loadpatents
name:-0.2982451915741
name:-0.081902027130127
name:-0.086324214935303
WANG; Lung-Yuan Patent Filings

WANG; Lung-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; Lung-Yuan.The latest application filed is for "method for fabricating assemble substrate".

Company Profile
2.9.20
  • WANG; Lung-Yuan - Taichung TW
  • Wang; Lung-Yuan - Taichung Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Fabricating Assemble Substrate
App 20220304157 - WANG; Lung-Yuan ;   et al.
2022-09-22
Electronic package, assemble substrate, and method for fabricating the assemble substrate
Grant 11,382,214 - Wang , et al. July 5, 2
2022-07-05
Electronic Package And Manufacturing Method Thereof
App 20220068867 - Kao; Feng ;   et al.
2022-03-03
Electronic Package, Manufacturing Method For The Same, And Electronic Structure
App 20220068801 - Kao; Feng ;   et al.
2022-03-03
Method For Fabricating Electronic Package
App 20220005786 - Wang; Lung-Yuan ;   et al.
2022-01-06
Electronic package and method for fabricating the same
Grant 11,152,331 - Wang , et al. October 19, 2
2021-10-19
Electronic Package, Assemble Substrate, And Method For Fabricating The Assemble Substrate
App 20210051800 - Wang; Lung-Yuan ;   et al.
2021-02-18
Electronic Package And Method For Fabricating The Same
App 20200388591 - Wang; Lung-Yuan ;   et al.
2020-12-10
Electronic package and method for fabricating the same
Grant 10,236,261 - Tsai , et al.
2019-03-19
Fabrication method of semiconductor package
Grant 10,163,662 - Chiang , et al. Dec
2018-12-25
Electronic Package And Method For Fabricating The Same
App 20180211925 - Tsai; Fang-Lin ;   et al.
2018-07-26
Fabrication Method Of Package On Package Structure
App 20180138158 - Tung; Shih-Hao ;   et al.
2018-05-17
Package on package structure and fabrication method thereof
Grant 9,905,546 - Tung , et al. February 27, 2
2018-02-27
Fabrication Method Of Semiconductor Package
App 20170207104 - Chiang; Cheng-Chia ;   et al.
2017-07-20
Semiconductor package and fabrication method thereof
Grant 9,646,921 - Chiang , et al. May 9, 2
2017-05-09
Method For Fabricating Semiconductor Package
App 20160233205 - Wang; Lung-Yuan ;   et al.
2016-08-11
Semiconductor package and fabrication method thereof
Grant 9,356,008 - Chiang , et al. May 31, 2
2016-05-31
Package on package structure and fabrication method thereof
Grant 9,343,387 - Hsu , et al. May 17, 2
2016-05-17
Semiconductor package and fabrication method thereof
Grant 9,343,421 - Wang , et al. May 17, 2
2016-05-17
Semiconductor Package And Fabrication Method Thereof
App 20160020195 - Chiang; Cheng-Chia ;   et al.
2016-01-21
Package On Package Structure And Fabrication Method Thereof
App 20150255360 - Hsu; Chu-Chi ;   et al.
2015-09-10
Semiconductor Package And Fabrication Method Thereof
App 20150200169 - Wang; Lung-Yuan ;   et al.
2015-07-16
Semiconductor Package And Fabrication Method Thereof
App 20150187722 - Chiang; Cheng-Chia ;   et al.
2015-07-02
Package On Package Structure And Fabrication Method Thereof
App 20150187741 - Tung; Shih-Hao ;   et al.
2015-07-02
Semiconductor Package And Fabrication Method Thereof And Substrate And Packaging Structure
App 20150123287 - Hsu; Chu-Chi ;   et al.
2015-05-07
Package Structure And Fabrication Method Thereof
App 20150102484 - Chen; Chia-Cheng ;   et al.
2015-04-16
Semiconductor Package And Fabrication Method Thereof
App 20150054150 - Hsiao; Cheng-Hsu ;   et al.
2015-02-26
Semiconductor Package And Fabrication Method Thereof
App 20150041972 - Shih; Chia-Kai ;   et al.
2015-02-12
Stacked Package And Method Of Fabricating The Same
App 20140367850 - Wang; Lung-Yuan
2014-12-18

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