loadpatents
name:-0.029678106307983
name:-0.048447132110596
name:-0.0017020702362061
Aga; Hiroji Patent Filings

Aga; Hiroji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aga; Hiroji.The latest application filed is for "method for manufacturing soi wafer".

Company Profile
1.47.50
  • Aga; Hiroji - Takasaki JP
  • AGA; Hiroji - Takasaki-shi JP
  • Aga; Hiroji - Annaka JP
  • Aga; Hiroji - Gunma JP
  • Aga; Hiroji - Annaka Gunma JP
  • Aga; Hiroji - Annaka-shi JP
  • Aga, Hiroji - Gunma-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing SOI wafer
Grant 11,244,851 - Aga February 8, 2
2022-02-08
Method For Manufacturing Soi Wafer
App 20200111701 - AGA; Hiroji
2020-04-09
Method for manufacturing bonded SOI wafer
Grant 10,490,440 - Kobayashi , et al. Nov
2019-11-26
Method For Manufacturing Bonded Soi Wafer
App 20190221470 - KOBAYASHI; Norihiro ;   et al.
2019-07-18
Method for producing SOI wafer
Grant 10,204,824 - Yokokawa , et al. Feb
2019-02-12
Method for manufacturing an SOI wafer
Grant 10,115,580 - Aga , et al. October 30, 2
2018-10-30
Method For Producing Soi Wafer
App 20180144975 - YOKOKAWA; Isao ;   et al.
2018-05-24
Method of manufacturing SOI wafer
Grant 9,953,860 - Aga April 24, 2
2018-04-24
Method for manufacturing bonded wafer
Grant 9,865,497 - Yokokawa , et al. January 9, 2
2018-01-09
Method of producing bonded wafer with uniform thickness distribution
Grant 9,859,149 - Kobayashi , et al. January 2, 2
2018-01-02
Method for manufacturing bonded SOI wafer
Grant 9,793,154 - Aga , et al. October 17, 2
2017-10-17
Method For Manufacturing An Soi Wafer
App 20170287697 - AGA; Hiroji ;   et al.
2017-10-05
Method for manufacturing bonded wafer
Grant 9,773,694 - Kobayashi , et al. September 26, 2
2017-09-26
Method For Polishing Germanium Wafer
App 20170216992 - NAGAOKA; Yasuo ;   et al.
2017-08-03
Method Of Manufacturing Soi Wafer
App 20170200634 - AGA; Hiroji
2017-07-13
Method for manufacturing bonded wafer
Grant 9,679,800 - Kobayashi , et al. June 13, 2
2017-06-13
Method for manufacturing SOI wafer
Grant 9,673,085 - Aga , et al. June 6, 2
2017-06-06
Method For Manufacturing Bonded Soi Wafer
App 20160372363 - AGA; Hiroji ;   et al.
2016-12-22
Method For Manufacturing Bonded Wafer
App 20160365273 - KOBAYASHI; Norihiro ;   et al.
2016-12-15
Method For Manufacturing Bonded Wafer
App 20160204024 - KOBAYASHI; Norihiro ;   et al.
2016-07-14
Method For Manufacturing Bonded Wafer
App 20160197008 - YOKOKAWA; Isao ;   et al.
2016-07-07
Method for manufacturing SOI wafer
Grant 9,378,999 - Aga , et al. June 28, 2
2016-06-28
Method for manufacturing SOI wafer
Grant 9,337,080 - Aga , et al. May 10, 2
2016-05-10
Method Of Producing Bonded Wafer
App 20160118294 - KOBAYASHI; Norihiro ;   et al.
2016-04-28
Method for manufacturing SOI wafer
Grant 9,240,344 - Aga , et al. January 19, 2
2016-01-19
Method For Manufacturing Soi Wafer And Soi Wafer
App 20150340279 - KOBAYASHI; Norihiro ;   et al.
2015-11-26
Method For Manufacturing Soi Wafer
App 20150249035 - Aga; Hiroji ;   et al.
2015-09-03
Method For Manufacturing Soi Wafer
App 20150243550 - Aga; Hiroji ;   et al.
2015-08-27
Method for manufacturing bonded SOI wafer
Grant 9,093,497 - Kobayashi , et al. July 28, 2
2015-07-28
Method For Manufacturing Soi Wafer
App 20150206790 - Aga; Hiroji ;   et al.
2015-07-23
Method for manufacturing a bonded SOI wafer
Grant 9,076,840 - Kobayashi , et al. July 7, 2
2015-07-07
Method for manufacturing SOI wafer
Grant 9,029,240 - Aga , et al. May 12, 2
2015-05-12
Method for manufacturing bonded wafer and bonded SOI wafer
Grant 8,987,109 - Aga , et al. March 24, 2
2015-03-24
Method For Manufacturing Soi Wafer
App 20150064875 - Aga; Hiroji ;   et al.
2015-03-05
Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer
Grant 8,962,352 - Yokokawa , et al. February 24, 2
2015-02-24
Method For Manufacturing Bonded Soi Wafer
App 20150017783 - Kobayashi; Norihiro ;   et al.
2015-01-15
Method For Manufacturing Soi Wafer
App 20140329372 - Aga; Hiroji ;   et al.
2014-11-06
Method For Manufacturing A Bonded Soi Wafer
App 20140322895 - Kobayashi; Norihiro ;   et al.
2014-10-30
Method For Calculating Warpage Of Bonded Soi Wafer And Method For Manufacturing Bonded Soi Wafer
App 20140186977 - Yokokawa; Isao ;   et al.
2014-07-03
Method for manufacturing SOI wafer
Grant 8,728,912 - Aga , et al. May 20, 2
2014-05-20
Method For Manufacturing Bonded Wafer And Bonded Soi Wafer
App 20140097523 - Aga; Hiroji ;   et al.
2014-04-10
Method for producing bonded wafer
Grant 8,691,665 - Oka , et al. April 8, 2
2014-04-08
Method For Manufacturing Soi Wafer
App 20130316522 - Aga; Hiroji ;   et al.
2013-11-28
Method For Manufacturing Bonded Wafer
App 20130102126 - Aga; Hiroji ;   et al.
2013-04-25
Method For Producing Bonded Wafer
App 20120244679 - Oka; Satoshi ;   et al.
2012-09-27
Method for manufacturing SOI wafer
Grant 8,202,787 - Ishizuka , et al. June 19, 2
2012-06-19
Method for manufacturing bonded wafer
Grant 8,173,521 - Kobayashi , et al. May 8, 2
2012-05-08
Method for manufacturing bonded wafer
Grant 8,097,523 - Kobayashi , et al. January 17, 2
2012-01-17
Method For Manufacturing Soi Wafer
App 20110281420 - Aga; Hiroji ;   et al.
2011-11-17
Method For Manufacturing Soi Wafer
App 20110223740 - Ishizuka; Tohru ;   et al.
2011-09-15
Method For Manufacturing Bonded Wafer
App 20110151643 - Kobayashi; Norihiro ;   et al.
2011-06-23
Method for producing semiconductor wafer
Grant 7,959,731 - Yokokawa , et al. June 14, 2
2011-06-14
Method For Manufacturing Bonded Wafer
App 20110104870 - Kobayashi; Norihiro ;   et al.
2011-05-05
Method of manufacturing SOI wafer and thus-manufactured SOI wafer
Grant 7,902,042 - Aga , et al. March 8, 2
2011-03-08
Method For Manufacturing Bonded Wafer
App 20100120223 - Kobayashi; Norihiro ;   et al.
2010-05-13
SOI wafer and method for producing the same
Grant 7,560,313 - Aga , et al. July 14, 2
2009-07-14
Method of producing SOI wafer and SOI wafer
Grant 7,524,744 - Yokokawa , et al. April 28, 2
2009-04-28
Method for producing direct bonded wafer and direct bonded wafer
Grant 7,521,334 - Kobayashi , et al. April 21, 2
2009-04-21
Method For Producing Semiconductor Wafer
App 20080138959 - Yokokawa; Isao ;   et al.
2008-06-12
Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer
App 20080128851 - Aga; Hiroji ;   et al.
2008-06-05
Method for Producing Direct Bonded Wafer and Direct Bonded Wafer
App 20080102603 - Kobayashi; Norihiro ;   et al.
2008-05-01
Method of fabricating SOI wafer
Grant 7,320,929 - Aga , et al. January 22, 2
2008-01-22
Process for treating substrates for the microelectronics industry, and substrates obtained by this process
Grant 7,288,418 - Barge , et al. October 30, 2
2007-10-30
SOI wafer and method for producing the same
App 20070054459 - Aga; Hiroji ;   et al.
2007-03-08
Method for producing SOI wafer and SOI wafer
Grant 7,176,102 - Aga , et al. February 13, 2
2007-02-13
Process for treating substrates for the microelectronics industry, and substrates obtained by this process
App 20060189102 - Barge; Thierry ;   et al.
2006-08-24
Method for producing a semiconductor wafer
App 20060185581 - Aga; Hiroji ;   et al.
2006-08-24
Method for treating substrates for microelectronics and substrates obtained according to said method
Grant 7,029,993 - Barge , et al. April 18, 2
2006-04-18
Method for manufacturing soi wafer and soi wafer
App 20060051945 - Yokokawa; Isao ;   et al.
2006-03-09
Soi wafer manufacturing method
App 20060040469 - Aga; Hiroji ;   et al.
2006-02-23
SOI wafer producing method, and wafer separating jig
Grant 6,998,329 - Aga , et al. February 14, 2
2006-02-14
Method of producing soi wafer and soi wafer
App 20050118789 - Aga, Hiroji ;   et al.
2005-06-02
Method of manufacturing a bonded wafers using a Bernoulli chuck
Grant 6,897,124 - Tate , et al. May 24, 2
2005-05-24
Method for producing bonding wafer
Grant 6,884,696 - Aga , et al. April 26, 2
2005-04-26
Method for producing SOI wafer and SOI wafer
App 20050042840 - Aga, Hiroji ;   et al.
2005-02-24
Method for producing SOI wafer and SOI wafer
Grant 6,846,718 - Aga , et al. January 25, 2
2005-01-25
Soi wafer and its manufacturing method
App 20040219370 - Aga, Hiroji ;   et al.
2004-11-04
Soi wafer producing method, and wafer separating jig
App 20040180511 - Aga, Hiroji ;   et al.
2004-09-16
Method for manufacturing bonded wafers
App 20040152283 - Tate, Naoto ;   et al.
2004-08-05
Method for producing SOI wafer and SOI wafer
App 20040063298 - Aga, Hiroji ;   et al.
2004-04-01
Method for producing bonding wafer
App 20030181001 - Aga, Hiroji ;   et al.
2003-09-25
Optical function device with photonic band gap and/or filtering characteristics
Grant 6,380,551 - Abe , et al. April 30, 2
2002-04-30
Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method
Grant 6,372,609 - Aga , et al. April 16, 2
2002-04-16
Optical Function Device With Photonic Band Gap And/or Filtering Characteristics
App 20010032977 - ABE, TAKAO ;   et al.
2001-10-25
Method of recycling a delaminated wafer and a silicon wafer used for the recycling
App 20010029072 - Kuwahara, Susumu ;   et al.
2001-10-11
Method of recycling a delaminated wafer and a silicon wafer used for the recycling
Grant 6,284,628 - Kuwahara , et al. September 4, 2
2001-09-04
Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer
Grant 6,239,004 - Aga , et al. May 29, 2
2001-05-29
Method of fabricating an SOI wafer and SOI wafer fabricated thereby
Grant 6,140,210 - Aga , et al. October 31, 2
2000-10-31
SOI wafer and method for the preparation thereof
Grant 5,998,281 - Aga , et al. December 7, 1
1999-12-07

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed