Wong; Kwong Hon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wong; Kwong Hon.The latest application filed is for "high-temperature stable gate structure with metallic electrode".

Company Profile

0.51.51

Wong; Kwong Hon - Hong Kong N/A HK
Wong; Kwong Hon - Wappingers Falls NY
Wong; Kwong Hon - Wappiners Falls NY
Wong; Kwong Hon - Wappinger Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pole mount for communication device Grant D730,331 - Wong , et al. May 26, 2	2015-05-26
Self-aligned contact combined with a replacement metal gate/high-K gate dielectric Grant 8,481,415 - Yuan , et al. July 9, 2	2013-07-09
Structure and method for MOSFET gate electrode landing pad Grant 8,304,912 - Clevenger , et al. November 6, 2	2012-11-06
Modified via bottom structure for reliability enhancement Grant 7,906,428 - Clevenger , et al. March 15, 2	2011-03-15
Method of forming nitride films with high compressive stress for improved PFET device performance Grant 7,804,136 - Conti , et al. September 28, 2	2010-09-28
High-temperature stable gate structure with metallic electrode Grant 7,683,418 - Park , et al. March 23, 2	2010-03-23
Method of fabricating a microelectromechanical system (MEMS) switch Grant 7,657,995 - Hsu , et al. February 9, 2	2010-02-09
Structure and method for MOSFET gate electrode landing pad Grant 7,528,065 - Clevenger , et al. May 5, 2	2009-05-05
High-temperature Stable Gate Structure With Metallic Electrode App 20090101993 - Park; Dae-Gyu ; et al.	2009-04-23
Method of forming nitride films with high compressive stress for improved PFET device performance Grant 7,491,660 - Conti , et al. February 17, 2	2009-02-17
Interconnect structures with encasing cap and methods of making thereof Grant 7,488,677 - Wong , et al. February 10, 2	2009-02-10
Interconnect Structures With Encasing Cap And Methods Of Making Thereof App 20080318415 - Wong; Kwong Hon ; et al.	2008-12-25
Method of forming nitride films with high compressive stress for improved PFET device performance Grant 7,462,527 - Conti , et al. December 9, 2	2008-12-09
Modified Via Bottom Structure For Reliability Enhancement App 20080220608 - Clevenger; Lawrence A. ; et al.	2008-09-11
Method to Fabricate Passive Components Using Conductive Polymer App 20080171418 - Clevenger; Lawrence A. ; et al.	2008-07-17
Structure and Method for Mosfet Gate Electrode Landing Pad App 20080164525 - Clevenger; Lawrence A. ; et al.	2008-07-10
Structure and method of fabricating a hinge type MEMS switch Grant 7,348,870 - Hsu , et al. March 25, 2	2008-03-25
Method Of Forming Nitride Films With High Compressive Stress For Improved Pfet Device Performance App 20080045039 - Conti; Richard A. ; et al.	2008-02-21
Method Of Forming Nitride Films With High Compressive Stress For Improved Pfet Device Performance App 20080036007 - Conti; Richard A. ; et al.	2008-02-14
Structure And Method Of Fabricating A Hinge Type Mems Switch App 20080014663 - Hsu; Louis ; et al.	2008-01-17
Modified Via Bottom Structure For Reliability Enhancement App 20070281469 - Clevenger; Lawrence A. ; et al.	2007-12-06
High-temperature Stable Gate Structure With Metallic Electrode App 20070262348 - Park; Dae-Gyu ; et al.	2007-11-15
Modified via bottom structure for reliability enhancement Grant 7,282,802 - Clevenger , et al. October 16, 2	2007-10-16
High-temperature stable gate structure with metallic electrode Grant 7,279,413 - Park , et al. October 9, 2	2007-10-09
Adhesion layer for Pt on SiO.sub.2 Grant 7,270,884 - Lian , et al. September 18, 2	2007-09-18
Method For Enhanced Uni-directional Diffusion Of Metal And Subsequent Silicide Formation App 20070128867 - Domenicucci; Anthony G. ; et al.	2007-06-07
Method of forming low resistance and reliable via in inter-level dielectric interconnect Grant 7,223,691 - Cabral, Jr. , et al. May 29, 2	2007-05-29
Method for enhanced uni-directional diffusion of metal and subsequent silicide formation Grant 7,208,414 - Domenicucci , et al. April 24, 2	2007-04-24
Method And Apparatus For Deposition & Formation Of Metal Silicides App 20070087541 - Giewont; Kenneth John ; et al.	2007-04-19
Thin film resistors of different materials Grant 7,193,500 - Chinthakindi , et al. March 20, 2	2007-03-20
Interconnect structures with encasing cap and methods of making thereof App 20070054489 - Wong; Kwong Hon ; et al.	2007-03-08
Method Of Forming Nitride Films With High Compressive Stress For Improved Pfet Device Performance App 20070007548 - Conti; Richard A. ; et al.	2007-01-11
Method to fabricate passive components using conductive polymer App 20060270098 - Clevenger; Lawrence A. ; et al.	2006-11-30
Method to fabricate passive components using conductive polymer Grant 7,112,502 - Clevenger , et al. September 26, 2	2006-09-26
Interconnect structures with encasing cap and methods of making thereof Grant 7,105,445 - Wong , et al. September 12, 2	2006-09-12
System level device for battery and integrated circuit integration Grant 7,088,074 - Clevenger , et al. August 8, 2	2006-08-08
Copper to aluminum interlayer interconnect using stud and via liner Grant 7,087,997 - Burrell , et al. August 8, 2	2006-08-08
Interconnect structures with encasing cap and methods of making thereof App 20060160349 - Wong; Kwong Hon ; et al.	2006-07-20
Early detection of contact liner integrity by chemical reaction Grant 7,078,247 - Bauer, Jr. , et al. July 18, 2	2006-07-18
Structure And Method Of Fabricating A Hinge Type Mems Switch App 20060145792 - Hsu; Louis C. ; et al.	2006-07-06
Apparatus and Method of Intelligent Multistage System Deactivation App 20060109117 - Hsu; Louis C. ; et al.	2006-05-25
Three-dimensional island pixel photo-sensor Grant 7,041,525 - Clevenger , et al. May 9, 2	2006-05-09
Integrated metal-insulator-metal capacitor and metal gate transistor Grant 7,041,552 - Clevenger , et al. May 9, 2	2006-05-09
Copper to aluminum interlayer interconnect using stud and via liner Grant 7,037,824 - Burrell , et al. May 2, 2	2006-05-02
Thin Film Resistors of Different Materials App 20060087400 - Chinthakindi; Anil K. ; et al.	2006-04-27
Modified via bottom structure for reliability enhancement App 20060081986 - Clevenger; Lawrence A. ; et al.	2006-04-20
Method of forming low resistance and reliable via in inter-level dielectric interconnect App 20060084256 - Cabral; Cyril JR. ; et al.	2006-04-20
Hybrid electronic mask Grant 7,023,528 - Hsu , et al. April 4, 2	2006-04-04
Structure And Method For Enhanced Uni-directional Diffusion Of Cobalt Silicide App 20060057844 - Domenicucci; Anthony G. ; et al.	2006-03-16
Electroplated interconnection structures on integrated circuit chips App 20060017169 - Andricacos; Panayotis Constantinou ; et al.	2006-01-26
High-temperature stable gate structure with metallic electrode App 20050282341 - Park, Dae-Gyu ; et al.	2005-12-22
Shared on-chip decoupling capacitor and heat-sink devices Grant 6,967,416 - Clevenger , et al. November 22, 2	2005-11-22
Method to fabricate passive components using conductive polymer Grant 6,958,522 - Clevenger , et al. October 25, 2	2005-10-25
Electroplated interconnection structures on integrated circuit chips Grant 6,946,716 - Andricacos , et al. September 20, 2	2005-09-20
Polymer thin-film transistor with contact etch stops Grant 6,911,354 - Breen , et al. June 28, 2	2005-06-28
Metal spacer gate for CMOS FET Grant 6,909,145 - Cabral, Jr. , et al. June 21, 2	2005-06-21
Method and apparatus for deposition & formation of metal silicides App 20050067745 - Giewont, Kenneth John ; et al.	2005-03-31
Planar polymer transistor Grant 6,864,504 - Breen , et al. March 8, 2	2005-03-08
CMP slurry additive for foreign matter detection Grant 6,857,434 - Wong , et al. February 22, 2	2005-02-22
Early Detection Of Contact Liner Integrity By Chemical Reaction App 20050010455 - Bauer, Lawrence JR. ; et al.	2005-01-13
Electroplated interconnection structures on integrated circuit chips App 20040229456 - Andricacos, Panayotis Constantinou ; et al.	2004-11-18
Three-dimensional island pixel photo-sensor App 20040227061 - Clevenger, Lawrence A. ; et al.	2004-11-18
Copper to aluminum interlayer interconnect using stud and via liner App 20040207092 - Burrell, Lloyd G. ; et al.	2004-10-21
Adhesion layer for Pt on SiO2 App 20040197984 - Lian, Jingyu ; et al.	2004-10-07
Method to fabricate passive components using conductive polymer App 20040195654 - Clevenger, Lawrence A. ; et al.	2004-10-07
Adhesion layer for Pt on SiO2 App 20040197576 - Lian, Jingyu ; et al.	2004-10-07
Integrated metal-insulator-metal capacitor and metal gate transistor Grant 6,787,836 - Clevenger , et al. September 7, 2	2004-09-07
Integrated metal-insulator-metal capacitor and metal gate transistor App 20040166626 - Clevenger, Lawrence A. ; et al.	2004-08-26
Semiconductor chip using both polysilicon and metal gate devices Grant 6,777,761 - Clevenger , et al. August 17, 2	2004-08-17
Structure and method for shadow mask electrode Grant 6,768,063 - Clevenger , et al. July 27, 2	2004-07-27
Polymer thin-film transistor with contact etch stops App 20040108569 - Breen, Tricia L. ; et al.	2004-06-10
Liner with poor step coverage to improve contact resistance in W contacts Grant 6,734,097 - Iggulden , et al. May 11, 2	2004-05-11
Three-dimensional island pixel photo-sensor Grant 6,720,595 - Clevenger , et al. April 13, 2	2004-04-13
Metal spacer gate for CMOS FET App 20040056285 - Cabral, Cyril JR. ; et al.	2004-03-25
Method of making electroplated interconnection structures on integrated circuit chips Grant 6,709,562 - Andricacos , et al. March 23, 2	2004-03-23
Integrated metal-insulator-metal capacitor and metal gate transistor App 20040038474 - Clevenger, Lawrence A. ; et al.	2004-02-26
Semiconductor chip using both polysilicon and metal gate devices App 20040026734 - Clevenger, Lawrence A. ; et al.	2004-02-12
Low Cu percentages for reducing shorts in AlCu lines App 20040020891 - Iggulden, Roy C. ; et al.	2004-02-05
Shared on-chip decoupling capacitor and heat-sink devices App 20040007918 - Clevenger, Lawrence A. ; et al.	2004-01-15
Polymer thin-film transistor with contact etch stops Grant 6,664,576 - Breen , et al. December 16, 2	2003-12-16
Hybrid electronic mask App 20030228541 - Hsu, Louis L. ; et al.	2003-12-11
Ti liner for copper interconnect with low-k dielectric Grant 6,661,097 - Clevenger , et al. December 9, 2	2003-12-09
Planar polymer transistor App 20030222312 - Breen, Tricia L. ; et al.	2003-12-04
Method of forming a planar polymer transistor using substrate bonding techniques Grant 6,620,657 - Breen , et al. September 16, 2	2003-09-16
CMP slurry additive for foreign matter detection App 20030139048 - Wong, Kwong Hon ; et al.	2003-07-24
Method Of Forming A Planar Polymer Transistor Using Substrate Bonding Techniques App 20030134487 - Breen, Tricia L. ; et al.	2003-07-17
System Level Battery Integration System App 20030122522 - Clevenger, Lawrence A. ; et al.	2003-07-03
Liner with poor step coverage to improve contact resistance in W contacts App 20030068894 - Iggulden, Roy C. ; et al.	2003-04-10
Chromium adhesion layer for copper vias in low-k technology Grant 6,539,625 - Engel , et al. April 1, 2	2003-04-01
Structure and method for shadow mask electrode App 20030042043 - Clevenger, Lawrence A. ; et al.	2003-03-06
Three-dimensional island pixel photo-sensor App 20030025138 - Clevenger, Lawrence A. ; et al.	2003-02-06
Method to fabricate passive components using conductive polymer App 20030006478 - Clevenger, Lawrence A. ; et al.	2003-01-09
Method for producing a flat interface for a metal-silicon contact barrier film App 20020180046 - Wang, Yun-Yu ; et al.	2002-12-05
Copper to aluminum interlayer interconnect using stud and via liner App 20020127846 - Burrell, Lloyd G. ; et al.	2002-09-12
Semi-insulating diffusion barrier for low-resistivity gate conductors Grant 6,444,516 - Clevenger , et al. September 3, 2	2002-09-03
Chromium adhesion layer for copper vias in low-k technology App 20020088117 - Engel, Brett H. ; et al.	2002-07-11
Conversion of amorphous layer produced during IMP Ti deposition Grant 6,387,790 - Domenicucci , et al. May 14, 2	2002-05-14
Copper vias in low-k technology Grant 6,383,929 - Boettcher , et al. May 7, 2	2002-05-07
Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film Grant 6,022,801 - Domenicucci , et al. February 8, 2	2000-02-08
Vertical paddle plating cell Grant 5,516,412 - Andricacos , et al. May 14, 1	1996-05-14