U.S. patent application number 09/814871 was filed with the patent office on 2001-10-04 for semiconductor device manufacturing system and method of manufacturing semiconductor devices.
Invention is credited to Hara, Shinichi, Ogawa, Sumio, Ueki, Minoru.
Application Number | 20010026949 09/814871 |
Document ID | / |
Family ID | 18603485 |
Filed Date | 2001-10-04 |
United States Patent
Application |
20010026949 |
Kind Code |
A1 |
Ogawa, Sumio ; et
al. |
October 4, 2001 |
Semiconductor device manufacturing system and method of
manufacturing semiconductor devices
Abstract
A semiconductor device manufacturing system is provided in which
chip position information is read without removing resin from a
package so that the cause of a failure can be quickly identified
and removed and the yield of chips can be rapidly improved. A
replacement address reading device reads redundancy addresses from
a semiconductor device which is determined as faulty in a test
performed after the semiconductor device has been sealed into a
package. A chip position analyzing device estimates, from the
combination of these redundancy addresses, a lot number, a wafer
number and a chip number of the faulty semiconductor device. A
failure distribution mapping device maps the distribution of faulty
chips in each wafer in the lot based on these numbers thus
obtained. A failure cause determining device identifies which
manufacturing device or processing step has caused the failures in
the wafer process based on the above distribution.
Inventors: |
Ogawa, Sumio;
(Higashihiroshima-shi, JP) ; Ueki, Minoru;
(Higashihiroshima-shi, JP) ; Hara, Shinichi;
(Shimonoseki-shi, JP) |
Correspondence
Address: |
David A. Blumenthal
FOLEY & LARDNER
Washington Harbour
3000 K Street, N.W., Suite 500
Washington
DC
20007-5109
US
|
Family ID: |
18603485 |
Appl. No.: |
09/814871 |
Filed: |
March 23, 2001 |
Current U.S.
Class: |
438/15 ; 257/678;
257/E21.525; 29/25.01; 324/750.15; 324/759.02; 438/14; 438/16 |
Current CPC
Class: |
H01L 22/20 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
438/15 ;
29/25.01; 438/16; 324/765; 438/14; 257/678 |
International
Class: |
H01L 021/66; G01R
031/26; H01L 021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 27, 2000 |
JP |
P2000-087480 |
Claims
What is claimed is:
1. A semiconductor device manufacturing system comprising: a
manufacturing line which manufactures a wafer with a plurality of
semiconductor chips provided therein in a grid-like arrangement by
a predetermined manufacturing device; a wafer tester which tests
said semiconductor chips for electric characteristics thereof; a
position information writing device which writes into each
semiconductor chip information of chip position on said wafer; a
wafer test information storage device which stores a first test
result outputted from said wafer tester and said chip position
information on said wafer that is associated with said first test
result; a package assembling device which divides said wafer into
respective ones of said semiconductor chips to produce
semiconductor devices each sealed in a package; a product tester
which tests each semiconductor device for its electric
characteristics; a chip position detecting device which detects
position information of said semiconductor device on said wafer
after said semiconductor device has been sealed in a package; a
product test information storage device which stores a second test
result outputted from said product tester and said information of
chip position on said wafer which that is detected by said chip
position detecting device and is associated with said second test
result; and a failure distribution mapping device which maps the
distribution of failures corresponding to a wafer by combining
position information of those chips determined to be faulty by said
wafer tester and position information of those chips determined to
be faulty by said product tester, based on said first test result,
said second test result and said information of chip position;
wherein a cause of failures is determined based on said
distribution of failures.
2. A semiconductor device manufacturing system according to claim
1, wherein said semiconductor chip is a semiconductor memory having
a redundancy circuit, said position information writing device
being a trimming device for blowing fuses for redundancy
addresses.
3. A semiconductor device manufacturing system comprising: a
manufacturing line which manufactures a wafer with a plurality of
semiconductor memories provided therein in a grid-like arrangement
by a predetermined manufacturing device; a wafer tester which tests
said semiconductor memories for electric characteristics thereof; a
trimming device which determines a redundancy address for a
redundancy memory of each semiconductor memory and blows fuses
corresponding to said redundancy address; a wafer test information
storage device which stores said redundancy address and position
information on said wafer that is associated with said redundancy
address; a package assembling device which divides said wafer into
respective ones of said semiconductor memories to produce
semiconductor memories each sealed in a package; a product tester
which tests each semiconductor memory after the division for its
electric characteristics and reads a replacement address; a
position estimating device which estimates position information by
comparing said read replacement address with said redundancy
address; a product test information storage device which stores a
second test result outputted from said product tester and said
position information detected by said position estimating device
that is associated with said second test result; and a failure
distribution mapping device which maps the distribution of failures
by associating said second test result with said position
information; wherein a cause of failures is determined based on
said distribution of failures.
4. A semiconductor device manufacturing system comprising: a
manufacturing line which manufactures a wafer with a plurality of
semiconductor memories provided therein in a grid-like arrangement
by a predetermined manufacturing device; a wafer tester which tests
said semiconductor memories for electric characteristics thereof; a
trimming device which determines a replacement address for a
redundancy memory of each semiconductor memory and blows fuses
corresponding to said replacement address; a position information
storage device which stores said replacement address and position
information on said wafer that is associated with said replacement
address; a package assembling device which divides said wafer into
respective ones of said semiconductor memories to produce
semiconductor memories each sealed in a package; a product tester
which tests each semiconductor memory for its electric
characteristics and reads a replacement address; a position
estimating device which estimates position information by comparing
said read replacement address with said replacement address stored
in said position information storage device; a product test
information storage device which stores a first test result
outputted by said wafer tester, a second test result outputted from
said product tester and said position information on said wafer
estimated by said position estimating device in association with
one another; and a failure distribution mapping device which maps,
based on said first test result, said second test result and said
position information, the distribution of failures by combining
position information of those semiconductor memories determined to
be faulty by said wafer tester and position information of those
semiconductor memories determined to be faulty by said product
tester; wherein a cause of failures is determined based on said
distribution of failures.
5. A semiconductor device manufacturing system for estimating the
location of a cause of a failure based on a test result of a
manufactured semiconductor device comprising: a position
information reading device which electronically reads chip data
previously written in a predetermined circuit of said semiconductor
device after this semiconductor device has been sealed into a
package; a position information extracting device which extracts a
lot number of said semiconductor device in a wafer process, a wafer
number of a wafer in said lot and position information on said
wafer based on said chip data; and a failure cause determining
device which determines a cause of a failure which has occurred
after division of said wafer into chips by combining respective
test results before and after said division into a single
distribution of failures.
6. A semiconductor device manufacturing system according to claim
5, wherein said failure cause determining device determines a cause
of a failure in a wafer process based on said position information
of that semiconductor device which is determined to be faulty in a
test of semiconductor devices after sealing into packages.
7. A semiconductor device manufacturing system according to claim
5, wherein said position information is a replacement address for
replacing a faulty memory cell, said system further comprises a
reference table mapping device which generates a reference table
showing a relation between said position information and said
replacement address in a test for determining whether a
semiconductor device in a wafer state is faulty or non-defective,
said position information extracting device extracts position
information of said semiconductor device after sealing into a
package from said reference table based on address data read from
said sealed semiconductor device.
8. A semiconductor device manufacturing system according to claim
5, further comprising: a storage circuit; a data writing device
which stores trimming data in said storage circuit during a test
for determining whether a semiconductor device in a wafer state is
faulty or nondefective; a data reading device which reads said
trimming data from said storage circuit; and a reference table
mapping device which maps a reference table showing a relation
between said position information and said trimming data; wherein
said position information extracting device extracts, based on
trimming data read from said semiconductor device, said position
information of semiconductor device corresponding to this trimming
data from said reference table.
9. A failure analyzing device which displays failure distributions
before and after a wafer is divided into a plurality of
semiconductor memory chips in association with positions on said
wafer.
10. A failure analyzing device comprising: a chip position
analyzing device which estimates a position of chip on a wafer; a
failure distribution mapping device which maps a distribution of
semiconductor chips which have become faulty; and a failure cause
determining device which determines a cause of a failure from said
distribution.
11. A failure analyzing device according to claim 10, wherein said
chip position analyzing device estimates said position on said
wafer based on a replacement address of a semiconductor memory.
12. A method of manufacturing semiconductor devices comprising the
step of estimating, based on a replacement address for replacing
with a redundancy circuit which address is stored in each of a
plurality of semiconductor memory chips into which a wafer has been
divided, position information of these semiconductor memory chips
on said wafer.
13. A method of manufacturing semiconductor devices according to
claim 12, wherein a distribution on said wafer of those
semiconductor memory chips which have been determined as faulty by
a semiconductor tester is determined based on said position
information.
14. A method of manufacturing semiconductor devices according to
claim 13, wherein a manufacturing device which causes a failure to
a semiconductor memory chip in a manufacturing line is identified
from said distribution.
15. A method of manufacturing semiconductor devices comprising: a
wafer step which forms semiconductor devices in a wafer through a
plurality of processing steps; a wafer test step which tests said
semiconductor devices in a wafer state; an assembling step which
cuts said wafer into chips of said semiconductor devices and seals
only those of said chips which have passed said test respectively
into packages; an assembly test step which tests said chips in a
packaged state and which selects non-defective chips; a chip data
reading step which electronically reads chip data previously stored
in a predetermined circuit of each of those semiconductor devices
which have been determined as faulty in said assembly test step;
and a position information extracting step which extracts, based on
said chip data, position information which comprises a lot number
of the relevant semiconductor device in said wafer step, a wafer
number of the relevant wafer in this lot and coordinates of the
relevant chip in this wafer.
16. A method of manufacturing semiconductor devices according to
claim 15 further comprises a detecting step for identifying, from
said wafer number and said coordinates of chip, a process step
which causes a failure, wherein the processing date and time for
each processing step of a lot is detected from said lot number, and
a control for processing quality in each processing step of said
wafer step is performed.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] This invention relates to a semiconductor device
manufacturing system for determining the cause of failures in a
semiconductor device which has become faulty after the division of
a wafer into a plurality of chips, and also to a method of
manufacturing semiconductor devices as well as a failure analyzing
device.
[0003] 2. Description of the Related Art
[0004] In recent years, the life cycle of electronic devices has
been becoming shorter and shorter, and it has become imperative for
developers to complete the designs of such electronic devices in a
short period of time and to supply them to the market in a timely
fashion. While the performance of semiconductor devices mounted in
electronic equipment has been improved and the goal of obtaining a
higher integration of circuits on a chip has been substantially
achieved, a further reduction in the cost of such semiconductor
devices is also an objective.
[0005] Semiconductor devices are usually manufactured by subjecting
a semiconductor wafer to predetermined processing steps (wafer
process) by means of several tens of types of manufacturing devices
(hereinafter called collectively as "a manufacturing line"). In
order to supply semiconductor devices stably at low cost, the
number of non-defective products obtained from one sheet of wafer
(hereinafter referred to as "yield") or its rate (hereinafter
referred to as "yield rate") must be raised.
[0006] In general, the manufacturing devices are complicated in
their construction and include many factors causing the yield rate
to be lowered. Also, the yield rate will largely depend on how the
manufacturing devices are used and the set conditions for the
processing steps.
[0007] When starting mass-production of newly developed
semiconductor devices or when adding a new manufacturing device to
the manufacturing line, the manager of the manufacturing line
analyses causes of failures and improves the manufacturing line and
the processing steps in an effort to attain a desired yield
rate.
[0008] Even after the desired yield rate has been attained, the
manager of the manufacturing line endeavors to maintain a stable
yield rate by always monitoring the manufacturing line in order to
detect in advance any sign of a deteriorating yield rate.
[0009] Thus, unless the development of the processing steps
necessary for the high-degree integration of circuits and the
stabilization of such processing steps have been completed as
quickly as possible, it is quite difficult to ship the needed
semiconductor devices stably within an acceptable time period.
[0010] Therefore, for the development of the manufacturing line and
the processing steps necessary for the manufacturing of
semiconductor devices and the stabilization thereof, it is critical
that the failures of the produced semiconductor devices are
analyzed, that the causes of failures revealed as a result of such
analysis are eliminated and to solve the problems of the
manufacturing line and the processing steps which lead up to these
problems.
[0011] However, since there are several tens of manufacturing
devices and hundreds of processing steps involved in the
manufacture of one semiconductor device, a big problem is how to
quickly find in which manufacturing device or in which processing
step the failure occurred. A method of finding the cause of
failures has been known in which the detection is done based on the
distribution of failures on the wafer of faulty semiconductor
devices and the dependency of the failures on the position of wafer
in the lot.
[0012] More specifically, the manufacturing device or the
processing step by which semiconductor devices become faulty can be
determined based on the distribution of chips of the faulty
semiconductor devices on the wafer and the position of that wafer
in the lot.
[0013] Japanese Unexamined Patent Application, First Publication,
No. Hei 11-45919 (hereinafter referred to as "first related art")
discloses a method in which, when semiconductor substrates (wafers)
are manufactured by means of a manufacturing line comprising a
plurality of manufacturing devices and desired manufacturing
processes (processing steps), such a determination is made based on
an inspection step for inspecting the plurality of manufactured
semiconductor substrates for the positions of the failures brought
about on each semiconductor substrate by means of an inspection
device, a failure distribution image data mapping step for
designating coordinates of the position data of failures of each
semiconductor substrate inspected in the inspection step on an
image data composed of pixels arranged on the semiconductor
substrate in a grid form and for mapping failure distribution image
data on the image data by counting the numbers of failures of the
plurality of semiconductor substrates for each of the grid-arranged
pixels, and a failure analysis step for comparing the failure
distribution image data formed in the failure distribution image
data mapping step with a plurality of case databases, from which
the cause of failures can be determined, to thereby identify the
cause of the failures.
[0014] For example, when the distribution of failures on a wafer
100 corresponds to a pattern 111 shown in FIG. 23, it can be
determined, by comparing the pattern with the case databases
produced in the past, that the cause may exist in the step A. When
the distribution of failures corresponds to a pattern 113, it can
be determined that the cause may exist in the step C.
[0015] In the case of a process wherein one lot of wafers are
processed by means of a plurality of manufacturing devices of the
same type (manufacturing machine No. A and manufacturing machine
No. B) in a single wafer processing, if the number of patterns 115
of the distribution of failures on wafers manufactured by the
manufacturing machine No. B is greater than the number of patterns
114 of the distribution of failures on wafers manufactured by the
manufacturing machine No. A as shown in FIG. 24, it can then be
determined that the cause exists in the manufacturing machine No.
B.
[0016] Although not disclosed in the document of the first related
art, a case may happen where faulty semiconductor devices are
concentrated in the lower area 102 of each wafer 100 in all the
lots of wafers processed at the same time, as shown in FIG. 25. In
such a case, it will be assumed that the cause of failures may
exist in an immersion wet etching process where a resist or an
oxide film was removed. The reason for this is that when a wafer is
immersed in an etchant and then raised, the immersion time of the
wafer is longer in the lower portion than in the higher portion,
and in addition the etchant flows in the direction of the lower
portion when the wafer is raised, so that a pattern or a thin film
in the lower portion 102 of the wafer is more deeply etched.
[0017] Another case may occur where faulty semiconductor devices
are concentrated in the peripheral area of the wafer 100. In this
case, it can be determined that the cause of the failures is a
plasma etching device. The reason for this is that the electric
field may be uneven in the peripheral area in such a device.
[0018] When the number of semiconductor devices which have been
judged to be faulty in a wafer numbered W1, is significantly high
as compared to other wafers numbered W2 to W25 in the same lot, it
may be assumed that the cause is a batch type processing step. For
example, as shown in FIG. 26, the wafers numbered W1 to W25 are
arranged in a direction perpendicular to their main surfaces in a
carrier 502 and subjected to a wet etching with a processing liquid
501 in a processing vessel 500. In this case, each of the wafers
numbered W1 to W25 is formed with circuits of semiconductor devices
on that surface which is indicated by an arrow A. Each of the
wafers numbered W2 to W25 has a little space on the side of the
upper surface, so that the etchant already reacted tends to remain
on the surface. In contrast, the wafer numbered W1 has a lot of
fresh etchant on the upper surface as compared to the other wafers,
so that the etching process progresses faster.
[0019] Japanese Unexamined Patent Application, First Publication,
No. Hei 10-339943 (hereinafter referred to as "second related art")
discloses a method of manufacturing a semiconductor device
comprising a step of exposure by means of projection through a mask
or a reticle, in which chip coordinates are used to specify each
position of chip on the exposed semiconductor wafer, determination
then being made from the chip-coordinate data of faulty chips
present on the exposed semiconductor wafer whether these faulty
chips are caused by the mask or the reticle, so that the positions
of failures in the mask or reticle can easily be detected in a
short period of time.
[0020] When those semiconductor devices which are detected as
faulty are cyclically located on the wafer 100 as shown in FIG. 27,
it can be inferred that the mask or the reticle 101 may be the
cause. It is here assumed that one reticle 101 is formed by four
semiconductor device patterns (or exposure units) and that a
failure exists in a specific area 101a thereof. When printing is
made with this reticle 101 on a resist on the wafer by a stepper,
failures will cyclically occur on the wafer corresponding to the
specific position within the exposure unit as shown in FIG. 27. In
FIG. 27, those chips marked with "x" are faulty chips.
[0021] As described above, a processing step causing failures can
be identified based on the dependency of semiconductor devices
which have been determined to be faulty because of their chip
positions and the dependency of faulty wafers on their positions in
the lot.
[0022] At present, in the analysis of failures with respect to a
processing step, the identification of the process step which may
have caused failures in semiconductor devices is performed based on
an inspection of semiconductor devices in a wafer state.
[0023] After that, only those semiconductor devices which have
passed the inspection by a wafer tester with respect to
predetermined items are sealed in packages and assembled. Each
semiconductor in this state is called an assembly. Thereafter, each
assembly is further inspected by an assembly tester. In this case,
since the number of inspection items is greater than that in the
inspection made in the wafer state, those failures which have not
been removed by the wafer tester can be detected, and at the same
time those failures which have occurred in the assembling stage can
also be detected and removed. Only those semiconductor devices
which have passed these inspections are shipped as products.
[0024] The test of semiconductor devices in a wafer state is
carried out by means of an expensive inspection device (a wafer
tester). In this case, however, it is not possible to perform a
high-speed test of operation in a wafer state due to the facts that
the probe has parasitic capacitance and that it is not possible to
provide in the time available a wafer tester possessing a speed
comparable to the enhanced speed of semiconductor devices. Also, it
is inefficient to perform, in a wafer state, tests about special
items such as a breakdown test in which a high voltage is applied
and an environmental test which is carried out at room, low and
high temperatures. In addition, since a plurality of semiconductor
devices are formed on the same semiconductor substrate in a wafer
state, there is another problem that it is not possible to carry
out a test on such items without the possibility that interference
with other chips may occur.
[0025] Furthermore, a large number of semiconductor devices cannot
be tested simultaneously, since control signals and data must be
conveyed to input/output pads of semiconductor devices through a
limited number of probes. In other words, the testing of
semiconductor devices in a wafer state has a significant
disadvantage since the number of semiconductor devices which can be
tested simultaneously is limited, and the production efficiency is
decreased when the test is performed in relation to many
operational and electric characteristics. These are the various
contributing factors that explain why the number of tests for
semiconductor devices in a wafer state cannot be increased.
[0026] When testing chips in the wafer state one by one, in order
to maintain productivity, a limited number of test items must be
selected and twenty of these items must be processed within a test
period of five minutes. In contrast, in the case of assemblies, 64
to 128 pieces can be mounted on a test board and a large number of
such test boards can be subjected to a test in parallel, so that
even when there are 400 items to be tested and a test period of two
hours is needed therefor, the time period needed for the test for
each semiconductor can be shortened.
[0027] The semiconductor devices which are judged to be faulty
after assembly is not high in number as compared to the failures in
the wafer test, but still exist to a certain degree. It is
therefore necessary to decrease as quickly as possible not only the
failure rate in the wafer stage but also the failure rate of the
assemblies. However, once assembled in a package, the assembly no
longer contains the information about its position in the wafer and
consequently, the detection of faulty processing steps as in the
first and the second related art cannot be made.
[0028] Thus, the semiconductor devices which have been judged to be
non-defective in the wafer state and then sealed in packages and
assembled may still contain a number of semiconductor devices which
will be judged to be faulty in the above-described test, so that
the conventional way of evaluating processing steps which may cause
failures is disadvantageous in that an accurate evaluation of
processing steps cannot be made.
[0029] In other words, the amount of data needed in the actual
analysis, such as the data about semiconductors to be used in the
evaluation of the processing step which may have caused failures,
cannot be provided solely by the results of the test made in the
wafer state.
[0030] In order to solve the above-described problems, Japanese
Unexamined Patent Application, First Publication, No. Hei 04-288811
(hereinafter referred to as "third related art") discloses a method
of obtaining information about the wafer or the like of a
semiconductor device which has become faulty in the market, in
which information about a wafer and the chip positions of
semiconductor devices on the wafer are inscribed in a chip surface
of each semiconductor device as data in the form of a pattern
specific to the chip during a stage of processing the wafer.
[0031] However, when a semiconductor device is judged to be faulty
after assembling in a package in the method of the third related
art, it is necessary to remove the resin sealing the package, read
the information about the wafer and so on by checking the pattern
data one at a time using a microscope and by so doing produce the
distribution of the semiconductor devices, which have been judged
to be faulty, on the wafer.
[0032] As described above, the above method of determining
positions of chips on a wafer requires that resin sealing each
package of all the semiconductor devices to be analyzed be removed
and is thus disadvantageous in that it consumes a great deal of
time.
[0033] Furthermore, in the above method of determining positions of
chips on a wafer, since the analyzer has to read the pattern data
on the chip one at a time with a microscope, it will take a lot of
time to read the pattern data and it may be quite probable that
errors occur in the reading of the pattern data.
[0034] In addition, once the resin of the package has been removed,
the surface of the semiconductor device may be corroded by the
resin removing solution, or a bonding wire connecting the
semiconductor device to an external terminal may be disconnected,
so that it will become impossible in practice to perform an
electrical test of the assembly with the result that it is no
longer possible to check which characteristics have become
faulty.
[0035] Japanese Unexamined Patent Application, First Publication,
No. Hei 11-45839 (hereinafter referred to as "fourth related art")
discloses a method in which a number of semiconductor chip areas
each having predetermined circuit functions are formed in a
predetermined wafer, whereafter information of position of each
chip on the wafer is given to a memory element provided in a
respective chip areas before the chips are separated from each
other, thereby enabling the history of the manufacturing processes
or the manufacturing data of each semiconductor chip to be easily
associated with its characteristic data, as a result of which the
yield rate of semiconductor products after the chip mounting can
easily be improved as compared to the conventional method.
[0036] In the method of the fourth related art, an analysis of
failures can be completed in a short period of time by knowing what
manufacturing process history and what characteristic data in a
wafer state the semiconductor device which has become faulty after
assembly has. However, the document of the fourth related art does
not contain any description suggesting procedures for the failure
analysis, and this fourth related art is not arranged so that the
first and the second related art is applied thereto.
[0037] Even when results of the test after assembly are associated
with the position information of the wafer, it will not give enough
data to allow an evaluation of the processing step which may have
caused failures. More specifically, since the number of faulty
assemblies is low as compared to the number of failures in the
wafer stage, even when the distribution of failures is described in
relation to the wafer positions, the data necessary for the
analysis used in determining to which failure distribution pattern
it corresponds may not be obtained, leading to a misleading failure
distribution pattern.
[0038] Furthermore, in the fourth related art the position
information of the wafer has to be provided in addition to the
original function of the semiconductor device, as a result of which
the chip size will be increased and efforts to reduce costs will be
hampered.
SUMMARY OF THE INVENTION
[0039] The present invention was made in response to the
above-described circumstances and has an object to provide a
semiconductor device manufacturing system in which chip position
information of semiconductor devices on a wafer, wafer position
information and lot information can be obtained even from a
semiconductor device assembled in a package; an accurate analysis
of failure distribution patterns can be achieved even from a small
number of failures; a processing step which is responsible for
failures can be improved quickly; chip yield can be increased
rapidly; and lot information, wafer information and chip position
information on the wafer of a semiconductor device chip can be
derived without removing resin from the package.
[0040] Another object of the present invention is to provide a
method of obtaining wafer information in which chip position
information of a semiconductor device on a wafer, wafer position
information and lot information can be obtained by making use of
the functions which the semiconductor device originally has.
[0041] A semiconductor device manufacturing system provided in
accordance with a first aspect of the invention comprises a
manufacturing line which manufactures a wafer with a plurality of
semiconductor chips provided therein in a grid-like arrangement by
a predetermined manufacturing device; a wafer tester which tests
the semiconductor chips for electric characteristics thereof; a
position information writing device which writes into each
semiconductor chip information of chip position on the wafer; a
wafer test information storage device which stores a first test
result outputted from the wafer tester and the chip position
information on the wafer that is associated with the first test
result; a package assembling device which divides the wafer into
respective ones of the semiconductor chips to produce semiconductor
devices each sealed in a package; a product tester which tests each
semiconductor device for its electric characteristics; a chip
position detecting device which detects position information of the
semiconductor device on the wafer after the semiconductor device
has been sealed in a package; a product test information storage
device which stores a second test result outputted from the product
tester and the information of chip position on the wafer which that
is detected by the chip position detecting device and is associated
with the second test result; and a failure distribution mapping
device which maps the distribution of failures corresponding to a
wafer by combining position information of those chips determined
to be faulty by the wafer tester and position information of those
chips determined to be faulty by the product tester, based on the
first test result, the second test result and the information of
chip position; wherein a cause of failures is determined based on
the distribution of failures.
[0042] A semiconductor device manufacturing system provided in
accordance with a second aspect of the invention comprises a
manufacturing line which manufactures a wafer with a plurality of
semiconductor memories provided therein in a grid-like arrangement
by a predetermined manufacturing device; a wafer tester which tests
the semiconductor memories for electric characteristics thereof; a
trimming device which determines a redundancy address for a
redundancy memory of each semiconductor memory and blows fuses
corresponding to the redundancy address; a wafer test information
storage device which stores the redundancy address and position
information on the wafer that is associated with the redundancy
address; a package assembling device which divides the wafer into
respective ones of the semiconductor memories to produce
semiconductor memories each sealed in a package; a product tester
which tests each semiconductor memory after the division for its
electric characteristics and reads a replacement address; a
position estimating device which estimates position information by
comparing the read replacement address with the redundancy address;
a product test information storage device which stores a second
test result outputted from the product tester and the position
information detected by the position estimating device that is
associated with the second test result; and a failure distribution
mapping device which maps the distribution of failures by
associating the second test result with the position information;
wherein a cause of failures is determined based on the distribution
of failures.
[0043] A semiconductor device manufacturing system provided in
accordance with a third aspect of the invention comprises a
manufacturing line which manufactures a wafer with a plurality of
semiconductor memories provided therein in a grid-like arrangement
by a predetermined manufacturing device; a wafer tester which tests
the semiconductor memories for electric characteristics thereof; a
trimming device which determines a replacement address for a
redundancy memory of each semiconductor memory and blows fuses
corresponding to the replacement address; a position information
storage device which stores the replacement address and position
information on the wafer that is associated with the replacement
address; a package assembling device which divides the wafer into
respective ones of the semiconductor memories to produce
semiconductor memories each sealed in a package; a product tester
which tests each semiconductor memory for its electric
characteristics and reads a replacement address; a position
estimating device which estimates position information by comparing
the read replacement address with the replacement address stored in
the position information storage device; a product test information
storage device which stores a first test result outputted by the
wafer tester, a second test result outputted from the product
tester and the position information on the wafer estimated by the
position estimating device in association with one another; and a
failure distribution mapping device which maps, based on the first
test result, the second test result and the position information,
the distribution of failures by combining position information of
those semiconductor memories determined to be faulty by the wafer
tester and position information of those semiconductor memories
determined to be faulty by the product tester; wherein a cause of
failures is determined based on the distribution of failures.
[0044] A semiconductor device manufacturing system provided in
accordance with a fourth aspect of the invention is a system for
estimating the location of a cause of a failure based on a test
result of a manufactured semiconductor device comprising: a
position information reading device which electronically reads chip
data previously written in a predetermined circuit of the
semiconductor device after this semiconductor device has been
sealed into a package; a position information extracting device
which extracts a lot number of the semiconductor device in a wafer
process, a wafer number of a wafer in the lot and position
information on the wafer based on the chip data; and a failure
cause determining device which determines a cause of a failure
which has occurred after division of the wafer into chips by
combining respective test results before and after the division
into a single distribution of failures.
[0045] A failure analyzing device provided in accordance with a
fifth aspect of the invention displays failure distributions before
and after a wafer is divided into a plurality of semiconductor
memory chips in association with positions on the wafer.
[0046] A failure analyzing device provided in accordance with a
sixth aspect of the invention comprises a chip position analyzing
device which estimates a position of chip on a wafer; a failure
distribution mapping device which maps a distribution of
semiconductor chips which have become faulty; and a failure cause
determining device which determines a cause of a failure from the
distribution.
[0047] A method of manufacturing semiconductor devices provided in
accordance with a seventh aspect of the invention comprises the
step of estimating, based on a replacement address for replacing
with a redundancy circuit which address is stored in each of a
plurality of semiconductor memory chips into which a wafer has been
divided, position information of these semiconductor memory chips
on the wafer.
[0048] A method of manufacturing semiconductor devices in
accordance with an eighth aspect of the invention comprises a wafer
step which forms semiconductor devices in a wafer through a
plurality of processing steps; a wafer test step which tests the
semiconductor devices in a wafer state; an assembling step which
cuts the wafer into chips of the semiconductor devices and seals
only those of the chips which have passed the test respectively
into packages; an assembly test step which tests the chips in a
packaged state and which selects non-defective chips; a chip data
reading step which electronically reads chip data previously stored
in a predetermined circuit of each of those semiconductor devices
which have been determined as faulty in the assembly test step; and
a position information extracting step which extracts, based on the
chip data, position information which comprises a lot number of the
relevant semiconductor device in the wafer step, a wafer number of
the relevant wafer in this lot and coordinates of the relevant chip
in this wafer.
[0049] Thus, according to the present invention, since the position
information of a chip of the assembly which is determined to be
faulty is analyzed based on the chip data held in that chip, a
malfunction of a manufacturing device or a processing step which
may cause failures in the semiconductor devices in the wafer
process can be identified quickly. Furthermore, the cause of a
failure can be determined accurately from the information giving
the position of wafer in a lot and the position of a chip on the
wafer, so that an abnormal manufacturing device or processing step
can be corrected quickly and the yield of chips can be improved
rapidly. Furthermore, a pattern of distribution of failures can be
obtained by electrically reading chip data of a semiconductor
device with an LSI tester or the like without removing resin
sealing the package, and by associating the chip data thus read
with the registered lot information, wafer information and position
information of the chip on the wafer. Therefore, the evaluation of
a malfunctioning manufacturing device or faulty processing step in
the wafer process can be made in a short period of time with a
great number of semiconductor devices being used for the analysis.
As a result, stable production of semiconductor devices becomes
possible.
BRIEF DESCRIPTION OF THE DRAWINGS
[0050] FIG. 1 is a block diagram showing the structure of a
semiconductor device manufacturing system provided in accordance
with a first embodiment of the invention;
[0051] FIG. 2 is a flow chart showing the operation of the
semiconductor device manufacturing system according to the first
embodiment of the invention;
[0052] FIG. 3 is a diagrammatic illustration showing a specific
structure of the wafer manufacturing line 20 in FIG. 1;
[0053] FIG. 4 is an illustration showing a preferred embodiment of
a structure of the manufacturing history information file 21 in
FIG. 1;
[0054] FIG. 5 is an illustration showing a preferred embodiment of
a structure of the wafer test information file 23 in FIG. 1;
[0055] FIG. 6A is a diagrammatic illustration showing a first
structure of the chip information memory circuit formed in a wafer
in the semiconductor device manufacturing system according to the
first embodiment;
[0056] FIG. 6B is a diagrammatic illustration showing a second
structure of the chip information memory circuit formed in a wafer
in the semiconductor device manufacturing system according to the
first embodiment;
[0057] FIG. 7 is an illustration showing a preferred embodiment of
a structure of the assembly test information file 28 in FIG. 1;
[0058] FIG. 8 is a detailed flow chart showing the failure
distribution mapping step SA24 and the failure cause determining
step SA25 in FIG. 2;
[0059] FIG. 9 is an illustration showing some distribution patterns
of faulty chips which is stored in the failure distribution
database 35 in FIG. 1;
[0060] FIG. 10 is an illustration showing some distribution
patterns of faulty chips which is stored in the failure
distribution database 35 in FIG. 1;
[0061] FIG. 11 is a block diagram showing a preferred embodiment of
a structure of the semiconductor device manufacturing system
according to a second embodiment of the invention;
[0062] FIG. 12 is an illustration showing a format for fuse
addresses by which the replacement address decision device 2
according to the invention indicates positions of blown fuses;
[0063] FIG. 13 is a diagrammatic illustration showing a preferred
embodiment of a structure of a fuse circuit by which an address of
one redundancy word line is set;
[0064] FIG. 14 is an illustration showing the structure of a table
format file in which fuse start numbers are described in the order
of redundancy word lines;
[0065] FIG. 15 is an illustration showing the structure of an
intermediate file which the replacement address decision device 2
outputs;
[0066] FIG. 16 is an illustration showing a format for the
redundancy address table which the replacement address decision
device 2 outputs;
[0067] FIG. 17 is a diagrammatic illustration showing the structure
of a memory cell array and memory cells for redundancy;
[0068] FIG. 18 is a flow chart showing the extraction of redundancy
addresses in the LSI tester of FIG. 1;
[0069] FIG. 19 is an illustration showing a structure of the
replacement address information file 43 which the replacement
address reading device 41 outputs;
[0070] FIG. 20 is an illustration showing a structure of the
assembly test information file 28 which the assembly tester 27
outputs;
[0071] FIG. 21 is an illustration showing the structure of a failed
chip distribution table which the failure distribution mapping
device 32 outputs;
[0072] FIG. 22 is a flow chart showing the process for generating a
redundancy address corresponding to the lot number, the wafer
number and the chip number of each chip from fuse addresses of
chips of the semiconductor devices after the wafer process;
[0073] FIG. 23 is a diagrammatic illustration showing a step for
analyzing failures found in the related art;
[0074] FIG. 24 is a diagrammatic illustration showing another step
for analyzing failures found in the related art;
[0075] FIG. 25 is a diagrammatic illustration showing the surface
of a wafer in which the positions of semiconductor devices which
have been determined as faulty are shown;
[0076] FIG. 26 is a diagrammatic illustration showing in side
elevation wafers positioned in a boat (a vessel for supporting a
plurality of wafers); and
[0077] FIG. 27 is a diagrammatic illustration showing the surface
of a wafer in which positions of those semiconductor devices which
have been determined as faulty are indicated.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0078] First Embodiment
[0079] FIG. 1 is an illustration showing the structure of a
semiconductor device manufacturing system in accordance with a
first embodiment of the invention, and FIG. 2 is a flow chart which
explains the operation of the semiconductor device manufacturing
system.
[0080] In FIG. 1, a wafer manufacturing line 20 is constituted by
manufacturing devices for performing various semiconductor
processes. In a wafer process step SA1 of FIG. 2, transistor
elements and wirings are formed in the surface of a wafer 100 to
fabricate a semiconductor device. Usually, twenty to fifty sheets
of wafer 100 are placed in a carrier and fed as one processing unit
(hereinafter referred to as "a lot") to the wafer manufacturing
line 20 to thereby subject them to predetermined wafer processes in
predetermined manufacturing devices. Each lot is given a
predetermined wafer processing lot number (hereinafter referred to
as "a lot number" unless specified otherwise).
[0081] The given lot number is indicated on the carrier and
recorded in a manufacturing history information file 21. In this
manufacturing history information file 21, product names of
semiconductor devices to be manufactured, lot numbers, numbers of
wafers to be processed, names of processing steps in which these
wafers are processed, times (manufacturing dates and hours) of the
processing steps, numbers of devices used in the processing steps
(machine numbers), manufacturing conditions of the processing
steps, numbers of specifications and so on are stored as shown in
FIG. 4. Here, in the manufacturing history information file 21, a
wafer test information file 23 which will be described later and an
assembly test information file 28 which will be described later, a
line of information is called "a record".
[0082] FIG. 3 shows the specific structure of the wafer
manufacturing line 20. The wafer manufacturing line 20 is
constituted by a resist coating device 20a, an exposure device 20b,
a development device 20c, an etching device 20d, an ion
implantation device 20e, a film depositing device 20f, a CMP (a
chemical mechanical polishing) device 20g, a cleaning device 20h
and so on. In many cases, a plurality of devices of the same type
are installed for each of the manufacturing devices 20a to 20h in
order to improve the productivity of semiconductor devices, wherein
each of the plurality of devices is given its own machine number
(No. 1, No, 2, . . . ).
[0083] The fed wafers 100 are transported through the manufacturing
devices 20a to 20h by a transporting device 20j so that each wafer
is processed in the wafer process step SA1 in a predetermined
order. The manufacturing history in this step is stored through a
communication line 20k in the manufacturing history information
file 21.
[0084] Referring back to FIG. 1, a plurality of semiconductor
devices have been arranged in a grid form in the surface of the
wafer 100 produced by the wafer manufacturing line 20. Hereinafter,
a semiconductor device before assembly into a package is referred
to as "a semiconductor chip" or simply as "a chip". Each wafer
formed with semiconductor chips is tested with respect to electric
characteristics by a wafer tester 22. In the method used for this
test, a probe is brought into contact with each input/output pad
formed on each semiconductor chip to transmit a predetermined test
signal thereto, and it is then determined whether its output is
within a predetermined standard (PASS) or out of the standard
(FAIL).
[0085] Each semiconductor chip is given coordinates on the wafer or
a serial number which is called a chip number. The results of the
test performed with the wafer tester 22 in a wafer test step SA2
(FIG. 2) are stored with the corresponding chip numbers in the
wafer test information file 23. The wafer test information file 23
stores chip information and test information as shown in FIG. 5,
wherein the chip information includes product names, lot numbers,
wafer numbers and chip numbers while the test information includes
test items, test dates and times, numbers of wafer testers 22 used
(test machine numbers), test conditions or specification numbers,
test results and overall determination results (PASS/FAIL).
[0086] Those chips which have been judged by the wafer tester 22 to
have failed in step SA3 are marked, for example, by a selecting
device 24 and scrapped in a subsequent process. When the test of
all the wafers 100 has been completed, the processing proceeds to a
failure distribution mapping step SA11, a failure cause determining
step SA12 and a failure cause removal step SA13. These steps are
the same as those in the first related art.
[0087] The chip number or the like is written by a chip information
writing device 25 into each chip which has been judged by the wafer
test 22 to have passed in the step SA3 (see step SA4 in FIG. 2).
Each chip is formed with a chip information memory circuit shown in
FIG. 6A or FIG. 6B, wherein FIG. 6A shows an example which employs
nonvolatile memory elements EP1 to EPn while FIG. 6B shows another
example which employs fuse elements FP1 to FPn.
[0088] The chip information memory circuit shown in FIG. 6A is
constituted by the non-volatile memory elements EP1 to EPn and
read/write circuits ED1 to EDn. When a selection signal SEL is
activated, the read/write circuits ED1 to EDn are brought into
operation. In write mode, chip information can be written into the
non-volatile memory elements EP1 to EPn by applying predetermined
signals to a data bus DO1 to DOn by means of a probe or the like.
In a read mode, the chip information stored in the non-volatile
memory elements EP1 to EPn is read through the read/write circuits
ED1 to EDn onto the data bus DO1 to DOn.
[0089] The chip information memory circuit shown in FIG. 6B is
constituted by the fuse elements FP1 to FPn and read/write circuits
FD1 to FDn. In a write mode, chip information can be written by
blowing/not blowing the fuse elements by a laser trimming device 3
(refer to FIG. 11). In read mode, the selection signal SEL is
activated whereupon the read/write circuits FD1 to FDn are brought
into operation with the result that the chip information stored by
the fuse elements FP1 to FPn is read through the read/write
circuits FD1 to FDn onto the data bus DO1 to DOn.
[0090] Referring back to FIGS. 1 and 2, each wafer 100 whose
processing in the above steps has been completed is cut into a
plurality of chips by a dicing device provided in a package
assembling device 26. Each of those chips which have been judged by
the wafer tester 22 to have passed is mounted on a lead frame and
sealed with a resin or the like by the package assembling device 26
(step SA5 in FIG. 2). Hereinafter, a semiconductor device which has
been sealed with a resin is called "an assembly". Each assembly is
given an assembly lot number on the basis of the processing unit in
the assembling step. In addition, each package is marked at it
surface with a manufacturing lot number determined by the
combination of a wafer processing lot number and an assembly lot
number.
[0091] Each assembly is subjected, by an assembly tester 27, to a
direct current characteristic test (DC test), an operation test (AC
test), an accelerated test (life test) and so on (step SA6 in FIG.
2). The DC test is a test for determining whether each terminal of
the assembly meets predetermined DC requirements and is performed
in respect of circuit currents, high level/low level output
voltages, high level/low level output currents and so forth. The DC
test can be accomplished in a shorter period of time as compared to
the AC test and the life test, and is therefore performed prior to
the latter two tests. As for those assemblies which have been
determined to be faulty in the DC test, the AC test and the life
test can be omitted.
[0092] In the AC test, a predetermined pattern of signals is
applied to an assembly and it is determined whether an expected
pattern of signals is outputted therefrom, thereby confirming that
the assembly fulfills desired functions.
[0093] The accelerated test is performed to eliminate initial
failures of assemblies and includes, for instance, a bias test in
which a high supply voltage is applied for a predetermined time
period, a high-temperature/low-temperature storage test and a
Pressure Cooker test.
[0094] The results of the test performed with the assembly tester
27 are stored in the assembly test information file 28. The
assembly test information file 28 is composed of assembly chip
information and assembly test information as shown in FIG. 7,
wherein the assembly chip information includes product names, lot
numbers, assembly lot numbers, wafer numbers, chip numbers and
sample numbers, while for the assembly test information test items,
test dates and times, numbers of assembly testers 27 used in the
test (test machine numbers), test conditions or numbers of their
specifications, test results and overall determination results
about non-defective products (PASS)/faulty products (FAIL) are
stored. At this stage, however, the chip number and the sample
number are not stored.
[0095] The assemblies which have been determined to be
non-defective by the assembly tester 27 in the step SA7 pass
through a selection device 29 and are shipped as products 30 (step
SA8 of FIG. 2). Those assemblies which have been determined as
faulty are given sample numbers by the selection device 29, which
sample numbers are stored in a predetermined record of the assembly
test information file 28. As to each faulty device, its chip number
which has been written by the chip information writing device 25 is
read by a chip information acquiring device 31 (step SA21 of FIG.
2). This chip number is stored in the record in the assembly test
information file 28 which corresponds to the same number (see FIG.
7).
[0096] When it is determined in step SA22 that the number of data
is insufficient, i.e., when the number of points to be indicated to
map a distribution of failures is low, it will become impossible to
carry out a pattern matching operation with the failure
distribution database 35 correctly in the next step SA25, as a
result of which an incorrect evaluation of what caused the failures
may be made. To avoid this, it is desirable to perform merging with
the wafer test information file to represent a distribution of
failures (step SA23 of FIG. 2).
[0097] A failure distribution mapping device 32 retrieves those
records which correspond to the determination results of "FAIL"
from the wafer test information file 23 and the assembly test
information file 28 and performs the required operations on the
records thereby to display the failure distribution on a display
device 33 which corresponds to the positions of their chip numbers
on a wafer, and also to display such distributions cumulatively for
one lot, to display such failure distributions separately for each
wafer number and to display a change in rate of occurrence of
failures for different lot numbers (step SA24 of FIG. 2).
[0098] A failure distribution database 35 has stored therein
distribution patterns of failures and their corresponding causes
and the manufacturing devices and processing steps causing the
failures.
[0099] A failure cause determining device 34 compares the
distribution of failures as obtained by the failure distribution
mapping device 32 with the failure distributions stored in the
failure distribution database 35 to thereby derive the most likely
cause of failures (step SA25 of FIG. 2).
[0100] The line manager of the wafer manufacturing line 20 examines
the manufacturing device and/or processing step which have been
judged to be the cause of failures based on the above derivation.
If this cause of failure corresponds to that for which a measure
has already been taken in the wafer stage in the failure cause
removal step SA13, the processing proceeds from step SA26 to step
SA28. If it is determined in step SA26 that no measure has been
taken, the position of the cause of failures in the wafer
manufacturing line 20 and the wafer process step SA1 can be located
and the cause removed (step SA27 of FIG. 27).
[0101] In step SA28, if failures (FAIL) still remain to be analyzed
with respect to other test items, the processing returns to the
step SA22 to repeat the steps SA22 to SA27 to map failure
distributions with respect to the other test items. If no defect
(FAIL) remains to be analyzed for other test items, the processing
for the analysis of failures will be terminated.
[0102] The processing in the failure distribution mapping step SA24
and the failure cause determining step SA25 will now be described
in more detail with reference to the flow chart shown in FIG.
8.
[0103] In step SA24a, the failure distribution mapping device 32
retrieves the test information and the chip information from the
assembly test information file 28 and/or the wafer test information
file 23.
[0104] In step SA24b, the failure distribution mapping device 32
classifies the test items for which failures (FAIL) have been
detected into groups having different lot numbers and different
wafer numbers. When deriving a relation between the wafer number
and the number of failures that have occurred with respect to a
predetermined test item, a graph such as those shown as patterns K
and L in FIG. 10 can be displayed. This graph can be displayed only
for a predetermined lot number or can be displayed as a result of
an accumulation of the numbers of failures in the respective lots.
It will become possible to perform an analysis based on this result
to determine whether failures that occurred in a certain lot have a
dependency on the positions of wafers or on the order of
processes.
[0105] In step SA24c, the failure distribution mapping device 32
rearranges the test items, for which failures (FAIL) have been
detected in each one of the wafers of a predetermined lot, for each
test item, for each wafer number and for each chip number.
[0106] When deriving, for each test item, the relation between the
position on a wafer corresponding to the chip number and the faulty
item and the relation between that position and the number of
failures that occurred, the faulty positions can be displayed
corresponding to a wafer as shown as patterns A to D in FIG. 9.
Each faulty position can be displayed only for a specific wafer
number or can be displayed as a result of an accumulation of the
numbers of failures that occurred in the respective wafers or in
the respective lots. This result enables an analysis for
determining whether failures occurred in a specific wafer or in a
specific lot depend on the chip positions or not.
[0107] In step SA24d, the failure distribution mapping device 32
classifies, for predetermined test items, failures (FAIL) in terms
of number into groups each having the same lot number, the same
wafer number or the same chip number.
[0108] By deriving the chronological variation of the number of
failures that occurred for a predetermined test item, the progress
of the number of failures that occurred can be displayed in a
temporal relationship, for example, with the manufacturing dates
and times as shown as a pattern P in FIG. 10. The numbers of
failures that occurred can be displayed not only for a specific lot
number, wafer number or chip number but also as results of
accumulations of the numbers of failures in respective chips,
wafers or lots. By grasping the chronological variation of the
number of failures according to this analysis, it will become
possible to perform maintenance work on the wafer manufacturing
line 20 and the wafer process step SA1 before replaceable parts of
the devices fail and the processing liquid is rendered unusable.
Thus, the occurrence of a multitude of failures can be prevented
and a stable supply of semiconductor devices can be achieved.
[0109] In step SA25a, the failure cause determining device 34
compares the distribution of failures as obtained by the failure
distribution mapping device 32 with the failure distribution
patterns A, B, . . . , P,. stored in the failure distribution
database 35 to thereby select the closest failure distribution
pattern. In the failure distribution database 35, as shown in FIG.
9 and FIG. 10, the failure distribution patterns A, B,. P, . . .
have been stored together with information about their
corresponding causes, manufacturing devices and processing steps to
be improved and so on.
[0110] When the selected pattern of failure distributions is
similar to the pattern A, a determination is made such that a
device SA25b for spin-coating liquid such as for a resist and SOG
(Spin on Glass) may be the cause of the failures. As for the other
failure distribution patterns B, . . . , P, . . . , causes of
failures SA25c to SA25h and so on can be estimated.
[0111] If the product has a simple structure, such as an
acceleration sensor, the number of manufacturing devices and
processing steps is low, so that causes of failures can be
relatively easily determined by knowing the manufacturing process
history and the characteristic data in the wafer stage of the
assemblies which have become faulty as in the fourth related art.
However, in the case of a semiconductor device for which there are
several hundreds of manufacturing devices and several thousands of
processing steps involved, even if the manufacturing process
history and the characteristic data in the wafer stage can be
known, a substantial amount of time will be needed until the causes
of failures can be located.
[0112] In contrast, according to the present embodiment, since the
cause of failures can be estimated based on the distribution of
failures, the cause of failures can be located within a short time.
In the case where it is not possible to determine to which
distribution of failures it corresponds because the number of
failures is too low, it will become possible to make a
determination without error through pattern matching with the
failure distributions by merging with the wafer test information
file.
[0113] The measurement of a charge-retaining characteristic of a
capacitive element formed in a DRAM chip will take a substantial
amount of time, so that it becomes inefficient to test such an
element in the wafer stage. For such a reason, a plurality of
assemblies are inserted into a testing board and are simultaneously
tested to thereby shorten the test time for each assembly. For a
test item of the above-described type for which detection of
failures (FAIL) is not performed in a wafer stage, an analysis
cannot be made in the first related art, so that it has been
impossible to estimate easily in a short time for that test item
which manufacturing device or process step has caused failures.
[0114] According to the above-described embodiment of the
invention, since the distribution of failures can be displayed
according to the chip position on a wafer and/or the wafer position
based on the chip information, it becomes possible to estimate
easily in a short time the manufacturing device or process step
which has caused failures even from the test results of
assemblies.
[0115] Second Embodiment
[0116] FIG. 11 shows the structure of a semiconductor device
manufacturing system provided in accordance with a second
embodiment of the invention, wherein its elements corresponding to
those in the first embodiment are designated by like reference
numerals and their description will be omitted.
[0117] In the following description, it will be assumed that the
semiconductor device to be manufactured is a memory such as a DRAM
(dynamic random access memory) which comprises a plurality of
memory cells and redundancy circuits which can replace memory cells
having defectives (hereinafter referred to as "defective
cell").
[0118] A wafer 100 is fed to a wafer manufacturing line 20 in which
the wafer is subjected to predetermined processing steps, as a
result of which a plurality of semiconductor memories are formed in
the wafer surface.
[0119] Herein, the wafer manufacturing line 20 means a series of
processing steps up to the processing step for cutting the wafer
into chips and includes all the processing steps for forming
transistors in a surface of the wafer such as an ion implantation
step (impurities injection step), a diffusion step, a thin film
deposition step, a resist coating step, an exposure step, an
etching step and a back grind step.
[0120] When the steps of the wafer manufacturing line have been
completed at step 20, an LSI tester 1 comprising a CPU, a storage
section and a memory performs an operation test (AC test) and a
direct-current characteristic test (DC test) with respect to
semiconductor devices in the form of chips in the wafer state
(after the wafer manufacturing process) in accordance with a test
program stored in the storage section.
[0121] Furthermore, the LSI tester 1 tests the semiconductor
memories in the wafer state as in the related art and stores
defective cell test information (data in the bitmap form)
representing defective cells in a memory cell array (chip) for each
chip in a defective cell test information file 4.
[0122] A replacement address decision device 2 carries out an
analysis for a combination of a word line and a bit line based on
the bitmap data received for each wafer in order to efficiently
remedy those bits failed in each chip on the wafer.
[0123] Then, the replacement address decision device 2 determines,
based on addresses of the word lines and addresses of the bit lines
as obtained from the results of the above analysis, fuse addresses
corresponding respectively to the word line and the bit line with
reference to a fuse address file having a format shown in FIG. 12
for each lot of the wafer manufacturing process in order to replace
the word line and the bit line with a redundancy word line and a
redundancy bit line.
[0124] Herein, an address for substitution which is calculated
based on the bitmap data supplied to a trimming device 3 in the
wafer stage is defined as a "redundancy address", while a
"redundancy address" derived from assemblies, which will be
described later, is defined as a "replacement address".
[0125] The replacement address decision device 2 determines, based
on the defective cell test information of defective cells which is
received from the defective cell test information file 4, whether
the defective cells are to be replaced by means of the redundancy
word line or the redundancy bit line in the redundancy circuit.
More specifically, the replacement address decision device 2
performs an analysis for each of the successive chips to determine
which one of the redundancy word lines and redundancy bit lines
enables the faulty bits to be remedied more efficiently (i.e., with
fewer redundancy bit and word lines to be replaced). The
determination of redundancy addresses is performed for every chip
on a wafer and for every wafer in a lot.
[0126] The memory cells with which replacement can be made are
constituted by those in a redundancy memory cell area which are
connected to redundancy word lines and arranged in the direction of
the word lines and those in a redundancy memory cell area which are
connected to redundancy bit lines and arranged in the direction of
bit lines. A plurality of such redundancy memory cell areas
exist.
[0127] In the case where three of a plurality of defective cells
lie on one word line, for example, if that word line is replaced
with a redundancy word line it will be sufficient to replace only a
single line, but if the bit lines are replaced with redundancy bit
lines three lines must be replaced. Thus, the replacement of the
word line with a redundancy word line is more efficient in terms of
the number of lines used. When replacing a plurality of defective
cells in the bitmap with redundancy memory cells, the replacement
address decision device 2 determines combinations of redundancy
word lines and redundancy bit lines by which the defective cells
can be replaced efficiently as described above.
[0128] Furthermore, the replacement address decision device 2
generates such a fuse address which causes the redundancy bit line
and the redundancy word line which will replace the bit line and
the word line selected as a result of the above analysis,
respectively, to have an address which is the same as that of the
corresponding bit line and word line.
[0129] More specifically, the redundancy word lines and the
redundancy bit lines each has an address setting circuit which
comprises a plurality of fuses for setting redundancy addresses as
will be described in more detail later. By blowing predetermined
fuses corresponding to a desired address, a redundancy address can
be set arbitrarily.
[0130] The replacement address decision device 2 generates a fuse
address, which specifies which fuses are to be blown, based on data
of the address of the word line and the bit line to be replaced and
output the fuse address thus generated to a trimming device 3. In
addition, the replacement address decision device 2 stores this
fuse address in a fuse information file 5.
[0131] The replacement address decision device 2 outputs this fuse
address file to the trimming device 3 and stores it in the fuse
information file 5.
[0132] A chip position analyzing device 42 generates the table
format data of FIG. 14 which represents classification of the fuses
in the redundancy circuits, i.e., which fuse numbers those fuses
constituting each group of fuses which sets an address of
redundancy word and bit lines have. The chip position analyzing
device 42 then stores the data in a redundancy address table file
44 in association with the above-described fuse address file.
[0133] The trimming device 3 then successively blows, by means of a
laser, fuses in the redundancy circuit in each chip of a wafer for
each wafer in a lot in the wafer process step, based on the
received data stored in the fuse address file.
[0134] In this case, as described above, the replacement address
decision device 2 outputs the fuse address file of a predetermined
lot which has been produced based on the bitmap obtained as a
result of the test by the LSI tester 1 to the trimming device 3
shown in FIG. 11 and also stores this fuse address file in the fuse
information file 5.
[0135] The trimming device 3 blows with the laser corresponding
fuses in each chip in each wafer based on the received fuse address
file.
[0136] Based on the fuse address file, the trimming device 3 blows
with the laser, for each wafer, fuses of the chips of the
semiconductor devices on the wafer to thereby replace the word
lines and the bit lines with the redundancy word lines and the
redundancy bit lines.
[0137] After the above replacement of the word and bit lines with
the redundancy word and bit lines has been completed, each wafer is
again subjected with the wafer tester 22 to a test with respect to
its semiconductor devices in order to confirm that the replacement
with the redundancy word and bit lines has been done as scheduled.
The wafer tester 22 may be the same as the LSI tester 1. Those
chips which have been determined as faulty (FAIL) in this test are
marked and will be discarded in a later step.
[0138] Those chips which have been determined as passing (PASS) are
cut/separated by a cutter into chip units, sealed into packages
with a plastic resin on a chip unit basis and assembled by a
package assembling device 26.
[0139] An assembly tester 27 subjects these assembled semiconductor
devices to tests which could not have been done in the wafer stage.
These tests include, for example, a high-speed operation test, a
breakdown test in which a high voltage is applied, an accelerated
(life) test which is carried out in a normal/low temperature/high
temperature atmosphere and requires a long period of time and other
tests which will interfere with other semiconductor device chips in
the wafer state through the wafer substrate.
[0140] In the above tests after assembly, semiconductor devices
which are determined as faulty in these subsequent tests with
respect to the additional test items or their assembled conditions
are detected by a selecting device 29 from among the semiconductor
devices which have been determined as non-defective (PASS) with
respect to the test items in the wafer state.
[0141] At this stage, the packages of those assemblies which have
been determined as faulty are marked (stamped) with sample numbers
which are unique in the relevant lot. These sample numbers are
stored in an assembly test information file 28.
[0142] Thus, the wafer tester 22 tests each chip on a wafer after
the laser processing for blowing the fuses for redundancy with the
trimming device 3 is completed.
[0143] Those chips for which bit failures are again detected as a
result of the above test are scrapped as irreparably faulty chips
in the next step.
[0144] Thus, those semiconductor device chips which have been
remedied with the redundancy circuits are sealed into packages and
assembled. In this case, the packages are marked on their surfaces
with the assembly lot number, the product name and the like.
[0145] Then, these assemblies are subjected with the assembly
tester 27 to tests which could not have been done in the wafer
stage, namely a high-speed operation test, a breakdown test in
which a high voltage is applied, an environmental test which is
carried out in a normal/low temperature/high temperature
atmosphere, and other tests which will interfere with other chips
through the wafer substrate.
[0146] In this test after assembly, semiconductor devices which are
determined as faulty with respect to the additional test items are
detected from among the semiconductor devices which have been
determined as non-defective (PASS) in the tests in the wafer
state.
[0147] Next, the replacement addresses are extracted from the
faulty assemblies by means of a replacement address reading device
41 to create for each chip a replacement address information file
43 shown in FIG. 19.
[0148] Then, an analysis of the failures is performed in order to
improve the manufacturing yield. For this purpose, the assemblies
which have been determined as faulty are used by a failure cause
determining device 34 to carry out an analysis for determining
which processing steps in the wafer process have caused the
failures.
[0149] In this case, the failure cause determining device 34 makes
use of the fact that abnormal processing steps can be identified
from the wafer position information in a lot and the pattern
(position information) of occurrence of failures in a wafer based
on failure patterns in a failure analysis database 35 to estimate
which processing steps of the wafer steps have caused the failures
in the chips.
[0150] Therefore, for the above identification of abnormal
processing steps, it becomes necessary to obtain the wafer position
information in the lot of the semiconductor devices and the chip
position information on that wafer.
[0151] Those assemblies which have been determined to have passed
by the selection device 29 are shipped as products 30 of
semiconductor memory.
[0152] Next, an outline of the failure analyzing steps in the
manufacture of semiconductor memories will be described with
reference to FIG. 11. In the manufacture of semiconductor memories,
the failure analysis which will be described hereunder is made
without synchronizing with the manufacturing steps.
[0153] The replacement address reading device 41 carries out a roll
call (which will be described later) with respect to those
assemblies which have been determined to be faulty in the test of
the test items added during the test of assemblies to thereby
extract the replacement addresses. In this case, in place of the
replacement address reading device 41, the assembly tester 27 can
be used to read the replacement addresses from the assemblies by
changing the test programs in the assembly tester 27.
[0154] A chip position analyzing device 42 reads, for each assembly
which has been determined as faulty in the test after assembly,
data of the replacement addresses from the replacement address
information file 43 and retrieves, from a redundancy address table
stored in a redundancy address table file 44 shown in FIG. 11, the
chip number which corresponds to a combination of replacement
addresses as described in the above replacement address data.
[0155] Furthermore, the chip position analyzing device 42 stores
the retrieved chip information in the assembly test information
file 28 at that record (storage area) whose sample number agrees
therewith.
[0156] In the assembly test information file 28 shown in FIG. 20,
the relation of the sample number of each semiconductor device
sealed into a package after assembly to the lot number, wafer
number and chip number of each semiconductor device chip in the
wafer process is indicated.
[0157] Each record in the replacement address information file 43
contains information on the sample number.
[0158] Therefore, the chip position analyzing device 42 extracts
the above sample number from the record of the replacement address
information file 43.
[0159] Then, the chip position analyzing device 42 writes this
sample number in the assembly test information file 28 in
association with the chip number which has been retrieved from the
redundancy address table and corresponds to the combination of
redundancy addresses of the semiconductor device having this sample
number.
[0160] It is assumed here that the chip position analyzing device
42 has detected the fact that a combination of redundancy addresses
{X/3, 4, A, C, D, . . . Y/1, 5, 7, 9, A, . . . } of the wafer
process lot number "CB95-3030", wafer number "01" and chip number
"06,31" described in the redundancy address table of the redundancy
address table file 44 agrees with a combination of replacement
addresses {X/3, 4, A, C, D, . . . Y/1, 5, 7, 9, A, . . . }
described in the replacement address information file 43 at the
record corresponding to the sample number"1".
[0161] Herein, [X/3, 4, A, C, D, . . . ] represents a combination
of redundancy addresses on the word line, while [Y/1, 5, 7, 9, A, .
. . ] represents a combination of redundancy addresses on the bit
line.
[0162] In this case, the chip position analyzing device 42 detects
the semiconductor device of the sample number "1" sealed in a
package after assembly as the chip having the wafer process lot
number "CB95-3030", wafer number "01" and chip number "06,31" and
stores the character "1" of the sample number "1" in the assembly
test information file 28 in association with the character string
of the lot number "CB95-3030", wafer number "01" and chip number
"06,31".
[0163] More specifically, as shown in FIG. 20, the chip position
analyzing device 42 describes in the assembly test information file
28 the character string "CB95-3030" representing the lot number in
the wafer process at an area R401 as data for the item "WAFER STEP
LOT NO", the character string "35er008" representing the lot number
in the assembling process at an area R402 as data for the item
"ASSEMBLY LOT NO", the character string of an identifier "W" and
the wafer number "01" at an area R403 as data for the item "WAFER
NO", the character string of the chip number "C06,31" at an area
R404 as data for the item "CHIP NO", and the character "1" of the
sample number of the semiconductor device after assembly at an area
R505 as data for the item "SAMPLE NO".
[0164] The failure distribution mapping device 32 carries out
statistical processing to facilitate an analysis based on the
assembly test information file 28 of FIG. 20 to determine to which
processing step in the wafer process caused the failures to each
semiconductor device which has failed attributes.
[0165] More specifically, the failure distribution mapping device
32 reads the chip numbers from the assembly test information file
28 of FIG. 20 for each wafer and derives a table of distribution of
failed chips of FIG. 21 based on position coordinates contained in
these chip numbers.
[0166] In this failed chip distribution table, a character string
composed of the identifier "W" and the wafer number "01" is
indicated in an area R601, a character string of "5" to "15"
representing vertical chip coordinates in the wafer is described in
an area R602 and a character string of "10" to "35" representing
horizontal chip coordinates in the wafer is described in an area
R603.
[0167] When displaying the semiconductor device of the sample
number 1 which has the lot number "CB95-3030", the wafer number
"01" and the chip number "06,31" on the chip distribution table of
FIG. 21, since "06" of the character string of the chip number
"06,31" represents the vertical coordinate of the chip and "31"
represents the horizontal coordinate of the chip, the failure
distribution mapping device 32 describes a mark R605 at the
position of these coordinates.
[0168] In a similar manner, when displaying the semiconductor
device of the sample number 2 which has the lot number "CB95-3030",
the wafer number "01" and the chip number "06,32" on the chip
distribution table of FIG. 21, the failure distribution mapping
device 32 describes a mark R606 at a corresponding position. These
marks R605 and R606 indicate failed chips. This distribution table
is displayed by the failure distribution mapping device 32 on the
display device 33.
[0169] Furthermore, the failure distribution mapping device 32
detects where on the wafers failed chips are concentrated by
superposing the chip distribution tables, where each table has been
derived for a respective one of the wafers, for each lot. There may
be a case where the number of failures is too low in the derived
failure distribution to identify a specific distribution pattern.
In such a case, the assembly test information file 28 may be merged
with the wafer test information file 23 produced with respect to
the test items in the wafer stage so that a failure distribution
can be derived. By doing so, the amount of information on the
failure distribution patterns is increased, so that identification
of the failure distribution pattern will be made easier, as a
result of which the probability of an incorrect determination of
the cause of any failure will be decreased.
[0170] Then, the failure cause determining device 34 compares the
pattern of marks in the chip distribution tables superposed on each
other for each lot with the failure patterns of wafers which have
been stored in the failure distribution database 35 and are
specific respectively to the processing steps which may cause the
failures. Based on the comparison, the failure cause determining
device 34 determines that the cause of failures exists in the
processing step whose failure pattern is the closest and displays,
on the display device 33, the pattern of marks of the chip
distribution tables superposed on each other for each lot together
with the name of the processing step obtained as a result of the
above determination.
[0171] In this case, a more accurate analysis of faulty processing
steps may become possible by including, in the above chip
distribution table, the distribution of semiconductor devices in
the wafer state on a wafer which has failed after the wafer process
has been completed, and by comparing such distribution with failure
patterns used in the determination of the cause of failures in the
processing steps.
[0172] Formats of the files used herein will now be described one
by one.
[0173] Fuse addresses which the replacement address decision device
2 outputs to the trimming device 3 has such a format as shown, for
example, in FIG. 12A character string of a "PRODUCT NAME" is
described in an area R1, and a character string of an identifier
"LOT NO" and a character string of a lot number "LOT NAME" are
described in an area R2 as a character string of "LOT NO", "LOT
NAME".
[0174] An identifier "W" and a wafer number "XX01" are described in
an area R3 as a character string of an identifier "WXX01".
[0175] Following the above area, in a row of areas R4, R5, . . . ,
an identifier "F" and Vref fuse numbers "Y101", "Y102", . . . are
described as character strings "FY101", "FY102", . . . ,
respectively, in the order of chips on the wafer bearing the above
wafer number.
[0176] Described in an area R6 is a chip number whose character
string is composed of an identifier "C" and a chip number
"A001".
[0177] Following this area, row fuse numbers representing numbers
of the fuses which are blown are described in a row of areas R7,
R8, . . . in the order of their numbers for each chip (a series of
fuse addresses for the row fuse numbers). These character strings
are composed of an identifier "F" and fuse numbers "B101", "B102".
These row fuse numbers correspond to the fuses in the redundancy
circuit for setting addresses of the redundancy word lines. In this
case, the character strings are separated from each other by
";".
[0178] Similarly, column fuse (COL FUSE) numbers representing the
fuses which are blown are described in a row of areas R9, R10, . .
. , respectively, in the order of their numbers for each chip (a
series of fuse addresses for the column fuse numbers). These
character strings are composed of the identifier "F" and fuse
numbers "C101", "C102", . . . The column fuse numbers correspond to
the fuses in the redundancy circuit for setting addresses of the
redundancy bit lines.
[0179] A character string of the identifier "C" and a chip number
"A002" is described in an area R11 as a character string
representing the next chip number.
[0180] After that, a chip number, row fuse numbers and column fuse
numbers are described in areas R12 to R15 in the above order.
[0181] Next to the above, a character string "/E" which is an
identifier indicating the end of the chip number, row fuse numbers
and column fuse number of the first wafer is described in an area
R16 as a termination delimiter of the wafer information.
[0182] In an area R17, a character string of the identifier "W" and
wafer number "XX02" which represents the number of the next wafer
is described.
[0183] Following this area, Vref fuse numbers and row fuse numbers
and column fuse numbers corresponding to respective chips of the
second wafer bearing the wafer number "XX02" are described in areas
up to an area R25 where a character string of the termination
delimiter "/E" of wafer information is shown, i.e., from an area
R18 to an area R24, in a manner described above for the case of the
first wafer of the number "XX01".
[0184] In a similar manner, respective fuse numbers of the wafers
of the lot bearing the lot number "LOT NAME" described in the area
R2 are described in succession.
[0185] The fuse numbers referred to in the above description
represent the numbers of fuses such as those shown in FIG. 13. FIG.
13 is a diagrammatic illustration showing the structure of a fuse
circuit for setting an address to one redundancy word line.
Usually, there are a plurality of redundancy word lines provided.
For the sake of simplicity, the address signals with respect to the
word line are shown to be constituted by four address signals A0 to
A3. The actual number of address signals varies depending on the
memory capacity and the type of memory arrangement. The fuse
circuit for each redundancy bit line has a structure similar to
that shown in FIG. 13.
[0186] In FIG. 13, the row fuse numbers in FIG. 12 correspond to
fuses F101 to F108.
[0187] More specifically, the address signal A0 received from the
outside is supplied, by a decoder not shown in the figure, to a
gate of corresponding transistor from among transistors TR1 to TR8
of the n-channel MOS (Metal Oxide Semiconductor) type as
complementary signals composed of the same address signal AO and an
inverted address signal A0B. For example, the address signal AO is
supplied to a gate of the transistor TR1 and the address signal A0B
is supplied to a gate of the transistor TR2.
[0188] One end of the fuse F101 is connected to a drain of the
transistor TR1, and the other end of the fuse F101 is connected to
a power supply of a predetermined voltage through a resistor RR.
Similarly, One end of the fuses F102 to F108 are connected to
drains of the transistors TR2 to TR8, respectively, and the other
ends of the fuses F102 to F108 are connected through the resistor
RR to the power supply of the predetermined voltage.
[0189] Sources of the transistors TR1 to TR8 are grounded. A
junction point between the other ends of the fuses F101 to F108 on
the one end and the resistor RR is connected to an input terminal
of an inverter M1. This inverter M1 serves together with another
inverter M2 to perform level adjustment and waveform shaping of a
word signal WD.
[0190] In the case where the replacement address decision device 2
determines based on the bitmap of the wafer No. "0001" tested by
the LSI tester 1 that the word line whose address signal {A3, A2,
A1, A0} is {0, 0, 1, 1} be replaced by a redundancy word line, for
example, this replacement address decision device generates a fuse
address from the above address signal {0, 0, 1, 1}.
[0191] More specifically, when the address signal {0, 0, 1, 1} is
received, the replacement address decision device 2 selects those
to be blown from the fuses F101 to F108 so that the word signal WD
goes to "H" level.
[0192] When the address signal of {0, 0, 1, 1} is received, those
address bits of the address signal which take the "H" level are the
address bits {A3B, A2B, A1, A0}. In this case, the address bits
{A3, A2, A1B, AOB} which are complementary to the address bits
{A3B, A2B, A1, A0} take the "L" level, so that the transistors TR2,
TR4, TR5 and TR7 are in the off state and conduct no current.
[0193] Thus, when the fuses connected to those transistors which
receive the address bits {A3B, A2B, A1, A0} at their gates are
blown, the current paths disappear, as a result of which even when
the transistors TR1, TR3, TR6 and TR8 are rendered on no current
flows and the word signal WD takes the "H" level.
[0194] Therefore, the replacement address decision device 2 selects
a string of fuse numbers {F108, F106, F103, F101} as a fuse address
for replacing the word line corresponding to the address signal {0,
0, 1, 1} with a redundancy word line.
[0195] When another word line to be replaced corresponds to an
address signal {1, 0, 1, 0}, the replacement address decision
device 2 selects a string of fuse numbers {F115, F114, F111, F110}
as a fuse address for replacement with the redundancy word
line.
[0196] In a similar manner, in order to replace a bit line with a
redundancy bit line, the replacement address decision device 2
generates based on the above-described bitmap a string of fuse
numbers {FC101, FC102, FC103, FC104} to render the redundancy bit
line correspondent to the address of the bit line to be
replaced.
[0197] In order to ensure that a supply voltage used internally to
the semiconductor memory device (internal supply voltage) is equal
to a predetermined voltage, the semiconductor memory device
generates a reference voltage Vref and generates the internal
supply voltage based on this reference voltage. This reference
voltage Vref is generated based on a threshold voltage Vt of a
transistor, but such threshold voltage varies in general depending
on the processing steps in the manufacturing line. It is therefore
necessary to measure the threshold voltage Vt with an LSI tester 1
and carry out an adjustment so that the level of the reference
voltage Vref becomes equal to the predetermined voltage. This
adjustment to obtain the predetermined voltage is also carried out
by blowing fuses.
[0198] More specifically, the replacement address decision device 2
determines a string of Vref fuse numbers of those fuses to be blown
to obtain the predetermined reference voltage Vref based on the
threshold voltage Vt measured by the LSI tester 1 for each
semiconductor device chip. Such a string of Vref fuse numbers is
formed for each chip as the string of numbers {FY101, FY102, FY103,
FY104, . . . } for the chip No. "CA001".
[0199] The replacement address decision device 2 has to output the
strings of fuse numbers successively, in the case of the strings of
fuse numbers for the row fuse numbers of FIG. 12, ". . . ; ROW FUSE
NO. (F101); ROW FUSE NO. (F103); ROW FUSE NO. (F106); ROW FUSE NO
(F108); ROW FUSE NO. (F110); ROW FUSE NO. (F113); ROW FUSE NO.
(F114); ROW FUSE NO. (F115); . . . " are described as a series of
fuse addresses.
[0200] For this reason, the chip position analyzing device 42
generates table format data shown in FIG. 14, in which starting row
fuse numbers of strings of row fuse numbers of redundancy words
line corresponding to words line to be replaced and starting column
fuse numbers of strings of column fuse numbers of redundancy bit
lines corresponding to bit lines to be replaced, in the order of
the redundancy word or bit lines used. The chip position analyzing
device 42 stores this table format data in a redundancy address
table file 44.
[0201] In this case, the column fuse numbers are arranged to start
from F501 and represent address signals each constituted by four
bits in a manner similar to the row fuse numbers.
[0202] Furthermore, the fuse numbers F101 to F108 form a group GR1,
the fuse numbers F109 to F116 a group GR2, . . . , the fuse numbers
F501 to F508 a group GL1, and the fuse numbers F509 to F516 a group
GL2.
[0203] In this case, F502, F502, F503, F504, . . . correspond to
FY101, FY102, FY103, FY104,. . .
[0204] Thus, as shown in FIG. 14, a character string [ROW FUSE
FIRST NO "F101, GR1"] which indicates that the starting fuse number
of the group GR1 is fuse F101 is described in an area R51. A
character string [ROW FUSE FIRST NO "F109, GR2"] which indicates
that the starting fuse number of the group GR2 is fuse F109 is
described in an area R52.
[0205] In a similar manner, the starting numbers of fuses forming
respective groups each corresponding to fuses for replacement with
a redundancy word line are described.
[0206] In FIG. 14, a character string [COL FUSE FIRST NO "F501,
GL1"] which indicates that the starting fuse number of the group
GL1 is fuse F501 is described in an area R61. A character string
[COL FUSE FIRST NO "F509, GL2"] which indicates that the starting
fuse number of the group GL2 is fuse F509 is described in an area
R62.
[0207] In a similar manner, the starting numbers of fuses forming
respective groups each corresponding to fuses for replacement with
a redundancy bit line are described.
[0208] The chip position analyzing device 42 uses the starting fuse
numbers described in the table format shown in FIG. 14 to divide
the string of fuse addresses of row fuse numbers and the string of
fuse addresses of column fuse numbers shown in FIG. 12 into groups
of fuse addresses each composed of the numbers of row fuses to be
blown or the numbers of column fuses to be blown.
[0209] Furthermore, the chip position analyzing device 42 processes
the fuse address file shown in FIG. 12 to produce an intermediate
file shown in FIG. 15. As shown in FIG. 15, this intermediate file
is a file formed by rearranging the character strings separated by
";" in the fuse address file of FIG. 12 so that they are described
in a single line. Herein, the above-described fuses F101 to F108
and F501 to F508 are used for the row fuse numbers and the column
fuse numbers.
[0210] The replacement address decision device 2 generates
redundancy addresses from the above intermediate file.
[0211] In this case, each redundancy address represents the address
of a word and a bit line which has been replaced with a redundancy
word and a redundancy bit line.
[0212] The chip position analyzing device 42 divides, based on the
table format data stored in the redundancy address table file 44,
the string of fuse addresses in the intermediate file shown in FIG.
15 into groups of fuse addresses each composed of row fuse numbers
of the fuses to be blown or column fuse numbers of the fuses to be
blown.
[0213] For example, the chip position analyzing device 42 divides
the string of fuse addresses composed of row fuse numbers of the
fuses to be blown into the group GR1 {F108, F106, F103, F101},
group GR2 {F115, F114, F113, F110}, . . .
[0214] Then, the chip position analyzing device 42 carries out a
processing step for converting each group of fuse addresses thus
obtained by the division into a redundancy address.
[0215] For example, the chip position analyzing device 42 converts
odd fuse numbers in the group GR1 {F108, F106, F103, F101} of the
row fuse numbers of group GR1 into "1"s and converts even fuse
numbers in the group into "0"s.
[0216] In a similar manner, the chip position analyzing device 42
converts the divided fuse addresses of other groups into data of
"0" and "1".
[0217] Then, the chip position analyzing device 42 converts the
group GR1 {0, 0, 1, 1}, group GR2 {1, 0, 1, 0}, . . . obtained by
the above conversion respectively into their hexadecimal
representations to obtain the redundancy addresses of group GR1
{3}, group GR2{A}, . . . Similarly, the chip position analyzing
device 42 converts the group GL1{1, 0, 1, 0}, group GL2{0, 0, 0,
1}, . . . respectively into their hexadecimal representations to
obtain the redundancy addresses of group GL1 {A}, group GL2{1}, . .
.
[0218] Next, a method of converting the fuse address file data into
replacement addresses will be described.
[0219] The chip position analyzing device 42 produces a redundancy
address table having a format shown in FIG. 16 for each wafer in a
lot, for example. This redundancy address table is a table which
shows the relation between redundancy addresses on one hand and a
lot number, a wafer number and chip numbers on the other hand.
[0220] The chip position analyzing device 42 stores the produced
redundancy address tables in the redundancy address table file
44.
[0221] As shown in FIG. 16, a character string "XXXX" of year,
month and day representing the date of manufacturing of this
redundancy address table is described in an area R60 for item
"DATE". A lot number to which the wafer has belonged in the wafer
process is described in an area R61 of item "Lot Name" as a
character string "CB95-3030". This item "Lot Name" corresponds to
"LOT NO","LOT NAME" of FIG. 12.
[0222] A number of the wafer in the lot of the above lot number is
described in an area R62 for item "Wafer Number" as a character
string "W0001". This item "Wafer Number" corresponds to the item of
the identifier "W" and the lot number "XX01" of FIG. 12.
[0223] A chip number representing coordinates of the chip on the
above wafer is described in an area R63 for item "Chip Name" as a
character string "C06,31". This item "Chip Name" corresponds to the
identifier "C" and the chip number "A001" of FIG. 12.
[0224] A value based on a fuse address for the adjustment of the
value of the voltage Vref of the chip bearing the chip number
"C06,31" is described in an area R64 for item "Vref number" as a
character string "4".
[0225] A character string of "GR1" representing the group GR1 which
is a number of the fuse group in which a redundancy address (an
address of a word line to be replaced) is written and a character
string of "3" representing the above redundancy address are
described in an area R65. More specifically, as will be appreciated
from the description made before about fuse addresses, fuses in the
group GR1 are blown so as to represent the address "3" of the word
line to be replaced, as a result of which an address of the
redundancy word line corresponding to this group GR1 becomes equal
to "3" whereby the word line is replaced with the redundancy word
line.
[0226] Similarly, a character string of "GR2" representing the
group GR2 which is a number of the fuse group in which a redundancy
address is written and a character string of "A" representing the
above redundancy address are described in an area R66.
[0227] Furthermore, a character string of "GR3" representing the
group GR3 which is a number of the fuse group in which a redundancy
address is written and a character string of "-" indicating that
the redundancy word line of this fuse group is not used are
described in an area R67.
[0228] For each of the groups GR4 and its succeeding groups, in a
manner similar to the groups GR1 to GR3, a character string of a
redundancy address is indicated below as a number of the group used
and a character string "-is " indicated below as a number of the
group not used.
[0229] A character string of "GL1" representing the group GL1 which
is the number of the fuse group in which a redundancy address (an
address of a bit line to be replaced) is written and a character
string of "A" representing the above redundancy address are
described in an area R68. More specifically, as will be appreciated
from the description made before about fuse addresses, fuses in the
group GL1 are blown so as to represent the address "A" of the bit
line to be replaced, as a result of which an address of the
redundancy bit line corresponding to this group GL1 becomes equal
to "A" whereby the bit line is replaced with the redundancy bit
line.
[0230] Similarly, a character string of "GL2" representing the
group GL2 which is the number of the fuse group in which a
redundancy address is written and a character string of"1"
representing the above redundancy address are described in an area
R69.
[0231] For each of the groups GL3 and its succeeding groups, in a
manner similar to the groups GR1 to GR3 and the groups GL1 and GL2,
a character string of a redundancy address is indicated below the
number of the group used and a character string "-" is indicated
below the number of the group not used.
[0232] A character string "C06,32" representing the number of the
next chip is described in an area R71 as an item of "Chip
Name".
[0233] A value based on a fuse address for the adjustment of value
of the voltage Vref of the chip bearing the chip number "C06,32" is
described in an area R72 for item "Vref number" as a character
string "5".
[0234] Thereafter, in a similar manner, redundancy addresses of the
chip bearing the chip number "C06,32" and numbers of the fuse
groups in which these redundancy addresses are written,
respectively, are described in the order of the redundancy word
lines and the redundancy bit lines.
[0235] In this manner, a redundancy address corresponding to a chip
number which represents a position (coordinates) of the chip is
described in the above redundancy address table with respect to all
the semiconductor device chips on a wafer corresponding to this
file.
[0236] In this case, the combination of redundancy addresses
corresponding to each chip number represents data which correspond
to the lot number, wafer number and chip number in the wafer
process.
[0237] More specifically, the combination of redundancy addresses
is a combination derived from the bitmap representing addresses of
the defective cells in the chip, i.e., a combination of addresses
of the word and bit lines to be replaced, and may therefore be
different from one chip to another with a very high probability. In
other words, it can be said that the probability of co-existence of
semiconductor device chips having the same redundancy address is
almost zero with respect to all the chips in a lot.
[0238] The reason for this is as follows. In order that the chip on
the wafer No. "01" bearing the chip number "C06,31" and the chip on
the wafer No. "01" bearing the chip number "C06,32" both described
above are determined to be the same chip, their redundancy
addresses for the word lines as well as their redundancy addresses
for the bit lines must be identical to each other.
[0239] For example, if the item of the group GR7 described in the
area R70 for the chip number "C06,31" takes in the corresponding
area for the chip number "C06,32" a character string other than "4"
or a character string "-", then it is determined that the chip
bearing the chip number "C06,31" and that bearing the chip number
"C06,32" are different chips.
[0240] In addition, although the word lines and the bit lines have
been assumed to have addresses each composed of four bits only in
the above description for the sake of convenience, the number of
bits is much greater in actual devices. For example, it is here
assumed that the semiconductor device has 128 M bits and a data bus
8-bit wide and is arranged in four banks. In this case, the number
of address signal lines for representing an address of a word line
is twelve (bit 0 to bit 11) and the number of address lines for
representing an address of a bit line is ten (bit 0 to bit 9).
These signal lines are divided into sets of signal lines and used
in the redundancy area.
[0241] For example, for the address signal lines for representing
an address of a word line eight lines are selected from bit 0 to
bit 11 to provide 2.sup.8=256 addresses, while for the address
signal lines for representing an address of a bit line eight lines
are selected from bit 0 to bit 9 to provide 2.sub.8=256 addresses.
There are 128 such sets for each and 256 sets in total. The width
of the data bus is not restricted to eight bits, and the number of
address signals is not restricted to the above numbers.
[0242] Not only in this application but also in general, when
selecting eight address signal lines from the twelve address signal
lines of bit 0 to bit 11 for representing the address of a word
line, for example, the bit 0 of the address signals corresponding
to the least significant bit is excluded in most cases. When the
replacement is performed with the address signal line of the least
significant bit being excluded, adjoining addresses whose address
values except for the least significant bit are the same are
replaced simultaneously. When dust or the like causes a failure
which needs replacement, the probability that adjoining word lines
or adjoining bit lines are also faulty is high. Thus, it is
advantageous that adjoining word lines or adjoining bit lines are
replaced simultaneously.
[0243] As described above, there are 256 sets of redundancy
circuits, wherein each set can select up to 256 addresses. Although
it may depend on the result of the manufacturing, a device will
become PASS in most cases when sets of redundancy circuits of the
order of 100 are used. Conversely speaking, the fact that the
circuit design was made such that there are 256 sets of redundancy
circuits provided, the design must have anticipated that half of
that number would be used.
[0244] If ten sets of redundancy circuits are sufficient for a
device to become PASS, the provision of 256 sets of redundancy
circuits is excessive and may indicate a wasteful design. If 300
sets of redundancy circuits are necessary to have a device become
PASS, the provision of 256 sets of redundancy circuits may indicate
a lack of foresight in the design stage.
[0245] A calculation will now be made to determine how many
combinations exist for 100 sets of redundancy circuits wherein each
set can take any value of 256 addresses. The number of combinations
of 100 sets selected from 256 sets is expressed as:
A.gtoreq..sub.256C.sub.100=256!/100! (1)
[0246] where C represent "combination". Since there are 100 sets
each taking any one of 256 addresses, the number of combinations
thereof is expressed as:
B=256.sup.100=10.sup.(100.times.log(256))=10.sup.800.times.log2.apprxeq.10-
.sup.240 (2)
[0247] Thus, the number of events which A and B can take is
A.times.B which is an astronomical number. However, the results of
the above formula (1) vary depending on how a remedying calculation
routine, which is a part of a program for determining redundancy
addresses, is programmed. Although no restriction is imposed on the
calculation of the number of combinations in the formula (1), when
redundancy circuits are actually used, the number of combinations
is restricted by the remedy calculation and is lower than the
number of combinations (i.e. 256!/100!) obtained by the formula
(1). For example, when the remedy calculation is carried out from
row addresses, the redundancy memory on the row side will
preferentially be used, whereas when the calculation is carried out
from the column side the row side will not be used much. Since the
selection is not made completely at random, the value of A will
decrease depending on the way the remedy calculation is performed.
But, there will still be at least several hundreds of combinations
and the value of A will never be below "1".
[0248] Even if it is assumed that A is equal to "1", the number of
combinations of redundancy addresses is at least:
A.times.B.gtoreq.1.times.B=10.sup.240 (3)
[0249] When the number of wafers in each lot is 25 with each wafer
having 200 chips thereon, the total number of chips in one lot is
5000 which is significantly small as compared to the number of
combinations for redundancy addresses.
[0250] Thus, as a finger print which enables one particular person
to be distinguished from a number of persons, the above combination
of redundancy addresses enables a particular chip on a particular
wafer in a lot of a particular lot number to be distinguished from
a population of all the chips included in a plurality of lots. That
is to say, one particular chip in the population can be
identified.
[0251] From the foregoing, we can say that the probability that a
plurality of chips having the same combination of redundancy
addresses is substantially null even taking into consideration the
number of lots.
[0252] Even when a plurality of chips have the same combination of
redundancy addresses, it will be expected that the number of such
chips having the same combination is significantly low for the
above reason. Therefore, when statistical processing for detecting
abnormal conditions in each processing step of the wafer process is
carried out with respect to a population of all the chips, the
number of chips having the above-described combination can be
treated as noise in the calculation made for this statistical
processing.
[0253] The chip position analyzing device 42 extracts redundancy
addresses for each chip from the fuse information file 5 in
accordance with the flow chart in FIG. 22.
[0254] The processing for extracting redundancy addresses for each
chip from the fuse address file will now be described with
reference to the flow chart shown in FIG. 22.
[0255] The chip position analyzing device 42 comprises a CPU and a
memory wherein the CPU carries out processing in accordance with
programs stored in the memory.
[0256] In step S101, the chip position analyzing device 42 reads
the fuse address data and the table file data from the fuse
information file 5 and the redundancy address table file 44,
respectively, and stores them in a storage section provided
therein.
[0257] In the next step S102, the chip position analyzing device 42
produces from the read fuse address data an intermediate file shown
in FIG. 15.
[0258] Subsequently, the chip position analyzing device 42 reads
from the intermediate file header information such as the product
name and the lot number, e.g., the character string Product Name
"128 M/SDRAM (128 Mbit Synchronous RAM)", Lot Number "CB95-3030",
and stores it in a predetermined area of the internal storage
section in step S103.
[0259] In step S104, the chip position analyzing device 42 reads a
line of data, i.e., the character string wafer number "W0001", from
the intermediate file.
[0260] In the next step S105, the chip position analyzing device 42
determines whether the character string read in step S104
represents a new wafer number. In this case, since the identifier
present at the top of the character string is "W", the chip
position analyzing device 42 determines that it is a new wafer
number and causes the processing to proceed to step S106.
[0261] If the identifier is a character other than "W", the chip
position analyzing device 42 causes the processing to proceed from
step S105 to step S108. In this step S108, the chip position
analyzing device 42 determines whether this is the case where no
fuse is used. More specifically, when it has been determined to be
PASS without any defective cell or when failures have occurred on
the entire surface of the wafer, the fuses are not used at all, so
that the chip position analyzing device 42 causes the processing to
proceed to step S115 which will be described later. In the present
case, since it has been premised that fuses are used, step S109
which will be described later is carried out subsequently to step
S108.
[0262] In step S106, the chip position analyzing device 42 extracts
the wafer number "0001" from the character string of the identifier
"W" and the wafer number "0001" which was read in step S104, and
stores this wafer number "0001" in a predetermined area of the
above-described storage section.
[0263] In the next step S107, the chip position analyzing device 42
read from the intermediate file a line of data, i.e., the character
string of the identifier "F" and the Vref fuse number "Y101".
[0264] Then, the chip position analyzing device 42 determines
whether the read character string, i.e., the identifier "F", agrees
with the character string of the identifier "/E" which represents
the end of wafer information. In the present case, since the
character string of the identifier "F" and the Vref fuse number
"Y101" does not agree with the character string of the identifier
of ending "/E", the chip position analyzing device 42 determines
that the read character string is different from the identifier
"/E" and causes the processing to proceed to step S109.
[0265] In this step S109, the chip position analyzing device 42
continuously reads, until a character string representative of a
chip number is reached, the identifiers "F" and the Vref fuse
numbers "Y102", which represent the numbers of fuses for the
setting of level of the voltage Vref, and upon detection of the
character string "CHIP NO." stores all the read Vref fuse numbers
"Y11", "Y102", . . . in a predetermined area of the storage section
and reads the character string on the line of the chip number,
i.e., the character string of the identifier "C" and the chip
number "A001".
[0266] Then, the chip position analyzing device 42 extracts the
chip number "A001" from the read character string of the identifier
"F" and the chip number "A001" and stores this chip number "A001"
in a predetermined area of the storage section.
[0267] Subsequently, in step S110, Vref numbers are formed based on
the combination of the strings of fuse numbers Vref fuse number
"Y101", Vref fuse number "Y102", . . . stored in the above storage
section. The relation between Vref numbers and combinations of
strings of fuse numbers has been stored in the storage section.
[0268] In the next step S111, the chip position analyzing device 42
reads from the intermediate file a line of data, i.e., the
character string "ROW FUSE NO. F101".
[0269] Then, the chip position analyzing device 42 determines
whether the character string read next to the above chip number is
an identifier of ending "/E" or not.
[0270] In the present case, since the read character string "ROW
FUSE NO. F101" does not coincide with "/E", the chip position
analyzing device 42 determines that the read character string is
not "/E" and causes the processing to proceed to step S112. In the
meantime, when no other fuses than those for the setting of level
of the voltage Vref are used, the identifier "/E" is read and the
result of the determination made in step S111 will be "YES". In
that case, the chip position analyzing device 42 causes the
processing to proceed to step S116 wherein processing similar to
that in step S113 described later is performed and then the
processing proceeds to step S115 which will be described later.
[0271] In step S112, the chip position analyzing device 42
continuously reads, until a character string representative of the
next chip number is detected, fuse numbers "ROW FUSE NO. F101",
"ROW FUSE NO. F103", . . . , "COL FUSE NO. F501", "COL FUSE NO.
F503", . . . , divides the string of these fuse numbers into fuse
groups corresponding respectively to the redundancy word lines and
the redundancy bit lines in accordance with the table file, and
generates redundancy addresses from each of the fuse groups.
[0272] For example, the chip position analyzing device 42 divides
the string of fuse numbers {F101, F103, F106, F108, F110, F113,
F114, F115, . . . , F501, F503, F506, F507, F509, F512, F514, F516,
. . . } based on the table format data and then rearranges the fuse
numbers to thereby form fuse group GR1{PF108, F106, F103, F101},
fuse group GR2{F115, F114, F113, F110}, . . . , fuse group
GL1{F507, F506, F503, F501}, fuse group GL2{F516, F514, F512,
F509}, . . .
[0273] Then, the chip position analyzing device 42 converts each
odd fuse number and each even fuse number into data "1" and data
"0", respectively, in the groups GR1, . . . GL2 . . . to thereby
form group GR1{0, 0, 1, 1}, group GR2{1, 0, 1, 0}, . . . , group
GL1{1, 0, 1, 0}, group GL2{0, 0, 0, 1}. . .
[0274] Then, the chip position analyzing device 42 converts each
bit series in the groups GR1, . . . , GL2, . . . into hexadecimal
numbers to form redundancy addresses as group GR1{3}, group GR2{A},
. . . , group GL1{A}, group GL2{1}, . . .
[0275] The chip position analyzing device 42 then causes the
processing to proceed to step S113.
[0276] In step S113, the chip position analyzing device 42 writes
the obtained combination of redundancy addresses in the redundancy
address table of FIG. 16, which is stored in the redundancy address
table file 44, corresponding to the chip number "A001", i.e., the
chip number "C06,31".
[0277] In this case, the chip position analyzing device 42 also
writes the lot number "C95-3030" and the wafer number "0001", which
have been stored in the storage section, together with the chip
number "C06,31" in the redundancy address table corresponding to
the combination of redundancy addresses.
[0278] Subsequently, in step S114, the chip position analyzing
device 42 reads a character string of the next line, i.e., a
character string of the identifier "C" and the chip number
"A002".
[0279] The chip position analyzing device 42 then determines
whether the read character string represents a chip number or
not.
[0280] In the present example, since the read character string is
the chip number "A002", the chip position analyzing device 42
determines that the read character string represents a chip number
and that there is chip information (a chip number, fuse numbers)
still remaining, and causes the processing to proceed to step
S109.
[0281] Thereafter, the chip position analyzing device 42 repeats
the processing from step S109 to step S114 to write successively
the obtained combinations of redundancy addresses together with
corresponding chip numbers in the redundancy address table stored
in the redundancy address table file 44, until the character string
"/E" representing an end of wafer information is detected instead
of a chip number in step S111 or when the character string "/E"
representing an end of wafer information is detected and it is
determined that there is no chip information remaining in step
S114.
[0282] When the character string "/E" representing an end is
detected in step S111 or in step S114, the chip position analyzing
device 42 recognizes that processing of one wafer has been
completed and causes the processing to proceed to step S115.
[0283] In this step S115, the chip position analyzing device 42
reads a character string of the next line to determine whether the
end of the fuse address file has been reached or not, e.g., whether
"EOF" (End of File) is detected or not.
[0284] In this case, if the chip position analyzing device 42 reads
a character string of the identifier "W" and a number "0002" which
together represent a wafer number, it recognizes that the end of
the fuse address file has not been reached and causes the
processing to proceed to step S104.
[0285] Thereafter, the chip position analyzing device 42 repeats
the processing from step S104 to step S115 as described above to
generate redundancy addresses for the wafer number "0002" and its
subsequent wafers until it is determined that the end of the fuse
address file has been reached at step S115, i.e., until the
generation of redundancy addresses for all the wafers in the lot of
the lot number "CB95-3030" has been completed.
[0286] When the chip position analyzing device 42 reads a character
string of the next line and detects that it is the end of the fuse
address file, i.e., when "EOF" is detected, this processing for the
generation of redundancy addresses (the flowchart of FIG. 22) is
terminated.
[0287] Hereinafter, a method (a roll call method) for extracting
replacement addresses from an assembled semiconductor device (an
assembly) with the replacement address reading device 41 will be
described with reference to FIGS. 17 and 18.
[0288] FIG. 17 is a diagrammatic illustration showing each
structure of a memory cell array and memory cells for redundancy.
FIG. 18 is a flowchart explaining the processing for the extraction
of redundancy addresses in the replacement address reading device
41.
[0289] In FIG. 17, character strings "0" to "F" described in an
area R100 represent addresses of word lines arranged to extend in
the column direction, while character strings "0" to "F" described
in an area R200 represent addresses of bit lines arranged to extend
in the row direction. A memory cell is arranged at each
intersection of the word lines and the bit lines.
[0290] For example, a memory cell MCFF is disposed at the
intersection of the word line F and the bit line F.
[0291] RX designates a redundancy memory cell area corresponding to
redundancy word lines, while RY designates another redundancy
memory cell area corresponding to redundancy bit lines.
[0292] The redundancy memory cell area RX is separated into blocks
of memories connected to redundancy word lines corresponding to
group GR1, group GR2, . . ., respectively.
[0293] In a similar manner, the redundancy memory cell area RY is
separated into blocks of memories connected to redundancy bit lines
corresponding to group GL1, group GL2, . . . , respectively.
[0294] The processing for extracting redundancy addresses in the
replacement address reading device 41 will now be described with
reference to the flowchart of FIG. 18. In the following
description, operations in respective steps are shown in the order
in which a CPU in the replacement address reading device 41
operates in accordance with measuring programs stored in a storage
section provided therein to control arithmetic operations of
necessary data and measuring circuits needed for the measurements
by the CPU.
[0295] In step S1, test conditions such as values of input
voltages/input currents to be supplied to a semiconductor device in
the test, timing data for measuring the operation speed and a
pattern in accordance with which the semiconductor device is
operated are set in the storage section of the replacement address
reading device 41 in accordance with the specification of the
semiconductor device to be tested as described in the reference
manual.
[0296] Subsequently, in step S2, the replacement address reading
device 41 causes the semiconductor device to operate in a normal
mode by the CPU.
[0297] Herein, the normal mode means a mode in which write and read
operations are performed with failed bits being replaced with
redundancy circuits.
[0298] Specifically, when writing data in memory cells of the
semiconductor device with the replacement address reading device
41, if an access is made to a word line which has not been replaced
with a redundancy word line the data is written into those memory
cells which are connected to the word line, whereas if an access is
made to a word line which has been replaced with a redundancy word
line the data is not written into the memory cells corresponding to
this word line but is written into those memory cells which
correspond to a group or a redundancy word line in which the
address of the above word line has been written.
[0299] For example, when writing data into a memory cell area of
the column corresponding the word line 3 is attempted, the data is
written into the memory cell area of the row corresponding to the
replacing group GR1. In this case, however, the writing party
(i.e., the replacement address reading device 41) carries out such
writing without being aware whether the specified word line has
been replaced or not and with which fuse group it has been
replaced. As a matter of course, when reading data stored in memory
cells, the reading party (i.e., the replacement address reading
device 41) is not aware whether the specified word line has been
replaced or not and with which fuse group it has been replaced.
[0300] In the next step S3, the replacement address reading device
41 writes "H" level data in memory cells of one bit line, for
example, in all the memory cells in memory cell area R201 in a
column (extending in the bit-line direction, in the horizontal
direction in FIG. 17).
[0301] It is here assumed that the word line 3 has been replaced
with the redundancy word line corresponding to the group GR1, the
word line A with the redundancy word line corresponding to the
group GR2, and the word lines 4, C and D with other redundancy word
lines.
[0302] Therefore, the "H" level data to be written into the memory
cells MC30 and MCA0 are actually written into the memory cells MGR1
and MGR2 in the redundancy memory cell area RX, respectively.
[0303] Similarly, the "H" level data to be written into the memory
cells MC40, MCC0 and MCD0 are written into the redundancy memory
cell area RX at the memory cells corresponding to the replacing
redundancy word lines, respectively.
[0304] In the next step S4, the replacement address reading device
41 sets the semiconductor device to operate in the test mode by the
CPU.
[0305] Herein, the test mode means a mode in which addresses
determined by the word lines 0 to F and the bit lines 0 to F are
not used and data is written in memory cells of specific addresses
in the redundancy memory cell areas RX and RY.
[0306] More specifically, the redundancy memory cell area RX and
the redundancy memory cell area RY are separated, through the
application of data of a specific pattern to a plurality of
predetermined pins of the semiconductor device, from the normal
address decoder and connected to a decoder provided for testing the
redundancy memory cell area RX and the redundancy memory cell area
RY. Thereby, the semiconductor device can write data into memory
cells of specific addresses in the redundancy memory cell areas RX
and RY with the writing party (the replacement address reading
device 41) being aware of this.
[0307] Subsequently, in step S5, the replacement address reading
device 41 writes "L" level data into memory cells of one bit line
in the memory cell area corresponding to the group GR1 which is the
first fuse group, i.e., into the memory cell MGR1.
[0308] Thus, the data stored in the memory cell MGR1 is changed
from "H" level to "L" level.
[0309] In the next step S6, the replacement address reading device
41 returns the operation mode of the semiconductor device from the
test mode to the normal mode.
[0310] In the next step S7, the replacement address reading device
41 reads data of all the memory cells of one bit line, i.e., all
the memory cells in the memory cell area R201, sequentially
determines whether each read data agrees with the initially written
corresponding "H" level data, and writes that address of the
redundancy word line corresponding to the faulty memory cell in a
not-shown failure memory.
[0311] In this case, the data stored in the memory cell MGR1 has
been changed to "L" level.
[0312] Since the semiconductor device is in the normal mode, the
replacement address reading device 41 writes the address "3" of the
replaced word line 3 in the failure memory as the address of the
redundancy word line corresponding to the group GR1.
[0313] In the next step S8, the replacement address reading device
41 makes a search through the failure memory to determine whether
there is any failed memory cell or not, i.e., whether the
semiconductor device has passed the test or not.
[0314] In the present case, since the address data is present in
the failure memory, the replacement address reading device 41
causes the processing to proceed to step S9.
[0315] In this step S9, the replacement address reading device 41
reads the address "3" of the word line 3 stored in the failure
memory. This address "3" is the redundancy address.
[0316] Thus, by writing "H" level data in all the memory cells of
one bit line in the normal mode, the "H" level data are written
into those memory cells which have not been replaced as they
are.
[0317] On the other hand, the "H" level data attempted to be
written into a memory cell which corresponds to a replaced word
line, for example the memory cell MC30 described above, is written
into the memory cell MGR1, which corresponds to the redundancy word
line of the group GR1 in the redundancy memory cell area RX
replacing the word line 3, by the replacement address reading
device 41 as described above for step S3.
[0318] Then, the replacement address reading device 41 changes the
operation mode of the semiconductor device to the test mode and
writes "L" level data into the memory cell MGR1 in the redundancy
memory cell area RX.
[0319] Subsequently, the replacement address reading device 41
returns the operation mode of the semiconductor device to the
normal mode, reads data from all the memory cells in the memory
cell area R201 corresponding to the bit line 0 and detects each
memory cell in which the data has been changed from "H" level to
"L" level, whereby the word line 3 which has been replaced with the
word line of the group GR1 corresponding to the memory cell MGR1
can be detected.
[0320] In step S10, the replacement address reading device 41
outputs the detected address "3" of the word line 3 to the
replacement address information file 43 of FIG. 11 as a replacement
address for the word line. FIG. 19 shows a table for indicating a
value of each replacement address thus derived and the
corresponding fuse numbers of fuses constituting a group, such
table being produced for each sample number. The replacement
address information file 43 shown in FIG. 19 corresponds to the
sample number "SP001".
[0321] For example, a character string "F101-F108" representing
fuses constituting the group GR1 and a character string "3" are
described in an area R301 for an item "FUSE" and an item
"REDUNDANCY ADDRESS" corresponding to the group GR1, respectively,
by the replacement address reading device 41.
[0322] The replacement address reading device 41 then causes the
processing to proceed to step S12.
[0323] In this step S12, the replacement address reading device 41
determines whether there are any other redundancy word lines in the
redundancy memory cell area RX or not.
[0324] Since there is a subsequent redundancy word line, i.e., the
word line corresponding to the group GR2, the replacement address
reading device 41 causes the processing to return to step S1 as a
result of the above determination.
[0325] In this case, in each of the steps S1 to S4, processing
similar in content to that described above for a corresponding step
is carried out.
[0326] In step S5, however, the replacement address reading device
41 writes "L" level data into memory cells of one bit line in the
memory cell area corresponding to the group GR2 which is the second
fuse group, i.e., into the memory cell MGR2.
[0327] As a result, the data stored in the memory cell MGR2 is
changed from "H" level to "L" level.
[0328] Then, in each of the steps S6 to S9, processing similar in
content to that described above for a corresponding step is carried
out.
[0329] In step S10, the replacement address reading device 41
stores the detected address "A" of the word line A in the
replacement address information file 43 as a replacement address of
word line.
[0330] For example, a character string "F109 to F116" representing
fuses constituting the group GR2 and a character string "A" are
described in an area R302 as the item "FUSE" and the item
"REDUNDANCY ADDRESS" corresponding to the group GR2, respectively,
by the replacement address reading device 41.
[0331] The replacement address reading device 41 then causes the
processing to proceed to step S12.
[0332] In this step S12, the replacement address reading device 41
determines whether there are any other redundancy word lines in the
redundancy memory cell area RX or not.
[0333] Since there is a subsequent redundancy word line, i.e., the
word line corresponding to the group GR3, the replacement address
reading device 41 causes the processing to return to step S1 as a
result of the above determination.
[0334] In this case, in each of the steps S1 to S4, processing
similar in content to that described above for a corresponding step
is carried out.
[0335] In step S5, the replacement address reading device 41 writes
"L" level data into memory cells of one bit line in the memory cell
area corresponding to the group GR3 which is the third fuse group,
i.e., into the memory cell MGR3.
[0336] As a result, the data stored in the memory cell MGR3 is
changed from "H" level to "L" level.
[0337] However, the redundant word line corresponding to this group
GR3 has not been used to replace any word line, so that the data
stored in any memory cell of the memory cell area R201 does not
change.
[0338] Then, in each of the steps S6 and S7, processing similar in
content to that described above for a corresponding step is carried
out.
[0339] In step S8, since the data from every memory cell in the
memory cell area R201 is at "H" level, the replacement address
reading device 41 determines that no address data is present in the
failure memory and causes the processing to proceed to step
S11.
[0340] In this step S11, since no address data is present in the
failure memory, the replacement address reading device 41
determines that the redundancy word line corresponding to the group
GR3 has not replaced any word line, and stores a character string
"UNUSE" representing the fact that the redundancy word line
corresponding to the group GR3 has not been used in the replacement
address information file 43.
[0341] For example, a character string "F117 to F124" representing
fuses constituting the group GR3 and a character string "UNUSE" are
described in an area R303 as the item "FUSE" and the item
"REDUNDANCY ADDRESS" corresponding to the group GR3, respectively,
by the replacement address reading device 41.
[0342] The replacement address reading device 41 then causes the
processing to proceed to step S12.
[0343] Thereafter, the replacement address reading device 41
repeats the processing of from step S1 to step S12 to extract
replacement addresses for the whole redundancy memory cell area RX,
i.e., for all the redundancy word lines, and then starts the
processing for extracting replacement addresses of the redundancy
memory cell area RY, i.e., for the redundancy bit lines.
[0344] In this case, the processing for extracting replacement
addresses for the redundancy bit lines is similar to that for the
redundancy word lines.
[0345] Therefore, the processing for extracting replacement
addresses for the redundancy bit lines will be described only in
those respects in which it is different from the processing for
extracting replacement addresses for the redundancy word lines, and
description about the flow chart as a whole will be omitted.
[0346] In step S3, the replacement address reading device 41 writes
"H" level data in memory cells of one word line, for example, in
all the memory cells in memory cell area R101 in a row (extending
in the word-line direction, in the vertical direction in FIG.
17).
[0347] In this case, the bit line 1 has been replaced with the
redundancy bit line corresponding to the group GL2, the bit line A
with the redundancy word line corresponding to the group GL1, and
the bit lines 5,7 and 9 with other redundancy bit lines in the
memory cell area.
[0348] Therefore, the "H" level data to be written into the memory
cells MC0A and MC01 is actually written into the memory cells MGL2
and MGL1 in the redundancy memory cell area RY, respectively.
[0349] Similarly, the "H" level data to be written into the memory
cells MC05, MC07 and MC09 are written into the redundancy memory
cell area RY at the memory cells corresponding to the replacing
redundancy bit lines, respectively.
[0350] In step S5, the replacement address reading device 41 writes
"L" level data into memory cells of one word line in the memory
cell area corresponding to the group GL1 which is the first fuse
group, i.e., into the memory cell MGL1.
[0351] As a result, the data stored in the memory cell MGL1 is
changed from "H" level to "L" level.
[0352] In step S7, the replacement address reading device 41 reads
data from all the memory cells of one word line, i.e., all the
memory cells in the memory cell area R201, sequentially determines
whether each read data agrees with the initially written
corresponding data of "H" level or not, and writes that address of
the redundancy bit line corresponding to the faulty memory cell in
the not-shown failure memory.
[0353] In this case, the data stored in the memory cell MGL1 has
been changed to "L" level.
[0354] Since the semiconductor device is in the normal mode, the
replacement address reading device 41 writes the address "A" of the
replaced bit line A in the failure memory as the address of the
redundancy bit line corresponding to the group GL1.
[0355] In step S10, the replacement address reading device 41
stores the detected address "A" of the bit line A in the
replacement address information file 43 shown in FIG. 11 as a bit
line redundancy address. FIG. 19 is the table for indicating a
value of each replacement address thus derived and the
corresponding fuse numbers of fuses constituting a group, such
table being produced for each sample number. The replacement
address information file 43 shown in FIG. 19 corresponds to the
sample number "SP001".
[0356] For example, a character string "F501 to F508" representing
fuses constituting the group GL1 and a character string "A" are
described in an area R351 for an item "FUSE" and an item
"REDUNDANCY ADDRESS" corresponding to the group GL1, respectively,
by the replacement address reading device 41.
[0357] Thereafter, the replacement address reading device 41
repeats the processing from step S1 to step S12 to extract
replacement addresses for the whole redundancy memory cell area RY,
i.e., for all the redundancy bit lines, and then terminates the
processing for replacement addresses with respect to one
assembly.
[0358] The processing for extracting replacement addresses for each
chip is repeatedly carried out for all the wafers in the lot.
[0359] As described above, according to this embodiment, by making
a search through the redundancy address table for a chip which has
the same combination of redundancy addresses as that in the
replacement address information file 43, it becomes possible to
obtain lot, wafer and chip numbers of the chip without destroying
the package of the assembled semiconductor device.
[0360] Thus, according to the present embodiment, by making use of
the electrical roll call method in the replacement address reading
device 41, it becomes possible to read replacement addresses to
thereby generate redundancy addresses for the detection of lot,
wafer and chip numbers. Therefore, a number of semiconductor device
assemblies can be evaluated each in the sealed-package state, and
abnormal manufacturing devices and processing steps can be detected
within a very short time period.
[0361] Furthermore, according to the present embodiment, since
accurate wafer position information in a lot and accurate chip
position information on a wafer in the wafer process can be
obtained, abnormal manufacturing devices and processing steps can
be detected with a high degree of accuracy.
[0362] Furthermore, by feeding the information about abnormal
manufacturing devices and processing steps which has been obtained
by the above-described analysis of failures back to the wafer
process, measures to rectify these abnormal manufacturing devices
and processing steps in the wafer process can quickly be taken.
[0363] Thus, by utilizing the present embodiments in the start (or
development) of a new process, in the introduction of a new
manufacturing device, in the introduction of a new product or in
the process control of a currently used process, the cause of a
failure can be located in an early stage and semiconductor devices
can be manufactured stably.
[0364] Furthermore, the date of processing of a lot in each
processing step can be determined from a lot number to facilitate
the quality control of each processing step in the wafer process,
and for the investigation of the cause of an abnormal processing
step, and factors of the process itself such as its environment can
be analyzed.
[0365] In the above description, although it has been assumed that
the replacement address decision device 2 is constructed so as to
generate redundancy addresses from fuse addresses, the replacement
addresses determined by the replacement address decision device 2
can directly be outputted to the replacement address information
file 43.
[0366] Specifically, it can be arranged such that the
above-described replacement address signal {A3, A2, A1, AO}={0, 0,
1, 1} is expressed in hexadecimal notation to obtain the redundancy
address "3".
[0367] As described above, in the second embodiment, the chip
information is detected, after the division into chips, based on
the replacement addresses of the redundancy circuit. As a result,
it is not necessary to provide a dedicated chip position
information storage area on a chip as in the third and fourth
related art, and it is also not necessary to add manufacturing
devices or processing steps to the wafer manufacturing line.
[0368] Therefore, the number of manufacturing steps and the chip
size need not be increased, and the manufacturing cost of each
semiconductor device will not increase.
[0369] In addition, since the replacement addresses are calculated
based on the fuse information to be outputted to the trimming
device, the amount of information that needs to be stored can be
reduced significantly as compared to such related art in which the
failure bitmap information is stored. For example, the failure
bitmap information for a semiconductor memory of 128 M bits may
amount to 16 M bytes per chip, 3.2 G bytes per wafer in the case of
a 200 chip/wafer, and 16 G bytes per lot in the case of a 50
wafer/lot even when the information is stored on the 8 bit/word
(byte) unit basis in the related art. In contrast, in the present
embodiment, information in the amount of 0.1 k byte (=100
replacement addresses in average.times.8 bits) per chip, 20 k bytes
per wafer in the case of a 200 chip/wafer and 1 M bytes per lot in
the case of a 50 wafer/lot may suffice.
[0370] Furthermore, the cause of failures can also be estimated
based on the distribution of failures which is formed using the
replacement address information.
[0371] Thus, by storing the replacement address information, the
chip position information and the information for the analysis of
failures in the wafer process can be made common, so that it
becomes possible to perform production control at the wafer
manufacturing line with less stored information.
* * * * *