U.S. patent application number 09/401988 was filed with the patent office on 2001-08-16 for apparatus and method for thermal regulation in memory subsystems.
Invention is credited to BARTH, RICHARD M., HAMPEL, CRAIG E., SATAGOPAN, RAMPRASAD, TSERN, ELY K., WOO, STEVEN C..
Application Number | 20010014049 09/401988 |
Document ID | / |
Family ID | 22380192 |
Filed Date | 2001-08-16 |
United States Patent
Application |
20010014049 |
Kind Code |
A1 |
WOO, STEVEN C. ; et
al. |
August 16, 2001 |
APPARATUS AND METHOD FOR THERMAL REGULATION IN MEMORY
SUBSYSTEMS
Abstract
A memory system configured to provide thermal regulation of a
plurality of memory devices is disclosed. The memory system
comprises a memory module having a plurality of memory devices
coupled to a bus. Additionally, the memory system also comprises a
controller coupled to the bus. The controller determines an
operating temperature (actual or estimated) of the memory device.
Based on the determined operating temperature of the memory device,
the controller is further operable to manipulate the operation of
the memory system.
Inventors: |
WOO, STEVEN C.; (SARATOGA,
CA) ; SATAGOPAN, RAMPRASAD; (SAN JOSE, CA) ;
BARTH, RICHARD M.; (PALO ALTO, CA) ; TSERN, ELY
K.; (LOS ALTOS, CA) ; HAMPEL, CRAIG E.; (SAN
JOSE, CA) |
Correspondence
Address: |
STEPHEN R WHITT ESQ
1215 TOTTENHAM COURT
RESTON
VA
20194
|
Family ID: |
22380192 |
Appl. No.: |
09/401988 |
Filed: |
September 23, 1999 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09401988 |
Sep 23, 1999 |
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09118696 |
Jul 16, 1998 |
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6021076 |
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Current U.S.
Class: |
365/211 |
Current CPC
Class: |
Y02D 10/16 20180101;
G06F 1/206 20130101; G11C 11/406 20130101; G06F 1/3225 20130101;
Y02D 10/00 20180101; G11C 11/40626 20130101 |
Class at
Publication: |
365/211 |
International
Class: |
G11C 007/04 |
Claims
What is claimed is:
1. A memory system comprising: a memory controller coupled to a
bus; a memory module comprising N memory devices coupled to the
bus, each one of the N memory devices operable to receive data from
the bus during a write operation and to transmit data onto the bus
during a read operation; wherein the memory controller comprises: a
tracking circuit operable to track a number of memory device
operations in M of the N memory devices during a period of time,
where M is less than or equal to N; and a control circuit operable
to manipulate operation of the memory system in response to a
comparison of the number of memory operations and a reference.
2. The memory system of claim 1, wherein the tracking circuit
comprises at least one counter.
3. The memory system of claim 2, wherein the at least one counter
comprises: a first counter incremented by each read operation
during the period of time; and a second counter incremented by each
write operation during the period of time.
4. The memory system of claim 3, wherein the at least one counter
comprises a First-In-First-Out (FIFO) buffer.
5. The memory system of claim 1, wherein the reference comprises
power value data relating a number of memory device operations with
an estimated operating temperature for the M memory devices.
6. The memory system of claim 5, wherein the power value data is
stored in the memory controller.
7. The memory system of claim 5, wherein the power value data is
stored in one or more register on the N memory devices.
8. The memory system of claim 5, wherein the memory module further
comprises a data storage element storing the power value data for
the M memory devices.
9. The memory system of claim 5, wherein the memory controller
further comprises: a delay circuit operable to select a first delay
between successive read operations to the M memory devices and to
select a second delay between successive write operations to the M
memory devices on the basis of a control circuit comparison
indicating that the number of memory operations exceeds the
reference.
10. The memory system of claim 5, wherein each of the N memory
devices is operable in first and second modes of operation, wherein
each of the N memory devices consumes less power in the second mode
of operation as compared with the first mode of operation; and
wherein the memory controller is operable to select between the
first and second modes of operation for each one of the M memory
devices on the basis of the control circuit comparison.
11. A method of regulating the operating temperature of memory
devices in a memory system comprising; a memory controller and a
memory module comprising a plurality of memory devices, the method
comprising: determining a number of operations involving one or
more memory devices on the memory module during a time period;
comparing the number of operations to reference data corresponding
to an estimated operating temperature the one or more memory
devices; determining whether to manipulate the operation of the
memory system on the basis of the comparison between the number of
operations and the reference data.
12. The method of claim 11, wherein the number of operations
comprises at least one of a number of read operations involving the
one or more memory devices, a number of write operations involving
the one or more memory devices, and a number of refresh operations
involving the one or more memory device.
13. The method of claim 11, further comprising: upon determining to
manipulate the operation of the memory system, introducing delays
between successive read operations and successive write operations
to the one or memory devices.
14. The method of claim 11, further comprising: upon determining to
manipulate the operation of the memory system, placing the one or
more memory devices in a mode of operation requiring less
power.
15. The method of claim 11, further comprising: upon determining to
manipulate the operation of the memory system, increasing the
refresh rate for the one or more memory device.
16. A memory system comprising: a memory controller coupled to a
bus; a memory module comprising N memory devices coupled to the
bus, each one of the N memory devices having a maximum operating
temperature; at least one temperature sensor measuring an actual
operating temperature for M of the N memory devices, where M is
less than or equal to N; and a circuit periodically refreshing data
in the M memory devices at a first rate when the actual operating
temperature is below the maximum operating temperature, and at a
second rate, higher than the first rate, when the actual operating
temperature is above the maximum operating temperature.
17. The memory system of claim 16, wherein the at least one
temperature sensor generates temperature data communicated to the
memory controller via the bus.
18. The memory system of claim 16, wherein the at least one
temperature sensor generates temperature data, and wherein the
memory system further comprises a signal line outside the bus
connecting the at least one temperature sensor and the memory
controller, such that the temperature data is communicated to the
memory controller via the signal line.
19. The memory system of claim 18, wherein the temperature data
comprises a digital flag and wherein the memory controller further
comprises a data register connected to the signal line and storing
a value associated with the digital flag.
20. The memory system of claim 16 wherein the memory module further
comprises a heat spreader, and wherein at least one temperature
sensor is associated with either each one of the M memory devices,
or a thermocouple between each one of the M memory devices and the
heat spreader.
21. A memory system comprising: a memory module comprising N memory
devices coupled to a bus, each one of the N memory devices being
operable in at least a first power mode and a second power mode,
and having a maximum threshold temperature; at least one
temperature sensors measuring actual operating temperature for a
group M of the N memory devices, where M is less than or equal to
N; a memory controller coupled to the bus, the memory controller
selecting the first power mode for each memory device in the group
M having an actual operating temperature below the maximum
threshold temperature, and selecting the second power mode for each
memory device in the group M having an actual operating temperature
above the maximum threshold temperature; wherein each one of the N
memory device consumes less power in the second power mode than in
the first power mode.
22. The memory system of claim 21, wherein the at least one
temperature sensor generates temperature data communicated to the
memory controller via the bus.
23. The memory system of claim 21, wherein the at least one
temperature sensor generates temperature data, and wherein the
memory system further comprises a signal line outside the bus
connecting the at least one temperature sensor and the memory
controller, such that the temperature data is communicated to the
memory controller via the signal line.
24. The memory system of claim 23, wherein the temperature data
comprises a digital flag and wherein the memory controller further
comprises a data register connected to the signal line and storing
a value associated with the digital flag.
25. A method of regulating the operating temperature of memory
devices in a memory system comprising a memory controller and a
memory module comprising N memory devices, the method comprising:
storing power value data indicative of a maximum threshold
temperature for at least one of the N memory devices in a data
storage element associated with the memory module; tracking a
number of memory system operations involving M of the N memory
devices during a time period, where M is less than or equal to N
and where the number of operations is indicative of an estimated
operating temperature for the M memory devices; comparing the
number of memory system operations to the power value data; and
upon determining based on the comparison of the number of memory
system operations to the power value data that the estimated
operating temperature for the M memory devices is greater than the
maximum threshold temperature, manipulating the operation of the
memory system to reduce the operating temperature of the M memory
devices.
26. The method of claim 25, further comprising: reading the power
value data from the data storage element during memory system
initialization.
27. The method of claim 25, wherein the data storage element is a
serial presence detect device.
Description
CROSS REFERENCE TO RELATED APPLICATION(S)
[0001] This application is a continuation-in-part of U.S.
application Ser. No. 09/118,696 filed Jul. 16, 1998.
FIELD OF THE INVENTION
[0002] The present invention relates to thermal regulation of
memory devices in a memory system. More particularly, the present
invention relates to an apparatus and method used to control
operation of a memory system to regulate the operating temperature
of memory devices in the memory system.
BACKGROUND OF THE INVENTION
[0003] Improvements in microprocessor designs have led to
microprocessors with a high operating frequency. Current
microprocessor designs have operating frequencies of 400 megahertz
("MHz") and higher. The increase in operating frequency, however,
has not led to fully acceptable performance gains. One of the main
factors adversely affecting performance gains is created when the
microprocessor idles during delays in external memory access. The
delays in external memory access are caused by the conventional
design characteristics of static random access memory ("SRAM")
cells, read only memory ("ROM") cells, and dynamic random access
memory ("DRAM") cells.
[0004] To counteract the performance losses associated with
external memory access, Rambus Inc., of Mountain View, Calif.,
developed a high speed memory system. FIG. 1 illustrates the Rambus
high speed memory system. In particular, system 100 shows a master
device, memory controller ("MC") 10, coupled to memory devices DRAM
20, SRAM 30, and ROM 40. Each device is coupled in parallel to
signal lines DATA BUS, ADDR BUS, CLOCK, V.sub.REF, GND, and VDD.
DATA BUS and ADDR BUS show the data and address lines used by MC 10
to access data from the memory devices. CLOCK, V.sub.REF, GND, and
VDD are the clock, voltage reference, ground, and power signals
shared between the multiple devices. Data is transferred by memory
device bus drivers (not shown) driving signals onto the bus. The
signals are transmitted over the bus to a destination device, such
as MC 10 or a central processing unit ("CPU") (not shown).
Accordingly, MC 10 coordinates the data transfer between the memory
devices of system 100 and a destination device.
[0005] To increase the memory access speed, system 100 supports
large data block transfers between the input/output ("I/O") pins of
the destination device and the memory devices of system 100. System
100 may also include design requirements that constrain the length
of the transmission bus, the pitch between the bus lines, and the
capacitive loading on the bus lines. Using these design
requirements system 100 operates at a higher frequency than
conventional memory systems. Accordingly, by increasing operating
frequency the performance of system 100 increases, thus reducing
the idle time of the destination device coupled to system 100.
[0006] Although a high operating frequency increases data
throughput, operating system 100 at a high frequency typically
results in higher power dissipation and correspondingly higher
system temperatures. This result is not unexpected when the basic
concept of thermal capacities is considered. The heat curve shown
in FIG. 2 illustrates this concept.
[0007] Beginning at some ambient temperature (T, ambient), the
temperature of an electrical device will rise over time to a
maximum, steady state temperature (T, steady state) as constant
power is applied. The rate at which the temperature rises is
determined by the thermal capacity of the device. The steady state
temperature is defined by many factors including the geometry,
size, composition, and surrounding environment (such as air flow)
of the device.
[0008] In the particular case of memory devices in a memory system,
power is not constant. Rather, the memory device is switched ON and
OFF with individual data requests. Thus, the heating curve for a
memory device will fluctuate considerably depending on it use in
addition to its thermal capacity.
[0009] Excessive heating of a memory device may cause problems well
below the steady state temperature. In fact, memory devices are
designed to operate at temperatures below a given junction
temperature ("Tj.sub.,max")
[0010] Additionally, provided the memory device includes a dynamic
cell design, its specification will also include a defined periodic
refresh rate. The refresh rate ensures that the storage cells of
the dynamic device are periodically recharged. Increasing the
operating frequency of a memory system, however, results in the
memory devices of the memory system generating high power levels.
The high power levels translate into an increase in the operating
temperature of the memory devices. If the operating temperature of
a memory device surpasses Tj.sub.,max the memory device may fail,
thus resulting in the failure of the memory system.
[0011] To ensure lower operating temperatures, prior art memory
systems implement conventional thermal management techniques. In
particular, to reduce the operating temperature of a memory device,
prior art memory systems typically use specific packaging designs
and specify the location of memory devices in memory systems.
Conventional thermal management techniques, however, create
numerous disadvantages.
[0012] In fact, many of the conventional thermal management
techniques are not readily applicable to evolving high frequency
memory systems. Conventional thermal management using packaging
designs for the memory devices is a good example. In particular,
conventional packaging designs are not always effective for
dissipating heat generated by memory devices operating at
frequencies in excess of 100 Mhz. Accordingly, the application of
traditional packaging designs to reduce thermal dissipation prove
ineffective in the thermal regulation of system 100.
[0013] Conventional thermal management techniques based on the
design layout of memory systems is another good example. In
particular, such conventional thermal management techniques require
large spacings between components to reduce heat transfer. In
system 100, however, the devices are located in relatively close
proximity to one another in order to increase data throughput.
Accordingly, the application of conventional placement techniques
to reduce thermal dissipation prove ineffective in the thermal
regulation of system 100.
SUMMARY OF THE INVENTION
[0014] In view of the foregoing, a brief summary of some exemplary
embodiments will now be presented. Some simplifications and
omissions may be made in this summary, which is intended to
highlight and introduce some aspects of the present invention, but
not to limit its scope in any way. Detailed descriptions of the
preferred embodiments adequate to allow those of ordinary skill in
the art to make and use the inventive concepts are provided
hereafter.
[0015] The present invention provides a system and method for
thermal regulation of a memory system. Memory systems operating at
high frequencies are particularly well adapted to the present
invention. That is, despite the fact that high frequency operation
results in greater power dissipation and increased heat, the
present invention yet allows the memory devices in the system to
operate below a specified junction temperature, or in the
alternative to reliably operate at temperatures above the specified
junction temperature with appropriate modification of the system's
performance parameters.
[0016] In one embodiment of the present invention, the operating
temperature of the memory device(s) is estimated. In another
embodiment, the actual operating temperature of the memory
devices(s) is measured. In either embodiment, operating temperature
may be derived on a memory device by memory device basis, or on a
memory module basis.
[0017] For example, one aspect the present invention provides a
memory system comprising a memory controller coupled to a bus, and
at least one memory device coupled to the bus. Typically there are
a plurality N of memory devices coupled to the bus. The memory
controller comprises a tracking circuit operable to track a number
of memory device operations involving M of the N memory devices
during a period of time, where M is less than or equal to N. The
memory controller also comprises a control circuit operable to
manipulate operation of the memory system in response to a
comparison of the number of memory operations and a reference.
[0018] The tracking circuit preferably comprises at least one
counter, and more preferably a first counter incremented by each
read operation during the period of time, and a second counter
incremented by each write operation during the period of time. The
at least one counter may comprise a First-In-First-Out (FIFO)
buffer.
[0019] The comparison reference comprises power value data relating
a number of memory device operations with an estimated operating
temperature for the at least one memory device. Power value data
may be stored in the memory controller, in one or more register
associated with the at least one memory device, or in a data
storage element associated with a memory module. The comparison
might, however, be made directly to a counter value in the tracking
circuit which maps to a true, known power value.
[0020] In another aspect, the present invention provides a memory
system comprising a memory controller coupled to a bus, a memory
device coupled to the bus and having a maximum operating
temperature, a temperature sensor measuring an operating
temperature associated with the memory device(s). The temperature
sensor may be associated with the memory device(s) proper, a
thermocouple attached to the memory device(s), or the heat spreader
itself.
[0021] However the operating temperature of the memory device is
derived, actually measured or estimated, it is used as a reference
in relation to one or more threshold values (for example, the
junction temperature noted above) to regulate operation of the
memory system in order to regulate the temperature of the memory
devices. Thermal regulation may be accomplished in a number of
ways.
[0022] In one aspect, the memory controller further comprises a
delay circuit operable to select delays between successive
operations, for example a first delay between successive read
operations and a second delay between successive write operations
on the basis of a control circuit comparison indicating that the
number of memory operations exceeds the reference.
[0023] In another aspect, the memory device(s) in the memory system
are operable in first and second modes of operation, wherein the
memory device consumes less power in the second mode of operation
as compared with the first mode of operation, and the memory
controller is operable to select between the first and second modes
of operation for the memory device on the basis of the control
circuit comparison.
[0024] In yet another aspect, a method of regulating the operating
temperature of a memory device in a memory system is used in which
a number of operations involving the memory device during a time
period are determined, the number of operations is compared to
reference data corresponding to an estimated operating temperature
for the memory device, and the operation of the memory system is
potentially manipulated on the basis of the comparison between the
number of operations and the reference data.
[0025] For another embodiment, the memory system includes multiple
memory devices functionally grouped on a memory module. Thermal
loading is often a system characteristic more aptly attributable to
a memory module, rather than individual memory devices since the
memory module can contain a heat spreader across the span of
grouped memory devices. Where the operating temperature is
estimated, the estimation may be made in relation to memory system
operations occurring in one or more memory devices on the memory
module. Where the actual operating temperature is measured,
measurement may take place in the memory devices proper, or at one
or more thermocouples associated with the memory devices and/or the
memory module heat spreader.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The features and advantages of the present invention are
illustrated by way of example and not limitation in the figures of
the accompanying drawings in which like references indicate like
elements, and in which:
[0027] FIG. 1 illustrates a prior art memory system;
[0028] FIG. 2 is a graph illustrating the concept of thermal
capacity;
[0029] FIG. 3 is a high level flowchart illustrating a method of
thermal regulation in a memory subsystem according to one
embodiment of the present invention;
[0030] FIG. 4 shows one embodiment of the present invention in
which a memory device is coupled to a memory controller having a
thermal regulation circuit;
[0031] FIG. 5 illustrates a FIFO buffer having application within
the embodiment shown in FIG. 4;
[0032] FIG. 6 shows an exemplary circuit used by a memory
controller of present invention to reduce the timing parameters of
a memory device;
[0033] FIG. 7 shows another embodiment of the present invention in
which a memory device with a temperature sensing circuit is coupled
to a memory controller;
[0034] FIG. 8 shows an exemplary thermal regulation circuit
consistent with one aspect of the present invention;
[0035] FIG. 9 is a high level flowchart illustrating a method of
thermal regulation in a memory subsystem according to another
embodiment of the present invention;
[0036] FIG. 10 shows yet another embodiment of the present
invention in which a memory system incorporates thermal regulation
circuitry; and, FIG. 11 shows a memory module adapted to the
present invention.
DETAILED DESCRIPTION
[0037] A system and method for thermal regulation of a memory
system is disclosed. Nominally, the memory system includes a memory
controller and at least one memory device. The present invention is
particularly well adapted for use in a memory system operating at
relatively high frequencies. Despite the fact that high frequency
operation results in greater power dissipation and increased heat,
the present invention allows the memory device(s) in the system to
operate below a specific junction temperature ("Tj.sub.,max"). For
example, a conventional memory device, such as a dynamic random
access memory ("DRAM"), might have a Tj.sub.,max of one hundred
degrees Celsius (100.degree. C.).
[0038] In one embodiment of the present invention, the operating
temperature of the memory device(s) is estimated. In another
embodiment, the actual operating temperature of the memory
devices(s) is measured. In either embodiment, operating temperature
may be derived on a memory device by memory device basis, on a
memory module basis, or on the entire memory system. However
derived, the operating temperature (actual or estimated) of the
memory device(s) is used as a reference in relation to a threshold
value to regulate operation of the memory system in order to
regulate the temperature of the memory device(s).
[0039] Thermal regulation may be accomplished in a number of ways.
For example, the present invention may ensure that the operating
temperature of the memory device(s) remains below this Tj.sub.,max
using one or more of a number of techniques. Alternatively, the
present invention may allow the memory device to operate at a
temperature greater than Tj.sub.,max, but increases the refresh
rate of dynamic memory device(s) in the system to ensure reliable
operation at these higher temperatures.
[0040] In one embodiment, the present invention includes a circuit,
preferably incorporated within the memory controller, that
estimates the operating temperature of the memory device(s). To
estimate the operating temperature of one or more memory devices,
the circuit tracks the data transfer operations within the memory
system. In particular, the circuit counts and stores the number of
read/write operations, as well as the number of other relevant DRAM
operations (like refresh operations), involving the memory
device(s). Based on the number and types of operations in a given
time period, the circuit estimates the operating temperature of the
memory device(s). If the operating temperature of the memory
device(s) exceeds a threshold value, the circuit regulates
operation of the memory system.
[0041] In another embodiment, the memory device(s) include a
temperature sensor coupled to the control circuit in the memory
controller. The temperature sensor measures an operating
temperature associated with the memory device(s). If the
temperature sensor indicates that the memory device is operating
above a given threshold temperature, the apparatus regulates the
operation of the memory system.
[0042] The memory system may include multiple memory devices
functionally grouped on a module. Thermal loading is often a memory
system characteristic more aptly attributable to a memory module,
rather than individual memory devices since the memory module may
contain a heat spreader across the span of grouped memory devices.
Where the operating temperature is estimated, the estimation may be
made in relation to memory system operations occurring in one or
more memory devices on the memory module. Where the actual
operating temperature is measured, measurement may be taken by a
special circuit within the memory devices proper, or by one or more
thermocouples attached to the memory devices or the memory module
heat spreader.
[0043] Regulating the operation of the memory system results in
regulation of the operating temperature of the memory devices in
the memory system. A number of regulation schemes are possible. For
example, the regulation scheme may consist of increasing the
refresh rate of the memory system, dynamically changing the timing
parameters of the memory system, dynamically placing components of
the memory system in a low power mode, and/or dynamically enabling
a cooling system.
[0044] Effective thermal regulation allows enhanced operating
performance in memory systems operating at high frequencies.
[0045] Turning now to the drawings, FIG. 3 is a high level
flowchart illustrating one embodiment of the present invention for
implementing thermal regulation in a memory system. In particular,
flowchart 240 illustrates a method used to turn off or turn on an
exemplary thermal regulation scheme. In step 245, a memory system
determines the operating temperature of a memory device. Examples
of actual methods and circuitry adapted to determine the
temperature of the memory device are described below.
[0046] Step 246 follows the completion of step 245. In step 246,
the operating temperature of the memory device is compared against
a predetermined threshold value. If the operational temperature
exceeds the threshold value, then step 247 is begun. In step 247,
the memory system initiates a thermal regulation scheme. After step
247 is completed, the memory system returns to step 245. If the
comparison done in step 246 finds that the operational temperature
does not exceed the threshold value, however, then step 248 is
begun.
[0047] In step 248, the memory system determines whether a thermal
regulation scheme is active. If a thermal regulation scheme is not
active, then the next step is step 245. If during step 248 the
system determines that a thermal regulation scheme is active, then
the memory system moves to step 249 in which the memory system
turns off the regulation scheme because the memory device is
operating below the threshold value. After step 249, the system
returns to step 245. For one embodiment, a memory system including
thermal regulation circuitry and one or more memory devices follow
the steps in flowchart 240 to regulate the operating temperature of
the memory devices.
[0048] FIG. 4 shows one embodiment of a memory device coupled to a
memory controller with thermal regulation circuitry. In particular,
system 200 includes controller 210 coupled to bus 230 along line
235. Bus 230, in turn, is coupled to memory device 220 via line
225. For one embodiment, bus 230 transmits address and data between
controller 210 and memory device 220. Accordingly, using bus 230,
controller 210 reads/writes data directly from memory device 220.
Using bus 230, controller 210 also transfers data from memory
device 220 to a second device (not shown) coupled to bus 230.
[0049] As illustrated in FIG. 4, controller 210 also includes
circuit 215 and circuit 216. Circuit 215 is used to ensure that
memory device 220 does not operate at a temperature exceeding
Tj.sub.,max. For one embodiment, circuit 216 is used to track the
operations of memory device 220 over a given time period. Data
relating the amount of energy/heat expended by a typical memory
device 220 during various memory system operations is developed
empirically. This "power value data" is stored within the memory
system, and later used as a reference to estimate the operating
temperature of the memory device in relation to a number of memory
system operations involving the memory device.
[0050] For example, circuit 215 may use the counted operations data
stored in circuit 216 in conjunction with the empirically derived
power value data to estimate the operational temperature of memory
device 220 during the given time period. If the estimated
temperature exceeds the threshold value Tj.sub.,max, a regulation
scheme is used to throttle the operation of system 200, thus
reducing the temperature of memory device 220.
[0051] For one embodiment, circuit 216 is a memory block used to
store the number and types of operations performed by memory device
220. For an alternative embodiment, circuit 216 is a first-in
first-out ("FIFO") buffer with each stage of the FIFO buffer
including multiple counters.
[0052] FIG. 5 illustrates one embodiment of the FIFO buffer. In
particular, FIFO buffer 260 includes three stages (275, 285, and
295) with each stage including a set of counters. Stage 275
includes counters 270-272. Stage 285 includes counters 280-282 and
stage 295 includes counters 290-292. Each set of counters tracks
the number of times specific operations are performed by memory
device 220 in a given time period "t1." Thus, each stage in FIFO
buffer 260 denotes the number of times three specific operations
are performed by memory device 220 during a "t1" time period. For
example, in stage 275, counter 270 might record the number of
precharge operations, counter 271 might record the number of read
operations, and counter 272 might record the number of write
operations occurring during period t1. The number of stages of the
FIFO buffer determines the extent of time during which the
operations of memory device 220 are tracked.
[0053] For example, for one embodiment, the FIFO has five stages
and t1 equals 1 second. Depending on the environment, first order
calculations indicate that several million operations occurring in
a few seconds can equate to memory device 220 having a temperature
of 95 degrees. Circuit 215 uses the five entries to calculate the
activity of memory device 220 over this time period. In particular,
based on the counter values of the FIFO buffer and empirically
determined power value data for each type of operation, circuit 216
calculates the total power dissipated by memory device 220. The
empirical power value data is used to correlate the total power to
the temperature of memory device 220.
[0054] The empirically determined power value data may be stored in
the memory controller, for example, as part of circuit 215. While
storing the power value data in the memory controller allows ready
access, such data is memory device specific. Since the memory
controller manufacturer is often different from the various memory
device manufacturers, obtaining and incorporating the power value
data into the memory controller can prove difficult.
[0055] Alternatively, the power value data may be stored in one or
more registers located directly on each memory device. This
embodiment allows each memory device, class of memory devices, or
batch of memory devices to accurately indicate its own specific
power value data. The memory controller may read the one or more
memory registers upon memory system initialization.
[0056] The power value data may be stored in registers associated
with a memory module in the memory system. Those of ordinary skill
in the art will recognize that a plurality of memory devices are
often grouped and packaged together in module form. Many
conventional memory modules include a data storage element
sometimes referred to as a "Serial Presence Detect," device or SPD
device. This memory element contains reference data (i.e., number,
type, etc.) for the memory devices on the memory module. In one
embodiment of the present invention, the SPD device or similar data
storage element is used to store the power value data along with
the conventional reference data.
[0057] Returning to the example illustrated in FIGS. 3, 4 and 5, if
the circuit 216 calculation is below a predetermined threshold
value system 200 operates normally. If the circuit 216 calculation
is above a predetermined threshold value, then controller 210
selects a regulation scheme to throttle the operation of system
200, thus controlling the operational temperature of memory device
220.
[0058] In one possible alternative embodiment, memory system 200
includes multiple memory devices, and multiple circuits 215, each
one governing an individual memory device, are included in
controller 210. Multiple circuits 215 allow controller 210 to
determine the operating temperature of each memory device and
subsequently regulate the operation of memory system 200. Within
this embodiment, different predetermined values may exist for
different memory devices, or groups of devices. In effect, the
provision of multiple different predetermined reference values
establishes multiple trip points which allow system 200 to initiate
one or more different regulation schemes for various trip points.
Accordingly, system 200 may implement varied or graduated
mechanisms to reduce the operating temperature of one or more
memory devices. The graduated control approach allows system 200 to
balance memory device temperature control with overall system
performance.
[0059] System 200 may incorporate a variety of regulation schemes
to ensure that memory device 220 operates below Tj.sub.,max. In one
embodiment, to ensure that memory device 220 operates below
Tj.sub.,max, system 200 can increase the timing parameters of
memory device 220--i.e., change the time required for memory device
220 to perform specific operations. In an alternative embodiment,
to ensure that memory device 220 operates below Tj.sub.,max,
controller 210 introduces delays into the instruction sequence of
memory device 220. In particular, if circuit 216 indicates a count
value above a given threshold, controller 210 delays the execution
of instructions directed to memory device 220. In yet another
embodiment, to ensure that memory device 220 operates below
Tj.sub.,max, controller 210 can change the operation mode of memory
device 220 or activate a cooling system.
[0060] FIG. 6 shows one embodiment of a circuit used by controller
210 to reduce the timing parameters of memory device 220. In
particular, circuit 300 is coupled to circuit 215 and includes four
registers (340-355), two select circuits (360 and 370), input
select 330, output read 310, and output write 320. As illustrated
in FIG. 6, registers 340 and 350 are coupled to select circuit 360.
The output of select circuit 360 is coupled to read 310. Similarly,
registers 345 and 355 are coupled to select circuit 370. The output
of select circuit 370 is coupled to write 320. Both select circuits
360 and 370 are coupled to select signal 330.
[0061] For one embodiment, read 310 is used to determine the delays
of controller 210 between successive reads from memory device 210.
Similarly, write 320 is used to determine the delays of controller
210 between successive writes to memory device 210. In the present
embodiment, during initialization of system 200, memory device 220
loads normal operation read/write delays into registers 340 and
345, respectively. Subsequently, to vary system 200 timing
parameters controller 210 uses delays stored in registers 350 and
355. In particular, during normal operation controller 210 moves
select signal 330 to a first position. If select 330 is in a first
position, register 340 is coupled to read 310 and register 345 is
coupled to write 320. As previously described, registers 340 and
345 increase delays used during normal operation. Accordingly,
during normal operation outputs read 310 and write 310 generate the
data stored in register 340 and 345. For example, from the
initialization process register 340 holds the value four and
register 345 holds the value six. Thus, during normal operation
controller 210 waits four cycles between successive reads of memory
device 220. Additionally, during normal operation controller 210
waits six cycles between successive writes to memory device
220.
[0062] If circuit 216 exceeds a threshold value, however,
controller 210 moves select 330 to a second position. When select
330 is in a second position, register 350 is coupled to read 310
and register 355 is coupled to write 320. Registers 340 and 345
include delays used during thermal regulation. In contrast to the
values stored in registers 340 and 345, registers 350 and 355 hold
higher values. For one embodiment, the values stored in registers
350 and 355 are derived from empirical data. For example, based on
empirical data register 340 stores the value twelve and register
345 stores the value eighteen. Accordingly, during thermal
regulation controller 210 waits twelve cycles between successive
reads of memory device 220. Additionally, during thermal regulation
controller 210 waits eighteen cycles between successive writes to
memory device 220. Regulating the timing parameter of system 200
allows controller 210 to control the operational temperature of
memory device 210, thus ensuring that memory device 210 does not
exceed Tj.sub.,max.
[0063] To ensure that memory device 220 operates below Tj.sub.,max
system 200 can also change the operation mode of memory device 220.
For example, for one embodiment, memory device 220 has two
operational modes. The operational modes include normal operation
and low power modes. One low power mode, called a drowsy mode,
reduces power dissipation by reducing performance, while another
low power mode, called nap, reduces power dissipation by preventing
memory access. During low power mode, system 200 consumes less
power. In particular, during low power mode memory device 220 turns
off non-essential circuitry. The reduction in the power consumption
of memory device 220 translates to a reduction in the operating
temperature of memory device 220. For one embodiment, if circuit
216 indicates a value above a given threshold, then controller 210
places memory device 220 in a low power mode.
[0064] As previously described, placing memory device 220 in a low
power mode reduces the thermal dissipation of memory device. The
low power modes, however, reduce the performance of system 200. In
particular, during the low power modes memory device 220 disables
unnecessary circuitry. For one embodiment, controller 210 places
memory device 220 in a low power mode for a predetermined time.
[0065] The aforementioned regulation schemes helps to ensure that
the temperature of memory device 220 does not exceed Tj.sub.,max.
For one embodiment, memory device 210 comprises a dynamic memory
device. A regulation scheme that allows memory device 220 to
operate above Tj.sub.,max is possible. In particular, if circuit
216 indicates a count value above a given threshold, then the
regulation scheme requires that controller 210 increases the
refresh rate of memory device 220. The increased refresh rate
allows memory device 220 to store information that would typically
be lost at temperatures above Tj.sub.,max, thereby effectively
increasing Tj.sub.,max. The increased refresh rate can also reduce
temperature by decreasing the time a device is available to perform
new operations.
[0066] FIG. 7 shows one embodiment of a memory device with a
temperature sensing circuit coupled to a memory controller. In
particular, system 400 includes controller 410 coupled to bus 440
along line 435. Bus 440, in turn, is coupled to memory device 420
via line 425. For one embodiment, bus 440 transmits address and
data between controller 410 and memory device 420. Accordingly,
using bus 440, controller 410 reads/writes data directly from
memory device 420.
[0067] As illustrated in FIG. 7, controller 410 includes register
415 and memory device 420 includes circuit 430. Circuit 430 is a
temperature sensing circuit that is coupled to register 415 via
line 450. Controller 410 uses circuit 430 to determine the
operating temperature of memory device 420. In particular, if
memory device 420 is operating above a threshold temperature, then
circuit 430 generates a digital signal along line 450. For one
embodiment, circuit 430 generates a logic "1" to indicate that
memory device 420 is operating above a threshold temperature. The
logic "1" signal sets a temperature flag in register 415. Based on
the set temperature flag, controller 410 initiates a regulation
scheme to throttle the operation of system 400, thus reducing the
temperature of memory device 420.
[0068] Controller 410 periodically samples register 415 to
determine whether the temperature flag is set. For one embodiment,
the sampling period is derived from empirical data. In particular,
the time period between memory device 420 reaching a threshold
temperature and memory device 420 reaching Tj.sub.,max is
empirically ascertained. The sampling period is set to a value that
is less than the sum of the empirically derived time and the time
required to initiate regulation. Setting the sampling period to
such a value ensures that controller 410 initiates a regulation
scheme prior to memory device 420 surpassing Tj.sub.,max. For
another embodiment, memory device 420 loads the sampling period of
the memory device into controller 410 during the initialization of
system 400.
[0069] For illustrative purposes, the previous description
describes a digital signal generated by circuit 430 along line 450.
For one embodiment, however, circuit 430 is a temperature sensitive
diode that generates an analog signal. For an alternative
embodiment, the output of circuit 430 is transmitted along bus
440.
[0070] FIG. 8 shows one embodiment of a thermal regulation circuit
included in circuit 215. In particular, circuit 590 includes input
511, output 512, register set 541, and sequencer 581. Circuit 590
also includes, FIFO 531 register set 521, comparator 551, and
arithmetic logic unit ("ALU") 561. As illustrated in FIG. 8,
sequencer 581 is coupled to input 511 and output 512. For one
embodiment, during normal operation, instructions from controller
210 to memory device 220 are transmitted along input 511 through
sequencer 581 and onto output 512. During thermal regulation,
however, sequencer 581 modifies the instruction sequence
transmitted to memory device 220. For example, for one embodiment,
sequencer 581 can introduce delay during thermal regulation.
[0071] As further illustrated in FIG. 8, register set 521 and FIFO
531 are coupled to the inputs of ALU 561. The output of ALU 561 is
coupled to the first input of comparator 551. The second input of
comparator 551 is coupled to register set 541. The output of
comparator 551 is coupled to sequencer 581.
[0072] For one embodiment, circuit 590 uses FIFO 531, register set
521, register set 541, comparator 551, and ALU 561 to determine
whether the thermal regulation of memory device 220 is necessary.
In particular, register set 521 includes power value data for
memory device 220. As previously described, FIFO 531 includes
counter information for the operations performed by memory device
220. Using the counter information of FIFO 531 and the power value
data of register set 521, ALU 561 performs arithmetic calculations
to estimate the operating temperature of memory device 220. After
ALU 561 performs the temperature estimation, comparator 551
compares the estimated temperature versus the contents of register
set 541. For one embodiment, register set 541 includes empirically
derived threshold temperatures.
[0073] As explained above, the power value data stored in register
set 521 may initially be stored in the memory controller, in one or
more registers associated with the memory device(s), or in a memory
module element, such as an SPD device.
[0074] If the comparison between the estimated temperature and the
threshold temperatures shows that thermal regulation is necessary,
sequencer 581 initiates a regulation scheme. For example, in one
embodiment, the regulation scheme consists of increasing the
refresh rate of memory device 220. In an alternative embodiment,
regulating the operation of the memory system consists of
dynamically changing the timing parameters of memory system 200.
For another embodiment, regulating the operation of the memory
system consists of dynamically placing memory device 220 in a low
power mode. For yet another embodiment, regulating the operation of
the memory system consists of dynamically enabling a cooling
system. For another embodiment, regulating the operation of the
memory system consist of introducing delays between operations.
[0075] FIG. 9 shows one embodiment of a flowchart used by a thermal
regulation circuit to implement a thermal regulation scheme. In
particular, flowchart 500 shows the steps followed by circuit 590
during the thermal regulation of memory device 220. Using steps 510
through 580, circuit 590 ensures that memory device 220 does not
exceed Tj.sub.,max. Step 510 is the initial step in flowchart
500.
[0076] For one embodiment, step 510 occurs after the power up of
system 200. In step 510, circuit 590 initializes the thermal
regulation scheme. In particular, in step 510, circuit 590 resets
the counters of FIFO 531. Further, in step 510, circuit 590 reads
the timing parameters and threshold values of memory device 220
into register set 521 and register set 521. After the
initialization of the regulation scheme, step 520 is begun.
[0077] In step 520, circuit 590 waits a "t2" time period to read
the counter values in FIFO 531. For one embodiment, "t2" equals the
predetermined time period necessary to acquire data for one stage
of FIFO buffer 260 included in circuit 216. For an alternative
embodiment, "t2" is read by memory controller 510 during the
initialization stage described in step 510. After circuit 590 waits
"t2" seconds step 530 is begun.
[0078] In step 530, circuit 590 reads the counter information in
FIFO 531. Subsequently, in step 540, the operating temperature of
memory device 220 is calculated via ALU 561. As previously
described, for one embodiment, the FIFO counter information is used
to compute an estimate of the operating temperature of memory
device 220. For an alternative embodiment, a memory device with a
temperature sensing circuit is used in system 200 for example,
memory device 420 and circuit 430 of system 400. In particular, if
memory device 420 is operating above a threshold temperature, then
the output of circuit 430 activates a temperature flag in sequencer
581. In step 540, the temperature flag is evaluated to determine
the operating temperature of the memory device 220. After
calculating/evaluating the operating temperature of the memory
device 220, step 550 is begun.
[0079] In step 550, the ALU 561 estimated temperature of memory
device 220 is compared against a threshold value. For one
embodiment, provided the calculated temperature of memory device
220 exceeds the threshold value, flowchart 500 transitions to step
580. In step 580, a thermal regulation scheme is initiated. As
previously described, the thermal regulation scheme reduces the
operating temperature of memory device 220, or increases the
refresh rate so that the memory device can operate at a temperature
above Tj max. For an alternative embodiment, the calculated
temperature of memory device 220 is compared against multiple
thresholds. The multiple thresholds allow system 200 to initiate a
different regulation scheme for each threshold. In particular,
provided a first threshold is exceed, flowchart 500 transitions to
step 580 to initiate a regulation scheme corresponding to the first
threshold. If a second threshold is exceed, then flowchart 500
transitions to step 580 to initiate a second regulation scheme
corresponding to the second threshold. Accordingly, the use of
different regulation schemes allow system 200 to perform graduated
steps to reduce the operating temperature of memory device 220. The
graduated steps allow system 200 to balance temperature control
versus system performance. After starting a thermal regulation
scheme, flowchart 500 returns to step 520.
[0080] If the calculated temperature of memory device 220 does not
exceed a threshold value, step 560 is begun. In step 560, circuit
590 determines whether a thermal regulation scheme is active. If
all thermal regulation schemes are inactive, flowchart 500
transitions to step 520. If a thermal regulation scheme is active,
then flowchart 500 transitions to step 570.
[0081] In step 570, for one embodiment, circuit 590 stops an active
thermal regulation scheme. Circuit 590 stops the active thermal
regulation scheme because the calculated temperature of memory
device 220 does not exceed a threshold value. Accordingly, the
operating temperature of memory device 220 is not approaching
Tj.sub.,max and the active regulation scheme is unnecessary. For an
alternative embodiment, in step 570, if the regulation scheme
involves multiple threshold values, one or more regulation
mechanisms is deactivated depending on which threshold values are
exceeded. After step 570, flowchart 500 returns to step 520.
[0082] FIG. 10 shows one embodiment of a memory system. In
particular, system 600 includes controller 640 coupled to memory
devices 610, 620, and 630 via bus 650. For one embodiment, bus 650
transmits address and data between controller 640 and memory device
610, 620, and 630. Accordingly, using bus 650 controller 640
reads/writes data directly from the memory devices.
[0083] Memory devices 610, 620, and 630 and controller 640 are also
coupled to each other via signal lines 655-657. The signal lines
form a chain between controller 640 and the memory devices. In
particular, memory device 630 is coupled to memory device 620 via
signal line 657. Similarly, memory device 620 is coupled to memory
device 610 via signal line 656. Finally, memory device 610 is
coupled to controller 640 via signal line 655. For one embodiment,
during the initialization of system 600 signal lines 655-657
transfer the timing parameters and refresh rates of the memory
devices to controller 640.
[0084] For one embodiment, controller 640 estimates the memory
device operating temperature. As previously described, based on the
estimated operating temperature controller 640 initiates a
regulation scheme. The regulation scheme reduces the operating
temperature of the memory device(s) operating above a threshold
temperature. For an alternative embodiment, memory devices 610,
620, and 630 include temperature sensing circuits. Thus, controller
640 determines the actual operating temperature of each memory
device. In particular, each temperature sensing circuit outputs a
digital signal indicating whether the memory device corresponding
to the sensing circuit is operating above a threshold temperature.
For one embodiment, signal lines 655-657 transfer the digital
signals to controller 640. Based on the digital signals, controller
640 initiates a regulation scheme to reduce the temperature of
those memory devices operating above a threshold temperature. For
an alternative embodiment, the digital signals are transferred to
controller 640 via bus 650.
[0085] Controller 640 is also coupled to a cooling system (660 and
670) via line 680. For one embodiment, a regulation scheme
implemented by controller 640 includes initiating a cooling system.
Accordingly, controller 640 activates fan 660 and fan 670 when the
controller determines that one of the memory devices 610, 620, or
630 is approaching Tj.sub.,max.
[0086] As described above, the present invention contemplates
thermal management on a memory module basis as well as memory
device basis. To further illustrate this point, reference is made
to FIG. 11 which illustrates a memory module and its relation to
the present invention.
[0087] In general block diagram form, FIG. 11 illustrates a memory
module 700 in card form having a series of plug-in connectors 707,
a plurality of memory devices 701-704, and a serial presence detect
(SPD device) 705. The plurality of memory devices are commonly
connected to the bus, but SPD device 705 generally communicates
with memory controller via a separate signal line. While the
illustrated example contains an SPD device connected via a
dedicated signal line, one of ordinary skill will appreciate that
any type of data storage element associated with the memory module
and communicating with the memory controller via any reasonable
means may be used to store power value data associated with the
memory devices. The SPD device is presently preferred because it is
already routinely incorporated in memory modules, and interrogated
by the memory controller during memory system initialization. Thus,
the present invention make efficient use of existing memory system
resources to effect novel features and derive their additional
benefit.
[0088] In the foregoing specification, the invention has been
described with reference to specific exemplary embodiments. It
will, however, be evident that various modifications and changes
may be made thereof without departing from the broader spirit and
scope of the invention as set forth in the appended claims. The
specification and drawings are, accordingly, to be regarded in an
illustrative rather than a restrictive sense.
* * * * *