U.S. patent application number 09/805564 was filed with the patent office on 2001-08-02 for semiconductor inspection apparatus and inspection method using the apparatus.
This patent application is currently assigned to FUJITSU LIMITED. Invention is credited to Fukasawa, Norio, Sumi, Yukinori.
Application Number | 20010010469 09/805564 |
Document ID | / |
Family ID | 13329664 |
Filed Date | 2001-08-02 |
United States Patent
Application |
20010010469 |
Kind Code |
A1 |
Fukasawa, Norio ; et
al. |
August 2, 2001 |
Semiconductor inspection apparatus and inspection method using the
apparatus
Abstract
A semiconductor inspection apparatus performs a test on a
to-be-inspected device which has a spherical connection terminal.
This apparatus includes a conductor layer formed on a supporting
film. The conductor layer has a connection portion. The spherical
connection terminal is connected to said connection portion. At
least a shape of said connection portion is changeable. The
apparatus further includes a shock absorbing member, made of an
elastically deformable and insulating material, for at least
supporting said connection portion.
Inventors: |
Fukasawa, Norio;
(Kawasaki-shi, JP) ; Sumi, Yukinori;
(Kawasaki-shi, JP) |
Correspondence
Address: |
ARMSTRONG,WESTERMAN, HATTORI,
MCLELAND & NAUGHTON, LLP
1725 K STREET, NW, SUITE 1000
WASHINGTON
DC
20006
US
|
Assignee: |
FUJITSU LIMITED
Kawasaki
JP
|
Family ID: |
13329664 |
Appl. No.: |
09/805564 |
Filed: |
March 14, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09805564 |
Mar 14, 2001 |
|
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|
08944489 |
Oct 6, 1997 |
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|
6246249 |
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Current U.S.
Class: |
324/750.29 |
Current CPC
Class: |
H01L 2224/81191
20130101; H05K 3/326 20130101; G01R 31/2886 20130101 |
Class at
Publication: |
324/765 |
International
Class: |
G01R 031/26 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 19, 1997 |
JP |
9-066912 |
Claims
What is claimed is:
1. A semiconductor inspection apparatus for performing a test on a
to-be-inspected device which has a spherical connection terminal,
said apparatus comprising: a conductor layer formed on a supporting
film, said conductor layer having a connection portion, said
spherical connection terminal is connected to said connection
portion, at least a shape of said connection portion being
changeable; and a shock absorbing member, made of an elastically
deformable and insulating material, for at least supporting said
connection portion.
2. The semiconductor inspection apparatus according to claim 1,
wherein said connection portion has a single-layer or multilayer
stacked stud bump projecting toward said spherical connection
terminal which is loaded on said apparatus.
3. The semiconductor inspection apparatus according to claim 2,
wherein said multilayer stacked stud bump is made of different
kinds of metals.
4. The semiconductor inspection apparatus according to claim 1,
wherein a surface of said connection portion is roughened.
5. The semiconductor inspection apparatus according to claim 1,
wherein a surface of said connection portion has a metal film
formed thereon, a material of said metal film being different from
a material of said connection portion.
6. The semiconductor inspection apparatus according to claim 1,
wherein a cut portion is formed in said shock absorbing member.
7. The semiconductor inspection apparatus according to claim 1,
wherein said shock absorbing member comprises a combination of a
plurality of division members.
8. The semiconductor inspection apparatus according to claim 1,
wherein said connection portion includes a ring-shaped portion and
an extending portion which extends from said ring-shaped portion
toward a center of said ring-shaped portion.
9. The semiconductor inspection apparatus according to claim 1,
wherein said connection portion has a nail-head shape.
10. The semiconductor inspection apparatus according to claim 1,
wherein a cut portion is formed in said supporting film.
11. The semiconductor inspection apparatus according to claim 1,
wherein said supporting film comprises a combination of a plurality
of division film members.
12. The semiconductor inspection apparatus according to claim 1,
wherein an electronic device is provided on a substrate which
comprises said conductor layer and said supporting film.
13. The semiconductor inspection apparatus according to claim 1,
wherein a projection portion is formed to said shock absorbing
member at a position at which said shock absorbing member faces
said connection portion, said projecting portion projecting toward
said connection portion.
14. The semiconductor inspection apparatus according to claim 1,
further comprising a supporting member which supports said shock
absorbing member.
15. The semiconductor inspection apparatus according to claim 14,
wherein said supporting member has one of a depression and a
projection formed thereto at a position at which said supporting
member faces said connection portion.
16. The semiconductor inspection apparatus according to claim 1,
further comprising a positioning mechanism which performs
positioning between said to-be-inspected device having said
spherical connection terminal and said connection portion.
17. The semiconductor inspection apparatus according to claim 16,
wherein said positioning mechanism comprises a guide pin.
18. The semiconductor inspection apparatus according to claim 16,
wherein said positioning mechanism comprises a guide-pin-attached
frame, said guide-pin-attached frame comprising a frame portion
which holds said to-be-inspected device and a guide pin which is
integrated with said frame portion.
19. The semiconductor inspection apparatus according to claim 18,
wherein said frame portion of said guide-pin-attached frame covers
and holds said to-be-inspected device, and said frame portion has a
taper surface formed on an inner surface thereof for positioning
said to-be-inspected device.
20. The semiconductor inspection apparatus according to claim 18,
wherein said frame portion has an aligning mechanism formed
thereto, said aligning mechanism performing an aligning process on
said to-be-inspected device so that said spherical connection
terminal can be positioned at said connection portion.
21. The semiconductor inspection apparatus according to claim 18,
wherein said frame portion has a pressing mechanism, said pressing
mechanism pressing said to-be-inspected device in a loaded
condition to said conductor layer.
22. The semiconductor inspection apparatus according to claim 18,
further comprising an elastic member having a shock absorbing
function between said frame portion and said to-be-inspected
device.
23. The semiconductor inspection apparatus according to claim 16,
wherein said positioning mechanism comprises a positioning
substrate, said positioning substrate being located so as to face
said to-be-inspected device which is loaded on said conductor
layer, said positioning substrate having a hole which has a shape
corresponding to said spherical connection terminal.
24. The semiconductor inspection apparatus according to claim 23,
wherein said positioning substrate is provided with a drawing
mechanism for drawing said spherical connection terminal.
25. The semiconductor inspection apparatus according to claim 23,
further comprising a substrate positioning mechanism for performing
positioning between said hole and said connection portion.
26. An inspection method using a semiconductor inspection apparatus
for performing a test on a to-be-inspected device which has a
spherical connection terminal, said apparatus comprising: a
conductor layer formed on a supporting film, said conductor layer
having a connection portion, said spherical connection terminal is
connected to said connection portion, at least a shape of said
connection portion being changeable; and a shock absorbing member,
made of an elastically deformable and insulating material, for at
least supporting said connection portion, said inspection method
comprising the step of pressing said spherical connection terminal
to said connection portion formed in said conductor layer so that
elastic deformation occurs in said connection portion of said
conductor layer and said shock absorbing member, the elastic
restoring force occurring in said connection portion and said shock
absorbing member due to said elastic deformation causing said
connection portion to be pressed to said spherical connection
terminal so that electrical connection therebetween is
provided.
27. An inspection method using a semiconductor inspection apparatus
for performing a test on a to-be-inspected device which has a
spherical connection terminal, said apparatus comprising: a
conductor layer formed on a supporting film, said conductor layer
having a connection portion, said spherical connection terminal is
connected to said connection portion, at least a shape of said
connection portion being changeable; a shock absorbing member, made
of an elastically deformable and insulating material, for at least
supporting said connection portion; and a positioning mechanism for
performing positioning between said to-be-inspected device having
said spherical connection terminal and said connection portion,
said positioning mechanism comprising a positioning substrate, said
positioning substrate being located so as to face said
to-be-inspected device which is loaded on said conductor layer,
said positioning substrate having a hole which has a shape
corresponding to said spherical connection terminal, said
inspection method comprising the steps of: a) inserting said
spherical connection terminal into said hole of said positioning
substrate, and thus positioning said spherical connection terminal;
b) causing said spherical connection terminal to be electrically
connected with said connection terminal while maintaining the
condition where the positioning has been performed; and c)
performing a test of said to-be-inspected device.
28. An inspection method using a semiconductor inspection apparatus
for performing a test on a to-be-inspected device which has a
spherical connection terminal, said apparatus comprises: a
conductor layer formed on a supporting film, said conductor layer
having a connection portion, said spherical connection terminal is
connected to said connection portion, at least a shape of said
connection portion being changeable; a shock absorbing member, made
of an elastically deformable and insulating material, for at least
supporting said connection portion; and a positioning mechanism for
performing positioning between said to-be-inspected device having
said spherical connection terminal and said connection portion,
said positioning mechanism comprising a positioning substrate, said
positioning substrate being located so as to face said
to-be-inspected device which is loaded on said conductor layer,
said positioning substrate having a hole which has a shape
corresponding to said spherical connection terminal, said
inspection method comprising the step of vibrating at least one of
said positioning substrate and said to-be-inspected device and thus
positioning said spherical connection terminal in said hole of said
positioning substrate.
29. An inspection method using a semiconductor inspection apparatus
for performing a test on a to-be-inspected device which has a
spherical connection terminal, said apparatus comprises: a
conductor layer formed on a supporting film, said conductor layer
having a connection portion, said spherical connection terminal is
connected to said connection portion, at least a shape of said
connection portion being changeable; a shock absorbing member, made
of an elastically deformable and insulating material, for at least
supporting said connection portion; and a positioning mechanism for
performing positioning between said to-be-inspected device having
said spherical connection terminal and said connection portion,
said positioning mechanism comprising a positioning substrate, said
positioning substrate being located so as to face said
to-be-inspected device which is loaded on said conductor layer,
said positioning substrate having a hole which has a shape
corresponding to said spherical connection terminal, said
positioning substrate having a drawing mechanism for drawing said
spherical connection terminal, said inspection method comprising
the steps of: a) forming a suction path in said positioning
substrate and connecting a suction apparatus to said suction path,
and b) positioning said spherical connection terminal in said hole
of said positioning substrate as a result of said spherical
connection terminal being drawn to said suction path.
30. An inspection method using a semiconductor inspection apparatus
for performing a test on a to-be-inspected device which has a
spherical connection terminal, said apparatus comprises: a
conductor layer formed on a supporting film, said conductor layer
having a connection portion, said spherical connection terminal is
connected to said connection portion, at least a shape of said
connection portion being changeable; a shock absorbing member, made
of an elastically deformable and insulating material, for at least
supporting said connection portion, a positioning mechanism for
performing positioning between said to-be-inspected device having
said spherical connection terminal and said connection portion is
provided, said positioning mechanism comprising a positioning
substrate, said positioning substrate being located so as to face
said to-be-inspected device which is loaded on said conductor
layer, said positioning substrate having a hole which has a shape
corresponding to said spherical connection terminal, said
positioning substrate having a drawing mechanism for drawing said
spherical connection terminal, said inspection method comprising
the steps of: a) forming said positioning substrate of a porous
material and connecting a suction apparatus to said positioning
substrate; and b) positioning said spherical connection terminal in
said hole of said positioning substrate as a result of said
spherical connection terminal being drawn to said positioning
substrate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a semiconductor inspection
apparatus and an inspection method using the apparatus, and, in
particular, to a semiconductor inspection apparatus and an
inspection method using the apparatus which is suitable for
inspection of a semiconductor chip, having spherical connection
terminals, and a semiconductor device (to-be-inspected device).
[0003] Recently, a semiconductor device is demanded to have a
higher density, a higher speed and to be miniaturized. In order to
meet the demand, a mounting method in which a plurality of
semiconductor chips, each of which is not sealed by a package (a
bare chip so-called), or a plurality of semiconductor devices of
the BGA (Ball Grid Array) structure are directly loaded on a
circuit substrate has been used.
[0004] In this mounting method, if one of the thus-arranged
plurality of bare chips or semiconductor devices has a defect, the
entire apparatus is defective. Accordingly, high reliability is
demanded for the individual bare chips or semiconductor
devices.
[0005] Therefore, an inspection of examining as to whether or not
the individual bare chips or semiconductor devices function
normally has been important.
[0006] 2. Description of the Related Art
[0007] In the related art, as an inspection method for a
semiconductor device (hereinafter, a bare chip which is not sealed
with resin and a semiconductor device which is sealed with resin
are generically referred to as `semiconductor devices`) which has
spherically projecting spherical connection terminals on the bottom
surface thereof, various inspection methods have been proposed and
have been performed practically.
[0008] When performing an electrical operation inspection on such a
type of semiconductor device, inspection needles of an inspection
apparatus are caused to come into contact with the spherical
connection terminals. It is necessary to perform electrical
connection inspection of the respective spherical connection
terminals with a little deterioration of the spherical connection
terminals as possible. Further, high reliability and low-cost
inspection is demanded.
[0009] As a semiconductor inspection apparatus in the related art,
for example, there is an apparatus using a semiconductor test
socket. This semiconductor socket is arranged so as to use probes
(inspection needles) and thus inspect electrical operation of a
semiconductor device. In this inspection method, a plurality of
probes are arranged on an inspection substrate for corresponding to
the plurality of spherical connection terminals formed on the
bottom surface of the semiconductor device. In this inspection
method, the extending ends of the probes are caused to directly
come into contact with the spherical connection terminals and
inspection is performed.
[0010] That is, this semiconductor test socket has the plurality of
probes which are provided in the same arrangement as that of the
plurality of spherical connection terminals of the semiconductor
device. These probes have U-shaped bending portions, respectively.
When the extending ends of the probes come into contact with the
spherical connection terminals of the semiconductor device and are
pressed, the bending portions bend and damage to the spherical
connection terminals is reduced.
[0011] However, when electrical inspection of the semiconductor
device is performed in the above-described probe inspection method,
because the heights of the spherical connection terminals vary from
each other, a case where connection with the probe may not be
sufficient occurs. Thereby, inspection accuracy may be
degraded.
[0012] Further, although the U-shaped bending portions are
provided, when the extending ends of the probes come into contact
with the spherical connection terminals, the shapes of the
spherical connection terminals, which are formed of solder, may be
changed.
SUMMARY OF THE INVENTION
[0013] The present invention is devised in consideration of the
above-described problems, and an object of the present invention is
to provide a semiconductor inspection apparatus and an inspection
method using the apparatus which can perform inspection of a
to-be-inspected semiconductor device having the spherical
connection terminals, with high reliability without changing the
shapes of the spherical connection terminals.
[0014] In order to solve these problems, the present invention uses
various means.
[0015] A first semiconductor inspection apparatus, according to the
present invention, for performing a test on a to-be-inspected
device which has a spherical connection terminal, comprises:
[0016] a conductor layer formed on a supporting film, the conductor
layer having a connection portion, the spherical connection
terminal is connected to the connection portion, at least a shape
of the connection portion being changeable;
[0017] a shock absorbing member, made of an elastically deformable
and insulating material, for at least supporting the connection
portion.
[0018] In a second semiconductor inspection apparatus according to
the present invention, the connection portion has a single-layer or
multilayer stacked stud bump projecting toward the spherical
connection terminal which is loaded on the apparatus.
[0019] In a third semiconductor inspection apparatus according to
the present invention, the multilayer stacked stud bump is made of
different kinds of metals.
[0020] In a fourth semiconductor inspection apparatus according to
the present invention, a surface of the connection portion is
roughened.
[0021] In a fifth semiconductor inspection apparatus according to
the present invention, a surface of the connection portion has a
metal film formed thereon, the material of the metal film being
different from the material of the connection portion.
[0022] In a sixth semiconductor inspection apparatus according the
present invention, a cut portion is formed in the shock absorbing
member.
[0023] In a seventh semiconductor inspection apparatus according to
the present invention, the shock absorbing member comprises a
combination of a plurality of division members.
[0024] In an eighth semiconductor inspection apparatus according to
the present invention, the connection portion includes a
ring-shaped portion and extending portions which extend from the
ring-shaped portion toward the center of the ring-shaped
portion.
[0025] In a ninth semiconductor inspection apparatus according to
the present invention, the connection portion has a nail-head
shape.
[0026] In a tenth semiconductor inspection apparatus according to
the present invention, a cut portion is formed in the supporting
film.
[0027] In an eleventh semiconductor inspection apparatus according
to the present invention, the supporting film comprises a
combination of a plurality of division film members.
[0028] In a twelfth semiconductor inspection apparatus according to
the present invention, an electronic device is provided on a
substrate which comprises the conductor layer and the supporting
film.
[0029] In a thirteenth semiconductor inspection apparatus according
to the present invention, a projection portion is formed to the
shock absorbing member at a position at which the shock absorbing
member faces the connection portion, the projecting member
projecting toward the connection portion.
[0030] In a fourteenth semiconductor inspection apparatus according
to the present invention, a supporting portion which supports the
shock absorbing member is provided.
[0031] In a fifteenth semiconductor inspection apparatus according
to the present invention, the supporting member has one of a
depression and a projection formed thereto at a position at which
the supporting member faces the connection portion.
[0032] In a sixteenth semiconductor inspection apparatus according
to the present invention, a positioning mechanism which performs
positioning between the to-be-inspected device having the spherical
connection terminal and the connection portion is provided.
[0033] In a seventeenth semiconductor inspection apparatus
according to the present invention, a guide pin is used as the
positioning mechanism.
[0034] In an eighteenth semiconductor inspection apparatus
according to the present invention, a guide-pin-attached frame is
used as the positioning mechanism, the guide-pin-attached frame
comprising a frame portion which holds the to-be-inspected device
and a guide pin which is integrated with the frame portion.
[0035] In a nineteenth semiconductor inspection apparatus according
to the present invention, the frame portion of the
guide-pin-attached frame covers and holds the to-be-inspected
device, and a taper surface for positioning the to-be-inspected
device is formed on an inner surface of the frame portion.
[0036] In a twentieth semiconductor inspection apparatus according
to the present invention, an aligning mechanism is formed to the
frame portion, the aligning mechanism performing an aligning
process on the to-be-inspected device so that the spherical
connection terminal can be positioned at the connection
portion.
[0037] In a twenty-first semiconductor inspection apparatus
according to the present invention, a pressing mechanism is
provided to the frame portion, the pressing mechanism pressing the
to-be-inspected device in a loaded condition to the conductor
layer.
[0038] In a twenty-second semiconductor inspection apparatus
according to the present invention, an elastic member having a
shock absorbing function is provided between the frame portion and
the to-be-inspected device.
[0039] In a twenty-third semiconductor inspection apparatus
according to the present invention, a positioning substrate is used
as the positioning mechanism, the positioning substrate being
located so as to face the to-be-inspected device which is loaded on
the conductor layer, the positioning substrate having a hole which
has a shape corresponding to the spherical connection terminal.
[0040] In a twenty-fourth semiconductor inspection apparatus
according to the present invention, a drawing mechanism for drawing
the spherical connection terminal is provided to the positioning
substrate.
[0041] In a twenty-fifth semiconductor inspection apparatus
according to the present invention, a substrate positioning
mechanism for performing positioning between the hole and the
connection portion is provided.
[0042] A first inspection method according to the present invention
using any one of the above-described first through twenty-fifth
semiconductor inspection apparatuses, the inspection method
comprising the step of pressing the spherical connection terminal
to the connection portion formed in the conductor layer so that
elastic deformation occurs in the connection portion of the
conductor layer and the shock absorbing member,
[0043] the elastic restoring force occurring in the connection
portion and the shock absorbing member due to the elastic
deformation causing the connection portion to be pressed to the
spherical connection terminal so that electrical connection
therebetween is provided.
[0044] A second inspection method according to the present
invention using any one of the above-described twenty-third through
twenty-fifth semiconductor inspection apparatuses, the inspection
method comprising the steps of inserting the spherical connection
terminal into the hole of the positioning substrate and thus
positioning the spherical connection terminal, then causing the
spherical connection terminal to be electrically connected with the
connection terminals while maintaining the condition where the
positioning has been performed, and performing a test of the
to-be-inspected device.
[0045] A third inspection method according to the present invention
using the above-described twenty-third semiconductor inspection
apparatus, the inspection method comprising the step of vibrating
at least one of the positioning substrate and the to-be-inspected
device and thus positioning the spherical connection terminal in
the hole of the positioning substrate.
[0046] A fourth inspection method according to the present
invention using the above-described twenty-fourth semiconductor
inspection apparatus, the inspection method comprising the steps of
forming a suction path in the positioning substrate and connecting
a suction apparatus to the suction path, and
[0047] positioning the spherical connection terminal in the hole of
the positioning substrate as a result of the spherical connection
terminal being drawn to the suction path.
[0048] A fifth inspection method according to the present invention
using the above-described twenty-fourth semiconductor inspection
apparatus, the inspection method comprising the steps of forming
the positioning substrate of a porous material and connecting a
suction apparatus to the positioning substrate,
[0049] positioning the spherical connection terminal in the hole of
the positioning substrate as a result of the spherical connection
terminal being drawn to the positioning substrate.
[0050] In the above-described first semiconductor inspection
apparatus, the shape of the connection portion of the conductor
layer can change, to which connection portion the spherical
connection terminal is connected. Accordingly, the shape of the
connection portion changes along the outer shape of the spherical
connection terminal in the condition where the to-be-inspected
device is loaded on the semiconductor inspection apparatus.
Thereby, the contact area between the connection portion and the
spherical connection terminal increases, and, thus, electrical
connection therebetween can be ensured.
[0051] In order to enable change of the shape of the connection
portion, it is necessary to form the conductor layer to be thin.
Thereby, the mechanical strength of the conductor layer may be
degraded. However, because the conductor layer is supported on the
supporting film, the mechanical strength of the conductor layer is
maintained.
[0052] For the connection portions, the supporting film may not be
provided so that improved electrical connection with the spherical
connection terminal can be provided. Because the supporting film is
not provided for the connection portions, the mechanical strength
of the connection portions would normally be degraded. However, the
connection portion is supported by the shock absorbing member. The
shock absorbing member is made of an elastically deformable
insulating material. Accordingly, when a strong force is applied to
the connection portion, the shock absorbing function of the shock
absorber prevents permanent deformation of the connection portion.
As a result, stable inspection can always be performed.
[0053] In the above-described second semiconductor inspection
apparatus, the single layer or multi-layer stacked stud bump is
provided on the connection portion, and the stud bump projects
toward the spherical connection terminal which is being loaded.
Thereby, the electrical connection with the spherical connection
terminal can be improved. Further, by appropriately selecting the
number of stacked layers of the stud bump, the height of the stud
bump can be easily adjusted so that the connection with the
spherical connection terminal can be the best electrical
connection.
[0054] Further, the stud bump can be formed by using the wire
bonding technique which is generally used as a semiconductor
manufacturing technique. Accordingly, the stud bump can be formed
at a low cost and efficiently.
[0055] In the above-described third semiconductor inspection
apparatus, by forming the multilayer stacked stud bumps of the
different kinds of metals, the material of the
projecting-end-portion stud bump can be selected so that the
compatibility between the material of the projecting-end-portion
stud bump and the material of-the spherical connection terminal is
good. Also, the material of the other stud bump can be selected so
that the compatibility between the material of the stud bump and
the material of the connection portion is good, and, also, the
compatibility between the material of the stud bump and the
material of the projecting-end-portion stud bump or another stud
bump is good.
[0056] Thus, the connection between the projecting-end-portion stud
bump and the spherical connection terminal can be a good
connection, the connection between the projecting-end-portion stud
bump and the other stud bump can be a good connection, and the
connection between the stud bump and the connection portion can be
a good connection. Further, in a case where the lower stud bump
includes a plurality of stacked stud bumps, the connection between
each pair of adjacent stud bumps of the plurality of stacked stud
bumps 16B can be a good connection.
[0057] In the above-described fourth semiconductor inspection
apparatus, by roughening the surfaces of the connection portion,
the thus-formed roughened surface has minute unevenness thereon,
and thus, the substantial surface area thereof is large. When the
spherical connection terminal 2 comes into contact with the
connection portion, the minute projections of the roughened surface
dig into the spherical connection terminal 2. Thereby, electrical
connection between the connection portion and the spherical
connection terminal can be ensured.
[0058] In the above-described fifth semiconductor inspection
apparatus, the different kind of metal film is provided on the
surface of the connection portion. The different kind of metal film
provides a good connection with the spherical connection terminal,
and also, provides a good connection with the connection portion.
Accordingly, even if the direct connection between the connection
portion and the spherical connection terminal is not a good
connection, the connection between the connection portion and the
spherical connection terminal can be a good electrical connection
as a result of inserting the different kind of metal film between
the connection portion and the spherical connection terminal.
Thereby, the electrical connection between the connection portion
and the spherical connection terminal can be improved, and also,
the connection portion can be protected.
[0059] In the above-described sixth and seventh semiconductor
inspection apparatuses, by forming the cut portions in the shock
absorbing member, or by forming the shock absorbing member to be
the combination of the plurality of division members, the
elasticity of the shock absorbing member increases due to the shape
thereof. Thereby, the shock absorbing function of the shock
absorbing member increases. Accordingly, projection of the
connection portion can be ensured.
[0060] In the above-described eighth semiconductor inspection
apparatus, the connection portion includes the ring-shaped portion
and the extending portion which extends from the ring-shaped
portion toward the center of the ring-shaped portion. Thereby, the
shape of the extending portion can be easily changed. Accordingly,
the shape of the extending portion easily changes along the outer
shape of the spherical connection terminal. As a result, it is
possible to surely connect the connection portion and spherical
connection terminal with one another with a weak pressing
force.
[0061] In the above-described ninth semiconductor inspection
apparatus, as a result of the connection portion having a nail head
shape, the connection portion is supported as a cantilever.
Accordingly, the shape of the connection portion easily changes as
a result of the-spherical connection terminal being loaded. As a
result, it is possible to surely connect the connection portion and
spherical connection terminal with one another with a weak pressing
force.
[0062] In the above-described tenth and eleventh semiconductor
inspection apparatuses, by forming the cut portion in the
supporting film, it is possible that the supporting film has
elasticity. Further, by forming the supporting film to be the
combination of the plurality of division film members, a gap can be
formed between each pair of adjacent division film members.
Thereby, various stresses which occur when the to-be-inspected
device is loaded are absorbed as a result of the shape of the
supporting film being changed, or as a result of the division film
members moving in the gaps. Thereby, it is possible to prevent
unnecessary stresses from being applied to the position at which
the spherical connection terminal comes into contact with the
connection portion.
[0063] In the above-described twelfth semiconductor inspection
apparatus, as a result of the electronic device being provided on
the substrate which includes the conductor layer and supporting
film, part or all of a semiconductor inspection process which is
performed on the to-be-inspected device can be performed by the
electronic device provided on the substrate.
[0064] In the above-described thirteenth semiconductor device, the
projection portion is formed to the shock absorbing member at the
position at which the shock absorbing member faces the connection
portion. The projecting portion projects toward the connection
portion. Thus, the distance between the projection portion and the
connection portion is small. Accordingly, protection of the
connection portion can be ensured.
[0065] In the above-described fourteenth semiconductor inspection
apparatus, by providing the supporting member which supports the
shock absorbing member, the supporting member can support the shock
absorbing member, the shape of the shock absorbing member
elastically changing. Thereby, it can be prevented that the shape
of the shock absorbing member unnecessary changes. Further, it can
also be prevented that the shock absorbing member moves from a
predetermined position.
[0066] In the above-described fifteenth semiconductor inspection
apparatus, the supporting member has one of a depression and a
projection formed thereto at a position at which the supporting
member faces the connection portion. For example, in the case where
the depression is formed in the supporting member, even if the
spherical connection terminal is pressed with an excessive pressing
force, and thereby, a large change of the shape of the shock
absorbing member occurs, this large change of the shape of the
shock absorbing member can be received by the depressions.
Accordingly, it is possible to maintain the shock absorbing
function of the shock absorbing member.
[0067] In the case where the projection is formed on the supporting
member, even if the spherical connection terminals are pressed with
an excessive pressing force, and thereby, a large change of the
shape of the shock absorbing member would normally occur, the shock
absorbing member comes into contact with the projection and thus
the shape of the shock absorbing member cannot change more.
Accordingly, the change of the shape of the shock absorbing member
is restrained by the projection and actually a large change of the
shape of the shock absorbing member does not occur. Thereby, the
shock absorbing member can be protected. Therefore, according to a
desired one of the above-mentioned functions, the depression or the
projection may be selected.
[0068] In the above-described sixteenth semiconductor inspection
apparatus, the positioning mechanism which performs the positioning
between the spherical connection terminal and the connection
portion is provided. Thereby, the positioning between the spherical
connection terminal and the connection portion can be easily and
accurately performed. Accordingly, reliability of the connection
between the spherical connection terminal and connection terminal
can be improved.
[0069] In the above-described seventeenth semiconductor inspection
apparatus, the guide pin is used as the positioning mechanism.
Thereby, the positioning between the spherical connection terminal
and the connection portion can be performed with a simple
arrangement.
[0070] In the above-described eighteenth semiconductor inspection
apparatus, the guide-pin-attached frame is used as the positioning
mechanism, the guide-pin-attached frame comprising the frame
portion which holds the to-be-inspected device and a guide pin
which is integrated with the frame portion. Thereby, the
to-be-inspected device itself (the outer shape of the device and so
forth) can be used to provide a reference position for positioning
of the to-be-inspected device. Accordingly, high-accuracy
positioning can be performed.
[0071] In the above-described nineteenth semiconductor inspection
apparatus, the frame portion of the guide-pin-attached frame covers
and holds the to-be-inspected device, and the taper surface for
positioning the to-be-inspected device is formed on an inner
surface of the frame portion. Accordingly, merely by inserting the
to-be-inspected device into the frame portion, the to-be-inspected
device is guided by the taper surface and positioned at a
predetermined loading position. Thus, the positioning process of
the to-be-inspected device, that is, the positioning between the
spherical connection terminal and the connection portion can be
easily performed.
[0072] In the above-described twentieth semiconductor inspection
apparatus, the aligning mechanism is formed to the frame portion,
the aligning mechanism performing the aligning process on the
to-be-inspected device. Accordingly, even if the position of the
spherical connection terminal is not coincident with the position
of the connection portion immediately after the to-be-inspected
device 1 is inserted into the frame portion, the aligning mechanism
performs the aligning process and thus the position of the
spherical connection terminal become coincident with the position
of the connection portion.
[0073] In the above-described twenty-first semiconductor inspection
apparatus, the pressing mechanism is provided to the frame portion,
the pressing mechanism pressing the to-be-inspected device in the
loaded condition to the conductor layer. Thereby, a predetermined
pressing forth is applied between the spherical connection terminal
and the connection portion. As a result, electrical connection
therebetween can be improved, and also, the spherical connection
terminal can be prevented from shifting from the connection portion
during measurement.
[0074] In the above-described twenty-second semiconductor
inspection apparatus, the elastic member having the shock absorbing
function is provided between the frame portion and the
to-be-inspected device. Accordingly, even if an excessive pressing
forth or an unnecessary external force is applied, the stress due
to the pressing force or the external force is absorbed by the
elastic member. Thus, the spherical connection terminal and the
connection portion can be prevented from being damaged.
[0075] In the above-described twenty-third semiconductor inspection
apparatus, the positioning substrate is used as the positioning
mechanism, the positioning substrate being located so as to face
the to-be-inspected device which is loaded on the conductor layer
and having the hole which has the shape corresponding to the
spherical connection terminal. Thereby, by merely loading the
to-be-inspected device on the positioning substrate so that the
spherical connection terminal is inserted into the hole, the
positioning between the spherical connection terminal and the
connection portion can be performed. Thus, positioning between the
spherical connection terminal and the connection portion can be
performed easily and efficiently.
[0076] In the above-described twenty-fourth semiconductor
inspection apparatus, fourth inspection method and fifth inspection
method, the drawing mechanism for drawing the spherical connection
terminal is provided to the positioning substrate. Thereby, the
spherical connection terminal is drawn by the drawing mechanism and
is inserted into the hole of the positioning substrate. Thus,
because the spherical connection terminal is forcibly positioned in
the hole by the drawing force which the drawing mechanism
generates, the positioning process can be performed surely.
[0077] In the above-described twenty-fifth semiconductor inspection
apparatus, the substrate positioning mechanism for performing the
positioning between the hole and the connection portion is
provided. Thereby, the positioning between the hole and connection
portion can be performed with high accuracy. Accordingly, the
positioning between the spherical connection terminal which is
inserted into the hole and the connection portion can be performed
with high accuracy.
[0078] In the above-described first inspection method, the
spherical connection terminal is pressed to the connection portion
formed in the conductor layer so that elastic deformation occurs in
the connection portion of the conductor layer and the shock
absorbing member. Thereby, the shape of the connection portion
changes along the outer shape of the spherical connection terminal.
Accordingly, the spherical connection terminal is prevented from
being damaged by the connection terminal.
[0079] Further, as a result of the shape of the connection portion
changing, the contact area between the connection portion and the
spherical connection terminal increases. Accordingly, the
electrical connection between the connection portion and the
spherical connection terminal can be improved.
[0080] Further, the elastic restoring force occurring in the
connection portion and the shock absorbing member due to the
elastic deformation causes the connection portion to be pressed to
the spherical connection terminal. Accordingly, a predetermined
pressing force is always applied between the connection portion and
the spherical connection terminal in the connected condition. Thus,
electrical connection between the connection portion and the
spherical connection terminal can be improved.
[0081] In the above-described second inspection method, merely by
inserting the spherical connection terminal into the hole of the
positioning substrate, the positioning of the spherical connection
terminal can be performed. While maintaining the thus-positioned
condition, the spherical connection terminal is electrically
connected with the connection portion. Then, a test of the
to-be-inspected apparatus is performed. Thereby, the connection
portion and the spherical connection terminal can be connected with
one another with good accuracy, and thus, the reliability of the
inspection can be improved.
[0082] In the above-described third inspection method, at least one
of the positioning substrate and the to-be-inspected device is
vibrated and thus the spherical connection terminal is positioned
in the hole of the positioning substrate. Thereby, the
to-be-inspected device relatively moves on the positioning
substrate, then, the spherical connection terminal is inserted into
the hole of the positioning substrate, and thus, the spherical
connection terminal is positioned. Thus, the positioning between
the spherical connection terminal and the hole (that is, the
positioning of the spherical connection terminal and the connection
portion) can be performed easily and automatically.
[0083] Other objects and further features of the present invention
will become more apparent from the following detailed description
when read in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0084] FIGS. 1A, 1B, 1C and 1D illustrate a semiconductor
inspection apparatus in a first embodiment of the present invention
and an inspection method using the apparatus;
[0085] FIGS. 2A and 2B illustrate a semiconductor inspection
apparatus in a second embodiment of the present invention;
[0086] FIGS. 3A and 3B illustrate a semiconductor inspection
apparatus in a first variant example of the second embodiment;
[0087] FIGS. 4A and 4B illustrate a semiconductor inspection
apparatus in a second variant example of the second embodiment;
[0088] FIGS. 5A and 5B illustrate a semiconductor inspection
apparatus in a third embodiment of the present invention;
[0089] FIGS. 6A and 6B illustrate a semiconductor inspection
apparatus in a fourth embodiment of the present invention.
[0090] FIGS. 7A and 7B illustrate a variant example of a shock
absorbing member;
[0091] FIGS. 8A and 8B show arrangement examples of connection
portions;
[0092] FIGS. 9A and 9B illustrate semiconductor inspection
apparatuses in fifth and sixth embodiments of the present
invention;
[0093] FIG. 10 illustrates a semiconductor inspection apparatus in
a seventh embodiment of the present invention;
[0094] FIG. 11 illustrates a semiconductor inspection apparatus in
an eighth embodiment of the present invention;
[0095] FIG. 12 illustrates a semiconductor inspection apparatus in
a ninth embodiment of the present invention;
[0096] FIG. 13 illustrates a semiconductor inspection apparatus in
a tenth embodiment of the present invention;
[0097] FIG. 14 illustrates a semiconductor inspection apparatus in
an eleventh embodiment of the present invention;
[0098] FIG. 15 illustrates a semiconductor inspection apparatus in
a twelfth embodiment of the present invention;
[0099] FIG. 16 illustrates a semiconductor inspection apparatus in
a thirteenth embodiment of the present invention;
[0100] FIG. 17 illustrates a semiconductor inspection apparatus in
a fourteenth embodiment of the present invention;
[0101] FIGS. 18A and 18B illustrate a semiconductor inspection
apparatus in a fifteenth embodiment of the present invention;
[0102] FIG. 19 illustrates a semiconductor inspection apparatus in
sixteenth embodiment of the present invention;
[0103] FIGS. 20A and 20B illustrate a semiconductor inspection
apparatus in a seventeenth embodiment of the present invention;
[0104] FIG. 21 illustrates a semiconductor inspection apparatus in
an eighteenth embodiment of the present invention;
[0105] FIGS. 22A and 22B illustrate a semiconductor inspection
apparatus in a nineteenth embodiment of the present invention;
[0106] FIG. 23 illustrates a semiconductor inspection apparatus in
a twentieth embodiment of the present invention;
[0107] FIGS. 24A, 24B, 24C and 24D illustrate a semiconductor
inspection apparatus in a twenty-first embodiment of the present
invention;
[0108] FIGS. 25A and 25B illustrate a semiconductor inspection
apparatus in a twenty-second embodiment of the present
invention;
[0109] FIG. 26 illustrates a semiconductor inspection apparatus in
a twenty-third embodiment of the present invention;
[0110] FIG. 27 illustrates a semiconductor inspection apparatus in
a twenty-fourth embodiment of the present invention;
[0111] FIG. 28 illustrates a semiconductor inspection apparatus in
a twenty-fifth embodiment of the present invention;
[0112] FIG. 29 illustrates a semiconductor inspection apparatus in
twenty-sixth embodiment of the present invention;
[0113] FIG. 30 illustrates a semiconductor inspection apparatus in
a twenty-seventh embodiment of the present invention;
[0114] FIGS. 31A and 31B illustrate a semiconductor inspection
apparatus in a twenty-eighth embodiment and an inspection method
using the apparatus;
[0115] FIGS. 32A and 32B illustrate a semiconductor inspection
apparatus in a twenty-ninth embodiment and an inspection method
using the apparatus;
[0116] FIGS. 33A and 33B illustrate a semiconductor inspection
apparatus in a thirtieth embodiment and an inspection method using
the apparatus;
[0117] FIGS. 34A and 34B illustrate a semiconductor inspection
apparatus in a thirty-first embodiment and an inspection method
using the apparatus;
[0118] FIG. 35 illustrates a semiconductor inspection apparatus in
a thirty-second embodiment of the present invention; and
[0119] FIG. 36 illustrates a semiconductor inspection apparatus in
a thirty-third embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0120] Embodiments of the present invention will be described with
reference to figures.
[0121] FIGS. 1A, 1B, 1C and 1D show a semiconductor inspection
apparatus 10-1 in a first embodiment of the present invention and
illustrate an inspection method using the apparatus. The
semiconductor inspection apparatus 10-1 in the embodiment generally
includes a conductor layer 11 and a shock absorbing member 12A.
[0122] As shown in FIGS. 1A and 1D, a semiconductor device 1 is
loaded on the semiconductor inspection apparatus 10-1. In this
loaded condition, an electrical operation inspection of the
to-be-inspected device is performed. The to-be-inspected device on
which the semiconductor inspection apparatus 10-1 performs a test
is a device which has spherical connection terminals such as bumps
as external connection terminals.
[0123] Although the example in which the semiconductor device 1
having the spherical connection terminals 2 is used as the
to-be-inspected device will be described, semiconductor inspection
devices which will be described as respective embodiments can be
used for various devices having the spherical connection terminals
as external connection terminals.
[0124] A specific arrangement of the semiconductor inspection
device 10-1 will now be described.
[0125] The conductor layer 41 is, for example, a copper (Cu) film
and is formed on a supporting film 13 which is formed of an
insulation resin material such as a polyimide or the like. These
conductor layer 11 and supporting film 13 have the same structure
as that of a flexible printed substrate (FPC). Accordingly, it is
possible to obtain the conductor layer 11 and supporting film 13 in
the embodiment using an FPC.
[0126] On a portion to which the spherical connection terminal 2 is
connected, a connection portion 14A is formed. FIGS. 1B and 1C show
magnified views of the portion indicated by the arrow A in FIG. 1A.
FIG. 1B shows a plan view of this portion and FIG. 1C shows a
sectional view of this portion. As shown in the respective figures,
the connection portion 14A includes a ring-shaped portion 14A-1 and
extending portions 14A-2. Further, in the position in which the
connection portion 14A is formed, the supporting film 13 is not
provided.
[0127] The ring-shaped portion 14A-1 has a diameter dimension such
that the spherical connection terminal 2 can be inserted in the
ring-shaped-portion 14A-1. Further, the extending portions 14A-2
extend to a central portion from the ring-shaped portion 14A-1. The
central end of each extending portion 14A-2 is a free end. Because
the supporting film 13 is not provided in the-position in which the
connection portion 14A is formed, the shape of each extending
portion 14A-2 can be easily changed.
[0128] Further, as shown in FIG. 1B, the extending portions 14A-2
extend from the central portion to the ring-shaped portion 14A-1
radially. Accordingly, when the spherical connection terminal 2 is
inserted in the connection portion 14A, the extending portions
14A-2 can be surely connected with the spherical connection
terminal 2.
[0129] The shock absorbing member 12A is formed of an insulating
elastic member (for example, rubber, flexible resin or the like).
When the semiconductor device 1 is loaded on the semiconductor
inspection apparatus 10-1, the shock absorbing member 12A absorbs
the shock of a pressing force of the spherical connection terminal
2. Further, when an unnecessary external force is applied, the
shock absorbing member 12A absorbs the shock of the force.
[0130] Further, in the embodiment, a projecting portion 15
projecting to the connection portion 14A is formed in a portion of
the shock absorbing member 12A which faces the connection portion
14A. Because the supporting film 13 is not provided in the position
in which the connection portion 14A is formed, the projecting
portion 15 projects in proximity to the bottom surface of the
connection portion 14A.
[0131] As a result of the projecting portion 15 projecting to the
connection portion 14A being formed in the shock absorbing member
12A, the distance between the connection portion 14A and the
projecting portion 15 is small. Thereby, even if the shape of the
connection portion (extending portions 14A-2) is changed as a
result of an external force being applied, the connection portion
14A can be protected. Thus, the shape of the extending portions
14A-2 being excessively changed and thereby the extending portions
14A-2 being damaged can surely be prevented.
[0132] A method of performing inspection on the semiconductor
device 1 using the above-described semiconductor inspection
apparatus 10-1 will now be described.
[0133] In order to perform inspection on the semiconductor device
1, the spherical connection terminals 2 provided on the
semiconductor device 1 and the connection portions 14A provided on
the semiconductor inspection apparatus 10-1 are positioned. Then,
the semiconductor device 1 is pressed onto the semiconductor
inspection apparatus 10-1 and thus the spherical connection
terminals 2 are connected with the connection portions 14A,
respectively. A semiconductor inspection tester (not shown in the
figures) is connected to the semiconductor inspection apparatus
10-1. Thereby, electrical operation inspection is performed on the
semiconductor device 1 in the condition where the semiconductor
device 1 has been loaded on the semiconductor inspection apparatus
10-1.
[0134] Thus, loading of the semiconductor device 1 on the
semiconductor inspection apparatus 10-1 is very easy. Further, the
shapes of the connection portions 14A (extending portion 14A-2),
formed to the conductor layers 11, to which the spherical
connection terminals 2 are connected, respectively, can be
changed.
[0135] Accordingly, in the condition where the semiconductor device
1 has been loaded on the semiconductor inspection apparatus 10-1,
as shown in FIG. 1D, the shapes of the extending portions 14A-2
change along the outer shape of the spherical connection terminal
2, respectively. Thereby, the contact areas between the connection
portion 14A and the spherical connection terminal 2 increases, and,
thus, electrical connection therebetween can be ensured.
[0136] In order to enable change of the shapes of the connection
portions 14A, it is necessary to form the conductor layer 11 to be
thin. Thereby, the mechanical strength of the conductor layers 11
may be degraded. However, because the conductor layers 11 (except
the connection portions 14A) are supported on the supporting film
13, the mechanical strength of the conductor layers 11 is
maintained.
[0137] For the connection portions 14A, the supporting film 13 is
not provided so that improved electrical connection with the
spherical connection terminals 2 can be provided. Because the
supporting film 13 is not provided for the connection portions 14A,
the mechanical strength of the connection portions 14A would
normally be degraded. However, in the embodiment, as mentioned
above, the connection portions 14A are supported by the projecting
portions 15 which are formed to the shock absorbing member 12A.
Thereby, it is possible to prevent permanent deformation of the
connection portions 14A. As a result, stable inspection can be
always performed.
[0138] A second embodiment of the present invention will now be
described.
[0139] FIGS. 2A and 2B show magnified views of a connection portion
14B of a semiconductor inspection apparatus in the second
embodiment. For each embodiment which will be described, the same
reference numerals are given to the same portions as those of the
semiconductor inspection apparatus 10-1 in the first embodiment
shown in FIGS. 1A, 1B, 1C and 1D, and descriptions thereof will be
omitted.
[0140] In the second embodiment, stud bumps 16 are formed on
extending end portions of extending portions 14B-2, respectively,
formed in the connection portion 14B. The stud bumps 16 are formed,
for example, using the wire bonding method. When each stud bump 16
is formed in the wire bonding method, a so-called nail head portion
is formed on the extending end portion of the extending portion
14B-2 using a capillary provided to a wire bonding apparatus. Then,
after slightly moving the capillary upward, the wire is cut. By
such a simple process, each stud bump 16 is formed
[0141] As a result of the stud bumps 16 being formed on the
extending end portions of the extending portions 14B-2,
respectively, the extending end portions of the extending portions
14B-2 project upward. When, as shown in FIG. 2B, the spherical
connection terminal 2 is connected with the extending portions
14B-2, the stud-bumps 16 projecting from the extending end portions
of the extending portions 14B-2 are connected with the spherical
connection terminals 2. At this connection, the stud bumps 16 dig
into the spherical connection terminal 2. Thereby, the connection
portion 14B is protected, and, also, improved electrical connection
between the connection portion 14B and the spherical connection
terminal 2 can be provided. For the sake of illustration, the stud
bumps 16 are large in the figures. However, actually, the stud
bumps 16 are so small that the spherical connection terminal 2 is
not damaged although the stud bumps 16 dig into the spherical
connection terminal 2.
[0142] As described above, the stud bumps 16 can be formed using
the wire bonding technique which is generally used as a
semiconductor device manufacturing technique. Accordingly, the stud
bumps 16 can be formed at a low cost and efficiently. Further,
generally, each stud bump 16 has a small projection which is formed
by the wire cutting at the projecting end thereof and the small
projection is pointed. Thereby, further improved electrical
connection between the connection portion 14B (stud bumps 16) and
the spherical connection terminals 2 can be provided.
[0143] FIGS. 3A and 3B show magnified views of a connection portion
14C of a semiconductor inspection apparatus in a first variant
example of the above-described second embodiment. In this variant
example, a plurality (two, in this example) of stud bumps 16 are
stacked.
[0144] Stacking a plurality of stud bumps 16 as shown in FIG. 3B is
possible and, by stacking a plurality of stud bumps 16, the
projection height of the entire stud bump 16 can be increased.
Thereby, it is possible to provide the stud bump 16 of the height
which is suitable for the diameter dimension and so forth of the
spherical connection terminal 2. Thus, further improved electrical
connection between the spherical connection terminal 2 and the
connection portion 14C can be provided.
[0145] FIGS. 4A and 4B show magnified views of a connection portion
14D of a semiconductor inspection apparatus in a second variant
example of the above-described second embodiment. In this variant
example, a plurality (two, in this example) of stud bumps 16A and
16B of different kinds of metals are stacked.
[0146] In this variant example, the stud bumps 16A and 16B are
stacked to form a two-layer structure. The material of the
projecting-end-portion stud bump 16A is palladium (Pd) and the
material of the lower stud bump 16B is gold (Au).
[0147] The reason why the material of the projecting-end-portion
stud bump 16A is palladium (Pd) is that, generally, the spherical
connection terminal 2 is plated with solder, and the compatibility
between the solder and the palladium is good. The reason why the
material of the lower stud bump 16B is gold (Au) is that the
material of the connection portion 14D is copper (Cu), the
compatibility between the copper and the gold is good, and, also,
the compatibility between the gold and the palladium of the
projecting-end-portion stud bump 16A is good.
[0148] Thus, by forming the multistage plurality of stud bumps 16A,
16B of the different kinds of metals, the material of the
projecting-end-portion stud bump 16A can be selected so that the
compatibility between the material of the projecting-end-portion
stud bump 16A and the material of the spherical connection terminal
2 can be good. Also, the material of the other stud bump 16B can be
selected so that the compatibility between the material of the stud
bump 16B and the material of the connection portion 14D can be
good, and, also, the compatibility between the material of the stud
bump 16B and the material of the projecting-end-portion stud bump
16A can be good.
[0149] Thus, the connection between the projecting-end-portion stud
bump 16A and the spherical connection terminal 2 can be good
connection, the connection between the projecting-end-portion stud
bump 16A and the other stud bump 16B can be a good connection, and
the connection between the stud bump 16B and the connection portion
14D can be a good connection. Further, in a case where the lower
stud bump 16B includes a plurality of stacked stud bumps 16B, the
connection between each pair of adjacent stud bumps 16B of the
plurality of stacked stud bumps 16B can be a good connection.
[0150] A third embodiment of the present invention will now be
described.
[0151] FIGS. 5A and 5B show magnified views of a connection portion
14E of a semiconductor inspection apparatus in the third embodiment
of the present invention. In this embodiment, roughened surfaces 17
are formed on extending portions 14E-2, respectively, which are
formed in the connection portion 14E.
[0152] The roughened surfaces 17 are formed by performing blasting
working or chemical working (for example, immersion in strong acid)
on the surfaces of the extending portions 14E-2. The thus-formed
roughened surfaces 17 have minute unevenness thereon, and thus, the
surface areas thereof are substantially large. When the spherical
connection terminal 2 comes into contact with the connection
portion 14E, the minute projections of the roughened surfaces 17
dig into the spherical connection terminal 2. Thereby, electrical
connection between the connection portion 14E (extending portions
14E-2) and the spherical connection terminal 2 can be ensured.
[0153] A fourth embodiment of the present invention will now be
described.
[0154] FIGS. 6A and 6B show magnified views of a connection portion
14F of a semiconductor inspection apparatus in the fourth
embodiment of the present invention. In this embodiment, a
different kind of metal film 18 is formed on a surface of each
extending portion 14F-2, which is formed in the connection portion
14F.
[0155] The different kind of metal film 18 is a metal film, the
material of which is different from the material of the connection
portion 14F. Specifically, the material of the connection portion
14F is copper (Cu). The material of the different kind of metal
film 18 is different from the material of the connection portion
14F, and, for example, nickel (Ni) or palladium (Pd) is selected as
the material of the different kind of metal film 18.
[0156] The reason why nickel (Ni) or palladium (Pd) is selected as
the material of the different kind of metal film 18 will now be
described. Generally, the spherical connection terminal 2 is plated
with solder, and the compatibility between the solder and any one
of nickel and palladium is good. Also, the material of the
connection portion 14F is copper (Cu), and the compatibility
between the copper and any one of nickel and palladium is good.
[0157] Thus the different kind of metal film 18 is formed on the
surface of each extending portion 14F-2, the compatibility between
the different kind of metal film 18 and the connection portion 14F
being good, and, also, the compatibility between the different kind
of metal film 18 and the spherical connection terminal 2 being
good. Thereby, even if the direct connection between the connection
portion 14F and the spherical connection terminal 2 is not a good
connection, the connection between the connection portion 14F
(extending portions 14F-2) and the spherical connection terminal 2
can be a good electrical connection, by inserting the different
kind metal of film 18 between the connection portion 14F and the
spherical connection terminal 2.
[0158] Further, the surfaces of the extending portions 14F-2, on
which the spherical connection terminal 2 slides when the
semiconductor device 1 is loaded, are covered by the different kind
of metal film 18. Thereby, the connection portion 14F can be
protected.
[0159] FIGS. 7A and 7B show variant examples of the above-mentioned
shock absorbing member 12A.
[0160] The shock absorbing member 12A provided in the semiconductor
inspection apparatus 10-1 is a simple plane-plate-shaped member
except that the above-mentioned projecting portions 15 are
formed.
[0161] In contrast to this, in the variant example shown in FIG.
7A, many cut portions 19 are formed in a shock absorbing member
12B. In the variant example shown in FIG. 7B, a shock absorbing
member 12C is a combination of a plurality of division members 20a,
20b, 20c and 20d.
[0162] By forming the cut portions 19 in the shock absorbing member
12B, the elasticity of the shock absorbing member 12B increases. By
forming the shock absorbing member 12C to be the combination of the
plurality (4 sheets in this example) of division members 20a, 20b,
20c and 20d, the elasticity of the shock absorbing member 12C
increases. In the case of the shock absorbing member 12B, by
providing the cut portions 19, when an external force is applied,
the sizes of the cut portions 19 change. Accordingly, the rigidity
of the shock absorbing member 12B can be decreased.
[0163] In the case of the shock absorbing member 12C, by combining
the division members 20a, 20b, 20c and 20d, gap portions 21 are
formed in between each pair of adjacent ones of the division
members 20a, 20b, 20c and 20d. The function of the gap portions 21
is similar to the function of the cut portions 19 of the shock
absorbing member 12B. Thus, the shock absorbing function of the
shock absorbing member 12B increases and the shock absorbing
function of the shock absorbing member 12C increases. Thereby,
protection of the connection portions 14A, 14B, 14C, 14D, 14E and
14F can be ensured.
[0164] FIGS. 8A and 8B show variant examples of the above-mentioned
connection portions 14A, 14B, 14C, 14D, 14E and 14F.
[0165] The connection portions 14A, 14B, 14C, 14D, 14E and 14F
described in the respective embodiments include the ring-shaped
portions 14A-1, 14B-1, 14C-1, 14D-1, 14E-1 and 14F-1 and the
extending portions 14A-2, 14B-2, 14C-2, 14D-2, 14E-2 and 14F-2,
respectively. In contrast to these, in the variant examples shown
in FIGS. 8A and 8B, the shape of a connection portion 14G is a nail
head shape.
[0166] Specifically, in the variant example shown in FIG. 8A, the
shape of the connection portion 14G is the nail head shape, and
also, the supporting film 13 is not provided underneath the
connection portion 14G. In the variant example shown in FIG. 8B,
the shape of the connection portion 14G is the nail head shape, and
also, a ring-shaped groove 22 surrounding the connection portion
14G is formed in the supporting film 13 and the supporting film 13
is present underneath the connection portion 14G. In the
arrangement shown in FIG. 8B, although the supporting film 13 is
present underneath the connection portion 14G, the shape of the
connection portion 14G can change because the ring-shaped groove 22
is provided.
[0167] By forming the connection portion 14G to have the nail head
shape as mentioned above, the connection portion 14G is supported
like a cantilever. Accordingly, the shape of the connection portion
14G easily changes as a result of the spherical connection terminal
2 being loaded thereon. Thus, connection between the connection
portion 14G and the spherical connection terminal 2 can be surely
performed with a weak pressing force. Further, in comparison to the
above-mentioned connection portions 14A, 14B, 14C, 14D, 14E and
14F, durability can be improved and the connection portion 14G can
be easily formed.
[0168] A fifth embodiment and a sixth embodiment of the present
invention will now be described.
[0169] FIG. 9A shows a plan view of a semiconductor inspection
apparatus 10-5 in the fifth embodiment of the present invention,
and FIG. 9B shows a plan view of a semiconductor inspection
apparatus 10-6 in the sixth embodiment of the present
invention.
[0170] In the semiconductor inspection apparatus 10-5 shown in FIG.
9A, cut portions 23 are formed in the supporting film 13. In the
semiconductor inspection apparatus 10-6 shown in FIG. 9B, the
supporting film 13 is a combination of a plurality (four sheets in
this embodiment) of division film members 24a, 24b, 24c and
24d.
[0171] As a result of the cut portions 23 being formed in the
supporting film 13 as shown in FIG. 9A, the supporting film 13 can
have elasticity. As a result of combining the plurality of division
film members 24a, 24b, 24c and 24d to form the supporting film 13
as shown in FIG. 9B, gap portions 25 can be formed between each
adjacent ones of the division film members.
[0172] Thereby, various stresses, which occur when the
semiconductor device 1 is loaded, can be absorbed as a result of
change of the sizes of the cutting portions 23 or as a result of
moving of the division film members 24a, 24b, 24c and 24d in the
gap portions 25. The above-mentioned various stresses may include,
for example, the stress occurring as a result of the spherical
connection terminal 2 pressing the connection portions 14G (14A,
14B, 14C, 14D, 14E and 14F), and the thermal stress occurring as a
result of the semiconductor device 1 generating heat.
[0173] Thereby, it is possible to prevent unnecessary stresses from
being applied to the position at which the spherical connection
terminal 2 comes into contact with the connection portion 14G (14A,
14B, 14C, 14D, 14E and 14F). Thereby, a good connection condition
between the spherical connection terminal 2 and the connection
portion 14G (14A, 14B, 14C, 14D, 14E and 14F) can be
maintained.
[0174] A seventh embodiment and an eighth embodiment of the present
invention will now be described.
[0175] FIG. 10 shows a plan view of a semiconductor inspection
apparatus 10-7 in the seventh embodiment of the present invention,
and FIG. 11 shows a plan view of a semiconductor inspection
apparatus 10-8 in the eighth embodiment of the present invention.
In the semiconductor inspection apparatuses 10-7 and 10-8 in the
seventh and eighth embodiments, electronic devices 36, 37 and 38,
which are connected with the conductor layers 11, are provided on a
substrate 39 which includes the conductor layers 11 and the
supporting film 13.
[0176] In the semiconductor inspection apparatus 10-7 shown in FIG.
10, a semiconductor device 36 (IC) is provided and the IC 36 and
the conductor layers 11 are electrically connected with each other.
In the semiconductor inspection apparatus 10-8 shown in FIG. 11,
capacitors 37 and resisters 38 are formed on the substrate 39, and
these are electrically connected with the conductor layers 11.
[0177] As a result of the electronic devices 36, 37 and 38 being
provided on the substrates 39 (conductor layers 11 and supporting
films 13) to form the semiconductor inspection-apparatuses 10-7 and
10-8, respectively, impedance matching or inductance matching can
easily be performed. Thereby, accuracy errors due to the
semiconductor inspection apparatuses 10-7 and 10-8 can be
restrained from occurring, and thus, high-accuracy semiconductor
inspection can be performed.
[0178] Further, as a result of the IC 36, which functions as an
active device, being provided on the semiconductor inspection
apparatus 10-7, it is possible that the semiconductor inspection
apparatus 10-7 itself performs part or all of semiconductor
inspection processes. Thereby, it is possible to reduce inspection
processes which a semiconductor inspection tester performs.
[0179] A ninth embodiment of the present invention will now be
described.
[0180] FIG. 12 shows an exploded view of a semiconductor inspection
apparatus 10-9 in the ninth embodiment. As shown in the figure, in
the semiconductor inspection apparatus 10-9 in this embodiment, a
supporting member 40 is provided underneath a shock absorbing
member 12D. The supporting member 40 is formed of a material having
a low elastic deformation rate such as a metal, hard resin or the
like.
[0181] Further, in the embodiment shown in FIG. 12, each of the
supporting member 40 and the shock absorbing member 12D has a flat
shape. The supporting member 40 is provided underneath the shock
absorbing member 12D and thereby supports the shock absorbing
member 12D.
[0182] As a result of the supporting member 40 which supports the
shock absorbing member 12D being provided, the supporting member 40
can support the shock absorbing member 12D, the shape of which
elastically changes as a result of the semiconductor device 1 being
loaded. Thereby, an unnecessary change of the shape of the shock
absorbing member 12D can be prevented, and shifting of the shock
absorbing member 12D from a predetermined position can be
prevented. Thereby, the connection between the connection portion
14A, 14B, 14C, 14D, 14E, 14F or 14G (hereinafter, in a case where
each of the connection portion 14A, 14B, 14C, 14D, 14E, 14F and 14G
can be applied, simply referred to as the connection portion 14)
can be always performed in a stable condition.
[0183] A tenth embodiment and an eleventh embodiment of the present
invention will now be described.
[0184] FIG. 13 shows an exploded view of a semiconductor inspection
apparatus 10-10 in the tenth embodiment, and FIG. 14 shows an
exploded view of a semiconductor inspection apparatus 10-11 in the
eleventh embodiment. As shown in FIG. 13, in the semiconductor
inspection apparatus 10-10 in the tenth embodiment, a supporting
member 40 is provided underneath the shock absorbing member 12D,
and also, depressions 41 are formed in the supporting member 40.
The depressions 41 are positioned so as to be aligned with the
connection portions 14, respectively.
[0185] In the semiconductor inspection apparatus 10-11 in the
eleventh embodiment shown in FIG. 14, a supporting member 40 is
provided underneath the shock absorbing member 12D, and also,
projections 42 are formed on the supporting member 40. The
projections 42 are positioned so as to be aligned with the
connection portions 14, respectively.
[0186] By forming the depressions 41 in or projections 42 on the
supporting member 40 at the positions to be aligned with the
connection portions 14, respectively, the shock absorbing function
of the shock absorbing member 12D can be effectively used.
Specifically, in the case where the depressions 41 are formed in
the supporting-member 40, even if the spherical connection
terminals 2 are pressed with an excessive pressing force, and
thereby, a large change of the shape of the shock absorbing member
12D occurs, this large change of the shape of the shock absorbing
member 12D can be received by the depressions 41. Accordingly, it
is possible to maintain the shock absorbing function of the shock
absorbing member 12D.
[0187] In the case where the projections 42 are formed on the
supporting member 40, even if the spherical connection terminals 2
are pressed with an excessive pressing force, and thereby, a large
change of the shape of the shock absorbing member 12D would
normally occur, the change of the shape of the shock absorbing
member 12D is restrained by the projections 42 and actually a large
change of the shape of the shock absorbing member 12D does not
occur. Thereby, the shock absorbing member can be protected.
Therefore, according to a desired one of the above-mentioned
functions, the depressions 41 or the projections 42 may be
selected.
[0188] Twelfth through thirty-third embodiments of the present
invention will now be described.
[0189] In each of the semiconductor inspection apparatuses 10-1
through 10-11 of the respective embodiments, inspection is
performed after the spherical connection terminals 2 provided on
the semiconductor device 1 come into contact with and are pressed
to the connection portions 14 of the semiconductor apparatus,
respectively. Accordingly, accurate inspection cannot be performed
unless the spherical connection terminals 2 and the connection
portions 14 are accurately positioned.
[0190] In each embodiment which will be described, a positioning
mechanism for positioning the semiconductor device (spherical
connection terminal 2) with respect to the connection portions 14
is provided.
[0191] First, with reference to FIGS. 15 through 23, structures
using guide pins as the positioning mechanisms will be described.
The material of the guide pins used in each embodiment which will
be described is preferably an insulating and
low-thermal-expansion-coefficient material.
[0192] In a semiconductor inspection apparatus 10-12 in the twelfth
embodiment shown in FIG. 15, guide pins 50-1 are provided to stand
on the substrate 39 which includes the conductor layers 11 and the
supporting film 13. The positions of the inner surfaces of the
guide pins 50-1 are coincident with the peripheral positions of the
semiconductor device 1 which is loaded accurately.
[0193] Accordingly, by being guided by the guide pins 50-1 and
loading the semiconductor device 1 on the semiconductor inspection
apparatus 10-12, the positioning between the spherical connection
terminals 2 and the connection portions 14 can be performed. At the
projecting ends of the guide pins 50-1, taper portions 51 are
formed, respectively, for enabling easy loading of the
semiconductor device 1.
[0194] In a semiconductor inspection apparatus 10-13 in the
thirteenth embodiment shown in FIG. 16, guide pins 50-2 are
provided to the semiconductor device 1, and also, guides 53-1
having positioning holes 52-1, respectively, into which the guide
pins 50-2 fit, respectively, are provided to the substrate 39. In
this arrangement, as a result of the guide pins 50-2 provided to
the semiconductor 1 fitting into the positioning holes 52-1 formed
in the guides 53-1, respectively, the positioning between the
spherical connection terminals 2 and the connection portions 14 is
performed.
[0195] In a semiconductor inspection apparatus 10-14 in the
fourteenth embodiment shown in FIG. 17, positioning holes 52-2 are
formed in the semiconductor device 1, and also, guide pins 50-3 are
provided to guides 53-2 provided on the substrate 39, respectively.
In this arrangement, as a result of the guide pins 50-3 provided to
stand on the guides 53-2 fitting into the positioning holes 52-2
formed in the semiconductor device 1, respectively, the positioning
between the spherical connection terminals 2 and the connection
portions 14 is performed.
[0196] In a semiconductor inspection apparatus 10-15 in the
fifteenth embodiment shown in FIGS. 18A and 18B, guide pins 50-4
are used for positioning the substrate 39 (including the conductor
layers 11 and the supporting film 13), the shock absorbing member
12D and the supporting member 40. For this purpose, as shown in
FIG. 18A, positioning holes 52-3 are formed at predetermined
positions of the substrate 39, positioning holes 52-4 are formed at
predetermined positions of the shock absorbing member 12D, and
positioning holes 52-5 are formed at predetermined positions of the
supporting member 40.
[0197] When performing the positioning, as shown in FIG. 18B, the
guide pins are inserted to pass through the respective positioning
holes 52-3, 52-4 and 52-5, respectively. Thus, the guide pins 50-4
control the positions of the substrate 39, shock absorbing member
12D and supporting member 40, and the substrate 39, shock absorbing
member 12D and supporting member 40 are positioned with respect to
each other. In order to perform high-accuracy inspection on the
semiconductor device 1, it is important that the substrate 39,
shock absorbing member 12D and supporting member 40 are positioned
with respect to each other.
[0198] In a semiconductor inspection apparatus 10-16 in the
sixteenth embodiment shown in FIG. 19, similar to the
above-described fifteenth embodiment, guide pins 50-5 are used-for
positioning the substrate 39, shock absorbing member 12D and
supporting member 40. Further, in this embodiment, the guide pins
50-5 also guide the semiconductor device 1.
[0199] Specifically, the positions of the inner surfaces of the
guide pins 50-5 are coincident with the peripheral position of the
semiconductor device 1 which is loaded on a predetermined loading
position, in the condition where the guide pins 50-5 have been
inserted and loaded into the substrate 39, shock absorbing member
12D and supporting member 40.
[0200] Thereby, by being guided by the guide pins 50-5 which have
been inserted and loaded into the substrate 39, shock absorbing
member 12D and supporting member 40, and loading the semiconductor
device 1 on the semiconductor inspection device 10-16, the
positioning between the spherical connection terminals 2 and the
connection portions 14 can be performed. Each of the extending ends
of the guide pins 50-5 is hemispheric so as to enable easy loading
of the semiconductor device 1, and also enable easy loading of the
guide pins 50-5 into the substrate 39, shock absorbing member 12D
and supporting member 40.
[0201] In a semiconductor inspection apparatus 10-17 in the
seventeenth embodiment shown in FIGS. 20A and 20B, in an
arrangement in which the shock absorbing member 12A and the
substrate 39 (including the conductor layers 11 and the supporting
film 13) are integrated, a stage 54 is further provided, and also,
guide pins 50-6 are provided to stand on the stage 54.
[0202] Positioning holes 52-6 are previously formed in the shock
absorbing member 12A and the substrate 39. Thereby, by causing the
guide pins 50-6 to pass through the positioning holes 52-6,
respectively, and thus loading the semiconductor inspection
apparatus 10-17 on the stage 54, the semiconductor inspection
apparatus 10-17 can be positioned with respect to the stage 54.
[0203] FIG. 20A shows a state before the semiconductor inspection
apparatus 10-17 has been loaded on the stage 54. FIG. 20B shows a
state after the semiconductor inspection apparatus 10-17 has been
loaded on the stage 54.
[0204] In a semiconductor inspection apparatus 10-18 in the
eighteenth embodiment shown in FIG. 21, similar to the
above-described seventeenth embodiment, guide pins 50-7 are used
for positioning of the shock absorbing member 12A and substrate 39
with respect to the stage 54. Further, in the semiconductor
inspection apparatus 10-18 in this embodiment, the guide pins 50-7
guide the semiconductor device 1. Specifically, the positions of
the inner surfaces of the guide pins 50-7 are coincident with the
peripheral positions of the semiconductor device 1 which is loaded
on a predetermined loading position, in the condition where the
guide pins 50-7 have been inserted and loaded into the shock
absorbing member 12D and substrate 39.
[0205] Thereby, by being guided by the guide pins 50-7 which have
been inserted and loaded into the shock absorbing member 12D and
substrate 39, and loading the semiconductor device 1 on the
semiconductor inspection device 10-18, the positioning between the
spherical connection terminals 2 and the connection portions 14 can
be performed. Each of the extending ends of the guide pins 50-7 is
hemispheric so as to enable easy loading of the semiconductor
device 1.
[0206] In a semiconductor inspection apparatus 10-19 in the
nineteenth embodiment shown in FIGS. 22A and 22B, guide pins 50-8,
for positioning the substrate 39(including the conductor layers 11
and supporting film 13), shock absorbing member 12D and supporting
member 40, are provided to stand on the supporting member 40.
Therefore, in the semiconductor inspection apparatus 10-19 in this
embodiment, as shown in FIG. 22A, positioning holes 52-7 and 52-8
are formed in the substrate 39 and shock absorbing member 12D.
[0207] When performing the positioning process, as shown in FIG.
22B, the guide pins 50-8 provided to stand on the supporting member
40 are inserted into so as to pass through the respective
positioning holes 52-8 and 52-7, respectively. Thereby, the
positions of the substrate 39 and shock absorbing member 12D are
controlled, and thereby, the positioning of the substrate 39 and
shock absorbing member 12D with respect to the supporting member 40
is performed.
[0208] As described above, in order to perform high-accuracy
inspection on the semiconductor device 1, positioning of the
substrate 39, shock absorbing member 12D and supporting member 40
with respect to each other is important. Accordingly, the
arrangement of this embodiment enables performing of high-accuracy
inspection on the semiconductor device 1. Further, because the
guide pins 50-8 are fixed to the supporting member 40, loss of the
guide pins 50-8 can be prevented.
[0209] In a semiconductor inspection apparatus 10-20 in the
twentieth embodiment shown in FIG. 23, similar to the
above-described nineteenth embodiment, guide-pins 50-9, which are
provided to stand on the supporting member 40, are used for
positioning the substrate 39, shock absorbing member 12D and
supporting member 40. Further, in the semiconductor inspection
apparatus 10-20 in this embodiment, the guide pins 50-9 also guide
the semiconductor device 1.
[0210] Specifically, the positions of the inner surfaces of the
guide pins 50-9 are coincident with the peripheral positions of the
semiconductor device 1 which is loaded on a predetermined loading
position, in the condition where the guide pins 50-9 have been
inserted and loaded into-the substrate 39 and shock absorbing
member 12D.
[0211] Thereby, by being guided by the guide pins 50-9 which have
been inserted and loaded into the substrate 39 and shock absorbing
member 12D, and loading the semiconductor device 1 on the
semiconductor inspection device 10-20, the positioning between the
spherical connection terminals 2 and the connection portions 14 can
be performed. Each of the extending ends of the guide pins 50-9 is
hemispheric so as to enable easy loading of the semiconductor
device 1.
[0212] In the above-described twelfth through twentieth
embodiments, the guide pins 50-1 through 50-9 are used,
respectively, as the positioning mechanism. Thus, the simple
arrangements enable the positioning between the spherical
connection terminals 2 and the connection portions 14.
[0213] With reference to FIGS. 24A through 30, arrangements using
guide-pin-attached frames will now be described.
[0214] FIGS. 24A, 24B, 24C and 24D show a semiconductor inspection
apparatus 10-21 in the twenty-first embodiment.
[0215] In this embodiment, the guide-pin-attached frame 60-1 is
used for positioning the substrate 39 (including the conductor
layers 11 and supporting film 13), shock absorbing member 12D and
supporting member 40.
[0216] The guide-pin-attached frame 60-1 includes a frame body
portion 61 which functions as a frame and guide pin portions 62
which are fixed to the frame body portion 61. As shown in FIGS. 24B
and 24C, the frame body portion 61 has a frame shape and has a
space portion 63 inside thereof. The shape of the space portion 63
corresponds to the outer shape of the semiconductor device 1. The
guide pin portions 62 extend downward from four corner positions of
the frame body portion 61.
[0217] As shown in FIG. 24A, positioning holes 52-3 are formed in
the substrate 39 at predetermined positions, positioning holes 52-4
are formed in the shock absorbing member 12D at predetermined
positions, and positioning holes 52-5 are formed in the supporting
member 40 at predetermined positions. The positions of the
respective positioning holes 52-3 through 52-5 correspond to the
positions of the guide pin portions 62 of the guide-pin-attached
frame 60-1.
[0218] When performing the positioning process in the
above-described semiconductor inspection apparatus 10-21, as shown
in FIG. 24D, the guide pin portions 62 of the guide-pin-attached
frame 60-1 are inserted into the respective positioning holes 52-3
through 52-5. Thereby, the positions of the substrate 39, shock
absorbing member 12D and supporting member 40 are controlled by the
guide pin portions 62, and thus they are positioned with respect to
each other.
[0219] Further, the guide-pin-attached frame 60-1 includes the
frame body portion 61 having the space portion 63 formed therein,
the shape of the space portion 63 corresponding to the outer shape
of the semiconductor device 1. Using the frame body portion 61,
positioning of the semiconductor device 1 can be performed. Thus,
in the semiconductor inspection apparatus 10-21 in this embodiment,
the positioning of the substrate 39, shock absorbing member 12D,
supporting member 40 and semiconductor device 1 can be easily
performed. Thereby, it is possible to perform high-accuracy
inspection on the semiconductor device 1.
[0220] FIGS. 24A through 24D show the process that the
guide-pin-attached frame 60-1 is loaded and the positioning is
performed after the semiconductor device 1 and the connection
portions 14 are connected with one another. However, it is also
possible that the guide-pin-attached frame 60-1 is loaded and thus
the positioning of the substrate 39, shock absorbing member 12D and
supporting member 40 is performed, and then, the frame-body member
61 is used to provide a reference position, the semiconductor
device 1 is loaded and thus the positioning of the semiconductor
device 1 is performed.
[0221] FIGS. 25A and 25B show a semiconductor inspection apparatus
10-22 in the twenty-second embodiment. A frame portion 64 of the
guide-pin-attached frame 60-2 of this embodiment covers and holds
the semiconductor device 1. Further, taper surfaces 65 for
positioning the semiconductor device 1 are formed on the inner
walls of the frame portion 64. The taper surfaces 65 are formed at
such positions as to face the peripheral portion of the top surface
of the semiconductor device 1. The guide pin portions 62 extend
downward from four corners of the bottom surface of the frame
portion 64.
[0222] As shown in FIG. 25A, positioning holes 52-3 are formed in
the substrate 39 at predetermined positions, positioning holes 52-4
are formed in the shock absorbing member 12D at predetermined
positions, and positioning holes 52-5 are formed in the supporting
member 40 at predetermined positions. The positions of the
respective positioning holes 52-3 through 52-5 correspond to the
positions of the guide pin portions 62 of the guide-pin-attached
frame 60-2.
[0223] When performing the positioning process in the
above-described semiconductor inspection apparatus 10-22, as shown
in FIG. 25B, the guide pin portions 62 of the guide-pin-attached
frame 60-2 are inserted into the respective positioning holes 52-3
through 52-5. Thereby, the positions of the substrate 39, shock
absorbing member 12D and supporting member 40 are controlled by the
guide pin portions 62, and thus they are positioned with respect to
each other.
[0224] Further, as mentioned above, the taper surfaces 65 are
formed on the inner walls of the frame portion 64 of the
guide-pin-attached frame 60-2. Therefore, when the
guide-pin-attached frame 60-2 is being loaded, the peripheral
portion of the top surface of the semiconductor device 1 comes into
contact with the taper surfaces 65. Thereby, the position of the
semiconductor device 1 is controlled by the taper surface 65 and
thus the semiconductor device 1 is positioned. Thus, in the
semiconductor inspection apparatus 10-22 in this embodiment, the
positioning of the substrate 39, shock absorbing member 12D,
supporting member 40 and semiconductor device 1 can be easily
performed. Thereby, it is possible to perform high-accuracy
inspection on the semiconductor device 1.
[0225] FIG. 26 shows a semiconductor inspection apparatus 10-23 in
the twenty-third embodiment.
[0226] The basic arrangement of the semiconductor inspection
apparatus 10-23 in this embodiment is the same as the
above-described semiconductor inspection apparatus 10-22 in the
twenty-second embodiment. However, an elastomer 66 is provided to
the bottom surface of the frame portion 64 of the
guide-pin-attached frame 60-2 at such a position as to face the top
surface of the semiconductor device 1. The elastomer 66 is made of
a material having flexibility (such as silicone rubber or the like)
and has a shock absorbing function.
[0227] As a result of providing the elastomer 66 between the frame
portion 64 and the semiconductor device 1, even if the
guide-pin-attached frame 60-2 is strongly pressed to the substrate
39, the shock of the pressing force is absorbed by the shock
absorbing member 12D and the elastomer 66. Thereby, the connected
portions of the spherical connection terminals 2 and the connection
portions 14D are prevented from having excessive stress applied
thereto. Accordingly, damage or deformation of the spherical
connection terminals 2 can be prevented.
[0228] FIG. 27 shows a semiconductor inspection apparatus 10-24 in
the twenty-fourth embodiment.
[0229] In the semiconductor inspection apparatus 10-24 in this
embodiment, an aligning mechanism 67, which performs an aligning
process on the semiconductor device 1, is provided inside the frame
portion 64 of the guide-pin-attached frame 60-3. The aligning
mechanism 67 includes a loaded portion 68, which is loaded on the
top surface of the semiconductor device 1, and a swinging arm 69,
which rotateably connects the loaded portion 68 to the frame
portion 64.
[0230] When the semiconductor device 1 shifts horizontally so that
the spherical connection terminals 2 connect with the predetermined
connection portions 14, respectively, the aligning mechanism 67
allows the loaded portion 68 to shift so as to follow the
semiconductor device 1. Thus, the aligning mechanism 67 performs
the aligning process so that the spherical connection terminals 2
are positioned on the connection portions 14, respectively. By
providing the above-described aligning mechanism 67, even if the
positions of the spherical connection terminals 2 are not
coincident with the positions of the connection portions 14,
respectively, immediately after the semiconductor device 1 is
inserted into the frame portion 64, the aligning mechanism 67
performs the aligning process and thus the positions of the
spherical connection terminals 2 become coincident with the
positions of the connection portions 14, respectively.
[0231] FIG. 28 shows a semiconductor inspection apparatus 10-25 in
the twenty-fifth embodiment.
[0232] In the semiconductor inspection apparatus 10-25 in this
embodiment, coil springs 70 are provided between the frame portion
64 of the guide-pin-attached frame 60-2 and a loaded portion 68
which is loaded on the top surface of the semiconductor device 1.
These coil springs 70 apply a force to the semiconductor device 1,
which has been loaded, so that the semiconductor device 1 is
pressed to the substrate 39 (conductor layers 11).
[0233] By providing the coil springs 70 between the frame portion
64 and the loaded portion 68, the spherical connection terminals 2
are always pressed to the connection portions 14, respectively.
Accordingly, it is possible to improve electrical connections
between the spherical connection terminals 2 and the connection
portions 14. Also, it is possible to prevent the spherical
connection terminals 2 from shifting from the connection portions
14 during measurement.
[0234] FIG. 29 shows a semiconductor inspection apparatus 10-26 in
the twenty-sixth embodiment.
[0235] The semiconductor inspection apparatus 10-26 is obtained
from inserting the elastomer 66 between the loaded portion 68 and
the top surface of the semiconductor device 1 in the semiconductor
inspection apparatus 10-24 in the twenty-fourth embodiment shown in
FIG. 27. In the twenty-sixth embodiment, the above-described
effects of the twenty-third embodiment and also the effects of the
twenty-fourth embodiment can be obtained.
[0236] FIG. 30 shows a semiconductor inspection apparatus 10-27 in
the twenty-seventh embodiment.
[0237] The semiconductor inspection apparatus 10-27 is obtained
from inserting the elastomer 66 between the loaded portion 68 and
the top surface of the semiconductor device 1 in the semiconductor
inspection apparatus 10-25 in the twenty-fifth embodiment shown in
FIG. 28. In the twenty-seventh embodiment, the above-described
effects of the twenty-third embodiment and also the effects of the
twenty-fifth embodiment can be obtained.
[0238] With reference to FIGS. 31 through 36, arrangements using
positioning substrates as positioning mechanisms will now be
described.
[0239] FIGS. 31A and 31B show a semiconductor inspection apparatus
10-28 in the twenty-eighth embodiment. In this embodiment, a
positioning substrate 80-1, which has a plurality of holes 81
formed therein, is used for positioning the spherical connection
terminals 2 of the semiconductor device 1 with respect to the
connection portions 14.
[0240] As shown in FIG. 31A, the positioning substrate 80-1 is a
plane-plate-shaped substrate body made of an insulating material
having truncated-cone-shaped holes 81 formed therein. The positions
of the holes 81 correspond to predetermined positions at which the
spherical connection terminals 2 and the connection portions 14 are
connected with each other, respectively. The positioning substrate
80-1 is positioned and provided on the substrate 39 which includes
the conductor layers 11 and supporting film 13.
[0241] In the above-described semiconductor inspection apparatus
10-28, when positioning the spherical connection terminals 2 and
the connection portions 14 with respect to one another, simply the
semiconductor device 1 is placed on the positioning substrate 80-1.
As mentioned above, the positions of the holes 81 formed in the
positioning substrate 80-1 are the predetermined positions at which
the spherical connection terminals 2 and the connection portions 14
are connected with one another, respectively. Further, each hole 18
has a truncated-cone shape. Accordingly, as a result of placing the
semiconductor device 1 on the positioning substrate 80-1, the
spherical connection terminals 2 are guided by the holes 81,
respectively, and come into contact with the connection portions,
respectively. FIG. 31B shows the state in which the spherical
connection terminals 2 and the connection portions 14 are connected
with one another, respectively.
[0242] Thus, in the semiconductor inspection apparatus 10-28 in
this embodiment, only by simply loading the semiconductor device 1
on the positioning substrate 80-1 in a manner in which the
spherical connection terminals 2 are inserted into the holes 81,
respectively, the positioning between the spherical connection
terminals 2 and the connection portions 14 can be performed. Thus,
the positioning between the spherical connection terminals 2 and
the connection portions 14 can be performed easily and efficiently.
FIGS. 32A and 32B show a semiconductor inspection apparatus 10-29
in the twenty-ninth embodiment.
[0243] In this embodiment, vibration is used for positioning the
spherical connection terminals 2 and connection portions 14 with
respect to one another. Specifically, in this embodiment, a
vibration generating apparatus (not shown in the figures) is
connected to the positioning substrate 80-1. By driving the
vibration generating apparatus, the positioning substrate 80-1 can
be vibrated.
[0244] As shown in FIG. 32A, by vibrating the positioning substrate
80-1, the semiconductor device 1 relatively moves (vibrates) on the
positioning substrate 80-1. Then, by this vibration of the
semiconductor device 1, as shown in FIG. 32B, the spherical
connection terminals 2 fit into the holes 81 of the positioning
substrate 80-1, respectively. Thus, the positioning of the
spherical connection terminals 2 is performed. Thus, in the
semiconductor inspection apparatus 10-29 in this embodiment, the
positioning between the spherical connection terminals 2 and the
connection portions 14 can be performed easily and
automatically.
[0245] FIGS. 33A and 33B show a semiconductor inspection apparatus
10-30 in the thirtieth embodiment. In this embodiment, suction
paths 83, which are connected to a vacuum suction apparatus (vacuum
pump), are formed in the positioning substrate 80-2, and suction
holes of the suction paths 83 are formed in the holes 81,
respectively. Accordingly, by driving the vacuum pump and sucking
air from the suction holes via the suction paths 83, the spherical
connection terminals 2 are forcibly drawn into the holes 81,
respectively. Thus, it is possible to positioning the spherical
connection terminals 2 into the holes 81 (to the connection
portions 14), respectively, with high accuracy.
[0246] FIG. 34A and 34B show a semiconductor inspection apparatus
10-31 in the thirty-first embodiment.
[0247] In this embodiment, the positioning substrate 80-3 is made
of a porous material, and the positioning substrate 80-3 is
connected to a vacuum suction apparatus (vacuum pump).
[0248] In this arrangement, when the vacuum pump is driven, because
the positioning substrate 80-3 is made of the porous material, the
entire surface of the semiconductor device 1 is drawn to the
positioning substrate 80-3. Thereby, the spherical connection
terminals 2 fit into the holes 81, respectively. Thus, it is
possible to positioning the spherical connection terminals 2 into
the holes 81 (to the connection portions 14), respectively, with
high accuracy.
[0249] FIGS. 35 and 36 show positioning mechanisms for positioning
the positioning substrate to the substrate 39.
[0250] In a semiconductor inspection apparatus 10-32 in the
thirty-second embodiment shown in FIG. 35, a stage 84, which has
positioning pins 85 provided to stand thereon, is used as the
positioning mechanism. By inserting the positioning pins 85 into
positioning holes 52-6 formed in the substrate 39 and shock
absorbing member 12A, and into positioning holes 86 formed in the
positioning substrate 80-4, the positioning substrate 80-4 is
positioned to the substrate 39.
[0251] In a semiconductor inspection apparatus 10-33 in the
thirty-third embodiment shown in FIG. 36, positioning pins 87 are
provided so as to be connected to the positioning substrate 80-5 as
the positioning mechanism. By inserting the positioning pins 87
into positioning holes 52-6 formed in the substrate 39 and shock
absorbing member 12A, the positioning substrate 80-4 is positioned
with respect to the substrate 39.
[0252] By positioning the positioning substrate 80-4 with respect
to the substrate 39 using the positioning pins 85 as described
above, it is possible to improve the positioning accuracy between
the connection portions 14 and the holes 81 of the substrate 80-4.
Similarly, by positioning the positioning substrate 80-5 to the
substrate 39 using the positioning pins 87 as described above, it
is possible to improve the positioning accuracy between the
connection portions 14 and the holes 81 of the substrate 80-5.
Accordingly, it is possible to improve the positioning accuracy
between the spherical connection terminals 2 and the connection
portions 14.
[0253] Further, the present invention is not limited to the
above-described embodiments, and variations and modifications may
be made without departing from the scope of the present invention
claimed in the following claims.
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