loadpatents
name:-0.0097141265869141
name:-0.018526077270508
name:-0.00045609474182129
Lo; Wei-Ta Patent Filings

Lo; Wei-Ta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lo; Wei-Ta.The latest application filed is for "fastener for heat sink".

Company Profile
0.15.9
  • Lo; Wei-Ta - Tu-chen TW
  • Lo; Wei-Ta - Tu-Cheng TW
  • Lo; Wei Ta - Taipei TW
  • Lo; Wei-Ta - Miou-Li TW
  • Lo, Wei Ta - Shenzhen CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat sink with heat pipes
Grant 7,401,642 - Lo July 22, 2
2008-07-22
Fastener for heat sink
Grant 7,218,525 - Lo , et al. May 15, 2
2007-05-15
Fastener for heat sink
App 20050254217 - Lo, Wei-Ta ;   et al.
2005-11-17
Heat sink with heat pipes
App 20050133199 - Lo, Wei-Ta
2005-06-23
Heat sink clip with interchangeable operating body
Grant 6,813,155 - Lo November 2, 2
2004-11-02
Heat dissipation device including heat sink and heat pipes
App 20040134642 - Lo, Wei-Ta
2004-07-15
Heat sink clip with interchangeable operating body
App 20040062008 - Lo, Wei-Ta
2004-04-01
Method for making heat dissipation device
Grant 6,665,934 - Lo December 23, 2
2003-12-23
Clip for heat sink
Grant 6,480,384 - Lo November 12, 2
2002-11-12
Ready-to-mount heat dissipating assembly
Grant 6,459,583 - Lo October 1, 2
2002-10-01
Method for making heat dissipation device
App 20020095788 - Lo, Wei Ta
2002-07-25
Heat Sink Assembly
App 20020088607 - Lo, Wei Ta
2002-07-11
Heat Removal System
App 20020080581 - Lo, Wei Ta
2002-06-27
Heat dissipation assembly
Grant 6,373,701 - Lo April 16, 2
2002-04-16
Heat sink clip
Grant 6,370,024 - Lo April 9, 2
2002-04-09
Clip for heat sink
App 20020036891 - Lo, Wei-Ta
2002-03-28
Heat sink clip
Grant 6,341,065 - Lo January 22, 2
2002-01-22
Heat sink assembly for an electrical socket
Grant 6,317,323 - Lee , et al. November 13, 2
2001-11-13
Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket
App 20010030853 - Lee, Chao-Yang ;   et al.
2001-10-18
Clip for securing heat sink to electronic device package
Grant 6,304,452 - Lo October 16, 2
2001-10-16
Locking device for CPU packages of different thicknesses
Grant 6,243,266 - Lo June 5, 2
2001-06-05
Heat sink module with heat dissipating device
Grant 6,145,586 - Lo November 14, 2
2000-11-14
Clip for retaining a heat sink on a chip
Grant 6,118,661 - Lo September 12, 2
2000-09-12
Device for fastening a heat sink to a heat-generating electrical component
Grant 6,111,752 - Huang , et al. August 29, 2
2000-08-29

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