| Patent | Date |
|---|
Display Device And Driving Method Thereof
App 20220147215 - Lee; Jeong Heon ; et al. | 2022-05-12 |
Apparatus And Method For Diagnosing State Of Battery Pack
App 20220069371 - LEE; Dong-Chun ; et al. | 2022-03-03 |
Battery Management Apparatus And Method
App 20200389034 - HONG; Sung-Ju ; et al. | 2020-12-10 |
System and method for authenticating user
Grant 10,204,265 - Bang , et al. Feb | 2019-02-12 |
Method and system for generating integral image marker
Grant 10,032,288 - Lee , et al. July 24, 2 | 2018-07-24 |
Method And System For Generating Integral Image Marker
App 20180101964 - LEE; Dong Chun ; et al. | 2018-04-12 |
System And Method For Authenticating User
App 20170200046 - BANG; Jun Seong ; et al. | 2017-07-13 |
Apparatus And Method For Cloud-based Development Environment Service
App 20160371069 - BAE; Su-Young ; et al. | 2016-12-22 |
Data storage device
Grant 8,902,596 - Kim , et al. December 2, 2 | 2014-12-02 |
Apparatus and method for collecting game data
Grant 8,827,817 - Kim , et al. September 9, 2 | 2014-09-09 |
Multiple Viewpoint Rendering Method For Multiplayer Online Game And Multiple Viewpoint Rendering Server Using The Same
App 20140243056 - LEE; Dong Chun ; et al. | 2014-08-28 |
Apparatus And Method For Providing Streaming-based Game Images
App 20140213353 - LEE; Dong-Chun ; et al. | 2014-07-31 |
Scenario-based load testing apparatus and method
Grant 8,556,725 - Cho , et al. October 15, 2 | 2013-10-15 |
Semiconductor module, socket for the same, and semiconductor module/socket assembly
Grant 8,385,080 - Kim , et al. February 26, 2 | 2013-02-26 |
Method And Apparatus For Testing Stability Of Game Server
App 20130040740 - Lee; Dong Chun ; et al. | 2013-02-14 |
Data Storage Device
App 20120244726 - Kim; Young-Hoon ; et al. | 2012-09-27 |
Reworkable passive element embedded printed circuit board
Grant 8,218,330 - Bang , et al. July 10, 2 | 2012-07-10 |
Apparatus And Method For Collecting Game Data
App 20120165103 - KIM; Ju-Young ; et al. | 2012-06-28 |
Scenario-based Load Testing Apparatus And Method
App 20120142424 - CHO; Chang-Sik ; et al. | 2012-06-07 |
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly
Grant 8,189,342 - Bang , et al. May 29, 2 | 2012-05-29 |
Method of Fabricating Semiconductor Device
App 20120108035 - Kim; Goon-Woo ; et al. | 2012-05-03 |
Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly
App 20110216516 - Kim; Jung-hoon ; et al. | 2011-09-08 |
Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
Grant 7,960,655 - Han , et al. June 14, 2 | 2011-06-14 |
Semiconductor device and method of manufacturing the same
Grant 7,906,423 - Bang , et al. March 15, 2 | 2011-03-15 |
Semiconductor package having passive component and semiconductor memory module including the same
Grant 7,902,664 - Bang , et al. March 8, 2 | 2011-03-08 |
Optical inspection tool having lens unit with multiple beam paths for detecting surface defects of a substrate and methods of using same
Grant 7,728,966 - Kim , et al. June 1, 2 | 2010-06-01 |
Semiconductor Device And Method Of Manufacturing The Same
App 20100105201 - Bang; Hyo-Jae ; et al. | 2010-04-29 |
Semiconductor package and module printed circuit board for mounting the same
Grant 7,675,176 - Park , et al. March 9, 2 | 2010-03-09 |
Semiconductor device and method of manufacturing the same
Grant 7,663,219 - Bang , et al. February 16, 2 | 2010-02-16 |
Method Of Electroless Plating
App 20100015362 - LEE; Joo-Han ; et al. | 2010-01-21 |
Semiconductor package and associated methods
App 20090257209 - Han; Seong-Chan ; et al. | 2009-10-15 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
Grant 7,576,437 - Han , et al. August 18, 2 | 2009-08-18 |
Semiconductor module with conductive element between chip packages
Grant 7,521,788 - Bang , et al. April 21, 2 | 2009-04-21 |
Heat spreader, semiconductor package module and memory module having the heat spreader
Grant 7,518,873 - Park , et al. April 14, 2 | 2009-04-14 |
Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
App 20090056979 - Han; Seong-Chan ; et al. | 2009-03-05 |
Methods of compensating for an alignment error during fabrication of structures on semiconductor substrates
Grant 7,498,248 - Lim , et al. March 3, 2 | 2009-03-03 |
Semiconductor Module
App 20090016022 - HAN; Hun ; et al. | 2009-01-15 |
Printed Circuit Board Capable Of Void Control During Surface Mounting Process
App 20080164054 - SHIN; Dong-Woo ; et al. | 2008-07-10 |
Semiconductor Package And Module Printed Circuit Board For Mounting The Same
App 20080157389 - Park; Chang-Yong ; et al. | 2008-07-03 |
Chip Network Resistor Contacting Pcb Through Solder Balls And Semiconductor Module Having The Same
App 20080136580 - BANG; Hyo-Jae ; et al. | 2008-06-12 |
Semiconductor device and method of manufacturing the same
App 20080111235 - Bang; Hyo-Jae ; et al. | 2008-05-15 |
Reworkable Passive Element Embedded Printed Circuit Board
App 20080079118 - BANG; Hyo-jae ; et al. | 2008-04-03 |
Lead Frame Type Stack Package And Method O Fabricating The Same
App 20080079128 - BANG; Hyo-Jae ; et al. | 2008-04-03 |
Method and arrangement for attaching labels to semiconductor modules
Grant 7,338,568 - Lee , et al. March 4, 2 | 2008-03-04 |
Semiconductor package and method of manufacturing the same
App 20080044951 - Bang; Hyo-jae ; et al. | 2008-02-21 |
Semiconductor package having passive component and semiconductor memory module including the same
App 20080023812 - Bang; Hyo-jae ; et al. | 2008-01-31 |
Method and apparatus for inspecting an edge exposure area of a wafer
Grant 7,280,233 - Shin , et al. October 9, 2 | 2007-10-09 |
Apparatus for inspecting a semiconductor device
App 20070189451 - Lee; Young-Soo ; et al. | 2007-08-16 |
Printed circuit board including reinforced copper plated film and method of fabricating the same
App 20070181993 - Choi; Jae-Hoon ; et al. | 2007-08-09 |
Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method
App 20070172690 - Kim; Si-suk ; et al. | 2007-07-26 |
Semiconductor module and method of forming a semiconductor module
App 20070161224 - Park; Chang-Yong ; et al. | 2007-07-12 |
Methods of compensating for an alignment error during fabrication of structures on semiconductor substrates
App 20070120220 - Lim; Jung-Taek ; et al. | 2007-05-31 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
App 20070109758 - Han; Seong-Chan ; et al. | 2007-05-17 |
Semiconductor module and method of forming a semiconductor module
Grant 7,215,026 - Park , et al. May 8, 2 | 2007-05-08 |
Semiconductor module and method of forming a semiconductor module
App 20070069378 - Park; Chang-Yong ; et al. | 2007-03-29 |
Method of testing a substrate and apparatus for performing the same
App 20070072467 - Lee; Young-Soo ; et al. | 2007-03-29 |
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly
App 20070047377 - Bang; Hyo-Jae ; et al. | 2007-03-01 |
Optical Inspection Tool Having Lens Unit With Multiple Beam Paths For Detecting Surface Defects Of A Substrate And Methods Of Using Same
App 20070013901 - Kim; Jong-An ; et al. | 2007-01-18 |
Heat spreader, semiconductor package module and memory module having the heat spreader
App 20070008703 - Park; Chang-Yong ; et al. | 2007-01-11 |
Component mounting apparatus including a demagnetizing device and method thereof
App 20060283009 - Shin; Dong-Woo ; et al. | 2006-12-21 |
Semiconductor module and method of forming a semiconductor module
App 20060231949 - Park; Chang-Yong ; et al. | 2006-10-19 |
Open socket
Grant 7,061,768 - Lee , et al. June 13, 2 | 2006-06-13 |
Semiconductor module and method of manufacturing the same
App 20060102997 - Bang; Hyo-Jae ; et al. | 2006-05-18 |
Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the same
Grant 7,027,638 - Jun , et al. April 11, 2 | 2006-04-11 |
Semiconductor device having heat sink
App 20060043578 - Bang; Hyo-Jae ; et al. | 2006-03-02 |
Image processing method
App 20060029286 - Lim; Jung-Taek ; et al. | 2006-02-09 |
Open socket
App 20050118878 - Lee, Dong-Chun ; et al. | 2005-06-02 |
Method and arrangement for attaching labels to semiconductor modules
App 20050000635 - Lee, Young-Soo ; et al. | 2005-01-06 |
Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor device
Grant 6,815,236 - Kim , et al. November 9, 2 | 2004-11-09 |
Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the same
Grant 6,800,863 - Jun , et al. October 5, 2 | 2004-10-05 |
Method and apparatus for inspecting an edge exposure area of a wafer
App 20040169869 - Shin, Koung-Su ; et al. | 2004-09-02 |
Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the same
App 20040099818 - Jun, Chung-Sam ; et al. | 2004-05-27 |
Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor device
App 20040092046 - Kim, Tae-Kyoung ; et al. | 2004-05-13 |
Transmission-type extrinsic fabry-perot interferometric optical fiber sensor
Grant 6,687,011 - Lee , et al. February 3, 2 | 2004-02-03 |
Method and apparatus for circulating pallets in an elevator unit of the module IC handler
Grant 6,629,812 - Lee , et al. October 7, 2 | 2003-10-07 |
Carrier for a module integrated circuit handler
App 20030033711 - Lee, Sang Soo ; et al. | 2003-02-20 |
Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the same
App 20020172412 - Jun, Chung-sam ; et al. | 2002-11-21 |
Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof
Grant 6,449,156 - Han , et al. September 10, 2 | 2002-09-10 |
Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof
App 20020039282 - Han, Seong-Chan ; et al. | 2002-04-04 |
Apparatus for carrying plural printed circuit boards for semiconductor module
Grant 5,927,504 - Han , et al. July 27, 1 | 1999-07-27 |
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