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Power semiconductor packaging method and structure
Grant 7,829,386 - Fillion , et al. November 9, 2 | 2010-11-09 |
Piezoelectric composite apparatus and related methods
Grant 7,696,676 - Berkcan , et al. April 13, 2 | 2010-04-13 |
Broad band energy harvesting system and related methods
Grant 7,667,375 - Berkcan , et al. February 23, 2 | 2010-02-23 |
Method of making devices for solid state thermal transfer and power generation
Grant 7,572,973 - Weaver, Jr. , et al. August 11, 2 | 2009-08-11 |
Broad band energy harvesting system and related methods
App 20090167110 - Berkcan; Ertugrul ; et al. | 2009-07-02 |
Etchant, method of etching, laminate formed thereby, and device
Grant 7,527,742 - Tysoe , et al. May 5, 2 | 2009-05-05 |
Devices For Thermal Transfer And Power Generation And System And Method Incorporating Same
App 20090078298 - Weave, JR.; Stanton Earl ; et al. | 2009-03-26 |
Device for solid state thermal transfer and power generation
Grant 7,498,507 - Weaver, Jr. , et al. March 3, 2 | 2009-03-03 |
Thermotunneling Refrigeration System
App 20090031733 - Weaver, JR.; Stanton Earl ; et al. | 2009-02-05 |
Monolithic array for solid state ultraviolet light emitters
Grant 7,482,634 - Wojnarowski , et al. January 27, 2 | 2009-01-27 |
Power Semiconductor Packaging Method And Structure
App 20080305582 - Fillion; Raymond Albert ; et al. | 2008-12-11 |
Piezoelectric composite apparatus and related methods
App 20080143216 - Berkcan; Ertugrul ; et al. | 2008-06-19 |
Power semiconductor packaging method and structure
Grant 7,262,444 - Fillion , et al. August 28, 2 | 2007-08-28 |
Power semiconductor packaging method and structure
App 20070040186 - Fillion; Raymond Albert ; et al. | 2007-02-22 |
Pressure sensor
App 20070000330 - Tysoe; Steven Alfred ; et al. | 2007-01-04 |
Etchant, method of etching, laminate formed thereby, and device
App 20060289386 - Tysoe; Steven Alfred ; et al. | 2006-12-28 |
Device for thermal transfer and power generation and system and method incorporating same
App 20060207643 - Weaver; Stanton Earl JR. ; et al. | 2006-09-21 |
Monolithic array for solid state ultraviolet light emitters
App 20060071219 - Wojnarowski; Robert John ; et al. | 2006-04-06 |
Direct CsI scintillator coating for improved digital X-ray detector assembly longevity
Grant 7,005,648 - Baumgartner , et al. February 28, 2 | 2006-02-28 |
Direct Csi Scintillator Coating For Improved Digital X-ray Detector Assembly Longevity
App 20050285045 - Baumgartner, Charles Edward ; et al. | 2005-12-29 |
Direct CsI scintillator coating for improved digital X-ray detector assembly longevity
Grant 6,720,561 - Baumgartner , et al. April 13, 2 | 2004-04-13 |
Method for fabricating a switch structure
Grant 6,655,011 - Kornrumpf , et al. December 2, 2 | 2003-12-02 |
High temperature circuit apparatus
Grant 6,603,145 - Wojnarowski , et al. August 5, 2 | 2003-08-05 |
Direct CsI scintillator coating for improved digital X-ray detector assembly longevity
App 20030107001 - Baumgartner, Charles Edward ; et al. | 2003-06-12 |
Methods of fabrication of electronic interface structures
App 20030057515 - Fillion, Raymond Albert ; et al. | 2003-03-27 |
Electronic interface structures and methods of fabrication
Grant 6,507,113 - Fillion , et al. January 14, 2 | 2003-01-14 |
Alignment of optical interfaces for data communication
Grant 6,474,860 - Wojnarowski , et al. November 5, 2 | 2002-11-05 |
High temperature circuit apparatus
App 20020121691 - Wojnarowski, Robert John ; et al. | 2002-09-05 |
Light source including an array of light emitting semiconductor devices and control method
Grant 6,412,971 - Wojnarowski , et al. July 2, 2 | 2002-07-02 |
Circuit chip package and fabrication method
Grant 6,396,153 - Fillion , et al. May 28, 2 | 2002-05-28 |
Alignment of optical interfaces for data communication
App 20010033497 - Wojnarowski, Robert John ; et al. | 2001-10-25 |
Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas
Grant 6,298,551 - Wojnarowski , et al. October 9, 2 | 2001-10-09 |
Alignment of optical interfaces for data communication
Grant 6,272,271 - Wojnarowski , et al. August 7, 2 | 2001-08-07 |
Circuit chip package and fabrication method
App 20010009779 - Fillion, Raymond Albert ; et al. | 2001-07-26 |
Electromagnetic system for railroad track crack detection and traction enhancement
Grant 6,262,573 - Wojnarowski , et al. July 17, 2 | 2001-07-17 |
Circuit chip package and fabrication method
Grant 6,242,282 - Fillion , et al. June 5, 2 | 2001-06-05 |
Semiconductor interconnect structure for high temperature applications
Grant 6,229,203 - Wojnarowski May 8, 2 | 2001-05-08 |
Switching structure and method of fabrication
Grant 6,188,301 - Kornrumpf , et al. February 13, 2 | 2001-02-13 |
Flexible interface structures for electronic devices
Grant 6,092,280 - Wojnarowski July 25, 2 | 2000-07-25 |
Interface structures for electronic devices
Grant 6,046,410 - Wojnarowski , et al. April 4, 2 | 2000-04-04 |
Method for fabricating a thin film inductor
Grant 6,040,226 - Wojnarowski , et al. March 21, 2 | 2000-03-21 |
Electronic device pad relocation, precision placement, and packaging in arrays
Grant 6,002,163 - Wojnarowski December 14, 1 | 1999-12-14 |
Semiconductor interconnect structure for high temperature applications
Grant 5,949,133 - Wojnarowski September 7, 1 | 1999-09-07 |
Interface structures for electronic devices
Grant 5,900,674 - Wojnarowski , et al. May 4, 1 | 1999-05-04 |
Integrated circuit test structure and test process
Grant 5,897,728 - Cole , et al. April 27, 1 | 1999-04-27 |
Electronic device pad relocation, precision placement, and packaging in arrays
Grant 5,888,884 - Wojnarowski March 30, 1 | 1999-03-30 |
Method for fabricating a thin film capacitor
Grant 5,872,040 - Wojnarowski , et al. February 16, 1 | 1999-02-16 |
High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
Grant 5,866,952 - Wojnarowski , et al. February 2, 1 | 1999-02-02 |
Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography
Grant 5,737,458 - Wojnarowski , et al. April 7, 1 | 1998-04-07 |
Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
Grant 5,703,400 - Wojnarowski , et al. December 30, 1 | 1997-12-30 |
Method for fabricating a thin film resistor
Grant 5,683,928 - Wojnarowski , et al. November 4, 1 | 1997-11-04 |
Semiconductor interconnect method and structure for high temperature applications
Grant 5,672,546 - Wojnarowski September 30, 1 | 1997-09-30 |
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