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Chip scale package structure and method of forming the same
Grant 11,450,606 - Chi , et al. September 20, 2 | 2022-09-20 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,916,449 - Hsu , et al. February 9, 2 | 2021-02-09 |
Chip Scale Package Structure And Method Of Forming The Same
App 20200312732 - CHI; Yen-Yao ; et al. | 2020-10-01 |
Semiconductor package with rigid under bump metallurgy (UBM) stack
Grant 10,756,040 - Yu , et al. A | 2020-08-25 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20200176408 - Lin; Tzu-Hung ; et al. | 2020-06-04 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20200152479 - Hsu; Wen-Sung ; et al. | 2020-05-14 |
Chip Scale Package Structure And Method Of Forming The Same
App 20200091070 - Chi; Yen-Yao ; et al. | 2020-03-19 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,580,747 - Lin , et al. | 2020-03-03 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,573,616 - Lin , et al. Feb | 2020-02-25 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,573,536 - Hsu , et al. Feb | 2020-02-25 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,573,615 - Lin , et al. Feb | 2020-02-25 |
Semiconductor package
Grant 10,553,526 - Hsu , et al. Fe | 2020-02-04 |
Semiconductor package with embedded supporter and method for fabricating the same
Grant 10,340,198 - Yu , et al. | 2019-07-02 |
Semiconductor package
Grant 10,312,210 - Huang , et al. | 2019-06-04 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20190164780 - Hsu; Wen-Sung ; et al. | 2019-05-30 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,236,187 - Hsu , et al. | 2019-03-19 |
Chip package and package substrate
Grant 10,236,242 - Hsu , et al. | 2019-03-19 |
Semiconductor package and method for fabricating the same
Grant 10,217,716 - Yu , et al. Feb | 2019-02-26 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 10,115,604 - Hsu , et al. October 30, 2 | 2018-10-30 |
Chip package having a patterned conducting plate and a conducting pad with a recess
Grant 10,074,581 - Hsu , et al. September 11, 2 | 2018-09-11 |
Semiconductor Package With Rigid Under Bump Metallurgy (ubm) Stack
App 20180233474 - YU; Ta-Jen ; et al. | 2018-08-16 |
Semiconductor Package With Embedded Supporter And Method For Fabricating The Same
App 20180233425 - YU; Ta-Jen ; et al. | 2018-08-16 |
Semiconductor Package
App 20180233476 - Huang; Ching-Liou ; et al. | 2018-08-16 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20180166297 - Hsu; Wen-Sung ; et al. | 2018-06-14 |
Semiconductor package
Grant 9,972,593 - Huang , et al. May 15, 2 | 2018-05-15 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 9,922,844 - Hsu , et al. March 20, 2 | 2018-03-20 |
Chip Package And Package Substrate
App 20180076121 - HSU; Wen-Sung ; et al. | 2018-03-15 |
Semiconductor Package And Method For Fabricating The Same
App 20180076166 - Yu; Ta-Jen ; et al. | 2018-03-15 |
Manufacturing method of chip package and package substrate
Grant 9,852,973 - Hsu , et al. December 26, 2 | 2017-12-26 |
Manufacturing Method Of Chip Package And Package Substrate
App 20170186709 - HSU; Wen-Sung ; et al. | 2017-06-29 |
Semiconductor Package
App 20170186676 - HSU; Wen-Sung ; et al. | 2017-06-29 |
Semiconductor package
Grant 9,633,936 - Hsu , et al. April 25, 2 | 2017-04-25 |
Chip package, package substrate and manufacturing method thereof
Grant 9,627,311 - Hsu , et al. April 18, 2 | 2017-04-18 |
Semiconductor package
Grant 9,553,040 - Hsu , et al. January 24, 2 | 2017-01-24 |
Semiconductor package
Grant 9,520,349 - Hsu , et al. December 13, 2 | 2016-12-13 |
Chip Package Having A Patterned Conducting Plate And Method For Forming The Same
App 20160343632 - HSU; Wen-Sung ; et al. | 2016-11-24 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20160307861 - Lin; Tzu-Hung ; et al. | 2016-10-20 |
Chip package having a patterned conducting plate and method for forming the same
Grant 9,437,457 - Hsu , et al. September 6, 2 | 2016-09-06 |
Chip Package, Package Substrate And Manufacturing Method Thereof
App 20160219714 - HSU; Wen-Sung ; et al. | 2016-07-28 |
Chip package and method for forming the same
Grant 9,373,526 - Hsu , et al. June 21, 2 | 2016-06-21 |
Semiconductor Package
App 20160133594 - HUANG; Ching-Liou ; et al. | 2016-05-12 |
Semiconductor Package
App 20160111358 - HSU; Wen-Sung ; et al. | 2016-04-21 |
Semiconductor package and method for fabricating base for semiconductor package
Grant 9,177,899 - Lin , et al. November 3, 2 | 2015-11-03 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20150264814 - HSU; Wen-Sung ; et al. | 2015-09-17 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20150262840 - HSU; Wen-Sung ; et al. | 2015-09-17 |
Semiconductor Package
App 20150145127 - HSU; Wen-Sung ; et al. | 2015-05-28 |
Chip Package And Method For Forming The Same
App 20150087115 - HSU; Wen-Sung ; et al. | 2015-03-26 |
Chip Package And Method For Forming The Same
App 20150061117 - HSU; Wen-Sung ; et al. | 2015-03-05 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20140191396 - LIN; Tzu-Hung ; et al. | 2014-07-10 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20140151867 - LIN; Tzu-Hung ; et al. | 2014-06-05 |
Semiconductor Package And Method For Fabricating Base For Semiconductor Package
App 20140035095 - LIN; Tzu-Hung ; et al. | 2014-02-06 |
Semiconductor Package
App 20130256878 - HSU; Wen-Sung ; et al. | 2013-10-03 |
Methods of dicing a semiconductor structure
Grant 8,048,778 - Ku , et al. November 1, 2 | 2011-11-01 |
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