U.S. patent application number 09/749974 was filed with the patent office on 2001-07-12 for monolithic capacitor.
This patent application is currently assigned to Murata Manufacturing Co., Ltd.. Invention is credited to Nakagawa, Takuji, Takagi, Yoshikazu, Yoneda, Yasunobu.
Application Number | 20010007522 09/749974 |
Document ID | / |
Family ID | 18501443 |
Filed Date | 2001-07-12 |
United States Patent
Application |
20010007522 |
Kind Code |
A1 |
Nakagawa, Takuji ; et
al. |
July 12, 2001 |
Monolithic capacitor
Abstract
A monolithic capacitor includes a plurality of monolithic
ceramic capacitor elements provided with external electrodes at
both ends thereof, solder layers arranged on the entire surfaces of
the external electrodes of the monolithic ceramic capacitor
elements, and metal terminals electrically connected to the
external electrodes of the monolithic ceramic capacitor elements.
The monolithic ceramic capacitor elements are joined to each other
by the solder layers and are stacked on each other. The external
electrodes of the monolithic ceramic capacitor elements are
electrically connected to each other by the solder layers.
Inventors: |
Nakagawa, Takuji;
(Takefu-shi, JP) ; Takagi, Yoshikazu; (Sabae-shi,
JP) ; Yoneda, Yasunobu; (Takefu-shi, JP) |
Correspondence
Address: |
Keating & Bennett LLP
10400 Eaton Place, Suite 312
Fairfax
VA
22030
US
|
Assignee: |
Murata Manufacturing Co.,
Ltd.
26-10 Tenjin 2-chome
Nagaokakyo-shi
JP
|
Family ID: |
18501443 |
Appl. No.: |
09/749974 |
Filed: |
December 28, 2000 |
Current U.S.
Class: |
361/301.4 |
Current CPC
Class: |
H01F 2027/295 20130101;
H01G 4/38 20130101; Y02P 70/50 20151101; H05K 3/3426 20130101; Y02P
70/613 20151101 |
Class at
Publication: |
361/301.4 |
International
Class: |
H01G 004/30 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 28, 1999 |
JP |
11-373021 |
Claims
What is claimed is:
1. A monolithic capacitor comprising: a plurality of monolithic
ceramic capacitor elements having external electrodes at both ends
thereof; solder layers arranged to cover the entire surfaces of the
external electrodes of the monolithic ceramic capacitor elements;
and metal terminals electrically connected to the external
electrodes of the monolithic ceramic capacitor elements; wherein
the monolithic ceramic capacitor elements are stacked on each other
and joined to each other via the solder layers, and the external
electrodes of the monolithic ceramic capacitor elements are
electrically connected to each other via the solder layers.
2. A monolithic capacitor according to claim 1, wherein the metal
terminals are directly connected to at least one of the monolithic
ceramic capacitor elements by the solder layers.
3. A monolithic capacitor according to claim 2, wherein the metal
terminals are not directly connected to at least one of the other
monolithic ceramic capacitor elements.
4. A monolithic capacitor according to claim 1, wherein each of the
metal terminals includes a middle section, a tip section located on
one edge of the middle section so as to face the middle section
with a space therebetween, and an end section located on the other
edge of the middle section, and the tip section is arranged to
impart spring characteristics to the metal terminal and is
connected to the external electrode of the monolithic ceramic
capacitor element by one of the solder layers.
5. A monolithic capacitor according to claim 4, wherein a film that
is resistant to soldering is disposed on the internal surface of
the metal terminal.
6. A monolithic capacitor according to claim 1, wherein the metal
terminal includes at least one cut-out arranged to adjust the
reactance component of the metal terminals.
7. A monolithic capacitor according to claim 1, wherein each of the
plurality of monolithic ceramic capacitor elements includes a
laminate having a plurality of dielectric layers and a plurality of
internal electrodes alternately disposed on the plurality of
dielectric layers.
8. A monolithic capacitor according to claim 1, wherein at least
one of the external electrodes includes a Cu layer, an Ni layer,
and an Sn layer.
9. A monolithic capacitor according to claim 1, wherein the
plurality of monolithic ceramic capacitor elements includes at
least three monolithic ceramic capacitor elements and the at least
three monolithic ceramic capacitor elements are joined
together.
10. A monolithic capacitor according to claim 1, wherein the metal
terminals are made of an Fe--Cr alloy.
11. A monolithic capacitor according to claim 1, wherein the solder
layers are made of a high-temperature solder containing Sn.
12. A monolithic capacitor according to claim 1, wherein the metal
terminals include tip sections which are connected to the external
electrodes of one of the plurality of monolithic ceramic capacitor
elements.
13. A monolithic capacitor according to claim 12, wherein vertical
lengths of tip sections of the metal terminals are substantially
equal to the height of the plurality of monolithic capacitor
elements joined together.
14. A monolithic capacitor according to claim 13, wherein the
number of monolithic capacitor elements joined together is
three.
15. A monolithic capacitor according to claim 13, wherein the
number of monolithic capacitor elements joined together is two.
16. A monolithic capacitor according to claim 12, wherein vertical
lengths of tip sections of the metal terminals are longer than the
height of the plurality of monolithic capacitor elements joined
together.
17. A monolithic capacitor according to claim 1, wherein at least
one cut-out is formed in each of the metal terminals.
18. A monolithic capacitor according to claim 17, wherein the at
least one cut-out is located in the approximate center of a middle
section of each of the metal terminals.
19. A monolithic capacitor according to claim 1, wherein a
plurality of cut-outs are formed in each of the metal
terminals.
20. A monolithic capacitor according to claim 19, wherein the
plurality of cut-outs are located in the approximate centers of
middle sections of the metal terminals.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a monolithic capacitor, and
more particularly, the present invention relates to a monolithic
capacitor having high capacitance and which includes a plurality of
monolithic ceramic capacitor elements and metal terminals, and
used, for example, as a substitute for a tantalum electrolytic
capacitor for smoothing a power circuit in a DC-DC converter, or
other suitable uses.
[0003] 2. Description of the Related Art
[0004] A monolithic capacitor provided with metal terminals is used
in order to improve thermal shock resistance by ensuring bending
strength and by relieving thermal stress. In such a monolithic
capacitor, monolithic ceramic capacitor elements are supported by
metal terminals so as not to contact a substrate. Furthermore, as
disclosed in Japanese Unexamined Utility Model Publication No.
1-112032, metal terminals are bent. By using the techniques
described above, it is also possible to decrease the difference in
thermal expansion between a substrate having a high thermal
expansion coefficient, such as an aluminum substrate, and
monolithic ceramic capacitor elements.
[0005] In such a monolithic capacitor, when a plurality of
monolithic ceramic capacitor elements are formed, external
electrodes of the monolithic ceramic capacitor elements are
partially connected to each other by a conductive resin or a solder
paste.
[0006] However, with respect to the monolithic ceramic capacitor in
which the external electrodes of the monolithic ceramic capacitor
elements are partially joined to each other by the conductive resin
or the solder paste, thermal stress is concentrated at the joints,
and cracks may occur in the joints and the monolithic ceramic
capacitor elements, resulting in a decrease in electrostatic
capacity.
SUMMARY OF THE INVENTION
[0007] In order to overcome the problems described above, preferred
embodiments of the present invention provide a monolithic capacitor
having high thermal shock resistance while avoiding all of the
problems of the prior art.
[0008] In accordance with various a preferred embodiment of the
present invention, a monolithic capacitor includes a plurality of
monolithic ceramic capacitor elements provided with external
electrodes at both ends thereof, solder layers arranged on the
entire surfaces of the external electrodes of the monolithic
ceramic capacitor elements, and metal terminals electrically
connected to the external electrodes of the monolithic ceramic
capacitor elements. The monolithic ceramic capacitor elements are
stacked on each other and are joined to each other by the solder
layers, and the external electrodes of the monolithic ceramic
capacitor elements are electrically connected to each other by the
solder layers.
[0009] In the monolithic capacitor of various preferred embodiments
of the present invention, preferably, the metal terminals are
directly connected to at least one of the monolithic ceramic
capacitor elements by the solder layers. In such a case, the metal
terminals may not be directly connected to at least one of the
other monolithic ceramic capacitor elements.
[0010] In the monolithic capacitor of various preferred embodiments
of the present invention, preferably, each metal terminal includes
a middle section, a tip section located on one edge of the middle
section so as to face the middle section with a space therebetween,
and an end section located on the other edge of the middle section,
in which the tip section imparts spring characteristics to the
metal terminal and is connected to the external electrode of the
monolithic ceramic capacitor element by the solder layer. In such a
case, a film which is resistant to soldering may be provided on the
internal surface of the metal terminal.
[0011] Furthermore, in the monolithic capacitor of various
preferred embodiments of the present invention, a cut-out may be
provided on the metal terminal for adjusting the reactance
component.
[0012] In the monolithic capacitor of preferred embodiments of the
present invention, since the solder layers are disposed on the
entire surfaces of the external electrodes of the monolithic
ceramic capacitors, thermal stress is dispersed by the solder
layers, and cracks are prevented from occurring in the joints of
the monolithic ceramic capacitor elements and the monolithic
ceramic capacitor elements. Therefore, the thermal shock resistance
is greatly improved in the monolithic capacitor of preferred
embodiments of the present invention.
[0013] Other features, elements, characteristics and advantages of
the present invention will become more apparent from the following
detailed description of preferred embodiments thereof with
reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a perspective view of a monolithic capacitor
according to a first preferred embodiment of the present
invention;
[0015] FIG. 2 is a schematic diagram showing a monolithic ceramic
capacitor element;
[0016] FIG. 3 is a perspective view of a monolithic capacitor
according to a second preferred embodiment of the present
invention;
[0017] FIG. 4 is a perspective view of a monolithic capacitor
according to a first comparative example;
[0018] FIG. 5 is an assembly view showing a major portion of the
monolithic capacitor shown in FIG. 4;
[0019] FIG. 6 is a perspective view of a monolithic capacitor
according to a second comparative example;
[0020] FIG. 7 is a perspective view of a monolithic capacitor
according to a third preferred embodiment of the present
invention;
[0021] FIG. 8 is a perspective view of a monolithic capacitor
according to a fourth preferred embodiment of the present
invention;
[0022] FIG. 9 is a perspective view of a monolithic capacitor
according to a fifth preferred embodiment of the present
invention;
[0023] FIG. 10 is a perspective view of a monolithic capacitor
according to a sixth preferred embodiment of the present
invention;
[0024] FIG. 11 is a perspective view of a monolithic capacitor
according to a third comparative example; and
[0025] FIG. 12 is a perspective view of a monolithic capacitor
according to a seventh preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0026] FIG. 1 is a perspective view of a monolithic capacitor
according to a first preferred embodiment of the present invention.
A monolithic capacitor 10 shown in FIG. 1 preferably includes three
monolithic ceramic capacitor elements 12.
[0027] The monolithic ceramic capacitor element 12 includes a
laminate 14 as shown in FIG. 2. The laminate 14 includes a
plurality of dielectric layers 16 made of, for example, a barium
titanate-based dielectric material or other suitable material, and
a plurality of internal electrodes 18 made of an electrode
material, such as Ni, or other suitable material. The plurality of
dielectric layers 16 and the plurality of internal electrodes 18
are alternately laminated. In such a case, every other one of the
internal electrodes 18 is arranged to extend to one side of the
laminate 14 and the remaining other internal electrodes 18 are
arranged to extend to the other side of the laminate 14. On one end
including one side of the laminate 14, a Cu layer 20a, an Ni layer
22a, and an Sn layer 24a are located, in that order, to constitute
an external electrode. In such a case, a Cu paste is applied at a
thickness of about 100 .mu.m on one end of the laminate 14, and
drying is performed for approximately 10 minutes at about
150.degree. C., followed by baking at about 800.degree. C. for
approximately 5 minutes to form the Cu layer 20a. Next, by wet
plating, the Ni layer 22a is formed to have a thickness of about 1
.mu.m and the Sn layer 24a is formed to have a thickness of about 5
.mu.m. Similarly, on the other end including the other side of the
laminate 14, a Cu layer 20b, an Ni layer 22b, and an Sn layer 24b
are provided, in that order, to constitute an external
electrode.
[0028] The three monolithic ceramic capacitor elements 12 are
connected to two metal terminals 30a and 30b which are preferably
made of, for example, an Fe--Cr alloy, by flow soldering, as shown
in FIG. 1.
[0029] That is, the metal terminal 30a includes a plate-like middle
section 32a. On the upper edge of the middle section 32a, a
plate-like tip section 34a is arranged to face the middle section
32a. A space may be provided between the tip section 34a and the
middle section 32a. The vertical length of the tip section 34a is
preferably about 2.5 mm, which is slightly longer than the height
of the monolithic ceramic capacitor element 12. A plate-like end
section 36a is disposed on the lower edge of the middle section 32a
so as to extend in a direction substantially perpendicular to the
middle section 32a. Therefore, the tip section 34a imparts spring
characteristics to the metal terminal 30a. The external surface of
the metal terminal 30a (i.e., surfaces of the middle section 32a
and the tip section 34a other than the surfaces facing each other,
and the lower surface of the end section 36a connected thereto) is
subjected to solder plating. Additionally, when a metal terminal
material which is easily soldered, such as brass, is used, on the
internal surface of the metal terminal 30a (the surfaces of the
middle section 32a and the tip section 34a facing each other, and
the upper surface of the end section 36a connected thereto), a film
38a which is resistant to soldering is formed. The film 38a is
preferably made of, for example, a metal oxide, a wax, a resin, or
a silicone oil, or other suitable material. Similarly, the other
metal terminal 30b includes a middle section 32b, a tip section
34b, and an end section 36b, the external surface is subjected to
solder plating, and a film 38b which is resistant to soldering is
formed on the internal surface.
[0030] Solder layers 26a and 26b, preferably made of a
high-temperature solder, e.g., Pb:Sn=85:15, are disposed on the
entire surfaces of the external electrodes (Sn layers 24a and 24b)
of the three monolithic ceramic capacitor elements 12,
respectively, by flow soldering. The three monolithic ceramic
capacitor elements 12 are stacked and joined to each other via the
solder layers 24a, 24b, and the external electrodes are
electrically connected to each other, and also, the tip sections
34a and 34b of the metal terminals 30a and 30b are connected to the
external electrodes of the lower monolithic ceramic capacitor
element 12.
[0031] FIG. 3 is a perspective view of a monolithic capacitor
according to a second preferred embodiment of the present
invention. In a monolithic capacitor 10 shown in FIG. 3, differing
from the monolithic capacitor 10 shown in FIG. 1, the vertical
lengths of tip sections 34a and 34b of metal terminals 30a and 30b
are preferably about 7.0 mm, which is substantially equal to the
height of three monolithic capacitor elements 12 joined together.
Accordingly, the vertical lengths of middle sections 32a and 32b of
the metal terminals 30a and 30b are longer. By solder layers 26a
and 26b, the tip sections 34a and 34b of the metal terminals 30a
and 30b are connected to external electrodes of the three
monolithic ceramic capacitor elements 12.
[0032] FIG. 4 is a perspective view of a monolithic capacitor
according to a first comparative example, and FIG. 5 is an assembly
view showing a major portion of the monolithic capacitor shown in
FIG. 4. In a monolithic capacitor 11 shown in FIG. 4, in contrast
to the monolithic capacitor 10 shown in FIG. 1, solder pastes 25a
and 25b (refer to FIG. 5) are applied only to portions at which
external electrodes of three monolithic ceramic capacitor elements
12 face each other, and metal terminals 30a and 30b made of an
Fe--Cr alloy are then connected to the monolithic ceramic capacitor
element 12. Therefore, solder layers 26a and 26b are disposed only
on portions in which the external electrodes of the three
monolithic ceramic capacitors 12 face each other and portions in
which the external electrodes and the metal terminals face each
other.
[0033] FIG. 6 is a perspective view of a monolithic capacitor
according to a second comparative example. In a monolithic
capacitor 11 shown in FIG. 6, in contrast to the monolithic
capacitor 10 shown in FIG. 3, a solder paste is applied only to
portions in which external electrodes of three monolithic ceramic
capacitor elements 12 face each other, and metal terminals 30a and
30b made of an Fe--Cr alloy are then connected to the monolithic
ceramic capacitor elements 12. Therefore, solder layers 26a and 26b
are disposed at portions in which the external electrodes of the
three monolithic ceramic capacitor elements 12 face each other and
portions in which the external electrodes of the bottom monolithic
ceramic capacitor element 12 and the metal terminals face each
other.
[0034] With respect to the monolithic capacitors constructed
according to examples of the first and second preferred embodiments
of the present invention and Comparative Examples 1 and 2, each was
preferably mounted on an aluminum substrate, thermal shock cycle
characteristics were observed, and the results thereof are shown in
Table 1. Herein, the defect rate (number of defects/total number)
was investigated in relation to the thermal shock cycle
characteristics when 250 cycles of thermal shock were applied and
when 500 cycles of thermal shock were applied, where a thermal
change of -55.degree. C. to 125.degree. C. was one thermal shock
cycle. A change (decrease) in electrostatic capacity of 10% or more
was considered to be a defect.
1 TABLE 1 Length of Thermal Shock Tip Section Cycle Characteristics
of Metal Material (number of defects/ Terminal for Metal total
number) (mm) Terminal 250 cycles 500 cycles Example 1 (FIG. 1) 2.5
Fe--Cr 0/36 0/36 Example 2 (FIG. 3) 7.0 Fe--Cr 0/36 0/36
Comparative 2.5 Fe--Cr 2/36 16/36 Example 1 (FIG. 4) Comparative
7.0 Fe--Cr 2/36 10/36 Example 2 (FIG. 6)
[0035] As is clear from Table 1, in Examples 1 and 2 constructed
according to the first and second preferred embodiments of the
present invention, in which solder layers were disposed on the
entire surfaces of the external electrodes of the monolithic
ceramic capacitor elements, the number of defects caused by thermal
shock was zero. In contrast, in Comparative Examples 1 and 2 in
which solder layers were partially formed on the surfaces of the
external electrodes of the monolithic ceramic capacitor elements,
defects occurred due to thermal shock.
[0036] This result occurred because when the external electrodes of
the monolithic ceramic capacitor elements are partially connected
by the solder layers, in the thermal shock cycle test, thermal
stress is concentrated at the joints and cracks occur in the joints
and the monolithic ceramic capacitor elements, resulting in a
decrease in electrostatic capacity. In contrast, when the solder
layers are disposed on the entire surfaces of the external
electrodes of the monolithic ceramic capacitor elements, thermal
stress is dispersed by the solder layers, and cracks are prevented
from occurring in the joints of the monolithic ceramic capacitor
elements and the monolithic ceramic capacitor elements, thus
improving thermal shock resistance.
[0037] Additionally, as in Examples 1 and 2 described above, when
the solder layers are disposed on the entire surfaces of the
external electrodes of a plurality of monolithic ceramic capacitor
elements, since the joining strength of the monolithic ceramic
capacitor elements is greatly improved, it is not necessary to form
the metal terminals corresponding to all the external electrodes of
the monolithic ceramic capacitor elements joined together.
[0038] Furthermore, as in Examples 1 and 2 described above, since
the tip section of the metal terminal imparts spring
characteristics to the metal terminal, it is possible to decrease
the difference in thermal expansion between the monolithic ceramic
capacitor elements and the substrate on which the monolithic
capacitor is mounted. Also, since the film which is resistant to
soldering is formed on the internal surface of the metal terminal,
the spring characteristics of the metal terminal is not impaired
due to the solder attached to the internal surface of the metal
terminal.
[0039] FIG. 7 is a perspective view of a monolithic capacitor
according to a third preferred embodiment of the present invention.
A monolithic capacitor 10 shown in FIG. 7 preferably has
substantially the same structure as that of the monolithic
capacitor 10 shown in FIG. 1.
[0040] FIG. 8 is a perspective view of a monolithic capacitor
according to a fourth preferred embodiment of the present
invention. In a monolithic capacitor 10 shown in FIG. 8, differing
from the monolithic capacitor 10 shown in FIG. 7, the vertical
lengths of tip sections 34a and 34b of metal terminals 30a and 30b,
preferably made of an Fe--Cr alloy, are about 5.1 mm, which is
substantially equal to the height of two monolithic ceramic
capacitor elements 12 joined together. Accordingly, the vertical
lengths of middle sections 32a and 32b of the metal terminals 30a
and 30b are longer.
[0041] FIG. 9 is a perspective view of a monolithic capacitor
according to a fifth preferred embodiment of the present invention.
A monolithic capacitor 10 shown in FIG. 9 preferably has
substantially the same structure as that of the monolithic
capacitor 10 shown in FIG. 3.
[0042] FIG. 10 is a perspective view of a monolithic capacitor
according to a sixth preferred embodiment of the present invention.
In a monolithic capacitor 10 shown in FIG. 10, differing from the
monolithic capacitor 10 shown in FIG. 9, the vertical lengths of
tip sections 34a and 34b of metal terminals 30a and 30b are about
10.1 mm, which is longer than the height of three monolithic
ceramic capacitor elements 12 joined together. Accordingly, the
vertical lengths of the middle sections 32a and 32b are longer.
[0043] FIG. 11 is a perspective view of a monolithic capacitor
according to a third comparative example. In a monolithic capacitor
11 shown in FIG. 11, in contrast to the monolithic capacitors 10
shown in FIGS. 7 to 10, metal terminals 30a and 30b are not
provided.
[0044] With respect to the monolithic capacitors in Examples 3, 4,
5, and 6, which are examples of various preferred embodiments of
the present invention, and Comparative Example 3, equivalent series
resistance (ESR) and equivalent series inductance (ESL) were
measured, deflection was measured when each monolithic capacitor
was mounted on a glass epoxy substrate, and thermal shock cycle
characteristics were observed when each monolithic capacitor was
mounted on an aluminum substrate. The results thereof are shown in
Table 2. ESR was measured at 100 kHz and 400 kHz, and ESL was
measured at 10 MHz. With respect to the thermal shock cycle
characteristics, the defect rate (number of defects/total number of
testing) was investigated when 250 cycles of thermal shock were
applied, where a thermal change of -55.degree. C. to 125.degree. C.
was one thermal shock cycle. A change (decrease) in electrostatic
capacity of 10% or more was considered to be a defect.
2 TABLE 2 Length of Thermal Shock Cycle Tip Section Characteristics
of Metal Material ESR at ESR at ESL at (number of Terminal for
Metal 100 kHz 400 kHz 10 MHz Deflection defects/total (mm) Terminal
(m.OMEGA.) (m.OMEGA.) (nH) (mm) number) Example 3 2.5 Fe-Cr 5.9 6.4
1.3 4.2 0/36 (FIG. 7) Example 4 5.1 Fe-Cr 7.2 7.6 1.6 7 or more
0/36 (FIG. 8) Example 5 7.0 Fe-Cr 9.0 9.8 2.0 7 or more 0/36 (FIG.
9) Example 6 10.1 Fe-Cr 15.0 15.9 3.2 7 or more 0/36 (FIG. 10)
Comparative 3.0 0.1 0.8 1.5 36/36 Example 3 (FIG. 11)
[0045] As is clear from Table 2, when the metal terminal made of
the Fe--Cr alloy is used, by setting the vertical length of the tip
section of the metal terminal to be about 5.1 mm, an increase in
ESR and ESL is minimized and the deflection and thermal shock cycle
characteristics are greatly improved.
[0046] With respect to the monolithic capacitors in Examples 3, 4,
5, and 6 and Comparative Example 3, in which the metal terminals
were made of brass, ESR and ESL were measured, deflection was
measured when each monolithic capacitor was mounted on a glass
epoxy substrate, and thermal shock cycle characteristics were
observed when each monolithic capacitor was mounted on an aluminum
substrate. The results thereof are shown in Table 3.
3 TABLE 3 Length of Thermal Shock Cycle Tip Section Characteristics
of Metal Material ESR at ESR at ESL at (number of Terminal for
Metal 100 kHz 400 kHz 10 MHz Deflection defects/total (mm) Terminal
(m.OMEGA.) (m.OMEGA.) (nH) (mm) number) Example 3 2.5 Brass 3.3 3.1
1.0 4.2 2/36 (FIG. 7) Example 4 5.1 Brass 3.6 3.1 1.2 7 or more
0/36 (FIG. 8) Example 5 7.0 Brass 3.7 3.1 1.5 7 or more 0/36 (FIG.
9) Example 6 10.1 Brass 4.8 3.1 2.2 7 or more 0/36 (FIG. 10)
Comparative 3.0 0.1 0.8 1.5 36/36 Example 3 (FIG. 11)
[0047] As is obvious from Table 3, when the metal terminal made of
brass is used, although the thermal shock cycle characteristics are
slightly degraded, ESR can be further decreased.
[0048] In the monolithic capacitors described above, if the length
of the metal terminal is increased, ESR and ESL are increased,
which may be disadvantageous. Therefore, the length of the metal
terminal is preferably as short as possible. On the other hand,
with respect to a feedback control circuit of a DC-DC converter,
ESR is optimally constant in the frequency band to be adjusted,
approximately, at several milli-ohms to about 10 m.OMEGA.. If the
monolithic capacitor in accordance with various preferred
embodiments of the present invention and a method for manufacturing
the same are used, the length of the metal terminal can be greatly
decreased, and accurate adjustment and control can be performed by
adjusting the length of the metal terminal so as to satisfy the
conditions described above.
[0049] That is, in accordance with various preferred embodiments of
the present invention, it is possible to set the length of the
metal terminal at the minimum required for thermal shock cycle
characteristics and bending strength, and thus, ESR and ESL can be
greatly decreased. In accordance with various preferred embodiments
of the present invention, by adjusting the resistance and the
length of the metal terminal, a monolithic capacitor having a
required ESR can be easily and accurately manufactured.
[0050] FIG. 12 is a perspective view of a monolithic capacitor
according to a seventh preferred embodiment of the present
invention. In a monolithic capacitor 10 shown in FIG. 12, differing
from the monolithic capacitor 10 shown in FIG. 1, cut-outs 40a and
40b are provided in the approximate centers in the width direction
of middle sections 32a and 32b of metal terminals 30a and 30b,
respectively. By providing the cut-outs 40a and 40b in the metal
terminals 30a and 30b, the reactance component of the metal
terminals 30a and 30b can be adjusted. Furthermore, as shown in
FIG. 12, in the metal terminal 30a, a first portion of an end
section 36a divided by the cut-out 40a and a second portion are
connected to pattern electrodes P1 and P2, respectively, and in the
metal terminal 30b, a first portion of an end section 36b divided
by the cut-out 40b and a second portion are connected to pattern
electrodes P3 and P4, respectively. Since electric currents flow in
opposite directions in the first and second portions of the middle
section 32b (32a) divided by the cut-out 40b (40a) of the metal
terminal 30b (30a) so that magnetic flux is cancelled, ESL can be
greatly decreased. Additionally, the cut-outs 40a and 40b are not
necessarily formed in the approximate centers of the middle
sections 32a and 32b of the metal terminals 30a and 30b, and may be
formed in other regions of the metal terminals 30a and 30b. Also, a
plurality of cut-outs may be formed.
[0051] Although three monolithic ceramic capacitor elements are
used in the individual examples of preferred embodiments of the
present invention as described above, two or at least four
monolithic ceramic capacitor elements may be used in the present
invention.
[0052] Although the external electrode of the monolithic ceramic
capacitor element has a three-layered structure including a Cu
layer, an Ni layer, and an Sn layer in the individual examples of
preferred embodiments of the present invention as described above,
the external electrode may have other structural arrangements as
long as it is solderable.
[0053] Furthermore, in various preferred embodiments of the present
invention, in order to improve the joining strength between the
plurality of monolithic ceramic capacitor elements, a resin for
joining may be inserted in the approximate centers between the
monolithic ceramic capacitor elements.
[0054] The material for the metal terminal is not limited to the
Fe--Cr alloy, or brass, and Ag, Ni, Cu, Fe, and Cr, or an alloy
thereof, or other suitable material, may be used.
[0055] In accordance with various preferred embodiments of the
present invention, a monolithic capacitor having high thermal shock
resistance can be obtained. Also, in accordance with various
preferred embodiments of the present invention, an increase in ESR
and ESL can be avoided.
[0056] While the invention has been described with reference to
preferred embodiments thereof, many modifications and variations of
the present invention are possible in light of the above teachings.
It is therefore to be understood that within the scope of the
appended claims, the invention may be practiced otherwise than as
specifically described.
* * * * *