U.S. patent application number 09/860978 was filed with the patent office on 2002-11-21 for high performance air cooled heat sinks used in high density packaging applications.
This patent application is currently assigned to Intel Corporation. Invention is credited to Lee, Seri, Pollard, Lloyd L. II, Randleman, Craig M..
Application Number | 20020171139 09/860978 |
Document ID | / |
Family ID | 25334534 |
Filed Date | 2002-11-21 |
United States Patent
Application |
20020171139 |
Kind Code |
A1 |
Lee, Seri ; et al. |
November 21, 2002 |
HIGH PERFORMANCE AIR COOLED HEAT SINKS USED IN HIGH DENSITY
PACKAGING APPLICATIONS
Abstract
A heat dissipation system and method for extracting heat from an
integrated circuit device includes a thermally conductive post
having substantially planar upper and lower surfaces, wherein the
upper surface is disposed across from the lower surface, and
wherein the lower surface is adapted to contact an integrated
circuit device. A conductive heat exchange portion including an
array of fins extends upwardly from the upper surface of the post
where possible to allow components mounted on a printed circuit
board to be positioned around the integrated circuit device. The
heat exchange portion including the array has a chamber within to
receive and house an air movement device so that the air introduced
around the fins by the air movement device enhances the heat
dissipation from the heat dissipation device.
Inventors: |
Lee, Seri; (Beaverton,
OR) ; Pollard, Lloyd L. II; (Portland, OR) ;
Randleman, Craig M.; (Firecrest, WA) |
Correspondence
Address: |
SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH, P.A.
P.O. BOX 2938
MINNEAPOLIS
MN
55402
US
|
Assignee: |
Intel Corporation
|
Family ID: |
25334534 |
Appl. No.: |
09/860978 |
Filed: |
May 18, 2001 |
Current U.S.
Class: |
257/720 ;
257/E23.099; 257/E23.103 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 23/3672 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/720 |
International
Class: |
H01L 023/34 |
Claims
What is claimed is:
1. A heat dissipation device for dissipating heat from an
integrated circuit device mounted on a printed circuit board
surrounded by other components, comprising: a thermally conductive
post having substantially planar upper and lower surfaces, wherein
the lower surface is adapted to contact the integrated circuit
device; and a thermally conductive heat exchange portion extending
upwardly from the upper surface of the post, the post and the heat
exchange portion are constructed and arranged for coupling the post
to the integrated circuit device without interference between the
heat exchange portion and other components mounted on the printed
circuit board, the heat exchange portion has a chamber within to
house an air movement device constructed and arranged for
circulating air over the fins to enhance the heat dissipation from
the heat dissipation device.
2. The device of claim 1, wherein the conductive heat exchange
portion includes an array of fins.
3. The device of claim 2, wherein the upper surface is disposed
across from the lower surface, and wherein the conductive heat
exchange portion including the array extends upwardly from the
upper surface of the post comprises: the upwardly extending heat
exchange portion including the array overhangs the post to allow
the components to be positioned around the integrated circuit
device.
4. The device of claim 3, wherein the post and the upwardly
extending heat exchange portion including the array are of
sufficient size so that they do not mechanically interfere with the
components needing to be placed around the integrated circuit
device.
5. The device of claim 3, wherein the heat dissipation device has
an outer shape selected from the group consisting of circular,
square, rectangular, elliptical, and other such shapes suitable for
a heat sink.
6. The device of claim 5, wherein the heat exchange portion
including the array extends upwardly from the upper surface
comprises: the heat exchange portion including the array extends
upwardly such that the extended heat exchange portion overhangs
over the components positioned around the integrated circuit
device.
7. The device of claim 1, wherein the heat dissipation device is
made from a material selected from the group consisting of copper,
aluminum, and other such materials suitable for dissipating heat
away from the integrated circuit device.
8. The device of claim 1, wherein the integrated circuit device is
a microprocessor.
9. The device of claim 1, wherein the integrated circuit device is
a digital signal processor.
10. The device of claim 1, wherein the integrated circuit device
comprises an application-specific integrated circuit.
11. The device of claim 1, wherein the air movement device
comprises a fan.
12. The device of claim 1, wherein the heat exchange portion
including the array is thermally coupled to the upper surface of
the post.
13. An electronic system, comprising: a printed circuit board
having at least one integrated circuit device, wherein the
integrated circuit device having a front side and a back side, and
wherein the front side is mounted to the printed circuit board; a
heat dissipation device comprising: a thermally conductive post,
having substantially planar upper and lower surfaces, wherein the
lower surface has a shape substantially similar to the back side of
the integrated circuit device, wherein the lower surface is
thermally coupled to the back side of the integrated circuit
device; and a conductive heat exchange portion extends upwardly
from the upper surface of the post such that the heat exchange
portion and the post allow clearance for components mounted on the
printed circuit board adjacent to the integrated circuit device,
the heat exchange portion has a chamber within to receive an air
movement device constructed and arranged for moving air in, around,
over, and out the chamber to enhance heat dissipation from the heat
dissipation device.
14. The system of claim 13, wherein the integrated circuit device
is a microprocessor.
15. The system of claim 13, wherein the air movement device is a
fan, wherein the fan is disposed within the chamber to enhance heat
dissipation from the heat dissipation device.
16. The system of claim 13, wherein the heat dissipation device is
made from a material selected from the group consisting of copper,
aluminum, and other such materials suitable for dissipating heat
away from the integrated circuit device.
17. A method of forming a heat dissipation device to extract heat
from an integrated circuit device attached to a printed circuit
board surrounded by other components, comprising: forming a
thermally conductive post including a substantially planar surface
adapted to contact the integrated circuit device, and a heat
exchange portion having a chamber within to receive an air movement
device such that the air movement over the array enhances the heat
dissipation from the device, and further the heat exchange portion
including the array extends upwardly from the post such that the
heat exchange portion including the array does not interfere with
the other components mounted on the printed circuit board.
18. The method of claim 17, wherein forming the thermally
conductive post including the heat exchange portion and the array
comprises: forming the thermally conductive post including the heat
exchange portion and the array using an impact extrusion
process.
19. The method of claim 18, wherein forming the heat exchange
portion including the array comprises: forming the heat exchange
portion including the array such that the heat exchange portion
including the array overhangs the post to allow the components to
be positioned around the integrated circuit device.
20. The method of claim 19, wherein forming the heat dissipation
device comprises: forming the heat dissipation device such that the
heat dissipation device has an outer shape selected from the group
consisting of circular, square, rectangular, elliptical, and other
such shapes suitable for a heat sink.
21. The method of claim 20, wherein the heat dissipation device is
made from a material selected from the group consisting of copper,
aluminum, and/or other such materials suitable for dissipating heat
away from the integrated circuit device.
22. The method of claim 17, wherein the integrated circuit device
is a microprocessor.
23. A method of forming a heat dissipation device to extract heat
from an integrated circuit device attached to a printed circuit
board surrounded by other components, comprising: forming a
thermally conductive post including substantially planar upper and
lower surfaces, wherein the upper surface is disposed across from
the lower surface, wherein the lower is adapted to thermally
contact the integrated circuit device; forming a heat exchange
portion including an array of fins and a through hole substantially
in the middle of the heat exchange portion and wherein the through
hole has an axis that is substantially parallel to the array of
fins; forming a chamber within the heat exchange portion including
the array and the through hole to receive and house an air movement
device so that the air movement created by the air movement device
enhances the heat dissipation from the device; and thermally
coupling the post to the through hole in the heat exchange portion
such that the upper surface of the post is in close proximity to
the chamber and further the heat exchange portion including the
array extends upwardly from the upper surface of the post such that
the post including the array does not interfere with the other
components mounted on the printed circuit board.
24. The method of claim 23, wherein forming the heat exchange
portion including the array and the through hole comprises: forming
the heat exchange portion including the array and the through hole
using an extrusion process.
25. The method of claim 24, wherein forming the chamber within the
heat exchange portion comprises: forming the chamber within the
heat exchange portion using a boring operation.
26. The method of claim 25, wherein forming the heat exchange
portion including the array comprises: forming the heat exchange
portion including the array such that the heat exchange portion
including the array overhangs the post to allow the components to
be positioned around the integrated circuit device.
27. The method of claim 26, wherein forming the radially and
upwardly extending array comprises: forming the array such that the
array of fins extend upwardly in configurations selected from the
group consisting of straight, circular, semi circular, and other
such configurations suitable for dissipating heat from the
integrated circuit device.
28. The method of claim 27, wherein forming the heat dissipation
device comprises: forming the heat dissipation device such that the
heat dissipation device has an outer shape selected from the group
consisting of circular, square, rectangular, elliptical, and other
such shapes suitable for a heat sink.
29. The method of claim 28, wherein the heat dissipation device is
made from a material selected from the group consisting of copper,
aluminum, and/or other such materials suitable for dissipating heat
away from the integrated circuit device.
30. The method of claim 23, wherein the integrated circuit device
is a microprocessor.
31. The method of claim 23, wherein the integrated circuit device
is a digital signal processor.
32. The method of claim 23, wherein the air movement device is a
fan.
33. The method of claim 23, wherein the post is a pedestal.
Description
TECHNICAL FIELD
[0001] This invention relates generally to a heat dissipation
technique for an integrated circuit assembly, and more particularly
to a technique for dissipating heat from an integrated circuit
device.
BACKGROUND
[0002] Integrated circuit devices, microprocessors and other
related computer components are becoming more and more powerful
with increasing capabilities, resulting in increasing amounts of
heat generated from these components. Packaged units and integrated
circuit device sizes of these components are decreasing or
remaining the same, but the amount of heat energy given off by
these components per unit volume, mass, surface area or any other
such metric is increasing. In current packaging techniques, heat
sinks typically consist of a flat base plate, which is mounted to
the integrated circuit device on one side. The heat sinks further
include an array of fins running perpendicular to the flat base
plate on the other side. Generally, the integrated circuit devices
(which are the heat sources) have a significantly smaller footprint
size than the flat base plate of the heat sink. The flat base plate
of the heat sink has a large footprint, that is requires more
motherboard real estate than the integrated circuit device in
contact therewith. The larger size of the base plate causes the
outermost part of the base plate that is not directly in contact
with the integrated circuit device to have a significantly lower
temperature than the part of the base plate that is directly in
contact with the integrated circuit device. Furthermore, as
computer-related equipment becomes more powerful, more components
are being placed inside the equipment and on the motherboard which
further requires more motherboard real estate. In addition, the
base plate of prior art heat sink designs is at the same level as
the integrated circuit device to which it is attached.
Consequently, the flat base plate configuration of the heat sink
generally ends up consuming more motherboard real estate than the
integrated circuit device on which it is mounted. Also, the current
design practice dictates that the fins extend to the edge of the
flat base plate, and in order to grow the fins laterally, the flat
base plate also has to grow. As a result, the larger footprint size
of the base plate prevents other motherboard components, such as
low-cost capacitors, from positioned around or on the
microprocessor. Thus, the large amounts of heat produced by many of
such integrated circuits, and the increasing demand for motherboard
real estate need to be taken into consideration when designing the
integrated circuit mounting and packaging devices.
[0003] For the reasons stated above, and for other reasons stated
below which will become apparent to those skilled in the art upon
reading and understanding the present specification, there is a
need in the art for a low-mass enhanced heat dissipation device and
method that has minimal lateral heat spreading resistance, and a
high performance fin area above adjacent components. Also, there is
a need for a heat dissipation device that do not consume more
motherboard real estate than the integrated circuit device to which
it is attached, to accommodate low-cost electronic components
needing to be positioned around the microprocessor.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is an isometric view of a prior art heat sink
attached to a microprocessor mounted on an assembled printed
circuit board.
[0005] FIG. 2 is an isometric view of another embodiment of a heat
dissipation device according to the present invention.
[0006] FIG. 3 is an isometric view of the heat dissipation device
shown in FIG. 2 attached to a microprocessor mounted onto an
assembled printed circuit board.
[0007] FIG. 4 is a flow diagram of one exemplary method of forming
the heat dissipation device according to the present invention.
[0008] FIGS. 5, 6, 7, 8 and 9 illustrate one example embodiment of
forming the heat dissipation device shown in FIG. 2 using an
extrusion process.
[0009] FIGS. 10 and 11 illustrate another example embodiment of
forming the heat dissipation device shown in FIG. 2 using an impact
extrusion technique.
DETAILED DESCRIPTION
[0010] In the following detailed description of the embodiments,
reference is made to the accompanying drawings that illustrate the
present invention and its practice. In the drawings, like numerals
describe substantially similar components throughout the several
views. These embodiments are described in sufficient detail to
enable those skilled in the art to practice the invention. Other
embodiments may be utilized and structural, logical, and electrical
changes may be made without departing from the scope of the present
invention. Moreover, it is to be understood that the various
embodiments of the invention, although different, are not
necessarily mutually exclusive. For example, a particular feature,
structure, or characteristic described in one embodiment may be
included in other embodiments. The following detailed description
is, therefore, not to be taken in a limiting sense, and the scope
of the present invention is defined only by the appended claims,
along with the full scope of equivalents to which such claims are
entitled.
[0011] This document describes, among other things, an enhanced
heat dissipation device including a chamber within to receive and
house an air movement device that allows electronic components to
be positioned around the microprocessor while maintaining high
performance and cost effectiveness by leveraging currently enabled
high-volume manufacturing techniques.
[0012] FIG. 1 shows an isometric view 100 of a prior art heat sink
110 mounted on a microprocessor 120 of an assembled mother board
130. Also, shown in FIG. 1 are low-cost capacitors 140 mounted
around the heat sink 110 and on the mother board 130.
[0013] The prior art heat sink 100 has a flat base plate 150
including an array of fins 160 extending perpendicularly away from
the flat base plate 150. This configuration of the heat sink 110
dictates the use of the flat base plate 150, with the array of fins
160 for dissipating heat from the microprocessor 120. Increasing
the heat dissipation using the prior art heat sink 110 shown in
FIG. 1 generally requires enlarging the surface area of the flat
base plate 150 and/or the array of fins 160. This in turn results
in consuming more motherboard real estate. Generally, the
microprocessor 120 (which is the heat source) has a smaller
footprint size than the flat base plate 150 configuration of the
heat sink 110 shown in FIG. 1. A larger footprint size of the flat
base plate 150 can cause the outermost part of the flat base plate
150 (the portion that is not directly in contact with the
integrated circuit device) to have a significantly lower
temperature than the part of the flat base plate 150 that is
directly in contact with the integrated circuit device.
Consequently, the prior art heat sink 110 with the larger flat base
plate 150 is not effective in dissipating heat from the integrated
circuit device. Furthermore, the packaged units and integrated
circuit device sizes are decreasing, while the amount of heat
generated by these components is increasing. The prior art heat
sink 110 configuration dictates that the array of fins 160 extend
to the edge of the flat base plate 150 to extract heat from the
integrated circuit device. Also, the prior art heat sink 110
requires increasing the size of the array of fins 160 to increase
the heat dissipation. In order to enlarge the fins 120 laterally,
the flat base plate 150 has to increase in size. Enlarging the flat
base plate 150 consumes more motherboard real estate. Consuming
more motherboard real estate is generally not a viable option in an
environment where system packaging densities are increasing with
each successive, higher performance, integrated circuit device
generation. Also, the flat base plate 150 configuration of the
prior art heat sink 100 has a larger footprint size than the
integrated circuit device on which it is mounted (the flat base
plate 110 is at the same level as the integrated circuit device it
is mounted on). The larger foot print size of the flat base plate
150 prevents motherboard components, such as low-cost capacitors,
from positioned on and around the integrated circuit device.
[0014] FIG. 2 is an isometric view of the heat dissipation device
200 according to one embodiment of the present invention. The heat
dissipation device 200 shown in FIG. 2 includes a thermally
conductive post 210, and a conductive heat exchange portion 220. In
some embodiments, the conductive heat exchange portion 220 includes
an array of fins 230. The thermally conductive post 210 has
substantially planar upper and lower surfaces 240 and 250. The
upper surface 240 is disposed across from the lower surface 250.
The lower surface 250 is adapted to contact an integrated circuit
device. The post 210 has an axis 270. The upper and lower surfaces
240 and 250 can be substantially perpendicular to the axis 270.
[0015] The conductive heat exchange portion 220 including the array
of fins 230 extends upwardly from the upper surface 240 of the post
210 where possible to allow components mounted on a printed circuit
board to be positioned around the integrated circuit device. The
heat exchange portion 220 including the array 230 further has a
chamber 245 within to receive and house an air movement device such
as a fan to enhance heat dissipation from the integrated circuit
device by drawing a cooling medium such as air 280 into the chamber
245 and pushing the air around, over, and through 290 the array of
fins 230.
[0016] The upwardly extending heat exchange portion 220 and the
array 230 overhangs the post 210 to allow the components to be
positioned around the integrated circuit device. Also, the post 210
including the upwardly extending heat exchange portion 220 and the
array 230 are of sufficient size so that they do not mechanically
interfere with the components needing to be placed around the
integrated circuit device. In some embodiments, the post 210 and
the heat exchange portion 220 are constructed and arranged for
coupling the post to the integrated circuit device without
interference between the heat exchange portion 220 and other
components mounted on the printed circuit board. In some
embodiments, the heat exchange portion 220 including the array 230
extend such that the extended heat exchange portion overhangs over
the components positioned around the integrated circuit device. The
upwardly extending heat exchange portion 220 and the array 230 can
have outer shapes such as circular, square, rectangular,
elliptical, and/or any other shape suitable for dissipating heat
from the integrated circuit device. The heat dissipation device 200
can be made from materials such as copper, aluminum, and/or other
such materials suitable for dissipating heat from the integrated
circuit device. The integrated circuit device can be a
microprocessor, digital signal processor, and/or an
application-specific integrated circuit.
[0017] FIG. 3 is an isometric view of an electronic system 300
showing the enhanced heat dissipation device 200 shown in FIG. 2,
attached to a microprocessor 310 on an assembled motherboard 320.
In the example embodiment shown in FIG. 3, the microprocessor 310
has front and back sides 330 and 340. The front side 330 is
disposed opposite the back side 340. The front side 330 is attached
to the motherboard 320 including components such as low-cost
capacitors 350 and other such electrical components. The lower
surface 250 shown in FIG. 2, of the enhanced heat dissipation
device 200, is attached to the back side 340 of the microprocessor
310. It can be seen from FIG. 3 that the heat exchange portion 220
and the array 230 extend upwardly such that they are of sufficient
size and shape to allow low-cost capacitors 350 mounted on the
motherboard 320 to be positioned around the microprocessor 310. It
can also be seen that the low-cost capacitors 350 are below the
heat exchange portion 220 and the array 230 and around the post
210.
[0018] It can also be envisioned that the size of the lower surface
250 of the post 210 to be the same as the back side 340 of the
microprocessor to maximize the heat dissipation characteristics of
the heat dissipation device 200. Also, it can be seen in FIG. 3
that the heat exchange portion 220 including the array 230 is
larger than the post 210, thereby increasing the heat dissipation
rate without increasing a footprint size of the post 210 of the
heat dissipation device 200 any more than the back side 340 of the
microprocessor 310. The coinciding footprint sizes of the post 210
and back side 340 of the microprocessor 310 enables the post 210
and the back side 340 of the microprocessor 310 to have the same
heat transfer rates. This in turn can significantly increase the
heat transfer efficiency between the post 210 and the back side 340
of the microprocessor 310. The heat transfer rate between the post
210 and the back side 340 of the microprocessor can be further
increased by thermally coupling the post 210 to the back side 340
using a layer of thermal grease, and/or a layer of thermally
conductive adhesive material. Also, shown in FIG. 3 is an air
movement device such as a fan 360 disposed within the chamber 245
to increase the heat dissipation rate from the heat dissipation
device 200.
[0019] FIG. 4 is a flow diagram illustrating one example method 400
of forming the heat dissipation device 200 shown in FIG. 2 to
extract heat from an integrated circuit device such that the heat
dissipation device 200 can allow components to be positioned around
the integrated circuit device. Method 400 as shown in FIG. 4,
begins with action 410 of forming a thermally conductive post
including substantially planar upper and lower surfaces. The lower
surface is adapted to contact the integrated circuit device. The
upper surface is across from the lower surface. The formed post can
be a pedestal. The integrated circuit device can include devices
such as a microprocessor, a digital signal processor, and/or an
application-specific integrated circuit.
[0020] The next action 420 in the method 400 includes forming a
heat exchange portion including an array of fins such that the heat
exchange portion and the array has a through hole large enough to
receive and hold the formed post in place. In some embodiments, the
heat exchange portion including the array and the through hole are
formed using an extrusion process in one single operation. In some
embodiments, the through hole can be formed after forming the heat
exchange portion and the array by a boring or drilling operation.
In some embodiments, the through hole is formed substantially in
the middle of the heat exchange portion. The through hole has an
axis that runs substantially parallel to the array. Further, the
axis runs substantially in the center of the through hole. In some
embodiments, the formed array extends upwardly in configurations
such as straight, circular, semi-circular, and/or other such
configurations suitable for dissipating heat from the integrated
circuit device. In some embodiments, the heat exchange portion
including the array are formed to have outer shapes that are
circular, square, rectangular, elliptical, and/or other such shapes
suitable for forming and dissipating heat from the integrated
circuit device.
[0021] The next action 430 includes forming a chamber within the
heat exchange portion, the array, and the through hole. The chamber
is sized to receive and house an air movement device such that air
introduced by the air movement device enhances the heat dissipation
from the heat dissipation device. In some embodiments, the chamber
is formed using a boring operation. The chamber can be
substantially concentric with the through hole. The air movement
device can be a fan.
[0022] The next action 440 includes thermally coupling the heat
exchange portion to the post. In some embodiments, the upper
surface of the post is thermally coupled to the through hole. In
some embodiments, this is accomplished by further boring the
extruded through hole so that a mechanical interference fit can be
achieved between the through hole and the post when the upper
surface of the post is inserted into the bored through hole. In
some embodiments, the post and heat exchange portion are thermally
coupled using a thermally conductive adhesive, and/or any other
suitable material that can provide the desired thermal coupling
between the post and the heat exchange portion. The heat
dissipating device can be formed from materials such as copper,
aluminum, and/or other such materials suitable for dissipating heat
from the integrated circuit device. In some embodiments, the post
is thermally coupled to the heat exchange portion including the
array such that the heat exchange portion overhangs the post to
allow components to be positioned around the integrated circuit
device when the heat dissipation device is mounted on to the
integrated circuit device.
[0023] FIGS. 5, 6, 7, 8 and 9 illustrate one example embodiment of
forming the heat dissipation device shown in FIG. 2. FIGS. 5 and 6
show forming the array of fins 230 with the through hole 510 having
a radius R.sub.1 from a blank using an extrusion process. FIGS. 7
and 8 show the forming of a heat exchange portion 220 and the
chamber 245 having radius R.sub.2 within the heat exchange portion
220 and the array 230 using a boring operation. FIG. 9 illustrates
thermally coupling the post 210 and heat exchange portion 220 using
the through hole 510 in the heat exchange portion 220 such that the
upper surface 240 of the post is in close proximity to the chamber
245. In some embodiments, the formed chamber 245 and the through
hole 510 are concentric to the axis 270. In some embodiments, the
chamber 245 and the through hole 510 are substantially in the
middle of the heat exchange portion 220 and the post 210,
respectively.
[0024] FIGS. 10 and 11 illustrate another example embodiment of
forming the heat dissipation device 200 shown in FIG. 2 using an
impact extrusion process. FIG. 10 shows the forming of the heat
dissipation device 200 by striking a cold metal slug 1000 between
two confronting dies 1010 and 1020 having cavity regions
corresponding to the spacings, alignments, height, and width of the
heat dissipation device 200 shown in FIG. 2. Impact extrusion is a
forming process that produces finished work pieces by striking the
metal slug 1000 contained between two confronting die cavities 1010
and 1020. During the impact extrusion process, the metal slug 1000
is forced to flow between the confronting die cavities 1010 and
1020 by a single high speed blow. Impact extrusion is also referred
to as micro forging is generally a cold forging technique. The
impact extrusion process permits the mass production of parts with
a precision and ultra-fine detail generally not attainable with the
conventional extrusion and forging processes. Impact extrusion
generally produces a finished part that does not require any
subsequent machining operations. The finish produced by impact
extrusion generally has a high resistance to corrosion. Also,
impact extrusion produces a homogeneous and undistorted grain and
microstructure in the finished part. FIG. 1I shows the formed heat
dissipation device 200 after completing the single high speed blow
between the two die cavities 1010 and 1020.
Conclusion
[0025] The above-described method and device provides, among other
things, an enhanced heat dissipation device having fins including a
chamber within extends outwardly upwardly from a thermally
conductive post where possible, to allow electronic components to
be positioned around the microprocessor while maintaining high
performance and cost effectiveness by leveraging currently enabled
high-volume manufacturing techniques.
* * * * *