U.S. patent application number 09/875668 was filed with the patent office on 2001-10-11 for method of recycling a delaminated wafer and a silicon wafer used for the recycling.
This patent application is currently assigned to Shin-Etsu Handotai Co., Ltd.. Invention is credited to Aga, Hiroji, Kuwahara, Susumu, Mitani, Kiyoshi, Wada, Masae.
Application Number | 20010029072 09/875668 |
Document ID | / |
Family ID | 15055912 |
Filed Date | 2001-10-11 |
United States Patent
Application |
20010029072 |
Kind Code |
A1 |
Kuwahara, Susumu ; et
al. |
October 11, 2001 |
Method of recycling a delaminated wafer and a silicon wafer used
for the recycling
Abstract
There is disclosed a method of recycling a delaminated wafer
produced as a by-product in producing an SOI wafer according to a
hydrogen ion delaminating method by reprocessing it for reuse as a
silicon wafer, wherein at least polishing of the delaminated wafer
for removing of a step in the peripheral part of the delaminated
wafer and heat treatment in a reducing atmosphere containing
hydrogen are conducted as the reprocessing. There are provided a
method of appropriately reprocessing a delaminated wafer produced
as a by-product in a hydrogen ion delaminating method to reuse it
as a silicon wafer actually, and particularly, a method of
reprocessing an expensive wafer such as an epitaxial wafer many
times for reuse, to improve productivity of SOI wafer having a high
quality SOI layer, and to reduce producing cost.
Inventors: |
Kuwahara, Susumu;
(Gunma-ken, JP) ; Mitani, Kiyoshi; (Gunma-ken,
JP) ; Aga, Hiroji; (Gunma-ken, JP) ; Wada,
Masae; (Nagano-ken, JP) |
Correspondence
Address: |
HOGAN & HARTSON L.L.P.
500 S. GRAND AVENUE
SUITE 1900
LOS ANGELES
CA
90071-2611
US
|
Assignee: |
Shin-Etsu Handotai Co.,
Ltd.
|
Family ID: |
15055912 |
Appl. No.: |
09/875668 |
Filed: |
June 5, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09875668 |
Jun 5, 2001 |
|
|
|
09295089 |
Apr 20, 1999 |
|
|
|
Current U.S.
Class: |
438/151 ;
257/E21.122; 257/E21.568; 438/152 |
Current CPC
Class: |
H01L 21/02032 20130101;
Y10S 438/959 20130101; Y10S 438/977 20130101; H01L 21/76254
20130101; H01L 21/2007 20130101 |
Class at
Publication: |
438/151 ;
438/152 |
International
Class: |
H01L 021/00; H01L
021/84 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 23, 1998 |
JP |
10-131351 |
Claims
What is claimed is:
1. A method of recycling a delaminated wafer produced as a
by-product in producing an SOI wafer according to a hydrogen ion
delaminating method by reprocessing it for reuse as a silicon
wafer, wherein at least polishing of the delaminated wafer for
removing of a step in the peripheral part of the delaminated wafer
and heat treatment in a reducing atmosphere containing hydrogen are
conducted as the reprocessing.
2. A method of recycling a delaminated wafer produced as a
by-product in producing an SOI wafer according to a hydrogen ion
delaminating method in which an epitaxial wafer is used as a bond
wafer by reprocessing it for reuse as a silicon wafer, wherein at
least polishing of the delaminated wafer for removing of a step in
the peripheral part of the delaminated wafer and heat treatment in
a reducing atmosphere containing hydrogen are conducted as the
reprocessing.
3. A method of recycling a delaminated wafer produced as a
by-product in producing an SOI wafer according to a hydrogen ion
delaminating method in which CZ wafer is used as a bond wafer by
reprocessing it for reuse as a silicon wafer, wherein at least
polishing of the delaminated wafer for removing of a step in the
peripheral part of the delaminated wafer and heat treatment in a
reducing atmosphere containing hydrogen are conducted as the
reprocessing.
4. A method of recycling a delaminated wafer produced as a
by-product in producing an SOI wafer according to a hydrogen ion
delaminating method in which FZ wafer is used as a bond wafer by
reprocessing it for reuse as a silicon wafer, wherein at least
polishing of the delaminated wafer for removing of a step in the
peripheral part of the delaminated wafer and heat treatment in a
reducing atmosphere containing hydrogen are conducted as the
reprocessing.
5. The method of recycling a delaminated wafer according to claim
1, wherein a surface oxide film is removed before polishing for
removal of a step in the peripheral part, as the reprocessing.
6. The method of recycling a delaminated wafer according to claim
2, wherein a surface oxide film is removed before polishing for
removal of a step in the peripheral part, as the reprocessing.
7. The method of recycling a delaminated wafer according to claim
3, wherein a surface oxide film is removed before polishing for
removal of a step in the peripheral part, as the reprocessing.
8. The method of recycling a delaminated wafer according to claim
4, wherein a surface oxide film is removed before polishing for
removal of a step in the peripheral part, as the reprocessing.
9. The method of recycling a delaminated wafer according to claim
1, wherein a stock removal in the polishing for removal of the step
in the peripheral part as the reprocessing is 1 to 2 microns.
10. The method of recycling a delaminated wafer according to claim
2, wherein a stock removal in the polishing for removal of the step
in the peripheral part as the reprocessing is 1 to 2 microns.
11. The method of recycling a delaminated wafer according to claim
3, wherein a stock removal in the polishing for removal of the step
in the peripheral part as the reprocessing is 1 to 2 microns.
12. The method of recycling a delaminated wafer according to claim
4, wherein a stock removal in the polishing for removal of the step
in the peripheral part as the reprocessing is 1 to 2 microns.
13. The method of recycling a delaminated wafer according to claim
1, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon, for 6
hours or less.
14. The method of recycling a delaminated wafer according to claim
2, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon, for 6
hours or less.
15. The method of recycling a delaminated wafer according to claim
3, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon, for 6
hours or less.
16. The method of recycling a delaminated wafer according to claim
4, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon, for 6
hours or less.
17. The method of recycling a delaminated wafer according to claim
1, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon for 1 to
300 seconds through use of a rapid heating/rapid cooling
apparatus.
18. The method of recycling a delaminated wafer according to claim
2, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon for 1 to
300 seconds through use of a rapid heating/rapid cooling
apparatus.
19. The method of recycling a delaminated wafer according to claim
3, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon for 1 to
300 seconds through use of a rapid heating/rapid cooling
apparatus.
20. The method of recycling a delaminated wafer according to claim
4, wherein the heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon for 1 to
300 seconds through use of a rapid heating/rapid cooling
apparatus.
21. The method of recycling a delaminated wafer according to claim
1, wherein said heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed in 100% hydrogen
atmosphere or a mixed atmosphere of hydrogen and argon.
22. The method of recycling a delaminated wafer according to claim
2, wherein said heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed in 100% hydrogen
atmosphere or a mixed atmosphere of hydrogen and argon.
23. The method of recycling a delaminated wafer according to claim
3, wherein said heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed in 100% hydrogen
atmosphere or a mixed atmosphere of hydrogen and argon.
24. The method of recycling a delaminated wafer according to claim
4, wherein said heat treatment in a reducing atmosphere containing
hydrogen as the reprocessing is performed in 100% hydrogen
atmosphere or a mixed atmosphere of hydrogen and argon.
25. The method of recycling a delaminated wafer, wherein the
delaminated wafer reprocessed by the method according to claim 1 is
reused as a bond wafer of an SOI wafer.
26. The method of recycling a delaminated wafer, wherein the
delaminated wafer reprocessed by the method according to claim 2 is
reused as a bond wafer of an SOI wafer.
27. The method of recycling a delaminated wafer, wherein the
delaminated wafer reprocessed by the method according to claim 3 is
reused as a bond wafer of an SOI wafer.
28. The method of recycling a delaminated wafer, wherein the
delaminated wafer reprocessed by the method according to claim 4 is
reused as a bond wafer of an SOI wafer.
29. A silicon wafer for reuse, wherein the silicon wafer is
obtained by being reprocessed according to the method of claim
1.
30. A silicon wafer for reuse, wherein the silicon wafer is
obtained by being reprocessed according to the method of claim
2.
31. A silicon wafer for reuse, wherein the silicon wafer is
obtained by being reprocessed according to the method of claim
3.
32. A silicon wafer for reuse, wherein the silicon wafer is
obtained by being reprocessed according to the method of claim 4.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a method of recycling a
silicon wafer by reprocessing a delaminated (split) wafer produced
as a by-product in a hydrogen ion delaminating method (also called
a smart cut method) wherein an ion-implanted wafer is bonded to
another wafer and a portion of the ion-implanted wafer is
delaminated to thereby obtain an SOI (silicon on insulator) wafer.
Particularly, the present invention relates to a method of
reprocessing the delaminated wafer many times, and reusing it many
times.
[0003] 2. Description of the Related Art
[0004] Conventionally, two methods have gained wide notice as
methods of fabricating wafers having an SOI structure. One method
is a SIMOX (separation by implanted oxygen) method in which oxygen
ions are implanted into a silicon monocrystal at a high
concentration, and heat treatment is then performed at a high
temperature in order to form an oxide layer. The other method is a
bonding method in which two mirror-polished silicon wafers are
bonded together without use of adhesive, and one of the wafers is
subsequently made very thin.
[0005] In the SIMOX method, the thickness of an SOI layer that
becomes a device active region can be determined and controlled
through adjustment of an acceleration voltage at the time of oxygen
ion implantation. Therefore, the SIMOX method has an advantage of
enabling easy formation of a thin SOI layer having a high
uniformity of thickness. However, the SIMOX method has many
problems in relation to the reliability of a buried oxide layer,
the crystallinity of the SOI layer, necessity of heat treatment at
a temperature of 1300.degree. C. or higher, and the like.
[0006] Meanwhile, in the wafer bonding method, an oxide film is
formed on at least one of two mirror-polished silicon single
crystal wafers, which are bonded together without use of adhesive
and then subjected to heat treatment (typically, at
1100-1200.degree. C.) in order to strengthen the bonding;
subsequently, one of the wafers is subjected to grinding or wet
etching such that the wafer becomes a thin film, the surface of
which is then mirror-polished to form an SOI layer. Therefore, the
reliability of the buried oxide layer is high, and the
crystallinity of the SOI layer is good.
[0007] However, since the thin film is formed by means of
mechanical machining, it takes long time to form the thin film, and
a great portion of one of the wafers is pulverized to be lost.
Therefore, productivity is extremely low, and production cost is
significantly high. Furthermore, there are limits to the thickness
and thickness uniformity of the resultant SOI layer in formation of
the thin film by grinding and polishing by means of mechanical
machining.
[0008] Furthermore, most of waters used in the wafer bonding method
are CZ wafers produced by Czochralski method (CZ method). However,
it has been found in recent years that there exist in the CZ wafer
crystal defects called COP (Crystal Originated Particle) which are
incorporated while the crystal is growing. Accordingly, when the CZ
wafer is used as a bond wafer which is to be a device active layer,
COP exists also in the SOI layer, and pierces through the SOI layer
which is very thin as required recently to form a pin hole which
extremely degrades electric characteristics of the wafer.
[0009] To solve the problem, there is proposed, for example, a
method wherein CZ wafer on which an epitaxial layer is grown is
bonded to other wafer on the side of the epitaxial layer, and the
silicon wafer which constitutes a base is ground and polished to
form a SOI layer (see Japanese Patent Application Laid-open (Kokai)
No. 7-254689). According to the method, the above mentioned crystal
defects such as COP can be surely eliminated. However, since it is
necessary to use an expensive epitaxial wafer, production cost of
the SOI wafer gets far higher.
[0010] When FZ wafer is used, there is no problem in relation to
defects due to oxygen or the above mentioned COP, since no oxygen
is contained in the FZ wafer. However, since only one SOI wafer can
be obtained from two silicon wafers, there still exists the problem
of high production cost.
[0011] In the wafer bonding method, not only silicon wafers are
bonded together, but also a silicon wafer may be bonded directly to
an insulator wafer of SiO.sub.2, SiC, Al.sub.2O.sub.3 or the like,
in order to form an SOI layer.
[0012] Recently, public attention has been drawn to a new method of
fabricating an SOI wafer in which an ion-implanted wafer is bonded
to another wafer and a portion of the ion-implanted wafer is
delaminated (split) to thereby obtain an SOI wafer (hydrogen ion
delaminating method: so-called smart-cut method). In this method,
an oxide film is formed on the surface of at least one of two
silicon wafers; and hydrogen ions or rare gas ions are implanted
into the surface of one of the two silicon wafers in order to form
a fine bubble layer (enclosed layer) within the wafer; the
ion-implanted silicon wafer is superposed on the other silicon
wafer such that the ion-implanted surface comes into close contact
with the surface of the other silicon wafer via the oxide film;
heat treatment is performed to delaminate a portion of the
ion-implanted wafer while the fine bubble layer is used as a
delaminating plane, in order to form a thin film; and heat
treatment (bonding heat treatment) is further performed to firmly
bond the thin film and the other wafer, to thereby obtain an SOI
wafer (see Japanese Patent Application Laid-Open (kokai) No.
5-211128 or U.S. Pat. No. 5,374,564). Also, in this method, since
the surface formed as a result of delamination is a good
mirror-like surface, an SOI wafer whose SOI layer has a high
thickness uniformity is obtained with relative ease.
[0013] Also in the hydrogen ion delaminating method described
above, not only silicon wafers are bonded together, but also an
ion-implanted silicon wafer may be bonded directly to an insulator
wafer of SiO.sub.2, SiC, Al.sub.2O.sub.3, etc., in order to form an
SOI layer.
[0014] When the SOI wafer is fabricated by the hydrogen ion
delaminating method, a silicon delaminated wafer is inevitably
produced as a by-product. It has been proposed to reuse such a
delaminated wafer as a by-product so that one SOI wafer can be
obtained substantially from one silicon wafer, and thereby to
reduce production cost significantly.
[0015] It is conceptually possible to reuse the delaminated wafer,
but there has been no actual cases of reusing the delaminated
wafer, and the specific means for reusing it has not yet been
known. The inventors of the present invention have studied and
found that the wafer as just delaminated cannot be reused for the
following reasons: a step is present in the peripheral part of the
wafer; a damage layer due to ion implantation is present on the
surface thereof; and surface roughness thereof is large.
Accordingly, it is necessary to remove the step in the peripheral
part of the wafer, the damage layer, or the like, in order to reuse
the delaminated wafer as a silicon wafer.
[0016] In this case, it may be conceived that the surface of the
delaminated wafer is ground, and then polished in order to remove
the step in the peripheral part and the damage layer, and to
improve surface roughness or the like. However, in order to improve
the surface properties by grinding and polishing, long processing
time and a lot of stock removal are required. Moreover, in the case
that an epitaxial layer is used as a bond wafer in the hydrogen ion
delimitation method, and SOI layer is made of an epitaxial layer,
since the epitaxial layer remaining on the delaminated layer is
completely removed, the epitaxial layer cannot be reused as a SOI
layer. Accordingly, cost for fabrication of SOI wafer cannot be
reduced.
[0017] In the case that CZ wafer is used as a bond wafer, the
problems in relation to the above-mentioned COP cannot be solved by
grinding and polishing. In the case that FZ wafer is used as a bond
wafer, a lot of stock removal in grinding or polishing means the
small number of times of reuse, and further, long processing time,
and high production cost.
SUMMARY OF THE INVENTION
[0018] The present invention has been accomplished to solve the
above-mentioned problems, and an object of the present invention is
to provide a method of appropriately reprocessing a delaminated
wafer produced as a by-product in a hydrogen ion delaminating
method to reuse it as a silicon wafer actually. Particularly, the
object of the present invention is to provide a method of
reprocessing an expensive wafer such as an epitaxial wafer many
times for reuse, to improve productivity of SOI wafer having a high
quality SOI layer, and to reduce producing cost.
[0019] To achieve the above object, the present invention provides
a method of recycling a delaminated wafer produced as a by-product
in producing an SOI wafer according to a hydrogen ion delaminating
method by reprocessing it for reuse as a silicon wafer wherein
polishing of the delaminated wafer for removing of a step in the
peripheral part of the delaminated wafer and heat treatment in a
reducing atmosphere containing hydrogen are at least conducted as
the reprocessing.
[0020] As described above, it has been found that there is a step
in the peripheral part of the delaminated wafer produced as a
by-product. According to the method of the present invention, the
step in the peripheral part of the delaminated wafer is removed by
polishing as reprocessing. With polishing for removal of the step
in the peripheral part of the delaminated wafer, the peripheral
step can be easily removed, and moreover, the damage layer on the
surface of the delaminated wafer can also be removed, and the
surface roughness can also be improved at the same time.
[0021] Basically, polishing is conducted only to the stock removal
necessary for removal of the step in the peripheral part in the
present invention. Removal of the damage layer remaining on the
surface and improvement of the surface roughness are achieved by
the heat treatment for the delaminated wafer in a reducing
atmosphere containing hydrogen.
[0022] The present invention also provides a method of recycling a
delaminated wafer produced as a by-product in producing an SOI
wafer according to a hydrogen ion delaminating method in which an
epitaxial wafer is used as a bond wafer by reprocessing it for
reuse as a silicon wafer wherein polishing of the delaminated wafer
for removal of a step in the peripheral part of the delaminated
wafer and heat treatment in a reducing atmosphere containing
hydrogen are at least conducted as the reprocessing.
[0023] As described above, since the stock removal is kept to a
minimum to reprocess the delaminated wafer in the method of the
present invention, the epitaxial layer of the expensive epitaxial
wafer can be reprocessed and reused many times, so that the SOI
wafer of high quality can be fabricated at low cost.
[0024] Furthermore, the present invention also provides a method of
recycling a delaminated wafer produced as a by-product in producing
an SOI wafer according to a hydrogen ion delaminating method in
which CZ wafer is used as a bond wafer by reprocessing it for reuse
as a silicon wafer wherein polishing of the delaminated wafer for
removing of a step in the peripheral part of the delaminated wafer
and heat treatment in a reducing atmosphere containing hydrogen are
at least conducted as the reprocessing.
[0025] As described above, since the delaminated wafer is subjected
to the heat treatment in a reducing atmosphere containing hydrogen
in the method of the present invention, a damage layer on the
surface of the delaminated wafer can be removed, the surface
roughness can be improved, and further, COPs in CZ wafer can be
eliminated. Accordingly, in the case that CZ wafer is used as a
bond wafer in a hydrogen ion delamination method, and a delaminated
wafer is CZ wafer, the recycled (reclaimed) wafer in which COPs in
the delaminated wafer are eliminated can be obtained.
[0026] Moreover, the present invention provides a method of
recycling a delaminated wafer produced as a by-product in producing
an SOI wafer according to a hydrogen ion delaminating method in
which FZ wafer is used as a bond wafer by reprocessing it for reuse
as a silicon wafer wherein polishing of the delaminated wafer for
removing of a step in the peripheral part of the delaminated wafer
and heat treatment in a reducing atmosphere containing hydrogen are
at least conducted as the reprocessing.
[0027] As described above, since the stock removal is kept to a
minimum to reprocess the delaminated wafer in the method of the
present invention, the FZ wafer having no COP can be reprocessed
many times to be reused, so that the SOI wafer having high quality
can be fabricated at low cost.
[0028] It is preferable that a surface oxide film is removed before
polishing for removal of a step in the peripheral part, as
reprocessing of delaminated wafer.
[0029] When the surface oxide film is removed before polishing for
removal of the peripheral step, the polishing can be conducted
uniformly. Namely, when the oxide film is present on the peripheral
part having the step, the step will be larger. Furthermore, since
the oxide film and the silicon are different in hardness, uniform
polishing is difficult in the presence of the oxide film.
[0030] A stock removal in polishing for removal of the step in the
peripheral part as reprocessing of the delaminated wafer is
preferably 1 to 2 .mu.m.
[0031] With such a small stock removal, the peripheral step can be
surely removed. Furthermore, since the stock removal is small, the
epitaxial layer can be used as the SOI layer many times by
reprocessing the delaminated wafer, even when the epitaxial wafer
is used as a bond wafer.
[0032] It is preferable that the heat treatment in a reducing
atmosphere containing hydrogen as reprocessing of the delaminated
wafer is performed at a temperature in the range from 1000.degree.
C. to a melting point of silicon, for 6 hours or less.
[0033] When the heat treatment is performed under such a condition,
namely at high temperature for a long time, the damage layer on the
surface can be removed and surface roughness can be improved
surely. Furthermore, the heat treatment in a reducing atmosphere
containing hydrogen can be performed through use of a conventional
resistance heating furnace.
[0034] In another embodiment of the present invention, the heat
treatment as reprocessing of the delaminated wafer in a reducing
atmosphere containing hydrogen is performed at a temperature in the
range from 1000.degree. C. to a melting point of silicon for 1 to
300 seconds through use of a rapid heating/rapid cooling
apparatus.
[0035] When the delaminated wafer is subjected to the heat
treatment in a reducing atmosphere containing hydrogen through use
of the rapid heating/rapid cooling apparatus as mentioned above,
removal of a damage layer on the surface of the delaminated wafer
and improvement of surface roughness thereof can be achieved
efficiently in a very short time.
[0036] In another embodiment of the present invention, the heat
treatment as reprocessing of the delaminated wafer in a reducing
atmosphere containing hydrogen is performed in 100% hydrogen
atmosphere or a mixed atmosphere of hydrogen and argon.
[0037] In such an atmosphere for the heat treatment, the surface of
the delaminated wafer can be surely improved.
[0038] As described above, the delaminated wafer reprocessed
according to the present invention has high quality, namely, the
peripheral step can be removed, the damage layer can be removed and
the surface roughness can be improved therein. Therefore, it can be
used as various silicon wafers.
[0039] Particularly, according to the present invention, since the
stock removal can be decreased, the reprocessed wafer can be reused
as a bond wafer of the SOI wafer, and thereby the delaminated wafer
can be reused for fabrication of the SOI wafer many times.
[0040] The present invention also provides a silicon wafer to be
reused, which is obtained according to the above-mentioned methods
of reprocessing.
[0041] As described above, the delaminated wafer reprocessed
according to the present invention can be reused as a silicon
wafer. Particularly, since the stock removal for reprocessing
according to the present invention is very small, it is not always
necessary to previously control thickness of the wafer to be
delaminated in the hydrogen ion delaminating method. Accordingly,
recycling of the delaminated wafer can be conducted quite easily
and conveniently.
[0042] As described above, when the delaminated wafer produced as a
by-product in the hydrogen ion delaminating method is reprocessed
appropriately according to the present invention, it can be
actually reused as a silicon wafer. Particularly, the stock removal
of the delaminated wafer can be decreased, an expensive wafer such
as an epitaxial wafer can be reprocessed many times to be reused
many times. Thereby, improvement in productivity of the SOI wafer
having the SOI layer of high quality and cost reduction can be
achieved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0043] FIG. 1 (a)-(h) is a flowchart showing an example of an
SOI-wafer fabricating process according to a hydrogen ion
delaminating method.
[0044] FIG. 2 (A)-(F) is a flowchart showing a method of
reprocessing a delaminated wafer for reuse of the present
invention, employed in an example.
[0045] FIG. 3 is a graph showing a result of measurement of a
peripheral step of a delaminated wafer.
[0046] (A) shows a delaminated wafer which is not processed,
[0047] (B) shows a delaminated wafer after an oxide film is
removed, and
[0048] (C) shows a delaminated wafer after a peripheral step is
removed.
[0049] FIG. 4 is a graph showing a relation between stock removal
in polishing for removal of a peripheral step and height of the
step.
[0050] FIG. 5 is a graph showing a result of measurement of a
damage layer of the delaminated wafer.
[0051] FIG. 6 is a schematic view of an example of a rapid
heating/rapid cooling apparatus.
DESCRIPTION OF THE INVENTION AND A PREFERRED EMBODIMENT
[0052] The present invention will be further described below in
detail, referring to the drawings, but is not limited thereto.
[0053] The present invention will be hereunder explained mainly as
for a method of producing SOI wafer by bonding two silicon
wafers.
[0054] In step (a) of the hydrogen ion delaminating method shown in
FIG. 1, two silicon wafers, namely a base wafer 1 to be a base and
a bond wafer 2 to be an SOI layer which are suitable for device
specifications are prepared. In this embodiment, an epitaxial wafer
consisting of a silicon mirror wafer on which an epitaxial layer 13
having a thickness of about 10 .mu.m was grown is employed as a
bond wafer 2.
[0055] In step (b), at least one of the wafers, the bond wafer
(epitaxial wafer) 2 in this case is subjected to thermal oxidation
so as to form on the surface thereof an oxide film 3 having a
thickness of about 0.1 .mu.m to 2.0 .mu.m.
[0056] In step (c), hydrogen ions or rare gas ions are implanted
into one surface, on which the epitaxial layer is formed, of the
bond wafer 2 on which oxide film is formed, in order to form a fine
bubble layer (enclosed layer) 4 which extends in parallel to the
surface at a position corresponding to the mean penetration depth
of ion implantation. The implantation temperature is preferably
25-450.degree. C.
[0057] In step (d), the base wafer 1 is superposed on the hydrogen
ion-implanted surface (the epitaxial layer formed surface) of the
hydrogen ion-implanted bond wafer 2 via the oxide film, and they
are brought in close contact with each other. When the surfaces of
the two wafers are brought into contact with each other at ambient
temperature in a clean atmosphere, the wafers adhere to each other
without use of adhesive or the like.
[0058] In step (e), there is performed a heat treatment for
delamination in which a delaminated wafer 5 is delaminated from an
SOI wafer 6 (composed of the SOI layer 7, a buried oxide layer 3,
and a base wafer 1) while the enclosed layer 4 is used as a
delaminating plane. The heat treatment is performed, for example,
at a temperature of about 500.degree. C. or higher in an inert gas
atmosphere so as to cause crystal rearrangement and bubble
cohesion, and thereby the delaminated wafer 5 is delaminated from
the SOI wafer 6. In this case all of the SOI layer 7 is made of an
epitaxial layer.
[0059] In step (f), the SOI wafer 6 is subjected to heat treatment
at high temperature as bonding heat treatment to achieve sufficient
bonding strength, since the bonding strength imparted in the
closely contacting step (d) and the delaminating heat treatment
step (e) described above is not sufficient to be used without
further treatment in a device process. Preferably, this heat
treatment is performed, for example, in an inert gas atmosphere at
1050 -1200.degree. C. for 30 minutes to 2 hours.
[0060] Step (e), i.e. the delaminating heat treatment and step (f),
i.e. the bonding heat treatment can be conducted successively.
Alternatively, step (e), i.e. the delaminating heat treatment he
can also serve as a bonding heat treatment of step (f).
[0061] In step (g), a mirror polishing process called touch
polishing wherein a stock removal is very small is then performed
to remove a crystal defect layer on a delaminated surface which is
a surface of the SOI layer 7 and improve the surface roughness.
[0062] The SOI wafer 6 of high quality having the SOI layer 7
consisting of an epitaxial layer of high crystal quality and high
thickness uniformity can be produced (step (h)) through the steps
described above.
[0063] In the above hydrogen ion delaminating method, the
delaminated wafer 5 is produced as a by-product in the step (e) of
FIG. 1. The thickness of the SOI layer produced by the hydrogen ion
delaminating method is generally 0.1 to 1.5 microns, and 2 microns
at the thickest. Accordingly, the delaminated wafer 5 has a
sufficient thickness. Therefore, production cost for the SOI layer
can be significantly reduced by reusing the delaminated wafer as a
silicon wafer. Particularly, when the epitaxial wafer having the
epitaxial layer with thickness of about 10 microns is used as a
bond wafer as in the above-mentioned embodiment, the epitaxial
layer with thickness of about 8 microns or more remains after
delamination. Accordingly, if it can be used as a bond wafer again,
production cost for the SOI wafer wherein the epitaxial wafer is
used can be significantly reduced.
[0064] However, a step 10 is formed in the peripheral part of the
delaminated wafer 5 as shown in the enlarged schematic view of the
delaminated wafer of FIG. 2(A), and therefore, the wafer cannot be
used as a silicon wafer without processing further. The peripheral
step 10 is formed because the periphery of the bond wafer cannot be
bonded to a base wafer. Accordingly, the height of the step is
approximately the same as the sum of the thickness of the SOI layer
and the thickness of the buried oxide layer 3.
[0065] Furthermore, the damage layer 12 due to hydrogen ion
implantation remains on the delaminated surface 11 of the
delaminated wafer, and the surface roughness is worse than that of
a general mirror wafer. Particularly, the surface roughness is
locally inferior. Accordingly, when the wafer is subjected to
preferential etching such as alkali etching, deep pits are formed
therein.
[0066] In that case, it would be conceived that all of the
peripheral step, the damage layer and the surface roughness is
removed by grinding and polishing. However, stock removal will be
too much, and processing time will be too long in such a method.
Furthermore, in the case that the epitaxial wafer is used as a bond
wafer as in the above-mentioned embodiment, the epitaxial layer
will be completely removed, and therefore it will not be able to be
reused as an SOI layer.
[0067] In order to solve the above-mentioned problems, the
inventors have studied a method wherein a delaminated wafer
produced as a by-product in a hydrogen ion delamination method is
reprocessed appropriately to be actually reused as a silicon wafer,
and completed the present invention.
[0068] In particular, the inventors studied a method wherein a
stock removal for reprocessing a delaminated wafer is reduced in
order to reprocess and to reuse an expensive wafer with high
quality, such as the above-mentioned epitaxial wafer, many
times.
[0069] Namely, according to the present invention, the peripheral
step formed on the delaminated wafer produced as a by-product in
fabrication of an SOI wafer by the hydrogen ion delaminating method
is removed by being polished slightly.
[0070] As described above, when the peripheral step in the
delaminated wafer is removed by polishing, the peripheral step can
be easily removed. For example, when the thickness of the SOI layer
is 0.2 micron, a stock removal of about 1 micron will be enough to
remove the step completely. Even when the SOI layer is thicker, a
stock removal of 2 microns will be enough to remove the peripheral
step.
[0071] Furthermore, when the peripheral step is removed by
polishing, removal of the damage layer and improvement of the
surface roughness on the delaminated wafer can also be achieved in
some extent at the same time.
[0072] In the method of the present invention, a surface oxide film
3 is preferably removed in reprocessing of the delaminated wafer
before the polishing for removal of the peripheral step.
[0073] Because, when the surface oxide film 3 is removed before
polishing for removal of the peripheral step 10, the polishing can
be performed uniformly. When the oxide film 3 is deposited on the
peripheral step 10, the height of the step is higher, and uniform
polishing in the surface of the delaminated wafer is difficult
because of the difference in hardness between the oxide film and
silicon.
[0074] The removal of the oxide film can be easily performed by
dipping the delaminated wafer into hydrofluoric acid.
[0075] Next, in the present invention, the delaminated wafer is
subjected to the heat treatment in a reducing atmosphere containing
hydrogen in order to improve the surface roughness completely.
Because, when the finish polishing is performed after polishing for
removal of the peripheral step, the stock removal will be
increased. Therefore, improvement of the surface roughness and
removal of the damage layer are achieved by subjecting the
delaminated wafer to the heat treatment in a reducing atmosphere
containing hydrogen as reprocessing for the delaminated wafer in
the present invention.
[0076] The heat treatment can remove the damage layer and improve
the surface roughness without decreasing the thickness of the
delaminated wafer. Accordingly, the stock removal in reprocessing
can be basically kept within the amount which is necessary for
removal of the peripheral step.
[0077] In that case, the order of the polishing for removal of the
peripheral step and the heat treatment in a reducing atmosphere
containing hydrogen is not necessary to be specific. It is
preferable to remove the peripheral step before the heat treatment,
namely to perform the heat treatment after removal of the surface
damage layer and the surface roughness in some extent, since in
that case the damage layer can be removed more completely, and the
surface roughness can be further improved. However, it doesn't
matter if the polishing for removal of the peripheral step is
performed after the heat treatment in a reducing atmosphere
containing hydrogen.
[0078] The heat treatment in a reducing atmosphere containing
hydrogen in the present invention can be conducted preferably, for
example, at 1000.degree. C. to a melting point of silicon, more
preferably at 1200 to 1350.degree. C., for 6 hours or less.
[0079] When the high temperature heat treatment is conducted for a
long time under the above-mentioned condition, it is possible to
surely remove the damage layer on the surface of the delaminated
wafer and to improve the surface roughness with any type of heat
treatment furnace. The heat treatment at a high temperature such as
1200.degree. C. or more makes it possible to remove the damage
layer efficiently and to improve the surface roughness. However,
heat treatment at a temperature higher than 1350.degree. C. may
cause problems in relation to durability of a furnace and wafer
contamination. Accordingly, the heat treatment at a temperature of
1200.degree. C. to 1350.degree. C. is preferable.
[0080] However, the heat treatment using a general heat treatment
furnace such as described above takes long time. Accordingly, the
heat treatment of the present invention can be conducted through
use of a rapid heating/rapid cooling apparatus at a temperature in
the range from 1000.degree. C. to the melting point of silicon for
1 to 300 seconds.
[0081] When the delaminated wafer is subjected to the heat
treatment in a reducing atmosphere containing hydrogen through use
of the rapid heating/rapid cooling apparatus as described above,
the damage layer on the surface of the delaminated wafer can be
removed and the surface roughness can be improved efficiently in
very short time. Temperature in the range from 1200.degree. C. to
1350.degree. C. is more effective also in this case.
[0082] Examples of an apparatus which can heat and cool the
delaminated wafer rapidly, used in the present invention include:
an apparatus heater such as a lamp heater with heat radiating. An
example of commercially available apparatuses is SHS-2800 (product
of AST corp.). These apparatuses are neither extremely complicated
nor expensive.
[0083] One example of the apparatus which can heat and cool the
delaminated wafer rapidly, used in the present invention will be
given below. FIG. 6 is a schematic sectional view of the rapid
heating/rapid cooling apparatus.
[0084] A heat-treatment apparatus 20 shown in FIG. 6 includes a
bell jar 21 which is formed from, for example, silicon carbide or
quarts and in which a wafer is heat-treated. Heating is performed
with heaters 22 and 22' surrounding the bell jar 21. The heaters
are separated into the upper one and the lower one, so that power
supplied to each of the heaters can be controlled independently.
The heating method is not limited thereto, but so-called radiation
heating and high-frequency heating may also be applicable. A
housing 23 for heat shield is disposed around the heaters 22 and
22'.
[0085] A water-cooled chamber 24 and a base plate 25 are arranged
at the lower portion of a furnace so as to isolate the interior of
the bell jar 21 from the atmosphere. A delaminated wafer 28 is held
on a stage 27, which is attached to the top-end of a support shaft
26 capable of being moved vertically by means of a motor 29. In
order to load a wafer into or unload it from the furnace along a
horizontal direction, the water-cooled chamber 24 has an
unillustrated wafer port which is opened and closed by means of a
gate valve. A gas inlet and a gas outlet are provided in the base
plate 25 so that the gas atmosphere within the furnace can be
adjusted.
[0086] In the heat treatment furnace 20 having the above-described
structure, the heat treatment for rapid heating/rapid cooling of
the delaminated wafer is carried out in the procedure described
below.
[0087] First, the interior of the bell jar 21 is heated to a
desired temperature of 1000.degree. C. to the melting point of
silicon by the heaters 22 and 22' and is then held at the desired
temperature. Through mutually independent control on power supplied
to the heaters 22 and 22', a temperature distribution can be
established within the bell jar 21 along a vertical direction.
Accordingly, the heat-treatment temperature of a wafer is
determined by the position of the stage 27, i.e. the amount of
insertion of the support shaft 26 into the furnace. Heat treatment
atmosphere is controlled by introducing a reducing gas containing
hydrogen from the gas inlet provided in the base plate.
[0088] In a state in which the interior of the bell jar 21 is
maintained at a desired temperature, a delaminated wafer is
inserted into the water-cooled chamber 24 through the wafer port by
an unillustrated wafer handling apparatus arranged next to the heat
treatment apparatus 20. The inserted wafer is placed in, for
example, a SiC boat provided on the stage 27 which is situated at
the bottom standby position. Since the water-cooled chamber 24 and
the base plate 25 are water-cooled, the wafer located at this
standby position is not heated to a high temperature.
[0089] Upon completion of placing the delaminated wafer on the
stage 27, the motor 29 is immediately driven to insert the support
shaft 26 into the furnace so that the stage 27 is raised to a heat
treatment position where a desired temperature in the range of
1000.degree. C. to a melting point of silicon is established,
thereby heat-treating the delaminated wafer on the stage at the
high temperature. In this case, since only approximately 20
seconds, for example, is required for moving the stage 27 from the
bottom standby position in the wafer-cooled chamber 24 to the heat
treatment position, the delaminated wafer is heated quickly.
[0090] The stage 27 is halted at the desired temperature position
for a predetermined time (1 to 300 seconds), thereby subjecting the
delaminated wafer to high-temperature heat treatment over the
halting time in a reducing atmosphere. Upon elapse of the
predetermined time to complete high-temperature heat treatment, the
motor 29 is immediately driven to-withdraw the support shaft 26
from the interior of the furnace to thereby lower the stage 27 to
the bottom standby position in the watercooled chamber 24. This
lowering motion can be completed in approximately 20 seconds, for
example. The delaminated wafer on the stage 27 is quickly cooled,
since the water-cooled chamber 24 and the base plate 25 are
water-cooled. Finally, the delaminated wafer is unloaded from
inside the water-cooled chamber 24 by the wafer handling apparatus,
thus completing the heat treatment.
[0091] When there are more delaminated wafers to be heat-treated,
these wafers can be sequentially loaded into and heat-treated in
the heat treatment furnace 20 maintained at a predetermined high
temperature without lowering temperature.
[0092] In this case, atmosphere of the heat treatment in reducing
atmosphere containing hydrogen can be a 100% hydrogen atmosphere or
a mixed atmosphere of hydrogen and argon.
[0093] In the above-mentioned atmosphere for the heat treatment, a
film which is harmful for the surface of the delaminated wafer is
not formed, a damage layer on the surface of the delaminated wafer
can be surely removed, and the surface roughness can be
improved.
[0094] There can be thus obtained the recycled (reclaimed) afer
wherein the peripheral step of the delaminated wafer and the damage
layer due to hydrogen ion implantation on the delaminated surface
can be removed, and the surface roughness of the delaminated
surface can be improved, so that the surface thereof is not
inferior to that of the general mirror wafer.
[0095] Particularly, according to the present invention, thickness
of the delaminated wafer is decreased only by 1 micron, or by 2
microns at thickest, so that the wafer itself can be reused as a
bond wafer.
[0096] Namely, for example, when the SOI wafer is produced by the
hydrogen ion delaminating method using the epitaxial wafer as a
bond wafer, and the delaminated wafer produced as a by-product is
reprocessed according to the present invention to reproduce an
epitaxial wafer, the epitaxial wafer thus obtained can be reused as
a bond wafer, so that the epitaxial layer of the expensive
epitaxial wafer can be reprocessed many times to be reused as a SOI
layer. Accordingly, a SOI wafer having high quality can be obtained
at low cost.
[0097] Furthermore, when the delaminated wafer produced as a
by-product in producing an SOI wafer according to a hydrogen ion
delaminating method in which CZ wafer is used as a bond wafer is
reprocessed according to the present invention to produce a silicon
wafer, a damage layer on the surface of the delaminated wafer can
be removed, the surface roughness can be improved, and further,
COPs in CZ wafer can be eliminated in the resultant wafer, since
the wafer is subjected to the heat treatment in a reducing
atmosphere containing hydrogen. Accordingly, in the case that CZ
wafer is used as a bond wafer, and a delaminated wafer is CZ wafer
in the hydrogen ion delaminating method, the recycle (reclaimed)
wafer wherein COPs in the delaminated wafer are also eliminated can
be obtained.
[0098] Moreover, when the delaminated wafer produced as a
by-product in producing an SOI wafer according to a hydrogen ion
delaminating method in which FZ wafer is used as a bond wafer is
reprocessed according to the present invention to produce a silicon
wafer, the FZ wafer having no COP can be reprocessed many time for
reuse, since the stock removal for the delaminated wafer is kept to
a minimum, so that the SOI wafer having high quality can be
fabricated at low cost.
[0099] The silicon wafer thus reprocessed according to the present
invention can be used not only as a bond wafer again, but also as a
base wafer, or as a general silicon mirror wafer. Namely use of the
recycled (reclaimed) wafer obtained by the present invention is not
limited specifically.
[0100] Particularly, when the epitaxial wafer is used as a bond
wafer, the resultant delaminated wafer can also be used as a
general epitaxial wafer.
EXAMPLE
[0101] The following examples are being submitted to further
explain the present invention. These examples are not intended to
limit the scope of the present invention.
Example 1
[0102] Two silicon mirror wafers having resistivity of 1.0 to 2.0
.OMEGA..multidot.cm and a diameter of 150 mm wherein a conductive
type is p type were prepared. As for one of these wafers, an
epitaxial layer having a thickness of about 10 microns was grown.
The epitaxial wafer was used as a bond wafer, and processed through
steps (a) to (h) shown in FIG. 1 according to the hydrogen ion
delaminating method to fabricate SOI wafers. Thickness of SOI layer
was 0.2 micron. The major process conditions used in the method
were as follows.
[0103] 1) Thickness of a buried oxide layer: 400 nm (0.4
micron);
[0104] 2) Conditions of hydrogen implantation: H.sup.+ ions,
implantation energy of 69 kev, implantation dose of
5.5.times.10.sup.16/cm.sup.2;
[0105] 3) Conditions of heat treatment for delamination: in a
N.sub.2 gas atmosphere, at 500.degree. C. for 30 minutes.
[0106] 4) Conditions of heat treatment for bonding: in a N.sub.2
gas atmosphere, at 1100.degree. C. for 2 hours.
[0107] The high quality SOI wafer having the SOI layer of the
epitaxial layer with thickness of 0.2 micron could be thus
obtained, and the delaminated wafer 5 was also produced as a
by-product in step (e) of FIG. 1.
[0108] The delaminated wafer was reprocessed in accordance with the
step (A) to (F) of FIG. 2 in order to be reused as a bond
wafer.
[0109] First, the peripheral shape of the unprocessed delaminated
wafer 5 shown in FIG. 2(A) was measured by being scanned with a
contact probe type roughness meter. The results of the measurement
was shown in FIG. 3(A).
[0110] As shown in FIG. 3(A), there was formed a step 10 in the
peripheral part of the delaminated wafer 5 due to the part at which
the wafers were not bonded on bonding of the wafers. Height of the
peripheral step 10 was more than the sum of thickness of the SOI
layer (0.2 micron) and thickness of the oxide film layer (0.4
micron).
[0111] The surface roughness of the delaminated surface 11 of the
unprocessed delaminated wafer 5 shown in FIG. 2(A) as measured by a
phase shift interferometry method at 250 microns square and by an
atomic force microscope method at 1 micron square was 0.40 nm on
the average and 7.4 nm on average respectively (RMS value: root
mean square roughness).
[0112] The values were far worse than that of a general mirror
polished silicon wafer. Particularly, the value at 1 micron square
is 10 times or more that of the general mirror polished silicon
wafer, which shows that the surface roughness on the delaminated
surface is locally large.
[0113] Depth of a damage layer on the delaminated surface 11 of the
unprocessed delaminated wafer 5 shown in FIG. 2 (A) was determined
as follows. The wafers were subjected to etching with KOH aqueous
solution at a different etching removal. The wafers were then
subjected to pyrogenic oxidation at 1100.degree. C. for one hour,
and the oxide film formed on the surface was removed with an
aqueous solution of hydrofluoric acid. Subsequently, the surface
thereof was then subjected to preferential etching with Secco
etching solution, and observed with a microscope to measure a
density of OSF (oxidation induced stacking fault) existing on the
surface. Each etching removal was 0, 25, 50, 75, 100, 150, 200 nm.
The results of measurement was shown as a curved line a in FIG.
5.
[0114] As shown in FIG. 5, it is apparent that a damage layer
having a depth of about 100 nm exists on the surface of the
delaminated wafer. OSFs observed in a position deeper than 100 nm
were likely generated as a result that nuclei of OSF was formed in
the epitaxial layer due to crystal defects which have been
originally present in the substrate itself.
[0115] In FIG. 2(B), the delaminated wafer is dipped into
hydrofluoric acid to remove the oxide film 3 on the surface. HF 50%
aqueous solution was used as hydrofluoric acid. The peripheral
shape of the delaminated wafer wherein the oxide film was removed
was measured again by scanning with a contact probe type roughness
meter. The result was shown in FIG. 3(B).
[0116] As shown in FIG. 3(B), there is a step which is slightly
higher than thickness of the SOI layer (0.2 micron) in the
peripheral part of the delaminated wafer 5.
[0117] The delaminated wafer after removal of the oxide film was
subjected to polishing to remove the peripheral step as shown in
FIG. 2(C). Polishing was performed under the similar condition with
the similar apparatus to those for general polishing of a silicon
wafer. In the present invention, the delaminated surface was
polished by inserting the delaminated wafer between polishing turn
tables, rotating the polishing turn tables in such way that each of
the polishing turn tables rotates in opposite direction each other,
with loading at 500 g/cm.sup.2 and with supplying a polishing
slurry to the delaminated surface to be polished.
[0118] The result of the measurement as for the relation between
the polishing stock removal and height of the peripheral step was
shown in FIG. 4. As shown in FIG. 4, it is apparent that a stock
removal of about 1 micron is enough to remove the steps completely.
When the SOI layer is thicker and the step is higher, a stock
removal of 2 micron will be preferable for perfection.
[0119] The shape of the peripheral part of the delaminated wafer
wherein the peripheral step was removed by being polished to a
stock removal of 1 micron was measured again by scanning with a
contact probe type roughness meter. The result was shown in FIG.
3(C).
[0120] As shown in FIG. 3(C), the step in the peripheral part of
the delaminated wafer was completely removed by being polished to a
stock removal of 1 micron. Accordingly, the shape of the periphery
of the wafer was suitable for reuse as a silicon wafer.
[0121] The delaminated wafer was subjected to cleaning before heat
treatment as shown in FIG. 2(D) to prevent contamination thereof.
The cleaning is well known as RCA cleaning, and comprises two
steps: (aqueous ammonia/aqueous hydrogen peroxide) and
(hydrochloric acid/aqueous hydrogen peroxide).
[0122] After the cleaning before heat treatment, the delaminated
wafer was subjected to the heat treatment in a reducing atmosphere
containing hydrogen through use of a rapid heating/rapid cooling
apparatus shown in FIG. 6 under the following condition: in
hydrogen 100% atmosphere, at 1200.degree. C., for 30 seconds (FIG.
2 (E)).
[0123] The surface roughness of the delaminated surface after the
heat treatment with a rapid heating/rapid cooling apparatus as
measured by a phase shift interferometry method at 250 microns
square and by atomic force microscope method at 1 micron square was
0.25 nm on the average and 0.20 nm on the average respectively (RMS
value: root mean square roughness).
[0124] The values are equivalent to those value of the general
mirror polished silicon wafer. Accordingly, it is apparent that the
surface roughness was significantly improved.
[0125] After the heat treatment with rapid heating/rapid cooling
apparatus, OSF density on the surface as measured by subjecting the
wafer to oxidation and preferential etching and being observed with
a microscope was about 10 numbers/cm.sup.2, which is equivalent to
the density of OSF generated in an epitaxial layer due to influence
of the substrate.
[0126] As described above, the delaminated wafer reprocessed
according to the present invention has a quality good enough for
reuse as an epitaxial wafer again.
[0127] Accordingly, the reprocessed delaminated wafer was used as a
bond wafer as shown in FIG. 2(F). Namely, the above-mentioned
recycle (reclaimed) wafer was used as a bond wafer 2 in FIG. 1(a).
As the delaminated wafer was made only 1 micron thinner by being
polished to remove a peripheral step, it still has a thickness of
about 9 microns. Then, the steps shown in FIG. 1 was performed to
prepare SOI wafer in accordance with hydrogen ion delaminating
method. High quality SOI wafer wherein SOI layer consists of the
epitaxial layer could be obtained without any problems.
[0128] Then, in order to determine the effect of improvement in
damage layer and the surface roughness achieved by the heat
treatment in a reducing atmosphere containing hydrogen, the
delaminated wafer wherein the oxide film was removed as shown in
FIG. 2(B) but the polishing for removing the peripheral step was
not performed, namely the delaminated wafer having the damage layer
and the surface roughness on the delaminated surface, was subjected
to RCA cleaning described above and then directly to the above
mentioned heat treatment in a reducing atmosphere containing
hydrogen through use of the rapid heating/rapid cooling apparatus
shown in FIG. 6 under the following condition: in hydrogen 100%
atmosphere, at 1200.degree. C., for 30 seconds.
[0129] In order to determine the depth of a damage layer after the
heat treatment, the wafers which are different from each other in
etched thickness on the surface thereof were subjected to oxidation
and preferential etching, and observed with a microscope to measure
a density of OSF existing on the surface of each wafer. Each
etching removal was 0, 25, 50, 75, 100, 150, 200 nm. The results of
measurement was shown as a curved line b in FIG. 5.
[0130] As shown in FIG. 5, it is apparent that, even though
polishing was not performed, the damage layer on the surface of the
delaminated wafer after the heat treatment in a reducing atmosphere
containing hydrogen was removed.
[0131] The surface roughness of the delaminated layer after the
heat treatment with a rapid heating/rapid cooling apparatus as
measured by a phase shift interferometry method at 250 microns
square and by atomic force microscope method at 1 micron square was
0.32 nm on the average and 0.21 nm on the average respectively (RMS
value: root mean square roughness).
[0132] The values are equivalent to those of the general mirror
polished silicon wafer. Accordingly, it is apparent that the
surface roughness was significantly improved.
[0133] Accordingly, it is apparent that the order of the step of
polishing for removing the peripheral step as shown in step (C) of
FIG. 2 and the step of heat treatment in a reducing atmosphere
containing hydrogen as shown in steps (D) and (E) of FIG. 2 can be
changed.
[0134] The present invention is not limited to the above-described
embodiment. The above-described embodiment is a mere example, and
those having the substantially same structure as that described in
the appended claims and providing the similar action and effects
are included in the scope of the present invention.
[0135] For example, the above description of the present invention
has focused on the case where two silicon wafers are bonded to
obtain an SOI wafer. However, the present invention is not limited
to the embodiment. For example, the present invention is applicable
to reprocessing of a delaminated wafer produced as by-product in
the case where a silicon wafer after ion implantation thereinto is
bonded to an insulator wafer; and a portion of the ion-implanted
wafer is delaminated to thereby obtain an SOI wafer.
[0136] Furthermore, the processes of reprocessing the delaminated
wafer according to the present invention are not limited to that
shown in FIG. 2. Other processes such as cleaning, heat treatment
or the like can be added thereto. Furthermore, the order of the
processes can be partly changed or any of the processes can be
omitted depending on the purpose.
* * * * *