Silicon Genesis Corporation

Patent Applications and Registrations

Patent applications and USPTO patent grants for Silicon Genesis Corporation.The latest application filed is for "three dimensional integrated circuit".

Company Profile

12.161.102

Silicon Genesis Corporation - Fremont CA
Silicon Genesis Corporation - Santa Clara CA US
Silicon Genesis Corporation - San Jose CA US
Silicon Genesis Corporation; - US
Silicon Genesis Corporation; - San Jose CA US
Silicon Genesis Corporation - Aptos CA
Silicon Genesis Corporation - Campbell CA
Silicon Genesis Corporation - 61 Daggett Drive San Jose CA
Silicon Genesis Corporation - 590 Division Street Campbell CA
Silicon Genesis Corporation - Los Gatos CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Layer transfer of films utilizing controlled shear region Grant 11,444,221 - Henley September 13, 2	2022-09-13
Three dimensional integrated circuit with lateral connection layer Grant 11,410,984 - Current , et al. August 9, 2	2022-08-09
Three Dimensional Integrated Circuit App 20210242184 - FONG; Theodore E. ; et al.	2021-08-05
Three dimensional integrated circuit Grant 10,923,459 - Fong , et al. February 16, 2	2021-02-16
Three dimensional integrated circuit Grant 10,804,252 - Fong , et al. October 13, 2	2020-10-13
Three Dimensional Integrated Circuit App 20200194409 - FONG; Theodore E. ; et al.	2020-06-18
Shaped silicon ingot using layer transfer Grant 10,683,588 - Henley	2020-06-16
Three Dimensional Integrated Circuit App 20200185364 - FONG; Theodore E. ; et al.	2020-06-11
Three dimensional integrated circuit Grant 10,573,627 - Fong , et al. Feb	2020-02-25
Layer Transfer Of Films Utilizing Controlled Shear Region App 20190326467 - HENLEY; Francois J.	2019-10-24
Shaped Silicon Ingot Using Layer Transfer App 20190017192 - HENLEY; Francois J.	2019-01-17
Three Dimensional Integrated Circuit App 20180350785 - FONG; Theodore E. ; et al.	2018-12-06
Method and device for slicing a shaped silicon ingot using layer transfer Grant 10,087,551 - Henley October 2, 2	2018-10-02
Three dimensional integrated circuit Grant 10,049,915 - Fong , et al. August 14, 2	2018-08-14
Three Dimensional Integrated Circuit App 20180175008 - FONG; Theodore E. ; et al.	2018-06-21
Three Dimensional Integrated Circuit App 20180082989 - Fong; Theodore E. ; et al.	2018-03-22
Techniques For Forming Optoelectronic Devices App 20170358704 - HENLEY; Francois J. ; et al.	2017-12-14
Three Dimensional Integrated Circuit App 20170301657 - FONG; Theodore E. ; et al.	2017-10-19
Three dimensional integrated circuit Grant 9,704,835 - Fong , et al. July 11, 2	2017-07-11
Substrate cleaving under controlled stress conditions Grant 9,640,711 - Henley , et al. May 2, 2	2017-05-02
Techniques For Forming Optoelectronic Devices App 20170084778 - HENLEY; Francois J. ; et al.	2017-03-23
Method And Device For Slicing A Shaped Silicon Ingot Using Layer Transfer App 20170002479 - Henley; Francois J.	2017-01-05
Apparatus And Method Of Cleaving Thin Layer From Bulk Material App 20160319462 - HENLEY; Francois J.	2016-11-03
Method and device for slicing a shaped silicon ingot using layer transfer Grant 9,460,908 - Henley October 4, 2	2016-10-04
Substrate Cleaving Under Controlled Stress Conditions App 20160276522 - HENLEY; Francois ; et al.	2016-09-22
Layer Transfer Of Films Utilizing Controlled Shear Region App 20160247958 - HENLEY; Francois J.	2016-08-25
Apparatus And Method Of Cleaving Thin Layer From Bulk Material App 20160208416 - HENLEY; Francois J.	2016-07-21
Three Dimensional Integrated Circuit App 20160204088 - FONG; Theodore E. ; et al.	2016-07-14
Layer transfer of films utilizing controlled shear region Grant 9,362,439 - Henley June 7, 2	2016-06-07
Substrate cleaving under controlled stress conditions Grant 9,356,181 - Henley , et al. May 31, 2	2016-05-31
Method of cleaving a thin sapphire layer from a bulk material by implanting a plurality of particles and performing a controlled cleaving process Grant 9,336,989 - Henley May 10, 2	2016-05-10
Techniques For Forming Optoelectronic Devices App 20160111500 - HENLEY; Francois J. ; et al.	2016-04-21
Techniques for forming optoelectronic devices Grant 9,257,339 - Henley , et al. February 9, 2	2016-02-09
Controlled process and resulting device Grant 9,159,605 - Henley , et al. October 13, 2	2015-10-13
Substrate Cleaving Under Controlled Stress Conditions App 20150155422 - HENLEY; Francois ; et al.	2015-06-04
Substrate cleaving under controlled stress conditions Grant 8,993,410 - Henley , et al. March 31, 2	2015-03-31
Cleaving Thin Layer From Bulk Material And Apparatus Including Cleaved Thin Layer App 20150044447 - HENLEY; Francois J.	2015-02-12
Controlled Process And Resulting Device App 20140370687 - HENLEY; Francois J. ; et al.	2014-12-18
Controlled process and resulting device Grant 8,835,282 - Henley , et al. September 16, 2	2014-09-16
Method And Device For Slicing A Shaped Silicon Ingot Using Layer Transfer App 20140106540 - Henley; Francois J.	2014-04-17
Layer transfer of films utilizing thermal flux regime for energy controlled cleaving Grant 8,637,382 - Henley January 28, 2	2014-01-28
Method and device for slicing a shaped silicon ingot using layer transfer Grant 8,623,137 - Henley January 7, 2	2014-01-07
Techniques For Forming Optoelectronic Devices App 20130292691 - Henley; Francois J. ; et al.	2013-11-07
Method and structure for fabricating solar cells using a thick layer transfer process Grant 8,563,402 - Henley October 22, 2	2013-10-22
Apparatus and Method of Cleaving Thin Layer from Bulk Material App 20130209740 - Henley; Francois J.	2013-08-15
Controlled Process And Resulting Device App 20130143389 - HENLEY; FRANCOIS J. ; et al.	2013-06-06
Layer Transfer Of Films Utilizing Thermal Flux Regime For Energy Controlled Cleaving App 20130032582 - HENLEY; FRANCOIS J.	2013-02-07
Techniques for forming thin films by implantation with reduced channeling Grant 8,329,557 - Brailove , et al. December 11, 2	2012-12-11
Race track configuration and method for wafering silicon solar substrates Grant 8,330,126 - Henley , et al. December 11, 2	2012-12-11
Layer transfer of films utilizing controlled propagation Grant 8,293,619 - Henley October 23, 2	2012-10-23
Substrate Cleaving Under Controlled Stress Conditions App 20120234887 - Henley; Francois ; et al.	2012-09-20
Substrate stiffness method and resulting devices for layer transfer process Grant 8,241,996 - Henley , et al. August 14, 2	2012-08-14
Apparatus and method of temperature control during cleaving processes of thick materials Grant 8,222,119 - Henley July 17, 2	2012-07-17
Non-contact etch annealing of strained layers Grant 8,187,377 - Malik , et al. May 29, 2	2012-05-29
Method and system for continuous large-area scanning implantation process Grant 8,153,513 - Henley April 10, 2	2012-04-10
Apparatus And Method Of Temperature Control During Cleaving Processes Of Thick Materials App 20120077289 - HENLEY; FRANCOIS J.	2012-03-29
Method for fabricating semiconductor devices using strained silicon bearing material Grant 8,143,165 - Henley March 27, 2	2012-03-27
Free-standing thickness of single crystal material and method having carrier lifetimes Grant 8,133,800 - Henley , et al. March 13, 2	2012-03-13
Method And Structure For Fabricating Solar Cells Using A Thick Layer Transfer Process App 20120058624 - HENLEY; FRANCOIS J.	2012-03-08
Method and structure for thick layer transfer using a linear accelerator Grant 8,124,499 - Henley , et al. February 28, 2	2012-02-28
Method and structure for fabricating solar cells using a thick layer transfer process Grant 8,110,480 - Henley February 7, 2	2012-02-07
Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process Grant 8,071,463 - Henley December 6, 2	2011-12-06
Controlled Process And Resulting Device App 20110294306 - Henley; Francois J. ; et al.	2011-12-01
Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process Grant 8,012,855 - Henley September 6, 2	2011-09-06
Method and structure for fabricating solar cells Grant 8,012,851 - Henley , et al. September 6, 2	2011-09-06
Controlled process and resulting device Grant 8,012,852 - Henley , et al. September 6, 2	2011-09-06
Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process Grant 7,911,016 - Henley March 22, 2	2011-03-22
Method and structure using selected implant angles using a linear accelerator process for manufacture of free standing films of materials Grant 7,910,458 - Henley March 22, 2	2011-03-22
Liquid based substrate method and structure for layer transfer applications Grant 7,910,456 - Kirk March 22, 2	2011-03-22
Method and structure for fabricating solar cells using a layer transfer process Grant 7,863,157 - Henley , et al. January 4, 2	2011-01-04
Techniques For Forming Thin Films By Implantation With Reduced Channeling App 20100317140 - BRAILOVE; ADAM ; et al.	2010-12-16
Controlled process and resulting device Grant 7,846,818 - Henley , et al. December 7, 2	2010-12-07
Controlled Process And Resulting Device App 20100282323 - Henley; Francois J. ; et al.	2010-11-11
Method and edge region structure using co-implanted particles for layer transfer processes Grant 7,811,901 - Ong , et al. October 12, 2	2010-10-12
Method and structure for fabricating solar cells using a thick layer transfer process Grant 7,811,900 - Henley October 12, 2	2010-10-12
Controlled cleaving process Grant 7,781,305 - Henley , et al. August 24, 2	2010-08-24
Controlled process and resulting device Grant 7,776,717 - Henley , et al. August 17, 2	2010-08-17
Method for manufacturing devices on a multi-layered substrate utilizing a stiffening backing substrate Grant 7,772,088 - Henley , et al. August 10, 2	2010-08-10
Method and Structure for Fabricating Solar Cells App 20100180945 - Henley; Francois J. ; et al.	2010-07-22
Method and structure for fabricating solar cells using a layer transfer process Grant 7,759,220 - Henley July 20, 2	2010-07-20
Controlled process and resulting device Grant 7,759,217 - Henley , et al. July 20, 2	2010-07-20
Method and Structure for Fabricating Solar Cells Using a Thick Layer Transfer Process App 20100178723 - Henley; Francois J.	2010-07-15
Method and Structure for Fabricating Multiple Tiled Regions Onto a Plate Using a Controlled Cleaving Process App 20100126587 - Henley; Francois J.	2010-05-27
Method and Structure for Fabricating Multiple Tiled Regions Onto a Plate Using a Controlled Cleaving Process App 20100129951 - Henley; Francois J.	2010-05-27
Method and Structure for Fabricating Multiple Tiled Regions Onto a Plate Using a Controlled Cleaving Process App 20100129950 - Henley; Francois J.	2010-05-27
Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process Grant 7,674,687 - Henley March 9, 2	2010-03-09
Layer transfer of films utilizing controlled propagation App 20100055874 - Henley; Francois J.	2010-03-04
Free-standing thickness of single crystal material and method having carrier lifetimes App 20100052105 - Henley; Francois J. ; et al.	2010-03-04
Race track configuration and method for wafering silicon solar substrates App 20100044595 - Henley; Francois J. ; et al.	2010-02-25
Method and structure for implanting bonded substrates for electrical conductivity Grant 7,629,666 - Henley December 8, 2	2009-12-08
Layer Transfer Of Films Utilizing Controlled Shear Region App 20090277314 - Henley; Francois J.	2009-11-12
Method for fabricating semiconductor devices using strained silicon bearing material App 20090258496 - Henley; Francois J.	2009-10-15
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species Grant 7,598,153 - Henley , et al. October 6, 2	2009-10-06
Method and system for fabricating strained layers for the manufacture of integrated circuits Grant 7,595,499 - Henley , et al. September 29, 2	2009-09-29
Carrier Apparatus And Method For Shaped Sheet Materials App 20090152162 - TIAN; LU ; et al.	2009-06-18
Method and structure for implanting bonded substrates for electrical conductivity Grant 7,547,609 - Henley June 16, 2	2009-06-16
Method and device for controlled cleaving process App 20090093103 - Henley; Francois J. ; et al.	2009-04-09
Method And Structure Using Selected Implant Angles Using A Linear Accelerator Process For Manufacture Of Free Standing Films Of Materials App 20090042369 - Henley; Francois J.	2009-02-12
Method and apparatus for flag-less water bonding tool Grant 7,479,441 - Kirk , et al. January 20, 2	2009-01-20
Method and structure for implanting bonded substrates for electrical conductivity App 20090001500 - Henley; Francois J.	2009-01-01
Method and device for controlled cleaving process Grant 7,470,600 - Henley , et al. December 30, 2	2008-12-30
Method for fabricating semiconductor devices using strained silicon bearing material Grant 7,462,526 - Henley December 9, 2	2008-12-09
Controlled process and resulting device App 20080286945 - Henley; Francois J. ; et al.	2008-11-20
Manufacturing strained silicon substrates using a backing material Grant 7,427,554 - Henley , et al. September 23, 2	2008-09-23
Cleaving process to fabricate multilayered substrates using low implantation doses App 20080206963 - Henley; Francois J. ; et al.	2008-08-28
Method And Structure For Thick Layer Transfer Using A Linear Accelerator App 20080206962 - Henley; Francois J. ; et al.	2008-08-28
Controlled process and resulting device Grant 7,410,887 - Henley , et al. August 12, 2	2008-08-12
Apparatus And Method Of Temperature Conrol During Cleaving Processes Of Thick Film Materials App 20080188011 - Henley; Francois J.	2008-08-07
Method And Structure For Fabricating Solar Cells Using A Thick Layer Transfer Process App 20080179547 - Henley; Francois J.	2008-07-31
Controlled cleaving process App 20080182386 - Henley; Francois J. ; et al.	2008-07-31
Method and structure for implanting bonded substrates for electrical conductivity Grant 7,399,680 - Henley July 15, 2	2008-07-15
Method and structure for fabricating solar cells using a layer transfer process App 20080160661 - Henley; Francois J.	2008-07-03
Method for fabricating semiconductor devices using strained silicon bearing material App 20080153220 - Henley; Francois J.	2008-06-26
System for forming a strained layer of semiconductor material Grant 7,391,047 - Henley , et al. June 24, 2	2008-06-24
Method and system for lattice space engineering Grant 7,390,724 - Henley , et al. June 24, 2	2008-06-24
Method and system for fabricating strained layers for the manufacture of integrated circuits App 20080141510 - Henley; Francois J. ; et al.	2008-06-19
Apparatus And Method For Introducing Particles Using A Radio Frequency Quadrupole Linear Accelerator For Semiconductor Materials App 20080128641 - Henley; Francois J. ; et al.	2008-06-05
Cleaving process to fabricate multilayered substrates using low implantation doses Grant 7,378,330 - Henley , et al. May 27, 2	2008-05-27
Controlled cleaving process Grant 7,371,660 - Henley , et al. May 13, 2	2008-05-13
Method for fabricating semiconductor devices using strained silicon bearing material Grant 7,354,815 - Henley April 8, 2	2008-04-08
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process Grant 7,351,644 - Henley April 1, 2	2008-04-01
Method and device for controlled cleaving process Grant 7,348,258 - Henley , et al. March 25, 2	2008-03-25
Method and Device for Controlled Cleaving Process App 20080057675 - Henley; Francois J. ; et al.	2008-03-06
Method And System For Continuous Large-area Scanning Implantation Process App 20080038908 - Henley; Francois J.	2008-02-14
Controlled Process and Resulting Device App 20080038901 - Henley; Francois J. ; et al.	2008-02-14
Surface finishing of SOI substrates using an EPI process App 20070259526 - Kang; Sien G. ; et al.	2007-11-08
Method And Structure For Fabricating Solar Cells Using A Layer Transfer Process App 20070235074 - Henley; Francois J. ; et al.	2007-10-11
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species App 20070232022 - Henley; Francois J. ; et al.	2007-10-04
Surface finishing of SOI substrates using an EPI process Grant 7,253,081 - Kang , et al. August 7, 2	2007-08-07
Controlled Process And Resulting Device App 20070123013 - HENLEY; FRANCOIS J. ; et al.	2007-05-31
Controlled Process And Resulting Device App 20070122995 - HENLEY; FRANCOIS J. ; et al.	2007-05-31
Controlled Process And Resulting Device App 20070122997 - HENLEY; FRANCOIS J. ; et al.	2007-05-31
Method and apparatus for flag-less water bonding tool App 20070087531 - Kirk; Harry R. ; et al.	2007-04-19
Non-contact etch annealing of strained layers App 20070051299 - Ong; Philip ; et al.	2007-03-08
Manufacturing strained silicon substrates using a backing material App 20070037323 - Henley; Francois J. ; et al.	2007-02-15
Pre-made cleavable substrate method and structure of fabricating devices using one or more films provided by a layer transfer process App 20070029043 - Henley; Francois J.	2007-02-08
Method and structure for fabricating devices using one or more films provided by a layer transfer process and etch back App 20070032044 - Henley; Francois J.	2007-02-08
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process App 20070032084 - Henley; Francois J.	2007-02-08
Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process App 20070026638 - Henley; Francois J.	2007-02-01
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process Grant 7,166,520 - Henley January 23, 2	2007-01-23
Controlled cleaving process Grant 7,160,790 - Henley , et al. January 9, 2	2007-01-09
Non-contact etch annealing of strained layers Grant 7,147,709 - Ong , et al. December 12, 2	2006-12-12
Method and system for source switching and in-situ plasma bonding App 20060240645 - Henley; Francois J.	2006-10-26
Substrate stiffness method and resulting devices for layer transfer process App 20060211219 - Henley; Francois J. ; et al.	2006-09-21
Applications and equipment of substrate stiffness method and resulting devices for layer transfer processes on quartz or glass App 20060205180 - Henley; Francois J. ; et al.	2006-09-14
Method and system for fabricating strained layers for the manufacture of integrated circuits Grant 7,094,666 - Henley , et al. August 22, 2	2006-08-22
Cleaving process to fabricate multilayered substrates using low implantation doses App 20060166472 - Henley; Francois J. ; et al.	2006-07-27
Method and system for fabricating strained layers for the manufacture of integrated circuits App 20060160329 - Henley; Francois J. ; et al.	2006-07-20
Method and system for source switching and in-situ plasma bonding Grant 7,078,317 - Henley July 18, 2	2006-07-18
Controlled cleaving process App 20060141747 - Henley; Francois J. ; et al.	2006-06-29
Method and structure for implanting bonded substrates for electrical conductivity App 20060138583 - Henley; Francois J.	2006-06-29
Method and structure for implanting bonded substrates for electrical conductivity App 20060131687 - Henley; Francois J.	2006-06-22
Cleaving process to fabricate multilayered substrates using low implantation doses Grant 7,056,808 - Henley , et al. June 6, 2	2006-06-06
Method and system for source switching and in-situ plasma bonding App 20060030167 - Henley; Francois J.	2006-02-09
Method and system for fabricating strained layers for the manufacture of integrated circuits App 20060024917 - Henley; Francois J. ; et al.	2006-02-02
Treatment method of film quality for the manufacture of substrates Grant 6,969,668 - Kang , et al. November 29, 2	2005-11-29
Method for smoothing a film of material using a ring structure App 20050247668 - Malik, Igor J. ; et al.	2005-11-10
Method and system for lattice space engineering App 20050233545 - Henley, Francois J. ; et al.	2005-10-20
Method for fabricating semiconductor devices using strained silicon bearing material App 20050227425 - Henley, Francois J.	2005-10-13
Controlled cleaving process App 20050186758 - Henley, Francois J. ; et al.	2005-08-25
Apparatus and method for controlled cleaving App 20050150597 - Henley, Francois ; et al.	2005-07-14
In situ plasma wafer bonding method Grant 6,908,832 - Farrens , et al. June 21, 2	2005-06-21
Method for fabricating semiconductor devices using strained silicon bearing material App 20050118754 - Henley, Francois J.	2005-06-02
Gettering technique for wafers made using a controlled cleaving process Grant 6,890,838 - Henley , et al. May 10, 2	2005-05-10
Smoothing method for cleaved films made using a release layer Grant 6,881,644 - Malik , et al. April 19, 2	2005-04-19
Method and device for controlled cleaving process App 20050070071 - Henley, Francois J. ; et al.	2005-03-31
Method and device for controlled cleaving process Grant 6,790,747 - Henley , et al. September 14, 2	2004-09-14
Method for multi-frequency bonding Grant 6,780,759 - Farrens , et al. August 24, 2	2004-08-24
In situ plasma wafer bonding method App 20040132304 - Farrens, Sharon N. ; et al.	2004-07-08
Gettering technique for wafers made using a controlled cleaving process App 20040097055 - Henley, Francois J. ; et al.	2004-05-20
In situ plasma wafer bonding method Grant 6,645,828 - Farrens , et al. November 11, 2	2003-11-11
System for the plasma treatment of large area substrates Grant 6,632,324 - Chan October 14, 2	2003-10-14
Controlled cleaving process Grant 6,632,724 - Henley , et al. October 14, 2	2003-10-14
Cleaving process to fabricate multilayered substrates using low implantation doses App 20030124815 - Henley, Francois J. ; et al.	2003-07-03
Controlled cleavage process using pressurized fluid Grant 6,582,999 - Henley , et al. June 24, 2	2003-06-24
Method and device for controlled cleaving process App 20030113983 - Henley, Francois J. ; et al.	2003-06-19
Apparatus and method for surface finishing a silicon film Grant 6,562,720 - Thilderkvist , et al. May 13, 2	2003-05-13
Silicon-on-silicon hybrid wafer assembly Grant 6,558,802 - Henley , et al. May 6, 2	2003-05-06
Substrate cleaving tool and method Grant 6,554,046 - Bryan , et al. April 29, 2	2003-04-29
Gettering technique for wafers made using a controlled cleaving process Grant 6,548,382 - Henley , et al. April 15, 2	2003-04-15
Particle distribution method and resulting structure for a layer transfer process Grant 6,544,862 - Bryan April 8, 2	2003-04-08
Method for fabricating multi-layered substrates Grant 6,534,381 - Cheung , et al. March 18, 2	2003-03-18
Controlled cleavage process and device for patterned films Grant 6,528,391 - Henley , et al. March 4, 2	2003-03-04
Method for non mass selected ion implant profile control Grant 6,514,838 - Chan February 4, 2	2003-02-04
Nozzle for cleaving substrates Grant 6,513,564 - Bryan , et al. February 4, 2	2003-02-04
Controlled cleavage process using pressurized fluid Grant 6,511,899 - Henley , et al. January 28, 2	2003-01-28
Smoothing method for cleaved films made using a release layer App 20030008477 - Kang, Sien G. ; et al.	2003-01-09
Method and apparatus for multi-frequency bonding App 20030003684 - Farrens, Shari N. ; et al.	2003-01-02
Cleaving process to fabricate multilayered substrates using low implantation doses Grant 6,500,732 - Henley , et al. December 31, 2	2002-12-31
Apparatus and method for surface finishing a silicon film Grant 6,489,241 - Thilderkvist , et al. December 3, 2	2002-12-03
Method and device for controlled cleaving process Grant 6,486,041 - Henley , et al. November 26, 2	2002-11-26
High temperature implant apparatus Grant 6,458,723 - Henley , et al. October 1, 2	2002-10-01
Controlled cleavage process and resulting device using beta annealing Grant 6,458,672 - Henley , et al. October 1, 2	2002-10-01
Smoothing method for cleaved films made using thermal treatment Grant 6,455,399 - Malik , et al. September 24, 2	2002-09-24
Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer Grant 6,448,152 - Henley , et al. September 10, 2	2002-09-10
Method and resulting device for manufacturing for double gated transistors App 20020090758 - Henley, Francois J. ; et al.	2002-07-11
Generic layer transfer methodology by controlled cleavage process App 20020081823 - Cheung, Nathan W. ; et al.	2002-06-27
Generic layer transfer methodology by controlled cleavage process Grant 6,391,740 - Cheung , et al. May 21, 2	2002-05-21
Controlled cleavage process using pressurized fluid App 20020055266 - Henley, Francois J. ; et al.	2002-05-09
Controlled cleavage thin film separation process using a reusable substrate Grant 6,335,264 - Henley , et al. January 1, 2	2002-01-01
Clustertool system software using plasma immersion ion implantation Grant 6,321,134 - Henley , et al. November 20, 2	2001-11-20
Enhanced plasma mode and system for plasma immersion ion implantation Grant 6,300,227 - Liu , et al. October 9, 2	2001-10-09
Method and device for controlled cleaving process Grant 6,291,313 - Henley , et al. September 18, 2	2001-09-18
Controlled cleavage process and device for patterned films using a release layer Grant 6,291,314 - Henley , et al. September 18, 2	2001-09-18
Controlled cleavage process using patterning Grant 6,290,804 - Henley , et al. September 18, 2	2001-09-18
Surface finishing of SOI substrates using an EPI process Grant 6,287,941 - Kang , et al. September 11, 2	2001-09-11
Method and device for controlled cleaving process Grant 6,284,631 - Henley , et al. September 4, 2	2001-09-04
Method for non mass selected ion implant profile control Grant 6,274,459 - Chan August 14, 2	2001-08-14
Collection devices for plasma immersion ion implantation Grant 6,269,765 - Chu , et al. August 7, 2	2001-08-07
Wafer edge engineering method and device Grant 6,265,328 - Henley , et al. July 24, 2	2001-07-24
Nozzle for cleaving substrates Grant 6,263,941 - Bryan , et al. July 24, 2	2001-07-24
Controlled cleavage process and device for patterned films using patterned implants Grant 6,248,649 - Henley , et al. June 19, 2	2001-06-19
Economical silicon-on-silicon hybrid wafer assembly Grant 6,245,161 - Henley , et al. June 12, 2	2001-06-12
Contoured platen design for plasma immerson ion implantation Grant 6,228,176 - Chu , et al. May 8, 2	2001-05-08
Substrate cleaving tool and method Grant 6,221,740 - Bryan , et al. April 24, 2	2001-04-24
Method for surface treatment of substrates Grant 6,221,774 - Malik April 24, 2	2001-04-24
Enhanced plasma mode and computer system for plasma immersion ion implantation Grant 6,213,050 - Liu , et al. April 10, 2	2001-04-10
Cluster tool apparatus using plasma immersion ion implantation Grant 6,207,005 - Henley , et al. March 27, 2	2001-03-27
Smoothing method for cleaved films made using thermal treatment Grant 6,204,151 - Malik , et al. March 20, 2	2001-03-20
Device for patterned films Grant 6,187,110 - Henley , et al. February 13, 2	2001-02-13
Shielded platen design for plasma immersion ion implantation Grant 6,186,091 - Chu , et al. February 13, 2	2001-02-13
Pre-semiconductor process implant and post-process film separation Grant 6,184,111 - Henley , et al. February 6, 2	2001-02-06
In situ plasma wafer bonding method Grant 6,180,496 - Farrens , et al. January 30, 2	2001-01-30
Treatment method of cleaved film for the manufacture of substrates Grant 6,171,965 - Kang , et al. January 9, 2	2001-01-09
Controlled cleavage process and resulting device using beta annealing Grant 6,162,705 - Henley , et al. December 19, 2	2000-12-19
Silicon-on-silicon wafer bonding process using a thin film blister-separation method Grant 6,159,824 - Henley , et al. December 12, 2	2000-12-12
Controlled cleavage thin film separation process using a reusable substrate Grant 6,159,825 - Henley , et al. December 12, 2	2000-12-12
Controlled cleavage system using pressurized fluid Grant 6,155,909 - Henley , et al. December 5, 2	2000-12-05
Cluster tool method using plasma immersion ion implantation Grant 6,153,524 - Henley , et al. November 28, 2	2000-11-28
Pressurized microbubble thin film separation process using a reusable substrate Grant 6,146,979 - Henley , et al. November 14, 2	2000-11-14
Removable liner design for plasma immersion ion implantation Grant 6,120,660 - Chu , et al. September 19, 2	2000-09-19
Distributed system and code for control and automation of plasma immersion ion implanter Grant 6,113,735 - Chu , et al. September 5, 2	2000-09-05
Planarizing technique for multilayered substrates Grant 6,103,599 - Henley , et al. August 15, 2	2000-08-15
Gettering technique for silicon-on-insulator wafers Grant 6,083,324 - Henley , et al. July 4, 2	2000-07-04
Perforated shield for plasma immersion ion implantation Grant 6,051,073 - Chu , et al. April 18, 2	2000-04-18
Silicon-on-silicon hybrid wafer assembly Grant 6,048,411 - Henley , et al. April 11, 2	2000-04-11
Method for controlled cleaving process Grant 6,033,974 - Henley , et al. March 7, 2	2000-03-07
Controlled cleavage process using pressurized fluid Grant 6,013,567 - Henley , et al. January 11, 2	2000-01-11
Controlled cleaning process Grant 6,013,563 - Henley , et al. January 11, 2	2000-01-11
Reusable substrate for thin film separation Grant 6,010,579 - Henley , et al. January 4, 2	2000-01-04
Controlled cleavage process using pressurized fluid Grant 5,994,207 - Henley , et al. November 30, 1	1999-11-30
Controlled cleavage process and device for patterned films Grant 5,985,742 - Henley , et al. November 16, 1	1999-11-16
Tumbling barrel plasma processor Grant 5,945,012 - Chan August 31, 1	1999-08-31

Company Registrations

NCAGE Code	1KY15	SILICON GENESIS CORPORATION
CAGE Code	1KY15	SILICON GENESIS CORPORATION
DUNS	806606646	SILICON GENESIS CORPORATION
SEC	0001407385	Silicon Genesis Corp of CALIFORNIA