Lee; Seri

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Seri.The latest application filed is for "apparatus for heat dissipation and a method for fabricating the apparatus".

Company Profile

0.17.24

Lee; Seri - Honolulu HI
Lee; Seri - Singapore SG
Lee; Seri - Durham NC
Lee; Seri - Beaverton OR
LEE; SERI - Chapel Hill NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Medical devices incorporating thermoelectric transducer and controller Grant 10,390,991 - Rogers , et al. A	2019-08-27
Bioreactor Grant 9,930,842 - Lau , et al. April 3, 2	2018-04-03
Apparatus for Heat Dissipation and a Method for Fabricating the Apparatus App 20150000886 - Lee; Seri	2015-01-01
Bioreactor App 20140331552 - Lau; Wai Man ; et al.	2014-11-13
Microscale cooling apparatus and method Grant 8,833,435 - Determan , et al. September 16, 2	2014-09-16
Medical Devices Incorporating Thermoelectric Transducer and Controller App 20120310313 - Rogers; Lesco L. ; et al.	2012-12-06
Medical devices incorporating thermoelectric transducer and controller Grant 8,267,983 - Rogers , et al. September 18, 2	2012-09-18
Microscale Heat Transfer Systems App 20120087088 - Killion; Jesse David ; et al.	2012-04-12
Thermal device with ionized air flow App 20100149719 - Ploeg; Johan F. ; et al.	2010-06-17
Microscale Cooling Apparatus And Method App 20100032150 - Determan; Matthew ; et al.	2010-02-11
Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods App 20090205696 - Koester; David ; et al.	2009-08-20
Thermal Device With Electrokinetic Air Flow App 20090168344 - Ploeg; Johan F. ; et al.	2009-07-02
Fan integrated thermal management device Grant 7,535,708 - Lee May 19, 2	2009-05-19
Method, apparatus and system for enclosure enhancement Grant 7,499,274 - Noble , et al. March 3, 2	2009-03-03
Spring loaded heat sink retention mechanism Grant 7,495,922 - Ploeg , et al. February 24, 2	2009-02-24
Piezoelectric Fan App 20090004034 - Lee; Seri	2009-01-01
Temperature Control Including Integrated Thermoelectric Sensing and Heat Pumping Devices and Related Methods and Systems App 20080264464 - LEE; SERI ; et al.	2008-10-30
Spring Loaded Heat Sink Retention Mechanism App 20080239678 - Ploeg; Johan F. ; et al.	2008-10-02
Cooling device, system containing same, and cooling method App 20080218972 - Sauciuc; Ioan ; et al.	2008-09-11
Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and Systems App 20080168775 - Windheim; Jesko von ; et al.	2008-07-17
Fan Integrated Thermal Management Device App 20080068790 - Lee; Seri	2008-03-20
Rake shaped fan Grant 7,321,184 - Lee , et al. January 22, 2	2008-01-22
Method, apparatus and system for enclosure enhancement App 20070285891 - Noble; Scott ; et al.	2007-12-13
Rake shaped fan App 20070037506 - Lee; Seri ; et al.	2007-02-15
Method of attaching non-adhesive thermal interface materials Grant 7,019,977 - Lee , et al. March 28, 2	2006-03-28
Method of attaching non-adhesive thermal interface materials App 20050135066 - Lee, Seri ; et al.	2005-06-23
Heat sink and package surface design Grant 6,870,736 - Lee , et al. March 22, 2	2005-03-22
High performance heat sink configurations for use in high density packaging applications Grant 6,845,010 - Lee January 18, 2	2005-01-18
Heat sink and package surface design App 20040218354 - Lee, Seri ; et al.	2004-11-04
Radial heat sink with skived-shaped fin and methods of making same App 20040190245 - Tirumala, Murli ; et al.	2004-09-30
Heat sink and package surface design Grant 6,757,170 - Lee , et al. June 29, 2	2004-06-29
Heat sink and package surface design App 20040017656 - Lee, Seri ; et al.	2004-01-29
Heat-dissipating devices, systems, and methods with small footprint Grant 6,633,484 - Lee , et al. October 14, 2	2003-10-14
High performance heat sink configurations for use in high density packaging applications App 20030189813 - Lee, Seri	2003-10-09
High performance heat sink configurations for use in high density packaging applications Grant 6,535,385 - Lee March 18, 2	2003-03-18
High Performance Air Cooled Heat Sinks Used In High Density Packaging Applications App 20020171139 - Lee, Seri ; et al.	2002-11-21
High performance air cooled heat sinks used in high density packaging applications Grant 6,479,895 - Lee , et al. November 12, 2	2002-11-12
Heat sink App 20020079097 - Lee, Seri ; et al.	2002-06-27
HIgh performance heat sink configurations for use in high density packaging applications App 20020060902 - Lee, Seri	2002-05-23

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