U.S. patent application number 09/875022 was filed with the patent office on 2001-11-15 for coating and developing method and apparatus therefor.
Invention is credited to Anai, Noriyuki, Araki, Shinichiro, Matsumoto, Shinko.
Application Number | 20010041311 09/875022 |
Document ID | / |
Family ID | 16957547 |
Filed Date | 2001-11-15 |
United States Patent
Application |
20010041311 |
Kind Code |
A1 |
Araki, Shinichiro ; et
al. |
November 15, 2001 |
Coating and developing method and apparatus therefor
Abstract
A coating and developing apparatus for coating a substrate with
a plurality of color resists and for developing it after exposure,
comprises: a scrubbing unit for scrubbing the substrate; a coating
unit having a plurality of resist discharge nozzles for
respectively discharging a plurality of color resists on the
scrubbed substrate; and a developing unit for developing the
substrate coated with the color resists after exposure.
Accordingly, reduction in size of apparatus and space savings can
be achieved, and manufacturing cost can also be reduced.
Inventors: |
Araki, Shinichiro;
(Kumamoto-ken, JP) ; Matsumoto, Shinko;
(Kumamoto-ken, JP) ; Anai, Noriyuki;
(Kumamoto-ken, JP) |
Correspondence
Address: |
RADER FISHMAN & GRAUER PLLC
LION BUILDING
1233 20TH STREET N.W., SUITE 501
WASHINGTON
DC
20036
US
|
Family ID: |
16957547 |
Appl. No.: |
09/875022 |
Filed: |
June 7, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09875022 |
Jun 7, 2001 |
|
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|
09365782 |
Aug 3, 1999 |
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Current U.S.
Class: |
430/325 ;
118/319; 118/320; 118/52; 156/345.11; 430/7; 430/935 |
Current CPC
Class: |
B05C 11/08 20130101;
G03F 7/3021 20130101; Y10S 430/136 20130101; G03F 7/0007 20130101;
G02B 5/201 20130101; G03F 7/162 20130101; H01L 21/6715
20130101 |
Class at
Publication: |
430/325 ; 118/52;
118/319; 118/320; 156/345; 430/7; 430/935 |
International
Class: |
G03F 007/16; B05C
005/00; G03F 007/20; G03F 007/26; G02B 005/20 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 5, 1998 |
JP |
233596/1998 |
Claims
What is claimed is:
1. A coating and developing method, comprising the steps of:
coating a substrate with a selected predetermined color resist out
of a plurality of kinds of color resists; transferring the
substrate coated with the predetermined color resist to an aligner;
and developing the exposed substrate received from the aligner, in
which after repeats of said steps in due order, the substrate is
housed in a cassette which can house therein a plurality of
substrates.
2. The method as set forth in claim 1, wherein kinds of developing
solutions for developing the plurality of kinds of color resists is
less in number than the plurality of kinds of color resists.
3. The method as set forth in claim 2, wherein there is one kind of
developing solution.
4. The method as set forth in claim 1, wherein the plurality of
kinds of color resists are discharged from at least one nozzle,
further comprising the step of cleaning an inside of the nozzle
after the predetermined color resist is discharged.
5. The method as set forth in claim 1, wherein the plurality of
kinds of color resists are discharged from one nozzle, further
comprising the step of cleaning an inside of the nozzle with one
kind of cleaning fluid which can dissolve a plurality of kinds of
color resists after the predetermined color resist is discharged
until the following color resist different from the predetermined
color resist is discharged.
6. The method as set forth in claim 4, further comprising the step
of cleaning an inside of containers for respectively containing the
plurality of kinds of color resists separately or simultaneously
with the same kind of the cleaning fluid as that for cleaning the
inside of the nozzle.
7. A coating and developing apparatus for coating a substrate with
a plurality of color resists and for developing it after exposure,
comprising: a resist coating unit having a plurality of resist
discharge nozzles for respectively discharging the plurality of
color resists to a substrate; and a developing unit for developing
the substrate coated with the color resist after exposure.
8. The apparatus as set forth in claim 7, further comprising a
scrubbing unit for scrubbing a substrate.
9. The apparatus as set forth in claim 7, wherein said resist
coating unit coats a substrate with one color resist through one
resist discharge nozzle, and thereafter coats the substrate which
has completed exposing and developing with the other color resists
one after another through the other resist discharge nozzles.
10. The apparatus as set forth in claim 7, further comprising: a
transfer means for transferring a substrate to said resist coating
unit and said developing unit; and a control means for controlling
said transfer means to transfer the substrate coated with one color
resist in said resist coating unit to an aligner and said
developing unit in order, to transfer the substrate to said resist
coating unit, and to transfer the substrate coated with another
color resist in said resist coating unit to the aligner and said
developing unit in order.
11. The apparatus as set forth in claim 7, wherein the plurality of
nozzles are disposed in the tip of one nozzle arm which is
rotatably provided in said resist coating unit.
12. The apparatus as set forth in claim 7, further comprising a
drying unit for drying the substrate coated with a color resist
substantially by non-heating.
13. The apparatus as set forth in claim 12, wherein the drying unit
dries the substrate coated with a resist solution in a state of a
reduced pressure.
14. The apparatus as set forth in claim 12, further comprising an
edge processing unit for removing a resist adhering to the edge of
a substrate after the drying by non-heating.
15. A coating and developing apparatus, comprising: a resist
coating unit for coating a substrate with a selected predetermined
color resist out of a plurality of kinds of color resists; a
developing unit for developing the exposed substrate which is
coated with the predetermined color resist, transferred to an
aligner, and received therefrom; and a transfer mechanism for
transferring the substrate between the units and the aligner, said
resist coating unit including at least one nozzle for discharging
the plurality of kinds of color resists and a cleaning mechanism
for cleaning the inside of the nozzle.
16. The apparatus as set forth in claim 15, wherein the cleaning
mechanism cleans an inside of the nozzle with one kind of cleaning
fluid which can dissolve a plurality of kinds of color resists
after the predetermined color resist is discharged from the nozzle
until the following color resist different from the predetermined
color resist is discharged.
17. The apparatus as set forth in claim 15, further comprising
cleaning mechanisms for cleaning separately or simultaneously
insides of containers for respectively containing the plurality of
kinds of color resists with the same kind of the cleaning fluid as
that for cleaning the inside of the nozzle.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a coating and developing
method of resist coating by supplying a resist on the front face of
a substrate, exposing it, and thereafter developing it by supplying
a developing solution particularly for fabricating a color filter
of a color liquid crystal display (LCD) or the like and an
apparatus therefor.
BACKGROUND OF THE INVENTION
[0002] A color filter of a color liquid crystal display (LCD) is
fabricated by the so-called photolithography technology in which a
rectangular substrate made of glass is coated with color resists of
four colors (red, green, blue, and black), and is exposed and
developed.
[0003] In the photolithography process of the color filter,
coating, exposing and developing are performed for each of the
color resists. More specifically, for example, a substrate after
being scrubbed is coated with a red color resist, thereafter the
red color resist is exposed and is sequentially developed. Next,
the substrate after being scrubbed is coated with a green color
resist, thereafter the green color resist is exposed and is
sequentially developed. Then, similar processes are performed with
respect to blue and black.
[0004] Accordingly, processing units for scrubbing, coating,
exposing and developing are required for processing of each color,
the processing units for scrubbing, coating, exposing and
developing are continuously arranged, and processes are
sequentially performed from upstream to downstream.
[0005] However, when one color filter is coated with a plurality of
color resists by the coating and developing system as described
above, processing units for scrubbing, coating, exposing and
developing are required to provide for each of the colors.
Moreover, a plurality of groups of processing units for scrubbing,
coating, exposing and developing in correspondence with the number
of colors must be provided. Therefore, there is a problem in the
coating and developing system as described above in that the
configuration of the apparatus becomes huge in size, which causes
an increase in space occupied in a clean room, and also an increase
in manufacturing cost.
[0006] The present invention is made in view of the above
circumstances. An object of the present invention is to provide a
coating and developing method and an apparatus therefor in which
reduction in size of apparatus and space savings can be achieved,
and manufacturing cost can also be reduced in coating and
developing a color filter and the like. Another object is to
provide a coating and developing method and an apparatus therefor
in which yields of products can be improved.
SUMMARY OF THE INVENTION
[0007] To solve the aforesaid problem, the first aspect of the
present invention is characterized by steps of coating a substrate
with a selected predetermined color resist out of a plurality of
kinds of color resists; transferring the substrate coated with the
predetermined color resist to an aligner; and developing the
exposed substrate received from the aligner, in which after repeats
of the above steps in due order, the substrate is housed in a
cassette which can house therein a plurality of substrates.
[0008] A second aspect of the present invention is characterized by
a coating and developing apparatus for coating a substrate with a
plurality of color resists and for developing it after exposure,
which comprises a resist coating unit having a plurality of resist
discharge nozzles for respectively discharging the plurality of
color resists to a substrate; and a developing unit for developing
the substrate coated with the color resist after exposure.
[0009] A third aspect of the present invention is characterized by
a coating and developing apparatus comprising a resist coating unit
for coating a substrate with a selected predetermined color resist
out of a plurality of kinds of color resists; a transfer mechanism
for transferring the substrate coated with the predetermined color
resist to an aligner and to a developing unit for developing the
exposed substrate received from the aligner, in which the resist
coating unit includes at least one nozzle for discharging the
plurality of kinds of color resists and a cleaning mechanism for
cleaning the inside of the nozzle.
[0010] A fourth aspect of the present invention is characterized by
steps of coating a substrate with a selected predetermined color
resist out of a plurality of kinds of color resists; transferring
the substrate coated with the predetermined color resist to an
aligner; and developing the exposed substrate received from the
aligner, in which a coating processing of a plurality of color
resists and developing processing after exposure thereof are
performed, since the substrate is housed in a cassette which can
house therein a plurality of substrates after repeats of the above
steps in due order.
[0011] Accordingly, in the present invention, a plurality of color
resists can be applied one after another and developed them after
exposure by one coating and developing apparatus, so that reduction
in size of apparatus and space savings can be achieved, and
manufacturing cost can also be reduced.
[0012] Moreover, in the present invention, a plurality of color
resists can be applied with high efficiency by using one resist
discharge nozzle to each of a plurality of color resists for
discharging the respective resists in the resist coating unit.
[0013] Furthermore, the present invention comprises a cleaning
mechanism for cleaning the inside of the color resist discharge
nozzle, whereby the color resist does not solidify in the nozzle,
which can prevent a solidified color resist from being discharged
onto a substrate G, resulting in improvements of product
yields.
[0014] The above and other objects and advantages of the present
invention will be easily confirmed from the following detailed
description in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1A is a plan view showing a coating and developing
system for a color filter of an LCD to which the present invention
is applied;
[0016] FIG. 1B is an explanatory view explaining a control system
of the coating and developing system for a color filter of an
LCD;
[0017] FIG. 2 is a schematic plan view showing a resist coating
unit (COT), a drying unit, and an edge remover (ER);
[0018] FIG. 3A is a schematic side view showing the resist coating
unit (COT), the drying unit, and the edge remover (ER);
[0019] FIG. 3B is an explanatory view of a resist supply
mechanism;
[0020] FIG. 4 is a sectional view of a developing unit (DEV);
[0021] FIG. 5 is a plan view of the developing unit (DEV);
[0022] FIG. 6 is an explanatory view of a cleaning mechanism for
cleaning the inside of a nozzle for discharging a color resist and
a container for storing the color resist; and
[0023] FIG. 7 is an explanatory view of another embodiment of a
cleaning mechanism for cleaning the inside of a nozzle for
discharging a color resist.
DETAILED DESCRIPTION OF THE INVENTION
[0024] FIG. 1A is a plan view showing a coating and developing
system for a color filter of an LCD as an embodiment to which the
present invention is applied.
[0025] The coating and developing system comprises a cassette
station 1 for mounting thereon cassettes C in each of which a
plurality of substrates G can be housed, a process section 2 having
a plurality of processing units for performing a series of
processes including resist-coating and development for the
substrate G, and an interface section 3 for sending and receiving
the substrate G to/from an aligner (not shown), where the cassette
station 1 and the interface section 3 are separately disposed on
both sides of the process section 2.
[0026] The cassette station 1 includes a transfer means, for
example, a transfer mechanism 10 for transferring the substrate G
between the cassettes C and the process section 2. The cassettes C
are carried in/out at the cassette station 1. The transfer
mechanism 10 includes a transferring arm 11 which can move on a
transfer path 10a provided along a direction of disposition of the
cassettes, and the substrate G is transferred between the cassettes
C and the process section 2 by the transferring arm 11.
[0027] The process section 2 is divided into a former stage 2a, a
middle stage 2b, and a latter stage 2c, which respectively include
transfer paths 12, 13, and 14 in the center of the above stages.
The respective processing units are arranged on both sides of the
above transfer paths. Between the transfer paths, relay sections 15
and 16 are respectively provided for receiving and sending the
substrate G between the former stage 2a and the middle stage 2b,
and the middle stage 2b and the latter stage 2c.
[0028] The former stage 2a includes a transfer means, for example,
a main transfer device 17 movable along the transfer path 12 for
transferring a substrate. On one side of the transfer path 12,
rotary processing units for processing the substrate G while
rotating it, for example, two scrubbing units (SCR) 21a and 21b are
arranged. On the other side of the transfer path 12, thermal-type
processing units for performing thermal processing to the substrate
G, for example, a cooling unit (COL) 25, vertically two-tiered
heating units (HP) 26 and cooling units (COL) 27, are arranged.
[0029] The middle stage 2b includes a transfer means, for example,
a main transfer device 18 movable along the transfer path 13 for
transferring a substrate. On one side of the transfer path 13, a
resist coating unit (COT) 22 for coating the periphery of the
substrate G color resists and an edge processing unit for removing
color resists, for example, an edge remover (ER) 23, are arranged.
On the other side of the transfer path 13, thermal-type processing
units for performing thermal processing to the substrate G, for
example, vertically two-tiered heating units (HP) 28, a heating and
cooling unit (HP/COL) 29 where a heating unit and a cooling unit
are vertically two-tiered, and cooling units (COL) 30, are
arranged.
[0030] Moreover, in this embodiment, a drying unit 40 is provided
between the resist coating unit (COT) 22 and the edge remover (ER)
23. Thereby, the substrate G coated with a color resist is
transferred to the drying unit 40 to be dried, and thereafter
undergoes edge processing by the edge remover (ER) 23. The drying
unit 40 will be described later.
[0031] Furthermore, the latter stage 2c includes a transfer means,
for example, a main transfer device 19 movable along the transfer
path 14 for transferring a substrate. On one side of the transfer
path 14, liquid-type processing units for processing the substrate
G by supplying a processing liquid and the like, for example, three
developing units 24a, 24b, and 24c are arranged. On the other side
of the transfer path 14, thermal-type processing units for
performing thermal processing to the substrate G, for example,
vertically two-tiered heating units 31, two heating and cooling
units (HP/COL) 32 and 33 in each of which a heating unit and a
cooling unit are vertically two-tiered.
[0032] As described above, the process section 2 has a structure
where only spinner-type units such as the scrubbing unit 21a, the
resist coating unit 22, and the developing unit 24a, are disposed
on one side, and only thermal-type processing units such as the
heating unit and the cooling unit are disposed on the other side
across the transfer paths.
[0033] In parts on the side where the spinner-type units are
disposed of the relay sections 15 and 16, chemicals supply units 34
are disposed and spaces 35 are additionally provided for the
maintenance.
[0034] The aforesaid main transfer device 17 has functions of
receiving/sending the substrate G from/to the arm 11 of the
transfer mechanism 10, and of carrying the substrate G into/out of
each unit of the former stage 2a, and moreover, of delivering the
substrate G from/to the relay section 15. The main transfer device
18 has functions of receiving/sending the substrate G from/to the
relay section 15, and of carrying the substrate G into/out of each
unit of the middle stage 2b, and moreover, of delivering the
substrate G from/to the relay section 16. Moreover, the main
transfer device 19 has functions of receiving/sending the substrate
G from/to the relay section 16, and of carrying the substrate G
into/out of each unit of the latter stage 2c, and moreover, of
delivering the substrate G from/to the interface section 3. The
relay sections 15 and 16 also function as cooling plates for
temperature regulation means, at which the temperature of the
substrate G can be regulated.
[0035] The interface section 3 includes an extension 36 for
temporarily holding a substrate when delivering the substrate
from/to the process section 2, two buffer stages 37 provided on
both sides of the extension 36, at which buffer cassettes are
disposed, and a transfer means, for example, a transfer mechanism
38 for carrying a substrate, for carrying the substrate G into/out
of an external device such as an aligner (not shown) which connects
with the extension 36 and the buffer stages 37. The transfer
mechanism 38 includes a transferring arm 39 which can move on a
transfer path 38a provided along the direction of disposition of
the extension 36 and the buffer stages 37, and the substrate G is
transferred between the process section 2 and the aligner by the
transferring arm 39.
[0036] Respective processing Units are assembled to be integrated
as above, thereby reducing space and improving efficiency of
processing.
[0037] In the coating and developing system configured as above,
the cassette station 1, the process section 2a, the process section
2b, the process section 2c, and the interface section 3, are
separately controlled in motion by unit control sections, for
example, a control section 112 of the cassette station 1, a control
section 113 of the process section 2a, a control section 114 of the
process section 2b, a control section 115 of the process section
2c, and a control section 116 of the interface section 3
respectively, and the control sections of respective process
sections are centrally controlled by a main control section 111, as
shown in FIG. 1B. The processing in each processing mechanism in
the cassette station 1, the process section 2a, the process section
2b, the process section 2c, and the interface section 3 is
controllable as follows: Recipes are sent from the main control
section 111 to the control section 112 of the cassette station 1,
the control section 113 of the process section 2a, the control
section 114 of the process section 2b, the control section 115 of
the process section 2c, and the control section 116 of the
interface section 3. Thereby, a substrate coated with one color
resist in the resist coating unit 22 is transferred to each
processing mechanism, for example, the aligner and the developing
units 24a to 24c in order, the substrate G is transferred again to
the resist coating unit 22, and the substrate G coated with another
color resist in the resist coating unit 22 is transferred to the
aligner and the developing units 24a to 24c in order.
[0038] In the coating and developing system configured as above,
the substrate G in the cassette C is transferred to the process
section 2, in which the substrate G is first scrubbed in the
scrubbing units (SCR) 21a and 21b of the former stage 2a, and dried
by heating in one of the heating units (HP) 26, and thereafter
cooled in one of the cooling units (COL) 27.
[0039] The substrate G is then transferred to the middle stage 2b
and coated with a predetermined color resist in the resist coating
unit (COT) 22 (a step of coating a substrate with a color resist),
and dried in the drying unit 40, and thereafter an excess color
resist on the periphery of the substrate G is removed in the edge
remover (ER) 23. Thereafter, the substrate G is prebaked in one of
the heating units (HP) in the middle stage 2b and cooled in the
cooling unit (COL) at the lower tier in the unit 29 or 30.
[0040] Then, the substrate G is transferred from the relay section
16 to the aligner through the interface section 3 by the main
transfer device 19 and exposed with a predetermined pattern (a step
of transferring the substrate coated with a predetermined color
resist to the aligner). Then the substrate G is again carried in
through the interface section 3 and developed in any of the
developing units (DEV) 24a, 24b, and 24c (a step of developing the
exposed substrate received from the aligner). The developed
substrate G is postbaked in any of the heating units (HP) of the
latter stage 2c and cooled in one of the cooling units (COL).
[0041] The above series of processes per color resist is carried
out in accordance with the preinstalled recipes. For example, the
substrate G for which a series of coating, exposing, and developing
of red is completed, is given a separate series of coating,
exposing, and developing of green, blue, and black in order. Each
color is processed almost in the same way, except for use of a
nozzle of a different color in the resist coating unit (COT) 22 as
described later. The completed substrate of a color filter is
housed in a predetermined cassette on the cassette station 1 by the
main transfer devices 19, 18, and 17 and the transfer mechanism
10.
[0042] Next, the resist coating unit (COT) 22, the drying unit (VD)
40, and the edge remover (ER) 23 which are installed in the coating
and developing system for a color filter according to this
embodiment, will be described hereinafter. FIG. 2 and FIG. 3A are
respectively a schematic plan view and a schematic side view
showing the resist coating unit (COT), the drying unit (VD), and
the edge remover (ER).
[0043] As shown in FIG. 2 and FIG. 3A, the resist coating unit
(COT) 22, the drying unit 40, and the edge remover (ER) 23, are
integrally placed side by side in a line on the same stage. The
substrate G coated with a predetermined color resist in the resist
coating unit (COT) is transferred to the drying unit 40 alone guide
rails 43 by a pair of transferring arms 41. The substrate G dried
in the drying unit 40 is transferred to the edge remover (ER) 23
along the guide rails 43 by a pair of transferring arms 42.
[0044] The resist coating unit (COT) 22 includes a spin chuck 51 to
be horizontally rotatable for suction-holding the substrate G, a
rotary cup 52 having a cylindrical form with a bottom and an open
top end which is shaped in such a manner to surround the top end
part of the spin chuck 51, to surround the substrate G suction-held
by the spin chuck 51, and to open at the top end part of itself, a
lid body (not shown) which is put on the open top end of the rotary
cup 52, and a coater cup 53 secured in such a manner to surround
the circumferences of the rotary cup 52. When a color resist is
dropped as described later, the substrate G is rotated by the spin
chuck 51 in a state where the lid body is opened. When the color
resist is diffused, while the substrate G is rotated by the spin
chuck 51, the rotary cup 52 in a state where the lid body is closed
is rotated. Moreover, around the periphery of the coater cup 53, an
outer cover 54 is provided.
[0045] The resist coating unit (COT) 22 includes a resist discharge
nozzle arm 55 for discharging color resists of four colors (red,
green, blue, and black) to a rectangular substrate G made of glass,
and the resist discharge nozzle arm 55 is rotatable.
[0046] The resist discharge nozzle arm 55 is on standby at a
standby position, and is turned to the center of the substrate G
when dropping the color resists. At the tip of the resist discharge
nozzle arm 55, provided are a nozzle 56a for a red color resist, a
nozzle 56b for a green color resist, a nozzle 56c for a blue color
resist, a nozzle 56d for a black color resist, and a thinner nozzle
56e. Moreover, a drain pan (not shown) having an open top is fixed
under the nozzles 56a to 56e at the standby position.
[0047] As shown in FIG. 3B, respective nozzles 56a to 56d are
connected to containers for respectively storing the color resists,
for example, resist supply tanks 102a to 102d, through resist
supply pipes 101a to 101d, and pumps 103a to 103d are provided at
the midpoints thereof. Between the nozzles 56a to 56d and the pumps
103a to 103d, air-operated valves 106a to 106d are provided.
Moreover, a nozzle cleaning mechanism 117 for cleaning the inside
of each of the nozzles 56a to 56d is provided for each of nozzles
56a to 56d. As the nozzle cleaning mechanisms 117, air-operated
three-way valves 104a to 104d are respectively provided between the
nozzles 56a to 56d and the pumps 103a to 103d, and are respectively
connected with pipes 105a to 105d from a cleaning fluid supply tank
110. One kind of cleaning fluid with which a plurality of kinds of
color resists can be dissolved, is stored in the cleaning fluid
supply tank 110. The cleaning fluid supply tank 110 can send the
cleaning fluid to the pipes 105a to 105d by being pressurized with
N2. The air-operated valves 106a to 106d can open and close by a
command from a control section 107, and the air-operated three-way
valves 104a to 104d can be switched by a command from the control
section 107.
[0048] For example, when a red color resist is discharged, the
air-operated three-way valve 104a is switched to allow the resist
to flow from the pipe 101a to the nozzle 56a, then the pump 103a is
driven, and the air-operated valve 106a is opened, thereby
discharging the resist.
[0049] In the above configuration, it is easy that after one color
resist is applied to the substrate G by one of the color resist
nozzles 56a to 56d, another nozzle of them performs coating
processing. For example, even when the color of a resist applied to
the following substrate is different, only changing nozzles can
easily cope with that.
[0050] Furthermore, for example, after a red color resist is
discharged, the inside of the nozzle 56a can be cleaned by
switching the air-operated three-way valve 104a to allow the
cleaning fluid to flow from the pipe 105a to the nozzle 56a.
Incidentally, the cleaning fluid after cleaning is discharged from
the nozzle 56a toward the drain pan (not shown).
[0051] Similarly to the above, the nozzles 56b to 56d can also
perform discharging of color resists and cleaning the inside
thereof.
[0052] The drying unit 40 includes a low chamber 61 and an upper
chamber 62 for covering the low chamber 61 to keep the inside of
processing chamber airtight. The low chamber 61 is provided with a
stage 63 for mounting thereon the substrate G, four exhaust ports
64 are provided in each of corner sections of the low chamber 61,
and exhaust ducts 65 (FIG. 3A) communicating with the exhaust ports
64 are connected to an exhaust pump (not shown) such as a
turbo-molecular exhaust pump and the like. Thereby, a gas in the
processing chamber between the low chamber 61 and the upper chamber
62 is exhausted to reduce pressure down to a predetermined vacuum
degree, and the substrate G is dried under a reduced pressure,
substantially by non-heating.
[0053] The edge remover (ER) 23 (edge processing) is provided with
a stage 71 for mounting thereon the substrate G, two alignment
means 72 for positioning the substrate G are provided in two corner
sections on the stage 71.
[0054] On the four sides of the substrate G, provided are four
remover heads 73 respectively for removing excess color resists
from the edges of the four sides of the substrate G. Each of the
remover heads 73 has a nearly U-shaped cross-section so as to
discharge thinner from the inside thereof, and can be shifted along
each of the four sides of the substrate G by a shifting mechanism
(not shown). Accordingly, each remover head 73 can remove excess
color resists adhering to each of the four sides of the substrate
G, while shifting along each of sides of the substrate G and
discharging thinner.
[0055] Next, processing of the substrate G in the resist coating
unit (COT) 22, the drying unit (VD) 40, and the edge remover (ER)
23 which are integrally structured as above will be described.
[0056] First, in the resist coating unit (COT) 22, when the
substrate G is rotated by the spin chuck 51, the resist discharge
nozzle arm 55 is turned to the center of the substrate G, and the
thinner nozzle 56e reaches the center of the substrate G, thinner
is discharged to the front face of the rotating substrate G and is
uniformly spread out from the center of the substrate G and
covering entirely the substrate G by centrifugal force.
[0057] Sequentially, a nozzle for a predetermined color resist, for
example, the nozzle 56a for the red color resist reaches a point
above the center of the spin chuck 51 (the center of the substrate
G), the air-operated three-way valve 104a and the air-operated
valve 106a are controlled, and the red color resist is dropped onto
the center of the rotating substrate G to be applied to the
substrate G and uniformly spread out from the center of the
substrate G entirely to the surroundings by centrifugal force.
[0058] After the red color resist is discharged, the resist
discharge nozzle arm 55 is turned to the standby position, and
performs a process of cleaning the inside of the nozzle 56a with
the cleaning fluid until the next different color resist is
discharged. At this time, the air-operated three-way valve 104a is
switched to allow the cleaning fluid to flow from the pipe 105a to
the nozzle 56a, and then the cleaning fluid is discharged from the
nozzle 56a to clean the inside of the nozzle 56a. By cleaning the
inside of the nozzle 56a, the color resist does not solidify inside
the nozzle, which can prevent a solidified resist from being
discharged onto the front face of the substrate G, resulting in
improvements of product yields.
[0059] The substrate G coated with the red color resist is
transferred to the drying unit 40 by the transferring arm 41, a gas
in the chamber between the low chamber 61 and the upper chamber 62
is exhausted, and so the pressure is reduced down to a
predetermined vacuum degree. Thereby, a solvent such as thinner and
the like in the color resist evaporates to a certain degree and so
the solvent in the resist is gradually released, which can
accelerate drying of the resist without adversely affecting the
resist. Moreover, drying processing is substantially performed by
non-heating, which can effectively prevent a transfer onto the
substrate G from occurring.
[0060] The dried substrate G is transferred to the edge remover
(ER) by the transferring arm 42, and the four remover heads 73 are
moved along respective sides of the substrate G, thereby excess
color resists adhering to the edges of the four sides of the
substrate G are removed with discharged thinner. The color resist
adhering to the edge of the substrate G is removed, which can
reduce the possibility that the color resist adheres to the main
transfer devices 17 to 19 and the transfer mechanism 38 when the
substrate G is transferred by the main transfer devices 17 to 19
and the transfer mechanism 38, to become a cause of particles.
[0061] Thereafter, another substrate G is carried into the resist
coating unit (COT) 22, a process of cleaning the inside of the
nozzle is completed, the resist discharge nozzle arm 55 is turned,
and the same red or another color resist is applied to the
substrate G. In a case of the same color, the same operation needs
to be performed repeatedly. Even in a case of a different color,
the same operation only except that the different color resist is
dropped from another color nozzle is required, which can be easily
coped with.
[0062] Meanwhile, the above substrate G coated with the red color
resist is exposed and developed, and after undergoing scrubbing
again, carried into the resist coating unit (COT) 22. The second
color resist, for example, the green color resist is applied to the
substrate from the nozzle 56b of the green color resist, and then
the aforesaid processes are similarly repeated. The third color
resist, for example, blue is applied, and then the fourth color
resist, for example, black is applied similarly to the above.
[0063] In the resist coating unit (COT) 22, the resist discharge
nozzles 56a to 56d for discharging the respective resists are used
in correspondence with a plurality of color resists, so that a
plurality of the color resists can be applied with high
efficiency.
[0064] Next, the developing units (DEV) 24a, 24b, and 24c according
to this embodiment will be described hereinafter.
[0065] FIG. 4 is a sectional view of the above developing units
24a, 24b, and 24c, and FIG. 5 is a plan view of the same.
[0066] As shown in FIG. 4 and FIG. 5, in each central portion of
the developing units (DEV) 24a, 24b, and 24c, provided is a spin
chuck 74 which can rotate and vertically move by the driving motor
31. The top face of the spin chuck 74 is configured to suction-hold
the glass substrate G in a horizontal state by vacuum suction and
the like.
[0067] A lower container 75 is placed under the spin chuck 74. An
outer cup 76 is disposed to surround the periphery of the spin
chuck 74, and an inner cup 77 is disposed between the lower
container 75 and the outer cup 76.
[0068] The outer cup 76 and the inner cup 77 are coupled by a
coupling member 78, and ascend and descend by a hoisting and
lowering cylinder 88. The outer cup 76 and the inner cup 77 are
made in such a manner to incline toward the inside as the upper,
the smaller the respective diameters become. The diameter of the
open top end of the outer cup 76 is larger than that of the inner
cup 77, and both of which are made to have size enough to house the
glass substrate G which is descended into the cup while kept in a
horizontal state.
[0069] The lower container 75 includes an inclined section 79 which
inclines downward from the center to the outside, and a pan section
80 disposed around the inclined section 79. On the inclined section
79, a plurality of supporting pins 81 for supporting the rear face
of the glass substrate G, for example, four pins are disposed. The
vertical position of the tip of the supporting pin 81 is set to be
where the tip of the supporting pin 81 abuts the rear face of the
glass substrate G when the substrate G supported by the spin chuck
74 is descended to the lowest position. On the bottom of the pan
section 80, provided is a cylindrical standing wall 82, which
exists between the outer cup 76 and the inner cup 77. The inclined
section of the inner cup 77 extends over the standing wall 82 to
exist around the periphery of the standing wall 82. Thereby the
fluid flowing on the inclined section of the inner cup 77 comes to
flow into an outer chamber 83 which is parted by the standing wall
82 of the pan section 80.
[0070] On the rear face of the inclined section 79 side of the
lower container 75, an exhaust port 84 for exhausting the gas
inside the cup is provided, and the exhaust port 84 is connected
with an exhaust pump(not shown). A waste liquid port 86 is formed
at a lower part of an inner chamber 85 which is parted by the
standing wall 82 of the pan section 80, and a drain port 87 is
formed at a lower part of the outer chamber 83. The waste liquid
port 86 is connected with a collection tank (not shown). The drain
port 87 is also connected with a collection tank (not shown).
[0071] On one side of the upper part of the cup, a developing
solution discharge mechanism 89 for discharging a developing
solution to the front face of the glass substrate G is disposed. On
the other side, disposed are a high pressure cleaning mechanism 90
for jetting a cleaning fluid out with high pressure to the front
face of the glass substrate G, and a rinse fluid supply mechanism
91 for supplying a rinse fluid to the front face of the glass
substrate G. Transfer rails 92 and 93 are provided in front of and
behind the top part of the cup. The developing solution discharge
mechanism 89 and the high pressure cleaning mechanism 90, to which
transfer motors 58 and 59 are respectively attached, are
transferred to above the inside of the cups along the transfer
rails 92 and 93 by driving of the transfer motors 58 and 59 under
control of a control section 94.
[0072] Into the developing solution discharge mechanism 89, the
developing solution is supplied from a developing solution storing
tank 52 through a pump 95 under control of the control section 94.
The developing solution is one in kind, which is fewer in number
than the kinds of the color resists. A warming device 96 for
warming the developing solution is laid between the developing
solution discharge mechanism 89 and the pump 95. When the
temperature of the atmosphere is, for example, 23(.degree. C.), the
warming device 96 warms the developing solution higher in
temperature than the atmosphere, for example, 25(.degree. C.) to
27(.degree. C.) and keeps it. Thereby, the developing speed can be
improved. Into the high pressure cleaning mechanism 90, the
cleaning fluid is supplied from a cleaning fluid tank 98 through a
pump 97 controlled by the control section 94. Similarly, into the
rinse fluid supply mechanism 91, a rinse fluid is supplied from a
rinse fluid tank 100 through a pump 99 controlled by the control
section 94.
[0073] Next, operations will be described. The glass substrate G
which is carried into the developing units 24a, 24b,and 24c and
supported by the spin chuck 74, is descended to a position where
the substrate G does not abut the supporting pins 81. The outer cup
76 and the inner cup 77 are ascended to the highest position, and
the developing solution discharge mechanism 89 is carried to near
the center of the glass substrate G to stop. Then the glass
substrate G supported by the spin chuck 74 is rotated, and the
developing solution is discharged from the developing solution
discharge mechanism 89 to the glass substrate G. The developing
solution which scatters from the periphery of the glass substrate G
hits the inner side of the inner cup 77 and is collected through
the waste liquid port 86, and at least a part of it is reused.
[0074] Next, the glass substrate G supported by the spin chuck 74
is descended to a position where the substrate G abuts the
supporting pins 81. The outer cup 76 and the inner cup 77 are
descended to a predetermined position, for example, the lowest
position. The glass substrate G supported by the spin chuck 74 is
kept still, the high pressure cleaning mechanism 90 is scanned in
the longitudinal direction of the glass substrate G, and the
cleaning fluid is discharged from the high pressure discharge
mechanism 90 to the glass substrate G. The cleaning fluid which
scatters from the periphery of the glass substrate G flows through
the space between the inner cup 77 and the outer cup 76 to be
drained from the drain port 87. The glass substrate G is supported
on its rear face by the supporting pins 81 during high pressure
cleaning, which prevents the deformation of the glass substrate G
.
[0075] Next, the glass substrate G supported by the spin chuck 74
is ascended to a position where the substrate G does not abut the
supporting pins 81. The outer cup 76 and the inner cup 77 are kept
in a state of being descended to the lowest position, and the rinse
fluid supply mechanism 91 is carried to near the center of the
glass substrate G. The glass substrate G supported by the spin
chuck 74 is rotated, and the rinse fluid is supplied to the
substrate G from the rinse fluid supply mechanism 91. The rinse
fluid which scatters from the periphery of the glass substrate G
flows through the space between the inner cup 77 and the outer cup
76 to be drained from the drain port 87.
[0076] Finally, the rinse fluid supply mechanism 91 is carried
outside the cup, and the glass substrate G supported by the spin
chuck 74 is rotated at high speed to be drained by spinning.
[0077] As has been explained, a plurality of color resists can be
applied in order, and developed after exposure by one coating and
developing system including the scrubbing unit (SCR), the resist
coating unit (COT), and the developing unit (DEV). Consequently,
reduction in size of apparatus and space savings can be achieved,
and manufacturing cost can be also reduced.
[0078] It should be noted that the present invention is not limited
to the above embodiments, and various modifications can be
employed. For example, in the above embodiments, explained is a
case where one substrate is coated with a plurality of resists in
order, the application of all colors is completed, and thereafter
the substrate is returned to the cassette. In addition to that,
color resists can be applied by various orders such that the
coating of all substrates with one color resist is completed, and
then the substrates are returned to the cassette to be coated with
the following color in a similar way.
[0079] It is needless to say that, as shown in FIG. 6, tank
cleaning mechanisms 118 which can clean vacant resist supply tanks
102a to 102d may be additionally provided to perform a step of
cleaning separately or simultaneously the insides of the resist
supply tanks 102a to 102d. As the tank cleaning mechanisms 118,
air-operated three-way valves 108a to 108d are provided between the
pumps 103a to 103d and the resist supply tanks 102a to 102d.
Moreover, pipes 109a to 109d for supplying the cleaning fluid from
the cleaning fluid supply tank 110 to the air-operated three-way
valves 108a to 108d are provided. Hereinafter, a case where the
inside of the resist supply tank 102a is cleaned will be explained.
When the color resist in the resist supply tank 102a runs out, the
air-operated three-way valve 108a is switched to allow the cleaninq
fluid to flow from the pipe 109a to the resist supply tank 102a, so
as to save the cleaning fluid in the resist supply tank 102a,
thereby cleaning the inside of the resist supply tank 102a. The
resist supply tank 102a is cleaned before being supplied with a new
resist, thereby preventing the resist before supply from mixing
into the resist after supply, and so the resist before supply is
not applied to the substrate, resulting in improvements of product
yields. A plurality of the resist supply tanks 102a to 102d can be
simultaneously cleaned by switching the air-operated three-way
valves 108a to 108d.
[0080] After the cleaning fluid is saved in the resist supply tank
102a, the air-operated three-way valve 108a is switched to allow
the cleaning fluid to flow from the resist supply tank 102a to the
pump 103a, the air-operated three-way valve 104a is switched to
permit the cleaning fluid in the resist supply tank 102a to be
discharged from the nozzle 56a and the cleaning fluid to flow from
the pipe 101a to the nozzle 56a, the air-operated valve 106a is
opened, the pump 103a is driven, and the cleaning fluid is
discharged from the nozzle 56a, thereby the passage between the
resist supply tank 102a to the nozzle 56a is also cleaned.
Thereafter, the resist supply tank 102a is supplied with a resist
or replaced with a new one. When the resist supply tank 102a is
vacant, the passage from the resist supply tank 102a to the nozzle
56a can be also cleaned, so that the resist does not solidify in
the passage while being supplied into the resist supply tank 102a,
resulting in improvements of product yields.
[0081] It is needless to say that any kind of liquids which can
remove resist can be employed as the cleaning fluid, and so the
resist solvent may be employed. The nozzle is cleaned with the
resist solvent, for example, thinner, thereby preventing alien
substances from mixing into the resist, resulting in improvements
of product yields. Thinner is readily available.
[0082] As the nozzle cleaning mechanisms 117, the cleaning fluid
supply tank 110 and the air-operated three-way valves 104a to 104d
are provided. However, as shown in FIG. 7, the cleaning fluid
supply tank 110 and the air-operated three-way valves 104a to 104d
are not provided, and the resist supply tanks 102a to 102d may be
naturally respectively replaced with the cleaning a fluid supply
tank 110 and pumps 103a to 103d are driven to clean the inside of
the nozzles 56a to 56d when performing the nozzle cleaning. In this
case, the apparatus configuration can be simplified and downsizing
of the apparatus is possible. The apparatus configuration can be
simplified, so that possibility of trouble decreases, resulting in
improvements of reliability of the apparatus.
[0083] A plurality of the nozzles for discharging color resists are
provided, and the number of the nozzles may be one as a matter of
course. A predetermined color resist is discharged and then the
inside of the nozzle is cleaned, so that the color resist does not
remain in the nozzle after cleaning. Even when a different color
resist is discharged from the same nozzle after cleaning, the
resist before cleaning does not mix into the different color
resist. Consequently, further downsizing of the apparatus is
possible.
[0084] The cleaning of the inside of the nozzles 56a to 56d is
naturally performed at regular intervals instead of being performed
only when the color resists are discharged. The timing of cleaning
can be chosen from the times when the number of discharge of the
color resists to the substrate G exceeds a predetermined number,
when lots of substrates are finished, and when a predetermined
period of time has passed from the last time of discharge of the
color resist. In this case, the number of cleaning of nozzles can
be reduced, resulting in improvements of throughput.
[0085] It is noted that arrangement and the number of units in the
coating and developing system are not particularly limited.
[0086] The aforesaid embodiments have the intention of clarifying
technical meaning of the present invention. Therefore, the present
invention is not intended to be limited to the above concrete
embodiments or to be interpreted in a narrow sense, and various
changes may be made therein without departing from the spirit of
the present invention and within the meaning of the
* * * * *