WANG; Soon Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for WANG; Soon Wei.The latest application filed is for "silicon-on-insulator die support structures and related methods".
Company Profile
25.25.30
- WANG; Soon Wei - Seremban MY
- - Seremban MY
- Wang; Soon Wei - Negeri Sembilan N/A MY
Patent Activity
| Patent | Date |
|---|---|
| Silicon-on-insulator Die Support Structures And Related Methods App 20220301876 - SEDDON; Michael J. ; et al. | 2022-09-22 |
| Semiconductor Packages With Die Including Cavities And Related Methods App 20220246434 - SEDDON; Michael J. ; et al. | 2022-08-04 |
| Semiconductor packages with thin die and related methods Grant 11,404,276 - Carney , et al. August 2, 2 | 2022-08-02 |
| Die sidewall coatings and related methods Grant 11,404,277 - Carney , et al. August 2, 2 | 2022-08-02 |
| Backmetal Removal Methods App 20220238342 - SEDDON; Michael J. ; et al. | 2022-07-28 |
| Semiconductor Package With Wettable Flank And Related Methods App 20220208658 - LER; Hui Min ; et al. | 2022-06-30 |
| Silicon-on-insulator die support structures and related methods Grant 11,361,970 - Seddon , et al. June 14, 2 | 2022-06-14 |
| Backmetal removal methods Grant 11,348,796 - Seddon , et al. May 31, 2 | 2022-05-31 |
| Semiconductor packages with die including cavities and related methods Grant 11,342,189 - Seddon , et al. May 24, 2 | 2022-05-24 |
| Ultra-thin Multichip Power Devices App 20210183799 - MANAP; Nurul Nadiah ; et al. | 2021-06-17 |
| Method for forming a semiconductor package Grant 10,971,429 - Prajuckamol , et al. April 6, 2 | 2021-04-06 |
| Ultra-thin multichip power devices Grant 10,930,604 - Manap , et al. February 23, 2 | 2021-02-23 |
| Quad Flat No Leads Package With Locking Feature App 20210043550 - WANG; Soon Wei ; et al. | 2021-02-11 |
| Molded wafer level packaging Grant 10,916,485 - Wang , et al. February 9, 2 | 2021-02-09 |
| Polymer Resin And Compression Mold Chip Scale Package App 20210028133 - LIN; Yusheng ; et al. | 2021-01-28 |
| Semiconductor Packages With Die Including Cavities And Related Methods App 20200365408 - SEDDON; Michael J. ; et al. | 2020-11-19 |
| Leadless Semiconductor Packages, Leadframes Therefor, And Methods Of Making App 20200365494 - TRUHITTE; Darrell D. ; et al. | 2020-11-19 |
| Polymer resin and compression mold chip scale package Grant 10,825,786 - Lin , et al. November 3, 2 | 2020-11-03 |
| Quad flat no leads package with locking feature Grant 10,825,754 - Wang , et al. November 3, 2 | 2020-11-03 |
| Backmetal Removal Methods App 20200286736 - SEDDON; Michael J. ; et al. | 2020-09-10 |
| Semiconductor Packages With Thin Die And Related Methods App 20200286735 - CARNEY; Francis J. ; et al. | 2020-09-10 |
| Die Sidewall Coatings And Related Methods App 20200279747 - CARNEY; Francis J. ; et al. | 2020-09-03 |
| Leadless semiconductor packages, leadframes therefor, and methods of making Grant 10,756,006 - Truhitte , et al. A | 2020-08-25 |
| Die Support Structures And Related Methods App 20200258750 - A1 | 2020-08-13 |
| Silicon-on-insulator Die Support Structures And Related Methods App 20200258751 - A1 | 2020-08-13 |
| Method For Forming A Semiconductor Package App 20200194340 - PRAJUCKAMOL; Atapol ; et al. | 2020-06-18 |
| Molded Wafer Level Packaging App 20200126880 - WANG; Soon Wei ; et al. | 2020-04-23 |
| Method for forming a semiconductor package Grant 10,607,921 - Prajuckamol , et al. | 2020-03-31 |
| Semiconductor package Grant 10,607,920 - Prajuckamol , et al. | 2020-03-31 |
| Molded wafer level packaging Grant 10,559,510 - Wang , et al. Feb | 2020-02-11 |
| Chip-on-lead Semiconductor Device Packages With Electrically Isolated Signal Leads App 20200035586A1 - | 2020-01-30 |
| Multi-chip packages with stabilized die pads Grant 10,438,877 - Palagud , et al. O | 2019-10-08 |
| Ultra-thin Multichip Power Devices App 20190304940 - MANAP; Nurul Nadiah ; et al. | 2019-10-03 |
| Multi-chip Packages With Stabilized Die Pads App 20190287884 - PALAGUD; Jose Felixminia ; et al. | 2019-09-19 |
| Polymer Resin And Compression Mold Chip Scale Package App 20190221532 - LIN; Yusheng ; et al. | 2019-07-18 |
| Polymer resin and compression mold chip scale package Grant 10,283,466 - Lin , et al. | 2019-05-07 |
| Leadless Semiconductor Packages, Leadframes Therefor, And Methods Of Making App 20190122967 - TRUHITTE; Darrell D. ; et al. | 2019-04-25 |
| Flexible Semiconductor Package And Related Methods App 20190103338 - PRAJUCKAMOL; Atapol ; et al. | 2019-04-04 |
| Flexible Semiconductor Package And Related Methods App 20190103337 - PRAJUCKAMOL; Atapol ; et al. | 2019-04-04 |
| Molded Wafer Level Packaging App 20190067143 - WANG; Soon Wei ; et al. | 2019-02-28 |
| Leadless semiconductor packages, leadframes therefor, and methods of making Grant 10,199,311 - Truhitte , et al. Fe | 2019-02-05 |
| Flexible semiconductor package Grant 10,177,074 - Prajuckamol , et al. J | 2019-01-08 |
| Quad Flat No Leads Package App 20180040539 - WANG; Soon Wei ; et al. | 2018-02-08 |
| Polymer Resin And Compression Mold Chip Scale Package App 20170345779 - LIN; Yusheng ; et al. | 2017-11-30 |
| Die support for enlarging die size Grant 9,748,163 - Wang , et al. August 29, 2 | 2017-08-29 |
| Leadless Semiconductor Packages, Leadframes Therefor, And Methods Of Making App 20170133302 - TRUHITTE; Darrell D. ; et al. | 2017-05-11 |
| Semiconductor Device And Method Of Forming An Alignment Structure In Backside Of A Semiconductor Die App 20170084545 - SEDDON; Michael J. ; et al. | 2017-03-23 |
| Chip scale packages and related methods Grant 9,281,258 - Fon , et al. March 8, 2 | 2016-03-08 |
| Semiconductor component and method of manufacture Grant 8,451,621 - Krishnan , et al. May 28, 2 | 2013-05-28 |
| Connector assembly and method of manufacture Grant 8,449,339 - Krishnan , et al. May 28, 2 | 2013-05-28 |
| Connector Assembly And Method Of Manufacture App 20120064781 - Krishnan; Shutesh ; et al. | 2012-03-15 |
| Semiconductor Component And Method Of Manufacture App 20120063107 - Krishnan; Shutesh ; et al. | 2012-03-15 |
| Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure Grant 7,939,380 - Krishnan , et al. May 10, 2 | 2011-05-10 |
| Method For Manufacturing A Semiconductor Component And Structure Therefor App 20090102028 - Krishnan; Shutesh ; et al. | 2009-04-23 |
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