| Patent | Date |
|---|
Resin Molded Product Production Method, Molding Die, And Resin Molding Apparatus
App 20220262650 - NAKATSUKASA; Ryota | 2022-08-18 |
Plunger unit
Grant D956,833 - Ichihashi , et al. July 5, 2 | 2022-07-05 |
Resin Molding Apparatus And Method For Manufacturing Resin Molded Product
App 20220161475 - OKUNISHI; Yoshito ; et al. | 2022-05-26 |
Resin Molding Apparatus And Method For Manufacturing Resin Molded Product
App 20220161469 - OKUNISHI; Yoshito ; et al. | 2022-05-26 |
Method For Supplying Resin, Method For Manufacturing Resin Molded Product, And Resin Molding Apparatus
App 20220118656 - USHIO; Haruka ; et al. | 2022-04-21 |
Resin Molding Apparatus And Method Of Manufacturing Resin Molded Product
App 20220063149 - Yasui; Hayato ; et al. | 2022-03-03 |
Resin Leakage Prevention Member, Resin Leakage Prevention Member Supply Mechanism, Resin Molding Apparatus, And Method For Producing Resin Molded Product
App 20220063151 - YOSHIDA; Yusuke ; et al. | 2022-03-03 |
Resin Molding Apparatus And Method For Producing Resin Molded Product
App 20220063150 - Okamoto; Ryota ; et al. | 2022-03-03 |
Hollow Package And Method For Manufacturing Same
App 20220068737 - Naito; Tadashi ; et al. | 2022-03-03 |
Resin Molding Apparatus And Manufacturing Method Of Resin Molded Product
App 20220055261 - YASUI; Hayato ; et al. | 2022-02-24 |
Inspection Device, Resin Molding Apparatus, And Method Of Manufacturing Resin Molded Product
App 20220059377 - NORIKANE; Kazutaka ; et al. | 2022-02-24 |
Conveying Apparatus, Resin Molding Apparatus, Conveying Method, And Resin Molded Product Manufacturing Method
App 20210387385 - YOSHIDA; Syuhei | 2021-12-16 |
Conveying Apparatus, Resin Molding Apparatus, Conveying Method, And Resin Molded Product Manufacturing Method
App 20210370565 - YOSHIDA; Syuhei | 2021-12-02 |
Resin-molding device and method for producing resin-molded product
Grant 10,814,532 - Okunishi , et al. October 27, 2 | 2020-10-27 |
Tableting punch or die and tableting machine including the same
Grant 10,792,880 - Ogata , et al. October 6, 2 | 2020-10-06 |
Tableting Punch Or Die And Tableting Machine Including The Same
App 20190176428 - OGATA; Kenji ; et al. | 2019-06-13 |
Translucent Material, Low-adhesion Material, And Molding Member
App 20190077123 - FUJIWARA; Kunihiko ; et al. | 2019-03-14 |
Resin-molding Device And Method For Producing Resin-molded Product
App 20190001536 - OKUNISHI; Yoshito ; et al. | 2019-01-03 |
Resin sealing apparatus and resin sealing method
Grant 10,170,346 - Onishi , et al. J | 2019-01-01 |
Resin-molding Device, Resin-molding Method, And Method For Producing Resin-molded Product
App 20180243953 - SHIMODA; Yusuke ; et al. | 2018-08-30 |
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
Grant 9,728,426 - Okada , et al. August 8, 2 | 2017-08-08 |
Cutting device and cutting method
Grant 9,595,483 - Shirai , et al. March 14, 2 | 2017-03-14 |
Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member
Grant 9,580,827 - Okada , et al. February 28, 2 | 2017-02-28 |
Pair of working gloves
Grant D770,724 - Koga , et al. November 8, 2 | 2016-11-08 |
Cutting Device And Cutting Method
App 20160284612 - SHIRAI; Katsumasa ; et al. | 2016-09-29 |
Resin Sealing Apparatus And Resin Sealing Method
App 20160284576 - ONISHI; Yohei ; et al. | 2016-09-29 |
Molded Article Production System And Molded Article Production Method
App 20160151946 - TAKA; Takeaki ; et al. | 2016-06-02 |
Method For Producing Electronic Component, Bump-formed Plate-like Member, Electronic Component, And Method For Producing Bump-formed Plate-like Member
App 20160020187 - OKADA; Hirokazu ; et al. | 2016-01-21 |
Method For Producing Resin-encapsulated Electronic Component, Bump-formed Plate-like Member, Resin-encapsulated Electronic Component, And Method For Producing Bump-formed Plate-like Member
App 20150311095 - OKADA; Hirokazu ; et al. | 2015-10-29 |
Method Of Manufacturing Resin-encapsulated Electronic Component And Apparatus For Manufacturing Resin-encapsulated Electronic Component
App 20150017372 - Uragami; Hiroshi ; et al. | 2015-01-15 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
Grant 8,771,563 - Takase , et al. July 8, 2 | 2014-07-08 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
Grant 8,696,951 - Takase , et al. April 15, 2 | 2014-04-15 |
Compression molding method for electronic component and compression molding apparatus employed therefor
Grant 8,684,718 - Yamada , et al. April 1, 2 | 2014-04-01 |
Method transparent member, optical device using transparent member and method of manufacturing optical device
Grant 8,222,059 - Ashida July 17, 2 | 2012-07-17 |
Optical electronic component
Grant 8,193,558 - Takase , et al. June 5, 2 | 2012-06-05 |
Compression Resin Sealing And Molding Method For Electronic Component And Apparatus Therefor
App 20110233821 - Bandoh; Kazuhiko ; et al. | 2011-09-29 |
Compression Molding Method And Compression Molding Apparatus
App 20110193261 - Uragami; Hiroshi ; et al. | 2011-08-11 |
Method of resin-sealing and molding an optical device
Grant 7,985,357 - Takase , et al. July 26, 2 | 2011-07-26 |
Low-adhesion material, resin molding die, and soil resistant material
Grant 7,901,797 - Kuno , et al. March 8, 2 | 2011-03-08 |
Method of and apparatus for working structure
Grant 7,861,624 - Kunimatsu , et al. January 4, 2 | 2011-01-04 |
Glove And Manufacturing Method Thereof
App 20100325779 - Matsunobu; Kazutaka ; et al. | 2010-12-30 |
Method for manufacturing optical electronic component
Grant 7,811,491 - Takase , et al. October 12, 2 | 2010-10-12 |
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material
Grant 7,784,764 - Kuno , et al. August 31, 2 | 2010-08-31 |
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
Grant 7,732,037 - Kuno , et al. June 8, 2 | 2010-06-08 |
Transparent member, optical device using transparent member and method of manufacturing optical device
Grant 7,682,853 - Ashida March 23, 2 | 2010-03-23 |
Method Of Compression-molding Light-emitting Elements
App 20100065983 - Kawakubo; Kazuki | 2010-03-18 |
Method Of Forming Light Emitter And Molding Die
App 20100006215 - Kawakubo; Kazuki ; et al. | 2010-01-14 |
Resin sealing method for electronic part and mold used for the method
Grant 7,618,573 - Takase , et al. November 17, 2 | 2009-11-17 |
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
Grant 7,614,293 - Kuno , et al. November 10, 2 | 2009-11-10 |
Singulation Apparatus For Manufacturing Electronic Component
App 20090242524 - Amakawa; Tsuyoshi | 2009-10-01 |
System and method for supplying processing water
App 20090126543 - Kitagawa; Yasuyuki ; et al. | 2009-05-21 |
Abrasive Waterjet Type Cutting Apparatus
App 20090124178 - Ueyama; Yasuyuki ; et al. | 2009-05-14 |
Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material
App 20090107361 - Kuno; Takaki ; et al. | 2009-04-30 |
Resin encapsulation molding method for semiconductor device
Grant 7,439,101 - Shimonaka , et al. October 21, 2 | 2008-10-21 |
Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin
App 20080254286 - Kuno; Takaki ; et al. | 2008-10-16 |
Composite material and resin mold
Grant 7,407,146 - Kuno , et al. August 5, 2 | 2008-08-05 |
Resin molding apparatus
Grant 7,390,188 - Banjo , et al. June 24, 2 | 2008-06-24 |
Method of and apparatus for working structure
App 20080121078 - Kunimatsu; Shinya ; et al. | 2008-05-29 |
Jet singulation
Grant 7,357,694 - Popescu , et al. April 15, 2 | 2008-04-15 |
Resin mold material and resin mold
Grant 7,287,975 - Bandoh , et al. October 30, 2 | 2007-10-30 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
App 20070138696 - Takase; Shinji ; et al. | 2007-06-21 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
App 20070132135 - Takase; Shinji ; et al. | 2007-06-14 |
Cutting apparatus
Grant 7,207,868 - Takehara , et al. April 24, 2 | 2007-04-24 |
Resin sealing and molding method of electronic component
App 20070085237 - Onishi; Yohei | 2007-04-19 |
Method of resin-seal-molding electronic component and apparatus therefor
App 20070072346 - Maeda; Keiji | 2007-03-29 |
Method of resin-seal-molding electronic component and apparatus therefor
App 20070069421 - Maeda; Keiji | 2007-03-29 |
Method of resin-seal-molding electronic component and apparatus therefor
App 20070069422 - Bandoh; Kazuhiko | 2007-03-29 |
Cutting Apparatus
App 20070066190 - Takehara; Masataka ; et al. | 2007-03-22 |
Resin molding apparatus
App 20060240140 - Banjo; Toshinobu ; et al. | 2006-10-26 |
Resin casting mold and method of casting resin
App 20060131780 - Kuno; Takaki ; et al. | 2006-06-22 |
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
Grant 7,056,770 - Uragami , et al. June 6, 2 | 2006-06-06 |
Transparent member, optical device using transparent member and method of manufacturing optical device
App 20060078246 - Ashida; Takeshi | 2006-04-13 |
Die bonding apparatus
App 20060021710 - Nitta; Kazunori | 2006-02-02 |
Resin encapsulation molding for semiconductor device
App 20060014328 - Shimonaka; Tomoya ; et al. | 2006-01-19 |
Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
Grant 6,977,188 - Takase December 20, 2 | 2005-12-20 |
Method of resin-sealing and molding an optical device
App 20050242452 - Takase, Shinji ; et al. | 2005-11-03 |
Method of introducing resin for electronic component and apparatus used therefor
Grant 6,929,977 - Takase , et al. August 16, 2 | 2005-08-16 |
Method of manufacturing semiconductor resin molding and resin member employed therefor
Grant 6,919,223 - Osada July 19, 2 | 2005-07-19 |
Composite material and resin mold
App 20050154113 - Kuno, Takaki ; et al. | 2005-07-14 |
Pressing method, pressing mechanism and resin molding device
Grant 6,851,355 - Harada , et al. February 8, 2 | 2005-02-08 |
Resin mold material and resin mold
App 20040253334 - Bandoh, Kazuhiko ; et al. | 2004-12-16 |
Die used for resin-sealing and molding an electronic component
Grant 6,773,247 - Osada , et al. August 10, 2 | 2004-08-10 |
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
App 20040101631 - Uragami, Hiroshi ; et al. | 2004-05-27 |
Cutting apparatus and cutting method
Grant 6,736,703 - Osada , et al. May 18, 2 | 2004-05-18 |
Method of introducing resin for electronic component and apparatus used therefor
App 20040063234 - Takase, Shinji ; et al. | 2004-04-01 |
Polishing apparatus and polishing method
Grant 6,712,674 - Matsuo , et al. March 30, 2 | 2004-03-30 |
Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
App 20040048416 - Takase, Shinji | 2004-03-11 |
Method of manufacturing semiconductor resin molding and resin member employed therefor
App 20030235938 - Osada, Michio | 2003-12-25 |
Resin sealing method and resin sealing apparatus
Grant 6,630,374 - Yamamoto October 7, 2 | 2003-10-07 |
Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
App 20030094185 - Osada, Michio ; et al. | 2003-05-22 |
Cutting apparatus and cutting method
App 20020160695 - Osada, Michio ; et al. | 2002-10-31 |
Electronic component, method of sealing electronic component with resin, and apparatus therefor
Grant 6,438,826 - Takase , et al. August 27, 2 | 2002-08-27 |
Polishing apparatus and polishing method
App 20020037685 - Matsuo, Makoto ; et al. | 2002-03-28 |
Apparatus for processing resin sealed lead frame
App 20010021409 - Osada, Michio ; et al. | 2001-09-13 |
Method of sealing electronic component with molded resin
Grant 5,874,324 - Osada February 23, 1 | 1999-02-23 |
Method of and apparatus for molding resin to seal electronic parts
Grant 5,834,035 - Osada , et al. November 10, 1 | 1998-11-10 |
Resin sealing and molding apparatus for sealing electronic parts
Grant 5,783,220 - Osada , et al. July 21, 1 | 1998-07-21 |
Method of sealing electronic parts with molded resin and mold employed therefor
Grant 5,753,538 - Kuno , et al. May 19, 1 | 1998-05-19 |
Method of molding resin to seal electronic parts
Grant 5,750,059 - Bandoh May 12, 1 | 1998-05-12 |
Method of molding resin to seal electronic parts using two evacuation steps
Grant 5,603,879 - Osada , et al. February 18, 1 | 1997-02-18 |
Resin molding apparatus for sealing an electronic device
Grant 5,507,633 - Osada , et al. April 16, 1 | 1996-04-16 |
Method of molding resin for sealing an electronic device
Grant 5,435,953 - Osada , et al. July 25, 1 | 1995-07-25 |
Film carrier for mounting IC chips
Grant 5,031,022 - Yamamoto , et al. July 9, 1 | 1991-07-09 |
| 