U.S. patent application number 09/859930 was filed with the patent office on 2001-09-13 for single semiconductor wafer processor.
This patent application is currently assigned to SEMITOOL, INC.. Invention is credited to Curtis, Gary L., Scranton, Dana.
Application Number | 20010020482 09/859930 |
Document ID | / |
Family ID | 23649094 |
Filed Date | 2001-09-13 |
United States Patent
Application |
20010020482 |
Kind Code |
A1 |
Scranton, Dana ; et
al. |
September 13, 2001 |
Single semiconductor wafer processor
Abstract
In a method of processing or drying a semiconductor wafer, the
wafer is withdrawn from a fluid bath at an inclined angle, and at a
selected withdrawal speed. A solvent vapor is provided at the
surface of the bath, to create a surface tension gradient and
promote drying, or removal of the fluid from the wafer surface.
After the wafer is entirely withdrawn from the rinsing liquid, the
wafer is rotated briefly, to remove any remaining fluid via
centrifugal force, without the fluid drying on the wafer. The wafer
is held onto a rotor assembly which rotates the wafer within an
enclosed chamber, and which is also pivoted within the chamber, to
position the wafer at the incline angle.
Inventors: |
Scranton, Dana; (Kalispell,
MT) ; Curtis, Gary L.; (Kalispell, MT) |
Correspondence
Address: |
LYON & LYON LLP
SUITE 4700
633 WEST FIFTH STREET
LOS ANGELES
CA
90071-2066
US
|
Assignee: |
SEMITOOL, INC.
|
Family ID: |
23649094 |
Appl. No.: |
09/859930 |
Filed: |
May 17, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09859930 |
May 17, 2001 |
|
|
|
09416225 |
Oct 8, 1999 |
|
|
|
Current U.S.
Class: |
134/61 ; 134/161;
134/902; 134/95.2 |
Current CPC
Class: |
H01L 21/67034 20130101;
Y10S 134/902 20130101 |
Class at
Publication: |
134/61 ; 134/161;
134/902; 134/95.2 |
International
Class: |
B08B 003/04 |
Claims
What is claimed is:
1. An apparatus for processing a wafer, comprising: a rotor for
holding a wafer and for spinning the wafer about a first axis; a
pivot arm pivotably supporting the rotor, so that the rotor can
pivot about a second axis, substantially perpendicular to the first
axis; and a basin below the rotor, for holding a liquid, with the
rotor vertically moveable toward and away from the basin.
2. The apparatus of claim 1 further including fingers on the rotor
for holding a wafer.
3. The apparatus of claim 1 further comprising a lid moveable to
enclose the basin to prevent escape of vapors from the basin.
4. The apparatus of claim 3 further including a spin motor attached
to the rotor.
5. The apparatus of claim 4 further including a body around the
basin, and with the lid engageable with the body, to enclose the
basin.
6. The apparatus of claim 5 further including a pivot motor linked
to the pivot arm.
7. An apparatus for processing a wafer, comprising: a basin for
holding a liquid; a rotor assembly supported above the basin on an
arm, with the rotor assembly including a rotor plate, a spin motor
linked to the rotor plate for spinning the rotor plate, and a wafer
holder on the rotor plate for holding a wafer; a pivot drive linked
to the arm for pivoting the arm and the rotor assembly supported on
the arm; and an elevator supporting the arm, for moving the rotor
assembly towards and away from the basin.
8. An apparatus for processing a wafer, comprising: a basin; an
elevator supporting an arm above the basin; a rotor on the arm,
with the rotor pivotable relative to the basin; a spin motor
connected to the rotor; and holding means on the rotor for holding
a wafer.
9. An apparatus for processing a wafer using a liquid, comprising:
a body; a basin within the body; a lid moveable to enclose the
basin; a rotor assembly including holding means for holding a wafer
and a spin motor linked to the holding means; and rotor assembly
support means for moving the rotor assembly in at least two degrees
of freedom relative to the basin.
10. The apparatus of claim 9 where the two degrees of freedom are
up and down vertical movement, and pivoting movement about a
horizontal axis.
11. An apparatus for processing a semiconductor article,
comprising: means for withdrawing the article from a bath of
processing fluid at an inclined angle at a selected withdrawal
rate; means for exposing the article to a vapor of an organic
solvent above the bath; and means for removing any remaining
droplets of the fluid from the wafer by momentarily spinning the
article.
12. The apparatus of claim 11 further comprising an enclosure for
containing the vapor.
13. The apparatus of claim 11 wherein the inclined angle is from
5-45.degree..
14. The apparatus of claim 1 further including a spray nozzle for
spraying the solvent vapor.
15. An apparatus for processing a semiconductor article,
comprising: a rotor within a chamber; a pivot drive for pivoting
the rotor; a basin within the chamber; an elevator attached to the
rotor for lowering the rotor and an article to immerse the article
into a liquid within the basin, and for raising the rotor and
article out of the liquid; an organic solvent vapor source
connecting into the chamber; and a spin motor connected to the
rotor.
16. The apparatus of claim 15 further comprising a lid engageable
onto the chamber, to seal the chamber.
17. An apparatus for processing a semiconductor article,
comprising: a body; a lid attached to the body; a basin in the
body; a rotor within the body, above the basin, the rotor having a
spin motor, and article support joined to the spin motor; and an
elevator attached to the rotor.
18. The apparatus of claim 17 further comprising a pivot axle
extending from the elevator through the body and joined to the
rotor.
19. The apparatus of claim 18 further comprising a pivot motor
linked to the pivot axle.
20. The apparatus of claim 17 further comprising a lid actuator
attached to the lid and to the body for opening and closing the
lid.
21. The apparatus of claim 17 further comprising spray nozzles at
the basin.
22. The apparatus of claim 17 with the elevator including a lift
motor, for raising and lowering the rotor, and a pivot motor, for
pivoting the rotor within the body.
23. The apparatus of claim 17 further including means for holding a
single article on the rotor.
24. The apparatus of claim 8 further including means for supplying
an organic solvent vapor around the rotor.
Description
[0001] This Application is a Division of U.S. patent application
Ser. No. 09/416,225, filed Oct. 8, 1999, now pending, and
incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The field of the invention is manufacturing semiconductor
wafers and similar articles.
BACKGROUND OF THE INVENTION
[0003] Semiconductor devices are used in a wide range of consumer
electronics, computers, communication equipment, and various other
products. Semiconductor devices are generally made from wafers of
silicon, or other semiconductor materials. The wafers are processed
through many manufacturing steps, to form microelectronic circuits.
During various steps in manufacturing, the wafers are processed
using fluid chemicals (e.g., acids, caustics, etchants,
photoresists, plating solutions, etc.). They are also rinsed and
dried, to remove contaminants which can cause defects in the end
product devices or interfere with subsequent process steps.
However, the processing or rinsing fluids themselves have potential
for unintentionally depositing a residue or particulate
contaminants on the wafer, if fluid dries on the wafer surface.
Thus, fluid is preferably removed quickly and completely from the
wafer.
[0004] Deionized ("DI") water is frequently used as a rinsing
fluid. DI water, as well as other fluids used in manufacturing
semiconductors, will cling to wafer surfaces in sheets or droplets,
due to surface tension. Consequently, the surface tension forces
must be overcome to remove the sheets or droplets, and to thereby
leave no fluid-borne contaminants on the wafer surfaces.
[0005] Various approaches have been used in the past to reduce the
level of contaminants left on the wafer surface after processing or
rinsing and drying. These include spin rinser machines, alcohol
vapor machines, as well as equipment using combinations of spin,
alcohol, and heat. While several of these approaches have performed
well, there is a need for improved processing and drying methods
and equipment.
SUMMARY OF THE INVENTION
[0006] In a first aspect of the invention, a method for processing
a semiconductor article includes the steps of withdrawing the
article from a processing fluid at an inclined angle. The article
is withdrawn at a selected withdrawal rate. The article is
advantageously exposed to a vapor of an organic solvent. After the
wafer is completely withdrawn from the fluid, the wafer is spun
momentarily, via a rotor, to centrifugally remove any fluid
remaining on the wafer.
[0007] In a second aspect of the invention, a dry gas, such as
nitrogen, is mixed with the vapor.
[0008] In a third aspect of the invention, the spin time of the
wafer is limited, to avoid drying fluid on the wafer.
[0009] In a fourth aspect of the invention, an apparatus for drying
a semiconductor article, such as a wafer, includes a lid attached
to a body. A basin in the body holds a rinsing liquid. A rotor
within the body, above the basin, has a spin motor for spinning a
wafer. An elevator attached to the rotor moves the rotor
vertically, to immerse and withdraw a wafer from the rinsing
liquid. A pivot motor in the elevator pivots the rotor into a face
up position, for loading and unloading a wafer, and into a
downwardly inclined position, so that the wafer is withdrawn from
the liquid at an inclined angle.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Other objects and advantages of the invention will become
apparent from the drawing figures, which are provided by way of
example, and should not be interpreted as limits of the
invention.
[0011] In the drawings, wherein the same reference number denotes
the same element, throughout all of the views:
[0012] FIG. 1 is a perspective view of the invention;
[0013] FIG. 2 is a section view taken along line 2-2 of FIG. 1, and
showing the dryer in a closed position; and
[0014] FIG. 3 is a section view taken along line 3-3 of FIG. 1, and
showing the dryer with the lid moving into an open position.
DETAILED DESCRIPTION OF THE DRAWINGS
[0015] Turning now into detail to the drawings, as shown in FIG. 1,
the processor 10 of the invention has a body 12 having upper and
lower cylindrical side walls 13 and 15. A lid 14 is pivotably
attached to the body 12. A lid motor or actuator 18 attached to the
body 12 raises and lowers the lid 14, or pivots the lid 14
upwardly, to open and close the body 12.
[0016] Referring to FIGS. 1-3, a bottom section 17 is joined to the
lower cylindrical side wall 15. A basin 38 is provided within the
body 12. The basin 38 has serrations or notches 70 at its upper
rim. An inlet 40 connects a rinsing liquid source, such as
deionized water, into the basin 38. Similarly, a drain 42 extends
from the bottom of the basin 38 to a facility drain. Vapor/gas
inlets 24 are connected to nozzles 44 through ducts 26.
[0017] A seal or O-ring 34 on an inner rim 36 of the upper
cylindrical side wall 13 closes off the body 12 when the lid 14 is
brought down to a closed position, with the body 12 then forming an
enclosed chamber 25. Specifically, an annular lid extension 32 on
the lid 14 engages against the O-ring 34, when the lid 14 is in the
down or closed position (as shown in FIG. 2).
[0018] The chamber 25, although closed off, need not be sealed in
all cases. Rather, it is closed off sufficiently to inhibit
variations in processing resulting from e.g., intrusion of clean
room air into the chamber, etc.
[0019] Referring to FIGS. 2 and 3, a rotor assembly 50 within the
body 12 or chamber 25 is supported on a pivot axle 52. The rotor
assembly 50 includes a rotor plate 62 attached to a spin shaft 60
extending through a spin motor 54. Fingers 56 on the rotor plate 62
hold a wafer 58, or other flat media article.
[0020] The pivot axle 52 extends through a vertical slot 55 in the
upper cylindrical side wall 13, and is attached to an elevator 16
on the outside of the body 12. The vertical slot 55 is preferably
closed off or sealed with a bellows or similar component which
allows for vertical translation and pivoting movement of the pivot
axle 52, while largely preventing vapors or gases from passing into
or out of the chamber 25. The elevator 16 has a pivot motor 20 for
turning or pivoting (in elevation) the pivot axle 52 and the rotor
assembly 50. The elevator 16 also has a linear lift motor 21
attached to the pivot axle 52 and pivot motor 20, so that the rotor
assembly 50 within the chamber 25 can be raised and lowered, (along
with the pivot axle 52 and pivot motor 20).
[0021] An exhaust duct 29 connects an exhaust port 30 in the lid 14
to a facility vapor/gas removal or recovery.
[0022] The spin motor 54 may be an electric motor powered via wires
extending from the spin motor 54 through the pivot axle 52 and
making electrical connections with a power source in the elevator
16. Alternatively, the spin motor 54, pivot motor 20, and lift
motor 21, may be electrical, fluid driven or pneumatic.
[0023] In use, the processor 10 processes one wafer at a time. The
lid 14 is raised up and/or pivoted open via the lid actuator 18.
The rotor assembly 50 is in a right side up position, i.e., with
the fingers 56 facing up, to receive a wafer 58. A wafer, to be
processed, is placed into the fingers 56, either manually, or via a
robot. The fingers 56 secure the wafer to the rotor assembly 50.
The pivot motor 20 is energized, turning the pivot axle 52 and
rotor assembly 50, so that the rotor assembly 50 pivots into a face
down position (as shown in FIG. 3). The lid actuator 28 closes the
lid 14, with the lid extension 32 sealing the lid 14 against the
upper cylindrical side wall 13 of the body 12.
[0024] When used for cleaning, a rinsing fluid, such as DI water,
fills the basin 38 via entry through the inlet 40. A diffuser plate
75 provides for more even upflow of fluid, as the fluid fills the
basin. The lift motor 21 is energized to lower the rotor assembly
50, so that the wafer 58 is immersed into the rinsing liquid 39.
The basin 38 is preferably overflowing with the DI water or
processing fluid. A surface tension gradient is created between the
interface at the liquid-solid-gas contact line, and the free liquid
surface away from the contact line. The gradient is created and
sustained by providing a continuous exchange of the meniscus, by
overflowing the DI water or fluid. The notches 70 at the upper rim
of the basin provide a uniform extraction of the surface layer of
the fluid, to remove any accumulated impurities or organic
concentration. This maintains a uniform surface tension
gradient.
[0025] More than one process fluid can be used in the basin, with
the wafer remaining in the basin, for multiple process steps using
multiple fluids, before the wafer is extracted and dried. Megasonic
transducers 72 may be provided on the basin, to provide a cleaning
process, before drying.
[0026] The term "wafer" here means any flat media such as
semiconductor wafers, photomasks, flat panel displays, memory
disks, CD glass, etc.
[0027] If the rotor assembly 50 is horizontal, as shown in FIG. 3,
the pivot motor 20 is actuated to pivot the rotor assembly, so that
the wafer 58 is moved into an inclined angle A, from horizontal, as
shown in FIG. 2. The inclined angle A is preferably in the range of
3-45.degree. from horizontal, more preferably in the range of
5-30.degree., and still more preferably between 5-15.degree., with
10.degree. being suitable for many applications.
[0028] The lift motor 21 is then reversed to lift the rotor
assembly 50 up, thereby withdrawing the wafer 58 from the rinsing
liquid 39, while the wafer 58 is maintained at the inclined angle
A.
[0029] A vapor of an organic solvent, preferably isopropyl alcohol,
is introduced into the environment around the wafer 58, within the
chamber 25, by the vapor ducts 26 and nozzles 44. The vapor is
introduced into the basin 38 at a position at or just above the
surface of the rinsing liquid 39. The vapor should be
non-condensing, and is preferably mixed with nitrogen or other
non-reacting gas.
[0030] The lift motor 21 continues to lift the rotor assembly 50,
until the wafer 58 is entirely withdrawn from the rinsing liquid
39. The spin motor 54 is then turned on briefly, to fling off any
liquid remaining on the wafer 58. The spin time is limited, to
avoid allowing any liquid to dry on the wafer 58. The spinning of
the wafer 58 may take place with the rotor assembly 50 at any
position or incline angle, or even while the rotor assembly is
pivoting. However, spinning is preferably done with the wafer
either horizontal, or at the inclined angle A. The wafer 58 is
preferably spun at from 300-1800 rpm, preferably at 500-800 rpm,
for an interval from 5-30 seconds, or for the least amount of time
necessary to remove any remaining liquid from the wafer. As in
practice, any remaining liquid tends to be located near the
peripheral edges of the wafer 58, only very brief spinning is
needed. Consequently, the disadvantages of liquid drying on the
wafer are avoided.
[0031] The rotor assembly 50 may be upside down, as shown in FIGS.
2 and 3, or right side up, during spinning of the wafer. After
spinning, the lid 14 is reopened, so that the dry wafer can be
removed from the dryer 10. The rinsing liquid 39 is drained from
the basin 38 through the drain pipe 42. Fresh rinsing liquid may
then be supplied to the basin 38, for processing the next
wafer.
[0032] By withdrawing the wafer 58 at the inclined angle, a
continuous linear meniscus of rinsing liquid 39 is formed on the
wafer surface, minimizing droplets left on the wafer. The rate of
lift or withdrawal of the wafer from the rinsing liquid 39 is
controlled to maintain the continuous meniscus. The solvent vapor
reduces the surface tension of the rinsing liquid, causing the
liquid to more easily run off the wafer. Spinning the wafer
centrifugally removes any remaining liquid from the wafer. It also
removes any remaining rinsing or other processing liquid from the
rotor and other components supporting the wafer. This avoids the
need for intricate self draining designs for the fingers and other
wafer supporting elements. As the chamber 25 is substantially
enclosed when the dryer 10 is in operation, release of the solvent
vapor (and other chemicals if used) is minimized or prevented. The
exhaust duct 29 on the lid 14 exhausts gases and vapors from the
chamber 25 in a controlled manor.
[0033] When used for other semiconductor manufacturing steps,
process chemicals in fluid form are used instead of a rinsing
liquid.
[0034] Thus, a novel method and apparatus for processing and for
drying semiconductor wafers, and similar articles, has been shown
and described. Various changes and modifications may of course be
made, without departing from the spirit and scope of the invention.
The invention, therefore, should not be limited, except by the
following claims, and their equivalents.
* * * * *