Wang; Hougong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Hougong.The latest application filed is for "electrostatic chuck and method for manufacturing protrusions thereof".

Company Profile

11.19.21

Wang; Hougong - Beijing CN
Wang; Hougong - Pleasanton CA
Wang; Hougong - San Jose CA
Wang; Hougong - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Degassing chamber and semiconductor processing apparatus Grant 11,328,940 - Jia , et al. May 10, 2	2022-05-10
Electrostatic chuck and method for manufacturing protrusions thereof Grant 11,309,208 - Ye , et al. April 19, 2	2022-04-19
Electrostatic Chuck And Method For Manufacturing Protrusions Thereof App 20210005496 - YE; Hua ; et al.	2021-01-07
Annealing method, process chamber and annealing apparatus Grant 10,886,142 - Bai , et al. January 5, 2	2021-01-05
Magnetic thin film deposition chamber and thin film deposition apparatus Grant 10,622,145 - Yang , et al.	2020-04-14
Annealing Method, Process Chamber And Annealing Apparatus App 20190259628 - BAI; Zhimin ; et al.	2019-08-22
Magnetron and magnetron sputtering device Grant 10,381,202 - Yang , et al. A	2019-08-13
Magnetic Thin Film Deposition Chamber And Thin Film Deposition Apparatus App 20190244754 - YANG; Yujie ; et al.	2019-08-08
Magnetic Thin Film Laminated Structure Deposition Method, Magnetic Thin Film Laminated Structure And Micro-inductance Device App 20190244736 - YANG; Yujie ; et al.	2019-08-08
Degassing Chamber And Semiconductor Processing Apparatus App 20190221454 - JIA; Qiang ; et al.	2019-07-18
Degassing Method, Degassing Chamber, And Semiconductor Processing Apparatus App 20190218660 - YE; Hua ; et al.	2019-07-18
Hot plate and substrate processing equipment using the same Grant 10,287,686 - Zhao , et al.	2019-05-14
Magnetron And Magnetron Sputtering Device App 20170011894 - YANG; Yujie ; et al.	2017-01-12
Apparatuses and methods for atomic layer deposition Grant 8,747,556 - Lam , et al. June 10, 2	2014-06-10
Apparatuses And Methods For Atomic Layer Deposition App 20140087091 - Lam; Hyman W.H. ; et al.	2014-03-27
Vapour Chamber And Substrate Processing Equipment Using Same App 20130269614 - Zhao; Mengxin ; et al.	2013-10-17
Apparatuses and methods for atomic layer deposition Grant 8,293,015 - Lam , et al. October 23, 2	2012-10-23
Rotating Bed to Reduce the Risk of Developing Pressure Ulcers App 20120036637 - Wang; Hougong ; et al.	2012-02-16
Thin film deposition Grant 7,884,032 - Ye , et al. February 8, 2	2011-02-08
Physical Vapor Deposition Chamber Having An Adjustable Target App 20080116067 - Lavitsky; Ilya ; et al.	2008-05-22
Thin film deposition App 20070099438 - Ye; Mengqi ; et al.	2007-05-03
Physical vapor deposition chamber having a rotatable substrate pedestal App 20060096857 - Lavitsky; Ilya ; et al.	2006-05-11
Physical vapor deposition chamber having an adjustable target App 20060096851 - Lavitsky; Ilya ; et al.	2006-05-11
Semiconductor wafer preheating Grant 7,006,888 - Wang , et al. February 28, 2	2006-02-28
Method of application of electrical biasing to enhance metal deposition Grant 6,913,680 - Zheng , et al. July 5, 2	2005-07-05
Method and apparatus for processing substrates in a system having high and low pressure areas App 20040166697 - Wang, Hougong ; et al.	2004-08-26
Method and apparatus for processing substrates in a system having high and low pressure areas Grant 6,672,864 - Wang , et al. January 6, 2	2004-01-06
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature Grant 6,610,189 - Wang , et al. August 26, 2	2003-08-26
Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing App 20030131458 - Wang, Hougong ; et al.	2003-07-17
Semiconductor wafer preheating App 20030133773 - Wang, Hougong ; et al.	2003-07-17
Method and apparatus for processing substrates in a system having high and low pressure areas App 20030044742 - Wang, Hougong ; et al.	2003-03-06
Method of reducing particle density in a cool down chamber App 20030013312 - Wang, Hougong ; et al.	2003-01-16
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature App 20020084189 - Wang, Hougong ; et al.	2002-07-04
Reflow chamber and process Grant 6,299,689 - Wang , et al. October 9, 2	2001-10-09
Central coil design for ionized metal plasma deposition Grant 6,077,402 - Hong , et al. June 20, 2	2000-06-20
Thermally sprayable powder materials having an alloyed metal phase and a solid lubricant ceramic phase and abradable seal assemblies manufactured therefrom Grant 5,976,695 - Hajmrle , et al. November 2, 1	1999-11-02
Ceramic coated metallic insulator particularly useful in a plasma sputter reactor Grant 5,879,523 - Wang , et al. March 9, 1	1999-03-09

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