U.S. patent number 8,222,059 [Application Number 12/163,669] was granted by the patent office on 2012-07-17 for method transparent member, optical device using transparent member and method of manufacturing optical device.
This patent grant is currently assigned to Towa Corporation. Invention is credited to Takeshi Ashida.
United States Patent |
8,222,059 |
Ashida |
July 17, 2012 |
Method transparent member, optical device using transparent member
and method of manufacturing optical device
Abstract
In a method of manufacturing an optical device, a whole
substrate is first prepared which has a plurality of regions
corresponding to substrates constituting a plurality of optical
devices, respectively. A plurality of chips are then mounted to the
plurality of regions, respectively. A whole sealing member having a
plurality of sealing members is integrally attached to the whole
substrate to form an intermediate body. The intermediate body is
divided into the above-described regions. Thus, the optical device
having a substrate, a chip as an optical element mounted to the
substrate and a sealing member with transparency provided at the
substrate for the purpose of sealing the chip is manufactured. This
manufacturing method improves the efficiency of manufacturing an
optical device.
Inventors: |
Ashida; Takeshi (Kyoto,
JP) |
Assignee: |
Towa Corporation (Kyoto,
JP)
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Family
ID: |
36145415 |
Appl.
No.: |
12/163,669 |
Filed: |
June 27, 2008 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20080265448 A1 |
Oct 30, 2008 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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11243967 |
Oct 6, 2005 |
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Foreign Application Priority Data
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Oct 7, 2004 [JP] |
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2004-294980 |
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Current U.S.
Class: |
438/28; 438/33;
438/26; 438/110; 438/22; 438/34; 438/116; 438/35 |
Current CPC
Class: |
G02B
3/0031 (20130101); H01L 24/97 (20130101); H01L
2224/48091 (20130101); H01L 2224/97 (20130101); H01L
2924/12043 (20130101); H01L 2924/01006 (20130101); H01L
2924/15787 (20130101); H01L 2924/12041 (20130101); H01L
2924/01033 (20130101); H01L 2224/32245 (20130101); H01L
2924/01082 (20130101); H01L 33/58 (20130101); H01L
2924/01005 (20130101); G02B 3/0075 (20130101); H01L
2224/48247 (20130101); H01L 2224/73265 (20130101); H01L
2224/48091 (20130101); H01L 2924/00014 (20130101); H01L
2224/97 (20130101); H01L 2224/85 (20130101); H01L
2224/73265 (20130101); H01L 2224/32245 (20130101); H01L
2224/48247 (20130101); H01L 2924/00 (20130101); H01L
2224/97 (20130101); H01L 2224/73265 (20130101); H01L
2224/32245 (20130101); H01L 2224/48247 (20130101); H01L
2924/00 (20130101); H01L 2924/15787 (20130101); H01L
2924/00 (20130101); H01L 2924/12043 (20130101); H01L
2924/00 (20130101) |
Current International
Class: |
H01L
21/00 (20060101) |
Field of
Search: |
;438/22,26,28,33-35,110,116 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1396323 |
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Mar 2004 |
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EP |
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61-001067 |
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Jan 1986 |
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JP |
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4-348088 |
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Dec 1992 |
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JP |
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6-871 |
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Jan 1994 |
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JP |
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2001-176902 |
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Jun 2001 |
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JP |
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2001-203227 |
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Jul 2001 |
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JP |
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2001-223285 |
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Aug 2001 |
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JP |
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2002-36270 |
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Feb 2002 |
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JP |
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2002-43345 |
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Feb 2002 |
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JP |
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2002-314100 |
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Oct 2002 |
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JP |
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2002-319711 |
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Oct 2002 |
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JP |
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2002-368281 |
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Dec 2002 |
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JP |
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2003-163382 |
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Jun 2003 |
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JP |
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2003-324118 |
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Nov 2003 |
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JP |
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2004-74461 |
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Mar 2004 |
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JP |
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2004-88713 |
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Mar 2004 |
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JP |
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2004-98364 |
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Apr 2004 |
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JP |
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2004-148621 |
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May 2004 |
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JP |
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2004-200269 |
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Jul 2004 |
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JP |
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2004-216558 |
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Aug 2004 |
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JP |
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2004-233482 |
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Aug 2004 |
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JP |
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2004-330697 |
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Nov 2004 |
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JP |
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WO 2004/027880 |
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Apr 2004 |
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WO |
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Other References
Translation of Japanese Patent Publication 04-348088 (Dec. 1992).
cited by other .
Notice of Grounds of Rejection mailed Jan. 19, 2010 in Japanese
Patent Application No. 095948/2007. cited by other .
Notice of Grounds of Rejection mailed Jan. 19, 2010 in Japanese
Patent Application No. 129395/2004. cited by other .
Notice of Grounds of Rejection mailed Oct. 21, 2010 in Japanese
Patent Application No. 294980/2004. cited by other.
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Primary Examiner: Au; Bac
Attorney, Agent or Firm: Birch, Stewart, Kolasch &
Birch, LLP
Parent Case Text
This application is a Divisional of application Ser. No.
11/243,967, filed on Oct. 6, 2005, now abandoned the entire
contents of which are hereby incorporated by reference and for
which priority is claimed under 35 U.S.C. .sctn.120.
Claims
What is claimed is:
1. A manufacturing method of an optical device comprising: a
substrate having a flat main surface; a chip as an optical element
mounted to said flat main surface of said substrate; and a sealing
member with transparency provided at said substrate for the purpose
of sealing said chip, wherein said optical device is formed by
dividing an intermediate body along phantom lines in a grid
pattern, and wherein a method of forming said intermediate body
comprises preparing a whole substrate on which a plurality of chips
are respectively attached to a plurality of regions sectioned by
the phantom lines in said grid pattern, integrally providing on
said whole substrate a whole sealing member having a plurality of
sealing members respectively corresponding to said plurality of
regions, wherein said plurality of sealing members fills a
plurality of prescribed spaces, each of which including said chip
in each of said plurality of regions, respectively, said plurality
of prescribed spaces are provided on a lower mold, said plurality
of chips moves towards said plurality of prescribed spaces,
respectively, with said substrate attached to an upper mold
opposing said lower mold, said plurality of sealing members are
formed by curing a resin material in a state where the plurality of
chips are immersed within a resin material melted by heating,
filling said prescribed spaces, or within a resin material
retaining a liquid state at a room temperature filling said
prescribed spaces, and the upper mold and the lower mold are
respectively positioned to allow a layer of the resin material
having a thickness between the prescribed spaces of the lower mold;
said plurality of sealing members are formed by compression
molding, and said plurality of sealing members are connected to
each other by a plate-like flange portion formed from curing of the
layer of the resin material having the thickness.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a transparent member used in an
optical device having a chip as an optical element, an optical
device using the transparent member, and a method of manufacturing
the optical device.
2. Description of the Background Art
Referring to FIGS. 21 to 25, a first method of manufacturing a
conventional optical device is described. Specifically, a method of
manufacturing a package of a light-emitting diode (hereinafter
referred to as an "LED") is described as an example of a
manufacturing method of the optical device. For the sake of
simplicity, respective drawings in association with the description
below are schematically depicted and not drawn to scale.
In the method of manufacturing the conventional optical device, as
shown in FIG. 21, an LED chip 3 is first die-bonded to a top
surface 2 of a lead frame 1 as a substrate. Then, electrodes (not
shown) of lead frame 1 and LED chip 3 are wire-bonded to each other
via a wire 4.
Then, as shown in FIG. 22, for example by transfer molding, a
protecting member 6 composed of a cured resin is formed at a
prescribed region on top surface 2 excluding the region around LED
chip 3 and wire 4 and at a prescribed region of a bottom surface 5.
Protecting member 6 serves to protect LED chip 3 and wire 4, and in
some cases, to reflect light emitted from LED chip 3 in an upward
direction of the drawing. Furthermore, when forming protecting
member 6, a concave portion 7 is formed in protecting member 6 on
the side of top surface 2. The process described above provides a
partially-completed product 8 corresponding to an LED package as
one completed product. In this partially-completed product 8, a
portion protruding from protecting member 6 in lead frame 1
functions as a lead of the LED package. It is to be noted that, in
the state shown in FIG. 22, secondary molding may be performed, as
necessary, to fill the space around LED chip 3 and wire 4 with a
cured resin having transparency.
As shown in FIG. 23, an adhesive (not shown) is then applied to
concave portion 7 of partially-completed product 8, and a
transparent member composed of a material having transparency, that
is, a lens member 9 is prepared. Lens member 9 is thereafter
transported in a state held by adsorption and the like, and aligned
with concave portion 7 of partially-completed product 8. Lens
member 9 individually manufactured by injection molding, includes a
transparent portion 10 having a configuration of a partial sphere
and functioning as a convex lens, and a plate-like flange portion
11 extending laterally at the bottom of transparent portion 10, and
has a circular shape in plan view.
As shown in FIG. 24, lens member 9 is then lowered to be placed on
concave portion 7, and the adhesive cures to bond lens member 9 and
partially-completed product 8 shown in FIG. 22. Thus, a
partially-completed product with a lens 12 shown in FIGS. 24 and 25
is completed. Subsequent to the above-described process, the lead
is subjected to bending, whereby an LED package is completed.
In addition to the above-described manufacturing method, the
following second manufacturing method is also known, depending on
the structure of the LED package. In the proposed manufacturing
method, a layered ceramic substrate is used instead of lead frame
1, and a metal cap is attached to the top surface of the layered
ceramic substrate instead of protecting member 6, and a lens (a
transparent member) is attached to a hole portion provided in the
top surface of the metal cap. This manufacturing method is
disclosed, for example, in Japanese Patent Laying-Open No.
2003-163382. The lens used in this method is a convex lens having a
circular shape in plan view and a convex cross-section at its
center portion.
In a manufacturing method proposed as a third manufacturing method,
a light-emitting diode pellet (an LED chip) on a lead frame is
sealed with resin to form a photoelectric conversion substrate
having a rectangular shape in plan view, onto which a transparent
resin plate (a transparent member) is mounted. The transparent
resin plate has a plate-like portion which is rectangular in plan
view and a convex lens portion integrated. This manufacturing
method is disclosed, for example, in Japanese Patent Laying-Open
No. 4-348088. The transparent resin plate with a lens is molded by
an injection molding method.
However, the conventional method set forth above poses the
following problems. First, in the first and second manufacturing
methods, the lens (including the lens member in the first
manufacturing method) has a circular shape in plan view and a
convex cross-section at the center portion. This makes it difficult
to pick up the lens by gripping or adsorption and the like and to
handle the lens during transportation even if the lens has a small
area of a flange portion. In addition, if a jig for a handling
operation contacts a portion through which light of the lens passes
(transparent portion 10 in FIG. 25), the lens will be damaged.
Also, management of inventory and processes become complicated
because it is necessary to store, pick up and transport individual
lenses in all of the first to third manufacturing methods.
Furthermore, it is difficult to improve the efficiency of
manufacturing LEDs because it is necessary to manufacture lenses
and partially-completed products one by one and then attach one
lens to one partially-completed product in all of the first to
third manufacturing methods.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a transparent
member with improved production efficiency and quality, an optical
device using the transparent member, and a method of manufacturing
the optical device.
The transparent member of the present invention is, in an optical
device having a substrate and a chip as an optical element mounted
to the substrate, a transparent member used for the purpose of
protecting the chip. The transparent member has a rectangular shape
in plan view and is formed by dividing one integral molded body
along phantom lines in a grid pattern. This structure allows a
plurality of transparent members to be manufactured together, and
therefore, increases the efficiency of manufacturing the
transparent member. Furthermore, the transparent member has a
rectangular shape in plan view so that it can be held by supporting
its opposite sides. Therefore, errors occurring in handling of the
transparent member and damages to it are prevented.
An optical device of one aspect of the present invention includes a
substrate, a chip as an optical element mounted to the substrate, a
protecting member provided on the substrate so as to surround the
chip, and a transparent member attached to a top surface of the
protecting member. Furthermore, the transparent member has a
rectangular shape in plan view and is formed by dividing one
integral molded body along phantom lines in a grid pattern. This
structure can produce effects similar to those caused by the
above-described transparent member.
In addition, the optical device of the above-described aspect may
be formed by dividing an intermediate body along the phantom lines
in a grid pattern. In this case, the intermediate body desirably
includes a whole substrate having a plurality of regions
corresponding to a plurality of substrates, a plurality of chips
mounted to the plurality of regions, respectively, sectioned by the
phantom lines in a grid pattern, a whole protecting member
integrally provided on the whole substrate as well as having a
plurality of protecting members corresponding to the plurality of
regions, respectively, and one molded body attached to a top
surface of the whole protecting member and having a plurality of
transparent members.
An optical device of another aspect of the present invention
includes a substrate, a chip as an optical element mounted to the
substrate, and a sealing member with transparency provided at the
substrate for the purpose of sealing the chip. In addition, the
optical device is formed by dividing an intermediate body along
phantom lines in a grid pattern. In this case, the intermediate
body includes a whole substrate having a plurality of regions
sectioned by the phantom lines in the grid pattern to correspond to
the plurality of substrates, respectively, a plurality of chips
mounted to the plurality of regions, respectively, and a whole
sealing member having a plurality of sealing members corresponding
to the plurality of regions, respectively, and integrally provided
on the whole substrate. This structure also can improve the
efficiency of manufacturing the optical device and facilitates
handling of it.
The above-described optical device can be manufactured by the
following manufacturing method.
A method of manufacturing an optical device of one aspect of the
present invention includes the steps of mounting a chip as an
optical element to a substrate, fixing a protecting member to the
substrate so as to surround the chip, and attaching a transparent
member to a top surface of the protecting member. The step of
attaching the transparent member includes the steps of molding one
molded body having a plurality of transparent members arranged at a
plurality of regions, respectively, sectioned by phantom lines in a
grid pattern, and dividing the one molded body along the phantom
lines to form each of the plurality of transparent members.
Furthermore, the one molded body preferably includes a double-faced
sheet having a base material, a temporary adhesive layer attached
to one side of the base material and an actual adhesive layer
attached to the other side of the base material and attached to the
transparent member. In this case, the one molded body may be cut
along the phantom lines with the temporary adhesive layer fixed to
other members to form the plurality of transparent members, and
after that, each of the plurality of transparent members may be
removed from the base material. Then, the transparent member may be
bonded to the top surface of the protecting member by the actual
adhesive layer. This allows the manufacturing process to be
simplified because it is not necessary to bond the transparent
member to an opening using an adhesive.
A method of manufacturing an optical device of another aspect of
the present invention is a method of manufacturing an optical
device having a substrate, a chip as an optical element mounted to
the substrate, a protecting member provided at the substrate so as
to surround the chip, and a transparent member attached to a top
surface of the protecting member. The manufacturing method includes
the steps of preparing a whole substrate having a plurality of
regions which can be sectioned by phantom lines in a grid pattern
to correspond to a plurality of substrates, respectively, mounting
a plurality of chips to the plurality of regions, respectively,
integrally attaching a whole protecting member having a plurality
of protecting members to the whole substrate, forming one
intermediate body by attaching one molded body to a top surface of
the whole protecting member, the one molded body having a plurality
of transparent members arranged at the plurality of regions,
respectively, sectioned by the phantom lines in the grid pattern,
and dividing the one intermediate body along the phantom lines in
the grid pattern to form a plurality of optical devices each having
the substrate, the protecting member, the transparent member and
the chip.
A method of manufacturing an optical device of still another aspect
of the present invention is a method of manufacturing an optical
device provided with a substrate, a chip as an optical element
mounted to the substrate, and a sealing member with transparency
provided at the substrate for the purpose of sealing the chip. The
manufacturing method includes the steps of preparing a whole
substrate having a plurality of regions which can be sectioned by
phantom lines in a grid pattern to correspond to a plurality of
substrates, respectively, mounting a plurality of chips to the
plurality of regions, respectively, forming one intermediate body
by integrally providing a whole sealing member having a plurality
of sealing members at the whole substrate, and dividing the one
intermediate body along the phantom lines in the grid pattern to
form a plurality of optical devices each having the substrate, the
sealing member and the chip.
The foregoing and other objects, features, aspects and advantages
of the present invention will become more apparent from the
following detailed description of the present invention when taken
in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1-4 are partial sectional views for describing a method of
manufacturing an optical device of the first embodiment.
FIG. 5 is a perspective view of a completed lens member of the
first embodiment.
FIGS. 6-9 are partial sectional views for describing a method of
manufacturing an optical device of the second embodiment.
FIG. 10 is a plan view of a partially-completed product with a lens
of the optical device of the second embodiment.
FIGS. 11-14 are partial sectional views for describing a method of
manufacturing an optical device of the third embodiment.
FIG. 15 is a cross sectional view of a completed optical device of
the third embodiment.
FIGS. 16-19 are partial sectional views for describing a method of
manufacturing an optical device of the fourth embodiment.
FIG. 20 is a cross sectional view of a completed optical device of
the fourth embodiment.
FIGS. 21-24 are cross sectional views of a method of manufacturing
a conventional optical device.
FIG. 25 is a plan view of a partially-completed product with a lens
of the conventional optical device.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
First Embodiment
First, referring to FIGS. 1 to 5, a transparent member, an optical
device and a method of manufacturing the optical device according
to a first embodiment of the present invention will be described.
In each drawing described below, the same components as those in
FIGS. 21 to 25 are designated by the same reference characters.
Furthermore, in the following description, an LED chip is used as
an example of an optical element, and an LED package is used as an
example of an optical device. However, the optical element of the
present invention is not limited to the LED chip, and may be a
light-receiving element converting received light to an electrical
signal, for example, a chip such as a photodiode (PD) or a
solid-state image sensor. Also, the optical element of the present
invention may be a light-emitting element emitting light depending
on received electrical signals, for example, a chip such as a laser
diode (LD). In addition, the optical device of the present
invention may be a module used in optical communication. In other
words, the present invention can be applied to any optical
element.
In the present embodiment, a lens member, that is, a transparent
member, which is bonded to a partially-completed product having a
substrate, an LED chip and a protecting member (see a
partially-completed product 8 shown in FIG. 23) is manufactured.
The transparent member is formed by performing resin molding to
integrally create a molded body including a plurality of lens
members and then dividing the molded body.
According to the method of manufacturing the optical device of the
present embodiment, a lower mold 13 and an upper mold 14 facing
each other are first prepared, as shown in FIG. 1. Then, a
prescribed amount of a granular resin material 16 composed of a
thermosetting resin having transparency is supplied to a cavity 15
provided in lower mold 13. Cavity 15 has a plurality of concave
portions in accordance with the shape of the lens member. Each of
the plurality of concave portions is formed within a region
sectioned by a phantom grid pattern. Also, resin material 16 may be
in the form of powder, a mass or a sheet instead of a granule as
shown, and may be a thermoplastic resin having prescribed
transparency. A resin material which is liquid at room temperature
may be injected into cavity 15.
Then, as shown in FIG. 2, lowering upper mold 14 (see FIG. 1)
causes lower mold 13 and upper mold 14 to be clamped together and
resin material 16 to be pressed. Resin material 16 is subsequently
heated by heaters (not shown) provided in lower mold 13 and upper
mold 14, and melted. This causes a fluid resin 17 to be formed
within cavity 15. Fluid resin 17 thereafter cures to form a molded
body 19 composed of a cured resin 18, as shown in FIG. 3, that is,
so-called compression molding is performed. Thus, molded body 19
including a plurality of lens members is molded integrally. Note
that transfer molding may be carried out to integrally mold molded
body 19.
As shown in FIG. 3, upper mold 14 is then raised to open lower mold
13 and upper mold 14. Molded body 19 is removed from cavity 15 and
then transported to a cutting machine used in the next process
while being held by means such as adsorption.
Then, molded body 19 is temporarily fixed to a stage 21 by a dicing
sheet 20 having an appropriate tackiness, in other words, a low
adhesive strength. Molded body 19 is thereafter cut by a rotary
blade 22, that is, molded body 19 is divided, along phantom dicing
lines 23 in a grid pattern extending toward a Y direction (the
direction from the front to backward in FIG. 4) and an X direction
(the direction from left to right in FIG. 4), respectively. As a
result, a plurality of lens members 25 (see FIG. 5) are formed.
It is noted that, as shown in FIG. 5, lens member 25 has a
transparent portion 10 functioning as a transparent member, that
is, a convex lens, and a plate-like flange portion 24 of a
rectangular shape in plan view. This lens member 25 having the
rectangular shape corresponds to the transparent member of the
present invention. Each of the plurality of lens members 25 which
remains temporarily fixed to dicing sheet 20 is then transported,
stored and shipped.
As in the case of the process shown in FIG. 23, an adhesive (not
shown) is applied to a concave portion 7 of a partially-completed
product 8. Lens member 25 is then detached from dicing sheet 20,
held by adsorption and the like, transported and aligned with
concave portion 7. It is assumed that, in the present embodiment,
concave portion 7 shown in FIGS. 22 to 24 has a rectangular shape
in plan view corresponding to flange portion 24 shown in FIG.
5.
Then, as in the case of the process shown in FIG. 24, lens member
25 is lowered to be rested on concave portion 7, and the adhesive
cures. Thus, a partially-completed product with a lens (see a
partially-completed product with a lens 12 in FIGS. 24 and 25) is
completed. After the above-described process, a lead is subjected
to bending, whereby the optical device (an LED package) of the
present embodiment is completed.
As described above, according to the present embodiment, after
molded body 19 including the plurality of lens members 25 is molded
integrally, it is divided into the plurality of lens members 25.
Therefore, as compared to the case of forming the plurality of lens
members 25 one by one by injection molding and the like, the
efficiency of manufacturing the optical device is increased.
Further, inventory management, storage and transportation and the
like are simplified. Lens member 25 also has a wide plate-like
flange portion 24 and a rectangular shape in plan view. Therefore,
it is possible to grip and adsorb flange portion 24 when handling
lens member 25. Furthermore, lens member 25 can be held by
supporting its opposite sides even if flange portion 24 has a small
area. Thus, errors occurring in handling lens member 25 and quality
deterioration caused by damages to transparent portion 10 are
prevented.
Note that, in the present embodiment, molded body 19 is cut by
rotary blade 22. However, the method of cutting molded body 19 is
not limited to the above-described method. Molded body 19 may have
grooves formed corresponding to dicing lines 23, and may be bent to
be divided along the grooves to form the plurality of lens members
25.
In addition, in the present embodiment, lens member 25 is used as a
transparent member. However, the transparent member is not limited
to the lens member and may be a lens member integrated with a
barrel (a portion including a protecting member 6 and a lens member
9 on the top side of a substrate 1 in FIG. 23).
Second Embodiment
Referring to FIGS. 6 to 10, a transparent member, an optical device
and a method of manufacturing the optical device according to a
second embodiment of the present invention will be described. In
the present embodiment, when a molded body is cut, it is
temporarily fixed to a stage. In addition, each of a plurality of
lens members formed by cutting the molded body is bonded to a
corresponding partially-completed product. Also, by using a
double-faced sheet, the molded body is temporarily fixed to the
stage, and the lens member is bonded to the partially-completed
product.
In the method of manufacturing the optical device of the present
embodiment, as shown in FIG. 6, a double-faced sheet 26 is first
affixed to the bottom side of a molded body 19. Double-faced sheet
26 has a three-layer structure which is constituted of a base
material 27, a temporary adhesive layer 28 for temporary fixing
which is formed on one side (the bottom side in FIG. 6) of base
material 27 and has a low adhesive strength, and an actual adhesive
layer 29 for actual fixing which is formed on the other side (the
top side in FIG. 6) of base material 27 and has a high adhesive
strength. Actual adhesive layer 29 is affixed to the bottom side of
molded body 19. Furthermore, actual adhesive layer 29 corresponding
to one lens member 25 is patterned so as to be located underneath a
flange portion 24 but not underneath a transparent portion 10. Note
that when an acrylic-like transparent member, for example, is used
as actual adhesive layer 29, actual adhesive layer 29 may be
provided across the entire bottom side of lens member 25.
Double-faced sheet 26 is then used in place of dicing sheet 20
shown in FIG. 4 to temporarily fix molded body 19 to a stage 21 by
temporary adhesive layer 28. Molded body 19 is thereafter cut by a
rotary blade 22 along dicing lines 23 in a grid pattern to thereby
form a plurality of lens members 25. At this time, each of the
plurality of lens members 25 is rectangular in plan view and is
provided with double-faced sheet 26.
The plurality of lens members 25 are then stripped off from
temporary adhesive layer 28 on stage 21. Thus, as shown in FIG. 7,
lens member 25 is formed in which actual adhesive layer 29 and base
material 27 are affixed in this order to the bottom side of lens
member 25.
After stripping base material 27 from actual adhesive layer 29, as
shown in FIG. 8, lens member 25 is transported with flange portion
24 adsorbed by an adsorption holder 30. As shown in FIGS. 9 and 10,
lens member 25 is thereafter aligned with a partially-completed
product 31, and lowered to contact the top side of
partially-completed product 31, and then pressurized to bond lens
member 25 on the top side of partially-completed product 31. In
other words, lens member 25 is attached to an opening of a
protecting member 6 surrounding a chip 3. A lead is then subjected
to bending, whereby the optical device (an LED package) of the
present embodiment is completed.
As described above, in the present embodiment, one double-faced
sheet 26 is used which functions as temporary fixing means used in
cutting molded body 19 and actual fixing means for bonding each of
the plurality of lens members 25 to a corresponding
partially-completed product 31. The plurality of lens members 25
are formed by cutting molded body 19. Thus, it is possible to
eliminate the process of applying an adhesive to
partially-completed product 31, and therefore, the efficiency of
manufacturing the optical device can be improved.
Third Embodiment
Then, referring to FIGS. 11 to 15, a transparent member, an optical
device and a method of manufacturing the optical device according
to a third embodiment of the present invention will be described.
In the method of manufacturing the optical device of the present
embodiment, as shown in FIG. 11, a whole substrate 33 is first
prepared in which a plurality of regions 32 sectioned by phantom
lines in a grid pattern and corresponding to optical devices,
respectively, are formed. Note that whole substrate 33 includes a
printed board and the like. Chips 3 are then die-bonded to regions
32 each having a rectangular shape in plan view, respectively, and
electrodes (not shown) of chip 3 and whole substrate 33 are
wire-bonded to each other by a wire 4.
Then, as shown in FIG. 12, a whole protecting member 34 surrounding
a chip in each of the plurality of regions 32 is integrally formed
by transfer molding. Note that, in place of this process, whole
protecting member 34 may be integrally pre-molded separately from
whole substrate 33 and then be aligned with whole substrate 33 to
be bonded to it. Using these methods, whole protecting member 34
may be integrally provided at whole substrate 33.
As shown in FIG. 13, a molded body 19 is then prepared (see FIG.
3). Molded body 19 is integrally molded by a transparent resin. It
is preferable that an adhesive sheet 35 is previously affixed to
the bottom side of molded body 19. Adhesive sheet 35 has functions
similar to those of actual adhesive layer 29 shown in FIGS. 6 to 9.
Furthermore, molded body 19 is aligned with whole substrate 33 and
then lowered to be pressed on a top surface (the top side in FIG.
13) of whole protecting member 34. In other words, molded body 19
is attached such that it blocks an opening of whole protecting
member 34 provided to surround chip 3. Thus, attachment is
established between molded body 19 and whole protecting member
34.
As shown in FIG. 14, an intermediate body 36 having molded body 19
and whole protecting member 34 bonded is temporarily fixed to a
stage (not shown). Intermediate body 36 is then cut by a rotary
blade 22 along phantom dicing lines 23 in a grid pattern extending
toward a Y direction (the direction from the front to backward in
the drawing) and an X direction (the direction from left to right
in the drawing), respectively. Thus, intermediate body 36 is
divided into regions 32 to form a plurality of optical devices 37
(an LED package) shown in FIG. 15.
Optical device 37 has a substrate 38 which is a division of whole
substrate 33, a chip 3 mounted on the top side of substrate 38, a
protecting member 39 provided to surround chip 3, and a lens member
25 which is a transparent member mounted on the top side of
protecting member 39 to block its opening. In addition, optical
device 37 is electrically connected to another printed board (not
shown) or the like by an external electrode (not shown) provided on
the bottom side of substrate 38.
As described above, according to the method of manufacturing the
optical device of the present embodiment, whole protecting member
34 surrounding chip 3 mounted to each region 32 of whole substrate
33 is integrally molded. Also, integral molded body 19 having
transparency is bonded on whole protecting member 34 to form
intermediate body 36. Furthermore, intermediate body 36 is divided
into regions 32 to complete optical device 37. Therefore, as
compared to a conventional manufacturing method of bonding one lens
member to one partially-completed product (see FIGS. 21 to 25), the
above-described manufacturing method considerably improves the
efficiency of manufacturing the optical device. In addition, lens
member 25 constituting optical device 37 is treated integrally as
molded body 19 until intermediate body 36 is cut. Thus, a plurality
of lens members 25 can be integrally held by gripping and adsorbing
a portion (a peripheral portion) not corresponding to lens member
25 of molded body 19. Therefore, errors occurring in handling
molded body 19 and quality deterioration of the optical device
caused by damages to lens member 25 are prevented. Optical device
37 also has a rectangular shape in plan view so that it can be held
by supporting its opposite sides. Therefore, handling of optical
device 37 is facilitated and damage to lens member 25 is
prevented.
Fourth Embodiment
Referring to FIGS. 16 to 20, a transparent member, an optical
device and a method of manufacturing the optical device according
to a fourth embodiment of the present invention will be described.
In the method of manufacturing the optical device of the present
embodiment, as described using FIG. 11, a plurality of chips 3 are
die-bonded to a plurality of regions 32 of a whole substrate 33,
respectively, and electrodes (not shown) of chips 3 and whole
substrate 33 are wire-bonded to each other by a wire 4. A lower
mold 40 and an upper mold 41 facing each other are then prepared.
Note that a cavity 42 is formed in lower mold 40 and, in cavity 42,
a plurality of concave portions corresponding to a plurality of
chips 3, respectively, are formed within the plurality of regions
sectioned by phantom lines in a grid pattern. Whole substrate 33 is
also fixed to upper mold 41 by means of adsorption and the like, as
shown in FIG. 16. In addition, as described using FIG. 1, a
prescribed amount of a granular resin material 43 formed of
thermosetting resin having transparency is supplied to cavity
42.
As shown in FIG. 17, resin material 43 is heated and melted to form
a fluid resin 44 within a cavity 15, and lower mold 40 and upper
mold 41 are thereafter clamped together. Then, a heater (not shown)
provided in lower mold 40 is used to heat resin material 43. In
place of or in addition to the heater, a contact type heating plate
and/or non-contact type halogen lamp and the like may be also
inserted between lower mold 40 and upper mold 41. As a result of
the above-described process, an intermediate body 46 having a
molded body 45 is formed (see FIG. 18). Molded body 45 is composed
of a cured resin created by curing fluid resin 44. Intermediate
body 46 has whole substrate 33 and molded body 45.
As shown in FIG. 18, upper mold 41 is then raised to open the lower
mold (not shown) and upper mold 41. Molded body 45 functions as a
whole sealing member which integrally seals all of a plurality of
chips 3 on whole substrate 33. In the above-described process, in
short, compression molding is carried out to integrally mold
intermediate body 46. Note that a cured resin may be formed by
transfer molding in place of compression molding to integrally mold
intermediated body 46.
As shown in FIG. 19, intermediate body 46 is then temporarily fixed
to a stage (not shown). Intermediate body 46 is then cut by a
rotary blade 22 along phantom dicing lines 23 in a grid pattern
extending toward a Y direction (the direction from the front to
backward in the drawing) and an X direction (the direction from
left to right in the drawing), respectively. Thus, intermediate
body 46 is divided into regions 32 to form a plurality of optical
devices 47 shown in FIG. 20.
By carrying out the above-described process, optical device 47 (an
LED package) of the present embodiment shown in FIG. 20 is
completed. This optical device 47 has a substrate 38 divided from
whole substrate 33, a chip (not shown) mounted on the top side of
substrate 38, a transparent member, that is, a lens member 50
having a transparent portion 48 in the form of a convex lens and a
plate-like flange portion 49 and sealing the chip.
As described above, in the present embodiment, chips 3 mounted to
regions 32 in whole substrate 33, respectively, are integrally
sealed to mold intermediate body 46. Intermediate body 46 is then
divided into regions 32 to form the plurality of optical devices
47. Therefore, as compared to the conventional manufacturing method
of bonding one lens member to one partially-completed product (see
FIGS. 21 to 25), the efficiency of manufacturing the optical device
is further improved. As compared to the manufacturing method of
forming the protecting member of the third embodiment (FIGS. 16 to
20), the production efficiency is also improved. In addition,
intermediate body 46 can be held by gripping and adsorbing a
portion not corresponding to lens member 50 of intermediate body 46
(a peripheral portion in molded body 45). Therefore, errors
occurring in handling intermediate body 46 and quality
deterioration of the optical device caused by damages to lens
member 50 are prevented. Furthermore, optical device 47 has a
rectangular shape in plan view so that it can be held by supporting
its opposite sides to facilitate handling of optical device 47 and
to prevent damages to lens member 50.
Note that the present embodiment employs a method in which
intermediate body 46 having whole substrate 33 and molded body 45
is molded integrally. However, instead of using the above-described
method, a member as an alternative to a portion composed of a cured
resin may be integrally pre-molded by a transparent resin, and the
molded member may be used as a whole sealing member. In this case,
the whole sealing member is first integrally pre-molded separately
from whole substrate 33. Specifically, a portion of molded body 45
other than a prescribed space around LED chip 3 and wire 4, in
other words, a portion corresponding to molded body 19 and whole
protecting member 34 shown in FIG. 4, is integrally molded as a
whole sealing member. The whole sealing member is aligned with
whole substrate 33 and bonded to it. Thus, the whole sealing member
functioning as a protecting member and a lens member is integrally
provided on whole substrate 33 to form an intermediate body. The
intermediate body is then divided into regions 32 to form a
plurality of optical devices. As a result, each of the plurality of
optical devices has a structure in which lens member 25 and
protecting member 39 shown in FIG. 15 are integrated and composed
of a transparent resin.
It is noted that, in each of the first to fourth embodiments, lens
members 25 and 50 have transparent portions 10 and 48 in the form
of a convex lens and plate-like flange portions 24 and 49,
respectively. However, the present invention is not limited to the
above-described structure, and may be formed such that lens members
25 and 50 are in their entirety to be a transparent portion in the
form of a convex lens. In this case, lens members 25 and 50 or
optical devices 37 and 47 can be held by supporting the opposite
sides, that is, portions other than the transparent portion in the
form of a convex lens while a dicing sheet (see dicing sheet 20 in
FIG. 4) is expanded after having been cut. This prevents errors
occurring in handling lens members 25 and 50 and optical devices 37
and 47, as well as quality deterioration.
Furthermore, wire-bonding is used to electrically connect
electrodes of a chip and a substrate. However, other connecting
methods may be used in place of the above-described structure. For
example, a chip may be flip-chip bonded so that light is emitted
from a light-emitting element or incident on a light-receiving
element via an opening provided at the substrate.
In addition, in the present embodiment, a rotary blade 22 cuts
molded body 19, and intermediate bodies 36 and 46. However, the
present invention is not limited to this, and can employ means of
cutting (trimming) by a laser beam as well as cutting by a wire saw
and the like.
Lens member 25 of the present embodiment is placed such that its
convex portion is directed toward the outer side of the optical
device. However, lens member 25 of the present invention is not
limited to this and may be placed such that its convex portion is
directed toward the interior of the optical device. In addition,
lens member 25 may have a convex shape protruding from the main
surfaces of both sides of the optical device, and a shape having a
transparent portion in the form of a convex lens and a light
reflecting wall provided therearound. These are also applied to
molded body 19 of the third embodiment and the whole sealing member
described in the fourth embodiment.
For example, if a lens member is not required as in a certain type
of a light-receiving element and the like, a plate-like member can
be used as a transparent member. Also, after a plate-like molded
body is integrally molded and bonded to a whole protecting member
to form an intermediate body, the intermediate body may be divided
to form a plurality of optical devices (see FIGS. 13 and 14).
Furthermore, a plate-like member may be provided in place of lens
member 50 shown in FIGS. 16 to 20. In these cases, the plate-like
member is equivalent to the transparent member according to the
present invention.
The present invention may be also applied to any optical device
provided with a light-receiving element or both of a light-emitting
element and a light-receiving element.
Although the present invention has been described and illustrated
in detail, it is clearly understood that the same is by way of
illustration and example only and is not to be taken by way of
limitation, the spirit and scope of the present invention being
limited only by the terms of the appended claims.
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