserted to the
insertion hole formed in the supporting member 35. Thus, the
position of the supporting member 35 remains unchanged.
[0096] In order to adjust the spacing of the supporting member 35
as required, the locking pin 45a formed at the bottom surface of
the locking member 45 exits from the insertion hole 35c of the
supporting member 35, which enables the adjustment of the spacing
by horizontally moving the supporting member 35 inserted to the
horizontal guide rod 47.
[0097] While the locking member 45 elevates up to a constant
vertical position during which the locking member 34 compresses the
elastic member 26, the position of the supporting member 35
inserted to the guide rod 47 remains unchanged and the locking pin
45a can completely exit from the insertion hole 35c of the
supporting member 35, whereby such an adjustment is possible. The
position of the supporting member 35 is changed by the equidistance
to adjust the spacing such that the insertion hole 35c is aligned
with the locking pin 25a. At this time, by the removal of the
external force applied to the locking member 45, the locking member
45 returns to an initial state thereof by the restoring force of
the elastic member 46, and, as shown in FIG. 13a, each of the
locking pins 45a formed in the bottom surface is inserted into the
insertion hole 35c. In consequence, the position of the supporting
member 35 is unchanged. Thus, although the installation spacings
for the test socket are varied, the module IC 1 can be handled
without exchanging the carrier.
[0098] Moreover, in case the module IC having a different size in
length is to be tested instead of testing the module IC of a
constant length, the tests can be conducted by changing the
position of the guides 33, 34 having been fixed to the housing 32
through the fixing screw 44, based upon the length of the module
IC. In case of the module IC having a different size in height T,
the position of the pressing member 36 pressing the top surface of
the module IC is automatically varied to compensate with respect to
the height, thus allowing the handling of the various sized module
ICs.
[0099] Next, a third embodiment according to the present invention
will be described below, with reference to FIGS. 14 to 21.
[0100] The carrier for the module IC handler according to the third
embodiment of the present invention is provided with a pair of
installation elements 53 in a housing 52, each element being spaced
apart at an equidistance therebetween, and having insertion grooves
54 formed at an equidistance therebetween, for supporting both ends
of the module IC. The insertion groove 43 also has the receiving
spaces 55 at both sides thereof.
[0101] The housing 52 has a plurality of fastening holes 52a formed
at both right and left sides thereof, and to which fixing screws 56
are selectively screwed through the through-holes 53a formed in the
installation elements 53, so that a distance between the parallel
installation elements 53 may be adjusted depending on a
longitudinal width L of the module IC 1. Each receiving space 55 is
adapted to receive a supporting member 57 therein some portion of
which is normally narrower than other portions thereof, and become
elastically wider when used to hold both sides of the module
IC.
[0102] The supporting member 57, as shown in FIGS. 14 to 16b,
consists of: a supporting portion 58 having a neck portion 57a
which is used to hold both sides of the module IC 1, the portion
57a having a spacing S narrower than the thickness T of the module
IC; and a bended portion 59 horizontally bended, for being
horizontally slid in the receiving space when the module IC is
inserted/pulled out to/from the inside thereof. The insertion
groove 54 communicating with the receiving space 55 is provided
with the drop preventing groove 53b for supporting the neck portion
57a so that the supporting member 57 is not dropped from the
installation element 53 when the supporting member 57 was
equipped.
[0103] In installing the supporting member 57 into the installation
element 53, the installation can be completed without dropping from
the installation element 53, by maximally compressing the neck
portion 57a of the supporting member 57, positioning the
horizontally bended portion 59 in the receiving space 55 and then
removing an external force from the supporting member 57, in
consequence, the neck portion 57a returning to its initial state by
the restoring force itself to be hitched in the drop preventing
groove 53b. Namely, when the module IC 1 is loaded between the
supporting portions 58 of the supporting member 57, tensile force
is exhibited only at the neck portion 57a due to a narrower width
of the neck than the thickness of the module IC 1, whereas when
loading the module IC, only force for restoring the neck portion
57a to its initial state is effective. Thus, the supporting member
57 does not drop from the receiving space 55.
[0104] FIGS. 17 and 18 show another configurations of the
supporting member. The supporting member 57 consists of: a
supporting portion 58 for holding both sides of the module IC 1; a
wound portion 60 having an insertion hole 60a therein used to
install the supporting member 57 in the installation element 53;
and a connecting portion 61 for connecting the wound portion 60 and
the supporting portion 58. The coupling of the supporting member 57
into the installation element 53 can be accomplished by positioning
the wound portions 60 in the receiving space 55 and inserting
supporting pins 62 into the insertion holes 60a of the wound
portion 50 through a fixing hole 53c. The supporting member 57 may
be implemented by a spring whose section is circular. This allows
the drop preventing groove to be dispensable, because the
supporting member 57 is fixed into the installation element 53 by
means of the supporting pin 62. Since the connecting portion 61, as
shown in FIG. 17, is tilted downward, this configuration also acts
to guide the module IC to a passage between the supporting portions
58 when the module IC is loaded.
[0105] As shown in FIGS. 19a and 19b, a structure whose section is
a plate, as a spring, may be applied to the supporting member 57.
In case the plate configuration is applied for the supporting
member 57, such a configuration, although it is relatively hard to
produce it, increases in a contact area with both sides of the
module IC 1, which guarantees, between the processes, the safe
transferring of the loaded module IC in a carrier.
[0106] Further, the supporting member 57 may be configured as shown
in FIGS. 20 and 21. There are provided the cut surfaces 53e in the
installation element 53, the cut surfaces 53e being spaced apart at
an equidistance therebetween and provided with long holes 53f.
Further, since the supporting member 57 is inserted to the long
hole 53f and then fixed by means of the bolt 65, the right and left
floating of the supporting member 57 can be prevented. A supporting
block 64 is used to fix the supporting member 57 to the
installation element 53, the supporting member 57 being provided
with a downward bended portion 57b for being inserted to the long
hole 53f. Also, the supporting member 57 has a neck portion 57a
provided with a protrusion inwardly projected, by which the spacing
S of the neck portion is narrower than the thickness of the module
IC 1.
[0107] The operation of the carrier for the module IC handier
according to the third embodiment of the present invention will be
described below.
[0108] As shown in FIG. 14, under the condition that the horizontal
bended portion 59 of the supporting member 57 is positioned in the
receiving space 55 of the installation element 53, the dropping of
supporting member 57 from the installation element 53 is prevented
because the neck portion 57a of the supporting member 57 is hitched
in the drop preventing groove 53b. At this time, when the carrier
arrives at the loading position of the module IC 1, separate
picking-up means holds the module ICs contained in the tray and
transfers them to a position over the carrier. After the plural
module ICs 1 held by the picking-up means are transferred to a
position over the insertion groove 54 formed in the installation
element 53, as shown in FIG. 16a, and the transferring operation of
the picking-up means stops.
[0109] If the picking-up means lowers by separate driving means,
the positioning of the module IC 1 held by the picking-up means is
re-determined by the slant surface 53d formed in the installation
element 53, and then both ends of the module IC are inserted in the
insertion grooves 54, respectively. As the insertion of both ends
of the module IC 1 into a region between the supporting portions 58
by way of the insertion hole 54 starts, the neck portion 57a
becomes wider, as shown in FIG. 16b, due to narrower spacing S of
the neck portion 57a relative to the thickness T of the module IC.
Thus, the neck portion closely supports both sides of the module IC
1. As the neck portion 57a becomes wider, the horizontal bended
portions 49 are opened along the receiving space 55. It is noted
that while the configuration of supporting member 57 is such that a
uniform opening of both ends thereof is obtained, in some cases,
there may be the case where one end of the horizontal bended
portion 59 is fixed not to be floated, whereas only the other end
thereof is opened.
[0110] The module IC 1 is inserted between the supporting portions
59 of the supporting member 57 before the holding state of the
picking-up means is released. After released, the picking-up means
is elevated and moved toward the tray to hold new module IC.
However, although released, since both sides of the module IC 1 are
closely supported to the neck portion 57a of the supporting member
57, and further both ends of the module IC are positioned inside
the insertion groove 54 of the installation element 53, the module
IC is not dropped from the supporting member 17, when the carrier
is transferred, or during the tests.
[0111] With the repetition of such operations, if all module ICs 1
are loaded into the supporting portion 58 of the supporting member
57, the carrier is transferred to the inside of the sealed chamber
(not shown) by the transferring means, where the module ICs are
heated at a temperature selected for the tests (e.g., about 70 to
90-degrees) and then transferred to the test site for the thermal
resistance tests. At the time of the tests for the loaded module IC
1 in the carrier at the test site, the contacts can be made, with
the horizontal or vertical positioning of the carrier being
determined, based upon the installation direction of the test
socket. In this case, since separate pusher presses the module IC 1
contained in the housing 52 toward the test socket, the module IC 1
is not dropped from the supporting member 57, and after finishing
the cests, separate discharging lever, which is equipped in the
test socket, pulls out the module IC inserted in the test socket,
so that it becomes possible to transfer the module IC to the
subsequent process (unloading process).
[0112] If, at the test site, the tests are finished and the carrier
is transferred to the unloading position, separate picking-up means
disposed at the unloading unit is moved to this place, to hold the
module IC held between the supporting members 57 and sorts by the
test results and store them in the unloading tray. Thus, the
thermal resistance tests for the module ICs are completed.
[0113] At the operation described above, the picking-up means
elevates, together with the module IC 1 whose both ends are held by
the ascending picking-up means, by which the module IC 1 can exit
from the supporting member 57. As the module IC leaves the
supporting member 57, the spacing S of the neck portion 57a becomes
narrower, as shown in FIG. 16a, by the elasticity of the supporting
member 57, thus allowing a new module IC 1 to be loaded into the
supporting member 57.
[0114] While the forgoing illustrates and describes the operation
of the carrier for module IC handler according to the third
embodiment of the preset invention, it will be understood that
another embodiments to the supporting member 57 are similarly
operated as in the third embodiment, i.e., when loading the module
IC 1, the neck portion 57a of the supporting member 57 opens wider
to support both sides of the module IC, thereby enables, between
the processes, the handling of the loaded module IC in the
carrier.
[0115] By the operations described above, only one carrier of the
present invention, which loads the plural module ICs and transfers
between the processes, can be used for providing the handling of
various kinds of module ICs through a spacing adjustment of the
installation elements 53 in the housing 52, in consideration of the
longitudinal width L of the module ICs to be tested. That is,
according to the width L of the module IC to be tested, the
selection of any suitable fastening hole 52a among the plurality of
the fastening holes 52a is made such that the appropriate spacing
between a pair of installation elements 53 is maintained, and the
fixing screw 56 screws into the insertion hole 53a aligned with the
selected fastening hole 52a.
[0116] Next, a fourth embodiment according to the present invention
will be explained below.
[0117] As shown in FIGS. 22 to 25, the carrier for the module IC
handler according to the fourth embodiment of the present invention
is provided with a pair of supporting blocks 73 installed
oppositely to each other at both sides of a housing 72, and having
one side to which an installation element 75 is fixed, the
installation element 75 having positioning grooves 74 disposed at
an equidistance.
[0118] The housing 72, in which the pair of supporting block are
installed, has left and right sides in which long holes 72a are
formed, respectively, that are used to adjust the spacing between
the parallel supporting blocks in consideration of the longitudinal
width L of the module IC 1 to be handled. The adjustment is made by
determining the position of the supporting blocks 73 through the
long holes 72a, and selectively fastening a fixing screw 76 into a
fastening hole 73a.
[0119] In the receiving space 73b of the supporting block 73 (see
FIG. 23) is coupled an ascending/descending member 77 having a
slant long hole 77a therein to which one end portion of a
connection member 78 is inserted to be retractable in response to
the ascending/descending motion of the member 77. Another end
portion of the connection member 78 is positioned in the
positioning groove 74 of the installation element 75 and another
end portion of the connection member 78 is also provided to which
the supporting member 79 is inserted, wherein the supporting member
79 has a seating groove 79a and a seating surface 79b for receiving
the module IC.
[0120] In order to install an elastic member 80 between the
installation element 75 and the connection member 78, a plurality
of pins 81 are inserted into the installation element 75 and each
one end thereof is supported by an E-ring 22 to be exposed external
to each connection member 78. The elastic member 80 is inserted in
an outer peripheral surface of the pin disposed between the
installation element 75 and the connection member 78.
[0121] As shown in FIGS. 23 and 25, the coupling of the pin 81 into
the installation element 75 is made by the screwing which allows
the clamping force of the pin to be adjusted to vary an elastic
force of the elastic member 80. To guarantee a safe inward or
outward movement of the supporting member 79 inserted to the
connection member 78, at least one or more guide pins 83 are fixed
at one side of the supporting member 79, opposing to the side on
which the seating groove 79a is formed. The guide pin 83 is to be
fixed to the installation element 75 in which an insertion hole 75a
receiving the guide pin 83 is formed.
[0122] The operation of the fourth embodiment according to the
present invention will be explained below.
[0123] As shown in FIGS. 22 and 24a, when an external force is not
applied to the ascending/descending member 77 installed in the
supporting member 73, the member 77 is positioned at the bottom
dead point by a restoring force of the elastic member 80 pushing
the ascending/descending member 77. At this time, in case the
carrier arrives at the loading position of the module IC 1, the
elevating operation of the pusher 84 disposed at a lower portion of
the carrier introduces an upward elevation of the member 77
installed at each supporting block 73.
[0124] Accordingly, due to the construction that the slant long
hole 77a to which one end of the connection member 78 is inserted
is formed in the ascending/descending member 77, as shown in FIG.
24b, a vertical motion of the ascending/descending member 77 is
converted to a horizontal motion and transmitted to the connection
member 78, so that the connection members 78 inserted to the plural
supporting member 78 compresses the elastic member 80, causing the
widening of spacing between the connection members 78.
[0125] After the spacing between the supporting members 79
installed oppositely to each other in the installation elements 75
becomes wider, then separate picking-up means hold the plurality of
module ICs contained in the tray (not shown) to transfer them into
the position over the carrier, and the transferring operation of
the picking-up means is stopped when the plural module IC 1 held by
the picking-up means is moved to a position over the seating groove
79a formed in the supporting member 79.
[0126] Thereafter, if the picking-up means lowers by separate
driving means, the positioning of the module IC 1 held by the
picking-up means is re-determined by a slant surface 79c formed in
the supporting member 79, and then both ends of the module IC are
inserted in each seating grooves 54 to abut against the bottom
surface thereof.
[0127] After re-positioning the module IC 1 held by the picking-up
means within the seating groove 79a of the supporting member 79,
the holding state for the module IC is released, and for the
purpose of holding new module ICs contained in the tray, following
the movement of picking-up means toward the tray to hold the module
ICs, the loading of the module IC 1 into a position between the
supporting members 79 which the module IC is not present is
conducted. Such operations are repeated. With the repetition of
such operations, if all module ICs 1 are loaded to the supporting
member 77 of the carrier, the pusher 84 having elevated the
ascending/descending member 77 descends.
[0128] If the ascending/descending member 77 descends as the pusher
84 descends, the connection members 78 are inwardly moved to each
other due to the construction that the slant long hole 77a to which
one end of the connection member 78 is inserted is formed in the
ascending/descending member 77. At this time, the inward movements
of the connection members 78 are promptly made by aid of the
restoring force of the elastic member 80 having been compressed
between the installation elements 75, thereby the supporting
members 79 holding both ends of the module IC 1.
[0129] With such operations, if all module ICs 1 to be tested are
loaded and held by the supporting member 79, the carrier is
transferred to the inside of the sealed chamber (not shown) by the
transferring means, where the module ICs are heated at a
temperature selected for the tests (e.g., about 70 to 90-degrees)
and then transferred to the test site for the thermal resistance
tests. It will be understood that the contacts can be made, with
the horizontal or vertical positioning of the carrier being
determined based upon the installation direction of the test
socket. In this case, since separate pusher (not shown) presses the
module IC 1 contained in the housing 72 toward the test socket, the
carrier is moved to a test socket by the pressing force of the
pusher, and after finishing the tests, separate discharging lever,
which is equipped in the test socket, pulls out the module IC
inserted in the test socket, so that it becomes possible to
transfer the module IC to the subsequent process.
[0130] If, at the test site, the tests are finished and the carrier
is transferred to the unloading position, separate picking-up means
disposed at the unloading unit is moved to this place, to hold the
module IC held between the supporting members 79 and sorts by the
tests results and store them in the unloading tray. Thus, the
thermal resistance tests for the module ICs are completed.
[0131] At the operation described above, the module IC 1 whose both
ends are held by the supporting member 79 is released from the
holding state thereof by the widening of the connection members 78
in which the supporting member 79 is inserted, during the elevation
of the ascending/descending member 77 when the pusher installed at
the unloading unit ascends. Thus, the unloading of the module IC
becomes made possible.
[0132] Next, a fifth embodiment according to the present invention
will be described below, with reference to FIGS. 30a and 30b.
[0133] As shown in FIGS. 26 to 29, the carrier for the module IC
handler is provided with a housing 112 configured like a
rectangular frame, having right and left sides in which supporting
blocks 113 are disposed, respectively. Between the supporting
blocks 113, there are fixed at least one or more guide bars 114 to
which a plurality of opposing holding member 115 are inserted which
holds both ends of the module IC 1 being loaded.
[0134] In case of the guide bar 114 having polygonal configuration
in section thereof and into which the plurality of the guide bar
114 having holding member 115 are inserted, only one guide bar 114
between the supporting blocks 113 is sufficient, while in case of
the guide bar 114 of a rod having a circular section, preferably,
two guide bars 114 for each of upper and lower portion are
installed so that the holding member 114 is not rotated with
respect to the guide bars 114. Further, there are provided with
spacing adjustment means for adjusting the spacing of the holding
member in consideration of associated position of the module IC,
i.e., the loading or the unloading position.
[0135] This needs because an insertion groove of the tray
containing the module IC 1 to be tested and a test socket at test
site are commonly sized to have a pitch of 15 mm and an insertion
groove of the unloading tray containing the test-finished module IC
1 is sized to have a pitch of 11 mm. Namely, in consideration of
different pitch dimensions for each picking-up means installed at
the loading and unloading positions, respectively, the provision of
such an spacing adjustment means is such that the loading or
unloading operation of the module IC 1 ensures to be conducted
depending on the site which the carrier is placed.
[0136] As shown in FIG. 29 illustrating a rear side of the spacing
adjustment means, the spacing adjustment means comprises: a
plurality of holding members 115 having a pair of upper and lower
protrusions 116;
[0137] a plurality of links 117, ends of which have long holes
117a, for causing simultaneous moving of the holding members,
wherein the link connects in a diagonal direction any one holding
member 115 and another holding member adjacent to said 115 one
holding member by inserting the protrusion of each of holding
members into the long holes of said link into; and
[0138] elastic member 119 connected between a hinge axis of the
link 117 and the protrusion 116 of the holding member 115, and used
to maximize the spacing between the holding means 115 and the means
115 adjacent thereto by pushing outward each holding means, when an
external force is applied. It is noted that while the elastic
member 119 is embodied by a torsion spring according to the fifth
embodiment of the present invention, any kinds of elastic member
similar to it may be also used.
[0139] The housing is provided with a plurality of fastening holes
112a, and the supporting block 113 has an insertion hole 113a.
Depending upon the longitudinal width L of the module IC 1 to be
tested, the positioning of the supporting block 113 is determined
and then the supporting block 113 is fixedly coupled by screwing a
fixing screw 120 through the fastening hole 112a. Namely, in the
case where the short width L of the module IC to be tested is
given, the spacing of the supporting block is made narrower, thus
allowing various lengths of the module ICs to be handled by only
one carrier, irrelevantly of any lengths of the module IC.
[0140] Further, as shown in FIGS. 27 and 28, the holding member
115, which is inserted to the guide bar 114 to hold both ends of
the module IC 1, consists of:
[0141] a body 121 having an insertion groove 121a, one side of
which has a seating surface 121b and a seating surface 121b which
are used to insert end portion of the module IC 1;
[0142] an ascending/descending member 122 installed to the body to
be moved upward/downward;
[0143] a pressing piece 123 installed on an upper portion of the
body to be rotated, and for pressing a top of the module IC 1;
[0144] an elastic member 124 installed on an outer peripheral
surface of the ascending/descending member 122, and for restoring
the ascending/descending member 122 to which the pressing piece is
installed, when an external force is not applied to the
ascending/descending member 122; and
[0145] a stopper 125 installed on the upper portion of the body
121, for rotating the pressing piece by suppressing the raising of
the pressing piece.
[0146] Accordingly, since the pressing piece elastically installed
by the elastic member 124 makes a horizontal motion within a
horizontal motion range S, even when the module IC of different
height T is to be tested, the module IC 1 higher than a minimal
height of the module IC 1 can be handled without exchanging the
parts.
[0147] The body 121 is further provided with a guide groove 121c
into which a protrusion piece 123b formed at both sides of the
pressing piece is inserted. When the ascending/descending member
122 is moved upward/downward, the pressing piece 123 makes a
horizontal movement within the horizontal movement range S, at a
condition that the pressing piece 123 is inserted into the guide
groove 121c. At the horizontal movement beyond the range S, the
pressing piece instead rotates by the operation that the rear end
portion thereof is pressed by the stopper 125. By such rotation, a
supporting groove 123c formed in a bottom surface of the pressing
piece 123 encompasses the module IC 1 inserted into the insertion
groove 121a. This ensures to safely maintain the holding state of
the module IC 1 held by the holding member 115 during the transfer
between the processes.
[0148] The operation of the carrier for the module IC handler
according to the fifth embodiment of the present invention will be
described.
[0149] Referring to FIG. 29, when an external force is not applied
to the plurality of holding members 115 inserted into the guide bar
114, the maximum spaced distance, e.g., 15 mm, between the holding
members 115 is maintained by the torsion spring. Further, as shown
in FIG. 26, when an external force is not applied to the
ascending/descending member 122 installed in the body 121, the
ascending/descending member 122 is positioned at the bottom dead
point by the restoring force of the elastic member 124, and the
rotatable pressing piece 123 installed in the ascending/descending
member 122 is positioned within the horizontal movement range.
[0150] Under such a condition, if the carrier arrives at the
loading position for the module IC 1, the pushers 126, which are
installed at a lower portion of the carrier (the numbers and
installation positions of the pushers correspond to those of the
holding members), elevate during which the ascending/descending
member 122 installed in the body 121 is pushed upward.
[0151] Since the ascending/descending member 122 ascends and also
compresses the elastic member 122, the rotatable pressing piece 123
installed in the ascending/descending member 122 is vertically
moved up within the horizontal movement range, which stable
vertical up movement of the pressing piece is guaranteed by the
configuration that the protrusion 123b formed in the pressing piece
123 is inserted into the guide groove 121c formed in the housing
121.
[0152] With the continued up movement of the ascending/descending
member 122, when the ascending/descending member 122 is further
moved upward even at the condition that the rear end portion of the
pressing piece 123 comes into contact with the stopper 125 beyond
the horizontal movement range of the pressing piece 123, the
pressing piece 123 no longer moves upward, instead, rotates with
respect to an axis 127, as shown in FIG. 30a, so that the insertion
groove 121a formed in the body 121 is opened.
[0153] The opposing pressing pieces 123 installed in the housing
112 are rotated in the opposing directions to each other to thereby
open the insertion groove 121a, and thereafter, the loading side
picking-up means holds the plurality of module ICs 1 contained with
a spacing of 15 mm therebetween in the tray and transfers them to a
position over the insertion groove 121a before the transferring
operation of the picking-up means stops.
[0154] Then, if the picking-up means lowers by separate driving
means, the positioning of the module IC 1 held by the picking-up
means is re-determined by the slant surface 121d formed in the body
121, and then both ends of the module IC are inserted into each
insertion groove 121a and the bottom surface of the module IC comes
into contact with the seating surface 121b.
[0155] After the module IC 1 held by the picking-up means is
positioned in the insertion groove 121a of the body 121, the
holding state of the module IC 1 is released. The picking-up means
then moved to the loading side tray holds new module IC 1 contained
in the tray and loads the module IC into the body 121 in which no
module IC is inserted. Such operations are repeated.
[0156] With such operations, if all module ICs 1 to be tested are
loaded into the holding member 115, the pusher 124 having moved
upward the ascending/descending member 122 descends. As the
ascending/descending member 122 descends, the restoring force form
the elastic member 119 compressed lowers the ascending/descending
member 122, by which the pressing piece coupled to the
ascending/descending member 122 by the axis 127 is pulled downward.
Thus, the pressing piece 123, which was rotated by the rear end
portion being hitched by the stopper, is rotated to be in a
horizontal state at which the pressing piece 123 descends along the
horizontal movement range S. During such horizontal movement, the
pressing piece presses the top surface of the module IC 1, as shown
in FIG. 30b.
[0157] With such operations, if all module ICs 1 to be tested are
loaded and held by the holding member 115, the carrier is
transferred to the inside of the sealed chamber (not shown) by the
transferring means, where the module ICs are heated at a
temperature selected for the tests (e.g., about 70 to 90-degrees)
and then transferred to the test site for the thermal resistance
tests. It will be understood that the contacts can be made, with
the vertical or horizontal positioning of the carrier being
determined based upon the installation direction of the test
socket.
[0158] In this case, since separate pusher (not shown) presses the
module IC 1 contained in the main body 112 toward the test socket,
the carrier is moved to a test socket by the pressing force of the
pusher, and after finishing the tests, separate discharging lever,
which is equipped in the test socket, pulls out the module IC
inserted in the test socket, so that it becomes possible to
transfer the module IC to the subsequent process.
[0159] If, at the test site, the tests are finished and the carrier
is transferred to the unloading position, the spacing of the
holding member 115 inserted into the guide bar 114 should be
adjusted to correspond to the insertion groove spacing, 11 mm of
the unloading tray positioned at the unloading side.
[0160] After the carrier in which the test-finished module ICs 1
are contained is moved to the unloading position, the spacing of
the holding member 115 which has been maintained with the spacing
of 15 mm should be adjusted to the same spacing, 11 mm as the
insertion groove of the unloading side unloading tray. Then, the
plurality of picking-up means installed spaced apart at a spacing
11 mm therebetween can simultaneously hold and unload the plurality
of module ICs from the holding member.
[0161] For this, separate pitch adjustment means holds respective
body 121 at an upper or lower side to inwardly move it. At this
time, the links 117 are folded which the long hole 117a is inserted
into the protrusion 114 of the holding member 115, accompanying the
compression of the elastic member 119 hitched between the
protrusion 114 and a hinge axis 118. Thus, the spacing between the
bodies 121 becomes narrower to a spacing of 11 mm which allows the
picking-up means installed at the unloading side to hold the module
IC 1.
[0162] After the spacing between the module ICs held by the holding
member 115 is adjusted, separate pusher ascends, as in the loading
operation of the module IC, to push the ascending/descending member
122. Then, the pressing piece connected to the ascending/descending
member 122 is rotated by the rear end portion hitched by the
stopper 125 to open the insertion groove 121a, but since further
details thereof are the same as described above, further
explanation therefor will be omitted.
[0163] Thus, the thermal resistance tests can be completed by
holding the module IC inserted into the insertion groove 121a of
the body 121 by using the picking-up means positioned at the
unloading side, and sorting and putting the module ICs into the
unloading tray depending upon the test results. The carrier
according to the present invention which performs such operations
described above and also loads the plurality of module ICs and
transfers them between the processes, can handle various types of
the module IC 1 by using one carrier through the spacing adjustment
of the supporting block 113 based on the longitudinal width L of
the module IC 1 to be tested. Namely, depending upon the
longitudinal width L of the module IC 1 to be tested, the
positioning of the supporting block 113 is determined and then the
supporting block 113 is fixedly coupled by screwing a fixing screw
120 through the fastening hole 112a so as to maintain an
appropriate spacing between a pair of supporting blocks 113.
[0164] As described above, the present invention improves
reliability of the product by the tests which are performed after,
at a temperature preset, heating the module IC transferred to the
inside of the chamber, wherein the transferring of the module IC
loaded in the carrier is easily achieved because the module IC is
loaded into the carrier by the picking-up means, in an outside of
the chamber.
[0165] Further, during the loading and unloading of the module IC
into the carrier, the tests for the module ICs loaded in the
carrier can be performed at the test site. Therefore, an advantage
is provided that an extreme availability of a high-cost apparatus
can be obtained.
* * * * *