Su; An-Jhih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Su; An-Jhih.The latest application filed is for "structure and method of forming a joint assembly".
Company Profile
103.141.159
- Su; An-Jhih - Taoyuan City TW
- Su; An-Jhih - Taoyuan TW
- SU; AN-JHIH - TAOYUAN COUNTY TW
- Su; An-Jhih - Bade TW
- Su; An-Jhih - Bade City TW
- Su; An-Jhih - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| Structure and Method of Forming a Joint Assembly App 20220302069 - Chen; Ying-Ju ; et al. | 2022-09-22 |
| Semiconductor devices and methods of manufacturing the same Grant 11,450,612 - Lin , et al. September 20, 2 | 2022-09-20 |
| Device and package structure and method of forming the same Grant 11,444,021 - Chen , et al. September 13, 2 | 2022-09-13 |
| Redistribution structure for integrated circuit package and method of forming same Grant 11,444,034 - Yu , et al. September 13, 2 | 2022-09-13 |
| Via for semiconductor device connection and methods of forming the same Grant 11,444,020 - Yu , et al. September 13, 2 | 2022-09-13 |
| Integrated Circuit Package Pad and Methods of Forming App 20220285171 - Yu; Chen-Hua ; et al. | 2022-09-08 |
| Chip package structure with bump Grant 11,410,956 - Chen , et al. August 9, 2 | 2022-08-09 |
| Package Structure Including A First Die And A Second Die And A Bridge Die And Method Of Forming The Package Structure App 20220223534 - Lin; Yu-Hung ; et al. | 2022-07-14 |
| Chip Package Structure With Conductive Shielding Film App 20220181305 - YU; Chen-Hua ; et al. | 2022-06-09 |
| Structure and method of forming a joint assembly Grant 11,355,468 - Chen , et al. June 7, 2 | 2022-06-07 |
| Raised Via for Terminal Connections on Different Planes App 20220165611 - Yu; Chen-Hua ; et al. | 2022-05-26 |
| Integrated circuit package pad and methods of forming Grant 11,342,196 - Chen , et al. May 24, 2 | 2022-05-24 |
| Package Structure And Manufacturing Method Thereof App 20220122952 - Chen; Wei-Yu ; et al. | 2022-04-21 |
| Integrated fan-out structure and method of forming Grant 11,276,656 - Chen , et al. March 15, 2 | 2022-03-15 |
| Semiconductor Structure App 20220068880 - YU; CHEN-HUA ; et al. | 2022-03-03 |
| Chip package structure with seal ring structure Grant 11,264,363 - Yu , et al. March 1, 2 | 2022-03-01 |
| Raised via for terminal connections on different planes Grant 11,251,071 - Yu , et al. February 15, 2 | 2022-02-15 |
| Semiconductor Devices And Methods Of Manufacturing The Same App 20220013461 - Lin; Yu-Hung ; et al. | 2022-01-13 |
| Package structure and manufacturing method thereof Grant 11,217,570 - Chen , et al. January 4, 2 | 2022-01-04 |
| Packages and Methods of Forming Packages App 20210375842 - Yu; Chen-Hua ; et al. | 2021-12-02 |
| Redistribution Structure For Integrated Circuit Package And Method Of Forming Same App 20210358854 - Yu; Chen-Hua ; et al. | 2021-11-18 |
| Method for dicing integrated fan-out packages without seal rings Grant 11,177,142 - Huang , et al. November 16, 2 | 2021-11-16 |
| Semiconductor structure Grant 11,177,238 - Yu , et al. November 16, 2 | 2021-11-16 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210351117 - Huang; Li-Hsien ; et al. | 2021-11-11 |
| Semiconductor Package and Method of Forming the Same App 20210351149 - Chen; Hsien-Wei ; et al. | 2021-11-11 |
| Semiconductor Package and Method App 20210343626 - Chen; Wei-Yu ; et al. | 2021-11-04 |
| Redistribution layers in semiconductor packages and methods of forming same Grant 11,158,619 - Huang , et al. October 26, 2 | 2021-10-26 |
| Semiconductor package and manufacturing method thereof Grant 11,145,633 - Chen , et al. October 12, 2 | 2021-10-12 |
| Semiconductor structure and method of forming Grant 11,133,197 - Chen , et al. September 28, 2 | 2021-09-28 |
| Package with bridge die for interconnection and method forming same Grant 11,133,258 - Yu , et al. September 28, 2 | 2021-09-28 |
| Semiconductor Device and Method App 20210281037 - Yu; Chen-Hua ; et al. | 2021-09-09 |
| Package Structures And Method Of Forming The Same App 20210272894 - Yu; Chen-Hua ; et al. | 2021-09-02 |
| Packages and methods of forming packages Grant 11,094,680 - Yu , et al. August 17, 2 | 2021-08-17 |
| Semiconductor package and method of manufacturing the same Grant 11,075,150 - Huang , et al. July 27, 2 | 2021-07-27 |
| Semiconductor package and method of forming the same Grant 11,075,182 - Chen , et al. July 27, 2 | 2021-07-27 |
| Semiconductor package and method Grant 11,062,978 - Chen , et al. July 13, 2 | 2021-07-13 |
| Fan-Out Structure and Method of Fabricating the Same App 20210193485 - Yu; Chen-Hua ; et al. | 2021-06-24 |
| Package structures and methods of forming the same Grant 11,037,899 - Huang , et al. June 15, 2 | 2021-06-15 |
| Underfill control structures and method Grant 11,018,069 - Chen , et al. May 25, 2 | 2021-05-25 |
| Package structures and method of forming the same Grant 11,011,464 - Yu , et al. May 18, 2 | 2021-05-18 |
| Multi-Stack Package-on-Package Structures App 20210143143 - Yu; Chen-Hua ; et al. | 2021-05-13 |
| Semiconductor device and method Grant 10,992,100 - Yu , et al. April 27, 2 | 2021-04-27 |
| Chip Package And Method Of Fabricating The Same App 20210111120 - Chen; Guan-Yu ; et al. | 2021-04-15 |
| Dam For Three-dimensional Integrated Circuit App 20210098318 - Wang; Tsung-Ding ; et al. | 2021-04-01 |
| Chip Package Structure with Bump App 20210082855 - Chen; Wei-Yu ; et al. | 2021-03-18 |
| Package structure and method of forming the same Grant 10,950,575 - Yu , et al. March 16, 2 | 2021-03-16 |
| Semiconductor device and method of manufacture Grant 10,943,889 - Chen , et al. March 9, 2 | 2021-03-09 |
| Fan-out structure and method of fabricating the same Grant 10,943,798 - Yu , et al. March 9, 2 | 2021-03-09 |
| Semiconductor Package And Manufacturing Method Thereof App 20210066263 - Chen; Wei-Yu ; et al. | 2021-03-04 |
| Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same App 20210035953 - Yu; Chen-Hua ; et al. | 2021-02-04 |
| Integrated Circuit Package Pad and Methods of Forming App 20210035819 - Chen; Hsien-Wei ; et al. | 2021-02-04 |
| Package with Bridge Die For Interconnection and Method Forming Same App 20210020574 - Yu; Chen-Hua ; et al. | 2021-01-21 |
| Multi-Stack Package-on-Package Structures App 20210005594 - Yu; Chen-Hua ; et al. | 2021-01-07 |
| Multi-Stacked Package-on-Package Structures App 20210005556 - Yu; Chen-Hua ; et al. | 2021-01-07 |
| Photonic Integrated Package And Method Forming Same App 20200411333 - Yu; Chen-Hua ; et al. | 2020-12-31 |
| Chip Package Structure With Seal Ring Structure App 20200411485 - YU; Chen-Hua ; et al. | 2020-12-31 |
| Package structure, die and method of manufacturing the same Grant 10,879,224 - Chen , et al. December 29, 2 | 2020-12-29 |
| Chip package and method of fabricating the same Grant 10,872,855 - Chen , et al. December 22, 2 | 2020-12-22 |
| Dam for three-dimensional integrated circuit Grant 10,867,878 - Wang , et al. December 15, 2 | 2020-12-15 |
| Semiconductor device and manufacturing method thereof Grant 10,867,928 - Lu , et al. December 15, 2 | 2020-12-15 |
| Chip package structure with bump Grant 10,854,565 - Chen , et al. December 1, 2 | 2020-12-01 |
| Chip Package Structure With Molding Layer App 20200365563 - CHEN; Wei-Yu ; et al. | 2020-11-19 |
| Device And Package Structure And Method Of Forming The Same App 20200335438 - Chen; Hsien-Wei ; et al. | 2020-10-22 |
| Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,811,394 - Yu , et al. October 20, 2 | 2020-10-20 |
| Chip package structure with conductive shielding film Grant 10,804,247 - Yu , et al. October 13, 2 | 2020-10-13 |
| Semiconductor package and rework process for the same Grant 10,797,038 - Yu , et al. October 6, 2 | 2020-10-06 |
| Integrated circuit package pad and methods of forming Grant 10,796,927 - Chen , et al. October 6, 2 | 2020-10-06 |
| Integrated Fan-Out Structure and Method of Forming App 20200303332 - Chen; Hsien-Wei ; et al. | 2020-09-24 |
| Multi-stack package-on-package structures Grant 10,784,248 - Yu , et al. Sept | 2020-09-22 |
| Multi-stacked package-on-package structures Grant 10,784,207 - Yu , et al. Sept | 2020-09-22 |
| Package Structures And Methods Of Forming The Same App 20200294955 - Huang; Li-Hsien ; et al. | 2020-09-17 |
| Photonic integrated package and method forming same Grant 10,777,430 - Yu , et al. Sept | 2020-09-15 |
| Semiconductor Device and Method of Manufacture App 20200279833 - Chen; Hsien-Wei ; et al. | 2020-09-03 |
| Package structure and fabricating method thereof Grant 10,756,037 - Huang , et al. A | 2020-08-25 |
| Fan-Out Structure and Method of Fabricating the Same App 20200258760 - A1 | 2020-08-13 |
| Device and package structure Grant 10,741,490 - Chen , et al. A | 2020-08-11 |
| Package Structure And Manufacturing Method Thereof App 20200251456 - Kind Code | 2020-08-06 |
| Raised Via for Terminal Connections on Different Planes App 20200251380 - Kind Code | 2020-08-06 |
| Chip package structure with molding layer Grant 10,734,357 - Chen , et al. | 2020-08-04 |
| Via for Semiconductor Device Connection and Methods of Forming the Same App 20200243442 - Yu; Chen-Hua ; et al. | 2020-07-30 |
| Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,720,409 - Yu , et al. | 2020-07-21 |
| Chip Package Structure With Molding Layer And Method For Forming The Same App 20200194404 - CHEN; Wei-Yu ; et al. | 2020-06-18 |
| Integrated fan-out structure and method of forming Grant 10,679,953 - Chen , et al. | 2020-06-09 |
| Chip-on-substrate packaging on carrier Grant 10,679,951 - Yu , et al. | 2020-06-09 |
| Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20200176432 - Huang; Li-Hsien ; et al. | 2020-06-04 |
| Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,672,741 - Yu , et al. | 2020-06-02 |
| Package structures and methods of forming the same Grant 10,672,734 - Huang , et al. | 2020-06-02 |
| Semiconductor device and method of manufacture Grant 10,658,339 - Chen , et al. | 2020-05-19 |
| Packages and packaging methods for semiconductor devices, and packaged semiconductor devices Grant 10,658,337 - Yu , et al. | 2020-05-19 |
| Structure and method of forming a joint assembly Grant 10,643,965 - Chen , et al. | 2020-05-05 |
| Fan-out structure and method of fabricating the same Grant 10,643,864 - Yu , et al. | 2020-05-05 |
| Package Structure, Die And Method Of Manufacturing The Same App 20200135708 - Chen; Wei-Yu ; et al. | 2020-04-30 |
| Package structure and manufacturing method thereof Grant 10,636,775 - Chen , et al. | 2020-04-28 |
| Raised via for terminal connections on different planes Grant 10,629,477 - Yu , et al. | 2020-04-21 |
| Packages and Methods of Forming Packages App 20200118987 - Yu; Chen-Hua ; et al. | 2020-04-16 |
| Semiconductor Structure App 20200118974 - YU; CHEN-HUA ; et al. | 2020-04-16 |
| Via for semiconductor device connection and methods of forming the same Grant 10,622,302 - Yu , et al. | 2020-04-14 |
| Integrated Circuit Package Pad and Methods of Forming App 20200083061 - Chen; Hsien-Wei ; et al. | 2020-03-12 |
| Multi-Stacked Package-on-Package Structures App 20200066643 - Yu; Chen-Hua ; et al. | 2020-02-27 |
| Semiconductor Device And Manufacturing Method Thereof App 20200043855 - Lu; Kuan-Chung ; et al. | 2020-02-06 |
| Multi-Stack Package-on-Package Structures App 20200035661 - Yu; Chen-Hua ; et al. | 2020-01-30 |
| Semiconductor Package and Method App 20200035584 - Chen; Wei-Yu ; et al. | 2020-01-30 |
| Package structure and method of forming the same Grant 10,541,226 - Yu , et al. Ja | 2020-01-21 |
| Semiconductor Device and Method App 20200014169 - Yu; Chen-Hua ; et al. | 2020-01-09 |
| Semiconductor package and method Grant 10,529,650 - Chen , et al. J | 2020-01-07 |
| Structure and Method of Forming a Joint Assembly App 20200006276 - Chen; Ying-Ju ; et al. | 2020-01-02 |
| Photonic Integrated Package and Method Forming Same App 20200006088 - Yu; Chen-Hua ; et al. | 2020-01-02 |
| Underfill Control Structures and Method App 20200006179 - Chen; Ying-Ju ; et al. | 2020-01-02 |
| Chip Package And Method Of Fabricating The Same App 20200006219 - Chen; Guan-Yu ; et al. | 2020-01-02 |
| Underfill control structures and method Grant 10,515,865 - Chen , et al. Dec | 2019-12-24 |
| Semiconductor structure and manufacturing method thereof Grant 10,510,715 - Yu , et al. Dec | 2019-12-17 |
| Integrated circuit package pad and methods of forming Grant 10,510,556 - Chen , et al. Dec | 2019-12-17 |
| Packages and methods of forming packages Grant 10,510,735 - Yu , et al. Dec | 2019-12-17 |
| Multi-stack package-on-package structures Grant 10,490,540 - Yu , et al. Nov | 2019-11-26 |
| Package Structure And Fabricating Method Thereof App 20190355687 - Huang; Li-Hsien ; et al. | 2019-11-21 |
| Integrated Fan-Out Structure and Method of Forming App 20190348381 - Chen; Hsien-Wei ; et al. | 2019-11-14 |
| Semicondcutor Package And Method Of Manufacturing The Same App 20190348353 - Huang; Li-Hsien ; et al. | 2019-11-14 |
| Via For Component Electrode Connection App 20190341306 - Yu; Chen-Hua ; et al. | 2019-11-07 |
| Multi-stacked package-on-package structures Grant 10,461,036 - Yu , et al. Oc | 2019-10-29 |
| Semiconductor Structure and Method of Forming App 20190326132 - Chen; Wei-Yu ; et al. | 2019-10-24 |
| Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20190326259 - Yu; Chen-Hua ; et al. | 2019-10-24 |
| Fan-Out Structure and Method of Fabricating the Same App 20190273001 - Yu; Chen-Hua ; et al. | 2019-09-05 |
| Raised Via for Terminal Connections on Different Planes App 20190273018 - Yu; Chen-Hua ; et al. | 2019-09-05 |
| Integrated Circuit Package Pad and Methods of Forming App 20190259630 - Chen; Hsien-Wei ; et al. | 2019-08-22 |
| Package Structures And Methods Of Forming The Same App 20190259727 - Huang; Li-Hsien ; et al. | 2019-08-22 |
| Via for Semiconductor Device Connection and Methods of Forming the Same App 20190252312 - Yu; Chen-Hua ; et al. | 2019-08-15 |
| Integrated fan-out structure and method of forming Grant 10,366,959 - Chen , et al. July 30, 2 | 2019-07-30 |
| Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,347,606 - Yu , et al. July 9, 2 | 2019-07-09 |
| Semiconductor structure and method of forming Grant 10,340,155 - Chen , et al. | 2019-07-02 |
| Multi-stacked package-on-package structures Grant 10,319,683 - Yu , et al. | 2019-06-11 |
| Integrated Fan-out Packages And Methods Of Forming The Same App 20190164783 - Huang; Li-Hsien ; et al. | 2019-05-30 |
| Redistribution layers in semiconductor packages and methods of forming same Grant 10,304,801 - Huang , et al. | 2019-05-28 |
| Raised via for terminal connections on different planes Grant 10,297,494 - Yu , et al. | 2019-05-21 |
| Fan-out structure and method of fabricating the same Grant 10,297,471 - Yu , et al. | 2019-05-21 |
| Semiconductor Package and Method App 20190148267 - Chen; Wei-Yu ; et al. | 2019-05-16 |
| PoP device and method of forming the same Grant 10,290,610 - Huang , et al. | 2019-05-14 |
| Package Structures and Method of Forming the Same App 20190139888 - Yu; Chen-Hua ; et al. | 2019-05-09 |
| Integrated circuit package pad and methods of forming Grant 10,283,375 - Chen , et al. | 2019-05-07 |
| Package structures and methods of forming the same Grant 10,283,479 - Huang , et al. | 2019-05-07 |
| Package Structure And Manufacturing Method Thereof App 20190131283 - Chen; Wei-Yu ; et al. | 2019-05-02 |
| Semiconductor Device and Method of Manufacture App 20190131279 - Chen; Hsien-Wei ; et al. | 2019-05-02 |
| Package structure and manufacturing method thereof Grant 10,276,542 - Huang , et al. | 2019-04-30 |
| Multi-Stacked Package-on-Package Structures App 20190115300 - Yu; Chen-Hua ; et al. | 2019-04-18 |
| Chip-on-Substrate Packaging on Carrier App 20190115307 - Yu; Chen-Hua ; et al. | 2019-04-18 |
| Packages and Methods of Forming Packages App 20190115332 - Yu; Chen-Hua ; et al. | 2019-04-18 |
| Pop Device And Method Of Forming The Same App 20190067249 - Huang; Li-Hsien ; et al. | 2019-02-28 |
| Semiconductor device and manufacturing method thereof Grant 10,217,687 - Yang , et al. Feb | 2019-02-26 |
| Chip Package Structure App 20190051635 - YU; Chen-Hua ; et al. | 2019-02-14 |
| Device And Package Structure App 20190035730 - Chen; Hsien-Wei ; et al. | 2019-01-31 |
| Semiconductor Package and Method of Forming the Same App 20190027456 - Chen; Hsien-Wei ; et al. | 2019-01-24 |
| Chip Package Structure With Bump App 20190027454 - CHEN; Wei-Yu ; et al. | 2019-01-24 |
| Devices, packaging devices, and methods of packaging semiconductor devices Grant 10,177,032 - Chen , et al. J | 2019-01-08 |
| Semiconductor Packages with Thermal-Electrical-Mechanical Chips and Methods of Forming the Same App 20180374824 - Yu; Chen-Hua ; et al. | 2018-12-27 |
| Chip-on-substrate packaging on carrier Grant 10,163,822 - Yu , et al. Dec | 2018-12-25 |
| Multi-stack package-on-package structures Grant 10,163,701 - Lee , et al. Dec | 2018-12-25 |
| Integrated fan-out packages and methods of forming the same Grant 10,163,803 - Chen , et al. Dec | 2018-12-25 |
| Semiconductor device and method of manufacture Grant 10,163,866 - Chen , et al. Dec | 2018-12-25 |
| Integrated Fan-out Packages And Methods Of Forming The Same App 20180366410 - Chen; Wei-Yu ; et al. | 2018-12-20 |
| Packages and methods of forming packages Grant 10,157,899 - Yu , et al. Dec | 2018-12-18 |
| Package structures and method of forming the same Grant 10,157,835 - Yu , et al. Dec | 2018-12-18 |
| Multi-stacked package-on-package structures Grant 10,157,852 - Yu , et al. Dec | 2018-12-18 |
| Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices App 20180337163 - Yu; Chen-Hua ; et al. | 2018-11-22 |
| Package Structure and Method of Forming the Same App 20180331069 - Yu; Chen-Hua ; et al. | 2018-11-15 |
| Multi-Stacked Package-on-Package Structures App 20180323150 - Yu; Chen-Hua ; et al. | 2018-11-08 |
| Dam for Three-Dimensional Integrated Circuit App 20180323118 - Wang; Tsung-Ding ; et al. | 2018-11-08 |
| Under bump metallurgy (UBM) and methods of forming same Grant 10,109,607 - Chen , et al. October 23, 2 | 2018-10-23 |
| Chip package structure and method for forming the same Grant 10,103,125 - Yu , et al. October 16, 2 | 2018-10-16 |
| Semiconductor package and method of forming the same Grant 10,096,563 - Chen , et al. October 9, 2 | 2018-10-09 |
| Metal pad for laser marking Grant 10,096,553 - Su , et al. October 9, 2 | 2018-10-09 |
| Device, package structure and method of forming the same Grant 10,090,241 - Chen , et al. October 2, 2 | 2018-10-02 |
| Semiconductor device and method of manufacture Grant 10,090,284 - Chen , et al. October 2, 2 | 2018-10-02 |
| Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20180277520 - Yu; Chen-Hua ; et al. | 2018-09-27 |
| Chip package structure with bump Grant 10,083,927 - Chen , et al. September 25, 2 | 2018-09-25 |
| Packages and packaging methods for semiconductor devices, and packaged semiconductor devices Grant 10,074,631 - Yu , et al. September 11, 2 | 2018-09-11 |
| Multi-Stacked Package-on-Package Structures App 20180226349 - Yu; Chen-Hua ; et al. | 2018-08-09 |
| Raised Via for Terminal Connections on Different Planes App 20180211912 - Yu; Chen-Hua ; et al. | 2018-07-26 |
| Semiconductor Device And Manufacturing Method Thereof App 20180211895 - YANG; TIEN-CHUNG ; et al. | 2018-07-26 |
| Chip-on-Substrate Packaging on Carrier App 20180204810 - Yu; Chen-Hua ; et al. | 2018-07-19 |
| Dam for three-dimensional integrated circuit Grant 10,020,236 - Wang , et al. July 10, 2 | 2018-07-10 |
| Semiconductor package and method of forming the same Grant 10,008,460 - Su , et al. June 26, 2 | 2018-06-26 |
| Fan-out Structure And Method Of Fabricating The Same App 20180174865 - Yu; Chen-Hua ; et al. | 2018-06-21 |
| Chip Package Structure And Method For Forming The Same App 20180151540 - YU; Chen-Hua ; et al. | 2018-05-31 |
| Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 9,984,998 - Yu , et al. May 29, 2 | 2018-05-29 |
| Semiconductor devices, multi-die packages, and methods of manufacure thereof Grant 9,984,969 - Yu , et al. May 29, 2 | 2018-05-29 |
| Chip Package Structure With Molding Layer App 20180122780 - CHEN; Wei-Yu ; et al. | 2018-05-03 |
| Semiconductor Device and Method of Manufacture App 20180122781 - Chen; Wei-Yu ; et al. | 2018-05-03 |
| Chip Package Structure With Bump App 20180122764 - CHEN; Wei-Yu ; et al. | 2018-05-03 |
| Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20180122774 - Huang; Li-Hsien ; et al. | 2018-05-03 |
| Integrated circuit process having alignment marks for underfill Grant 9,953,963 - Chen , et al. April 24, 2 | 2018-04-24 |
| Underfill Control Structures and Method App 20180102299 - Chen; Ying-Ju ; et al. | 2018-04-12 |
| Package structures, pop devices and methods of forming the same Grant 9,941,248 - Yang , et al. April 10, 2 | 2018-04-10 |
| Dicing in wafer level package Grant 9,929,071 - Cheng , et al. March 27, 2 | 2018-03-27 |
| Semiconductor device and manufacturing method thereof Grant 9,929,069 - Yang , et al. March 27, 2 | 2018-03-27 |
| Wafer level shielding in multi-stacked fan out packages and methods of forming same Grant 9,922,939 - Chen , et al. March 20, 2 | 2018-03-20 |
| Chip-on-substrate packaging on carrier Grant 9,922,943 - Yu , et al. March 20, 2 | 2018-03-20 |
| Multi-Stack Package-on-Package Structures App 20180068979 - Lee; Chi-Jung ; et al. | 2018-03-08 |
| Integrated Circuit Package Pad and Methods of Forming App 20180061668 - Chen; Hsien-Wei ; et al. | 2018-03-01 |
| Semiconductor Packages With Thermal-electrical-mechanical Chips And Methods Of Forming The Same App 20180053746 - Yu; Chen-Hua ; et al. | 2018-02-22 |
| Package Structures and Method of Forming the Same App 20180033721 - Yu; Chen-Hua ; et al. | 2018-02-01 |
| Package Structure And Method Of Forming The Same App 20180033771 - Yu; Chen-Hua ; et al. | 2018-02-01 |
| Integrated Fan-Out Structure and Method of Forming App 20180026001 - Chen; Hsien-Wei ; et al. | 2018-01-25 |
| Package Structure And Manufacturing Method Thereof App 20180026010 - Huang; Li-Hsien ; et al. | 2018-01-25 |
| Under Bump Metallurgy (UBM) And Methods Of Forming Same App 20180026002 - Chen; Wei-Yu ; et al. | 2018-01-25 |
| Semiconductor Device and Method of Manufacture App 20180019230 - Chen; Hsien-Wei ; et al. | 2018-01-18 |
| Chip package structure with bump and method for forming the same Grant 9,859,245 - Chen , et al. January 2, 2 | 2018-01-02 |
| Semiconductor device and method of manufacture Grant 9,859,258 - Chen , et al. January 2, 2 | 2018-01-02 |
| Testing, manufacturing, and packaging methods for semiconductor devices Grant 9,852,957 - Huang , et al. December 26, 2 | 2017-12-26 |
| Chip package structure and method for forming the same Grant 9,842,829 - Chen , et al. December 12, 2 | 2017-12-12 |
| Underfill control structures and method Grant 9,842,788 - Chen , et al. December 12, 2 | 2017-12-12 |
| Multi-Stack Package-on-Package Structures App 20170345807 - Yu; Chen-Hua ; et al. | 2017-11-30 |
| Testing, Manufacturing, and Packaging Methods for Semiconductor Devices App 20170345726 - Huang; Li-Hsien ; et al. | 2017-11-30 |
| Package Structures, Pop Devices And Methods Of Forming The Same App 20170345795 - Yang; Tien-Chung ; et al. | 2017-11-30 |
| Structure and Method of Forming a Joint Assembly App 20170345786 - Chen; Ying-Ju ; et al. | 2017-11-30 |
| Semiconductor package and forming method thereof Grant 9,831,215 - Chen , et al. November 28, 2 | 2017-11-28 |
| Semiconductor Device and Method of Manufacture App 20170338207 - Chen; Wei-Yu ; et al. | 2017-11-23 |
| Package Structures And Methods Of Forming The Same App 20170338200 - Huang; Li-Hsien ; et al. | 2017-11-23 |
| Chip package structure with molding layer and method for forming the same Grant 9,825,007 - Chen , et al. November 21, 2 | 2017-11-21 |
| Multi-Stack Package-on-Package Structures App 20170330858 - Lee; Chi-Jung ; et al. | 2017-11-16 |
| Package on-package method Grant 9,812,430 - Chen , et al. November 7, 2 | 2017-11-07 |
| Integrated circuit package pad and methods of forming Grant 9,812,337 - Chen , et al. November 7, 2 | 2017-11-07 |
| Chip Package Structure And Method For Forming The Same App 20170317058 - CHEN; Shao-Yun ; et al. | 2017-11-02 |
| Multi-stack package-on-package structures Grant 9,806,059 - Lee , et al. October 31, 2 | 2017-10-31 |
| Semiconductor Structure and Method of Forming App 20170301562 - Chen; Wei-Yu ; et al. | 2017-10-19 |
| Pop devices and methods of forming the same Grant 9,793,246 - Tseng , et al. October 17, 2 | 2017-10-17 |
| Under bump metallurgy (UBM) and methods of forming same Grant 9,793,231 - Chen , et al. October 17, 2 | 2017-10-17 |
| Semiconductor device and method of manufacture Grant 9,793,245 - Chen , et al. October 17, 2 | 2017-10-17 |
| Integrated fan-out structure and method of forming Grant 9,786,614 - Chen , et al. October 10, 2 | 2017-10-10 |
| Package structures and method of forming the same Grant 9,786,599 - Yu , et al. October 10, 2 | 2017-10-10 |
| Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof App 20170256487 - Yu; Chen-Hua ; et al. | 2017-09-07 |
| Wafer Level Shielding in Multi-Stacked Fan Out Packages and Methods of Forming Same App 20170256502 - Chen; Wei-Yu ; et al. | 2017-09-07 |
| Semiconductor Package And Rework Process For The Same App 20170250171 - Yu; Chen-Hua ; et al. | 2017-08-31 |
| Multi-stack package-on-package structures Grant 9,735,131 - Su , et al. August 15, 2 | 2017-08-15 |
| Packages And Methods Of Forming Packages App 20170229436 - Yu; Chen-Hua ; et al. | 2017-08-10 |
| Package structure Grant 9,728,498 - Su , et al. August 8, 2 | 2017-08-08 |
| Integrated circuit packages and methods of forming same Grant 9,728,522 - Su , et al. August 8, 2 | 2017-08-08 |
| Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20170194292 - Yu; Chen-Hua ; et al. | 2017-07-06 |
| Underfill Control Structures and Method App 20170194226 - Chen; Ying-Ju ; et al. | 2017-07-06 |
| Cylindrical embedded capacitors Grant 9,691,840 - Su , et al. June 27, 2 | 2017-06-27 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170170145 - YU; CHEN-HUA ; et al. | 2017-06-15 |
| Chip on package structure and method Grant 9,679,839 - Su , et al. June 13, 2 | 2017-06-13 |
| Integrated Circuit Packages And Methods Of Forming Same App 20170148768 - Su; An-Jhih ; et al. | 2017-05-25 |
| Wafer level shielding in multi-stacked fan out packages and methods of forming same Grant 9,659,878 - Chen , et al. May 23, 2 | 2017-05-23 |
| Semiconductor devices, multi-die packages, and methods of manufacture thereof Grant 9,659,863 - Yu , et al. May 23, 2 | 2017-05-23 |
| Integrated Fan-Out Structure and Method of Forming App 20170141053 - Chen; Hsien-Wei ; et al. | 2017-05-18 |
| Semiconductor Device and Method of Manufacture App 20170141080 - Chen; Hsien-Wei ; et al. | 2017-05-18 |
| Multi-Stack Package-on-Package Structures App 20170133351 - Su; An-Jhih ; et al. | 2017-05-11 |
| Integrated Circuit Process Having Alignment Marks For Underfill App 20170133354 - Chen; Hsien-Wei ; et al. | 2017-05-11 |
| Packages and methods of forming packages Grant 9,646,955 - Yu , et al. May 9, 2 | 2017-05-09 |
| Metal Pad for Laser Marking App 20170125355 - Su; An-Jhih ; et al. | 2017-05-04 |
| Semiconductor device Grant 9,640,496 - Chen , et al. May 2, 2 | 2017-05-02 |
| Wafer Level Shielding In Multi-stacked Fan Out Packages And Methods Of Forming Same App 20170110413 - Chen; Wei-Yu ; et al. | 2017-04-20 |
| Semiconductor Device And Manufacturing Method Thereof App 20170098588 - YANG; TIEN-CHUNG ; et al. | 2017-04-06 |
| Chip-on-Substrate Packaging on Carrier App 20170098617 - Yu; Chen-Hua ; et al. | 2017-04-06 |
| Anti-fuse on and/or in package Grant 9,613,910 - Su , et al. April 4, 2 | 2017-04-04 |
| Semiconductor Device App 20170084556 - CHEN; WEI-YU ; et al. | 2017-03-23 |
| Semiconductor Package and Method of Forming the Same App 20170069590 - Chen; Hsien-Wei ; et al. | 2017-03-09 |
| Metal pad for laser marking Grant 9,589,900 - Su , et al. March 7, 2 | 2017-03-07 |
| Dicing in Wafer Level Package App 20170062300 - Cheng; Chia-Shen ; et al. | 2017-03-02 |
| Packages with thermal interface material on the sidewalls of stacked dies Grant 9,583,415 - Yu , et al. February 28, 2 | 2017-02-28 |
| Semiconductor Device And Manufacturing Method Thereof App 20170053812 - YANG; TIEN-CHUNG ; et al. | 2017-02-23 |
| Package Structures And Method Of Forming The Same App 20170053896 - Yu; Chen-Hua ; et al. | 2017-02-23 |
| Integrated circuit packages and methods of forming same Grant 9,570,322 - Su , et al. February 14, 2 | 2017-02-14 |
| Semiconductor Package and Method of Forming the Same App 20170040271 - Su; An-Jhih ; et al. | 2017-02-09 |
| Package-on-Package Method App 20170040298 - Chen; Hsien-Wei ; et al. | 2017-02-09 |
| Semiconductor device and manufacturing method thereof Grant 9,564,345 - Yang , et al. February 7, 2 | 2017-02-07 |
| Under Bump Metallurgy (ubm) And Methods Of Forming Same App 20170005052 - Chen; Wei-Yu ; et al. | 2017-01-05 |
| Package Structure App 20170005034 - Su; An-Jhih ; et al. | 2017-01-05 |
| Chip-on-substrate packaging on carrier Grant 9,524,942 - Yu , et al. December 20, 2 | 2016-12-20 |
| Device, Package Structure And Method Of Forming The Same App 20160351494 - Chen; Hsien-Wei ; et al. | 2016-12-01 |
| Semiconductor package and method of forming the same Grant 9,502,364 - Chen , et al. November 22, 2 | 2016-11-22 |
| Dicing in wafer level package Grant 9,484,227 - Cheng , et al. November 1, 2 | 2016-11-01 |
| Semiconductor package and method of forming the same Grant 9,478,443 - Su , et al. October 25, 2 | 2016-10-25 |
| Package-on-package Structure Grant 9,478,521 - Chen , et al. October 25, 2 | 2016-10-25 |
| Integrated Circuit Package Pad And Methods Of Forming App 20160163566 - Chen; Hsien-Wei ; et al. | 2016-06-09 |
| Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof App 20160155730 - Yu; Chen-Hua ; et al. | 2016-06-02 |
| Integrated Circuit Packages and Methods of Forming Same App 20160148903 - Su; An-Jhih ; et al. | 2016-05-26 |
| Package-on-Package Structure and Method App 20160093590 - Chen; Hsien-Wei ; et al. | 2016-03-31 |
| Semiconductor package and method Grant 9,293,442 - Su , et al. March 22, 2 | 2016-03-22 |
| Packages and Methods of Forming Packages App 20160071829 - Yu; Chen-Hua ; et al. | 2016-03-10 |
| Semiconductor Package And Method Of Forming The Same App 20160064342 - CHEN; HSIEN-WEI ; et al. | 2016-03-03 |
| Semiconductor Package And Method Of Forming The Same App 20160064309 - Su; An-Jhih ; et al. | 2016-03-03 |
| Anti-fuse on and/or in Package App 20160020172 - Su; An-Jhih ; et al. | 2016-01-21 |
| Devices, Packaging Devices, and Methods of Packaging Semiconductor Devices App 20150371947 - Chen; Hsien-Wei ; et al. | 2015-12-24 |
| Metal Pad for Laser Marking App 20150348912 - Su; An-Jhih ; et al. | 2015-12-03 |
| Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices App 20150294939 - Yu; Chen-Hua ; et al. | 2015-10-15 |
| Dam for Three-Dimensional Integrated Circuit App 20150262900 - Wang; Tsung-Ding ; et al. | 2015-09-17 |
| Semiconductor Package and Method App 20150255431 - Su; An-Jhih ; et al. | 2015-09-10 |
| Chip-on-Substrate Packaging on Carrier App 20150171034 - Yu; Chen-Hua ; et al. | 2015-06-18 |
| Chip on Package Structure and Method App 20150115470 - Su; An-Jhih ; et al. | 2015-04-30 |
| Packages with Thermal Interface Material on the Sidewalls of Stacked Dies App 20150108628 - Yu; Chen-Hua ; et al. | 2015-04-23 |
| Bump with protection structure Grant 8,847,388 - Yu , et al. September 30, 2 | 2014-09-30 |
| Cylindrical Embedded Capacitors App 20140106536 - Su; An-Jhih ; et al. | 2014-04-17 |
| Cylindrical embedded capacitors Grant 8,693,163 - Su , et al. April 8, 2 | 2014-04-08 |
| Bump With Protection Structure App 20130087908 - YU; Chen-Hua ; et al. | 2013-04-11 |
| Radiate under-bump metallization structure for semiconductor devices Grant 8,294,264 - Wang , et al. October 23, 2 | 2012-10-23 |
| Cylindrical Embedded Capacitors App 20120049322 - Su; An-Jhih ; et al. | 2012-03-01 |
| Radiate Under-Bump Metallization Structure for Semiconductor Devices App 20110241201 - Wang; Tzu-Yu ; et al. | 2011-10-06 |
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