U.S. patent application number 09/884348 was filed with the patent office on 2001-10-18 for heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket.
Invention is credited to Lee, Chao-Yang, Lo, Wei-Ta, Sun, Chung-Yung, Tseng, Chao Kun.
Application Number | 20010030853 09/884348 |
Document ID | / |
Family ID | 23884150 |
Filed Date | 2001-10-18 |
United States Patent
Application |
20010030853 |
Kind Code |
A1 |
Lee, Chao-Yang ; et
al. |
October 18, 2001 |
Heat sink assembly for dissipating heat of an electronic package
mounted on an electrical socket
Abstract
A heat sink assembly for an electrical socket of the present
invention comprises a heat sink and a latching member latching with
a pair of lugs on the socket. The heat sink comprises a base plate
and a plurality of fins projecting upward therefrom. A receiving
channel is integrally formed between the fins in the base plate for
receiving the latching member. A pair of positioning tabs depends
downward from a bottom surface of the base plate to tightly engage
in a slit between the electric socket and a CPU mounted thereon for
positioning the heat sink assembly on the CPU and keeping it from
moving along the CPU. The receiving channel and the fins extend in
a first direction while the tabs extend in a second direction
vertical to the first direction.
Inventors: |
Lee, Chao-Yang; (Taipei,
TW) ; Tseng, Chao Kun; (Tu-Chen, TW) ; Sun,
Chung-Yung; (Kee-Lung, TW) ; Lo, Wei-Ta;
(Miou-Li, TW) |
Correspondence
Address: |
WEI TE CHUNG
FOXCONN INTERNATIONAL, INC.
1650 MEMOREX DRIVE
SANTA CLARA
CA
95050
US
|
Family ID: |
23884150 |
Appl. No.: |
09/884348 |
Filed: |
June 18, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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09884348 |
Jun 18, 2001 |
|
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09474578 |
Dec 29, 1999 |
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Current U.S.
Class: |
361/704 ;
257/E23.086; 361/703 |
Current CPC
Class: |
H01L 2924/00 20130101;
H01L 23/4093 20130101; Y10T 24/44026 20150115; H01L 2924/0002
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
361/704 ;
361/703 |
International
Class: |
H05K 007/20 |
Claims
What is claimed is:
1. A heat sink assembly comprising: a heat sink having a base
plate, a plurality of fins on the base plate, a latching member
receiving channel formed between the fins, wherein both the fins
and the channel extend in a first direction, and at least a tab
formed on an underside of the base plate opposite to said fins and
extending in a second direction perpendicular to the first
direction; and a latching member received in the channel.
2. The heat sink assembly as claimed in claim 1, wherein a recess
is defined in a side of the base plate of the heat sink adjacent to
the channel.
3. The heat sink assembly as claimed in claim 2, wherein the heat
sink has two tabs located at two sides of the recess.
4. The heat sink assembly as claimed in claim 1, wherein the fins
are formed by extrusion, while the tabs are formed by stamping.
5. An electrical assembly, comprising: an electrical socket, the
socket having two lugs formed on two opposite lateral sides
thereof, respectively; an electronic package mounted on the socket;
a heat sink mounted on the electronic package, the heat sink having
a base plate, a plurality of fins on the base plate, a latching
member receiving channel formed between the fins, wherein both the
fins and the channel extend in a lateral direction through the two
lateral sides of the electrical socket, and at least a tab is
formed on an undersurface of the base plate opposite to said fins,
the tab extending in a direction perpendicular to the lateral
direction and fitting in a slit between the electronic package and
the socket; and a latching member received in the channel, the
latching member having two depending latching arms respectively
engaging with the lugs.
6. The electrical assembly as claimed in claim 5 further comprising
an electrical fan located neighboring one of the lateral sides of
the electrical socket, wherein when the fan is activated, an air
flows through the heat sink along the lateral direction.
7. A method for forming a heat sink, comprising: (a) providing an
aluminum mass; (b) subjecting the aluminum to an extruding
operation to simultaneously form a base plate, a plurality of fins
on a top face of the base plate, and a latching member receiving
channel between the fins, in which the fins and the channel extend
in a first direction and the receiving channel is used for
receiving a latching member for fastening the heat sink to an
electrical socket; and (c) subjecting the product obtained by step
(b) to a pressing operation to form at least one tab on a bottom
face of the base plate, the tab extending in a second direction
vertical to the first direction.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation-in-part (C-IP)
application of my copending U.S. patent application Ser. No.
09/474,578, filed on Dec. 29, 1999, entitled Heat Sink Assembly for
An Electrical Socket and whose disclosure is incorporated by
reference herein.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a heat sink assembly for
dissipating heat of an electronic package mounted on an electrical
socket, and particularly to a heat sink assembly which is
effectively positioned on the socket, has a low cost and can
improve the heat dissipating efficiency.
[0004] 2. Description of Related Art
[0005] Today's computer technology transmits information at higher
and higher rates. As transmission speed increases, the heat
produced by the internal electronic elements increases
correspondingly. This heat must be disipated efficiently, otherwise
the rising temperature in the computer will cause a system
malfunction.
[0006] Prior art Taiwan Patents Nos. 85209788, 84218687 and
83217100 disclose heat sink assemblies having a heat sink body in
contact with an electronic element. The heat sink body is formed
from extruded aluminum and comprises a bottom glazed surface
abutting the electronic element to absorb heat therefrom and a
plurality of fins projecting upward from a base to dissipate the
heat. A latching member closely binds the heat sink to the
electronic element by latching to a pair of lugs formed on a socket
mounting the electronic element. However, a channel must be cut in
the heat sink body for receiving the latching member, which
complicates the manufacture process. Additionally, the smooth,
glazed surface of the heat sink abuts the electronic element, so
the heat sink body is difficult to position accurately and may
easily slide along the electric element after assembly. Finally,
sometimes there is a need to mount an additional fan beside the
socket and the heat sink to enhance the heat dissipating
effectiveness of the heat sink; however, the extending direction of
the fins of the heat sink in the prior art is transverse to the air
flowing direction of he additional fan, resulting in an unfavorable
cooling effectiveness. Hence, an improved electrical connector is
required to overcome the disadvantages of the prior art.
SUMMARY OF THE INVENTION
[0007] An essential object of the present invention is to provide a
heat sink assembly which can be effectively positioned on a socket
on which an electronic package (for example, a CPU) to be cooled is
mounted. The heat sink assembly has a low cost, and can improve the
heat dissipating effectiveness for the electronic package.
[0008] A heat sink assembly of the present invention for cooling an
electronic package mounted on an electrical socket comprises a heat
sink and a latching member. The heat sink comprises a base plate
and a plurality of fins projecting upward from a top surface
thereof. A receiving channel is integrally formed between the
plurality of fins for receiving the latching member. The latching
member is elongated, and has two latching ends for respectively
engaging with two lugs of the socket, respectively. The two lugs
are formed on two opposite lateral sides of the socket,
respectively. The base plate defines an enlarged recess adjacent to
receiving channel to prevent interference with the normal operation
of the electric socket. A pair of positioning tabs depends downward
from a bottom surface of the base plate for positioning the heat
sink on a CPU mounted on the electric socket and keeping it from
moving along the CPU. If necessary, an electrical fan is mounted
beside the socket neighboring a corresponding lug of the socket,
whereby when the fan is activated, airflow is generated to
laterally flow through the heat sink. The fins together with the
latching member receiving channel are integrally formed during
extruding the heat sink, in which the fins and the channel are
extended along the lateral direction when the heat sink is mounted
on the socket. The positioning tabs are formed by subjecting the
heat sink to a pressing operation. The tabs extend in a direction
vertical to the lateral direction.
[0009] Other objects, advantages and novel features of the
invention will become more apparent from the following detailed
description of the present embodiment when taken in conjunction
with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a front view of a heat sink assembly of the
present invention with a CPU mounted on an electrical socket;
[0011] FIG. 2 is a right side view of a heat sink assembly of the
present invention;
[0012] FIG. 3 is bottom view of a heat sink assembly of the present
invention; and
[0013] FIG. 4 is a top view showing the heat sink assembly fastened
to the electrical socket which is mounted on a printed circuit
board.
DETAILED DESCRIPTION OF THE INVENTION
[0014] Reference will now be made to the drawing figures to
describe the present invention in detail.
[0015] Referring to FIGS. 1 to 4, a heat sink assembly for an
electrical socket of the present invention comprises a heat sink 10
and a latching member 20. The heat sink 10 is formed by extruding
aluminum and comprises a base plate 12 and a plurality of fins 14
integral with the base plate 12 and projecting upward from a top
surface thereof. A receiving channel 15 is integrally formed
between the plurality of fins 14 in the base plate 12 when the heat
sink 10 is extruded, for receiving the latching member 20, thereby
simplifying the manufacture of the heat sink with respect to the
prior art, which formed a receiving channel using a cutting means.
In other words, the receiving channel 15 of the present invention
is formed extending along the extruding direction of the heat sink
10 so that the receiving channel 15 can be simultaneously formed
when the heat sink 10 is extruded. The fins 14 are extended in the
same direction as that of the receiving channel 15. The base plate
12 comprises a bottom glazed surface 17 for abutting a CPU 30 to
absorb the heat produced by the CPU 30. As best seen in FIG. 3, an
enlarged recess 16 is defined at one side of the base plate 12
adjacent to the receiving channel 15 to prevent interference with
the normal operation of an electrical socket 40 to which the heat
sink assembly is fastened. A pair of positioning tabs 18 depends
from the bottom surface 17 at both sides of the recess 16, each tab
18 forming a pair of side abutting surfaces 19. The tabs 18 are
formed by subjecting the base plate 12 of the heat sink 10 to a
pressing stamping operation. The latching member 20 has a curved
shape and comprises a pair of latching arms 22 depending downward
at each side of a middle section (no labeled) thereof.
[0016] The CPU 30 is mounted on an electrical socket 40, a slit 34
being defined therebetween which engages with the pair of
positioning tabs 18. The electrical socket 40 forms a pair of lugs
42 at opposite sides thereof to latch with the pair of latching
arms 22 of the latching member 20. One of said lugs 42 is formed on
the socket 40 nearest to and parallel to the slit 34.
[0017] In assembly, the latching member 20 is engaged in the
receiving channel 15 of the heat sink 10. The heat sink assembly is
placed atop the CPU 30, the pair of positioning tabs 18 fitting in
the slit 34 with each pair of side surfaces 19 thereof abutting
against both inside surface (not labeled) of the slit 34. The heat
sink assembly is then fastened to the electrical socket 40 by the
pair of latching arms 22 latching the pair of lugs 42 of the
electrical socket 40, the bottom surface 17 abutting the CPU 30 to
absorb heat produced therefrom. The heat sink 10 is thereby
securely positioned and is kept from moving along the CPU 30.
[0018] The lugs 42 of the electrical socket 40 are provided on two
opposite lateral sides thereof, respectively. The heat sink 10 is
fastened to the socket 40 in a manner that the fins 14 and the
receiving channel 15 extend along the lateral direction
(X-direction of the drawings), while the tabs fitting in the slit
34 between the CPU 30 and the socket 40 extend in a direction
(Y-direction of the drawings) vertical to the lateral direction. By
such design, the heat sink 10 can be firmly fastened to the socket
40 and the CPU 30. If necessary an electrical fan 60 can be mounted
on a printed circuit board 50 on which the heat sink 10, the
latching member 20, the socket 40 and the CPU30 are also mounted.
The electrical fan 60 is located near a side of the socket 40 on
which one of the lugs 42 is formed. When the fan 60 is activated,
an air is formed to flow through the heat sink 10 along the
X-direction, whereby the air can flow through the heat sink 10
easily to effectively take away heat from the heat sink 10 and thus
the CPU 30, since the fins 14 and the receiving channel are formed
extending along the X-direction.
[0019] It is to be understood, however, that even though numerous
characteristics and advantages of the present invention have been
set forth in the foregoing description, together with details of
the structure and function of the invention, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
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