U.S. patent application number 09/173538 was filed with the patent office on 2001-07-19 for integrated device and method for routing a signal through the device.
Invention is credited to CORISIS, DAVID J., VICTORY, FONDA R..
Application Number | 20010008482 09/173538 |
Document ID | / |
Family ID | 22632486 |
Filed Date | 2001-07-19 |
United States Patent
Application |
20010008482 |
Kind Code |
A1 |
CORISIS, DAVID J. ; et
al. |
July 19, 2001 |
INTEGRATED DEVICE AND METHOD FOR ROUTING A SIGNAL THROUGH THE
DEVICE
Abstract
An integrated device includes a package having first and second
sides, a first package terminal disposed on the first side of the
package, and a second package terminal disposed on the second side
of the package in alignment with the first package terminal. An
integrated circuit is mounted to the package and has an input
terminal coupled to the first package terminal and an output
terminal coupled to the second package terminal. In operation, the
first package terminal receives a signal and couples the signal to
the input terminal of the integrated circuit, the integrated
circuit couples the signal from its input terminal to its output
terminal, and the signal leaves the device via the second package
terminal
Inventors: |
CORISIS, DAVID J.;
(MERIDIAN, ID) ; VICTORY, FONDA R.; (EMMETT,
ID) |
Correspondence
Address: |
GRAYBEL JACKSON HALEY,LLP
SUITE 350
155-108TH AVENUE N E
BELLEVUE
WA
980045901
|
Family ID: |
22632486 |
Appl. No.: |
09/173538 |
Filed: |
October 15, 1998 |
Current U.S.
Class: |
361/735 ;
257/E25.023; 361/803 |
Current CPC
Class: |
H01L 2924/15331
20130101; H01L 2224/48091 20130101; H01L 2924/00014 20130101; H01L
2924/01055 20130101; H01L 2225/1058 20130101; H01L 2924/3011
20130101; H01L 25/105 20130101; H01L 2225/1005 20130101; H01L
2224/48091 20130101; H01L 2924/19041 20130101; H01L 2225/1023
20130101 |
Class at
Publication: |
361/735 ;
361/803 |
International
Class: |
H05K 001/14 |
Claims
What is claimed:
1. An integrated device, comprising: a package having first and
second sides; a first package terminal disposed on the first side
of the package and operable to receive a signal; a second package
terminal disposed on the second side of the package in alignment
with the first package terminal; and an integrated circuit mounted
to the package and having a circuit input terminal coupled to the
first package terminal and having a circuit output terminal coupled
to the second package terminal, the integrated circuit operable to
couple the signal from the circuit input terminal to the circuit
output terminal.
2. The device of claim 1 wherein the first and second package
terminals comprise respective conductive balls.
3. The device of claim 1 wherein the integrated circuit is disposed
within the package.
4. The device of claim 1 wherein the package comprises a substrate
having a first conductive path operable to couple the signal from
the first package terminal to the circuit input terminal and having
a second conductive path operable to couple the signal from the
circuit output terminal to the second package terminal.
5. The device of claim 1 wherein the package comprises a substrate
having a first conductive path operable to couple the signal from
the first package terminal to the circuit input terminal and having
a second conductive path operable to couple the signal from the
circuit output terminal to the second package terminal; and wherein
the integrated circuit is mounted to the substrate.
6. An integrated device, comprising: a package having first and
second sides; a first package terminal disposed on the first side
of the package; a second package terminal disposed on the second
side of the package in alignment with the first package terminal;
and an integrated circuit mounted to the package and having a first
circuit terminal coupled to the first package terminal, a second
circuit terminal coupled to the second package terminal, and a
first conductive path coupled to the first and second circuit
terminals.
7. The device of claim 6 wherein the package comprises a substrate
having a first conductive path coupled to the first package
terminal and the first circuit terminal and having a second
conductive path coupled to the second package terminal and the
second circuit output terminal.
8. The device of claim 6 wherein the package comprises a printed
circuit board having a first conductive trace connecting the first
package terminal to the first circuit terminal and having a second
conductive trace connecting the second package terminal to the
second circuit output terminal.
9. The device of claim 6 wherein the package comprises a layer that
encapsulates the integrated circuit.
10. The device of claim 6, further comprising: a third package
terminal disposed on the second side of the package and coupled to
the second package terminal; and a fourth package terminal disposed
on the first side of the package and coupled to the third package
terminal.
11. The device of claim 6, further comprising: a third package
terminal disposed on the second side of the package and coupled to
the second package terminal; and a fourth package terminal disposed
on the first side of the package and aligned with and coupled to
the third package terminal.
12. The device of claim 6, further comprising: a third package
terminal disposed on the second side of the package; a coupler
disposed on the package and having a conductive path coupled to the
second and third package terminals; and a fourth package terminal
disposed on the first side of the package and coupled to the third
package terminal.
13. The device of claim 6, further comprising: a third package
terminal disposed on the second side of the package; a termination
circuit disposed on the package and having a first termination
terminal coupled to the second package terminal and having a second
termination terminal coupled to t he third package terminal; and a
fourth package terminal disposed on the first side of the package
and coupled to the third package terminal.
14. An integrated-circuit module, comprising: a first integrated
device including: a first package having first and second sides; a
first package terminal disposed on the first side and operable to
receive a signal; a second package terminal disposed on the second
side and aligned with the first package terminal; and a first
integrated circuit mounted to the first package and having a first
circuit input terminal coupled to the first package terminal and
having a first circuit output terminal coupled to the second
package terminal, the integrated circuit operable to couple the
signal from the first circuit input terminal to the first circuit
output terminal; and a second integrated device including: a second
package having first and second sides; a first package terminal
disposed on the first side of the second package and coupled to and
operable to receive the signal from the second package terminal of
the first device; a second package terminal disposed on the second
side of and aligned with the first package terminal of the second
device; and a second integrated circuit mounted to the second
package and having a second circuit input terminal coupled to the
first package terminal of the second device and having a second
circuit output terminal coupled to the second package terminal of
the second device, the second integrated circuit operable to couple
the signal from the second circuit input terminal to the second
circuit output terminal.
15. The integrated-circuit module of claim 14 wherein: the first
package comprises a first substrate having a first conductive path
operable to couple the signal from the first package terminal of
the first device to the first circuit input terminal of the first
integrated circuit and having a second conductive path operable to
couple the signal from the first circuit output terminal of the
first integrated circuit to the second package terminal of the
first device; and the second package comprises a second substrate
having a first conductive path operable to couple the signal from
the first package terminal of the second device to the second
circuit input terminal of the second integrated circuit and having
a second conductive path operable to couple the signal from the
second circuit output terminal of the second integrated circuit to
the second package terminal of the second device.
16. The integrated-circuit module of claim 14 wherein the first
device includes third and fourth package terminals respectively
disposed on the first and second sides of the first package, the
fourth package terminal coupled to the second package terminal of
the second device and to the third package terminal, the fourth
package terminal operable to receive the signal from the second
package terminal of the second device and to couple the signal to
the third package terminal.
17. The integrated-circuit module of claim 14 wherein: the second
device includes a third package terminal disposed on the first side
of the second packages the third package terminal coupled to and
operable to receive the signal from the second package terminal of
the second device; and the first device includes third and fourth
package terminals respectively disposed on the first and second
sides of the first package, the fourth package terminal coupled to
the third package terminals of the first and second devices, the
fourth package terminal operable to receive the signal from the
third package terminal of the second device and to couple the
signal to the third package terminal of the first device.
18. The integrated-circuit module of claim 14 wherein: the second
device includes a third package terminal disposed on the first side
of the second package, the third package terminal coupled to and
operable to receive the signal from the second package terminal of
the second device; and the first device includes third and fourth
package terminals respectively disposed on the first and second
sides of the first package and aligned with one another, the fourth
package terminal coupled to the third package terminals of the
first and second devices, the fourth package terminal operable to
receive the signal from the third package terminal of the second
device and to couple the signal to the third package terminal of
the first device.
19. The integrated-circuit module of claim 14 wherein: the second
device includes third and fourth inter-coupled package terminals
respectively disposed on the first and second sides of the second
package, the fourth package terminal coupled to and operable to
receive the signal from the second package terminal of the second
device; and the first device includes third and fourth package
terminals respectively disposed on the first and second sides of
the first package and aligned with one another, the fourth package
terminal of the first device coupled to the third package terminals
of the first and second devices, the fourth package terminal of the
first device operable to receive the signal from the third package
terminal of the second device and to couple the signal to the third
package terminal of the first device.
20. The integrated-circuit module of claim 14 wherein: the second
device includes third and fourth inter-coupled package terminals
respectively disposed on the first and second sides of the second
package and aligned with one another, the fourth package terminal
coupled to and operable to receive the signal from the second
package terminal of the second device; and the first device
includes third and fourth package terminals respectively disposed
on the first and second sides of the first package and aligned with
one another, the fourth package terminal of the first device
coupled to the third package terminals of the first and second
devices, the fourth package terminal of the first device operable
to receive the signal from the third package terminal of the second
device and to couple the signal to the third package terminal of
the first device.
21. The integrated-circuit module of claim 14, further comprising:
a termination circuit coupled to and operable to receive the signal
from the second package terminal of the second device; wherein the
first device includes third and fourth package terminals
respectively disposed on the first and second sides of the first
package, the fourth package terminal coupled to the termination
circuit and to the third package terminal, the fourth package
terminal operable to receive the signal from the termination
circuit and to couple the signal to the third package terminal.
22. The integrated-circuit module of claim 14 wherein the second
device is disposed on the first device.
23. The integrated-circuit module of claim 14 wherein the second
device is disposed adjacent to the first device.
24. An integrated-circuit module, comprising: a first integrated
device including: a first package having first and second sides; a
first package terminal disposed on the first side; a second package
terminal disposed on the second side and aligned with the first
package terminal; and a first integrated circuit mounted to the
first package and having a first circuit input terminal coupled to
the first package terminal, a first circuit output terminal coupled
to the second package terminal, and a first conductive path coupled
to the first circuit input and output terminals; and a second
integrated device including: a second package having first and
second sides; a first package terminal disposed on the first side
of the second package and coupled to the second package terminal of
the first device; a second package terminal disposed on the second
side of and aligned with the first package terminal of the second
device package; and a second integrated circuit mounted to the
second package and having a second circuit input terminal coupled
to the first package terminal of the first device, a second circuit
output terminal coupled to the second package terminal of the
second device, and a second conductive path coupled to the second
circuit input and output terminals.
25. The integrated-circuit module of claim 24 wherein: the first
package comprises a first substrate having a third conductive path
coupled to the first package terminal of the first device and to
the first circuit input terminal of the first integrated circuit
and having a fourth conductive path coupled to the first circuit
output terminal of the first integrated circuit and to the second
package terminal of the first device; and the second package
comprises a second substrate having a fifth conductive path coupled
to the first package terminal of the second device and to the
second circuit input terminal of the second integrated circuit and
having a sixth conductive path coupled to the second circuit output
terminal of the second integrated circuit and to the second package
terminal of the second device.
26. The integrated-circuit module of claim 24 wherein the first
device includes third and fourth package terminals respectively
disposed on the first and second sides of the first package, the
fourth package terminal coupled to the second package terminal of
the second device and to the third package terminal.
27. The integrated-circuit module of claim 24, further comprising:
a termination circuit coupled to the second package terminal of the
second device; and wherein the first device includes third and
fourth package terminals respectively disposed on the first and
second sides of the first package, the fourth package terminal
coupled to the termination circuit and to the third package
terminal.
28. The integrated-circuit module of claim 24 wherein the second
device is disposed on the first device.
29. The integrated-circuit module of claim 24 wherein the second
device is disposed adjacent to the first device.
30. An integrated-circuit module, comprising: a first integrated
device including: a first package having first and second opposite
sides; a first package terminal disposed on the first side and
operable to receive a signal; a second package terminal disposed on
the second side and aligned with the first package terminal; and a
first integrated circuit mounted to the first package and having a
first circuit input terminal coupled to the first package terminal
and having a first circuit output terminal coupled to the second
package terminal, the integrated circuit operable to couple the
signal from the first circuit input terminal to the first circuit
output terminal; a coupler having a first coupler terminal coupled
to the second package terminal and having a second coupler
terminal, the coupler operable to couple the signal from the first
coupler terminal to the second coupler terminal; and a second
integrated device disposed adjacent to the first packaged device
and including: a second package having first and second opposite
sides; a first package terminal disposed on the first side of the
second package, coupled to the coupler, and operable to receive the
signal from the second coupler terminal; a second package terminal
disposed on the second side of the second package and aligned with
the first package terminal of the second device; and a second
integrated circuit mounted to the second package and having a
second circuit input terminal coupled to the first package terminal
of the first device and having a second circuit output terminal
coupled to the second package terminal of the second device, the
second integrated circuit operable to couple the signal from the
second circuit input terminal to the second circuit output
terminal.
31. The integrated-circuit module of claim 30 wherein: the first
integrated circuit is mounted to the second side of the first
package; and the second integrated circuit is mounted to the first
side of the second package.
32. The integrated-circuit module of claim 30 wherein: the first
integrated circuit is mounted to the second side of the first
package; and the second integrated circuit is mounted to the second
side of the second package.
33. The integrated-circuit module of claim 30 wherein: the first
package has first and second opposite edges that extend between the
first and second sides; the second package terminal of the first
device is disposed along the first edge of the first package; the
second package has first and second opposite edges that extend
between the first and second sides; the first package terminal of
the second device is disposed along the first edge of the second
package; and the second edge of the first package is adjacent to
the first edge of the second package.
34. The integrated-circuit module of claim 30 wherein: the first
package has first and second opposite edges that extend between the
first and second sides; the second package terminal of the first
device is disposed along the first edge of the first package; the
second package has first and second opposite edges that extend
between the first and second sides; the first package terminal of
the second device is disposed along the first edge of the second
package; and the second edge of the first package is adjacent to
the second edge of the second package.
35. The integrated-circuit module of claim 30 wherein the first and
second integrated circuits each comprise a respective memory
circuit.
36. The integrated-circuit module of claim 30 wherein: the first
integrated circuit is disposed on the second side of the first
package; the first package comprises: a first conductive pad
disposed on the second side of the first package and coupled to the
first circuit input terminal of the first integrated circuit; a
first conductive path coupled to the first package terminal of the
first device and to the first conductive pad; a second conductive
pad disposed on the second side of the first package and coupled to
the first circuit output terminal of the first integrated circuit;
and a second conductive path coupled to the second package terminal
of the first device and to the second conductive pad; and the
second integrated circuit is disposed on the second side of the
second package; and the second package comprises: a first
conductive pad disposed on the second side of the second package
and coupled to the second circuit input terminal of the second
integrated circuit; a first conductive path coupled to the first
package terminal of the second device and to the first conductive
pad; a second conductive pad disposed on the second side of the
second package and coupled to the second circuit output terminal of
the second integrated circuit; and a second conductive path coupled
to the second package terminal of the second device and to the
second conductive pad.
37. The integrated-circuit module of claim 30 wherein: the first
integrated circuit is disposed on the second side of the first
package; the first package comprises: a first conductive pad
disposed on the second side of the first package and coupled to the
first circuit input terminal of the first integrated circuit; a
first conductive path coupled to the first package terminal of the
first device and to the first conductive pad; a second conductive
pad disposed on the second side of the first package and coupled to
the first circuit output terminal of the first integrated circuit;
and a second conductive path coupled to the second package terminal
of the first device and to the second conductive pad; the second
integrated circuit is disposed on the first side of the second
package; and the second package comprises: a first conductive pad
disposed on the first side of the second package and coupled to the
second circuit input terminal of the second integrated circuit; a
first conductive path coupled to the first package terminal of the
second device and to the first conductive pad; a second conductive
pad disposed on the first side of the second package and coupled to
the second circuit output terminal of the second integrated
circuit; and a second conductive path coupled to the second package
terminal of the second device and to the second conductive pad.
38. The integrated-circuit module of claim 30 wherein: the signal
has a value; and the first integrated circuit is operable to
configure the first circuit input and output terminals in response
to the value of the signal.
39. The integrated-circuit module of claim 30 wherein: the signal
has a value; and the second integrated circuit is operable to
configure the second circuit input and output terminals in response
to the value of the signal.
40. An integrated-circuit module, comprising: a first integrated
device including: a first package having first and second opposite
sides; a first package terminal disposed on the first side; a
second package terminal disposed on the second side and aligned
with the first package terminal; and a first integrated circuit
mounted to the first package and having a first circuit input
terminal coupled to the first package terminal, a first circuit
output terminal coupled to the second package terminal, and a
conductive path coupled to the first circuit input and output
terminals; a coupler having a first coupler terminal coupled to the
second package terminal, a second coupler terminal, and a
conductive path coupled to the first and second coupler terminals;
and a second integrated device disposed adjacent to the first
packaged device and including: a second package having first and
second opposite sides; a first package terminal disposed on the
first side of the second package and coupled to the second coupler
terminal; a second package terminal disposed on the second side of
second package and aligned with the first package terminal of the
second device; and a second integrated circuit mounted to the
second package and having a second circuit input terminal coupled
to the first package terminal of the second device, a second
circuit output terminal coupled to the second package terminal of
the second device, and a conductive path coupled to the second
circuit input and output terminals.
41. An electronic system, comprising: a circuit board having an
input pad and an output pad; and an integrated device disposed on
the circuit board and including: a package having first and second
sides; a first package terminal disposed on the first side of the
package and coupled to the input pad; a second package terminal
disposed on the second side of the package in alignment with the
first package terminal, the second package terminal coupled to the
output pad; and an integrated circuit mounted to the package and
having a first circuit terminal coupled to the first package
terminal, a second circuit terminal coupled to the second package
terminal, and a conductive path coupled to the first and second
circuit terminals.
42. The electronic system of claim 41, further comprising: a supply
terminal; and a termination circuit having a first terminal coupled
to the output pad and having a second terminal coupled to the
supply terminal.
43. The electronic system of claim 41, further comprising: a supply
terminal; and a termination impedance having a first terminal
coupled to the output pad and having a second terminal coupled to
the supply terminal.
44. An electronic system, comprising: a circuit board having an
input pad and an output pad; and an integrated-circuit module
disposed on the circuit board and including: a first integrated
device disposed on the circuit board and including: a first package
having first and second sides; a first package terminal disposed on
the first side and coupled to the input pad; a second package
terminal disposed on the second side and aligned with the first
package terminal; and a first integrated circuit mounted to the
first package and having a first circuit input terminal coupled to
the first package terminal, a first circuit output terminal coupled
to the second package terminal, and a first conductive path coupled
to the first circuit input and output terminals; and a second
integrated device including: a second package having first and
second sides; a first package terminal disposed on the first side
of the second package and coupled to the second package terminal of
the first device; a second package terminal disposed on the second
side of the second package and aligned with the first package
terminal of the second device, the second package terminal coupled
to the output pad; and a second integrated circuit mounted to the
second package and having a second circuit input terminal coupled
to the first package terminal of the second device, a second
circuit output terminal coupled to the second package terminal of
the second device, and a second conductive path coupled to the
second circuit input and output terminals.
45. The electronic system of claim 44, further comprising: a supply
terminal; and a termination circuit having a first terminal coupled
to the output pad and having a second terminal coupled to the
supply terminal.
46. The electronic system of claim 44 wherein the
integrated-circuit module comprises a termination circuit that is
coupled between the second package terminal of the first device and
the first package terminal of the second device.
47. An electronic system, comprising: a circuit board having an
input pad and an output pad; and an integrated-circuit module
disposed on the circuit board and including: a first integrated
device including: a first package having first and second opposite
sides; a first package terminal disposed on the first side and
coupled to the input pad; a second package terminal disposed on the
second side and aligned with the first package terminal; and a
first integrated circuit mounted to the first package and having a
first circuit input terminal coupled to the first package terminal,
a first circuit output terminal coupled to the second package
terminal, and a conductive path coupled to the first circuit input
and output terminals; a coupler having a first coupler terminal
coupled to the second package terminal, a second coupler terminal,
and a conductive path coupled to the first and second coupler
terminals; and a second integrated device disposed adjacent to the
first packaged device and including: a second package having first
and second opposite sides; a first package terminal disposed on the
first side of the second package and coupled to the second coupler
terminal; a second package terminal disposed on the second side of
the second package and aligned with the first package terminal of
the second device, the second package terminal coupled to the
output pad; and a second integrated circuit mounted to the second
package and having a second circuit input terminal coupled to the
first package terminal of the second die, a second circuit output
terminal coupled to the second package terminal of the second die,
and a conductive path coupled to the second circuit input and
output terminals.
48. The electronic system of claim 47, further comprising: a supply
terminal; and a termination circuit having a first terminal coupled
to the output pad and having a second terminal coupled to the
supply terminal.
49. The electronic system of claim 47 wherein the conductive path
of the coupler comprises a termination circuit that is coupled
between the first and second coupler terminals.
50. A method, comprising: coupling a signal to a first terminal
disposed on a first side of a device package; coupling the signal
from the first terminal through an integrated circuit disposed on
the package; and coupling the signal from the integrated circuit to
a second terminal disposed on a second side of the package in
alignment with the first terminal.
51. The method of claim 50, further comprising: coupling the signal
from the second terminal to a third terminal disposed on the second
side of the package; and coupling the signal from the third
terminal to a fourth terminal disposed on the first side of the
package.
52. The method of claim 50, further comprising terminating the
signal after the second terminal.
53. A method, comprising: coupling a signal to a first terminal
disposed on a first side of a first device package; coupling the
signal from the first terminal, through a first integrated circuit
mounted to the first package, and to a second terminal disposed on
a second side of the first package in alignment with the first
terminal; coupling the signal from the second terminal of the first
package to a third terminal disposed on a first side of a second
device package; and coupling the signal from the third terminal,
through a second integrated circuit mounted to the second package,
and to a fourth terminal disposed on a second side of the second
package in alignment with the third terminal.
54. The method of claim 53, further comprising: coupling the signal
from the fourth terminal to a fifth terminal disposed on the second
side of the first package; and coupling the signal from the fifth
terminal to a sixth terminal disposed on the first side of the
first package.
55. The method of claim 53, further comprising: coupling the signal
from the fourth terminal to a fifth terminal disposed on the first
side of the second package; coupling the signal from the fifth
terminal to a sixth terminal disposed on the second side of the
first package; and coupling the signal from the sixth terminal to a
seventh terminal disposed on the first side of the first
package.
56. The method of claim 53, further comprising: coupling the signal
from the fourth terminal to a fifth terminal disposed on the second
side of the second package; coupling the signal from the fifth
terminal to a sixth terminal disposed on the first side of the
second package; coupling the signal from the sixth terminal to a
seventh terminal disposed on the second side of the first package;
and coupling the signal from the seventh terminal to an eighth
terminal disposed on the first side of the first package.
57. The method of claim 53, further comprising terminating the
signal after the fourth terminal.
Description
TECHNICAL FIELD
[0001] The invention relates generally to electronic circuits, and
more particularly to an integrated device that routes a signal
through the device and to other devices in an integrated-circuit
module.
BACKGROUND OF THE INVENTION
[0002] In today's marketplace, consumers are pressuring
manufacturers of electronic products to squeeze more functionality
into a smaller space. For example, consumers want smaller and
lighter personal computers, such as laptops, that have faster, more
powerful processors and greater memory capacity.
[0003] FIG. 1 is a side view of an integrated-circuit (IC) module
10, which allows manufactures to reduce the circuit-board area, and
thus the overall size, of electronic products such as personal
computers. The module 10 includes a number of integrated devices
12, which are stacked one atop the other, and is mounted to a
circuit board 14. Therefore, no matter how many devices 12 it
includes, the module 10 occupies the circuit-board area of only one
device 12. This is a significant reduction in occupied area as
compared to a scheme where the devices 12 are laid out side by side
on the board 14.
[0004] More specifically, each of the devices 12 in the module 10
has a conventional package that allows coupling of signals between
the board 14 and all of the devices 12. In the illustrated
embodiment, the devices 12 each have a ball-grid-array (BGA)
package, although other packages may be used as long as they allow
stacking of the devices 12 to form the module 10. Each device 12
includes a number of connection balls 16, which are each coupled to
a respective terminal 18. A respective conductor 19 couples each of
the terminals 18 to a respective terminal 20 that is aligned with
the terminal 18. For example, in the device 12.sub.0, the conductor
19.sub.0 couples the terminal 18.sub.0 to the terminal 20.sup.0.
When the devices 12 are stacked to form the module 10, respective
conductive paths are formed by the connection balls 16, the
terminals 18 and 20, and the conductors 19. It is these conductive
paths that couple respective signals between the circuit board 14
and all of the devices 12 in the module 10. For example, one such
conductive path is formed by the ball 16.sub.0, terminal 18.sub.0,
conductor 19.sub.0, terminal 20.sup.0, ball 16.sub.1, and so on up
to the terminal 20.sub.n. Therefore, so that the module 10 works
properly, all of the devices 12 have the same pin out, i.e.,
receive the same signals on the same respective terminals 18 and
provide the same signals on the same respective terminals 20.
[0005] Unfortunately, referring to FIG. 2, which is a top view of
one of the devices 12 of FIG. 1, the size of each device 12 is
increased to accommodate signals that are not common to all of the
devices 12. For example, each device 12 is enabled by a respective
chip-select signal CS.sub.0-CS.sub.n, which is received on a
respective chip-select terminal 18.sub.CS0-18.sub.CSn. If they were
laid out side by side on the board 14 (FIG. 1), then each of the
devices 12 would need only one chip-select terminal 18.sub.CS. But
because they are stacked, each device 12 has the same number of
chip-select terminals 18.sub.CS0-18.sub.CSn as there are devices 12
in the module 10 (FIG. 1).
[0006] More specifically, for each unique signal such as a
chip-select signal that they receive, the devices 12 each need n
terminals, where n is the number of devices 12 in the module 10
(FIG. 1). Thus, just one or two unique signals may cause a
significant increase in the sizes of the devices 12. For example,
the device 12.sub.0 (FIG. 1) responds only to CS.sub.0, and thus
needs only the terminal 18.sub.CS0 to function properly. That is,
the device 12.sub.0 has no need for CS.sub.1-CS.sub.n, and thus can
function properly without the terminals 18.sub.CS1-18.sub.CSn But
because the other devices 12, - 12.sup.n in the module 10 respond
to CS.sub.1-CS.sub.n, respectively, the device 12.sub.0 must also
include the terminals 18.sub.CS1-18.sub.CSn to form conductive
paths that couple CS.sub.1-CS.sub.n to the devices
12.sub.1-12.sub.n. For reasons including that the relative position
of a device 12 in the module 10 is unknown during manufacture of
the device 12, each of the devices 12.sub.1-12.sub.n also includes
a respective set of terminals 18.sub.CS0-18.sub.CSn
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Following is a brief description of the drawing where like
numerals are used to reference like elements.
[0008] FIG. 1 is a side view of a known IC module.
[0009] FIG. 2 is a top view of one of the devices that composes the
IC module of FIG. 1.
[0010] FIG. 3 is a side view of an embodiment of an IC module
according to the invention.
[0011] FIG. 4 is a coupling diagram for the devices that compose
the IC module of FIG. 3.
[0012] FIG. 5 is a side view of another embodiment of an IC module
according to the invention.
[0013] FIG. 6 is a coupling diagram for the devices that compose
the IC module of FIG. 5.
[0014] FIG. 7 is a side view of another embodiment of the IC module
of FIG. 5.
[0015] FIG. 8 is a side view of another embodiment of the IC module
of FIG. 5.
[0016] FIG. 9 is a side view of another embodiment of the IC module
of FIG. 5.
[0017] FIG. 10 is a schematic block diagram of a memory circuit
that can be incorporated into one or more of the devices that
compose the IC modules of FIGS. 3, 5, 7, 8, and 9.
[0018] FIG. 11 is a block diagram of an electronic computer system
that can incorporate one or more of the IC modules of FIGS. 3, 5,
7, 8, and 9.
SUMMARY OF THE INVENTION
[0019] In one aspect of the invention, an integrated device
includes a package having first and second sides, a first package
terminal disposed on the first side of the package, and a second
package terminal disposed on the second side of the package in
alignment with the first package terminal. An integrated circuit is
mounted to the package and has an input terminal coupled to the
first package terminal and has an output terminal coupled to the
second package terminal. In operation, the first package terminal
receives a signal and couples the signal to the input terminal of
the integrated circuit, the integrated circuit couples the signal
from its input terminal to its output terminal, and the signal
leaves the device via the second package terminal.
[0020] Such a device allows the coupling of multiple signals to
multiple devices in an IC module over only one single path. For
example, such a device may allow multiple devices in the module to
share one chip-select signal path. Sharing the same signal path
allows each device in the module to have only one terminal for a
unique signal, and thus allows the devices and module to have
smaller sizes than they might otherwise have.
DETAILED DESCRIPTION OF THE INVENTION
[0021] FIG. 3 is a side view of an embodiment of an IC module 20
according to the invention. The module 20 is mounted to the circuit
board 14 and includes one or more integrated devices
22.sub.0-22.sub.n, which are coupled together by connecting balls
21 and which share the same signal path for signals, such as
chip-select signals, that are respectively unique to each of the
devices 22. Therefore, where the devices 22 are similar to the
devices 12 of FIG. 1 except for the signal path sharing, each
device 20 includes fewer terminals and occupies a smaller area than
a device 12, and thus the module 20 occupies a smaller area than
the module 10 of FIG. 1.
[0022] More specifically, each of the devices 22 of the module 20
includes a package 24 having a sides 26 and 28. Terminals 30 are
disposed on the side 26, and terminals 32, which are each aligned
with a respective terminal 30, are disposed on the side 28. For
example, the terminals 30.sub.0 and 32.sub.0 of the device 22.sub.0
are aligned with one another. A conductive pad 34 is disposed on
the side 28 and is coupled to the terminal 30 via a conductive path
36. Similarly, a pad 38 is disposed on the side 28 and is coupled
to the terminal 32 via a conductive path 40. Although the path 40
is shown routed through the package 24, in other embodiments it is
routed along the surface of the side 28. An integrated circuit 42,
such as a memory circuit, is mounted to the package 24. In one
embodiment, the circuit 42 is in die form. In another embodiment,
the circuit 42 includes a Sync-Link Dynamic Random Access Memory
(SLDRAM) that operates at clock speeds up to 800 MHZ. In still
another embodiment, the package 24 encapsulates the circuit 42 to
protect it from the environment. In yet another embodiment, the
package includes a substrate, such as a circuit board, to which the
circuit 42 is mounted. The circuit 42 has an input terminal 44,
which is coupled to the pad 36, and has an output terminal 46,
which is coupled to the pad 38. In the illustrated embodiment, the
terminals 44 and 46 are wire bonded to the pads 36 and 38,
respectively, although other coupling techniques may be used.
[0023] During operation of the module 20, the integrated circuit
42.sub.0 of the device 22.sub.0 receives a signal from the circuit
board 14 via the connection ball 21.sub.0, terminal 30.sub.0, path
36.sub.0, pad 34.sub.0, and input terminal 44.sub.0, and provides
the signal to the connection ball 21.sub.1 via the output terminal
46.sub.0, pad 38.sub.0, path 40.sub.0, and terminal 32.sub.0. The
other devices 22.sub.1-22.sub.n-1 operate in a similar manner such
that the signal is serially coupled all the way to the device
22.sub.n. Arrows in FIG. 3 show the direction of the signal flow
along this serial path.
[0024] Each of the devices 22 may, however, respond only to a
respective one of the signals, even though all of the signals are
coupled through the same serial path. For example, if the signals
transmitted along this path are chip-select signals, then each of
the integrated circuits 42 may be constructed or programmed to
recognize a unique voltage drop across its terminals 44 and 46.
That is, a circuit 42 will not be enabled until the appropriate
chip-select voltage is applied to the signal path. Thus, by
providing chip-select signals of differing voltage levels, the
desired one of the devices 22 can be selected. Alternatively, the
chip-select signals may be digital, and each circuit 44 programmed
to recognize a unique digital value. Furthermore, signals other
than chip-select signals may be routed according to these
techniques.
[0025] Still referring to FIG. 3, in high-frequency applications,
it may be desirable to terminate the serial path at its end to
prevent undesirable transmission-line effects. Therefore, the
module 20 may include a termination circuit, such as a termination
impedance 50, which is coupled between the end of the signal path,
here the connection ball 21.sub.n+1, and ground or another
termination node. The impedance 50 may include e.g., a resistor,
capacitor, or transmission-line stub. In one embodiment, a
conductive path to the board 14 is formed by terminals 52 and 54,
conductors 56, and connection balls 58, and the termination
impedance 50 is coupled between the connection balls 21.sub.n+1,
and 58.sub.n+1. If this conductive path is required whether or not
the impedance 50 is present (for example, if it is a ground path),
then the addition of the impedance 50 does not require the devices
22 to have additional terminals. Alternatively, if this path is a
dedicated termination path, then the connection balls 21.sub.n+1
and 58.sub.n+1 can be shorted together so that the termination
impedance 50 can be located on the circuit board 14.
[0026] Although the module 20 is shown having BGA connections
between the devices 22, other types of connections may be used.
Furthermore, although the input and output terminals 44 and 46 are
shown on opposite sides of the respective integrated circuits 42,
they may have different locations. Additionally, the input
terminals 44 may be wire bonded directly to the respective
terminals 30, and the output terminals 46 may be wire bonded
directly to the respective terminals 32, thus eliminating the need
for the pads 34 and 38 and the conductive paths 36 and 40.
[0027] FIG. 4 is a top view of one embodiment of the device
22.sub.0 and the coupling between the circuit 42.sub.0 and the
terminals 44.sub.0 and 46.sub.0. In this embodiment, the terminals
44.sub.0 and 46.sub.0 are arranged side by side, and the terminals
30.sub.0 and 32.sub.0 are omitted for clarity. As in FIG. 3, the
arrows show the direction of signal flow. The conductive paths
36.sub.0 and 40.sub.0 can be formed from any combination of
conductive traces on and vias between the package surfaces 26.sub.0
and 28.sub.0 (FIG. 3). The other devices 22 can have a similar
coupling scheme.
[0028] FIG. 5 is a side view of an IC module 60 according to
another embodiment of the invention. The module 60 includes two
stacks 62 and 64 of the devices 22, and is useful in high-frequency
applications. Because of its larger surface area, the module 60
often allows greater heat-dissipation than the module 20 of FIG. 3.
Also, the module 60 may provide shorter signal paths including
shorter serial paths that are terminated at their respective
ends.
[0029] The stack 62 of the module 60 is similar to the single stack
of the devices 22 in the module 20 of FIG. 3. Thus, the serial
signal path of the stack 62 begins at the ball .sup.210 and ends at
the ball 21.sub.n+1. The module 60 also includes a shunt coupler 66
having a conductor 68 for coupling the ball 21.sub.n+1 to the ball
21.sub.n+2, which is the input ball of the stack 64.
[0030] The stack 64 is similar to the stack 62, except that the
signal flow along the serial path is in the opposite direction,
i.e., top to bottom instead of bottom to top. To accommodate this
reversed signal flow, the connections to the integrated circuits 42
are reversed. For example, in the device 22.sub.2n, the input
terminal 44.sub.2n is coupled to the pad 38.sub.2n instead of the
pad 34.sub.2n. Likewise, the output terminal 46.sub.2n is coupled
to the pad 34.sub.2n instead of the pad 38.sub.2n. Thus, the
integrated circuit 42.sub.2n receives the signal from the ball
21.sub.2n+1 via the terminal 32.sub.2n, path 40.sub.2n, pad
38.sub.2n, and input terminal 44.sub.2n, and provides the signal to
the connection ball 21.sub.2(n+1) via the output terminal
46.sub.2n, pad 34.sub.2n, path 36.sub.2n, and terminal 30.sub.2n.
The other devices 22.sub.n+1-22.sub.2n-1 of the stack 64 are
similarly constructed such that the stack 64 receives the signal
from the stack 62 and couples the signal back to the board 14 for
termination by a termination circuit such as the termination
impedance 50. Again, the arrows show the direction of the signal
flow along the serial path. It is clear that for the same number n
of devices 22 in the modules 20 and 60, the heights of the stacks
62 and 64 are approximately half the height of the single stack in
the module 20. Therefore, for the same number n of devices 22, the
terminated serial path of the module 60 is approximately one half
the length of the terminated serial path of the module 20 of FIG.
3.
[0031] The module 60 also includes a path for a signal, such as an
address signal, that the devices 22 of both stacks 62 and 64
receive in parallel. As shown by the arrows, the path begins with
the bail 58.sub.0, extends through the first stack 62, a conductor
70 of the coupler 66, the stack 64, and to the ball 58.sub.2(n+1),
and thus can be terminated on the board 14.
[0032] In one embodiment, whether the signals are serially routed
like the chip-select signals or parallel routed like an address
signal, they are routed up from the board 14 via the left and right
sides of the stack 62 and back down to the circuit board 14 via the
left and right sides of the stack 64, respectively.
[0033] FIG. 6 is a top view of one embodiment of a device 22 of the
module 60 of FIG. 5 and the coupling options between the circuit 42
and the balls 21. The package 24 includes a routing scheme 72
having two connection options, a first one for the devices 22 of
the stack 62 (shown in solid line and with solid arrows) and a
second one for the devices 22 of the stack 64 (shown in broken line
with broken arrows). Having this connection scheme allows the same
packages 24 to be used for the devices 22 in both of the stacks 62
and 64. More specifically, in the first option, the pads A and B
correspond to the pads 34 and 38, respectively, of the devices 22
in the stack 62. Thus, as shown by the solid arrows, the signal
flow is from the lower ball 21 (for example, 21.sub.1) into the
input terminal 44 via the pad A, and out of the output terminal 46
to the upper ball 21 (for example, 21.sub.1) via the pad B. In the
second option, the pads B and C correspond to the pads 38 and 34,
respectively, of the devices 22 in the stack 64. Thus, as shown by
the broken arrows, the signal flow is from the upper ball 21 (for
example, 21.sub.1) into the input terminal 44 via the pad B, and
out of the output terminal 46 to the lower ball 21 (for example,
21.sub.0) via the pad C.
[0034] FIG. 7 is a side view of another embodiment of the IC module
60 according to the invention. Here, identical devices 22 are used
in both of the stacks 62 and 64. Thus, unlike the embodiment of
FIG. 5, only one version of the devices 22 need be manufactured and
tested. This is advantageous because it is often easier and less
expensive to manufacture and test one version of a part than it is
to manufacture and test multiple versions. To allow the use of
identical devices 22 in both stacks 62 and 64, the integrated
circuits 42 are conventionally designed to recognize which of the
terminals 44 and 46 is being used as an input terminal and which is
being used as an output terminal, and to then configure these
terminals appropriately. For example, in one embodiment, the
integrated circuit 42.sub.0 measures the voltage drop across the
terminals 44.sub.0 and 46.sub.0 and configures the terminal at the
higher voltage as the input terminal and configures the terminal at
the lower voltage as the output terminal. The other circuits 42
operate in a similar manner. Thus, because the connections of the
terminals 44 and 46 in the stack 64 are not reversed with respect
to the connections of the terminals 44 and 46 in the stack 62 as in
the embodiment of FIG. 5, only one version of the devices 22 needs
to be manufactured and tested.
[0035] FIG. 8 is a side view of another embodiment of the IC module
60 of FIG. 5. In this embodiment, not only can both of the stacks
62 and 64 use identical devices 22, but unlike the embodiment of
FIG. 7, the integrated circuits 42 need not dynamically configure
the terminals 44 and 46. Therefore, the integrated circuits 42 used
in this embodiment can be less complex and smaller because they do
not need the dynamic configuration circuitry like the circuits 42
in the FIG. 7 embodiment. More specifically, the stack 62 in this
embodiment is similar to the stacks 62 of FIGS. 5 and 7. In the
stack 64, however, the devices 22 are flipped such that they are
upside down with respect to the devices 22 in the stack 62.
Therefore, a signal routed along the serial path enters a device 22
in the stack 64 via the terminal 30 and exits the device via the
terminal 32 just as it enters and exits a device 22 in the stack
62.
[0036] FIG. 9 is a side view of yet another embodiment of the IC
module 60 in which some signal paths between the stacks 62 and 64
are significantly shortened. Such shorter paths may be desirable
for routing high-frequency signals to minimize transmission line
effects.
[0037] More specifically, the module 60 of FIG. 9 is similar to the
module 60 of FIG. 8, except that in the FIG. 9 embodiment, the
stack 64 is oriented as if its left side were "hinged" to the right
side of the stack 62. Therefore, all of the signals that are routed
along the right side of the stack 62 are also routed along the left
side of the stack 54, and all of the signals routed along the left
side of the stack 62 are also routed along the right side of the
stack 64. Because the right side of the stack 52 and the left side
of the stack 54 are adjacent, the distance between them is much
less than for the right-side-to-right-side and
left-side-to-left-side routing of the modules 60 in FIGS. 5, 7, and
8. Although it is true that now the signal paths along the left
side of the stack 62 and right side of the stack 64 are longer than
the signal paths in FIGS. 5, 7, and 8, the devices 22 can be
designed so that lower frequency signals are routed along these
paths so that the additional distance does not cause undesirable
transmission line effects. Thus, besides the different orientations
of the devices 22 in the stack 64, the only major structural
difference between the modules 60 of FIGS. 8 and 9 is that in the
FIG. 9 embodiment, the coupler 66 couples the terminals on the left
side of the stack 62 to the respective terminals on the right side
of the stack 54, and couples the terminals on the right side of the
stack 62 to those on the left side of the stack 64.
[0038] FIG. 10 is a block diagram of a memory circuit 70, which can
compose one or more of the integrated circuits 42 of FIGS. 3-9.
[0039] The memory circuit 70 includes an address register 72, which
receives an address from an ADDRESS bus. A control logic circuit 74
receives a clock (CLK) signal, and receives clock enable (CKE),
chip select ({overscore (CS)}), row address strobe ({overscore
(RAS)}), column address strobe ({overscore (CAS)}), and write
enable ({overscore (WE)}) signals from the COMMAND bus, and
communicates with the other circuits of the memory circuit 70. A
row address multiplexer 76 receives the address signal from the
address register 72 and provides the row address to the row-address
latch-and-decode circuits 78a and 78b for the memory bank 80a or
80b, respectively. During read and write cycles, the row-address
latch-and-decode circuits 78a and 78b activate the work lines of
the addressed rows of memory cells in the memory banks 80a and 80b,
respectively. Read/write circuits 82a and 82b read data from the
addressed memory cells in the memory banks 80a and 80b,
respectively, during a read cycle, and write data to the addressed
memory cells during a write cycle. A column-address
latch-and-decode circuit 84 receives the address from the address
register 72 and provides the column address of the selected memory
cells to the read/write circuits 82a and 82b. For clarity, the
address register 72, the row-address multiplexer 76, and
row-address latch-and-decode circuits 78a and 78b, and the
column-address latch-and-decode circuit 84 can be collectively
referred to as an address decoder.
[0040] A data input/output (I/O) circuit 86 includes a plurality of
input buffers 88. During a write cycle, the buffers 88 receive and
store data from the DATA bus, and the read/write circuits 82a and
82b provide the stored data to the memory banks 80a and 80b,
respectively. The data I/O circuit 86 also includes a plurality of
output drivers 90. During a read cycle, the read/write circuits 82a
and 82b provide data from the memory banks 80a and 80b,
respectively, to the drivers 90, which in turn provide this data to
the DATA bus.
[0041] A refresh counter 92 stores the address of the row of memory
cells to be refreshed either during a conventional auto-refresh
mode or self-refresh mode. After the row is refreshed, a refresh
controller 94 updates the address in the refresh counter 92,
typically by either incrementing or decrementing the contents of
the refresh counter 92 by one. Although shown separately, the
refresh controller 94 may be part of the control logic 74 in other
embodiments of the memory circuit 70.
[0042] The memory device 70 may also include an optional charge
pump 96, which steps up the power-supply voltage V.sub.DD to a
voltage V.sub.DDP. In one embodiment, the pump 96 generates
V.sub.DDP approximately 1-1.5 V higher than V.sub.DD. The memory
circuit 70 may also use VDDP to conventionally overdrive selected
internal transistors.
[0043] FIG. 11 is a block diagram of an electronic system 100, such
as a computer system, the can incorporate one or more of the
modules 20 of FIG. 3 or the modules 60 of FIGS. 5, 7, 8, and 9. The
system 100 includes computer circuitry 102 for performing computer
functions, such as executing software to perform desired
calculations and tasks. The circuitry 102 typically includes a
processor 104 and a memory section 105, which may include one or
more of the memory circuits 70. The memory section 105 is coupled
to the processor 104. One or more input devices 106, such as a
keyboard or a mouse, are coupled to the computer circuitry 102 and
allow an operator (not shown) to manually input data thereto. One
or more output devices 168 are coupled to the computer circuitry
102. Examples of such output devices 108 include a printer and a
video display unit. One or more data-storage devices 110 are
coupled to the computer circuitry 102 to store data on or retrieve
data from external storage media (not shown). Examples of the
storage devices 110 and the corresponding storage media include
drives that accept hard and floppy disks, tape cassettes, and
compact disk read-only memories (CD-ROMs). Typically, the computer
circuitry 102 includes address data and command buses and a clock
line that are respectively coupled to the ADDRESS, DATA, and
COMMAND buses, and the CLK line of the memory circuit 70. The
computer circuitry 102, processor 104, input devices 106, output
devices 108, and storage devices 170 may each include one or more
of the modules 20 of FIG. 3 or the modules 60 of FIGS. 5, 7, 8, and
9.
[0044] From the foregoing it will be appreciated that, although
specific embodiments of the invention have been described herein
for purposes of illustration, various modifications may be made
without deviating from the spirit and scope of the invention.
* * * * *