U.S. patent application number 09/746595 was filed with the patent office on 2002-06-27 for heat removal system.
Invention is credited to Lo, Wei Ta.
Application Number | 20020080581 09/746595 |
Document ID | / |
Family ID | 25001508 |
Filed Date | 2002-06-27 |
United States Patent
Application |
20020080581 |
Kind Code |
A1 |
Lo, Wei Ta |
June 27, 2002 |
HEAT REMOVAL SYSTEM
Abstract
A heat removal system of the present invention includes a fan
(30) of a power supply (20), a heat sink (50) mounted to the fan,
and a heat pipe (60) connecting the heat sink to a CPU (24). The
heat sink includes a cylindrical base (52) and a plurality of
radial fins (54) around the base. Four bolts (40) attach the heat
sink and the fan to the power supply. A central bore (58) is
defined in the base of the heat sink, for receiving one end of the
heat pipe. The other end of the heat pipe is attached to a top
surface of the CPU. Heat generated by the CPU is thereby conducted
to the heat sink via the heat pipe, and then dissipated outside of
a computer enclosure by forced convection of the fan.
Inventors: |
Lo, Wei Ta; (Shenzhen,
CN) |
Correspondence
Address: |
ANDREW C. CHENG
FOXCONN INTERNATIONAL, INC.
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Family ID: |
25001508 |
Appl. No.: |
09/746595 |
Filed: |
December 21, 2000 |
Current U.S.
Class: |
361/700 |
Current CPC
Class: |
G06F 1/20 20130101 |
Class at
Publication: |
361/700 |
International
Class: |
H05K 007/20 |
Claims
1. A heat removal system adapted for removing heat from an
electronic device, comprising: a fan adapted to be mounted to an
inner surface of a power supply; a heat sink mounted to the fan;
and a heat pipe connected to the heat sink and adapted to connect
to the electronic device.
2. The heat removal system as described in claim 1, wherein the
heat sink comprises a base and a plurality of fins around the
base.
3. The heat removal system as described in claim 1, wherein the fan
defines at least one through aperture therethrough, the heat sink
defines at least one through hole therethrough corresponding to the
at least one through aperture, and at least one bolt is received in
the at least one through aperture and at least one through hole to
engage the heat sink and the fan to the power supply.
4. The heat removal system as described in claim 1, wherein a bore
is defined in the heat sink for receiving one end of the heat
pipe.
5. The heat removal system as described in claim 4, wherein the
other end of the heat pipe is attached to the electronic device.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat removal system of a
computer, and in particular to a heat removal system in which a CPU
and a power supply share a fan.
[0003] 2. Related Art
[0004] Many electronic devices, such as Central Processing Units
(CPUs), generate large amounts of heat during operation. This
deteriorates their operational stability. Typically, a heat sink is
attached to an outer surface of the CPU to facilitate removal of
heat therefrom. A fan is often attached to the heat sink to provide
forced convection. However, contemporary CPUs are performing tasks
faster and faster, thus generating more and more heat. Heat sinks
and fans are being made larger and larger along with this trend.
The weights of such heat sinks and fans are increasing accordingly.
A clip which fastens a heavy heat sink to a CPU socket mounted on a
mother board has limited strength. Thus when a computer sustains
shock during normal operation, the heat sink may be dislodged from
the CPU. Even if the clip has sufficient strength, the socket may
break away from the mother board under the weight of the heat
sink.
[0005] Therefore, an improved heat removal system which overcomes
the above-mentioned problems is desired.
SUMMARY OF THE INVENTION
[0006] Accordingly, an object of the present invention is to
provide a heat removal system which does not require attachment of
a heat sink directly onto a heat-generating electronic device.
[0007] Another object of the present invention is to provide a heat
removal system which allows a fan to cool more than one
heat-generating electronic device.
[0008] A further object of the present invention is to provide a
heat removal system which efficiently removes heat from electronic
devices.
[0009] To achieve the above-mentioned objects, a heat removal
system of the present invention comprises a fan of a power supply,
a heat sink mounted to the fan, and a heat pipe connecting the heat
sink to a CPU. The heat sink comprises a cylindrical base and a
plurality of radial fins around the base. Four bolts attach the
heat sink and the fan to the power supply. A central bore is
defined in the base of the heat sink, for receiving one end of the
heat pipe. The other end of the heat pipe is attached to a top
surface of the CPU. Heat generated by the CPU is thereby conducted
to the heat sink via the heat pipe, and then dissipated outside of
a computer enclosure by forced convection of the fan.
[0010] Other objects, advantages and novel features of the present
invention will be drawn from the following detailed description of
a preferred embodiment of the present invention with the attached
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is an exploded view of a power supply with a fan, a
heat sink, and a heat pipe in accordance with the present
invention, together with a computer enclosure; and
[0012] FIG. 2 is an assembled view of FIG. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0013] Referring to FIG. 1, a heat removal system of the present
invention includes a fan 30 of a power supply 20, a heat sink 50,
and a heat pipe 60.
[0014] The power supply 20 is attached to a rear panel 10 of a
computer enclosure 1. An outflow opening (not labeled) of the power
supply 20 communicates with the rear panel 10, for allowing air to
pass out of the power supply into airspace outside the computer
enclosure 1. The power supply 20 also defines an inflow opening
(not labeled) opposite the outflow opening. The fan 30 is attached
to an inner face of the power supply 20, such that the inflow
opening (not labeled) of the power supply 20 communicates with the
fan 30. The fan 30 defines four through apertures 32 at respective
comers thereof. The heat sink 50 includes a cylindrical base 52 and
a plurality of fins 54 extending radially from a circumferential
surface of the base 52. Four sleeves 55 are formed at respective
ends of four fins 54, corresponding to the four through apertures
32 of the fan 30. A through hole 56 is defined in each sleeve 55. A
central bore 58 is defined in the base 52 of the heat sink 50.
Bolts 40 secure the heat sink 50 to the fan 30.
[0015] The computer enclosure also has a side panel 12. A CPU
socket 26 is attached to an inner surface of the side panel 12. A
CPU 24 is mounted to the socket 26.
[0016] Referring also to FIG. 2, in assembly, four bolts 40 are
extended into the respective through holes 56 of the heat sink 50
and the respective through apertures 32 of the fan 30 to engage
with the power supply 20. Thus the heat sink 50 is securely
attached to the fan 30. One end of the heat pipe 60 is inserted
into the central bore 58 of the heat sink 50, and is retained in
the central bore 58 by conventional means such as interferential
engagement. The other end of the heat pipe 60 is attached to a top
surface of the CPU 24 by conventional means such as using heat
conductive glue. Thus heat generated by the CPU 24 is transmitted
to the heat sink 30 via the heat pipe 60. The fan 30 of the power
supply 20 is preferably high-powered. The fan 30 creates forced
convection, whereby heat is removed from the heat sink 50 to
outside of the computer enclosure 1.
[0017] Alternative means can be employed for engaging the end of
the heat pipe 60 with the CPU 24. One such alternative means
includes welding or gluing a copper plate to the end of the heat
pipe 60. The copper plate is then mounted to the top surface of the
CPU 24 by using clips or glue.
[0018] It is understood that the invention may be embodied in other
forms without departing from the spirit thereof. Thus, the present
example and embodiment are to be considered in all respects
illustrative and not restrictive, and the invention is not to be
limited to the details given herein.
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