| Patent | Date |
|---|
Skip via connection between metallization levels
Grant 11,315,827 - Huang , et al. April 26, 2 | 2022-04-26 |
Copper Interconnect Structure With Manganese Barrier Layer
App 20220115269 - Edelstein; Daniel C. ; et al. | 2022-04-14 |
Bottom Barrier Free Interconnects Without Voids
App 20220028797 - Cheng; Kenneth Chun Kuen ; et al. | 2022-01-27 |
Trapezoidal Interconnect at Tight BEOL Pitch
App 20220013406 - Lanzillo; Nicholas Anthony ; et al. | 2022-01-13 |
Trapezoidal interconnect at tight BEOL pitch
Grant 11,177,162 - Lanzillo , et al. November 16, 2 | 2021-11-16 |
Interconnects with gouged vias
Grant 11,177,169 - Cheng , et al. November 16, 2 | 2021-11-16 |
Barrier-less Prefilled Via Formation
App 20210343589 - Lanzillo; Nicholas Anthony ; et al. | 2021-11-04 |
Bottom barrier free interconnects without voids
Grant 11,164,815 - Cheng , et al. November 2, 2 | 2021-11-02 |
Hybrid selective dielectric deposition for aligned via integration
Grant 11,152,299 - Lanzillo , et al. October 19, 2 | 2021-10-19 |
Barrier-less prefilled via formation
Grant 11,152,257 - Lanzillo , et al. October 19, 2 | 2021-10-19 |
Wafer Backside Engineering For Wafer Stress Control
App 20210320036 - JAIN; Nikhil ; et al. | 2021-10-14 |
Hybrid Selective Dielectric Deposition For Aligned Via Integration
App 20210280510 - Lanzillo; Nicholas Anthony ; et al. | 2021-09-09 |
Skip Via Connection Between Metallization Levels
App 20210280456 - Huang; Huai ; et al. | 2021-09-09 |
Tall trenches for via chamferless and self forming barrier
Grant 11,101,175 - Mignot , et al. August 24, 2 | 2021-08-24 |
Barrier-less Prefilled Via Formation
App 20210225700 - Lanzillo; Nicholas Anthony ; et al. | 2021-07-22 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20210217653 - Penny; Christopher J. ; et al. | 2021-07-15 |
Metallization interconnect structure formation
Grant 11,056,426 - Mignot , et al. July 6, 2 | 2021-07-06 |
Bottom Barrier Free Interconnects Without Voids
App 20210098388 - Cheng; Kenneth Chun Kuen ; et al. | 2021-04-01 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,964,588 - Penny , et al. March 30, 2 | 2021-03-30 |
Trapezoidal Interconnect at Tight BEOL Pitch
App 20210082744 - Lanzillo; Nicholas Anthony ; et al. | 2021-03-18 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,943,866 - Briggs , et al. March 9, 2 | 2021-03-09 |
Void-free metallic interconnect structures with self-formed diffusion barrier layers
Grant 10,903,116 - Maniscalco , et al. January 26, 2 | 2021-01-26 |
Interconnects With Gouged Vias
App 20200402844 - Cheng; Kenneth Chun Kuen ; et al. | 2020-12-24 |
Bottom-up Curing Of Dielectric Films In Integrated Circuits
App 20200388488 - Sil; Devika ; et al. | 2020-12-10 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20200388525 - Penny; Christopher J. ; et al. | 2020-12-10 |
Metallization Interconnect Structure Formation
App 20200381354 - Mignot; Yann ; et al. | 2020-12-03 |
Techniques to improve critical dimension width and depth uniformity between features with different layout densities
Grant 10,832,945 - Saulnier , et al. November 10, 2 | 2020-11-10 |
Semiconductor Device With Selective Insulator For Improved Capacitance
App 20200303239 - Penny; Christopher J. ; et al. | 2020-09-24 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,784,197 - Briggs , et al. Sept | 2020-09-22 |
Semiconductor device with selective insulator for improved capacitance
Grant 10,763,160 - Penny , et al. Sep | 2020-09-01 |
Techniques to Improve Critical Dimension Width and Depth Uniformity Between Features with Different Layout Densities
App 20200266100 - Saulnier; Nicole ; et al. | 2020-08-20 |
Forming High Carbon Content Flowable Dielectric Film With Low Processing Damage
App 20200234949 - Briggs; Benjamin D. ; et al. | 2020-07-23 |
Selective deposition of dielectrics on ultra-low k dielectrics
Grant 10,692,755 - Shobha , et al. | 2020-06-23 |
Capacitance reduction in sea of lines BEOL metallization
Grant 10,679,934 - Briggs , et al. | 2020-06-09 |
Multi-buried ULK field in BEOL structure
Grant 10,679,892 - Mignot , et al. | 2020-06-09 |
Tall Trenches For Via Chamferless And Self Forming Barrier
App 20200161180 - MIGNOT; Yann ; et al. | 2020-05-21 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,651,078 - Penny , et al. | 2020-05-12 |
Selective Deposition Of Dielectrics On Ultra-low K Dielectrics
App 20200135544 - Shobha; Hosadurga ; et al. | 2020-04-30 |
Dual-damascene formation with dielectric spacer and thin liner
Grant 10,629,478 - Briggs , et al. | 2020-04-21 |
Dielectric gap fill evaluation for integrated circuits
Grant 10,622,250 - Chu , et al. | 2020-04-14 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20200058590 - Briggs; Benjamin D. ; et al. | 2020-02-20 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20200058591 - Briggs; Benjamin D. ; et al. | 2020-02-20 |
Void-free Metallic Interconnect Structures With Self-formed Diffusion Barrier Layers
App 20200020581 - Maniscalco; Joseph F. ; et al. | 2020-01-16 |
Void-free Metallic Interconnect Structures With Self-formed Diffusion Barrier Layers
App 20200020577 - Maniscalco; Joseph F. ; et al. | 2020-01-16 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,529,662 - Briggs , et al. J | 2020-01-07 |
Void-free metallic interconnect structures with self-formed diffusion barrier layers
Grant 10,529,622 - Maniscalco , et al. J | 2020-01-07 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20190267278 - Penny; Christopher J. ; et al. | 2019-08-29 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20190237402 - Briggs; Benjamin D. ; et al. | 2019-08-01 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,361,117 - Penny , et al. | 2019-07-23 |
Dielectric Gap Fill Evaluation For Integrated Circuits
App 20190189503 - Chu; Isabel Cristina ; et al. | 2019-06-20 |
Dielectric Gap Fill Evaluation For Integrated Circuits
App 20190189504 - Chu; Isabel Cristina ; et al. | 2019-06-20 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20190181033 - Penny; Christopher J. ; et al. | 2019-06-13 |
Capacitance Reduction In Sea Of Lines Beol Metallization
App 20190172783 - Briggs; Benjamin D. ; et al. | 2019-06-06 |
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
App 20190172704 - Haigh, JR.; Thomas J. ; et al. | 2019-06-06 |
Dielectric gap fill evaluation for integrated circuits
Grant 10,312,140 - Chu , et al. | 2019-06-04 |
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
Grant 10,242,865 - Haigh, Jr. , et al. | 2019-03-26 |
Rework of patterned dielectric and metal hardmask films
Grant 10,242,872 - Arnold , et al. | 2019-03-26 |
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
Grant 10,236,176 - Haigh, Jr. , et al. | 2019-03-19 |
Dual-damascene Formation With Dielectric Spacer And Thin Liner
App 20190067087 - Briggs; Benjamin D. ; et al. | 2019-02-28 |
Rework Of Patterned Dielectric And Metal Hardmask Films
App 20180277369 - Arnold; John C. ; et al. | 2018-09-27 |
Integration of super via structure in BEOL
Grant 10,020,254 - Bao , et al. July 10, 2 | 2018-07-10 |
Integration of super via structure in BEOL
Grant 10,020,255 - Bao , et al. July 10, 2 | 2018-07-10 |
Selective and non-selective barrier layer wet removal
Grant 10,002,831 - Briggs , et al. June 19, 2 | 2018-06-19 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,947,622 - Canaperi , et al. April 17, 2 | 2018-04-17 |
Selective And Non-selective Barrier Layer Wet Removal
App 20170317026 - Briggs; Benjamin D. ; et al. | 2017-11-02 |
Selective and non-selective barrier layer wet removal
Grant 9,806,023 - Briggs , et al. October 31, 2 | 2017-10-31 |
Selective And Non-selective Barrier Layer Wet Removal
App 20170301624 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
App 20170263451 - Haigh, JR.; Thomas J. ; et al. | 2017-09-14 |
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
App 20170263449 - Haigh, JR.; Thomas J. ; et al. | 2017-09-14 |
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
Grant 9,735,005 - Haigh, Jr. , et al. August 15, 2 | 2017-08-15 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,691,705 - Canaperi , et al. June 27, 2 | 2017-06-27 |
Selective and non-selective barrier layer wet removal
Grant 9,685,406 - Briggs , et al. June 20, 2 | 2017-06-20 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,607,825 - Canaperi , et al. March 28, 2 | 2017-03-28 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,558,934 - Canaperi , et al. January 31, 2 | 2017-01-31 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,558,935 - Canaperi , et al. January 31, 2 | 2017-01-31 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20170005040 - Canaperi; Donald F. ; et al. | 2017-01-05 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,536,733 - Canaperi , et al. January 3, 2 | 2017-01-03 |
Method of forming an interconnect structure
Grant 9,502,288 - Nguyen , et al. November 22, 2 | 2016-11-22 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,472,503 - Canaperi , et al. October 18, 2 | 2016-10-18 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,449,812 - Canaperi , et al. September 20, 2 | 2016-09-20 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160133576 - Canaperi; Donald F. ; et al. | 2016-05-12 |
Interconnect structure containing a porous low k interconnect dielectric/dielectric cap
Grant 9,312,224 - Canaperi , et al. April 12, 2 | 2016-04-12 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160064218 - Canaperi; Donald Francis ; et al. | 2016-03-03 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160064509 - Canaperi; Donald Francis ; et al. | 2016-03-03 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,275,952 - Canaperi , et al. March 1, 2 | 2016-03-01 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160056111 - Canaperi; Donald Francis ; et al. | 2016-02-25 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160047038 - Canaperi; Donald Francis ; et al. | 2016-02-18 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160035618 - Canaperi; Donald F. ; et al. | 2016-02-04 |
Composite dielectric materials with improved mechanical and electrical properties
Grant 9,214,332 - Canaperi , et al. December 15, 2 | 2015-12-15 |
Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication
Grant 9,209,126 - Lin , et al. December 8, 2 | 2015-12-08 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20150287593 - Canaperi; Donald Francis ; et al. | 2015-10-08 |
Composite Dielectric Materials With Improved Mechanical And Electrical Properties
App 20150270124 - Canaperi; Donald F. ; et al. | 2015-09-24 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20150214157 - Canaperi; Donald F. ; et al. | 2015-07-30 |
Improved SiCOH Hardmask with Graded Transition Layers
App 20150028491 - ANGYAL; MATTHEW S. ; et al. | 2015-01-29 |
SiCOH hardmask with graded transition layers
Grant 8,927,442 - Angyal , et al. January 6, 2 | 2015-01-06 |
Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication
Grant 8,822,137 - Lin , et al. September 2, 2 | 2014-09-02 |
ADHESION LAYER AND MULTIPHASE ULTRA-LOW k DIELECTRIC MATERIAL
App 20140203336 - GRILL; ALFRED ; et al. | 2014-07-24 |
Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD
Grant 8,637,412 - Grill , et al. January 28, 2 | 2014-01-28 |
MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION
App 20130333923 - Balseanu; Mihaela ; et al. | 2013-12-19 |
Method of fabricating semiconductor capacitor
Grant 8,518,773 - Horak , et al. August 27, 2 | 2013-08-27 |
Semiconductor Capacitor
App 20130065376 - Horak; David Vaclav ; et al. | 2013-03-14 |
Method for fabricating air gap interconnect structures
Grant 8,383,507 - Chanda , et al. February 26, 2 | 2013-02-26 |
Multiphase Ultra Low K Dielectric Material
App 20130043514 - Grill; Alfred ; et al. | 2013-02-21 |
Interconnect structure with an oxygen-doped SiC antireflective coating and method of fabrication
Grant 8,373,271 - Goldfarb , et al. February 12, 2 | 2013-02-12 |
Self-aligned Fine Pitch Permanent On-chip Interconnect Structures And Method Of Fabrication
App 20130032945 - Lin; Qinghuang ; et al. | 2013-02-07 |
Self-aligned Fine Pitch Permanent On-chip Interconnect Structures And Method Of Fabrication
App 20130032949 - Lin; Qinghuang ; et al. | 2013-02-07 |
Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same
Grant 8,362,596 - Cohen , et al. January 29, 2 | 2013-01-29 |
Semiconductor capacitor
Grant 8,354,703 - Horak , et al. January 15, 2 | 2013-01-15 |
Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures
Grant 8,299,365 - Nguyen , et al. October 30, 2 | 2012-10-30 |
SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STRUCTURES
App 20120175023 - Nguyen; Son Van ; et al. | 2012-07-12 |
Air Gap Interconnect Structures And Methods For Forming The Same
App 20120111825 - Chanda; Kaushik ; et al. | 2012-05-10 |
Air gap interconnect structures and methods for forming the same
Grant 8,120,179 - Chanda , et al. February 21, 2 | 2012-02-21 |
Semiconductor Capacitor
App 20120012980 - HORAK; DAVID VACLAV ; et al. | 2012-01-19 |
Semiconductor Capacitor
App 20120012979 - Horak; David Vaclav ; et al. | 2012-01-19 |
INTERCONNECT STRUCTURE WITH AN OXYGEN-DOPED SiC ANTIREFLECTIVE COATING AND METHOD OF FABRICATION
App 20110291284 - Goldfarb; Dario L. ; et al. | 2011-12-01 |
SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STRUCTURES
App 20110162874 - Nguyen; Son Van ; et al. | 2011-07-07 |
Air Gap Interconnect Structures And Methods For Forming The Same
App 20110108992 - Chanda; Kaushik ; et al. | 2011-05-12 |
Engineered Interconnect Dielectric Caps Having Compressive Stress And Interconnect Structures Containing Same
App 20110012238 - Cohen; Stephan A. ; et al. | 2011-01-20 |
Underfilling with acid-cleavable acetal and ketal epoxy oligomers
Grant 7,776,993 - Buchwalter , et al. August 17, 2 | 2010-08-17 |
Treatment of plasma damaged layer for critical dimension retention, pore sealing and repair
Grant 7,750,479 - Purushothaman , et al. July 6, 2 | 2010-07-06 |
Advanced multilayer dielectric cap with improved mechanical and electrical properties
Grant 7,737,052 - Bhatia , et al. June 15, 2 | 2010-06-15 |
Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby
Grant 7,737,029 - Kim , et al. June 15, 2 | 2010-06-15 |
Methods of Forming Metal Interconnect Structures on Semiconductor Substrates Using Oxygen-Removing Plasmas and Interconnect Structures Formed Thereby
App 20090239374 - Kim; Jae hak ; et al. | 2009-09-24 |
Advanced Multilayer Dielectric Cap With Improved Mechanical And Electrical Properties
App 20090224374 - Bhatia; Ritwik ; et al. | 2009-09-10 |
Method For Protecting Porous Low-k Dielectric Post Chemical Mechanical Planarization
App 20090142885 - OU; YA ; et al. | 2009-06-04 |
Treatment Of Plasma Damaged Layer For Critical Dimension Retention, Pore Sealing And Repair
App 20080042283 - Purushothaman; Sampath ; et al. | 2008-02-21 |
Reworkable b-stageable adhesive and use in waferlevel underfill
App 20050250248 - Buchwalter, Stephen Leslie ; et al. | 2005-11-10 |
Acid-cleavable acetal and ketal based epoxy oligomers
Grant 6,919,420 - Buchwalter , et al. July 19, 2 | 2005-07-19 |
Reworkable b-stageable adhesive and use in waferlevel underfill
App 20040110010 - Buchwalter, Stephen Leslie ; et al. | 2004-06-10 |
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