loadpatents
Patent applications and USPTO patent grants for Aga; Hiroji.The latest application filed is for "method for manufacturing soi wafer".
Patent | Date |
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Method for manufacturing SOI wafer Grant 11,244,851 - Aga February 8, 2 | 2022-02-08 |
Method For Manufacturing Soi Wafer App 20200111701 - AGA; Hiroji | 2020-04-09 |
Method for manufacturing bonded SOI wafer Grant 10,490,440 - Kobayashi , et al. Nov | 2019-11-26 |
Method For Manufacturing Bonded Soi Wafer App 20190221470 - KOBAYASHI; Norihiro ;   et al. | 2019-07-18 |
Method for producing SOI wafer Grant 10,204,824 - Yokokawa , et al. Feb | 2019-02-12 |
Method for manufacturing an SOI wafer Grant 10,115,580 - Aga , et al. October 30, 2 | 2018-10-30 |
Method For Producing Soi Wafer App 20180144975 - YOKOKAWA; Isao ;   et al. | 2018-05-24 |
Method of manufacturing SOI wafer Grant 9,953,860 - Aga April 24, 2 | 2018-04-24 |
Method for manufacturing bonded wafer Grant 9,865,497 - Yokokawa , et al. January 9, 2 | 2018-01-09 |
Method of producing bonded wafer with uniform thickness distribution Grant 9,859,149 - Kobayashi , et al. January 2, 2 | 2018-01-02 |
Method for manufacturing bonded SOI wafer Grant 9,793,154 - Aga , et al. October 17, 2 | 2017-10-17 |
Method For Manufacturing An Soi Wafer App 20170287697 - AGA; Hiroji ;   et al. | 2017-10-05 |
Method for manufacturing bonded wafer Grant 9,773,694 - Kobayashi , et al. September 26, 2 | 2017-09-26 |
Method For Polishing Germanium Wafer App 20170216992 - NAGAOKA; Yasuo ;   et al. | 2017-08-03 |
Method Of Manufacturing Soi Wafer App 20170200634 - AGA; Hiroji | 2017-07-13 |
Method for manufacturing bonded wafer Grant 9,679,800 - Kobayashi , et al. June 13, 2 | 2017-06-13 |
Method for manufacturing SOI wafer Grant 9,673,085 - Aga , et al. June 6, 2 | 2017-06-06 |
Method For Manufacturing Bonded Soi Wafer App 20160372363 - AGA; Hiroji ;   et al. | 2016-12-22 |
Method For Manufacturing Bonded Wafer App 20160365273 - KOBAYASHI; Norihiro ;   et al. | 2016-12-15 |
Method For Manufacturing Bonded Wafer App 20160204024 - KOBAYASHI; Norihiro ;   et al. | 2016-07-14 |
Method For Manufacturing Bonded Wafer App 20160197008 - YOKOKAWA; Isao ;   et al. | 2016-07-07 |
Method for manufacturing SOI wafer Grant 9,378,999 - Aga , et al. June 28, 2 | 2016-06-28 |
Method for manufacturing SOI wafer Grant 9,337,080 - Aga , et al. May 10, 2 | 2016-05-10 |
Method Of Producing Bonded Wafer App 20160118294 - KOBAYASHI; Norihiro ;   et al. | 2016-04-28 |
Method for manufacturing SOI wafer Grant 9,240,344 - Aga , et al. January 19, 2 | 2016-01-19 |
Method For Manufacturing Soi Wafer And Soi Wafer App 20150340279 - KOBAYASHI; Norihiro ;   et al. | 2015-11-26 |
Method For Manufacturing Soi Wafer App 20150249035 - Aga; Hiroji ;   et al. | 2015-09-03 |
Method For Manufacturing Soi Wafer App 20150243550 - Aga; Hiroji ;   et al. | 2015-08-27 |
Method for manufacturing bonded SOI wafer Grant 9,093,497 - Kobayashi , et al. July 28, 2 | 2015-07-28 |
Method For Manufacturing Soi Wafer App 20150206790 - Aga; Hiroji ;   et al. | 2015-07-23 |
Method for manufacturing a bonded SOI wafer Grant 9,076,840 - Kobayashi , et al. July 7, 2 | 2015-07-07 |
Method for manufacturing SOI wafer Grant 9,029,240 - Aga , et al. May 12, 2 | 2015-05-12 |
Method for manufacturing bonded wafer and bonded SOI wafer Grant 8,987,109 - Aga , et al. March 24, 2 | 2015-03-24 |
Method For Manufacturing Soi Wafer App 20150064875 - Aga; Hiroji ;   et al. | 2015-03-05 |
Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer Grant 8,962,352 - Yokokawa , et al. February 24, 2 | 2015-02-24 |
Method For Manufacturing Bonded Soi Wafer App 20150017783 - Kobayashi; Norihiro ;   et al. | 2015-01-15 |
Method For Manufacturing Soi Wafer App 20140329372 - Aga; Hiroji ;   et al. | 2014-11-06 |
Method For Manufacturing A Bonded Soi Wafer App 20140322895 - Kobayashi; Norihiro ;   et al. | 2014-10-30 |
Method For Calculating Warpage Of Bonded Soi Wafer And Method For Manufacturing Bonded Soi Wafer App 20140186977 - Yokokawa; Isao ;   et al. | 2014-07-03 |
Method for manufacturing SOI wafer Grant 8,728,912 - Aga , et al. May 20, 2 | 2014-05-20 |
Method For Manufacturing Bonded Wafer And Bonded Soi Wafer App 20140097523 - Aga; Hiroji ;   et al. | 2014-04-10 |
Method for producing bonded wafer Grant 8,691,665 - Oka , et al. April 8, 2 | 2014-04-08 |
Method For Manufacturing Soi Wafer App 20130316522 - Aga; Hiroji ;   et al. | 2013-11-28 |
Method For Manufacturing Bonded Wafer App 20130102126 - Aga; Hiroji ;   et al. | 2013-04-25 |
Method For Producing Bonded Wafer App 20120244679 - Oka; Satoshi ;   et al. | 2012-09-27 |
Method for manufacturing SOI wafer Grant 8,202,787 - Ishizuka , et al. June 19, 2 | 2012-06-19 |
Method for manufacturing bonded wafer Grant 8,173,521 - Kobayashi , et al. May 8, 2 | 2012-05-08 |
Method for manufacturing bonded wafer Grant 8,097,523 - Kobayashi , et al. January 17, 2 | 2012-01-17 |
Method For Manufacturing Soi Wafer App 20110281420 - Aga; Hiroji ;   et al. | 2011-11-17 |
Method For Manufacturing Soi Wafer App 20110223740 - Ishizuka; Tohru ;   et al. | 2011-09-15 |
Method For Manufacturing Bonded Wafer App 20110151643 - Kobayashi; Norihiro ;   et al. | 2011-06-23 |
Method for producing semiconductor wafer Grant 7,959,731 - Yokokawa , et al. June 14, 2 | 2011-06-14 |
Method For Manufacturing Bonded Wafer App 20110104870 - Kobayashi; Norihiro ;   et al. | 2011-05-05 |
Method of manufacturing SOI wafer and thus-manufactured SOI wafer Grant 7,902,042 - Aga , et al. March 8, 2 | 2011-03-08 |
Method For Manufacturing Bonded Wafer App 20100120223 - Kobayashi; Norihiro ;   et al. | 2010-05-13 |
SOI wafer and method for producing the same Grant 7,560,313 - Aga , et al. July 14, 2 | 2009-07-14 |
Method of producing SOI wafer and SOI wafer Grant 7,524,744 - Yokokawa , et al. April 28, 2 | 2009-04-28 |
Method for producing direct bonded wafer and direct bonded wafer Grant 7,521,334 - Kobayashi , et al. April 21, 2 | 2009-04-21 |
Method For Producing Semiconductor Wafer App 20080138959 - Yokokawa; Isao ;   et al. | 2008-06-12 |
Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer App 20080128851 - Aga; Hiroji ;   et al. | 2008-06-05 |
Method for Producing Direct Bonded Wafer and Direct Bonded Wafer App 20080102603 - Kobayashi; Norihiro ;   et al. | 2008-05-01 |
Method of fabricating SOI wafer Grant 7,320,929 - Aga , et al. January 22, 2 | 2008-01-22 |
Process for treating substrates for the microelectronics industry, and substrates obtained by this process Grant 7,288,418 - Barge , et al. October 30, 2 | 2007-10-30 |
SOI wafer and method for producing the same App 20070054459 - Aga; Hiroji ;   et al. | 2007-03-08 |
Method for producing SOI wafer and SOI wafer Grant 7,176,102 - Aga , et al. February 13, 2 | 2007-02-13 |
Process for treating substrates for the microelectronics industry, and substrates obtained by this process App 20060189102 - Barge; Thierry ;   et al. | 2006-08-24 |
Method for producing a semiconductor wafer App 20060185581 - Aga; Hiroji ;   et al. | 2006-08-24 |
Method for treating substrates for microelectronics and substrates obtained according to said method Grant 7,029,993 - Barge , et al. April 18, 2 | 2006-04-18 |
Method for manufacturing soi wafer and soi wafer App 20060051945 - Yokokawa; Isao ;   et al. | 2006-03-09 |
Soi wafer manufacturing method App 20060040469 - Aga; Hiroji ;   et al. | 2006-02-23 |
SOI wafer producing method, and wafer separating jig Grant 6,998,329 - Aga , et al. February 14, 2 | 2006-02-14 |
Method of producing soi wafer and soi wafer App 20050118789 - Aga, Hiroji ;   et al. | 2005-06-02 |
Method of manufacturing a bonded wafers using a Bernoulli chuck Grant 6,897,124 - Tate , et al. May 24, 2 | 2005-05-24 |
Method for producing bonding wafer Grant 6,884,696 - Aga , et al. April 26, 2 | 2005-04-26 |
Method for producing SOI wafer and SOI wafer App 20050042840 - Aga, Hiroji ;   et al. | 2005-02-24 |
Method for producing SOI wafer and SOI wafer Grant 6,846,718 - Aga , et al. January 25, 2 | 2005-01-25 |
Soi wafer and its manufacturing method App 20040219370 - Aga, Hiroji ;   et al. | 2004-11-04 |
Soi wafer producing method, and wafer separating jig App 20040180511 - Aga, Hiroji ;   et al. | 2004-09-16 |
Method for manufacturing bonded wafers App 20040152283 - Tate, Naoto ;   et al. | 2004-08-05 |
Method for producing SOI wafer and SOI wafer App 20040063298 - Aga, Hiroji ;   et al. | 2004-04-01 |
Method for producing bonding wafer App 20030181001 - Aga, Hiroji ;   et al. | 2003-09-25 |
Optical function device with photonic band gap and/or filtering characteristics Grant 6,380,551 - Abe , et al. April 30, 2 | 2002-04-30 |
Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method Grant 6,372,609 - Aga , et al. April 16, 2 | 2002-04-16 |
Optical Function Device With Photonic Band Gap And/or Filtering Characteristics App 20010032977 - ABE, TAKAO ;   et al. | 2001-10-25 |
Method of recycling a delaminated wafer and a silicon wafer used for the recycling App 20010029072 - Kuwahara, Susumu ;   et al. | 2001-10-11 |
Method of recycling a delaminated wafer and a silicon wafer used for the recycling Grant 6,284,628 - Kuwahara , et al. September 4, 2 | 2001-09-04 |
Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer Grant 6,239,004 - Aga , et al. May 29, 2 | 2001-05-29 |
Method of fabricating an SOI wafer and SOI wafer fabricated thereby Grant 6,140,210 - Aga , et al. October 31, 2 | 2000-10-31 |
SOI wafer and method for the preparation thereof Grant 5,998,281 - Aga , et al. December 7, 1 | 1999-12-07 |
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