loadpatents
Patent applications and USPTO patent grants for Nakagawa; Takuji.The latest application filed is for "release film".
Patent | Date |
---|---|
Release film Grant 10,982,118 - Ueda , et al. April 20, 2 | 2021-04-20 |
Release Film App 20190390088 - UEDA; Hiroaki ;   et al. | 2019-12-26 |
Band-pass filter and method for making photonic crystal for the band-pass filter Grant 8,149,073 - Nakagawa April 3, 2 | 2012-04-03 |
Method for manufacturing three-dimensional photonic structure Grant 7,682,551 - Nakagawa , et al. March 23, 2 | 2010-03-23 |
Band-pass Filter And Method For Making Photonic Crystal For The Band-pass Filter App 20090034900 - Nakagawa; Takuji | 2009-02-05 |
Three-dimensional periodic structure and method for producing the same Grant 7,303,626 - Kirihara , et al. December 4, 2 | 2007-12-04 |
Three-dimensional periodic structure and method for producing the same App 20060011126 - Kirihara; Soshu ;   et al. | 2006-01-19 |
Photonic three-dimensional structure and method for production thereof App 20050285115 - Nakagawa, Takuji ;   et al. | 2005-12-29 |
Three dimensional periodic structure and method of producing the same App 20050221100 - Kirihara, Soshu ;   et al. | 2005-10-06 |
Monolithic capacitor Grant 6,433,992 - Nakagawa , et al. August 13, 2 | 2002-08-13 |
Ceramic electronic component Grant 6,388,864 - Nakagawa , et al. May 14, 2 | 2002-05-14 |
Ceramic electronic component Grant 6,381,117 - Nakagawa , et al. April 30, 2 | 2002-04-30 |
Monolithic capacitor App 20010007522 - Nakagawa, Takuji ;   et al. | 2001-07-12 |
Ceramic electronic part and mounting structure for the same Grant 6,201,683 - Yamada , et al. March 13, 2 | 2001-03-13 |
Ceramic electronic component Grant 6,181,544 - Nakagawa , et al. January 30, 2 | 2001-01-30 |
Ceramic electronic part having u-shape terminals Grant 6,046,902 - Nakagawa , et al. April 4, 2 | 2000-04-04 |
Method of preparing InSb thin film Grant 5,494,711 - Takeda , et al. February 27, 1 | 1996-02-27 |
Magnetoresistance element Grant 5,432,494 - Inoue , et al. July 11, 1 | 1995-07-11 |
Method of manufacturing laminated ceramic electronic component Grant 5,009,744 - Mandai , et al. April 23, 1 | 1991-04-23 |
Structure of copper conductor and method of forming same Grant 4,833,004 - Senda , et al. May 23, 1 | 1989-05-23 |
Method of forming electrodes of an electronic component of chip type for connecting to the external Grant 4,756,928 - Senda , et al. July 12, 1 | 1988-07-12 |
Thin-film resistor Grant 4,737,757 - Senda , et al. April 12, 1 | 1988-04-12 |
Ceramic capacitor Grant 4,604,676 - Senda , et al. August 5, 1 | 1986-08-05 |
Process of heat treating copper film on ceramic body and heat treating apparatus therefor Grant 4,402,494 - Senda , et al. September 6, 1 | 1983-09-06 |
Method of forming copper conductor Grant 4,328,048 - Senda , et al. May 4, 1 | 1982-05-04 |
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