U.S. patent application number 10/112945 was filed with the patent office on 2002-07-25 for method of forming conductive layers in the trenches or through holes made in an insulating film on a semiconductor substrate.
This patent application is currently assigned to Hitachi, Ltd.. Invention is credited to Furukawa, Ryouichi, Hiranuma, Masayuki, Ishizaka, Masayuki, Saitoh, Koichi, Shimoda, Maki, Suko, Kazuyuki, Yamamoto, Hirohiko, Yoshida, Tadanori.
Application Number | 20020098678 10/112945 |
Document ID | / |
Family ID | 16206298 |
Filed Date | 2002-07-25 |
United States Patent
Application |
20020098678 |
Kind Code |
A1 |
Furukawa, Ryouichi ; et
al. |
July 25, 2002 |
Method of forming conductive layers in the trenches or through
holes made in an insulating film on a semiconductor substrate
Abstract
Conductive layers are formed in the trenches made in an
insulating film in the following manner. First, an amorphous
silicon film 26A is deposited in the trenches 25 made in a silicon
oxide film 24. A photoresist film 30 is then formed on the
amorphous silicon film 26A by means of spin coating. Then, exposure
light is applied to the entire surface of the photoresist film 30,
thereby exposing to light those parts of the photoresist film 30
which lie outside the trenches 25. The other parts of the
photoresist film 30, which lie in the trenches 25 are not exposed
to light because the light reaching them is inadequate. Further,
the photoresist film 30 is developed thereby removing those parts
of the film 30 which lie outside the trenches 25 and which have
been exposed to light. Thereafter, those parts of the amorphous
silicon film 26A, which lie outside the trenches 25, are removed by
means of dry etching using, as a mask, the unexposed parts of the
photoresist film 30 which remain in the trenches 25.
Inventors: |
Furukawa, Ryouichi; (Ome,
JP) ; Suko, Kazuyuki; (Hachiouji, JP) ;
Hiranuma, Masayuki; (Westpeak, SG) ; Saitoh,
Koichi; (Tokyo, JP) ; Yamamoto, Hirohiko;
(Hachiouji, JP) ; Yoshida, Tadanori; (Sayama,
JP) ; Ishizaka, Masayuki; (Kodaira, JP) ;
Shimoda, Maki; (Hachiouji, JP) |
Correspondence
Address: |
REED SMITH HAZEL THOMAS LLP
3110 Fairview Park Drive, Suite 1400
Falls Church
VA
22042
US
|
Assignee: |
Hitachi, Ltd.
|
Family ID: |
16206298 |
Appl. No.: |
10/112945 |
Filed: |
April 2, 2002 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10112945 |
Apr 2, 2002 |
|
|
|
09610114 |
Jun 30, 2000 |
|
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Current U.S.
Class: |
438/624 ;
257/E21.013; 257/E21.019; 257/E21.507; 257/E21.579; 257/E21.583;
257/E21.586; 257/E21.648; 257/E27.088; 438/627; 438/629;
438/637 |
Current CPC
Class: |
H01L 21/76865 20130101;
H01L 21/76879 20130101; H01L 27/10885 20130101; H01L 21/76843
20130101; H01L 21/76808 20130101; H01L 27/10814 20130101; H01L
21/76897 20130101; H01L 2924/0002 20130101; H01L 21/7684 20130101;
H01L 27/10817 20130101; H01L 27/10852 20130101; H01L 28/84
20130101; H01L 27/10855 20130101; H01L 28/91 20130101; H01L
2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
438/624 ;
438/629; 438/637; 438/627 |
International
Class: |
H01L 021/4763 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 1, 1999 |
JP |
11-187450 |
Claims
What is claimed is:
1. A method of manufacturing a semiconductor integrated circuit
device, comprising the steps of: (a) forming a first conductive
film on a major surface of a semiconductor substrate, forming a
first insulating film on the first conductive film, and making a
trench or a through hole in the first insulating film; (b) forming
a second conductive film in the trench or the through hole and on
the first insulating film, said second conductive film extending
through the trench or the through hole and electrically connected
to the first conductive film; (c) covering the second conductive
film with a photoresist film and applying exposure light to the
photoresist film, thereby exposing to light at least that part of
the photoresist film which lies outside the trench or the through
hole; (d) removing that part of the photoresist film which is
exposed to light, thus leaving the other, unexposed part of the
photoresist film in the trench or the through hole; and (e)
removing that part of the second conductive film which is not
covered with the photoresist film, thereby leaving the other part
of the second conductive film in the trench or the through
hole.
2. The method of manufacturing a semiconductor integrated circuit
device, according to claim 1, wherein the second conductive film is
removed in part in the step (e) by means of etching using the
photoresist film as a mask.
3. The method of manufacturing a semiconductor integrated circuit
device, according to claim 1, wherein the second conductive film is
removed in part in the step (e) by means of chemical mechanical
polishing.
4. The method of manufacturing a semiconductor integrated circuit
device, according to claim 1, wherein the photoresist film is
removed in part in the step (d) by developing the photoresist
film.
5. The method of manufacturing a semiconductor integrated circuit
device, according to claim 1, after the step (e) has been
performed, further comprising a step (f) of removing that part of
the photoresist film lying in the trench or the through hole and
growing a third conductive film on the second conductive film
exposed in the trench or the through hole, thereby burying the
third conductive film in the trench or the through hole.
6. The method of manufacturing a semiconductor integrated circuit
device, according to claim 5, wherein the second conductive film is
made of titanium nitride or tungsten.
7. The method of manufacturing a semiconductor integrated circuit
device, according to claim 5, wherein the third conductive film is
made of tungsten or aluminum alloy.
8. The method of manufacturing a semiconductor integrated circuit
device, according to claim 5, after a step (f) has been performed,
further comprising the step (h) of forming a fourth conductive film
on the first insulating film and electrically connecting the fourth
conductive film to the first conductive film via the third
conductive film in the trench or the through hole.
9. The method of manufacturing a semiconductor integrated circuit
device, according to claim 1, further comprising the following
steps (f) and (g) which are performed after the step (e): (f)
removing that part of the photoresist film which lie in the trench
or the through hole, and forming a fifth conductive film in the
trench or the through hole and on the first insulating film; and
(g) growing a sixth conductive film on the fifth conductive film
and removing those parts of the sixth and fifth conductive films
which lie outside the trench or the through hole, thereby leaving
the sixth and fifth conductive films in the trench or the through
hole.
10. The method of manufacturing a semiconductor integrated circuit
device, according to claim 9, wherein the second conductive film is
made of titanium nitride or tantalum nitride.
11. The method of manufacturing a semiconductor integrated circuit
device, according to claim 9, wherein the fifth and sixth
conductive films are made of copper.
12. The method of manufacturing a semiconductor integrated circuit
device, according to claim 9, wherein said parts of the sixth and
fifth conductive films are removed by means of chemical mechanical
polishing.
13. A method of manufacturing a semiconductor integrated circuit
device having at least one memory cell composed of a cell-selecting
MISFET formed in a major surface of a semiconductor substrate and a
data-storing capacitive element provided above the cell-selecting
MISFET, said method comprising the steps of: (a) forming a
cell-selecting MISFET on in a major surface of a semiconductor
substrate, forming a first insulating film on the cell-selecting
MISFET, and forming, in a through hole made in the first insulating
film, a first conductive film electrically connected to a source or
drain of the cell-selecting MISFET; (b) forming a second insulating
film on the first insulating film and making a trench in the second
insulating film; (c) forming a second conductive film in the trench
and on the second insulating film, said second conductive film
extending through the trench and electrically connected to the
first conductive film; (d) covering the second conductive film with
a photoresist film and applying exposure light to the photoresist
film, thereby exposing that part of the photoresist film which lies
outside the trench to light; (e) removing that part of the
photoresist film which has been exposed to light, thereby leaving,
in the trench, that part of the photoresist film which is not
exposed to light; (f) removing that part of the second conductive
film which is not covered with the photoresist film, thereby
leaving the other part of the second conductive film in the trench;
and (g) removing that part of the photoresist film that lies in the
trench, and then forming a third insulating film in the trench and
on the second insulating film and forming a third conductive film
on the third insulating film, thereby forming a data-storing
capacitive element composed of a first electrode, a capacitive
insulating film and a second electrode which are made of the second
conductive film, third insulating film and third conductive film,
respectively.
14. A method of manufacturing a semiconductor integrated circuit
device having at least one memory cell composed of a cell-selecting
MISFET formed in a major surface of a semiconductor substrate and a
data-storing capacitive element provided above the cell-selecting
MISFET, said method comprising the steps of: (a) forming a
cell-selecting MISFET on the major surface of the semiconductor
substrate, forming a first insulating film on the cell-selecting
MISFET, and forming, in a through hole made in the first insulating
film, a first conductive film electrically connected to a source or
drain of the cell-selecting MISFET; (b) forming a second insulating
film on the first insulating film and making a trench in the second
insulating film; (c) forming, in the trench and on the second
insulating film, a second conductive film made of amorphous silicon
and electrically connected to the first conductive film via the
trench; (d) covering the second conductive film with a photoresist
film and applying exposure light to the photoresist film, thereby
exposing that part of the photoresist film which lies outside the
trench to light; (e) removing that part of the photoresist film
which has been exposed to light, thereby leaving, in the trench,
that part of the photoresist film which is not exposed to light;
(f) removing that part of the second conductive film which is not
covered with the photoresist film, thereby leaving the second
conductive film in the trench; (g) removing that part of the
photoresist film which lies in the trench and forming depressions
and projections in and on the surface of the second conductive film
exposed in the trench; (h) heat-treating the second conductive
film, converting the same to a polycrystalline film; and (i)
forming a third insulating film in the trench and on the second
insulating film and forming a third conductive film on the third
insulating film, thereby forming a data-storing capacitive element
composed of a first electrode, a capacitive insulating film and a
second electrode which are made of the second conductive film,
third insulating film and third conductive film, respectively.
15. A method of manufacturing a semiconductor integrated circuit
device having at least one memory cell composed of a cell-selecting
MISFET formed in a major surface of a semiconductor substrate and a
data-storing capacitive element provided above the cell-selecting
MISFET, said method comprising the steps of: (a) forming a
cell-selecting MISFET on a major surface of a semiconductor
substrate, forming a first insulating film on the cell-selecting
MISFET, and forming, in a through hole made in the first insulating
film, a first conductive film electrically connected to a source or
drain of the cell-selecting MISFET; (b) forming a second insulating
film on the first insulating film and then making a trench in the
second insulating film; (c) forming, in the trench and on the
second insulating film, a second conductive film made of amorphous
silicon and electrically connected to the first conductive film via
the trench; (d) forming depressions and projections in and on the
surface of the second conductive film; (e) heat-treating the second
conductive film, converting the same to a polycrystalline film; and
(f) covering the second conductive film with a photoresist film and
applying exposure light to the photoresist film, thereby exposing
that part of the photoresist film which lies outside the trench to
light; (g) removing that part of the photoresist film which has
been exposed to light, thereby leaving that part of the photoresist
film which lies in the trench; (h) removing that part of the second
conductive film which is not covered with the photoresist film,
thereby leaving the second conductive film in the trench; (i)
removing that part of the photoresist film which lies in the
trench, then forming a third insulating film in the trench and on
the second insulating film and forming a third conductive film on
the third insulating film, thereby forming a data-storing
capacitive element composed of a first electrode, a capacitive
insulating film and a second electrode which are made of the second
conductive film, third insulating film and third conductive film,
respectively.
16. The method of manufacturing a semiconductor integrated circuit
device, according to claim 14, wherein that part of the second
conductive film which is not covered with the photoresist film is
removed by means of etching using the photoresist film as a
mask.
17. The method of manufacturing a semiconductor integrated circuit
device, according to claim 14, wherein the depressions and
projections are formed in and on the second conductive film, by
growing silicon grains on the surface of the second conductive film
made of amorphous silicon.
18. The method of manufacturing a semiconductor integrated circuit
device, according to claim 14, wherein when that part of the second
conductive film which is not covered with the photoresist film is
removed, an upper edge of that part of the second conductive film
which lies in the trench is made to recede below a rim of the
trench.
19. The method of manufacturing a semiconductor integrated circuit
device, according to claim 18, wherein the upper edge of the second
conductive film is made to recede by a distance substantially equal
to a diameter of the depressions and projections formed in and on
the surface of the second conductive film.
20. The method of manufacturing a semiconductor integrated circuit
device, according to claim 13, wherein the second insulating film
is a silicon oxide film.
21. The method of manufacturing a semiconductor integrated circuit
device, according to claim 13, wherein the third insulating film is
a film having a large dielectric constant or a ferroelectric
film.
22. A method of manufacturing a semiconductor integrated circuit
device, comprising the steps of: (a) forming a first conductive
film on a major surface of a semiconductor substrate, forming a
first insulating film on the first conductive film and then making
a through hole in the first insulating film; (b) forming a
photoresist film in the through hole and on the first insulating
film, and then exposing to light that part of the photoresist film
which lies in the through hole and that part of the part of the
photoresist film which lies on a wire-forming region; (c) removing
that part of the photoresist film which has been exposed to light,
thereby leaving the unexposed parts of the photoresist film which
lie on a part of the first insulating film and in the through hole;
(d) etching the first insulating film by using the photoresist film
as a mask, thereby making a wire trench in the first insulating
film; (e) removing the photoresist film and forming a second
conductive film, on the first insulating film and in the wire
trench and through hole, said second conductive film lying in the
through hole and electrically connected to the first conductive
film via the through hole; and (f) removing that part of the second
conductive film which lies on the first insulating film by means of
chemical and mechanical polishing, thereby forming a buried wire
made of the second conductive film in the wire trench and through
hole.
23. The method of manufacturing a semiconductor integrated circuit
device, according to claim 22, wherein the second conductive film
is made of copper.
24. A method of manufacturing a semiconductor integrated circuit
device, comprising the steps of: (a) forming a first conductive
film on a major surface of a semiconductor substrate, forming a
first insulating film on the first conductive film and then
patterning the first insulating film and first conductive film,
thereby forming a gate electrode made of the first conductive film
and covered with the first insulating film; (b) forming
semiconductor regions in two parts of the semiconductor substrate
lie at both sides of the gate electrode; (c) forming a second
insulating film on the semiconductor substrate, covering the gate
electrode formed on the semiconductor substrate and then forming a
third insulating film on the second insulating film, said third
insulating film having an etching rate different from that of the
second insulating film; (d) etching the third insulating film by
using a first photoresist film as a mask, thereby making a first
trench reaching the second insulating film provided on the
semiconductor region and making a second trench reaching the second
insulating film provided on the gate electrode; (e) removing the
first photoresist film and forming a second photoresist film in the
first and second trenches and on the third insulating film; (f)
applying exposure light to the second photoresist film, thereby
exposing to light those parts of the second photoresist film which
lie in the second trench and on the third insulating film, and
removing those parts of the second resist film which have been
exposed to light, thereby leaving an unexposed part of the second
photoresist film in the first trench; (g) etching a part of the
second insulating film and a part of the first insulating film
lying beneath the second insulating film, by using the second
photoresist film left in the first trench as a mask; and (h)
removing the second photoresist film and etching the second
insulating film lying in the first trench and the first insulating
film lying in the second trench, thereby making a first contact
hole exposing the semiconductor region and a second contact hole
exposing the gate electrode.
25. The method of manufacturing a semiconductor integrated circuit
device, according to claim 24, wherein the first and second
insulating films are made of silicon nitride and the third
insulating film is made of silicon oxide film.
26. The method of manufacturing a semiconductor integrated circuit
device, according to claim 24, further comprising the following
steps (i) and (j) which are performed after the step (h): (i)
forming a second conductive film in the first and second contact
holes and on the third insulating film; and (j) patterning the
second conductive film, thereby forming first and second wires in
the first and second contact holes, which are electrically
connected to the semiconductor region and the gate electrode,
respectively.
27. A method of manufacturing a semiconductor integrated circuit
device, comprising the steps of: (a) forming a trench in a first
insulating film provided on a major surface of a semiconductor
substrate and forming a silicon layer in the trench and on the
first insulating film; (b) forming a second insulating film on the
silicon layer laying in the trench and removing that part of the
silicon layer which lies outside the trench; (c) removing that part
of the second insulating film which lies in the trench and forming
depressions and projections in and on the silicon layer; and (d)
forming a dielectric film on the silicon having the depressions and
projections in and on the surface, and forming a conductive film on
the dielectric film.
28. The method of manufacturing a semiconductor integrated circuit
device, according to claim 27, wherein the silicon layer is made of
amorphous silicon.
29. The method of manufacturing a semiconductor integrated circuit
device, according to claim 27, wherein the first insulating film is
made of silicon oxide and the second insulating film is made of
photoresist.
30. The method of manufacturing a semiconductor integrated circuit
device, according to claim 27, wherein the depressions and
projections provided in and on the silicon layer have been formed
by growing silicon grains on the surface of the silicon layer.
31. The method of manufacturing a semiconductor integrated circuit
device, according to claim 29, wherein the step (b) includes the
sub-steps of: (b-1) forming a photoresist film in the trench and on
the first insulating film and then applying exposure light to the
photoresist film, thereby applying light to that part of the
photoresist film which lies outside the trench; (b-2) removing that
part of the photoresist film which has been exposed to light,
thereby leaving an unexposed part of the photoresist film in the
trench; and (b-3) removing that part of the silicon layer which
lies outside the trench, by means of etching using the photoresist
film as a mask.
32. The method of manufacturing a semiconductor integrated circuit
device, according to claim 27, wherein the silicon layer having the
depressions and projections in and on the surface constitutes a
first electrode of a capacitive element, the dielectric film
constitutes a capacitive insulating film of the capacitive element,
and the conductive film constitutes a second electrode of the
capacitive element.
33. A method of manufacturing a semiconductor integrate circuit,
comprising the steps of: (a) making a trench in a first insulating
film provided on a major surface of a semiconductor substrate and
then forming a conductive layer in the trench and on the first
insulating film; (b) forming a photoresist film on the conductive
layer and applying exposure light to the photoresist film, thereby
exposing to light the entire photoresist film which lies on the
photoresist film and a part of the photoresist film which lies in
the trench; (c) developing the photoresist film, thereby removing
that part of the photoresist film which has been entirely exposed
to light and leaving that unexposed part of the photoresist film
which lies in the trench; and (d) removing that part of the
conductive layer which is not covered with the photoresist
film.
34. The method of manufacturing a semiconductor integrate circuit,
according to claim 33, wherein that part of the conductive layer is
removed by means of etching using the photoresist film as a
mask.
35. A method of manufacturing a semiconductor integrate circuit,
comprising the steps of: (a) forming a silicon oxide film on a
major surface of a semiconductor substrate and making a trench in
the silicon oxide film; (b) forming a first conductive film in the
trench and on the silicon oxide film; (c) covering the first
conductive film with a photoresist film and applying exposure light
to the photoresist film, thereby exposing to light that part of the
photoresist film which lies outside the trench; (d) developing that
part of the photoresist film which has been exposed to light,
thereby leaving an unexposed part of the photoresist film in the
trench; (e) removing that part of the first conductive film which
lies on the silicon oxide film, by means of etching using the
photoresist film as a mask; and (f) removing that part of the
photoresist film which lies in the trench, thereby leaving that
part of the first conductive film which lies in the trench.
36. The method of manufacturing a semiconductor integrate circuit,
according to claim 35, wherein the photoresist film is removed in
the step (f) by means of ashing.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The application is a divisional application of U.S.
application Ser. No. 09/610,114 filed on Jun. 30, 2000. The present
Invention relates to a method of manufacturing a semiconductor
integrated circuit device. More particularly, the invention relates
to a technique, which is useful and efficient when applied to the
process of forming conductive layers in the trenches or through
holes made in an insulating film.
BACKGROUND OF THE INVENTION
[0002] The memory cells of a DRAM (Dynamic Random Access Memory)
are arranged at the intersections of a plurality of word lines and
a plurality of bit lines, which are provided on the major surface
of the, semiconductor substrate. Hence, the memory cells are
arranged in rows and columns on the major surface of the
semiconductor substrate. Each of the memory cells comprises a
MISFET (Metal Insulator Semiconductor Field Effect Transistor) and
a capacitive element. The MISFET is turned on to select the memory
cell. The capacitive element Is connected to the MISFET in series,
for storing data.
[0003] Each MISFET for selecting one memory cell is provided in an
active region of the substrate, which is surrounded by
element-Isolating regions. The cell-selecting MISFET comprises a
gate insulating film, a gate electrode formed integral with a word
line, and a pair of semiconductor regions serving as the source and
the drain, respectively. Each bit line is provided above two
adjacent cell-selecting MISFETs and electrically connected to the
common source or drain of the adjacent MISFETs, which are arranged
along the bit line. The data-storing capacitive element is also
located above the MISFETs, too, and electrically connected to the
common source or drain of the MISFETs.
[0004] Japanese Patent Application Laid-Open Publication No. 7-7084
discloses a DRAM of a stacked capacitor structure, in which
data-storing capacitive elements are provided above cell-selecting
MISFETs. In the DRAM disclosed in the publication, the lower
electrode (data-storing electrode) of each data-storing capacitive
element is shaped as a hollow cylinder with a larger surface to
compensate for the decrease in stored charge which inevitably
results from the size reduction of the memory cell. The upper
electrode (plate electrode) of the data-storing capacitive element
is provided above the lower electrode.
[0005] Japanese Patent Application Laid-Open Publication No.
11-17144 discloses the technique of forming a reinforcing member
made of insulating film, on the bottom of a hollow cylindrical
lower electrode of the type described above. The reinforcing member
increases the mechanical strength of the lower electrode thereby
preventing the lower electrode from toppling in the course of
manufacturing the data-storing capacitive element.
SUMMARY OF THE INVENTION
[0006] The Inventors of the present invention have been developing
the technique of first forming a trench in a thick silicon oxide
film deposited and located above a bit line and then forming the
lower electrode (data-storing electrode) of a data-storing
capacitive element in the trench.
[0007] The data-storing capacitive element is manufactured as
follows. First, a thick silicon oxide film is formed above the bit
line. A trench is made In the silicon oxide film by means of dry
etching using a mask made of a photoresist film. Then, a
polycrystalline silicon film is deposited in the trench and on the
silicon oxide film. Thereafter, a coating is formed on the
polycrystalline silicon film by means of SOG (Spin On Glass) or the
like, thereby protecting the polycrystalline silicon film. A part
of the polycrystalline silicon film, which is provided on the
silicon oxide film, is removed by dry etching. The other part of
the polycrystalline silicon film, which remains. In the trench,
will be used as the lower electrode.
[0008] Next, the SOG film Is removed from the polycrystalline
silicon film remaining In the trench. The SOG film is removed by
dry etching or wet etching based upon the difference In etching
rate between the silicon oxide film and the SOG film.
[0009] Then, a dielectric film, such as a tantalum oxide (Ta2O5)
film, is deposited on the polycrystalline silicon film. A
conductive film made of titanium oxide or the like is deposited on
the tantalum oxide film. A data-storing capacitive element is
thereby manufactured, which comprises a lower electrode made of a
polycrystalline silicon film, a capacitance insulating film made of
a tantalum oxide film, and an upper electrode made of a titanium
oxide film.
[0010] The data-storing capacitive element described above has its
lower electrode provided in a trench made in a silicon oxide film.
Provided in the trench, the lower electrode would not be toppled as
the conventional lower electrode that is shaped like a hollow
cylinder, in the course of manufacturing the data-storing
capacitive element. In view of this, the lower electrode is
advantageous over the conventional one. However, the lower
electrode of the data-storing capacitive element has a smaller
surface than the conventional lower electrode, whose inner surface
and outer surface are used as a region to effectively hold the
accumulated charge. In order to hold the charge reliably, some
measures must be taken to increase the surface area of the lower
electrode. To Increase the surface area of the lower electrode, the
trench in which the lower electrode is provided may be made deeper,
and depressions and projections may be made at the surface of the
lower electrode.
[0011] However, the method of manufacturing the lower electrode,
wherein the selective etching of the SOG film Is achieved based
upon the difference in etching rate between the silicon oxide film
and the SOG film, is disadvantageous In one respect. Since the
difference in etching rate between these films is not sufficiently
large, the oxide silicon film outside the trench is etched to some
extent when the SOG film covering the polycrystalline silicon film
provided In the trench is etched. Consequently, the upper surface
of the silicon oxide film lowers, in particular where depressions
and projections are made at the surface of the polycrystalline
silicon film and over-etching is performed to remove those parts of
the SOG film which remain in the depressions and between the
projections.
[0012] If the upper surface of the silicon oxide film lowers, the
upper edge of the polycrystalline silicon film formed in the trench
protrudes from the plane in which the trench opens. This impairs
the surface smoothness of the data-storing capacitive element such
that it is inevitably impaired. Further, an electric field
concentrates at the upper edge of the polycrystalline silicon film,
which inevitably increases the leakage current of the data-storing
capacitive element.
[0013] An object of the present invention is to provide a technique
for enhancing the manufacturing yield of a DRAM comprising
data-storing capacitive elements, each having a lower electrode
provided in a trench made in an insulating film.
[0014] Another object of the invention is to provide a technique of
forming a conductive layer in a trench or a through hole made in an
insulating film.
[0015] Additional objects and novel features of the invention will
be obvious from the description, which follows, and the drawings
accompanying the present specification.
[0016] The representative embodiments of this invention are briefly
described as follows.
[0017] (1) A method of manufacturing a semiconductor integrated
circuit device, according to this invention, comprises the
following steps:
[0018] (a) forming a first conductive film on a surface of a
semiconductor substrate, forming a first insulating film on the
first conductive film, and making a trench or a through hole in the
first insulating film;
[0019] (b) forming a second conductive film in the trench or the
through hole and on the first insulating film, said second
conductive film extending through the trench or the through hole
and electrically connected to the first conductive film;
[0020] (c) covering the second conductive film with a photoresist
film and applying exposure light to the photoresist film, thereby
exposing to light at least that part of the photoresist film which
lies outside the trench or the through hole;
[0021] (d) removing a part of the photoresist film which is exposed
to light, thereby leaving the other, unexposed part of the
photoresist film in the trench or the through hole; and
[0022] (e) removing the unexposed part of the second conductive
film which is not covered with the photoresist film, thereby
leaving the other part of the second conductive film in the trench
or the through hole.
[0023] (2) In the method of manufacturing a semiconductor
integrated circuit device device. described in Paragraph M. the
second conductive film may be removed in part in the step (e) by
means of etching using the Photoresist film as a mask.
[0024] (3) In the method of manufacturing a semiconductor
integrated circuit device device, described in paragraph (1), the
second conductive film May be removed in part in the step (e) by
means of chemical mechanical Polishing.
[0025] (4) In the method of manufacturing a semiconductor
integrated circuit device device, described in Paragraph (1),
wherein the photoresist film may be removed in part in the step (d)
by developing the photoresist film.
[0026] (5) The method of manufacturing a semiconductor integrated
circuit device, described in paragraph (1), after the step (e) has
been performed, may further comprise a step (f) of removing that
part of the photoresist film lying in the trench or the through
hole and growing a third conductive film on the second conductive
film exposed in the trench or the through hole, thereby burying the
third conductive film in the trench or the through hole.
[0027] (6) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (5), the second
conductive film may be made of titanium nitride or tungsten.
[0028] (7) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (5), the third
conductive film may be made of tungsten or aluminum alloy.
[0029] (8) The method of manufacturing a semiconductor integrated
circuit device, described in paragraph (5), after the step (f) has
been performed, may further comprise a step (h) of forming a fourth
conductive film on the first insulating film and electrically
connecting the fourth conductive film to the first conductive film
via the third conductive film in the trench or the through
hole.
[0030] (9) The method of manufacturing a semiconductor integrated
circuit device, described in paragraph (1), may further comprise
the following steps (f) and (g) which are performed after the step
(e):
[0031] (f) removing that part of the photoresist film which lie in
the trench or the through hole, and forming a fifth conductive film
in the trench or the through hole and on the first insulating film;
and
[0032] (g) growing a sixth conductive film on the fifth conductive
film and removing those parts of the sixth and fifth conductive
films which lie outside the trench or the through hole, thereby
leaving the sixth and fifth conductive film in the trench or the
through hole.
[0033] (10) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (9), the second
conductive film may be made of titanium nitride or tantalum
nitride.
[0034] (11) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (9), the fifth
and sixth conductive films may be made of copper.
[0035] (12) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (9), said parts
of the sixth and fifth conductive films may be removed by means of
chemical mechanical polishing.
[0036] (13) A method of manufacturing a semiconductor integrated
circuit device, according to the present invention, is one designed
to manufacture a semiconductor integrated circuit device that has
at least one memory cell composed of a cell-selecting MISFET formed
in a major surface of a semiconductor substrate and a data-storing
capacitive element provided above the cell-selecting MISFET. This
method comprises the steps of:
[0037] (a) forming a cell-selecting MISFET on in a major surface of
a semiconductor substrate, forming a first insulating film on the
cell-selecting MISFET, and forming, in a through hole made in the
first insulating film, a first conductive film electrically
connected to a source or drain of the cell-selecting MISFET;
[0038] (b) forming a second insulating film on the first insulating
film and making a trench in the second insulating film;
[0039] (c) forming a second conductive film in the trench and on
the second insulating film, said second conductive film extending
through the trench and electrically connected to the first
conductive film;
[0040] (d) covering the second conductive film with a photoresist
film and applying exposure light to the photoresist film, thereby
exposing that part of the photoresist film which lies outside the
trench to light;
[0041] (e) removing that part of the photoresist film Which has
been exposed to light. thereby leaving,, in the trench, that part
of the photoresist film which is not exposed to light;
[0042] (f) removing that part of the second conductive film which
is not covered with the photoresist film, thereby leaving the other
part of the second conductive film in the trench; and
[0043] (g) removing that part of the photoresist film that lies in
the trench, and then forming a third insulating film in the trench
and on the second insulating film and forming is a third conductive
film on the third insulating film, thereby forming a data-storing
capacitive element composed of a first electrode, a capacitive
insulating film and a second electrode which are made of the second
conductive film, third insulating film and third conductive film,
respectively.
[0044] (14) A method of manufacturing a semiconductor integrated
circuit device, according to the invention, is one designed to
manufacture a semiconductor integrated circuit device that has at
least one memory cell composed of a cell-selecting MISFET formed in
a major surface of a semiconductor substrate and a data-storing
capacitive element provided above the cell-selecting MISFET. This
method comprises the steps of:
[0045] (a) forming a cell-selecting MISFET on the major surface of
the semiconductor substrate, forming a first insulating film on the
cell-selecting MISFET, and forming, in a through hole made in the
first insulating film, a first conductive film electrically
connected to a source or drain of the cell-selecting MISFET;
[0046] (b) forming a second insulating film on the first insulating
film and making a trench in the second insulating film;
[0047] (c) forming, in the trench and on the second insulating
film, a second conductive film made of amorphous silicon and
electrically connected to the first conductive film via the
trench;
[0048] (d) covering the second conductive film with a photoresist
film and applying exposure light -to the photoresist film, thereby
exposing that part of the photoresist film which lies outside the
trench to light;
[0049] (e) removing that part of the photoresist film which has
been exposed to light, thereby leaving, in the trench, that part of
the photoresist film which is not exposed to light;
[0050] (f) removing that part of the second conductive film which
is not covered with the photoresist film, thereby leaving the
second conductive film in the trench;
[0051] (g) removing that part of the photoresist film which lies in
the trench and forming depressions and projections in and on the
surface of the second conductive film exposed in the trench;
[0052] (h) heat-treating the second conductive film, converting the
same to a polycrystalline film; and
[0053] (i) forming a third insulating film in the trench and on the
second insulating film and forming a third conductive film on the
third insulating film, thereby forming a data-storing capacitive
element composed of a first electrode, a capacitive insulating film
and a second electrode which are made of the second conductive
film, third insulating film and third conductive film,
respectively.
[0054] (15) A method of manufacturing a semiconductor integrated
circuit device, according to the invention, is one designed to
manufacture a semiconductor integrated circuit device that has at
least one memory cell composed of a cell-selecting MISEET formed in
a major surface of a semiconductor substrate and a data-storing
capacitive element provided above the cell-selecting MISFET. The
method comprises the steps of:
[0055] (a) forming a cell-selecting MISFET on a major surface of a
semiconductor substrate, forming a first insulating film on the
cell-selecting MISFET, and forming, in a through hole made in the
first insulating film, a first conductive film electrically
connected to a source or drain of the cell-selecting MISFET;
[0056] (b) forming a second insulating film on the first insulating
film and then making a trench in the second insulating film;
[0057] (c) forming, in the trench and on the second insulating
film, a second conductive film made of amorphous silicon and
electrically connected to the first conductive film via the
trench;
[0058] (d) forming depressions and projections in and on the
surface of the second conductive film;
[0059] (e) heat-treating the second conductive film, converting the
same to a polycrystalline film; and
[0060] (f) covering the second conductive film with a photoresist
film and applying exposure light to the photoresist film, thereby
exposing that part of the photoresist film which lies outside the
trench to light;
[0061] (g) removing that part of the photoresist film which has
been exposed to light, thereby leaving that part of the photoresist
film which lies in the trench;
[0062] (h) removing that part of the second conductive film which
is not covered with the photoresist film, thereby leaving the
second conductive film in the trench;
[0063] (i) removing that part of the photoresist film which lies in
the trench, then forming a third insulating- film in the trench and
on the second insulating film and forming a third conductive film
on the third insulating film, thereby forming a data-storing
capacitive element composed of a first electrode, a capacitive
insulating film and a second electrode which are made of the second
conductive film, third insulating film and third conductive film,
respectively.
[0064] (16) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (14), that part
of the second conductive film which is not covered with the
photoresist film may be removed by means of etching using the
photoresist film as a mask.
[0065] (17) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (14), the
depressions and projections may be formed in and on the second
conductive film, by growing silicon grains on the surface of the
second conductive film made of amorphous silicon.
[0066] (18) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (14), wherein
when that part of the second conductive film which is not covered
with the photoresist film is removed, an upper edge of that part of
the second conductive film which lies in the trench is made to
recede below a rim of the trench.
[0067] (19) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (18), the upper
edge of the second conductive film may be made to recede by a
distance substantially equal to a diameter of the depressions and
projections formed in and on the surface of the second conductive
film.
[0068] (20) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (13), the second
insulating film may be a silicon oxide film.
[0069] (21) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (13), the third
insulating film may be a film having a large dielectric constant or
a ferroelectric film.
[0070] (22) A method of manufacturing a semiconductor integrated
circuit device, according to the present invention, comprises the
steps of:
[0071] (a) forming a first conductive film on a major surface of a
semiconductor substrate, forming a first insulating film on the
first conductive film and then making a through hole in the first
insulating film;
[0072] (b) forming a photoresist film in the through hole and on
the first insulating film, and then exposing to light a part of the
photoresist film which lies in the through hole and a part of the
part of the photoresist film which lies on a wire-forming
region;
[0073] (c) removing the part of the photoresist film which has been
exposed to light, thereby leaving the unexposed parts of the
photoresist film which lie on a part of the first insulating film
and in the through hole;
[0074] (d) etching the first insulating film by using the unexposed
part of the photoresist film as a mask, thereby making a wire
trench in the first insulating film;
[0075] (e) removing the unexposed part of the photoresist film and
forming a second conductive film, on the first insulating film and
in the wire trench and through hole, said second conductive film
lying in the through hole and electrically connected to the first
conductive film via the through hole; and
[0076] (f) removing the part of the second conductive film which
lies on the first insulating film by means of chemical and
mechanical polishing, thereby forming a buried wire made of the
second conductive film in the wire trench and through hole.
[0077] (23) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (22), the second
conductive film may be made of copper.
[0078] (24) A method of manufacturing a semiconductor integrated
circuit device, according to the present invention, comprises the
steps of:
[0079] (a) forming a first conductive film on a major surface of a
semiconductor substrate, forming a first insulating film on the
first conductive film and then patterning the first insulating film
and first conductive film, thereby forming a gate electrode made of
the first conductive film and covered with the first insulating
film;
[0080] (b) forming semiconductor regions in two parts of the
semiconductor substrate lie at both sides of the gate
electrode;
[0081] (c) forming a second insulating film on the semiconductor
substrate, covering the gate electrode formed on the semiconductor
substrate and then forming a third insulating film on the second
insulating film, said third insulating film having an etching rate
different from that of the second insulating film;
[0082] (d) etching the third insulating film by using a first
photoresist film as a mask, thereby making a first trench reaching
the second insulating film provided on the semiconductor region and
making a second trench reaching the second insulating film provided
on the gate electrode;
[0083] (e) removing the first photoresist film and forming a second
photoresist film in the first and second trenches and on the third
insulating film;
[0084] (f) applying exposure light to the second photoresist film,
thereby exposing to light those parts of the second photoresist
film which lie in the second trench and on the third insulating
film, and removing those parts of the second resist film which have
been exposed to light, thereby leaving an unexposed part of the
second photoresist film in the first trench;
[0085] (g) etching a part of the second insulating film and a part
of the first insulating film lying beneath the second insulating
film, by using the second photoresist film left in the first trench
as a mask; and
[0086] (h) removing the second photoresist film and etching the
second insulating film lying in the first trench and the first
insulating film lying in the second trench, thereby making a first
contact hole exposing the semiconductor region and a second contact
hole exposing the gate electrode.
[0087] (25) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (24), the first
and second insulating films may be made of silicon nitride and the
third insulating film is made of silicon oxide film.
[0088] (26) The method of manufacturing a semiconductor integrated
circuit device, described in paragraph (24) may comprises the
following steps (i) and (j) which are performed after the step
(h):
[0089] (i) forming a second conductive film in the first and second
contact holes and on the third insulating film; and
[0090] (j) patterning the second conductive film, thereby forming
first and second wires in the first and second contact holes, which
are electrically connected to the semiconductor region and the gate
electrode, respectively.
[0091] (27) A method of manufacturing a semiconductor integrated
circuit device, according to this invention, comprises the
following steps:
[0092] (a) forming a trench in a first insulating film provided on
a major surface of a semiconductor substrate and forming a silicon
layer in the trench and on the first insulating film;
[0093] (b) forming a second insulating film on the silicon layer
laying in the trench and removing that part of the silicon layer
which lies outside the trench;
[0094] (c) removing that part of the second insulating film which
lies in the trench and forming depressions and projections in and
on the silicon layer; and
[0095] (d) forming a dielectric film on the silicon having the
depressions and projections in and on the surface, and forming a
conductive film on the dielectric film.
[0096] (28) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (27), the silicon
layer may be made of amorphous silicon.
[0097] (29) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (27), the first
insulating film may be made of silicon oxide and the second
insulating film is made of photoresist.
[0098] (30) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (27), the
depressions and projections provided in and on the silicon layer
may be ones formed by growing silicon grains on the surface of the
silicon layer.
[0099] (31) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (29), the step
(b) may include the following sub-steps:
[0100] (b-1) forming a photoresist film in the trench and on the
first insulating film and then applying exposure light to the
photoresist film, thereby applying light to that part of the
photoresist film which lies outside the trench;
[0101] (b-2) removing that part of the photoresist film which has
been exposed to light, thereby leaving an unexposed part of the
photoresist film in the trench; and
[0102] (b-3) removing that part of the silicon layer which lies
outside the trench, by means of etching using the photoresist film
as a mask.
[0103] (32) In the method of manufacturing a semiconductor
integrated circuit device, described in paragraph (27), the Silicon
layer having the depressions and projections in and on the surface
may constitute a first electrode of a capacitive element, the
dielectric film may constitute a capacitive insulating film of the
capacitive element, and the Conductive film may constitute a second
electrode of the capacitive element.
[0104] (33) A method of manufacturing a semiconductor integrate
circuit, according to the present invention, comprises the
following steps:
[0105] (a) making a trench in a first insulating film provided on a
major surface of a semiconductor substrate and then forming a
conductive layer in the trench and on the first insulating
film;
[0106] (b) forming a photoresist film on the conductive layer and
applying exposure light to the photoresist film, thereby exposing
to light the entire surface of the photoresist film and a part of
the photoresist film which lies in the trench;
[0107] (c) developing the photoresist film, thereby removing that
part of the photoresist film which has been entirely. exposed to
light and leaving that unexposed part of the photoresist film which
lies in the trench; and
[0108] (d) removing the unexposed part of the conductive layer
which is not covered with the photoresist film.
[0109] (34) In the method of manufacturing a semiconductor
integrate circuit, described in paragraph (33), that part of the
conductive layer may be removed by means of etching using the
photoresist film as a mask.
[0110] (35) A method of manufacturing a semiconductor integrate
circuit, according to the invention, comprises the following
steps:
[0111] (a) forming a silicon oxide film on a major surface of a
semiconductor substrate and making a trench in the silicon oxide
film;
[0112] (b) forming a first conductive film in the trench and on the
silicon oxide film;
[0113] (c) covering the first conductive film with a photoresist
film and applying exposure light to the photoresist film, thereby
exposing to light that part of the photoresist film which lies
outside the trench;
[0114] (d) developing that part of the photoresist film which has
been exposed to light, thereby leaving the unexposed part of the
photoresist film in the trench;
[0115] (e) removing the unexposed part of the first conductive film
which lies on the silicon oxide film, by means of etching using the
photoresist film as a mask; and
[0116] (f) removing that part of the photoresist film which lies in
the trench, thereby leaving that part of the first conductive film
which lies in the trench.
[0117] (36) In the method of manufacturing a semiconductor
integrate circuit, described in paragraph (35), the photoresist
film may be removed in the step (f by means of ashing.
BRIEF DESCRIPTIONS OF THE DRAWINGS
[0118] FIG. 1 is a sectional view of a semiconductor substrate,
illustrating a method of manufacturing a semiconductor integrated
circuit device, i.e. Embodiment 1 of the present invention;
[0119] FIG. 2 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of this present invention;
[0120] FIG. 3 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the invention;
[0121] FIG. 4 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the invention;
[0122] FIG. 5 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of this invention;
[0123] FIG. 6 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor Integrated
circuit device, i.e., Embodiment 1 of the present invention;
[0124] FIG. 7 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the present invention;
[0125] FIG. 8 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of this invention;
[0126] FIG. 9 is a sectional view of the semiconductor substrate,
Illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the invention;
[0127] FIG. 10 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the invention;
[0128] FIG. 11 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor Integrated
circuit device, i.e., Embodiment 1 of the present invention;
[0129] FIG. 12 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the invention;
[0130] FIG. 13 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of this invention;
[0131] FIG. 14 is a sectional view of the semiconductor substrate,
explaining the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 1 of the invention;
[0132] FIG. 15 is a sectional view of a semiconductor substrate,
showing a method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of this invention;
[0133] FIG. 16 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of the present invention;
[0134] FIG. 17 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of the invention;
[0135] FIG. 18 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of the invention;
[0136] FIG. 19 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of this invention;
[0137] FIG. 20 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of the present invention;
[0138] FIG. 21 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 2 of the invention;
[0139] FIG. 22 is a sectional view of a semi-conductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the present invention;
[0140] FIG. 23 is a sectional view of the semiconductor substrate,
Illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the present Invention;
[0141] FIG. 24 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of this invention;
[0142] FIG. 25 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor Integrated
circuit device, i.e., Embodiment 3 of the invention;
[0143] FIG. 26 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of this invention;
[0144] FIG. 27 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the invention;
[0145] FIG. 28 Is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the invention;
[0146] FIG. 29 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the present invention;
[0147] FIG. 30 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor Integrated
circuit device, i.e., Embodiment 3 of the invention;
[0148] FIG. 31 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of this invention;
[0149] FIG. 32 Is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the invention;
[0150] FIG. 33 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 3 of the invention;
[0151] FIG. 34 is a sectional view of a semiconductor substrate,
depicting a method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 4 of the present invention;
[0152] FIG. 35 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 4 of the invention;
[0153] FIG. 36 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 4 of this invention;
[0154] FIG. 37 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 4 of the invention;
[0155] FIG. 38 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 4 of the present invention;
[0156] FIG. 39 is a sectional view of the semiconductor substrate,
Illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 4 of the invention;
[0157] FIG. 40 Is a sectional view of a semiconductor substrate,
illustrating a method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of the present invention;
[0158] FIG. 41 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of the invention;
[0159] FIG. 42 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of the invention;
[0160] FIG. 43 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of this invention;
[0161] FIG. 44 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, I.e., Embodiment 5 of the present invention;
[0162] FIG. 45 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor Integrated
circuit device, i.e., Embodiment 5 of the invention;
[0163] FIG. 46 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of this invention;
[0164] FIG. 47 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e.,. Embodiment 5 of this invention;
[0165] FIG. 48 Is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of the invention;
[0166] FIG. 49 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 5 of the invention;
[0167] FIG. 50 is a sectional view of a semiconductor substrate,
illustrating a method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the present Invention;
[0168] FIG. 51 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the invention;
[0169] FIG. 52 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the invention;
[0170] FIG. 53 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of this invention;
[0171] FIG. 54 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the present invention;
[0172] FIG. 55 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the invention;
[0173] FIG. 56 is a sectional view of the semiconductor substrate,
depicting the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of this invention;
[0174] FIG. 57 is a sectional view of the semiconductor substrate,
illustrating the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the invention; and
[0175] FIG. 58 is a sectional view of the semiconductor substrate,
showing the method of manufacturing a semiconductor integrated
circuit device, i.e., Embodiment 6 of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0176] Embodiments of the present invention will be described in
detail, with reference to the accompanying drawings. In the
drawings illustrating the embodiments, the components of any
embodiment, which perform the same functions as those of any other
embodiment, are designated with the same reference numerals and
symbols and will not be described repeatedly. (Embodiment 1)
[0177] The method of manufacturing a DRAM (Dynamic Random Access
Memory), which is Embodiment 1 of the present invention, will be
explained, by describing the sequence of manufacturing steps, with
reference to FIGS. 1 to 14.
[0178] First, as shown in FIG. 1, element-isolating trenches 2 are
made in the surface of a semiconductor substrate 1 (hereinafter
referred to as "substrate") that is made of, for example, p-type
single crystal silicon. More specifically, those parts of the
substrate 1 are etched away thereby making the trenches 3. Silicon
oxide is deposited in the trenches 3 and on the substrate 1 by
means of CVD (Chemical Vapor Deposition). The silicon oxide on the
substrate 1 is removed by CMP (Chemical Mechanical Polishing),
thereby forming silicon oxide film 5 in the trenches 3. Thereafter,
p-type impurities (boron (B)) are ion-implanted into the substrate
1 thereby forming a p-type well 3 in the major surface of the
substrate 1.
[0179] Next, the substrate 1 is subjected to steam oxidation thus
forming a gate insulating film 6 on the surface of the p-type well
3. Gate electrodes 7 (word lines WL) are formed on the gate
insulating film 6, in the following manner. First, a
polycrystalline silicon film doped with n-type impurities, such as
phosphorus (P), is deposited on the substrate 1 by CVD. Then, a
tungsten nitride (WN) film is formed on the polycrystalline silicon
film by sputtering. Further, a tungsten (W) film is deposited on
the tungsten nitride film by sputtering. Then, a silicon nitride
film 8 is formed on the tungsten film by CVD. And then, the
tungsten nitride film, the tungsten film and the silicon nitride
film 8 are patterned by dry etching using a photoresist film as a
mask.
[0180] As shown in FIG. 2, n-type impurities, such as phosphorus
(P), are ion-implanted into those parts of the p-type wells 3,
which are among the gate electrodes 7. N.sup.--type semiconductor
regions 9 are thereby formed. A silicon nitride film 10 is
deposited on the gate electrodes 7 (word lines WL) by CVD, and a
silicon oxide film. 11 is also deposited on the silicon nitride
film 10 by CVD. Chemical mechanical polishing is performed on the
silicon oxide film 11 such that the film 11 has a flat upper
surface.
[0181] Then, as shown in FIG. 3, the silicon oxide film 11 and
silicon nitride film 10 are subjected to dry etching using a
photoresist film (not shown) as a mask. Contact holes 12 and 13 are
thereby made above the n-type semiconductor regions 9,
respectively. The silicon oxide film 11 is etched at a rate much
higher than the rate at which the silicon nitride film 10 is
etched, thus preventing the silicon nitride film 10 lying beneath
the silicon nitride film 11 from being removed. The silicon nitride
film 10 is etched at a rate much higher than the rate at which the
substrate I is etched, thereby preventing the substrate 1 from
being etched excessively deep. Moreover, the silicon nitride film
10 is subjected to anisotropic etching, thereby leaving the silicon
nitride film 10 on the sides of each gate electrode 7 (word line
WL). As a result, the contact holes 12 and 13 are self-aligned with
respect to the gate electrodes 7 (word lines WL). Hence, there is
no need to provide a margin for the alignment between the contact
holes 12, 13 and the gate electrodes 7 (word lines WL). This helps
to decrease the size of the memory cells of the DRAM.
[0182] Next, n-type impurities such as arsenic (As), are
ion-implanted into the p-type well 3 through the contact holes 12
and 13 thereby forming n.sup.+-type semiconductor regions 14
(sources and drains). The manufacturing steps, described thus far,
form n-channel MISFETs Qs, each having a gate insulating film 6, a
gate electrode 7 and n.sup.+-type semiconductor regions 14 (source
and drain) and used to select a memory cell.
[0183] Further, plugs 15 are formed in the contact holes 12 and 13.
More specifically, the plugs 15 are formed in the following way.
First, low-resistance polycrystalline silicon films doped with
n-type impurities, such as phosphorus, are deposited in the contact
holes 12 and 13 and on the silicon oxide film 11 by means of CVD.
Then, the polycrystalline silicon film that lies on the silicon
oxide film 11 is removed by dry etching (or by chemical mechanical
polishing). The polycrystalline silicon film is thereby left in the
contact holes 12 and 13 only.
[0184] As shown in FIG. 4, a silicon oxide film 16 is deposited on
the silicon oxide film 11 by means of CVD. Dry etching using a
photoresist film (not shown) as a mask is performed on the silicon
oxide film 16 to make a through hole 17 that communicates with the
contact hole 12. A plug 18 is then formed in the through hole 17.
Further, a bit line BL is formed on the plug 18.
[0185] More precisely, the plug 18 is formed by the following
method. First, a titanium nitride film is deposited in the through
hole 17 and on the silicon oxide film 16 by means of sputtering.
Then, a tungsten film is deposited in the through hole 17 and on
the titanium nitride film also by of sputtering. Thereafter, the
titanium nitride film and the tungsten film, except the parts in
the through hole 17, are removed by chemical mechanical polishing.
The bit line BL is formed in the following manner. First, a
tungsten film is deposited on the silicon oxide film 16 by means of
sputtering. Then, dry etching using a photoresist film (not shown)
as a mask is carried out, thus patterning the tungsten film. The
bit line BL thus formed is electrically connected by the plugs 18
and 15 formed in the through holes 17 and 12, respectively, to the
drain or source (i.e., n+-type semiconductor region 14) of the
cell-selecting MISFET Qs.
[0186] Next, a silicon oxide film 19 is deposited on the silicon
oxide film 16 by means of CVD. The silicon oxide films 19 and 16
are subjected to dry etching using a photoresist film (not shown)
as a mask, thus making through holes 21. A plug 22 is formed in
each of the through holes 21 in the following way. First, a
low-resistance polycrystalline silicon film doped with n-type
impurities such as phosphorus (P) is deposited by CVD in the
through hole 21 and on the silicon oxide film 19. Then, that part
of the polycrystalline silicon film which is provided on the
silicon oxide film 19 is removed by dry etching (or by chemical
mechanical polishing), thereby leaving the polycrystalline silicon
film in the through hole 21 only.
[0187] As shown in FIG. 5, a silicon nitride film 23 is deposited
on the silicon oxide film 19 by CVD. Then, a silicon oxide film 24
is deposited on the silicon nitride film 23 by CVD, too. The
silicon oxide film 24 and silicon nitride film 23 are subjected to
dry etching using a photoresist film (not shown) as a mask, thereby
making trenches 25 which are aligned with the through holes 21. The
lower electrodes of data-storing capacitive elements (later
described) will be formed on the inner walls of these trenches 25.
The silicon oxide film 24 must therefore have a large thickness (1
.mu.m or more) to impart a large area to the lower electrodes,
thereby to increase the charge that each capacitive element may
accumulates.
[0188] The silicon oxide film 24 is etched at a rate higher than
the rate at which the silicon nitride film 23 may be etched. This
prevents the silicon nitride film 23, which lies beneath the
silicon oxide film 24, from being removed. The silicon nitride film
23 is etched at a rate higher than the rate at which the silicon
oxide film 19 may be etched. This prevents the silicon oxide film
19 from being etched too deep. The silicon nitride film 23 provided
beneath the thick silicon oxide film 24 functions as an etching
stopper, preventing the silicon oxide film 19 from being etched
excessively when the silicon oxide film 24 is etched to make the
trenches 25. The trenches 25 can therefore be made with high
precision.
[0189] Thereafter, as shown in FIG. 6, an amorphous silicon film
26A doped with n-type impurities Such as phosphorus is deposited in
the trenches 25 and the silicon oxide film 24 by means of CVD. The
amorphous silicon film 26A is deposited to a small thickness (e.g.,
50 to 60 nm) thereby only covering the inner surfaces of the
trenches 25.
[0190] As shown In FIG. 7, a photoresist film 30 is formed on the
amorphous silicon film 26A by spin-coating. The photoresist film 30
is made of positive-type photoresist (e.g., photoresist mainly made
of novolac resin).
[0191] Then, as FIG. 8 shows, exposure light is applied to the
entire surface of the photoresist film 30. At this time, those
parts of the photoresist film 30, which exist outside the trenches
25 and near the rims thereof. are exposed to light. By contrast,
the other parts provided near the bottoms of the trenches 25 are
not thoroughly exposed to light, because the exposure light
reaching the bottoms of the trenches 25 are weak.
[0192] As shown in FIG. 9, the photoresist film 30 is developed
with alkali aqueous solution or the like. Those parts of the
photoresist film 30, which exist outside the trenches 25 and near
the rims thereof, are removed because they are soluble with the
developing solution. On the other hand, the other parts of the film
30, which are provided near the bottoms of the trenches 25, are not
removed because they have not sufficiently exposed. As a result,
those parts of the amorphous silicon film 26A, that are outside the
trenches 25, are exposed. The other parts of the film 26A, which
exist in the trenches 25, remain covered with the photoresist film
30, except for those parts that are provided near the rims of the
trenches 25.
[0193] Next, as shown in FIG. 10, those parts of the amorphous
silicon film 26A, which are not covered with the photoresist film
30, i.e., the parts outside the trenches 25 and near the rims
thereof, are removed by means of dry etching. The amorphous silicon
film 26A is etched at a rate much higher than the rate at which the
photoresist film 30 may be etched. This prevents those parts of the
amorphous silicon film 26A, which are covered with the photoresist
films 30 Provided in the trenches 25, from being exposed and etched
away.
[0194] It is desired that the amorphous silicon film 26A is
subjected to anisotropic etching such that the upper edges of the
amorphous silicon films 26 in the trenches 25 may recede downwards
a little from the rims of the trenches 25. If the upper edges of
the amorphous silicon films 26 so recede downwardly, an electric
field will scarcely concentrate at the distal ends (upper edges) of
the lower electrodes formed in the trenches 25. It is therefore
possible to decrease the leakage current of the data-storing
capacitive elements. It is desirable to make the upper edges of the
amorphous silicon films 26 recede from the rims of the trenches 25
by a distance (about 50 nm) that is almost equal to the diameter of
silicon grains grown in the surface of the amorphous silicon film
26A. If the upper edges of the amorphous silicon films 26 recede
shorter than this distance, the silicon grains will protrude from
the rims of the trenches 25, and an electric field will concentrate
at the silicon grains. Conversely, if the upper edges of the
amorphous silicon films 26 recede longer than this distance, the
surface of the lower electrode of each capacitive element will
decrease, inevitably reducing the charge the capacitive element can
accumulate.
[0195] Then, as shown in FIG. 11, those parts of the photoresist
film 30 which remain in each trench 25 are removed by means of, for
example, ozone ashing. Specifically, the photoresist film 30 is
oxidized and decomposed with the oxygen radicals generated by
thermally decomposing ozone. This ashing is conducted in such a
manner that the oxygen radicals are generated in great numbers and
for a long time. Many oxygen radicals, so generated, decompose and
remove the photoresist film 30 completely from the amorphous
silicon film 26A provide in each trench 25 (that is relatively
deep).
[0196] During the dry etching of those parts of the amorphous
silicon films 26A, which are outside the trenches 25, the
photoresist film 30 protects the other parts of the amorphous
silicon films 26A, which are provided in the trenches 25.
Thereafter, the photoresist film 30, which is no longer necessary,
is removed by means of ashing. With this method it is possible to
minimize the etching of the other parts of the films 26A which
exist in the trenches 25, in the course of removing those parts of
the amorphous silicon films 26A which are outside the trenches 25.
This is because the amorphous silicon film 26A is etched at a rate
higher than the rate at which the photoresist film 30 may be
etched. Since the photoresist film 30 is removed from the trenches
25 by means of ashing, it is also possible to minimize the etching
of those parts of the silicon oxide film 24 provided outside the
trenches 25.
[0197] Next, as shown in FIG. 12, the amorphous silicon films 26A
that exist in the trenches 25, are processed by forming
polycrystalline silicon films 26 with a rough surface. More
precisely, the surfaces of the amorphous silicon films 26A are
washed with, for example, a hydrofluoric acid-based washing
solution. Then, monosilane (SiH.sub.4) or disilane
(Si.sub.2H.sub.6) is applied to the amorphous silicon film 26A in a
pressure-reduced atmosphere. Silicon grains with an average
diameter of about 50 nm are thereby grown on the surface of each
amorphous silicon film 26A. Thereafter, the substrate 1 is
heat-treated thereby converting the amorphous silicon films 26 to
polycrystalline silicon films 26. Having a rough surface, each
polycrystalline silicon film 26 has a large surface area. This
renders it possible to increase the charges the data-storing
capacitive element can accumulate.
[0198] In the present embodiment, the amorphous silicon films 26A
provided in the trenches 25 have their surfaces roughened after the
photoresist film 30 (protecting the films 26A) is removed by means
of ashing. Therefore, those parts of the photoresist film 30, which
remain in the trenches 25, can be easily removed. If a protection
film is formed on the amorphous silicon films 26A after roughening
the surfaces of the amorphous silicon films 26A and removed after
etching away the amorphous silicon films 26A, the protection film
would likely remain in the depressions made in the surface of each
film 26A and between the projections formed on the surface
thereof.
[0199] As shown in FIG. 13, a tantalum oxide (Ta.sub.2O.sub.5) film
28 is formed on the exposed top of the silicon oxide film 24 and on
the polycrystalline silicon films 26 provided in the trenches 25.
The tantalum oxide film 26, which has a large dielectric constant,
is formed by thermal CVD in which pentaethoxy tantalum and oxygen
are used as source gases. The film 26 has a thickness of about 20
m. Before the tantalum oxide film 26 is formed, the polycrystalline
silicon film 26 is nitrided thereby forming a thin silicon nitride
film on each polycrystalline silicon film 26. In this case, the
thin silicon film reduces the leakage current in the tantalum oxide
film 28. Thereafter, the tantalum oxide film 28 is changed and
crystallized in an oxygen atmosphere at about 800.degree. C. As a
result, a tantalum oxide film 28 is obtained, which has a large
dielectric constant and in which the leakage current is small.
[0200] As shown in FIG. 14, CVD and sputtering are carried out,
depositing a titanium nitride (TiN) film 29 on the tantalum oxide
film 28. As a result, data-storing capacitive elements C are
formed. Each capacitive element C comprises a lower electrode made
of the polycrystalline silicon film 26, a capacitance insulating
film made of the oxide tantalum film 28, and an upper electrode
made of the silicon nitride film 29. The lower electrode (i.e., the
polycrystalline silicon film 26) of each data-storing capacitive
element C is electrically connected to the other of the source and
drain (i.e., n.sup.+-type semiconductor regions 14) of the
cell-selecting MISFET Qs by the plugs 22 and 15 that are formed in
the through hole 21 and the contact hole 13, respectively. Thus,
the memory cells of the DRAM are made, each comprising a
cell-selecting MISFET Qs and a data-storing capacitive element C
connected in series to the MISFET Qs.
[0201] Thereafter, aluminum (Al) wires, each comprising two layers,
are formed on the data-storing capacitive elements C. A passivation
film is formed to cover the aluminum wires. The passivation film is
a two-layer film composed of a silicon oxide film and a silicon
nitride film formed on the silicon oxide film. Neither the aluminum
wires nor the passivation film is illustrated in FIG. 14 and will
not be described in detail.
[0202] In the present embodiment, the lower electrodes formed in
the trenches 25 made in the surface of the silicon oxide film 24 a
made of the polycrystalline silicon film 26. Nonetheless, the
material of the lower electrodes is not limited to polycrystalline
silicon. Nor the materials of the capacitance insulating film and
upper electrode are limited to tantalum oxide and titanium nitride,
respectively. Rather, the lower electrodes and upper electrodes may
be made of tungsten, platinum, ruthenium, iridium or the like. The
capacitance insulating film may be made of a metal oxide having a
large dielectric constant or a ferroelectric material. To be more
specific, the capacitance insulting film may be made of BST, STO,
BaTiO.sub.3 (barium titanate), PbTiO.sub.3 (lead titanate), PZT
(PbZrX Til--XO.sub.3), PLT (PbLaX Til-XO.sub.3), or PUT.
[0203] (Embodiment 2)
[0204] The method of manufacturing a DRAM (Dynamic Random Access
Memory), which is Embodiment 2 of the invention, will be described
with reference to FIGS. 15 to 21. Embodiment 2 is differs from
Embodiment 1 in the way of forming the lower electrodes (i.e., the
polycrystalline silicon films 26) of the data-storing capacitive
elements C.
[0205] First, as shown in FIG. 15, a silicon nitride film 23 and a
thick silicon oxide film 24 are deposited above the silicon oxide
film 19 that covers a bit line BL. Deep trenches 25 are made in the
silicon oxide film 24 and the silicon nitride film 23. And then, an
amorphous silicon film 26A is deposited in the trenches 25 and on
the silicon oxide film 24. These steps of manufacturing the DRAM
are identical to the steps of Embodiment 1, shown in FIGS. 1 to
6.
[0206] Next, as shown in FIG. 16, silicon grains are grown in the
surface of the amorphous silicon film 26A. The substrate 1 is then
heat-treated thus converting the amorphous silicon film 26A to a
polycrystalline silicon film 26. The polycrystalline silicon film
26 has a rough surface, in the trenches 25 and at the upper surface
of the silicon oxide film 24. The surface of the amorphous silicon
film 26A is roughened in the same manner as in Embodiment 1.
[0207] As shown in FIG. 17, a positive-type photoresist film 30 is
formed on the polycrystalline silicon film 26 by means of
spin-coating. Exposure light is applied to the entire photoresist
film 30. As shown in FIG. 18, the photoresist film 30 is developed.
Those parts of the film 30 that have been exposed to light are
removed. The other parts of the film 30, which have not been
exposed to light, remain in the trenches 25.
[0208] Then, as shown in FIG. 19, those parts of the
polycrystalline silicon film 26, which are not covered with the
photoresist film 30 and present near the upper edges of the
trenches 25, are removed by means of dry etching. The
polycrystalline silicon film 26 is etched at a rate much higher
than the rate at which the photoresist film 30 may be etched, as
the amorphous silicon film 26A is etched in Embodiment 1. This
prevents the amorphous silicon film 26A, which is covered with the
photoresist film 30, from being exposed and etched. It is desired
that the amorphous silicon film 26 is subjected to anisotropic
etching, such that the upper edges of the amorphous Silicon films
26 near the Upper edges of the trenches 25 recede downwards a
little from-the rims of the trenches 25.
[0209] The etching of the polycrystalline silicon film 26, whose
surface has been roughened, proceeds along the surface of the film
26. Hence, the parts of the film 26, which are on the rims of the
trenches 25, may remain not etched. These parts of the film 26, if
not etched, will cause short-circuiting between the lower
electrodes formed in the trenches 25. The polycrystalline silicon
film 26 must, therefore, be etched in such conditions that no parts
of the film 26 remain on the upper rims of the trenches 25.
[0210] Next, as shown in FIG. 20, the photoresist film 30 is
removed from the trenches 25 by means of, for example, the
above-mentioned ozone ashing. The polycrystalline silicon films 26
provided in the trenches 25 are thereby exposed. If photoresist
remains among the silicon grains in the surface of each
polycrystalline silicon film 26, it will decrease the charges the
data-storing capacitive element C can accumulate. Therefore, the
photoresist film 30 must be completely and thoroughly in specific
ashing conditions.
[0211] As shown in FIG. 21, a tantalum oxide film 28 is deposited
on the silicon oxide film 24 and on the polycrystalline silicon
films 26 provided in the trenches 25. Heat treatment is then
effected, thereby changing and crystallizing the tantalum oxide
film 28. A titanium nitride film 29 is deposited on the tantalum
oxide film 28. As a result, data-storing capacitive elements C are
formed. Each capacitive element C comprises a lower electrode made
of the polycrystalline silicon film 26, a capacitance insulating
film made of the oxide tantalum film 28, and an upper electrode
made of the titanium nitride film 29. The tantalum Oxide film 28
and the titanium nitride film 29 are formed in the Same way as in
Embodiment 1.
[0212] In Embodiment 2, the photoresist film 30 protects those
parts of the amorphous silicon films 26, which are provided in the
trenches 25, during the dry etching of the other parts of the
amorphous silicon films 26 that are outside the trenches 25.
Thereafter, the photoresist film 30, which is no longer necessary,
is removed by means of ashing. With this method it is possible to
minimize the etching of the other parts of the films 26 which exist
in the trenches 25, in the course of removing those parts of the
amorphous silicon films 26 which are outside the trenches 25. This
is because the amorphous silicon film 26 is etched at a rate higher
than the rate at which the photoresist film 30 may be etched. Since
the photoresist film 30 is removed from the trenches 25 by means of
ashing, it is also possible to minimize the etching of those parts
of the silicon oxide film 24 provided outside the trenches 25.
[0213] (Embodiment 3)
[0214] A method of forming plugs, which is Embodiment 3 of this
invention, will be explained, by describing the sequence of
manufacturing steps, with reference to FIGS. 22 to 33.
[0215] First, as shown in FIG. 22, element-isolating trenches 2 are
made in the major surface of a semiconductor substrate 1 that is
made of, for example, p-type single crystal silicon. Thereafter,
p-type impurities (boron (B)) are ion-implanted into one part of
the substrate 1, thereby forming a p-type well 3 in the major
surface of the substrate 1. Further, n-type impurities (phosphorus
or arsenic) are ion-implanted into another part of the substrate 1,
thereby forming an n-type well 4.
[0216] Next, the CMOS process known in the art is performed,
thereby forming an n-channel MISFET Qn in the p-type well 3 and a
p-channel MISFET Qp in the n-type well 4. The n-channel MISFET Qn
comprises a gate oxide film 6, a gate electrode 7 and n.sup.+-type
semiconductor regions 31 (source and drain). The p-channel MISFET
Qp comprises a gate oxide film 6, a gate electrode 7 and
p.sup.+-type semiconductor regions 32 (source and drain).
[0217] As shown in FIG. 23, a silicon oxide film 33 is deposited by
CVD on the n-channel MISFET Qn and the p-channel MISFET Qp. And
then, the silicon oxide film 33 is subjected to chemical mechanical
polishing to obtain a flat upper surface. The silicon oxide film 33
is then subjected to dry etching using a photoresist film (not
shown) as a mask. As a result, contact holes 34 and 35 are made,
respectively, which expose the n.sup.+-type semiconductor regions
31, and contact holes 36 and 37 are made, respectively, which
expose the p.sup.+-type semiconductor regions 32. At the same time,
a contact hole 38 is made, which exposes the gate electrode 7.
[0218] Then, first-layer wires 41 to 47 are formed above the
silicon oxide film 33. More specifically, the wires 41 to 47 are
formed in the following way. First, a titanium nitride film is
deposited in the contact holes 34 to 38 and on the silicon oxide
film 33 by means of either sputtering or CVD. A tungsten film is
deposited on the titanium nitride film by means of CVD. Thereafter,
dry etching using a photoresist film as a mask is carried out,
thereby patterning both the tungsten film and the titanium nitride
film.
[0219] Plugs may be formed in the contact holes 34 to 38. In this
case, a titanium nitride film is deposited in the contact holes 34
to 38 and on the silicon oxide film 33 by either sputtering or CVD.
A tungsten film is then deposited on the titanium nitride film by
means of CVD. Those parts of the tungsten film and the titanium
nitride film, which are provided on the silicon oxide film 33, are
removed by chemical mechanical polishing. Plugs are thereby formed
in the contact holes 34 to 38. Next, a tungsten film is formed on
the silicon oxide film 33 by sputtering. Dry etching using a
photoresist film as a mask is performed, thereby patterning the
tungsten film. As a result, first-layer wires 41 to 47 are
formed.
[0220] Next, as shown in FIG. 24, a silicon oxide film 48 is
deposited on the silicon oxide film 33 by means of CVD. The silicon
oxide film 48 is subjected to chemical mechanical polishing thus
attaining a flat upper surface. Dry etching using a photoresist
film (not shown) as a mask is conducted on the silicon oxide film
48. Through holes 51 to 55 are thereby made above the first-layer
wires 41, 43, 44, 46 and 47, respectively.
[0221] As shown in FIG. 25, a barrier metal film 56 is formed in
the through holes 51 to 55 and on the silicon oxide film 48. The
barrier metal film 56 is an adhesion layer to increase the adhesion
between the plugs to be formed in the holes 51 to 55 and the
silicon oxide film 48. The film 56 is, for example, a titanium
nitride film deposited by sputtering or CVD.
[0222] As shown in FIG. 26, a positive-type photoresist film 40 is
formed on the barrier metal film 56 by means of spin-coating.
Exposure light is applied to the entire photoresist film 40 as is
illustrated in FIG. 27. At this time, those parts of the
photoresist film 40, which exist outside the through holes 51 to 55
and near the rims thereof, are exposed to light. By contrast, the
other parts provided deep in through holes 51 to 55 are not
thoroughly exposed to light.
[0223] Thereafter, as shown in FIG. 28, the photoresist film 40 is
developed, whereby those parts of the film 40, which have been
exposed to light, are removed. The other parts of the film 40
remain in the through holes 51 to 55. Thereafter, as shown in FIG.
29, those parts of the barrier metal film 56, which lie outside the
through holes 51 to 55, are removed by means of dry etching. The
other parts of the barrier metal film 56 remain in the through
holes 51 to 55, because they are covered with the photoresist film
40. The barrier metal film 56 is etched at a rate much higher than
the rate at which the photoresist film 40 is etched. This prevents
those parts of the film 56, which are covered with the photoresist
films 30 provided in the holes 51 to 55, from being exposed and
etched away.
[0224] Then, as shown in FIG. 30, the photoresist film 30 provided
in the holes, 51 to 55 are removed by means of zone, ashing or the
like. As shown in FIG. 31, tungsten films 57 are grown on the
barrier metal films 56 provided in the through holes 51 to 55,
filling the through holes 51 to 55, by means of selective CVD or
the like. The tungsten films 57 will be processed into plugs, which
electrically connect the first-layer wires 41, 43, 44, 46 and 47 to
the second-layer wires which are to be formed on the silicon oxide
film 48 in the next manufacturing step.
[0225] As shown in FIG. 32, the parts of the tungsten film 57 which
protrude from the through holes 51 to 55 are removed by dry etching
(or chemical mechanical polishing), whereby each tungsten film 57
has its upper surface at the same level as the silicon oxide film
48. Thereafter, as shown in FIG. 33, the second-layer wires 61 to
64 are formed on the silicon oxide film 48. Specifically, the
tungsten film is deposited on the silicon oxide film 48 by
sputtering and patterned by dry etching using a photoresist film as
a mask.
[0226] (Embodiment 4)
[0227] Another method of forming plugs, which is Embodiment 4 of
this invention, will be explained, by describing the sequence of
manufacturing steps, with reference to FIGS. 34 to 39.
[0228] First, as shown in FIG. 34, first-layer wires 41 to 47 are
formed above an n-channel MISFET Qn and a p-channel MISFET Qp in
the same way as in the above Embodiment 3. Further, a silicon oxide
film 48 is deposited to cover the first-layer wires 41 to 47.
Thereafter, the silicon oxide film 48 is subjected to dry etching,
thereby making through holes 51 to 55 in the silicon oxide film
48.
[0229] Next, as shown in FIG. 35, a barrier metal film 56 is formed
in the through holes 51 to 55 and on the silicon oxide film 48. The
barrier metal film 56 will be processed into adhesive layers.
Thereafter, a positive-type photoresist film 40 is formed above the
barrier metal film 56 by means of spin coating. At this time, those
parts of the photoresist film 40, which exist outside the through
holes 51 to 55 and near the rims thereof, are exposed to light. By
contrast, the other parts provided deep in through holes 51 to 55
are not thoroughly exposed to light.
[0230] Further, the photoresist film 40 is developed, whereby those
parts of the film 40 which have been exposed to light are removed,
while leaving the other parts of the film 40 in the through holes
51 to 55. Thereafter, as shown in FIG. 36, those parts of the
barrier metal film 56 which are not covered with the photoresist
film 40 are removed by means of dry etching. Those parts of the
photoresist film 40, which remain in the through holes 51 to 55,
are removed by means of zone ashing or the like.
[0231] As shown in FIG. 37, a shield layer 65 is formed in the
through holes 51 to 55 and on the silicon oxide film 48. The shield
layer 65 is provided as an under layer for the plugs that will be
formed in the through holes 51 to 55 in the next manufacturing
step. It is formed by depositing copper (Cu) by, for example,
sputtering.
[0232] Then, as shown in FIG. 38, a copper film 66 is deposited
above the surface of the shield layer 65 by means of electroless
plating or vapor deposition. Thereafter, as shown in FIG. 39, those
parts of the copper film 66 and the shield layer 65, which lie
outside the through holes 51 to 55, are removed by chemical
mechanical polishing. Plugs 66A to 66E, each composed of a copper
film 66 and a shield layer 65, are thereby formed in the through
holes 51 to 55.
[0233] Copper tends to diffuse into silicon oxide films and cannot
firmly adhere to silicon oxide films. Therefore, it is generally
necessary to provide a barrier metal film between a copper film and
a silicon oxide film, in order to form copper plugs or copper wires
in the through holes made in the silicon oxide film. The barrier
metal film should be, for example, a titanium nitride film, which
inhibits diffusion of copper and firmly adheres to the silicon
oxide film.
[0234] In forming copper plugs or copper wires by means of chemical
mechanical polishing, it is therefore necessary to polish and
remove the copper film or copper shield layer from those parts of
the silicon oxide film which lie outside trenches or through holes.
Further, it is also necessary to polish and remove the barrier
metal film provided beneath the copper film or copper shield layer.
Obviously, the chemical mechanical polishing is inevitably
complicated.
[0235] In the method of forming copper plugs according to the
present embodiment, those parts of the barrier metal film 56 which
lie outside the through holes 51 to 55 are removed by dry etching
before the chemical mechanical polishing is carried out.
Thereafter, those parts of the copper film 66 and the shield layer
65 made of copper, too, which lie outside the through holes 51 to
55, are polished and removed. Hence, the chemical mechanical
polishing is simple in the present embodiment. The barrier metal
film that prevents diffusion of copper may be made of material
other than titanium nitride. It can be a tantalum nitride (TaN)
film, a tungsten nitride (WN) film or the like.
[0236] (Embodiment 5)
[0237] A method of forming copper wires, which is Embodiment 5 of
the present invention, will be explained, by describing the
sequence of manufacturing steps, with reference to FIGS. 40 to 49.
In this method, copper wires are buried in dual-damascene
fashion.
[0238] First, as shown in FIG. 40, an n-channel MISFET Qn and a
p-channel MISFET Qp are made in the same way as in the above
Embodiments 3 and 4. Then, first-layer wires 41 to 47 are formed
above the n-channel MISFET Qn and the p-channel MISFET Qp. As shown
in FIG. 41, a silicon oxide film 68 is deposited by CVD, to cover
the first-layer wires 41 to 47.
[0239] Next, as shown in FIG. 42, the silicon oxide film 68 is
subjected to dry etching using a photoresist film (not shown),
thereby making through holes 71 to 75 in the silicon oxide film 68
above the wires 41, 43, 44, 46 and 47. Thereafter, as shown in FIG.
43, a positive-type photoresist film 50 is formed in the through
holes 71 to 75 and above the silicon oxide film 68 by means of spin
coating.
[0240] As FIG. 44 shows, exposure light is applied to selected
parts of the positive-type photoresist film 50, through a photomask
49. At this time, those parts of the photoresist film 50, which
exist outside the through holes 71 to 75 and near the rims thereof,
are exposed to light. By contrast, the other parts provided deep in
through holes 71 to 75 are not thoroughly exposed to light.
[0241] Then, as shown in FIG. 45, the photoresist film 50 is
developed, whereby those parts of the film 50 which have been
exposed to light are removed, while leaving the other parts of the
film 50, not exposed to light, in the through holes 71 to 75. The
parts of the photoresist film 50, thus left, fill the lower halves
of the through holes 70 to 75.
[0242] As shown in FIG. 46, those parts of the silicon oxide film
68, which lie in wire-forming regions, are removed by dry etching
using the photoresist film 50 as a mask. Wire trenches 76 to 79 are
thereby formed in the silicon oxide film 68. The silicon oxide film
68 is etched at a rate much higher than the rate at which the
photoresist film 50 may be etched. Hence, the etching of the film
68 stops at the time the photoresist film 50 in each through hole
is exposed at the bottom of the wire trenches 76 to 79.
[0243] As is shown in FIG. 47, the photoresist films 50 remaining
in the through holes 71 to 75 are removed by means of ashing or the
like. Then, as shown in FIG. 48, a barrier metal film 56, which
will serve as an adhesive layer, is formed in the wire trenches 76
to 79 and in the through holes 71 to 75 located below the wire
trenches 76 to 79. Thereafter, a copper film 86 is deposited above
the barrier metal film 56. The barrier metal film 56 is a titanium
film deposited by, for example, CVD. The copper film 86 is
deposited by means of sputtering or the like.
[0244] Further, as shown in FIG. 49, those parts of the copper film
86 which lie outside the wire trenches 76 to 79, and those parts of
the barrier metal film 56, which lie outside the trenches 76 to 79,
are removed by means of chemical mechanical polishing. Buried
copper wires 86A to 86D are thereby formed such that each is in one
wire trench and one through hole is located below each wire
trench.
[0245] In a dual-damascene process, wires trenches and through
holes are made in a silicon oxide film and wires are simultaneously
buried in the wire trenches and the through holes located below the
trenches. To make the trenches and through the holes, an insulating
film (e.g., a silicon nitride film) serving as an etching stopper
is formed at the interface between the trenches and the through
holes. The level where the insulating film is provided determines
the depth of the wire trenches. More specifically, the trenches are
made in the following way.
[0246] At first, a first silicon nitride film is formed on a
silicon oxide film. Then, a second silicon oxide film is deposited
on the silicon nitride film. Thereafter, dry etching is performed
on the second silicon oxide film, the silicon nitride film and the
second silicon oxide film, thereby making through holes in these
films. Next, the second silicon oxide film is subjected to dry
etching using the silicon nitride film as a mask. As a result, the
wire trenches are made in the second silicon oxide film. The
through holes remain in the silicon nitride film and the first
silicon oxide film both of which are located below the second
silicon oxide film.
[0247] The dual-damascene process is, however, complicated, because
the three insulating films (i.e., the first silicon oxide film, the
silicon nitride film and the second silicon oxide film) must be
formed in order to form one layer of buried wires. Further, if
copper wires a formed on the insulating film and one of the
insulating films contains silicon nitride having a larger
dielectric constant than silicon oxide film, the parasitic
capacitance of the insulating films will increase.
[0248] By contrast, in the present embodiment, the wire trenches 76
to 79 are made by utilizing the photoresist films buried in the
through holes 71 to 75 as etching stoppers. The through holes 71 to
75 and the wire trenches 76 to 79 are made in a single silicon
oxide film 68. This shortens the time required to perform the
dual-damascene process. In addition, the parasitic capacitance of
the copper buried wires 86A to 86E decreases because an insulating
film (i.e., silicon nitride film) with a large dielectric constant
s not used as an etching stopper.
[0249] (Embodiment 6)
[0250] A method of making self-aligned contact holes, which is
Embodiment 6 of the invention, will be explained, by describing the
sequence of manufacturing steps, with reference to FIGS. 50 to
58.
[0251] First, as FIG. 50 shows, a p-type well 3 and an n-type well
4 are formed in the major surface of a substrate 1.
Element-isolating trenches 2 are made in the surfaces of the wells
3 and 4. A gate insulating film 6 is formed in the trenches 2 and
on the wells 3 and 4. Silicon oxide films 5 are formed, to fill the
trenches 2. Thereafter, gate electrodes 7 are formed in the
following manner. For example, a polycrystalline silicon film doped
with n-type impurities such as phosphorus is deposited on the
substrate 1 by CVD. Then, a tungsten nitride film is deposited on
the polycrystalline silicon film by sputtering. Further, a tungsten
film is also deposited on the tungsten nitride film by sputtering.
A silicon nitride film 8 is deposited on the tungsten film by means
of CVD. Thereafter, the polycrystalline silicon film, the tungsten
nitride film, the tungsten film and the silicon nitride film are
patterned by dry etching using a photoresist film as a mask. Each
silicon nitride film 8 on one gate electrode 7 is an insulating
film that is required to form a contact hole (later described) in
self-alignment with the gate electrode 7.
[0252] Next, as shown in FIG. 51, n-type impurities such as
phosphorus are ion-implanted into the p-type well 3, forming
n.sup.--type semiconductor regions 9. Into the n-type well region
4, p-type impurities (boron) are ion-implanted, thus forming
p.sup.--type semiconductor regions 20. Then, a silicon nitride film
27 is deposited by CVD to cover the gate electrodes 7. Further, a
silicon oxide film 11 is deposited on the silicon oxide film 27.
The silicon oxide film 11 is subjected to chemical mechanical
polishing to attain a flat surface. The silicon nitride film 27 is
an insulating film required to make contact holes (later described)
in self-alignment with the element-isolating trenches 2.
[0253] In order to make contact holes in self-alignment with the
gate electrodes 7 and the element-isolating trenches 2, the silicon
nitride films 8 are provided on the gate electrodes 7,
respectively, and the silicon nitride film 27 is provided, to close
the element-isolating trenches 2. Thus, a single-layer film, i.e.,
the silicon nitride film 27, covers the diffusion layers (i.e., the
n.sup.--type semiconductor regions 9 and the p-type semiconductor
regions 20), whereas a two-layer film composed of the silicon
nitride films 8 and 27 covers the gate electrodes 7.
[0254] As shown in FIG. 52, the silicon oxide film 11 provided
above the diffusion layers (n.sup.--type semiconductor regions 9
and p.sup.--type semiconductor regions 20) is subjected to dry
etching using a photoresist film (not shown) as a mask. At the same
time, those parts of the silicon oxide film 11 which lie above the
gate electrodes 7 are dry-etched at a rate higher than the rate at
which the silicon nitride film 27 may be etched. This prevents the
silicon nitride film 27 lying beneath the silicon oxide film 11
from being removed.
[0255] If the silicon oxide film 11 is dry-etched by using the
silicon nitride film 27 lying beneath the film 11 as a mask, a
single-layer film, i.e., the silicon nitride film 27, will remain
on the diffusion layers (the n.sup.--type semiconductor regions 9
and the p.sup.--type semiconductor regions 20), and a two-layer
film composed of the silicon nitride films 8 and 27 will remain on
each gate electrodes 7. The silicon oxide film 5, lying partly on
the substrate 1 and partly in the element-isolating trenches 2,
will be etched excessively if the silicon nitride films 8 and 27
provided on each gate electrode 7 are dry-etched in the next step,
together with the silicon nitride film 27 provided on the diffusion
layers (the n.sup.--type semiconductor regions 9 and the
p.sup.--type semiconductor regions 20), in order to make contact
holes that reach these diffusion layers. Consequently, the leakage
current in each element will increase thereby deteriorating the
characteristics of the element. It is necessary to prevent
excessive etching of the substrate 1 and the silicon oxide film 5.
To this end, the silicon nitride film 8 that lies above each gate
electrode 7 and that part of the silicon nitride film 27 which lies
on the film 8 need to be etched in one step, and those parts of the
silicon nitride film 27 which lie on the diffusion layers
(n.sup.--type semiconductor regions 9 and p.sup.--type
semiconductor regions 20) needs to be etched in another step.
Hence, it would be necessary to use two photomasks.
[0256] Then, in the present embodiment, the silicon oxide film 11
is dry-etched by using the silicon nitride film 27, which lies
beneath the silicon oxide film 11, as etching stopper. Thereafter,
as shown in FIG. 53, a positive-type photoresist film 60 is
spin-coated on the silicon oxide film 11. Exposure light is applied
to the entire surface of the photoresist film 60. At this time,
those parts of the photoresist film 60 which lie above the gate
electrode 7 are thin and therefore thoroughly affected by the
light. Those parts of the photoresist film 60 which lie above the
diffusion layers (the n.sup.--type semiconductor regions 9 and the
p.sup.--type semiconductor regions 20) are thick and affected by
the light at only the upper part.
[0257] Next, as shown in FIG. 54, the photoresist film 60 is
developed, whereby those parts exposed to light are removed. At
this time, those parts of the silicon nitride film 27, which lie
above the gate electrodes 7 and which are indicated by arrows, are
thereby exposed. On the other hand, the other parts of the film 27,
which lie on the diffusion layers (the n.sup.--type semiconductor
regions 9 and the p.sup.--type semiconductor regions 20), are not
exposed. This is because the parts of the photoresist film 60,
which have not been exposed to light, remain above the diffusion
layers.
[0258] As shown in FIG. 55, those parts of the silicon nitride film
27 and 8, which lie above the gate electrode 7 is subjected to dry
etching using, as a mask, the those parts of the photoresist film
60 which lie above the diffusion layers (the n.sup.--type
semiconductor regions 9 and the p.sup.--type semiconductor regions
20). The silicon nitride films 27 and 8 are etched at a rate much
higher than the rate at which the silicon oxide film 11 may be
etched. Therefore, the etching is stopped at the time when the
silicon nitride film 8 (covering the gate electrode 7) is etched to
almost the same thickness as that of the silicon nitride film 27
covering the diffusion layers (i.e., the n.sup.--type semiconductor
regions 9 and the p.sup.--type semiconductor regions 20).
[0259] As shown in FIG. 56, those parts of the photoresist film 60,
which remain above the diffusion layers (the n-type semiconductor
regions 9 and the p.sup.--type semiconductor regions 20), are
removed by means of ozone ashing. Then, as shown in FIG. 57, those
parts of the silicon nitride films 27 which covers the diffusion
layers (the n.sup.--type semiconductor regions 9 and the
p.sup.--type semiconductor regions 20) are removed by dry etching.
And, that part of the silicon nitride film 8 which covers the gate
electrode 7 is also removed by dry etching. As a result, contact
holes 91 and 92 are thereby made, thereby exposing the n-type
semiconductor regions 9, and contact holes 93 and 94 are made
thereby exposing the p.sup.--type semiconductor regions 20, and a
contact hole 95 is made thereby exposing the gate electrode 7. The
silicon nitride films 8 and 27 are subjected to anisotropic
etching, thereby leaving silicon nitride films 27 on the sides of
every gate electrode 7.
[0260] The silicon nitride film 8 and 27 are etched after those
parts of these films which lie above the diffusion layers (the
n.sup.--type semiconductor regions 9 and the p.sup.--type
semiconductor regions 20), and the gate electrode 7 have been
etched to almost the same thickness. Hence the silicon oxide film 5
provided in the element-isolating trenches 2 or the substrate 1
would not be etched excessively even if the silicon nitride films 8
and 27 were etched at the same time.
[0261] In Embodiment 6, the contact hole 95, exposing the gate
electrode 7 can be made at the same time the contact holes 91 to 94
are made in self-alignment with respect to the other gate
electrodes 7 and the element-isolating trenches 2. Therefore, it
suffices to use only one photomask to make the contact holes 91 to
95.
[0262] Next, as shown in FIG. 58, n-type impurities (phosphorus or
arsenic) are ion-implanted into the p-type well 3 through the
contact holes 91 and 92, thereby forming n.sup.+-type semiconductor
regions (source and drain) 31, whereby n-channel MISFETs Qn are
formed. Further, p-type impurities (boron) are ion-implanted into
the n-type well 4 through the contact holes 93 and 94, thereby
forming p.sup.+-type semiconductor regions (source and drain) 32,
whereby p-channel MISFETs Qp are formed. Thereafter, first-layer
wires 41 to 47 are formed on the silicon oxide film 11 in the same
way as in Embodiments 3 to 5.
[0263] The invention has been described, with reference to some
embodiments. The present invention is not limited to these
embodiments. Rather, various changes and modification can be made
without departing the spirit and scope of the invention.
[0264] Some of the various advantages achieved by this invention
are as follows:
[0265] (1) The invention enhances the reliability and manufacturing
yield of a DRAM having data-storing capacitive elements, each
having its lower electrode formed in a trench made in an insulating
film.
[0266] (2) The invention makes it possible to form, with a high
yield, conductive layers in the trenches Or through holes made in
an insulating film.
[0267] (3) The invention renders it possible to form conductive
layers in the trenches or through holes made in an insulating film,
by performing few manufacturing steps.
* * * * *